Vacuum suction cup and dynamic adjustment system

Abstract

This application belongs to the technical field of nanoimprint lithography and discloses a vacuum chuck and dynamic adjustment system. The vacuum chuck includes a chuck substrate and a driving assembly. The chuck substrate has a negative pressure cavity, a working surface located at the top of the negative pressure cavity, an adsorption port located on the working surface and communicating with the negative pressure cavity, and a through port located on the working surface and communicating with the negative pressure cavity. Multiple through ports are spaced apart. The negative pressure cavity can generate negative pressure under the action of a negative pressure device. The working surface is used to place a substrate. The driving assembly includes multiple driving components located in the negative pressure cavity. Each driving component has a driving part that can move in a direction perpendicular to the working surface. Each driving part can extend to the top of the working surface through its corresponding through port to push the substrate placed on the working surface, thereby reducing the flatness requirements of the working surface and reducing the investment cost of production equipment, thus achieving the effect of reducing the manufacturing cost of the vacuum chuck.

Description

Technical Field

[0001] This application belongs to the technical field of nanoimprinting, specifically relating to a vacuum chuck and dynamic adjustment system. Background Technology

[0002] Nanoimprint lithography (NIL) is a high-resolution, high-efficiency method for transferring micro- and nano-patterns, widely used in semiconductor manufacturing, microelectromechanical systems (MEMS), optical devices, and biochips. In hard-stencil nanoimprint lithography, a rigid template (or a hard mold on the template) with nanoscale uneven structures is typically bonded tightly and parallel to a substrate coated with a polymer (imprint adhesive) over its entire surface. Therefore, the parallelism, flatness, and uniformity of contact pressure between the template and substrate directly determine the accuracy of pattern transfer, the uniformity of residual layer thickness, and the yield of the final device during the imprinting process.

[0003] In nanoimprint lithography equipment, reliable fixation and support of the substrate are essential to maintain its position and orientation throughout the entire process of template contact, pressure application, and detachment. Vacuum chucks, with their ability to provide large-area, uniform adsorption force without mechanical clamping stress, have become a commonly used substrate fixation and support component in the industry. However, the manufacturing cost of these vacuum chucks is relatively high, and their long-term stability is poor. Summary of the Invention

[0004] The embodiments of this application provide a vacuum suction cup and a dynamic adjustment system to reduce the manufacturing cost of the vacuum suction cup and improve its long-term stability.

[0005] A vacuum suction cup includes: a suction cup base having a negative pressure cavity, a working surface at the top of the negative pressure cavity, an adsorption port disposed on the working surface and communicating with the negative pressure cavity, and a through port disposed on the working surface and communicating with the negative pressure cavity, wherein multiple through ports are spaced apart; the negative pressure cavity is capable of generating negative pressure under the action of a negative pressure device; and the working surface is used to place a substrate. A driving assembly includes multiple driving members disposed in the negative pressure cavity, each driving member corresponding to one of the multiple through ports; each driving member has a driving part capable of moving in a direction perpendicular to the working surface; and each driving part can extend through its corresponding through port to the top of the working surface to push a substrate placed on the working surface.

[0006] According to an embodiment of this application, the diameter of the driving part is smaller than the diameter of the through-hole, so that an airflow channel is formed between the outer peripheral surface of the driving part and the wall of the through-hole.

[0007] According to an embodiment of this application, the drive unit has an initial position and an ejected position. In the initial position, one top end of the drive unit is located in the passage; in the ejected position, one top end of the drive unit extends to the top of the working surface.

[0008] According to an embodiment of this application, the suction cup substrate has a communication port that communicates with the negative pressure chamber, and the communication port is used to communicate with a negative pressure device.

[0009] According to an embodiment of this application, the suction cup substrate is provided with a partition plate located in the negative pressure cavity, the partition plate dividing the negative pressure cavity into a first chamber and a second chamber that are independent of each other.

[0010] According to an embodiment of this application, the partition plate extends circumferentially along the suction cup base, the first chamber is located inside the partition plate, and the second chamber is located between the partition plate and the suction cup base.

[0011] According to an embodiment of this application, the suction cup substrate has an edge surrounding the working surface, the edge being located at the top of the working surface.

[0012] According to an embodiment of this application, the driving element is a piezoelectric ceramic actuator, and the piezoelectric ceramic stack of the piezoelectric ceramic actuator constitutes the driving part.

[0013] Another aspect of this application embodiment provides a dynamic adjustment system, including a programmable logic controller (PLC), a surface shape detection module electrically connected to the PLC, and a vacuum chuck as described above. The driving component is electrically connected to the PLC. The surface shape detection module is used to detect the flatness of the upper surface of the substrate and can send the flatness information of the upper surface of the substrate to the PLC. The PLC can control the driving component according to the flatness information of the upper surface of the substrate sent by the surface shape detection module, so that the driving component corresponding to the recessed position of the substrate works.

