An optical module

Abstract

This disclosure provides an optical module including a circuit board and an optical emitting component. The circuit board has an insertion port into which the optical emitting component is inserted. The optical emitting component includes a laser component array, which includes laser components. Each laser component includes a first substrate and a laser chip. The laser chip is mounted on the first substrate and is used to emit optical signals. A support plate is formed on the first sidewall of the insertion port, and the support plate is disposed along the length of the circuit board. The support plate and the first sidewall of the insertion port form a placement notch, and the laser component is placed at the placement notch so that the laser component and the support plate are arranged side by side along the width of the circuit board. The laser chip of the laser component is disposed at the end of the first substrate away from the first sidewall of the insertion port. The support plate is provided with signal pads, and the laser chip is directly wire-connected to the signal pads without the need for a transfer through the first substrate, thereby reducing the reflection loss of high-frequency signals and ensuring the high-frequency signal integrity of the optical module.

Description

Technical Field

[0001] This disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Technology

[0002] With the development of new business and application models such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are the tools for converting between photoelectric signals and signals, and are one of the key components in optical communication equipment. Furthermore, with the evolving needs of optical communication technology, the transmission rate of optical modules is constantly increasing. Summary of the Invention

[0003] This disclosure provides an optical module that reduces reflection loss of high-frequency signals.

[0004] In some embodiments, an optical module is provided, comprising:

[0005] The circuit board has an insertion slot.

[0006] The light emitting component is embedded in the embedding port;

[0007] The light emitting component includes:

[0008] Laser component array, including:

[0009] Laser components, including:

[0010] Laser chips are used to emit optical signals;

[0011] The first substrate supports the laser chip;

[0012] A lens array is located in the light-emitting direction of the laser component array to focus the optical signal;

[0013] An optical fiber array is located in the converging direction of the lens array to transmit optical signals converged by the lens array;

[0014] The first sidewall of the insertion port is formed with:

[0015] A support plate is provided along the length of the circuit board and has signal pads. The support plate and the first sidewall of the insertion port form a placement notch. The laser component is placed at the placement notch so that the laser component and the support plate are arranged side by side along the width of the circuit board. The laser chip is located at the end of the first substrate away from the first sidewall of the insertion port, and the laser chip is directly wire-connected to the signal pads.

[0016] The above technical solution has the following beneficial effects: The optical module includes a circuit board and an optical emitting component. The circuit board has an insertion port, and the optical emitting component is inserted into the insertion port. The optical emitting component includes a laser component array, a lens array, and an optical fiber array. The laser component array includes a laser component, which includes a first substrate and a laser chip. The laser chip is mounted on the first substrate and is used to emit optical signals. The lens array is located in the light-emitting direction of the laser component array to converge the optical signals emitted by the laser chip. The optical fiber array is located in the convergence direction of the lens array to transmit the optical signals converged by the lens array. A support plate is formed on the first sidewall of the insertion port, and the support plate is arranged along the length direction of the circuit board. The support plate and the first sidewall of the insertion port form a placement notch, and the laser component is placed at the placement notch so that the laser component and the support plate are arranged side by side along the width direction of the circuit board. The laser chip of the laser component is located at the end of the first substrate away from the first sidewall of the insertion port. The support plate is provided with signal pads, and the laser chip is directly wire-connected to the signal pads without the need for a transfer through the first substrate. This reduces the reflection loss of high-frequency signals and ensures the high-frequency signal integrity of the optical module.

[0017] In some embodiments, an optical module is provided in which the upper surface of the support plate is flush with the upper surface of the first sidewall of the embedding port, and the lower surface of the support plate is not flush with the lower surface of the first sidewall of the embedding port, so that the support plate and the first sidewall of the embedding port form an avoidance gap.

[0018] The above technical solution has the following beneficial effects: the upper surface of the support plate is flush with the upper surface of the first side wall of the insertion port, and the lower surface of the support plate is not flush with the lower surface of the first side wall of the insertion port, so that the support plate and the first side wall of the insertion port form an avoidance gap to avoid the device below the laser assembly.

[0019] In some embodiments, an optical module is provided, wherein the optical emitting component further includes:

[0020] A semiconductor cooler, supporting the laser assembly, is located below the support plate; there is a gap between the support plate and the semiconductor cooler.

[0021] The above technical solution has the following beneficial effects: The light emitting component also includes a semiconductor cooler, which supports the laser assembly to control the operating temperature of the laser assembly within the target temperature range. The semiconductor cooler is located below the support plate, and there is a gap between the semiconductor cooler and the support plate to prevent the upper surface of the semiconductor cooler from being higher than the lower surface of the support plate due to processing errors, thereby reducing mutual interference between the semiconductor cooler and the support plate.

[0022] In some embodiments, an optical module is provided, wherein the optical emitting component further includes:

[0023] The temperature sensing element is located in the middle of the laser component array;

[0024] The storage notch includes:

[0025] The first placement notch, formed by the two adjacent support plates and the first sidewall of the insertion opening, is used to place the laser assembly.

[0026] The second storage notch, formed by two adjacent support plates and the first sidewall of the insertion opening, is located in the middle of the plurality of first storage notches and is used to place the laser assembly and the temperature sensing element;

[0027] The third placement notch is formed by the support plate, the first side wall of the insertion port, and a side wall connected to the first side wall of the insertion port, and is used to place the laser assembly and the first and second electrode posts of the semiconductor cooler.

[0028] The width of the second storage notch is greater than the width of the first storage notch, and the width of the third storage notch is greater than the width of the first storage notch.

