Method for manufacturing electronic paper and electronic paper

Abstract

This invention relates to the field of electronic paper manufacturing and discloses a method for producing electronic paper. The method involves directly forming microcup structures on a glass substrate using either imprinting or photolithography and etching. This results in microcup structures with advantages such as good uniformity of dam height, good verticality of the dam walls, high surface hardness, and no chemical reaction between the dam walls and the plasma material. The invention also discloses an electronic paper where microcup structures are directly formed on a first substrate layer, resulting in microcup structures with good uniformity of dam height, good verticality of the dam walls, high surface hardness, and no chemical reaction between the dam walls and the plasma material.

Description

Technical Field

[0001] This invention relates to the field of electronic paper manufacturing technology, and more particularly to a method for manufacturing electronic paper and electronic paper itself. Background Technology

[0002] In existing electronic paper products, PS glue or other resins can be used to create a dam to form a microcup to support and restrict the flow of internal plasma. However, in this structure and the corresponding manufacturing process, due to the difference in the height of the dam and the fact that the cross-sectional shape of the dam is trapezoidal and not perpendicular to the cup wall, there are problems such as the dam resin material reacting with the pulp, and the microcup being easily scratched or falling off. Summary of the Invention

[0003] The present invention aims to solve at least one problem in the prior art. To this end, the present invention proposes a method for manufacturing electronic paper and electronic paper itself. This method involves directly fabricating a microcup structure on a glass substrate. This microcup structure has advantages such as good uniformity of dam height, good verticality of the dam walls, high surface hardness, and no chemical reaction between the dam walls and the plasma material.

[0004] A method for manufacturing electronic paper according to a first aspect of the present invention includes:

[0005] Make a mold with reverse dimensions based on the size of the microcup;

[0006] A glass substrate is provided, and the mold is pressed onto the glass substrate to form a microcup structure;

[0007] Plasma material is filled into the microcup structure;

[0008] The microcup structure, after being filled with plasma material, is attached to the driving substrate.

[0009] According to another embodiment of the present invention, providing a glass substrate and pressing the mold onto the glass substrate to form a microcup structure specifically includes:

[0010] A glass substrate is provided, and the glass substrate is heated and softened.

[0011] A mold is used to press, hold, and anneal the softened glass substrate to form a microcup structure on the glass substrate.

[0012] Separate the mold from the glass substrate.

[0013] According to another embodiment of the invention, the heating temperature is 500°-800°.

[0014] According to another embodiment of the present invention, the mold is an alloy or graphite.

[0015] A method for manufacturing electronic paper according to a second aspect of the present invention includes:

[0016] Make a mask template according to the size of the microcup;

[0017] A glass substrate is provided, and an ink layer is coated on the surface of the glass substrate;

[0018] The ink layer is exposed and developed using a photomask to form alignment holes in the ink layer;

[0019] The glass substrate and the ink layer are etched using an etching solution to form a microcup structure;

[0020] Plasma material is filled into the microcup structure;

[0021] The microcup structure, after being filled with plasma material, is attached to the driving substrate.

[0022] According to another embodiment of the present invention, the ink layer is an acid-resistant ink or an alkali-resistant ink.

[0023] According to another embodiment of the present invention, the etching solution is an acidic etching solution or an alkaline etching solution.

[0024] An electronic paper according to a third aspect of the present invention includes a first substrate layer and a second substrate layer disposed therebetween. A microcup structure is disposed on the first substrate layer, and a plasma material is disposed in the microcup structure. The microcup structure is integrally formed on the first substrate layer.

[0025] According to another embodiment of the present invention, the microcup structure includes a plurality of dikes perpendicular to the first substrate layer, the plurality of dikes defining a plurality of microcup chambers.

[0026] According to another embodiment of the present invention, the first substrate layer is a glass substrate.

[0027] Compared with the prior art, the present invention has the following beneficial effects:

[0028] The first aspect of this invention discloses a method for manufacturing electronic paper. First, a mold with reverse dimensions is fabricated according to the size of a microcup. Then, the mold is imprinted onto a glass substrate to form a microcup structure. Next, plasma material is filled into the microcup structure, and the plasma-filled microcup structure is attached to a driving substrate. By directly generating the microcup structure on the glass substrate through imprinting, this microcup structure has advantages such as good uniformity of dam height, good verticality of the dam walls, high surface hardness, and no chemical reaction between the dam walls and the plasma material.