[0014] According to an embodiment of this application, the surface shape detection module includes at least one of a laser interferometer, a white light interferometer, and a capacitive sensor.

[0015] By adopting the above technical solution, the embodiments of this application can achieve at least the following beneficial effects:

[0016] The vacuum suction cup in this embodiment includes a suction cup base and a driving assembly. The suction cup base has a negative pressure cavity, a working surface at the top of the negative pressure cavity, an adsorption port on the working surface communicating with the negative pressure cavity, and multiple passage ports on the working surface communicating with the negative pressure cavity. The negative pressure cavity can generate negative pressure under the action of a negative pressure device. The working surface is used to place a substrate. The driving assembly includes multiple driving components disposed in the negative pressure cavity. The multiple driving components are correspondingly arranged with the multiple passage ports. Each driving component has a driving part that can move in a direction perpendicular to the working surface. Each driving part can extend through its corresponding passage port to... The top of the working surface pushes the substrate placed on it, thereby reducing the flatness requirements of the working surface and the requirements for processing equipment during the production of vacuum chucks, thus reducing the investment cost of processing equipment and achieving the effect of reducing the production cost of vacuum chucks. On the other hand, it can also drive the driving component according to the flatness of the substrate's upper surface, using the driving part of the driving component to push the substrate upward, thereby improving the flatness of the substrate's upper surface. This overcomes the problem of poor flatness of the working surface caused by wear and tear during long-term use of vacuum chucks, and thus improves the long-term stability of vacuum chucks. Attached Figure Description

[0017] The above-mentioned contents, other objects, features and advantages of this application will become clearer from the following description of embodiments with reference to the accompanying drawings, in which:

[0018] Figure 1 A schematic cross-sectional view of a vacuum chuck according to an embodiment of this application is shown;

[0019] Figure 2 A schematic top view of a vacuum chuck according to an embodiment of this application is shown;

[0020] Figure 3 This schematically illustrates another perspective cross-sectional view of a vacuum suction cup according to an embodiment of the present application, mainly showing the partition plate;

[0021] Figure 4 A schematic cross-sectional view of a vacuum chuck according to an embodiment of this application is shown, mainly showing the spacer plate.

[0022] Figure label:

[0023] 1. Suction cup base; 11. Suction cup shell; 111. Connecting port; 112. Connecting pipe; 113. Partition plate; 114. Spacing plate; 115. Vent; 116. Edge; 12. Support plate; 121. Adsorption port; 122. Pass-through port; 13. Negative pressure chamber; 131. Upper chamber; 132. Lower chamber; 133. First chamber; 134. Second chamber; 135. Third chamber; 2. Drive assembly; 21. Drive component; 22. Drive unit. Detailed Implementation

[0024] The embodiments of this application will now be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of this application. In the following detailed description, numerous specific details are set forth to provide a thorough understanding of the embodiments of this application for ease of explanation. However, it will be apparent that one or more embodiments may be implemented without these specific details. Furthermore, descriptions of well-known structures and technologies are omitted in the following description to avoid unnecessarily obscuring the concepts of this application.

[0025] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of this application. The terms “comprising,” “including,” etc., as used herein indicate the presence of the stated features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0026] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein are to be interpreted in a manner consistent with the context of this specification, and not in an idealized or overly rigid way.

[0027] When using expressions such as "at least one of A, B and C", they should generally be interpreted in accordance with the meaning that is commonly understood by those skilled in the art (e.g., "a system having at least one of A, B and C" should include, but is not limited to, a system having A alone, a system having B alone, a system having C alone, a system having A and B, a system having A and C, a system having B and C, and / or a system having A, B and C, etc.).

[0028] Furthermore, it should be understood in the description of this application that the terms "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0029] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0030] In this application, unless otherwise expressly specified and limited, the first feature "on" or "below" the second feature may be in direct contact with the first and second features, or indirect contact with the first and second features through an intermediate medium. In the description of this specification, references to terms such as "implementation," "example," "aspect," "specific example," or "specific example" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application.

[0031] In related technologies, for substrates with large-area, multi-layer material composites or integrated precision circuit structures, the working surface of the vacuum chuck needs to be processed to a global flatness of tens or even several nanometers. The processing accuracy of the machine tool is close to or has reached the limit of current machining technology. Such ultra-precision processing not only has huge equipment investment costs, but also results in a low yield rate of vacuum chucks, which leads to high production and manufacturing costs of vacuum chucks.

[0032] Meanwhile, the working surface of the precision-polished vacuum chuck will inevitably develop localized wear or scratches during long-term use due to frequent substrate adsorption and release, contact with particulate matter contamination, or localized stress concentration. Furthermore, the release of residual stress in the vacuum chuck material may also cause slow deformation of the working surface. All these factors disrupt the ideal fit between the working surface and the substrate, causing the actual surface of the substrate after adsorption to deviate from the expected plane. This introduces uneven imprinting pressure distribution and bubble defects, ultimately affecting the long-term stability of the vacuum chuck.