[0029] The above technical solution has the following beneficial effects: The light emitting component also includes a temperature sensing element, which is located in the middle of the laser component array to facilitate accurate monitoring of the temperature around the laser component array. The placement notch includes a first placement notch, a second placement notch, and a third placement notch. The first and second placement notches are each surrounded by two adjacent support plates and the first sidewall of the insertion port. The second placement notch is located in the middle of the plurality of first placement notches, ensuring that the second placement notch is in the center of the placement notch. The first placement notch is used to place the laser component, and the second placement notch is used to place the laser component and the temperature sensing element. The third placement notch is surrounded by a support plate, the first sidewall of the insertion port, and a sidewall connecting the first sidewall of the insertion port. The third placement notch is used to place the laser component and the first and second electrode posts of the semiconductor cooler. The width of the second placement notch is greater than the width of the first placement notch, so that the first placement notch places the laser component, and the second placement notch places the laser component and the temperature sensing element. The width of the third storage notch is greater than that of the first storage notch, so that the first storage notch can hold the laser component, and the third storage notch can hold the first electrode post and the second electrode post of the laser component and the semiconductor cooler.

[0030] In some embodiments, an optical module is provided, wherein the optical emitting component further includes:

[0031] The tubular shell, embedded in the embedding port, includes:

[0032] The first supporting surface supports the semiconductor cooler;

[0033] The adhesive dispensing surface is positioned along the length of the tube shell, along with the first supporting surface.

[0034] The second supporting surface is located on the dispensing surface and supports the optical fiber array;

[0035] The first limiting plate is located on the dispensing surface, between two adjacent second supporting surfaces, and connected to one side of the fiber array;

[0036] The third supporting surface is connected to the lower surface of the side wall of the embedding port, and its height is lower than the height of the dispensing surface;

[0037] The connecting surface is connected to the dispensing surface on one side and to the third supporting surface on the other side, and is also connected to the side wall of the embedding port.

[0038] The above technical solution has the following beneficial effects: The light emitting component also includes a housing, which is embedded in an insertion port. The housing includes a first supporting surface and a dispensing surface. The first supporting surface supports the semiconductor cooler, and a second supporting surface is provided on the dispensing surface. The second supporting surface supports the fiber array. The dispensing surface and the first supporting surface are arranged along the length direction of the housing, so that the optical devices on the semiconductor cooler and the fiber array are arranged along the length direction of the housing. A first limiting plate is also provided on the dispensing surface. The first limiting plate is located between two adjacent second supporting surfaces. One side of the first limiting plate is connected to one side of the fiber array to limit the position of the fiber array in the width direction of the housing. The housing includes a third supporting surface, which is connected to the lower surface of the sidewall of the insertion port to support the circuit board. The height of the third supporting surface is lower than the height of the dispensing surface, so that the dispensing surface and the third supporting surface are connected by a connecting surface. The connecting surface is connected to the side of the sidewall of the insertion port to limit the position of the circuit board in the width direction of the housing.

[0039] In some embodiments, an optical module is provided, wherein the lower surface of the sidewall of the embedding port is provided with:

[0040] The protective component, connected to the third support surface of the tube shell, includes:

[0041] The storage recess has an opening; the opening faces away from the insertion port.

[0042] The above technical solution has the following beneficial effects: A protective element is provided on the lower surface of the sidewall of the insertion port. The protective element is connected to the third support surface of the tube housing to protect the circuit board and prevent damage to the circuit board when disassembling the tube housing. The protective element can be coated with adhesive to bond the tube housing to the circuit board. The protective element includes a storage groove where adhesive can be placed. The adhesive thickness in the storage groove area is greater than the adhesive thickness in other protective areas to increase the contact area between the tube housing and the circuit board, thereby increasing the adhesion between the tube housing and the circuit board. The storage groove has an opening facing away from the insertion port. When there is too much adhesive, the adhesive will not flow into the insertion port, avoiding adhesive contamination of the optical components of the light emitting element.

[0043] In some embodiments, an optical module is provided, and the optical emitting component further includes:

[0044] The temperature sensing element is located in the middle of the laser component array;

[0045] A support plate, resting on the semiconductor cooler and supporting the laser component array, includes:

[0046] First support plate;

[0047] The second support plate, together with the first support plate, supports the laser component array. The first electrode post and the second electrode post of the semiconductor cooler are further away from the first support plate. The side of the second support plate closest to the first support plate supports the temperature sensing element.

[0048] The above technical solution has the following beneficial effects: The light emitting component also includes a temperature sensing element, which is located in the middle of the laser component array to facilitate accurate monitoring of the temperature around the laser component array. The light emitting component also includes a support plate, which is supported on the semiconductor cooler and supports the laser component array. The support plate includes a first support plate and a second support plate, which together support the laser component array to reduce deformation caused by an excessively large first support plate, thereby ensuring that the light emission ports of each laser component in the laser component array are at the same height. The second support plate is further away from the first and second electrode posts of the semiconductor cooler than the first support plate, and the side of the second support plate closer to the first support plate supports the temperature sensing element, so that the temperature sensing element is located in the middle of the laser component array.

[0049] In some embodiments, an optical module is provided, wherein the optical emitting component includes:

[0050] An isolator array is located between the lens array and the fiber array;

[0051] The shell also includes:

[0052] The fourth support surface is located between the first support surface and the second support surface, supporting the isolator array; the second limiting plate is located on the fourth support surface, arranged along the width direction of the tube shell, with one end connected to the end face of the optical fiber array and the other end connected to the end face of the isolator array.

[0053] The above technical solution has the following beneficial effects: The optical emitting component includes an isolator array, which is located between the lens array and the fiber array. The isolator array is used to prevent the optical signal from returning along the original path. The housing also includes a fourth supporting surface, which is located between the first supporting surface and the second supporting surface, and supports the isolator array. A second limiting plate is provided on the fourth supporting surface. The second limiting plate is arranged along the width direction of the housing, with one end connected to the end face of the fiber array and the other end connected to the end face of the isolator array, so as to limit the position of the isolator array and the fiber array in the length direction of the housing.

[0054] In some embodiments, an optical module is provided in which two adjacent laser components are wire-connected to different support plates.