[0029] The second aspect of this invention discloses a method for manufacturing electronic paper. First, a photomask is fabricated according to the dimensions of a microcup. Then, an ink layer is coated onto the surface of a glass substrate. The ink layer is exposed and developed using the photomask to form alignment holes. Next, an etching solution is used to etch the glass substrate and the ink layer to form a microcup structure. Finally, plasma material is filled into the microcup structure, and the plasma-filled microcup structure is attached to a driving substrate. By directly generating the microcup structure on the glass substrate through photolithography and etching, this microcup structure has advantages such as good uniformity of dam height, good verticality of the dam walls, high surface hardness, and no chemical reaction between the dam walls and the plasma material.

[0030] The third aspect of this invention discloses an electronic paper that directly generates a microcup structure on a first substrate layer. This microcup structure has the advantages of good uniformity of dam height, good verticality of dam walls, high surface hardness, and no chemical reaction between the dam walls and the plasma material.

[0031] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0032] The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0033] Figure 1 A partial process diagram of one embodiment of the electronic paper manufacturing method provided in this application;

[0034] Figure 2 A partial process diagram of one embodiment of the electronic paper manufacturing method provided in this application;

[0035] Figure 3 A partial process diagram of another embodiment of the electronic paper manufacturing method provided in this application;

[0036] Figure 4 A partial process diagram of another embodiment of the electronic paper manufacturing method provided in this application;

[0037] Figure 5 A schematic flowchart of one embodiment of the electronic paper manufacturing method provided in this application;

[0038] Figure 6 A schematic flowchart of another embodiment of the method for manufacturing electronic paper provided in this application;

[0039] Figure 7A schematic flowchart of another embodiment of the electronic paper manufacturing method provided in this application; the markings in the figure mean:

[0040] 100. Electronic paper; 110. First substrate layer; 111. Microcup structure; 112. Plasma material;

[0041] 113. Cofferdam; 114. Microcup chamber; 120. Second basal layer;

[0042] 200. Mold;

[0043] 300. Glass substrate;

[0044] 400. Driver substrate;

[0045] 500, mask template;

[0046] 600, Ink layer; 610, Alignment hole. Detailed Implementation

[0047] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0048] In the description of this invention, it should be understood that features specified as "first" or "second" may explicitly or implicitly include one or more of those features. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0049] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0050] To illustrate the manufacturing method of the electronic paper and the electronic paper itself provided in this application, the following detailed description is provided in conjunction with the accompanying drawings and textual descriptions of the embodiments.

[0051] The following is for reference. Figure 1 , Figure 2 , Figure 5 and Figure 6 A method for manufacturing electronic paper 100 according to an embodiment of the first aspect of the present invention is described, such as... Figure 5 As shown, the specific steps include:

[0052] Step S110: Fabricate a mold 200 with reverse dimensions according to the dimensions of the microcup structure 111;

[0053] Specifically, the dimensions of the microcup structure 111 can be designed according to the usage requirements of the electronic paper 100 product. These dimensions include the length, width, height, width of the dam 113, and area of ​​the microcup structure 111. Then, a mold 200 with the opposite dimensions is designed based on the dimensions of the microcup structure 111.

[0054] Step S120: Provide a glass substrate 300, and press the mold 200 onto the glass substrate 300 to form a microcup structure 111;

[0055] Specifically, the size of the glass substrate 300 can be selected according to the usage requirements of the electronic paper 100 product. For example, glass substrates 300 of sizes such as G2.5, G4.5 or G8.6 can be selected.

[0056] Step S130: Fill the microcup structure 111 with plasma material 112;

[0057] Specifically, plasma material 112 may include plasma solution and electrophoretic particles.

[0058] Step S140: Attach the microcup structure 111 filled with plasma material 112 to the driving substrate 400.

[0059] Specifically, the microcup structure 111 is attached to the drive substrate 400 to achieve the sealing of the plasma material 112.

