Support plate, display module, electronic device and manufacturing method of support plate

Abstract

A support plate (16), a display module (10), an electronic device (100), and a method for manufacturing the support plate (16) are disclosed, relating to the field of electronic device technology. The support plate (16) can solve the problems of poor extrusion resistance and impact resistance of existing display modules (10). The support plate (16) includes a bending portion (160) that can be bent relative to an axis (L1). The bending portion (160) includes a first surface (16a) and a second surface (16b) that are opposite to each other along the thickness direction of the support plate (16). The bending portion (160) has a plurality of through holes (165a) that penetrate the support plate (16) along the thickness direction of the support plate (16). The through holes (165a) include a first opening (165a1) and a second opening (165a2) located at both ends of the through hole (165a), respectively. The area of ​​the first opening (165a1) is smaller than the area of ​​the second opening (165a2).

Description

Support plate, display module, electronic device, and manufacturing method of support plate Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to a support plate, a display module, an electronic device, and a method for manufacturing the support plate. Background Technology

[0002] Currently, in order to provide users with a better sensory experience, larger screens have become an inevitable development trend for display-based smart terminal products such as mobile phones, laptops, and tablets. However, larger screens also increase the size of the smart terminal, making it less convenient to carry around.

[0003] To address the aforementioned issues, foldable electronic devices have emerged. When folded, these devices achieve a smaller size, making them easier for users to carry. The electronic device includes at least a flexible display screen and a support plate for supporting the flexible display screen. The flexible display screen includes a bending portion, and the support plate has through holes in the area corresponding to the bending portion to improve the bending performance of the support plate.

[0004] However, setting through holes in the area corresponding to the bend on the support plate will make the bend of the flexible display screen less resistant to compression and impact, and the display screen is prone to display failure problems such as bright spots and black spots, which will reduce the user experience.

[0005] Summary of the Invention

[0006] This application provides a support plate, a display module, an electronic device, and a method for manufacturing the support plate. The support plate can solve the problems of poor extrusion resistance and poor impact resistance of existing display modules.

[0007] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0008] In a first aspect, this application provides a support plate including a bendable portion having a plurality of through holes extending through the support plate along its thickness direction. Each through hole includes a first opening and a second opening located at opposite ends, the area of ​​the first opening being smaller than the area of ​​the second opening.

[0009] The aforementioned support plate can be used in a foldable display module. In the foldable display module, the support plate supports the backlight surface of the display panel, the bent portion of the support plate corresponds to the bent area of ​​the display panel, and the first opening of the through hole on the support plate is closer to the display panel than the second opening.

[0010] Because the area of ​​the first opening is smaller than the area of ​​the second opening, the solid area on the surface of the support plate used to support the display panel is larger than the solid area on the surface of the support plate facing away from the display panel. This means the contact area between the support plate and the display panel is increased. When the display module is subjected to impacts or pressure, stress is transferred to the support plate. The support plate disperses this stress using its first surface. The increased solid area of ​​the support plate used to support the display panel avoids stress concentration on the support plate, thus preventing display module failure and further improving the reliability of the support plate's support for the display panel.

[0011] From another perspective, the reduced area of ​​the first opening increases the solid portion of the support plate near the display panel, thus improving its rigidity. When the display module is subjected to impacts or pressure, stress is transferred to the support plate. The support plate's high rigidity resists this stress, preventing breakage and thus avoiding issues like bright spots and black spots on the display panel. This further enhances the reliability of the support plate's support for the display panel.

[0012] In one possible design of the first aspect, the bending portion can be bent relative to an axis, and the through hole is an elongated through hole extending in a direction parallel to the axis. This improves the bending resilience of the bending portion and enhances the user experience when bending the support plate.

[0013] In one possible design of the first aspect, the support plate includes a first surface and a second surface opposite to each other along the thickness direction, with through holes penetrating both the first and second surfaces. A first opening is located on the first surface, and a second opening is located on the second surface. In this way, multiple through holes penetrate the support plate to form a bent portion of the support plate, resulting in a simple support plate structure that is easy to manufacture.