[0055] The above technical solution has the following beneficial effects: two adjacent laser components are wired to different support plates to reduce mutual interference of electrical signals.

[0056] In some embodiments, an optical module is provided, further comprising:

[0057] A light receiving component, located on the surface of the circuit board and on one side of the embedding port, is used to receive light signals.

[0058] The above technical solution has the following beneficial effects: The optical module also includes an optical receiving component. The optical receiving component is located on the surface of the circuit board, on one side of the insertion port, so that the components of the optical emitting component and the optical receiving component are arranged side-by-side along the width direction of the circuit board. The optical receiving component is used to receive optical signals, enabling the optical module to receive optical signals. Attached Figure Description

[0059] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0060] Figure 1 This is a partial structural diagram of an optical communication system according to some embodiments;

[0061] Figure 2 This is a partial structural diagram of a host computer according to some embodiments;

[0062] Figure 3 This is a structural diagram of an optical module according to some embodiments;

[0063] Figure 4 An exploded view of an optical module according to some embodiments;

[0064] Figure 5 This is an exploded view of the internal structure of an optical module according to some embodiments;

[0065] Figure 6 This is an exploded view of a light emitting component provided according to some embodiments;

[0066] Figure 7 This is an optical path diagram of a light emitting component according to some embodiments;

[0067] Figure 8 This is a structural diagram of a laser assembly according to some embodiments;

[0068] Figure 9 This is a structural diagram of a circuit board according to some embodiments;

[0069] Figure 10 A partial view of the internal structure of an optical module according to some embodiments. Figure 1 ;

[0070] Figure 11 A partial view of the internal structure of an optical module according to some embodiments. Figure 2 ;

[0071] Figure 12 This is a structural diagram of a circuit board provided according to some embodiments, viewed from another perspective.

[0072] Figure 13 This is a partial view of the internal structure of an optical module according to some embodiments, taken from another perspective.

[0073] Figure 14 This is a cross-sectional view of the internal structure of an optical module according to some embodiments;

[0074] Figure 15 This is a cross-sectional view of the internal structure of an optical module provided according to some embodiments, taken from another perspective. Detailed Implementation

[0075] The embodiments of this disclosure will now be described clearly and in detail with reference to the accompanying drawings. However, the described embodiments are merely some, and not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure are within the scope of protection of this disclosure.

[0076] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and inclusive, meaning "including, but not limited to"; the terms "first" and "second" should not be construed as indicating or implying relative importance or indicating an upper limit on the number; the term "multiple" means two or more; the term "connection" should be interpreted broadly, for example, "connection" can be a fixed connection, a detachable connection, or an integral part, and can be a direct connection or an indirect connection through an intermediate medium; the use of the terms "applicable to" or "configured to" implies open and inclusive language, which does not exclude applicability to or configuration to devices performing additional tasks or steps; descriptions such as "parallel," "perpendicular," "identical," "consistent," and "aligned" are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges arising in practice, and differences based on the same design concept but due to manufacturing reasons.

[0077] In optical communication technology, to establish information transmission between information processing devices, information is loaded onto light, and the speed of light propagation is used to transmit the information. This light carrying information is called an optical signal. When optical signals are transmitted in optical information transmission equipment, optical power loss can be reduced, enabling long-distance transmission of optical signals. At the same time, the cost of optical information transmission equipment such as optical fibers is lower than that of electrical information transmission equipment such as copper wires. Therefore, optical communication technology can achieve high-speed, long-distance, and low-cost information transmission.

[0078] Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., while optical information transmission equipment typically includes optical fibers and optical waveguides. Information processing equipment can only recognize and process electrical signals, while optical communication technology uses optical signals for transmission, requiring optical modules to convert between optical and electrical signals.

[0079] An optical module enables the conversion between optical signals and electrical signals between information processing equipment and optical information transmission equipment. In some embodiments, at least one of the optical signal input or output terminals of the optical module is connected to an optical fiber, and at least one of the electrical signal input or output terminals of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber.

[0080] Since multiple information processing devices can transmit information via electrical signals, at least one of these devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is also referred to as the host computer of the optical module. Furthermore, the optical signal input or output terminal of the optical module is called the optical port, and the electrical signal input or output terminal is called the electrical port.

[0081] Figure 1 This is a partial structural diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100 for optical modules, an optical module 200, an optical fiber 101, and a network cable 103. Among them, the optical fiber 101 is an optical information transmission device, and the network cable 103 is an electrical information transmission device.

[0082] In some embodiments, one end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can undergo total internal reflection in the optical fiber 101, and the propagation of the optical signal in the direction of total internal reflection can almost maintain the original optical power. The optical signal undergoes multiple total internal reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance information transmission based on low power loss.

[0083] The optical communication system includes one or more optical fibers 101. In some embodiments, the optical fiber 101 is detachably connected to the optical module 200; in some embodiments, the optical fiber 101 is non-detachably connected to the optical module 200.

[0084] The host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor or control the working status of the optical module 200.

[0085] The host computer 100 includes a housing for accommodating the optical module 200, and an optical module interface 102 disposed on the housing. The optical module 200 is inserted into the housing through the optical module interface 102 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0086] The host computer 100 also includes an external power interface that can connect to an electrical signal network. In some embodiments, the external power interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to connect a network cable 103 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103.

[0087] One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. In some embodiments, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted in the optical fiber 101 to the remote information processing device 1000.

[0088] In some embodiments, a first optical signal from a remote information processing device 1000 is transmitted through an optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to an optical module 200. The optical module 200 converts the first optical signal into a first electrical signal, and transmits the first electrical signal to a host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to a local information processing device 2000.

[0089] In some embodiments, the optical module is a tool for converting optical signals to electrical signals. During the conversion process, the information does not change, but the encoding or decoding method of the information changes.

[0090] In addition to optical network terminals, the host computer 100 also includes optical line terminals (OLTs), optical network equipment (ONTs), or data center servers.

