Porous composite copper foil, method for producing the same, and use thereof

CN122303985APending Publication Date: 2026-06-30JIUJIANG TELFORD ELECTRONICS MATERIAL CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
JIUJIANG TELFORD ELECTRONICS MATERIAL CO LTD
Filing Date
2026-03-17
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

Traditional porous copper foils have shortcomings in terms of pore size uniformity and porosity control, making it difficult to balance mechanical strength and electrical performance, and thus failing to meet the requirements of flexible electronic devices.

Method used

The porous composite copper foil design employs a layered structure, comprising a dense copper layer and a porous copper layer. The porous copper layer has through holes with a porosity of 30% to 65% and a thickness of 1µm to 4µm. The dense copper layer has a thickness of 3µm to 8µm. By matching specific porosities and thicknesses, the electrical performance and mechanical strength are improved.

Benefits of technology

At a relatively thin thickness, porous composite copper foil balances strength and electrical performance, improving the rate performance and cycle stability of the battery, and enhancing the uniformity of the electrochemical reaction.

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Abstract

The application relates to a porous composite copper foil and a preparation method and application thereof, the porous composite copper foil comprising a laminated dense copper layer and a porous copper layer; a plurality of through holes are arranged on the porous copper layer and penetrate through the porous copper layer, the surface porosity of the porous copper layer is 30%-65%, the thickness of the porous copper layer is 1 mu m-4 mu m, and the thickness of the dense copper layer is 3 mu m-8 mu m. The above-mentioned porous composite copper foil can give consideration to strength and electrical performance through the mutual cooperation of the porous copper layer with the specific surface porosity and specific thickness and the dense copper layer with the specific thickness.
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