[0033] To reduce the manufacturing cost of vacuum chucks and improve their long-term stability, refer to Figures 1 to 4This application discloses a vacuum suction cup, which includes a suction cup base 1 and a driving assembly 2. The suction cup base 1 has a negative pressure cavity 13, a working surface located on top of the negative pressure cavity 13, an adsorption port 121 disposed on the working surface and communicating with the negative pressure cavity 13, and a passage port 122 disposed on the working surface and communicating with the negative pressure cavity 13. Multiple passage ports 122 are spaced apart. The negative pressure cavity 13 can generate negative pressure under the action of a negative pressure device. The working surface is used to place a substrate. The driving assembly 2 includes multiple driving members 21 disposed in the negative pressure cavity 13. The multiple driving members 21 are correspondingly disposed with multiple passage ports 122. Each driving member 21 has a driving part 22 that can move in a direction perpendicular to the working surface. Each driving part 22 can extend to the top of the working surface through its corresponding passage port 122 to push the substrate placed on the working surface.

[0034] It is understood that the negative pressure chamber 13 is located inside the suction cup base 1, and the diameter of the port 122 is greater than or equal to the diameter of the drive part 22, so that the drive part 22 can extend to the top of the working surface through the port 122. Multiple suction ports 121 are provided at intervals.

[0035] Specifically, when fixing the substrate, the substrate is first placed on the working surface to support it. Then, the air in the negative pressure chamber 13 is extracted using a negative pressure device, creating a negative pressure in the chamber. This causes the adsorption port 121 to exert an adsorption force on the substrate, thus fixing it in place. When the upper surface of the substrate is bent, the driving member 21 corresponding to the recessed position on the upper surface is activated. This causes the driving part 22 of the driving member 21 to move upward, extending through the corresponding port 122 to the top of the working surface and pushing the substrate upward. This causes the recessed position on the upper surface of the substrate to move upward, ultimately bringing the upper surface of the substrate to a flat plane. In other words, the problem of unevenness on the upper surface of the substrate is overcome by using the driving part 22 of the driving member 21 to push the substrate upward.

[0036] Since the working surface is provided with multiple through ports 122 that communicate with the negative pressure chamber 13, the driving part 22 of the driving member 21 can extend to the top of the working surface through the corresponding through ports 122. Then, the driving part 22 of the driving member 21 can be used to push the substrate so that the upper surface of the substrate is on the same plane. This reduces the requirements for the processing accuracy of the working surface, thereby reducing the requirements for the processing equipment used to manufacture vacuum chucks, reducing the investment cost of processing equipment, improving the yield of vacuum chucks, and thus achieving the effect of reducing the manufacturing cost of vacuum chucks.

[0037] Meanwhile, as the vacuum chuck is used for a longer period of time, wear or scratches may appear on the working surface. In this case, the driving part 22 of the driving member 21 can push the substrate to compensate for the impact of wear or scratches on the flatness of the upper surface of the substrate. This will prevent the upper surface of the substrate from deviating from the expected plane due to wear or scratches on the working surface, thereby improving the long-term stability of the vacuum chuck.

[0038] Furthermore, the vacuum chuck in this embodiment can not only adjust the flatness of the substrate surface by moving the drive part 22 of the drive member 21, but also reduce the requirements for the flatness of the substrate surface, thereby reducing the substrate manufacturing cost.

[0039] In addition, the vacuum chuck in this embodiment of the application adjusts the upper surface of the substrate by moving the driving part 22 of the driving member 21. It is compatible with substrates with different warpage and different thickness uniformity, which improves the adaptability of the vacuum chuck to different materials and processes. It can even actively construct tiny non-planar adsorption surfaces according to specific process requirements to achieve special imprinting requirements.

[0040] In summary, the vacuum chuck in this embodiment not only eliminates the traditional method of processing the substrate and working surface to atomic-level flatness in related technologies, but also achieves dynamic adjustment of the upper surface of the substrate by using the driving part 22 of the driving member 21 to push the substrate, thereby creating optimal bonding conditions for the substrate. This can compensate for the flatness defects caused by local deformation of the substrate in real time, ensuring that the template and the substrate maintain a high degree of parallelism and uniform contact in the global range during the imprinting process. This significantly improves the uniformity of the thickness of the nanoimprinting residual layer and enhances the consistency and reliability of pattern transfer.

[0041] It should be noted that when adjusting the flatness of the upper surface of the substrate, the drive unit 21 to be activated is determined according to the recessed position of the upper surface of the substrate, that is, the drive unit 21 corresponding to the recessed position of the upper surface of the substrate is activated, and the pushing stroke of the drive unit 22 to the recessed position of the substrate is determined according to the recessed depth of the recessed position of the upper surface of the substrate.

