A secondary electron trap for electron beam evaporation

By using permanent magnets and magnetically conductive structures to actively confine secondary electrons in an electron beam evaporation apparatus, combined with a cooling system, the problems of secondary electron diffusion and contamination were solved, thereby improving the film quality and optical performance.

CN122303801APending Publication Date: 2026-06-30CHENGDU GUOTAI VACUUM EQUIP CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
CHENGDU GUOTAI VACUUM EQUIP CO LTD
Filing Date
2026-05-28
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

Existing technologies struggle to effectively control and capture secondary electrons generated during electron beam evaporation, leading to decreased film quality, reduced optical performance, and increased risk of contamination.

Method used

The magnetic circuit structure consists of a permanent magnet, a magnetic block, a side magnetic plate, a cooling plate, a fixed bracket, and an anti-fouling protective plate. It uses a magnetic field to confine secondary electrons and guide them to collide with the anti-fouling protective plate to release energy. Combined with the cooling structure, it reduces the thermal impact.

Benefits of technology

It achieves active capture and energy dissipation of secondary electrons, improves film quality and optical performance, reduces pollution risk, and is suitable for various electron beam evaporation equipment.

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    Figure CN122303801A_ABST
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Abstract

This invention discloses a secondary electron trap for electron beam evaporation, comprising a permanent magnet, a magnetically conductive block, a side magnetically conductive plate, a cooling plate, a fixed bracket, and an anti-fouling plate. The permanent magnet has opposing magnetic poles at both ends, each connected to a magnetically conductive block. The magnetically conductive block is connected to the side magnetically conductive plate located below it. The side magnetically conductive plate has an inclined guide edge, and the cooling plate is connected to this inclined guide edge. The anti-fouling plate is located on the side of the cooling plate facing the secondary electron's movement path, serving as a preferential impact interface for the secondary electrons. The fixed bracket is connected to the lower part of the side magnetically conductive plate and is made of a non-magnetic material. The movement of secondary electrons is actively controlled by a magnetic field, achieving a shift from passive blocking to active trapping. The cooling plate and anti-fouling plate effectively dissipate the energy of the secondary electrons, reducing the thermal impact. This reduces the impact of secondary electrons on the substrate area and the cavity environment, improving film quality.
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