[0060] According to one embodiment of the present invention, such as Figure 6 As shown, step S120: A glass substrate 300 is provided, and the mold 200 is pressed onto the glass substrate 300 to form a microcup structure 111, specifically including the following steps:

[0061] Step S121: Provide a glass substrate 300 and heat the glass substrate 300 to soften it;

[0062] Specifically, the glass substrate 300 can be heated to its softening point using a high-temperature furnace. It is understood that the softening point temperature of different glass substrates 300 varies depending on the glass material.

[0063] Step S122: The softened glass substrate 300 is pressed, held and annealed using the mold 200 to form a microcup structure 111 on the glass substrate 300.

[0064] Specifically, the glass substrate 300, after reaching its softening point, is brought into contact with the mold 200, and a corresponding microcup structure 111 is formed on the glass substrate 300 by imprinting. At the same time, the microcup structure 111 is successfully formed through processes such as pressure holding and annealing.

[0065] Step S123: Separate the mold 200 from the glass substrate 300.

[0066] Specifically, the mold 200 on the glass substrate 300 after the microcup structure 111 is formed is removed.

[0067] According to one embodiment of the present invention, the heating temperature is 500°-800°. It is understood that the commonly used glass softening temperature is between 500°-800°, so setting the heating temperature to 500°-800° can meet the softening process of most glasses.

[0068] It should be noted that in some other embodiments, the appropriate heating temperature can be selected according to the different glass materials.

[0069] According to one embodiment of the present invention, such as Figure 1 and Figure 2 As shown, the mold 200 is made of alloy or graphite. It can be understood that the mold 200 can be made of high-temperature resistant and precision-machinable materials such as alloy and graphite, so as to meet the requirements of imprinting on the glass substrate 300 after heating.

[0070] It should be noted that in some other embodiments, the mold 200 can also be made of other high-temperature resistant and precision-machinable materials.

[0071] The following is for reference. Figure 3 and 4 , Figure 7 A method for manufacturing electronic paper 100 according to a second aspect embodiment of the present invention is described, such as... Figure 3 and 4 , Figure 7 As shown, the specific steps include:

[0072] Step S210: Fabricate a mask template 500 according to the dimensions of the microcup structure 111;

[0073] Specifically, the dimensions of the microcup structure 111 can be designed according to the usage requirements of the electronic paper 100 product. These dimensions include the length, width, height, width of the dam 113, and area of ​​the microcup structure 111. Then, a mask template 500 of the corresponding size can be designed according to the dimensions of the microcup structure 111.

[0074] Step S220: Provide a glass substrate 300 and coat an ink layer 600 on the surface of the glass substrate 300;

[0075] Specifically, an ink layer 600 is coated on the surface of the glass substrate 300 to prepare for subsequent photolithography processes.

[0076] Step S230: Expose and develop the ink layer 600 using the mask 500 to form alignment holes in the ink layer 600;

[0077] Specifically, the ink layer 600 is exposed and developed using a mask 500, thereby forming corresponding alignment hole structures on the ink layer 600, which prepares for subsequent etching.

[0078] Step S240: Use an etching solution to etch the glass substrate 300 and the ink layer 600 to form a microcup structure 111;

[0079] Specifically, the glass substrate 300 and the ink layer 600 are etched using an etching solution, and the ink layer 600 is formed into the designed microcup structure 111 by utilizing the pre-formed alignment hole structure.

[0080] Step S250: Fill the microcup structure 111 with plasma material 112;

[0081] Specifically, plasma material 112 may include plasma solution and electrophoretic particles.

[0082] Step S260: Attach the microcup structure 111 filled with plasma material 112 to the driving substrate 400.

[0083] Specifically, the microcup structure 111 is attached to the drive substrate 400 to achieve the sealing of the plasma material 112.

[0084] According to one embodiment of the present invention, the ink layer 600 is an acid-resistant ink or an alkali-resistant ink. Specifically, the ink layer 600 can be epoxy ink, polyurethane ink, acrylic resin ink, or UV screen printing ink, etc. These inks can effectively resist acid and alkali corrosion and ensure the normal progress of etching. It is understood that the ink layer 600 needs to be compatible with the etching solution used to avoid the etching solution removing the ink layer 600 during the etching process.