[0091] Figure 2 This is a partial structural diagram of a host computer according to some embodiments. To clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. For example... Figure 2As shown, in some embodiments, the host computer 100 further includes a PCB circuit board 105 disposed in the receiving cavity, and a cage 106 disposed on the surface of the PCB circuit board 105; the optical module 200 is inserted into the cage 106 and fixed by the cage 106.

[0092] In some embodiments, a heat sink 107 is provided on the cage 106 to dissipate heat for the optical module; in some embodiments, the heat sink 107 has protruding structures such as fins to increase the heat dissipation area.

[0093] In some embodiments, an electrical connector is provided inside the cage 106, which is configured to connect to the electrical port of the optical module 200.

[0094] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is conducted to the cage 106 and then diffused through the heat sink 107.

[0095] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, thereby establishing an electrical signal connection between the optical module 200 and the host computer 100.

[0096] In some embodiments, the optical port of the optical module 200 is connected to the optical fiber 101, thereby enabling the optical module 200 to establish an optical signal connection with the optical fiber 101.

[0097] Figure 3 This is a structural diagram of an optical module according to some embodiments. Figure 4 This is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, in some embodiments, the optical module 200 includes a shell, which comprises an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202, forming two openings 204 and 205, one of which is an electrical port and the other is an optical port. In some embodiments, the shell forms an opening that serves as both an electrical port and an optical port.

[0098] In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0099] The assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, etc. into the housing. The upper housing 201 and the lower housing 202 can encapsulate and protect the above-mentioned devices.

[0100] The direction of the line connecting the two openings 204 and 205 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200. Figure 3 The opening 205 is also located at the end of the optical module 200 (right end). Figure 3 (The left end). Alternatively, opening 204 is located at the end of optical module 200, while opening 205 is located on the side of optical module 200.

[0101] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011, which covers the two lower side plates 2022 of the lower housing 202 to form the aforementioned housing.

[0102] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates and the two lower side plates 2022 are combined to realize that the upper housing 201 covers the lower housing 202.

[0103] like Figure 3 and Figure 4 As shown, in some embodiments, the optical module includes a circuit board 300 disposed within a housing. The circuit board 300 includes circuit traces, electronic components, and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0104] In some embodiments, the circuit board includes a rigid circuit board, which, due to its relatively rigid material, can also serve a load-bearing function, such as being able to stably support the aforementioned electronic components and chips; the rigid circuit board can also be inserted into an electrical connector in the cage 106 of the host computer 100.

[0105] In some embodiments, the circuit board further includes a flexible circuit board, which can be used independently or in conjunction with a rigid circuit board.

[0106] In some embodiments, the circuit board further includes gold fingers formed on its end surface, the gold fingers consisting of a plurality of independent pins.

[0107] In some implementations, the gold fingers are located on the surface of one side of the circuit board 300 (e.g., Figure 4 (as shown on the upper surface); In some implementations, the gold fingers are set on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thereby adapting to situations where the number of pins is large.

[0108] In some implementations, the gold fingers of the circuit board extend from the electrical port and are inserted into the electrical connector of the host computer 100; the circuit board is inserted into the cage 106, and the gold fingers are connected to the electrical connector inside the cage 106. The gold fingers are configured to establish an electrical connection with the host computer, enabling electrical connection functions such as power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, and data signal transmission.

[0109] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to establish a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0110] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a locking component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the locking component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the locking component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the fixation between the optical module 200 and the host computer, thereby allowing the optical module 200 to be pulled out of the cage 106.

[0111] In some embodiments, the optical module includes a light emitting component 400, such as... Figure 3 and Figure 4 As shown. The light emitting component 400 is used to emit light signals.

[0112] In some embodiments, the optical module includes an optical receiving component 500, such as... Figure 3 and Figure 4 As shown. The optical receiving unit 500 is used to receive optical signals and convert them into electrical signals.

[0113] In some embodiments, at least one of the light emitting component 400 or the light receiving component 500 is located on the side of the circuit board 300 away from the gold fingers.

[0114] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0115] In some embodiments, at least one of the light emitting component or the light receiving component may be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component may be disposed on the surface of the circuit board 300 or the side of the circuit board 300.

[0116] Figure 5 This is an exploded view of the internal structure of an optical module according to some embodiments. Figure 4 and Figure 5 As shown, in some embodiments, the circuit board 300 may have an insertion port 310. The light emitting component 400 may be disposed at the insertion port 310 of the circuit board 300 so that the light emission path of the light emitting component 400 can be flush with the upper surface of the circuit board 300.

[0117] In some embodiments, the light receiving component 500 may be disposed on the upper surface of the circuit board 300.

[0118] The light receiving component 500 can be located on one side of the insertion port 310 so that the light receiving component 500 can be arranged side by side with the device of the light emitting component 400 along the width direction of the circuit board 300.

[0119] In some embodiments, a DSP chip 330 may be disposed on the surface of the circuit board 300. The DSP chip 330 can process electrical signals transmitted by the optical network terminal through the gold fingers, and can also process electrical signals transmitted by the optical receiving component 500.

[0120] In some embodiments, the DSP chip 330 may integrate a driver chip. The DSP chip 330 may be connected to the light emitting component 400 via a first signal line to provide a high-frequency driving signal to the light emitting component 400, thereby enabling the light emitting component 400 to emit light signals under the action of the high-frequency driving signal. For example, the circuit board 300 is provided with high-frequency signal pads, and the DSP chip 330 may be connected to the high-frequency signal pads via a first signal line. The high-frequency signal pads are wire-connected to the laser component of the light emitting component 400.

[0121] In some embodiments, the optical receiver 500 can be connected to the DSP chip 330 via a second signal line, so that the DSP chip 330 can process the high-frequency electrical signal provided by the optical receiver 500 and transmitted via the second signal line. For example, the optical receiver 500 can be connected to the DSP chip 330 via a second signal line.