[0014] In one possible design of the first aspect, the support plate includes a first surface and a second surface opposite to each other along the thickness direction, with a first opening located on the first surface. The bent portion also has a first groove formed by recessing from the second surface toward the first surface, and the second openings of the plurality of through holes all penetrate the bottom wall of the first groove.

[0015] In this way, the second opening of the through-hole is located between the first and second surfaces. Along the thickness direction of the support plate, the depth of the through-hole decreases, which helps improve the processing efficiency of the through-hole. Furthermore, the reduced depth of the through-hole allows for the processing of smaller first and second openings, thereby ensuring the rigidity of the support plate near the display panel and improving the reliability of the support plate in supporting the display panel.

[0016] Furthermore, a first groove is provided on the side of the support plate facing away from the display panel. The first groove can improve the bending resilience of the side of the support plate facing away from the display panel, so as to match the deformation when the side of the support plate facing away from the display panel is bent, thereby improving the user's feel when using electronic devices.

[0017] In one possible design of the first aspect, the through-hole is located between the first opening and the second opening at the minimum cross-sectional area perpendicular to the thickness direction of the support plate. This allows the through-hole to be processed using an upper and lower spray etching solution, where the duration of the upper spray etching solution is shorter than the duration of the lower spray etching solution, or the amount of the upper spray etching solution is less than the amount of the lower spray etching solution, ensuring that the area of ​​the first opening is smaller than the area of ​​the second opening. Under the action of the upper and lower spray etching solutions, the through-hole is formed faster, which is beneficial for improving the processing efficiency of the support plate.

[0018] In one possible design of the first aspect, the distance between the through hole and the first opening at the point of minimum cross-sectional area perpendicular to the thickness direction of the support plate is a first distance. The distance between the through hole and the second opening at the point of minimum cross-sectional area perpendicular to the thickness direction of the support plate is a second distance, and the first distance is less than the second distance.

[0019] In this way, when the display panel is subjected to external pressure or impact, the display panel transfers the stress to the support plate. The part of the support plate closer to the display panel has greater rigidity, providing sufficient support to prevent deformation and maintain the original state of the display panel, thereby improving the reliability of the support plate's support. Furthermore, the part of the support plate away from the display panel has higher bending resilience to accommodate bending deformation of the support plate.

[0020] In one possible design of the first aspect, the cross-sectional area of ​​the through hole gradually increases from the point of minimum cross-sectional area perpendicular to the thickness direction of the support plate to both ends of the through hole.

[0021] In this way, the through-holes can be processed using an up-and-down spray etching solution method. Under the action of the up-and-down spray etching solution, the through-holes are formed quickly, which helps to improve the processing efficiency of the support plate. Furthermore, the type of etching solution and the spray direction of the etching solution in the etching process determine the shape of the inner wall of the through-hole. The above-mentioned through-hole structure is easy to process using conventional etching solution types and spray directions, which helps to reduce the difficulty of processing the support plate.

[0022] In one possible design of the first aspect, the cross-sectional area of ​​the through hole gradually increases along the direction perpendicular to the thickness of the support plate from the first opening to the second opening. This results in a simple structure for the through hole, making it easy to manufacture.

[0023] In one possible design of the first aspect, the bent portion is capable of bending relative to an axis, the first direction being perpendicular to both the axis and the thickness direction of the support plate. The difference between the maximum dimension of the first opening along the first direction and the maximum dimension of the second opening along the first direction is greater than or equal to 0.03 mm and less than or equal to 0.16 mm.

[0024] In this way, the difference between the maximum dimension of the first opening along the first direction and the maximum dimension of the second opening along the first direction has a lower limit of 0.03 mm, so that different parts of the support plate have different bending resilience and stiffness. While satisfying the bending resilience requirement of the support plate, the stiffness of the support plate is increased, thereby improving the reliability of the support plate in supporting the display panel. The difference between the maximum dimension of the first opening along the first direction and the maximum dimension of the second opening along the first direction has an upper limit of 0.16 mm, so that the size difference between different segments of the through hole is small, reducing the processing difficulty of the through hole.