[0042] For example, refer to Figure 1 and Figure 4 The suction cup base 1 includes a suction cup shell 11 with an open top and a support plate 12 fixedly connected to the suction cup shell 11. A negative pressure cavity 13 is formed between the support plate 12 and the suction cup shell 11. The top end face of the support plate 12 forms the working surface. The suction port 121 and the through port 122 are both provided on the support plate 12 and the support plate 12 is penetrated in the thickness direction of the support plate 12 in a direction perpendicular to the working surface.

[0043] For example, multiple adsorption ports 121 are distributed in an array on the working surface to ensure the force balance of the substrate when adsorbing it. Multiple access ports 122 are distributed in an array on the working surface to enable the drive component 2 to adjust any position of the substrate as much as possible and to improve the adjustment accuracy of the substrate.

[0044] In one implementation, reference Figure 1 and Figure 2 The diameter of the drive unit 22 is smaller than the diameter of the through port 122, so that an airflow channel is formed between the outer peripheral surface of the drive unit 22 and the through port 122.

[0045] It should be noted that the phrase "an airflow channel is formed between the outer peripheral surface of the drive unit 22 and the wall of the through-port 122" means that an airflow channel is formed between the outer peripheral surface of the drive unit 22 and the wall of the through-port 122 when the drive unit 22 extends into the through-port 122.

[0046] Since the diameter of the drive unit 22 is smaller than the diameter of the through port 122, on the one hand, the contact between the outer peripheral surface of the drive unit 22 and the wall of the through port 122 is avoided, which would increase the movement resistance of the drive unit 22. This ensures the smoothness of the movement of the drive unit 22 and improves the accuracy of its movement, thereby improving the adjustment accuracy of the substrate. On the other hand, it also allows an airflow channel to be formed between the outer peripheral surface of the drive unit 22 and the wall of the through port 122, so that the through port 122 can also generate an adsorption force on the substrate, thereby increasing the adsorption points on the substrate, increasing the fixation stability of the substrate and further improving the force balance of the substrate.

[0047] Furthermore, referring to Figure 1 and Figure 2 The central axis of the drive unit 22 is collinear with the central axis of the passage 122, so that the gap between the outer peripheral surface of the drive unit 22 and the wall of the passage 122 is consistent along the circumference of the drive unit 22. This further avoids the situation where the outer peripheral surface of the drive unit 22 may come into contact with the wall of the passage 122, which would affect the movement resistance of the drive unit 22. This further improves the smoothness of movement and the accuracy of movement of the drive unit 22.

[0048] Of course, in other embodiments, the diameter of the drive unit 22 may also be equal to the diameter of the through port 122.

[0049] In one implementation, reference Figure 1 The drive unit 22 has an initial position and an ejected position. In the initial position, one top end of the drive unit 22 is located in the passage 122; in the ejected position, one top end of the drive unit 22 extends to the top of the working surface.

[0050] It is understandable that when the driving unit 22 pushes the substrate, the driving unit 22 moves from the initial position toward the ejection position.

[0051] It should be noted that the "ejection position" mentioned in this application does not refer to a specific position, but rather to all positions where the top end of the drive unit 22 extends to the top of the working surface.

[0052] Since the top end of the drive unit 22 is located in the passage 122 in the initial position, the stroke required for the drive unit 22 to push the substrate is shortened, thereby improving the response efficiency of the drive unit 22 and thus improving the adjustment efficiency of the drive member 21 on the substrate.

[0053] Of course, in some other embodiments, when the drive unit 22 is in the initial position, the drive unit 22 may also be located at the bottom of the support plate 12.

[0054] In one implementation, reference Figure 1 The suction cup base 1 has a communication port 111 that communicates with the negative pressure chamber 13. The communication port 111 is used to communicate with the negative pressure device.

[0055] It is understandable that the negative pressure device is located outside the negative pressure chamber 13, and the negative pressure device is connected to the connection port 111 through a pipeline.

[0056] Since the suction cup base 1 has a communication port 111 that communicates with the negative pressure chamber 13, on the one hand, the negative pressure device can be connected to the negative pressure chamber 13 through a pipeline so that the inside of the negative pressure chamber 13 can generate negative pressure under the action of the negative pressure device; on the other hand, it can also avoid the situation where the weight of the vacuum suction cup increases due to the installation of the negative pressure device in the negative pressure chamber 13, so as to ensure the effect of easy movement of the negative pressure device.

[0057] Furthermore, referring to Figure 1 The suction cup base 1 is fixedly connected to a connecting pipe 112 located at the connecting port 111, so as to facilitate the connection of the negative pressure equipment and the connecting port 111 by means of the pipe.