[0122] In some embodiments, the laser component of the light emitting component 400 includes a laser chip and a first substrate. The laser chip can be placed on the first substrate, and the first substrate is provided with signal lines. One end of the laser chip and one end of the signal lines are connected by a first gold wire bonding, and the other end of the signal lines is connected to the circuit board 300 by a second gold wire bonding. Since neither the first nor the second gold wire is located on the surface of the first substrate, but is suspended in air or a vacuum, and the material of the first substrate has a different dielectric constant than that of air or a vacuum, the impedances of the first and second gold wires and the signal lines are different, resulting in increased reflection loss of high-frequency signals and affecting the high-frequency signal integrity of the optical module.

[0123] To address this issue, in some embodiments, the circuit board is formed with a support plate, and the support plate and its sidewall form a storage notch. The laser component is placed at the storage notch so that the support plate and the laser component are arranged side by side along the width of the circuit board. The support plate is provided with signal pads, and the laser chip of the laser component can be directly connected to the signal pads of the support plate via wire bonding without going through the first substrate. This reduces the reflection loss of high-frequency signals and ensures the high-frequency signal integrity of the optical module.

[0124] Figure 6 This is an exploded view of a light emitting component provided according to some embodiments. Figure 7 This is an optical path diagram of a light emitting component according to some embodiments. Figure 8 This is a structural diagram of a laser assembly according to some embodiments. Figure 6 , Figure 7 and Figure 8As shown, in some embodiments, the light emitting component 400 may include a laser component array 420. The laser component array 420 may include a laser component 421, which can emit one optical signal. For example, the laser component array 420 may include eight laser components arranged side-by-side along the width of the circuit board to emit eight optical signals. The laser components may be 100G EML laser components, with each 100G EML laser component emitting a 100G optical signal of one wavelength according to a high-frequency drive signal, thereby enabling the laser component array 420 to emit eight 100G optical signals.

[0125] In some embodiments, the laser component 421 may include a laser chip 4211. The laser chip 4211 may emit optical signals.

[0126] In some embodiments, the laser assembly 421 may include a first substrate 4212. The laser chip 4211 may be supported on the first substrate 4212. The laser chip 4211 may be located at one end of the first substrate 4212 away from the first sidewall of the insertion port 310 (the sidewall near the gold finger).

[0127] In some embodiments, the first substrate 4212 does not have signal lines for transmitting electrical signals, and the laser chip 4211 of the laser component 421 can only be wire-connected to the signal pads of the circuit board 300 to achieve electrical connection between the laser chip 4211 and the signal pads of the circuit board 300.

[0128] In some embodiments, the first substrate 4212 is provided with signal lines for transmitting electrical signals, and the laser chip 4211 of the laser assembly 421 can be wire-connected to the signal pads of the circuit board 300 to achieve electrical connection between the laser chip 4211 and the signal pads of the circuit board 300.

[0129] In some embodiments, the lens array 430 may include a lens array 430. The lens array 430 may be a converging lens array, capable of converging optical signals. The lens array 430 may be located in the light emission direction of the laser component array 420.

[0130] Lens array 430 may include lenses to converge at least one optical signal. For example, lens array 430 includes eight lenses arranged side-by-side along the width of the circuit board to converge eight optical signals. Each converging lens has a light-transmitting surface through which the optical signals are converged.

[0131] The number of lens arrays 430 is the same as the number of laser component arrays 420, so that the laser components of the laser component array 420 correspond one-to-one with the lenses of the lens array 430.

[0132] In some embodiments, the lens array 430 may include a first lens array, which may be a converging lens array that can converge the light signals emitted by the laser component array.

[0133] In some embodiments, the lens array 430 may include a second lens array, which may be a collimating lens array that can collimate the optical signal emitted by the laser component array. The second lens array may be located between the laser component array and the first lens array.

[0134] Because the optical signal between the first and second lens arrays is collimated, the distance between them can be short or long, facilitating the placement of more components. This flexibility not only increases the tolerance of the emitted optical path, making it more tolerant of changes in the position and angle of components, but also improves the stability of the emitted optical path.

[0135] In some embodiments, the light emitting component 400 may include an isolator array 440. The isolator array 440 can prevent the light signal from returning to the laser component array 420 via its original path.

[0136] The isolator array 440 may include at least one isolator to prevent at least one optical signal from returning to the laser component array 420 via its original path. For example, the isolator array 440 includes eight isolators arranged side by side along the width of the circuit board to prevent eight optical signals from returning to the laser component array 420 via their original path.

[0137] The number of isolator arrays 440 is the same as the number of lens arrays 430, so that the isolators of isolator array 440 correspond one-to-one with the lenses of lens array 430.

[0138] In some embodiments, the light emitting component 400 may include an optical fiber array 450. The optical fiber array 450 may include optical fibers. The optical fiber array 450 may be located in the converging direction of the lens array 430, so that the end face of the optical fiber of the optical fiber array 450 may be located at the focal point of the lens array 430, thereby enabling the optical fiber of the optical fiber array 450 to transmit optical signals.

[0139] The optical path of the optical emitting component is as follows: the laser component array 420 emits 8 optical signals, which are converged by the lens array 430, pass through the isolator array 440, and converge to the fiber array 450.

[0140] In some embodiments, the light emitting component 400 may include a thermoelectric cooler (TEC) 460. A laser component array 420 may be mounted on the thermoelectric cooler 460 to control the operating temperature of the laser component array 420 within a target temperature range. A lens array 430 may be mounted on the thermoelectric cooler 460 such that the central axis of the lens array 430 is flush with the light exit port of the laser component array 420. For example, the lens array 430 may include a first lens array, which may be mounted on the thermoelectric cooler 460. Alternatively, the lens array 430 may include a first lens array and a second lens array, which may be mounted on the thermoelectric cooler 460.