[0085] According to one embodiment of the present invention, the etching solution is an acidic etching solution or an alkaline etching solution. Specifically, the etching solution can be FeCl3 etching solution, H2O2-hydrochloric acid, CuCl2-hydrochloric acid, or an ammonia-containing alkaline etching solution, etc.

[0086] The following is for reference. Figure 2 and Figure 4 An electronic paper 100 according to an embodiment of a third aspect of the present invention is described, such as Figure 2 and Figure 4As shown, the system includes a first substrate layer 110 and a second substrate layer 120. A microcup structure 111 is disposed on the first substrate layer 110, and a plasma material 112 is disposed in the microcup structure 111. The microcup structure 111 is integrally formed on the first substrate layer 110. It can be understood that since the microcup structure 111 is integrally formed on the first substrate layer 110, the microcup structure 111 and the first substrate layer 110 have the same material, thereby making the microcup structure 111 have the same material as the first substrate layer 110. Furthermore, the microcup structure 111 includes multiple dams 113 perpendicular to the first substrate layer 110, which define multiple microcup chambers 114. Plasma material 112 is disposed in the microcup chambers 114. Specifically, the first substrate layer 110 can be a material with high hardness, thereby giving the microcup structure 111 the advantages of good uniformity of dam height, good verticality of dam walls, high surface hardness, and no chemical reaction between dam walls and plasma material 112.

[0087] According to one embodiment of the present invention, such as Figure 2 and Figure 4 As shown, the first substrate 110 is a glass substrate 300. It can be understood that the glass substrate 300 has good hardness and strength, and at the same time has stable physical and chemical stability in the process of fabricating the microcup structure 111.

[0088] The above-described method for manufacturing electronic paper and the electronic paper provided in this application are preferred embodiments and should not be construed as limiting the scope of protection of this application. Those skilled in the art should know that various improvements or substitutions can be made without departing from the concept of this application, and all improvements or substitutions should be within the scope of protection of this application, that is, the scope of protection of this application should be determined by the claims.

[0089] Where there is no conflict, the above embodiments and features described herein can be combined with each other.

Claims

1. A method for manufacturing electronic paper, characterized in that, include: A mold with reverse dimensions is made based on the dimensions of the microcup structure; A glass substrate is provided, and the mold is pressed onto the glass substrate to form a microcup structure; Plasma material is filled into the microcup structure; The microcup structure, after being filled with the plasma material, is attached to the driving substrate.

2. The method for manufacturing electronic paper as described in claim 1, characterized in that, The provision of a glass substrate, and the imprinting of the mold onto the glass substrate to form a microcup structure, specifically includes: A glass substrate is provided, and the glass substrate is heated to soften it. The softened glass substrate is pressed, held under pressure, and annealed using the mold to form a microcup structure on the glass substrate; Separate the mold from the glass substrate.

3. The method for manufacturing electronic paper as described in claim 2, characterized in that, The heating temperature is 500°-800°.

4. The method for manufacturing electronic paper as described in claim 1, characterized in that, The mold is made of alloy or graphite.

5. A method for manufacturing electronic paper, characterized in that, include: A mask template is fabricated based on the dimensions of the microcup structure; A glass substrate is provided, and an ink layer is coated on the surface of the glass substrate; The ink layer is exposed and developed using the photomask to form alignment holes in the ink layer; The glass substrate and the ink layer are etched using an etching solution to form a microcup structure; Plasma material is filled into the microcup structure; The microcup structure, after being filled with the plasma material, is attached to the driving substrate.

6. The method for manufacturing electronic paper as described in claim 5, characterized in that, The ink layer is an acid-resistant ink or an alkali-resistant ink.

7. The method for manufacturing electronic paper as described in claim 5, characterized in that, The etching solution is either an acidic etching solution or an alkaline etching solution.

8. An electronic paper, characterized in that, It includes a first base layer and a second base layer, respectively. A microcup structure is disposed on the first base layer, and plasma material is disposed in the microcup structure. The microcup structure is integrally formed on the first base layer.

9. The method for manufacturing electronic paper as described in claim 8, characterized in that, The microcup structure includes multiple dikes perpendicular to the first base layer, and the multiple dikes define multiple microcup chambers.

10. The method for manufacturing electronic paper as described in claim 8, characterized in that, The first base layer is a glass substrate.

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