[0058] Of course, in other embodiments, the negative pressure device can be installed in the mounting cavity, and the suction cup base 1 is provided with a hole structure that communicates with the exhaust port of the negative pressure device, so that the gas generated when the negative pressure device is working can be discharged to the outside of the negative pressure cavity 13 through the hole structure.

[0059] In one implementation, reference Figure 3 and Figure 4 The suction cup base 1 is provided with a partition plate 113 located in the negative pressure chamber 13, which divides the negative pressure chamber 13 into a first chamber 133 and a second chamber 134 that are independent of each other.

[0060] It is understood that the partition plate 113 is fixedly connected to the suction cup shell 11 and the support plate 12. Both the first chamber 133 and the second chamber 134 can be connected to the negative pressure device so that negative pressure can be generated in both the first chamber 133 and the second chamber 134.

[0061] Because the partition plate 113 divides the negative pressure chamber 13 into two independent chambers, a first chamber 133 and a second chamber 134, firstly, it can evacuate only the chamber containing the substrate as needed, thereby reducing the energy consumption of the negative pressure equipment and preventing dirt or dust from entering the negative pressure chamber 13 through the adsorption port 121; secondly, when the drive unit 21 pushes the substrate, it can adjust the vacuum level of each chamber individually to ensure the adsorption stability of the substrate; thirdly, the partition plate 113 can support the support plate 12 to improve the support effect of the working surface on the substrate, thereby improving the consistency and reliability of pattern transfer; fourthly, different vacuum adsorption pressures can be set for different areas of the substrate to ensure... To ensure the stability of the substrate, warping of the substrate should be avoided. For example, stronger fixing force is needed at the edge of the substrate, while more uniform adsorption force is needed in the central area to avoid warping. Fifthly, when the upper surface of the substrate is recessed, the vacuum degree of the chamber can be increased to make the vacuum chuck form a "push-pull" action to more effectively correct the local deformation of the substrate. For example, if the substrate protrudes upward at the first chamber 133 and is recessed downward at the second chamber 134, the vacuum degree of the first chamber 133 can be increased to increase the adsorption force of the first chamber 133 on the substrate. The protruding part of the substrate moves downward, and at the same time, the driving unit 21 located in the second chamber 134 is activated so that the driving part 22 pushes the recessed position of the substrate upward.

[0062] This application does not specifically limit the shape of the partition 113. In one embodiment, referring to... Figure 3 and Figure 4 The partition plate 113 extends circumferentially along the suction cup base 1, that is, the partition plate 113 is a ring structure. The first chamber 133 is located inside the partition plate 113, and the second chamber 134 is located between the partition plate 113 and the suction cup base 1.

[0063] It is understandable that the partition plate 113 is a ring structure, and the second chamber 134 is arranged around the first chamber 133.

[0064] Since the partition plate 113 extends circumferentially along the suction cup base 1, the first chamber 133 is located inside the partition plate 113, and the second chamber 134 is located between the partition plate 113 and the suction cup base 1. This allows the center of the substrate to be aligned with the first chamber 133 when the substrate is adsorbed using a vacuum suction cup, so that the center region of the substrate is above the first chamber 133 and the side region of the substrate is above the second chamber 134. This allows for adjustment of the adsorption force between the center region and the side region of the substrate. For example, when the side region of the substrate warps downward, the vacuum level of the second chamber 134 can be reduced while the vacuum level of the first chamber 133 can be increased, so that the center region of the substrate moves downward under the negative pressure of the first chamber 133. When the edge region of the substrate warps upward, the vacuum level of the first chamber 133 can be reduced while the vacuum level of the second chamber 134 can be increased, so that the side region of the substrate moves downward.

[0065] For example, refer to Figure 3 and Figure 4 There are two partition plates 113, namely a first partition plate and a second partition plate sleeved on the first partition plate. The first chamber 133 is located inside the first partition plate, and the second chamber 134 is located between the first partition plate and the second partition plate. A third chamber 135 is formed between the second partition plate and the suction cup substrate 1 to further increase the adsorption flexibility of the vacuum suction cup on the substrate.

[0066] Furthermore, referring to Figure 4 The suction cup base 1 is fixedly connected to a partition plate 114 located in the negative pressure chamber 13. The partition plate 114 divides the negative pressure chamber 13 into an independent upper chamber 131 and a lower chamber 132 in a direction perpendicular to the working surface. The first partition plate 113 and the second partition plate 113 are both located on top of the partition plate 114 and in the upper chamber 131. The first partition plate 113 and the second partition plate 113 divide the upper chamber 131 into a first chamber 133, a second chamber 134, and a third chamber 135. The connecting port 111 is connected to the lower chamber 132, and the partition plate 114 is positioned to... Vents 115 are provided in the first chamber 133 and the second chamber 134. The vent 115 in the first chamber 133 is used to connect the first chamber 133 and the lower chamber 132. The vent 115 in the second chamber 134 is used to connect the second chamber 134 and the lower chamber 132. Each vent 115 is equipped with a solenoid valve to control the connection or disconnection between the first chamber 133 or the second chamber 134 and the lower chamber 132, so as to achieve the formation of negative pressure in the first chamber 133 and the second chamber 134 using the same negative pressure device.