[0141] The semiconductor cooler 460 may include an upper substrate 462 and a lower substrate 461. The upper surface of the upper substrate 462 may support a laser component array 420 and a lens array 430. The lower surface of the upper substrate 462 has a second conductive region, and the upper surface of the lower substrate 461 has a first conductive region. The first conductive region of the lower substrate 461 and the second conductive region of the upper substrate 462 may be connected by a semiconductor assembly 465.

[0142] A first electrode post 463 and a second electrode post 464 are disposed on the lower substrate 461. One end of the first electrode post 463 is connected to one end of the semiconductor assembly 465, and one end of the second electrode post 464 is connected to the other end of the semiconductor assembly 465. The other ends of both the first electrode post 463 and the second electrode post 464 are connected to the output terminal of the driving circuit. The driving circuit provides operating current to the semiconductor cooler 460 to heat or cool the semiconductor cooler 460, thereby controlling the temperature of the laser component array 420 within the target temperature range.

[0143] The MCU can be connected to the drive circuit so that the MCU can control the output current of the drive circuit, thereby achieving heating or cooling of the semiconductor cooler 460, so that the operating temperature of the laser component array 420 can be controlled within the target temperature range.

[0144] In some embodiments, the light emitting component 400 may include a support plate 480. The support plate 480 may be placed on the thermoelectric cooler 460, and the support plate 480 may support the laser component array 420 and the lens array 430. The support plate 480 may be thermally conductive so that the temperature of the laser component array 420 and the lens array 430 is as equal as possible to the temperature of the thermoelectric cooler 460.

[0145] The support plate 480 may include a first support plate 481. The first support plate 481 may house the laser component array 420 and the lens array 430.

[0146] The support plate 480 may include a second support plate 482. The second support plate 482 can support the laser component array 420 and the lens array 430. The first support plate 481 and the second support plate 482 jointly support the laser component array 420 and the lens array 430 to reduce the deformation caused by the excessive size of the first support plate 481, thereby ensuring that the light outlet heights of each laser component in the laser component array 420 are flush.

[0147] In some embodiments, the light emitting component 400 may include a temperature sensing element 470. The temperature sensing element 470 may be located around the laser component array 420. The temperature sensing element 470 may be used to monitor the temperature around the laser component array 420 and identify the temperature around the laser component array 420 as the operating temperature of the laser component array 420, thereby achieving monitoring of the operating temperature of the laser component array 420.

[0148] In some embodiments, the second support plate 482 is further away from the first electrode post 463 and the second electrode post 464 of the semiconductor cooler 460 relative to the first support plate 481, and the side of the second support plate 482 closer to the first support plate 481 supports the temperature sensing element 470 so that the temperature sensing element 470 can be located in the middle of the laser component array 420.

[0149] In some embodiments, the temperature sensor 470 may be placed in the middle of the laser component array 420 to facilitate accurate monitoring of the temperature around the laser component array 420. For example, the temperature sensor 470 may be placed on the side of the second support plate 482 near the first support plate 481.

[0150] The temperature sensing element 470 is a temperature-sensitive component whose resistance changes with temperature. Therefore, the temperature around the temperature sensing element can be determined by the resistance value of the temperature sensing element 470.

[0151] The temperature sensing element 470 can be connected to the MCU so that the MCU can determine the temperature around the temperature sensing element based on the resistance value of the temperature sensing element 470. In turn, the MCU can control the output current of the drive circuit based on the temperature around the temperature sensing element 470, thereby realizing the heating or cooling of the semiconductor cooler.

[0152] In some embodiments, the light emitting component 400 may include a housing 410. The central region of the housing 410 may support the various devices of the light emitting component 400, and the edge regions of the housing 410 may support the circuit board 300.

[0153] The top of the housing 410 may include a first support surface 411, which can support the thermoelectric cooler 460.

[0154] The top of the housing 410 may include a dispensing surface 414 for dispensing adhesive. A second supporting surface 415 may be provided on the dispensing surface 414, which can support the fiber optic array 450. The dispensing surface 414 and the first supporting surface 411 can be arranged along the length of the housing 410, so that the optical devices on the thermoelectric cooler 460 and the fiber optic array 450 are arranged along the length of the housing 410. The area of ​​the dispensing surface 414 other than the second supporting surface 415 is the dispensing area, and adhesive can be dispensed within this area. The adhesive in the dispensing area and the second supporting surface 415 are in contact with and connected to the fiber optic array 450. After the adhesive in the dispensing area cures, it forms a colloid that fixes the fiber optic array 450.

[0155] The top of the housing 410 may include a fulcrum surface 417. There may be no gap between the fulcrum surface 417 and the edge of the housing 410, that is, the fulcrum surface 417 is located in the edge region of the housing 410. The fulcrum surface 417 may be located in the projection region of the fiber array 450. There may be a gap between the fulcrum surface 417 and the fiber array 450 to facilitate the separation of the fiber array 450 from the housing 410 by using the fulcrum surface 417 as a fulcrum.

[0156] The top of the housing 410 may include a third support surface 413. The third support surface 413 may be located in the edge region of the housing 410 and may be connected to the lower surface of the sidewall of the insertion port 310 to support the circuit board 300. There is a height difference between the third support surface 413 and the dispensing surface 414, i.e., the height of the dispensing surface 414 is higher than that of the third support surface 413, such that the dispensing surface 414 and the third support surface 413 are connected by a connecting surface 416. The connecting surface 416 is connected to the side of the sidewall of the insertion port 310 to define the position of the circuit board 300 in the width direction of the housing 410. For example, the connecting surface 416 may contact and connect with one sidewall of the insertion port 310 of the circuit board 300.

[0157] The top of the housing 410 may include a fourth support surface 412. The fourth support surface 412 may be located between the first support surface 411 and the second support surface 415, and the fourth support surface 412 may support the isolator array 440. There is a height difference between the first support surface 411 and the fourth support surface 412, so that the light signal converged by the lens array 430 placed above the thermoelectric cooler 460 can pass through the isolator array 440.