[0025] In one possible design of the first aspect, the dimension of the first opening along the first direction is less than or equal to the length of the through hole along the thickness direction of the support plate. This ensures that the volume of the solid portion of the support plate meets the rigidity requirements, thereby meeting the structural strength requirements for the support plate supporting the display panel and further improving the reliability of the support plate in supporting the display panel.

[0026] In one possible design of the first aspect, the difference between the dimension of the first opening along the first direction and the length of the through hole along the thickness direction of the support plate is less than or equal to 0.04 mm. In this way, the dimension of the first opening along the first direction is not much smaller than the depth of the through hole along the thickness direction of the support plate. Under the premise that the support plate meets the rigidity requirements, it can also ensure that the support plate has better bending resilience and heat dissipation performance, thereby improving the user's handling experience when using electronic devices.

[0027] In one possible design of the first aspect, the ratio of the depth of the first groove to the thickness of the support plate is greater than or equal to 0.1 and less than or equal to 0.4 in the thickness direction of the support plate. The ratio of the depth of the first groove to the thickness of the support plate has a lower limit of 0.1 to ensure that the depth of the first groove can improve the bending resilience performance of the support plate on the side opposite to the display panel, thereby improving the user's tactile experience.

[0028] The ratio of the depth of the first groove to the thickness of the support plate has an upper limit of 0.4 to ensure the structural strength of the support plate in supporting the display panel, thereby improving the reliability and stability of the support plate in supporting the display panel.

[0029] In one possible design of the first aspect, the bending portion is capable of bending relative to an axis, the first direction being perpendicular to both the axis and the thickness direction of the support plate. The support plate includes a first surface and a second surface facing away from each other along the thickness direction. The bending portion includes a first sub-bending portion and two second sub-bending portions, with the two second sub-bending portions respectively disposed on both sides of the first sub-bending portion along the first direction, and a plurality of through holes located in the first sub-bending portion.

[0030] The second sub-bend includes a plurality of second grooves, which are formed by recessing from the second surface toward the first surface and extend in a direction parallel to the axis.

[0031] In this way, when the support plate is bent, the first sub-bend with a larger degree of bending deformation has higher bending resilience, while the second sub-bend with a smaller degree of bending deformation has higher rigidity, thereby improving the reliability and stability of the support plate in supporting the display panel. The support plate is divided into different bending sections to accommodate different degrees of deformation when the display module is bent.

[0032] Furthermore, when the support plate bends, it first transitions from the flat section with high support strength to the second sub-bend section with high support strength, and then further transitions to the first sub-bend section with lower support strength. This is to avoid the support strength of the flat section and the bend section being too different, which could cause breakage at the junction of the flat section and the bend section, and is beneficial to improving the overall support strength of the support plate.

[0033] In one possible design of the first aspect, in a direction parallel to the axis, the bent portion includes a first end face and a second end face facing away from each other, and the bent portion also includes at least one notch formed by one of the first end face and the second end face being recessed into the other; the notch penetrates the first surface and the second surface, and at least one end of the second groove in the direction parallel to the axis communicates with the notch.

[0034] In this way, the support plate can overcome the limitations of the etching process and avoid the problem of excess material forming at the end of the second groove, thereby improving the processing accuracy of the second groove, and thus improving the bending resilience performance of the support plate at the second groove, and improving the user's feel when using electronic devices.

[0035] In one possible design of the first aspect, the depth of the notch in the direction parallel to the axis is greater than or equal to 0.05 mm and less than or equal to 0.3 mm. The lower limit of the notch depth, 0.05 mm, removes most of the excess material located at the end face of the second groove, thereby improving the machining accuracy of the second groove. The upper limit of the notch depth, 0.3 mm, ensures the volume of the solid portion of the support plate, thus ensuring the rigidity of the support plate and improving the reliability and stability of the support plate in supporting the display panel.