[0067] In other embodiments, the partition plate 113 may also be a flat plate, so that the partition plate 113 divides the negative pressure cavity 13 into a first chamber 133 and a second chamber 134 in the radial direction of the suction cup base 1; or, multiple partition plates 113 are provided, and the multiple partition plates 113 are spliced ​​together to divide the negative pressure cavity 13 into multiple arrays of chambers.

[0068] In one implementation, reference Figure 1 The suction cup base 1 has an edge 116 surrounding the working surface, and the edge 116 is located at the top of the working surface.

[0069] It is understood that the edge 116 is integrally formed on the suction cup shell 11, and there is a gap between the top of the support plate 12 and the top of the suction cup shell 11. The wall of the suction cup shell 11 between the top of the support plate 12 and the top of the suction cup shell 11 constitutes the edge 116.

[0070] Since the suction cup base 1 has an edge 116 surrounding the working surface, and the edge 116 has a gap at the top of the working surface, the edge 116 can be used to position and limit the substrate to increase the stability of the vacuum suction cup on the substrate. On the other hand, the edge 116 can also be used to block the airflow flowing radially along the working surface to prevent dirt or dust from entering the negative pressure chamber 13 through the suction port 121, thereby ensuring the cleanliness of the negative pressure chamber 13.

[0071] This application does not specifically limit the structure of the drive element 21. In one embodiment, the drive element 21 is a piezoelectric actuator, and the piezoelectric ceramic stack of the piezoelectric actuator constitutes the drive part 22.

[0072] Since the driving element 21 is a piezoelectric ceramic actuator, and the piezoelectric ceramic stack of the piezoelectric ceramic actuator constitutes the driving part 22, it can, on the one hand, push the substrate with the driving element 21 to adjust the substrate; on the other hand, it can also increase the accuracy of the substrate adjustment by the driving element 21 to ensure the flatness of the substrate surface, thereby improving the consistency and reliability of pattern transfer.

[0073] In other embodiments, the drive element 21 may also be an electromagnetic actuator, an electrostrictive actuator, a giant magnetostrictive actuator, or other structures, as long as it can push the substrate.

[0074] This application also discloses a dynamic adjustment system, which includes a programmable logic controller (PLC), a surface shape detection module electrically connected to the PLC, and a vacuum chuck as described above. The drive unit 21 is electrically connected to the PLC. The surface shape detection module is used to detect the flatness of the upper surface of the substrate and can send the flatness information of the upper surface of the substrate to the PLC. The PLC can control the drive unit 21 according to the flatness information of the upper surface of the substrate sent by the surface shape detection module, so that the drive unit 21 corresponding to the recessed position of the substrate works.

[0075] It is understandable that the aforementioned solenoid valve is also electrically connected to a programmable logic controller (PLC) so that the PLC can control the opening degree of the solenoid valve based on the flatness signal of the substrate surface.

[0076] Specifically, when fixing the substrate, the substrate is first placed on the working surface to support it. Then, the air in the negative pressure chamber 13 is extracted using a negative pressure device, creating a negative pressure in the chamber and causing the adsorption port 121 to exert an adsorption force on the substrate, thus fixing it. Next, the surface shape detection module detects the flatness of the substrate's upper surface and sends the real-time morphology data to the programmable logic controller (PLC). Based on the measurement data from the surface shape detection module, the PLC calculates the required height for the driving part 22 of each driving element 21 to rise. Then, based on the calculation results, the PLC sends an independent control signal to each driving element 21 to move the driving part 22 upwards, thereby pushing the substrate upwards until the upper surface of the substrate is perfectly parallel to the template.

[0077] This application does not specifically limit the structure of the face shape detection module, which may include at least one of a laser interferometer, a white light interferometer, and a capacitive sensor.

[0078] The following implementation methods will describe each case of the surface shape detection module separately:

[0079] In this first embodiment, the surface shape detection module includes a laser interferometer.

[0080] When detecting the flatness of the substrate surface, a vacuum chuck holding the substrate is placed below a laser interferometer, with the optical axis of the interferometer perpendicular to the substrate surface. The interferometer then emits a laser (typically a He-Ne laser with a wavelength of 632.8 nm), which is split into two paths by a beam splitter: one path strikes a reference plane mirror and returns; the other path penetrates the reference mirror, strikes the substrate surface, and reflects back. The two reflected beams produce interference fringes on a detector (CCD camera). The intensity distribution of the interference pattern is directly related to the height distribution of the substrate surface: the density and curvature of the fringes reflect the surface flatness deviation. Then, a phase-shifting technique (PZT driving the reference mirror to step, acquiring multiple frames of interferograms) is used, and an algorithm (such as the Carre algorithm) is employed to calculate the height value of each pixel, generating a three-dimensional surface topography map.