[0158] The top of the housing 410 may include a first limiting plate 419. The first limiting plate 419 may be located on the dispensing surface 414. The first limiting plate 419 may be disposed along the length direction of the housing 410. The first limiting plate 419 may be located between two adjacent second supporting surfaces 415, and one side of the fiber array 450 may abut against one end of one side of the first limiting plate 419 to limit the position of the fiber array 450 in the width direction of the housing 410. The first limiting plate 419 may be located between two adjacent fourth supporting surfaces 412, and the isolator array 440 may abut against the other end of one side of the first limiting plate 419 to limit the position of the isolator array 440 in the width direction of the housing 410.

[0159] The top of the housing 410 may include a second limiting plate 418. The second limiting plate 418 may be located on the fourth supporting surface 412. The second limiting plate 418 may be disposed along the width direction of the housing 410. One end of the second limiting plate 418 is connected to the end face of the isolator array 440 to define the position of the isolator array 440 in the length direction of the housing 410. The other end of the second limiting plate 418 may be connected to the end face of the fiber array 450 to define the position of the fiber array 450 in the length direction of the housing 410.

[0160] Figure 9 This is a structural diagram of a circuit board according to some embodiments. Figure 10 A partial view of the internal structure of an optical module according to some embodiments. Figure 1 . Figure 11 A partial view of the internal structure of an optical module according to some embodiments. Figure 2 .like Figure 9 , Figure 10 and Figure 11 As shown, in some embodiments, the first sidewall 311 of the insertion port 310 of the circuit board 300 is provided with a plurality of support plates 312. The support plates 312 may be arranged along the length direction of the circuit board 300. Signal pads 3121 may be provided on the support plates 312. The signal pads 3121 may be wire-connected to the laser chip 4211 of the laser assembly 421.

[0161] The support plate 312 and the first sidewall 311 of the insertion opening 310 can form a storage notch 313. The storage notch 313 can be used to place the laser assembly 421. The laser assembly 421 can be placed at the storage notch 313 so that the laser assembly 421 and the support plate 312 can be arranged side by side along the width direction of the circuit board 300.

[0162] The laser chip 4211 of the laser component 421 is disposed at one end of the first sidewall 311 of the first substrate 4212 away from the embedding port 310. The support plate 312 is provided with signal pads 3121. The laser chip 4211 is directly wire-connected to the signal pads 3121 without the need for conversion through the first substrate 4212, which can reduce the reflection loss of high-frequency signals and ensure the integrity of high-frequency signals of the optical module.

[0163] In some embodiments, two adjacent laser components 421 are not wired to the same support plate 312 to reduce mutual interference of electrical signals.

[0164] The storage notch 313 may include a first storage notch 3131. The first storage notch 3131 may be formed by two adjacent support plates 312 and the first sidewall 311 of the insertion opening 310. The first storage notch 3131 may hold the laser assembly 421.

[0165] The storage notch 313 may include a second storage notch 3132. The second storage notch 3132 may be formed by two adjacent support plates 312 and the first sidewall 311 of the insertion port 310. The second storage notch 3132 may be located in the middle of a plurality of first storage notches 3131, so that the second storage notch 3132 can be located in the middle of the storage notch 313. The second storage notch 3132 may house the laser assembly 421 and the temperature sensing element 470, so that the temperature sensing element 470 can be located in the middle of the laser assembly array 420.

[0166] The width of the second storage notch 3132 can be greater than the width of the first storage notch 3131, so that the first storage notch 3131 can hold the laser component 421, and the second storage notch 3132 can hold the laser component 421 and the temperature sensing element 470.

[0167] The storage notch 313 may include a third storage notch 3133. The third storage notch 3133 may be formed by a support plate 312, a first sidewall 311 of the insertion port 310, and a sidewall connected to the first sidewall 311 of the insertion port 310. The third storage notch 3133 may hold the first electrode post 463 and the second electrode post 464 of the laser assembly 421 and the semiconductor cooler 460.

[0168] The width of the third storage notch 3133 can be greater than the width of the first storage notch 3131, so that the first storage notch 3131 can hold the laser component 421, and the third storage notch 3133 can hold the first electrode post 463 and the second electrode post 464 of the laser component 421 and the semiconductor cooler 460.

[0169] The storage notch 313 may include a fourth storage notch 3134. The fourth storage notch 3134 may be formed by the support plate 312, the first sidewall 311 of the insertion port 310, and another sidewall connected to the first sidewall 311 of the insertion port 310. The fourth storage notch 3134 can separate the other sidewall of the insertion port 310 of the circuit board 300 from the support plate 312, thereby preventing damage to the circuit board 300 during the fabrication of the support plate 312.

[0170] Figure 12 This is a structural diagram of a circuit board provided according to some embodiments, viewed from another perspective. Figure 13 This is a partial view of the internal structure of an optical module according to some embodiments, taken from another perspective. Figure 12 and Figure 13 As shown, in some embodiments, the thickness of the support plate 312 may be less than the thickness of the first sidewall of the insertion port 310. That is, the upper surface of the support plate 312 is flush with the upper surface of the first sidewall of the insertion port 310, and the lower surface of the support plate 312 is not flush with the lower surface of the first sidewall of the insertion port 310, so that the support plate 312 and the first sidewall 311 form an avoidance notch 314 to avoid the device.

[0171] In some embodiments, a protective member 320 is provided on the lower surface of the sidewall of the insertion port 310. The protective member 320 may be coated with adhesive to bond the housing 410 to the circuit board 300. The protective member 320 is connected to the third support surface 413 of the housing 410 to protect the circuit board 300 and prevent damage to the circuit board 300 when the housing 410 is removed.