[0036] Secondly, this application also provides a display module, which includes a cover plate, a display panel, and a support plate. The display panel includes a display surface and a backlight surface facing away from each other, and the cover plate is stacked on the display surface. The support plate is the support plate described above, and the support plate is stacked on the backlight surface; the first opening of the through hole in the support plate is closer to the display panel than the second opening.

[0037] Since the display module provided in this application embodiment includes the support plate of the above technical solution, the two can solve the same technical problem and achieve the same effect.

[0038] Thirdly, this application also provides an electronic device, which includes a display module and a support device, wherein the display module is the same as described above. The support device is disposed on the side of a support plate opposite to the display panel.

[0039] In one possible design of the third aspect, the support device includes a first housing, a second housing, and a pivot mechanism, the pivot mechanism being disposed between the first housing and the second housing, and the support device being supported on the side of the support plate opposite to the display panel.

[0040] Since the electronic device provided in this application embodiment includes the display module of the above technical solution, the two can solve the same technical problem and achieve the same effect.

[0041] Fourthly, this application also provides a method for manufacturing a support plate, the method comprising:

[0042] A first mask layer is formed on the third surface of the support blank, and a second mask layer is formed on the fourth surface of the support blank; the third surface and the fourth surface are two surfaces of the support blank that are opposite to each other in the thickness direction; the first mask layer has a first perforation, and the second mask layer has a second perforation.

[0043] The support plate blank is etched through the first and second perforations to form a through hole that penetrates the support plate blank along the thickness direction of the support plate blank. The through hole includes a first opening and a second opening along the thickness direction of the support plate blank.

[0044] The etching time of the support plate blank through the first perforation is greater than the etching time of the support plate blank through the second perforation, so that the area of ​​the first opening is greater than the area of ​​the second opening.

[0045] Since the manufacturing method provided in this application embodiment is used to manufacture the support plate of the above technical solution, the two methods can solve the same technical problem and achieve the same effect.

[0046] Fifthly, this application also provides a method for manufacturing a support plate, the method comprising:

[0047] A first mask layer is formed on the third surface of the support blank, and a second mask layer is formed on the fourth surface of the support blank; the third surface and the fourth surface are two surfaces of the support blank that are opposite to each other in the thickness direction, the first mask layer has a first perforation, and the second mask layer covers the fourth surface;

[0048] The support plate blank is etched through the first perforation to form a through hole through the support plate blank.

[0049] Since the manufacturing method provided in this application embodiment is used to manufacture the support plate of the above technical solution, the two methods can solve the same technical problem and achieve the same effect. Attached Figure Description

[0050] Figure 1 is a perspective view of an electronic device provided in some embodiments of this application in its unfolded position;

[0051] Figure 2 is a partial exploded view of the electronic device shown in Figure 1;

[0052] Figure 3 is a schematic diagram of the electronic device shown in Figure 1 when it is in the folded position;

[0053] Figure 4 is a schematic diagram of the structure of the display module shown in Figure 3;

[0054] Figure 5 is a partial structural diagram of the support plate in the display module shown in Figure 4;

[0055] Figure 6 is a bottom view of the support plate shown in Figure 5;

[0056] Figure 7 is a schematic diagram of the etching process during the fabrication of the support plate provided in some embodiments of this application;

[0057] Figure 8 is a structural schematic diagram of the etching process during the processing of the support plate provided in some other embodiments of this application;

[0058] Figure 9 is a schematic diagram of the support plate shown in Figure 6 cut along line AA;

[0059] Figure 10 is a schematic diagram of the structure of the first sub-bend provided in some embodiments of this application;

[0060] Figure 11 is a schematic diagram of another structure of the support plate shown in Figure 10 cut along line BB;

[0061] Figure 12 is a structural schematic diagram of the first sub-bend provided in some embodiments of this application;

[0062] Figure 13 is a structural schematic diagram of the first sub-bend provided in some embodiments of this application;