[0081] Then the laser interferometer sends the generated three-dimensional surface topography image to the programmable logic controller (PLC). The PLC calculates the required rise distance of the driving part 22 of the corresponding driving unit 21 based on the three-dimensional surface topography image. Then the PLC sends the rise distance information of the driving part 22 to the corresponding driving unit 21, which finally enables the driving unit 21 to start and the driving part 22 to push the substrate.

[0082] In the second embodiment, the surface shape detection module includes a white light interferometer.

[0083] When detecting the flatness of the substrate's upper surface, a vacuum chuck holding the substrate is placed near the focal point of the interference objective of a white light interferometer, driving a PZT vertical scan (Z-axis step, e.g., 20-100nm each time), while a CCD acquires each frame of the interference image. For each pixel, with each Z-scan, the light intensity exhibits a coherent envelope (due to the short coherence length of white light, interference fringes only appear near zero optical path difference). Then, algorithms (such as centroid method, phase shift method, envelope fitting) are used to extract the envelope peak position of each pixel, which corresponds to the precise height of that point. After the scan is complete, the height value of each pixel within the entire field of view is obtained, generating a three-dimensional topography map.

[0084] Then, the white light interferometer sends the generated three-dimensional surface topography image to the programmable logic controller (PLC). The PLC calculates the required rise distance of the driving unit 22 of the corresponding driving unit 21 based on the three-dimensional surface topography image. Then, the PLC sends the rise distance information of the driving unit 22 to the corresponding driving unit 21, which finally enables the driving unit 21 to start and the driving unit 22 to push the substrate.

[0085] In the third embodiment, the surface shape detection module includes a capacitive sensor.

[0086] There are two detection methods for capacitive sensors. One method involves mounting a miniature capacitive sensor (probe diameter 1-5mm) on a precision platform capable of XY motion, positioned above a substrate. The gap is then calibrated at a point on the substrate edge (e.g., using a feeler gauge or laser displacement gauge to set an initial distance, such as 100μm). The probe is then driven to move point by point above the substrate according to a preset grid (e.g., 5mm × 5mm), and the gap value at each point is measured. Due to variations in the height of the substrate surface, the gap will change accordingly. The gap deviation at all points is recorded, and after data processing (subtracting probe motion flatness error), a relative height map of the substrate surface is obtained.

[0087] Another detection method involves integrating dozens to hundreds of miniature capacitive sensors onto a planar array plate (the array size is comparable to the substrate, for example, an array corresponding to a 300mm wafer). The array plate is then mounted directly above the substrate, with a small gap (e.g., 50-200μm) between the probe tip and the substrate surface. The capacitance values ​​of all probes are then read at once, and the height of each point on the substrate surface is calculated in real time using a pre-calibrated "distance-capacitance" curve for each probe.

[0088] It should be noted that the planar array plate mentioned above can be an imprint template or integrated into a movable measuring head.

[0089] For example, the surface shape detection module in this embodiment combines the three implementation methods described above. Specifically, the surface shape detection module includes a laser interferometer, a white light interferometer, and a capacitance sensor. The capacitance sensor array is integrated into the imprinting station to directly output real-time height data of each region of the substrate. This allows the programmable logic controller (PLC) to control the drive unit 21 based on the height data, enabling dynamic compensation of the substrate using the drive unit 21. When installing a vacuum chuck or changing the substrate type, the laser interferometer is used to detect the flatness of the working surface and the morphology of the substrate, recording this as reference information. This information is then used by the PLC to control the drive unit 21. When localized unevenness occurs during imprinting, the substrate is removed, and the microstructure of the affected area is precisely measured using a white light interferometer. The analysis determines whether the defect is caused by defects in the substrate itself or insufficient adjustment of the drive unit 21, thus quickly identifying the cause of the defect.

[0090] Furthermore, multiple pressure sensors are embedded in the working surface and distributed in an array on the working surface. Each pressure sensor is electrically connected to a programmable logic controller and is used to detect the pressure between the substrate and the working surface, so that the programmable logic controller controls the drive unit 21 according to the pressure value detected by the pressure sensor.

[0091] Specifically, the programmable logic controller (PLC) sends a signal to the drive unit 21 so that the drive unit 21 adjusts the flatness of the upper surface of the substrate to meet the requirements. Then, multiple pressure sensors detect the pressure between the lower surface of the substrate and the working surface and send the detection results to the PLC for recording. Then, the template is used to apply pressure to the substrate. At this time, the pressure on the substrate changes, which in turn causes the pressure value detected by each pressure sensor to change. At the same time, each pressure sensor sends the pressure value to the PLC, and then the PLC calculates the pressure change value of each pressure sensor.