[0172] The protective component 320 may include a storage groove 321. Adhesive may be placed on the protective component 320 and in the storage groove 321. The thickness of the adhesive in the storage groove 321 area is greater than the thickness of the adhesive in other protective areas, so as to increase the contact area between the tube shell 410 and the circuit board 300, thereby increasing the adhesion between the tube shell 410 and the circuit board 300.

[0173] The storage recess 321 may have an opening 3211, which may face away from the insertion port 310. When there is too much glue, the glue will not flow into the insertion port 310, thus avoiding glue contamination of the optical device of the light emitting component 400.

[0174] In some embodiments, the height difference between the lower surface of the support plate 312 and the first support surface 411 is equal to the height difference between the upper surface of the support plate 480 and the first support surface 411, so that the support plate 312 is placed on the support plate 480, that is, the support plate 312 is directly connected to the support plate 480, which facilitates the thermoelectric cooler 460 to adjust the temperature of the support plate 312.

[0175] In some embodiments, the height difference between the lower surface of the support plate 312 and the first support surface 411 is greater than the height difference between the upper surface of the support plate 480 and the first support surface 411, so that there is a gap between the support plate 312 and the support plate 480, that is, the support plate 312 and the support plate 480 are not connected, so as to avoid the upper surface of the support plate 480 being higher than the lower surface of the support plate 312 due to processing errors, thereby reducing the mutual interference between the support plate 312 and the support plate 480.

[0176] Figure 14 This is a cross-sectional view of the internal structure of an optical module according to some embodiments. Figure 15 This is a cross-sectional view of the internal structure of an optical module according to some embodiments, taken from another perspective. Figure 14 and Figure 15 As shown, in some embodiments, a clearance notch 314 is formed at one end of the circuit board 300 near the insertion port 310, the clearance notch 314 clearing the semiconductor cooler 460 and the support plate 480.

[0177] In some embodiments, the laser component array 420 is placed on the support plate 480, and there is a gap between the support plate 312 and the support plate 480.

[0178] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this disclosure.

Claims

1. An optical module, characterized in that, include: The circuit board has an insertion slot. The light emitting component is embedded in the embedding port; The light emitting component includes: Laser component array, including: Laser components, including: Laser chips are used to emit optical signals; The first substrate supports the laser chip; A lens array is located in the light-emitting direction of the laser component array to focus the optical signal; An optical fiber array, located in the converging direction of the lens array, is used to transmit optical signals converged by the lens array; the first sidewall of the embedding port is formed with: A support plate is provided along the length of the circuit board and has signal pads. The support plate and the first sidewall of the insertion port form a placement notch. The laser component is placed at the placement notch so that the laser component and the support plate are arranged side by side along the width of the circuit board. The laser chip is located at the end of the first substrate away from the first sidewall of the insertion port, and the laser chip is wire-connected to the signal pads.

2. The optical module according to claim 1, characterized in that, The upper surface of the support plate is flush with the upper surface of the first sidewall of the insertion port, and the lower surface of the support plate is not flush with the lower surface of the first sidewall of the insertion port, so that the support plate and the first sidewall of the insertion port form an avoidance gap.

3. The optical module according to claim 1, characterized in that, The light emitting component also includes: A semiconductor cooler, supporting the laser assembly, is located below the support plate; there is a gap between the support plate and the semiconductor cooler.

4. The optical module according to claim 3, characterized in that, The light emitting component also includes: The temperature sensing element is located in the middle of the laser component array; The storage notch includes: The first placement notch, formed by the two adjacent support plates and the first sidewall of the insertion opening, is used to place the laser assembly. The second storage notch, formed by two adjacent support plates and the first sidewall of the insertion opening, is located in the middle of the plurality of first storage notches and is used to place the laser assembly and the temperature sensing element; The third placement notch is formed by the support plate, the first side wall of the insertion port, and a side wall connected to the first side wall of the insertion port, and is used to place the laser assembly and the first and second electrode posts of the semiconductor cooler. The width of the second storage notch is greater than the width of the first storage notch, and the width of the third storage notch is greater than the width of the first storage notch.

5. The optical module according to claim 3, characterized in that, The light emitting component also includes: The tubular shell, embedded in the embedding port, includes: The first supporting surface supports the semiconductor cooler; The adhesive dispensing surface is positioned along the length of the tube shell, along with the first supporting surface. The second supporting surface is located on the dispensing surface and supports the optical fiber array; The first limiting plate is located on the dispensing surface, between two adjacent second supporting surfaces, and connected to one side of the fiber array; The third supporting surface is connected to the lower surface of the side wall of the embedding port, and its height is lower than the height of the dispensing surface; The connecting surface is connected to the dispensing surface on one side and to the third supporting surface on the other side, and is also connected to the side wall of the embedding port.

6. The optical module according to claim 5, characterized in that, The lower surface of the sidewall of the insertion port is provided with: The protective component, connected to the third support surface of the tube shell, includes: The storage recess has an opening; the opening faces away from the insertion port.

7. The optical module according to claim 3, characterized in that, The light emitting component also includes: The temperature sensing element is located in the middle of the laser component array; A support plate, resting on the semiconductor cooler and supporting the laser component array, includes: First support plate; The second support plate, together with the first support plate, supports the laser component array. The first electrode post and the second electrode post of the semiconductor cooler are further away from the first support plate. The side of the second support plate closest to the first support plate supports the temperature sensing element.

8. The optical module according to claim 5, characterized in that, The light emitting component includes: An isolator array is located between the lens array and the fiber array; The shell also includes: The fourth support surface, located between the first support surface and the second support surface, supports the isolator array; The second limiting plate is located on the fourth supporting surface and is arranged along the width direction of the tube shell. One end is connected to the end face of the optical fiber array, and the other end is connected to the end face of the isolator array.

9. The optical module according to claim 1, characterized in that, The two adjacent laser components are wired to different support plates.

10. The optical module according to claim 1, characterized in that, Also includes: A light receiving component, located on the surface of the circuit board and on one side of the embedding port, is used to receive light signals.

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