[0063] Figure 14 is a structural schematic diagram of the first sub-bend provided in some embodiments of this application;

[0064] Figure 15 is a structural schematic diagram of the first sub-bend provided in some embodiments of this application;

[0065] Figure 16 is a structural schematic diagram of the first sub-bend provided in some embodiments of this application;

[0066] Figure 17 is a structural schematic diagram of a support plate provided in some embodiments of this application;

[0067] Figure 18 is a partial structural schematic diagram of the support plate provided in some embodiments of this application;

[0068] Figure 19 is a structural schematic diagram of the support plate provided in some embodiments of this application;

[0069] Figure 20 is a process diagram of a support plate manufacturing method provided in some embodiments of this application;

[0070] Figure 21 is a process diagram of a support plate manufacturing method provided in some embodiments of this application;

[0071] Figure 22 is a process diagram of a support plate manufacturing method provided in some embodiments of this application;

[0072] Figure 23 is a process diagram of a support plate manufacturing method provided in some embodiments of this application;

[0073] Figure 24 is a process diagram of a support plate manufacturing method provided in some embodiments of this application;

[0074] Figure 25 is a structural schematic diagram of the support plate provided in some embodiments of this application;

[0075] Figure 26 is a structural schematic diagram of the support plate provided in some embodiments of this application.

[0076] Reference numerals: 100, Electronic device; 10, Display module; 11, First display area; 12, Second display area; 13, Third display area; 131, First transition section; 132, Second transition section; 133, Arc section; 14, Light-transmitting cover plate; 15, Display panel; 151, Display surface; 152, Backlight surface; 16, Support plate; 16a, First surface; 16b, Second surface; 16c, First end face; 16d, Second end face; 161, First flat plate portion; 162, Second flat plate portion; 160, Bending portion; 163, First sub-bending portion; 164, Second sub-bending portion; 165, Hollow structure; 165 a. Through hole; 165a1. First opening; 165a2. Second opening; 165b. First groove; 165c. Second groove; 165d. Notch; 20. Support device; 21. First housing; 22. Second housing; 23. Rotating shaft mechanism; 24. Support blank; 24a. Third surface; 24b. Fourth surface; 241. First hole segment; 242. Second hole segment; 25. Etching solution; L1. Axis; 26. First mask layer; 261. First perforated hole; 262. Third perforated hole; 27. Second mask layer; 271. Second perforated hole; 281. First protective layer; 282. Second protective layer. Detailed Implementation

[0077] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0078] In the embodiments of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" and "second" may explicitly or implicitly include one or more of that feature.

[0079] In the description of the embodiments of this application, the term "at least one" means one or more, and "more than one" means two or more. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of a single item or a plurality of items. For example, at least one of a, b, or c can represent: a, b, c, ab, ac, bc, or abc, where a, b, and c can be a single item or multiple items.

[0080] In the description of the embodiments of this application, the term "and / or" refers to and covers any and all possible combinations of one or more of the associated listed items. The term "and / or" describes an association relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this application generally indicates that the preceding and following related objects have an "or" relationship.

[0081] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, "linking" can mean a detachable connection or a non-detachable connection; it can mean a direct connection or an indirect connection through an intermediate medium. The directional terms mentioned in the embodiments of this application, such as "inner," "outer," "upper," "lower," "left," and "right," are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0082] In the description of embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0083] This application provides an electronic device, which is a type of terminal device with a foldable screen. Specifically, the electronic device in the embodiments of this application can be user equipment (UE) or terminal equipment, such as a portable Android device (PAD), a personal digital assistant (PDA), a handheld device with wireless communication capabilities, a computing device, an in-vehicle device, a wearable device, a virtual reality (VR) terminal device, an augmented reality (AR) terminal device, a wireless terminal in industrial control, a wireless terminal in self-driving vehicles, a wireless terminal in a smart home, and other mobile or fixed terminals. The form of the electronic device is not specifically limited in the embodiments of this application.