[0092] If the pressure change values ​​of multiple pressure sensors are consistent, it indicates that the upper surface of the substrate is subjected to uniform force, which means that the printing adhesive is evenly distributed. If the pressure change values ​​of multiple pressure sensors are different, it indicates that the upper surface of the substrate is subjected to uneven force. At this time, the programmable logic controller will send a signal to the drive unit 21 according to the pressure change value, so that the drive unit 21 will readjust the substrate to make the upper surface of the substrate evenly subjected to force, thereby realizing dynamic adjustment of the substrate printing process and ensuring the uniformity of the printing adhesive.

[0093] For example, if the pressure change value of one of the pressure sensors is small, the programmable logic controller sends a signal to the drive unit 21 near the pressure sensor to make the drive part 22 of the drive unit 21 move upward and push the substrate, thereby making the pressure change values ​​of multiple pressure sensors consistent and so that the substrate is subjected to force balance.

[0094] For any parts not mentioned in this application, existing technologies may be used or referenced.

[0095] The various embodiments in this specification are described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0096] Those skilled in the art will understand that the features described in the various embodiments of this application can be combined and / or combined in various ways, even if such combinations or combinations are not explicitly described in this application. In particular, the features described in the various embodiments of this application can be combined and / or combined in various ways without departing from the spirit and teachings of this application. All such combinations and / or combinations fall within the scope of this application.

Claims

1. A vacuum suction cup, characterized in that, include: The suction cup substrate (1) has a negative pressure cavity (13), a working surface located on the top of the negative pressure cavity (13), an adsorption port (121) located on the working surface and communicating with the negative pressure cavity (13), and a passage port (122) located on the working surface and communicating with the negative pressure cavity (13). Multiple passage ports (122) are provided at intervals. The negative pressure cavity (13) can generate negative pressure under the action of a negative pressure device. The working surface is used to place a substrate. The drive assembly (2) includes a plurality of drive members (21) disposed in the negative pressure chamber (13). The plurality of drive members (21) are respectively arranged in correspondence with the plurality of passage ports (122). Each drive member (21) has a drive part (22) that can move in a direction perpendicular to the working surface. Each drive part (22) can extend to the top of the working surface through its corresponding passage port (122) to push the substrate placed on the working surface.

2. The vacuum suction cup according to claim 1, characterized in that, The diameter of the drive unit (22) is smaller than the diameter of the through port (122) so that an airflow channel is formed between the outer peripheral surface of the drive unit (22) and the opening wall of the through port (122).

3. The vacuum suction cup according to claim 1, characterized in that, The drive unit (22) has an initial position and an ejection position. In the initial position, one top end of the drive unit (22) is located in the passage (122). In the ejection position, one top end of the drive unit (22) extends to the top of the working surface.

4. The vacuum suction cup according to claim 1, characterized in that, The suction cup base (1) has a communication port (111) that communicates with the negative pressure chamber (13), and the communication port (111) is used to communicate with the negative pressure device.

5. The vacuum suction cup according to claim 1, characterized in that, The suction cup base (1) is provided with a partition plate (113) located in the negative pressure cavity (13), which divides the negative pressure cavity (13) into a first chamber (133) and a second chamber (134) that are independent of each other.

6. The vacuum suction cup according to claim 5, characterized in that, The partition plate (113) extends circumferentially along the suction cup base (1), the first chamber (133) is located inside the partition plate (113), and the second chamber (134) is located between the partition plate (113) and the suction cup base (1).

7. The vacuum suction cup according to claim 1, characterized in that, The suction cup base (1) has an edge (116) surrounding the working surface, the edge (116) being located at the top of the working surface.

8. The vacuum chuck according to any one of claims 1-7, characterized in that, The driving element (21) is a piezoelectric ceramic actuator, and the piezoelectric ceramic stack of the piezoelectric ceramic actuator constitutes the driving part (22).

9. A dynamic adjustment system, characterized in that, The device includes a programmable logic controller (PLC), a surface shape detection module electrically connected to the PLC, and a vacuum chuck as described in any one of claims 1-8. The drive unit (21) is electrically connected to the PLC. The surface shape detection module is used to detect the flatness of the upper surface of the substrate and can send the flatness information of the upper surface of the substrate to the PLC. The PLC can control the drive unit (21) according to the flatness information of the upper surface of the substrate sent by the surface shape detection module, so that the drive unit (21) corresponding to the recessed position of the substrate works.

10. The dynamic adjustment system according to claim 9, characterized in that, The surface shape detection module includes at least one of a laser interferometer, a white light interferometer, and a capacitive sensor.

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