[0084] Please refer to Figures 1 and 2. Figure 1 is a perspective view of the electronic device 100 provided in some embodiments of this application in an unfolded position, and Figure 2 is a partial exploded structural diagram of the electronic device 100 shown in Figure 1. This embodiment and the embodiments described below are exemplified by the electronic device 100 being a handheld device with wireless communication capabilities, such as a mobile phone.

[0085] The electronic device 100 is approximately rectangular flat in its unfolded position. For the convenience of the description of the embodiments below, an XYZ coordinate system is established for the electronic device 100 in its unfolded position, defining the length direction of the electronic device 100 as the X-axis direction, the width direction of the electronic device 100 as the Y-axis direction, and the thickness direction of the electronic device 100 as the Z-axis direction.

[0086] It is understood that the coordinate system of the electronic device 100 can be flexibly set according to actual needs, and no specific limitation is made here. In some other embodiments, the shape of the electronic device 100 may also be a square plate, a circular plate, an elliptical plate, etc.

[0087] The electronic device 100 includes a display module 10 and a support device 20.

[0088] Display module 10 is used to display images, videos, and other information. Display module 10 has a display area for displaying image information, and the display area of ​​display module 10 is exposed to facilitate the presentation of images, videos, and other information to the user. Display module 10 includes a first display area 11, a second display area 12, and a third display area 13, with the third display area 13 connected between the first display area 11 and the second display area 12.

[0089] In the electronic device 100 shown in Figure 1, the display module 10 is in the unfolded position, and the first display area 11, the third display area 13, and the second display area 12 are arranged sequentially along the X-axis direction, so that the electronic device 100 is folded laterally.

[0090] In some other embodiments, when the display module 10 is in the unfolded position, the first display area 11, the third display area 13, and the second display area 12 can also be arranged sequentially along the Y-axis. In this way, the electronic device 100 folds vertically. When the display module 10 is in the unfolded position, it is flat, enabling large-screen display to provide users with richer information and a better user experience.

[0091] At least the third display area 13 of the display module 10 is a flexible screen structure. Thus, the third display area 13 can bend and deform under external force, causing the display module 10 to fold from the unfolded position shown in Figure 1 to the folded position. The first display area 11 and the second display area 12 of the display module 10 can be a flexible screen structure, a rigid screen structure, or a combination of both; no specific limitation is made here.

[0092] The support device 20 is used to support the display module 10. The support device 20 includes a first housing 21, a second housing 22, and a pivot mechanism 23. The first housing 21 supports the first display area 11, and the second housing 22 supports the second display area 12. The pivot mechanism 23 is connected between the first housing 21 and the second housing 22 and supports the third display area 13.

[0093] When the electronic device 100 is in the unfolded state, the first display area 11, the second display area 12 and the third display area are located on the same plane, and the display module 10 presents a flat display surface to the user, improving the user experience.

[0094] Please refer to Figure 3, which is a structural schematic diagram of the electronic device 100 shown in Figure 1 in the folded position. The display module 10 in the electronic device 100 is also in the folded position. Specifically, when the display module 10 is in the folded position, the first display area 11 and the second display area 12 of the display module 10 are approximately parallel and opposite to each other.

[0095] It should be noted that if the angle between the first display area 11 and the second display area 12 is within 30°, the first display area 11 and the second display area 12 can be considered approximately parallel. The first display area 11 and the second display area 12 being opposite means that the display surface of the first display area 11 faces the display surface of the second display area 12.

[0096] When the electronic device 100 is in the folded position, please continue to refer to Figure 3. The support device 20 protects the display module 10 from the outside, and the display module 10 is not visible to the user. This can prevent the display module 10 from being scratched by hard objects. This electronic device is an inward folding electronic device, and the size of the electronic device 100 is reduced, making it convenient to carry.

[0097] When the display module 10 is in the folded position, please refer to Figure 3. After bending and deformation, the third display area 13 is folded into a teardrop shape. In this shape, the third display area 13 includes a first transition section 131, a second transition section 132, and an arc section 133.

[0098] The first transition segment 131 connects the arc segment 133 and the first display area 11. The second transition segment 132 connects the arc segment 133 and the second display area 12. The distance between the end of the first transition segment 131 connecting to the first display area 11 and the end of the second transition segment 132 connecting to the second display area 12 is a first distance, and the distance between the end of the first transition segment 131 connecting to the arc segment 133 and the end of the second transition segment 132 connecting to the arc segment 133 is a second distance, and the second distance is greater than the first distance.

[0099] It is understood that when the electronic device 100 is in the folded position, the third display area 13 of the display module 10 can also be folded into other shapes, such as U-shape, as needed. This application does not limit this.

[0100] Please refer to Figure 4, which is a structural schematic diagram of the display module 10 shown in Figure 3. The display module 10 includes a light-transmitting cover plate 14, a display panel 15, and a support plate 16 stacked together.

[0101] It is understood that Figure 4 schematically shows some of the film layers included in the display module 10. The size and structure of these film layers are not limited by Figure 4. In addition to these film layers, the display module 10 may also include other film layers, such as polarizers, buffer layers, shielding layers, etc., which are not specifically limited here.

[0102] The light-transmitting cover 14 serves to protect the display panel 15 from water, dust, and scratches. The material of the light-transmitting cover 14 includes, but is not limited to, plastic. In some other embodiments, the display module 10 may not have the light-transmitting cover 14.

[0103] Display panel 15 is the main component for displaying images and videos. Specifically, display panel 15 can be an organic light-emitting diode (OLED) display panel, a micro organic light-emitting diode (micro organic light-emitting diode) display panel, or a quantum dot light-emitting diode (QLED) display panel.

[0104] The display panel 15 has a display surface 151 and a backlight surface 152 opposite to the display surface 151. The display surface 151 of the display panel 15 refers to the side of the display panel 15 that displays images or videos, and the user can view the images or videos displayed on the display panel 15 through this display surface 151. A light-transmitting cover 14 is stacked on the display surface 151 of the display panel 15.

[0105] The support plate 16, also known as the "bamboo book," is located on the back side of the display panel 15. The support device 20 is located on the side of the support plate 16 away from the display panel 15, and the display module 10 is supported on the support device 20 by means of the support plate 16. In addition, the support plate 16 is usually made of metals such as stainless steel and titanium alloy. These metals have a certain degree of hardness and a large modulus of elasticity, which can improve the hardness and bending resilience of the display module 10.

[0106] Please refer to Figures 5 and 6. Figure 5 is a partial structural schematic diagram of the support plate 16 in the display module 10 shown in Figure 4; Figure 6 is a bottom view of the support plate 16 shown in Figure 5.

[0107] The support plate 16 has a first surface 16a and a second surface 16b disposed opposite to each other. The first surface 16a is stacked on the backlight surface 152 of the display panel 15. The support plate 16 includes a first flat plate portion 161, a bent portion 160, and a second flat plate portion 162 connected in sequence. The first flat plate portion 161, the bent portion 160, and the second flat plate portion 162 can be integrally formed, or they can be formed separately and welded together; this application does not specifically limit this.

[0108] In the embodiment shown in Figure 5, the first flat plate portion 161, the bent portion 160, and the second flat plate portion 162 are arranged sequentially along a first direction, which can be the X-axis direction, i.e., the bent portion 160 connects the first flat plate portion 161 and the second flat plate portion 162, so that the electronic device 100 is folded laterally. In some other embodiments, the first direction can also be the Y-axis direction, so that the electronic device 100 is folded longitudinally.

[0109] The first display area 11 of the display module 10 is supported on the first housing 21 by means of the first flat plate portion 161, the second display area 12 of the display module 10 is supported on the second housing 22 by means of the second flat plate portion 162, and the third display area 13 of the display module 10 is supported on the rotating shaft mechanism 23 by means of the bending portion 160.

[0110] The bending portion 160 includes a first sub-bending portion 163 and two second sub-bending portions 164. One second sub-bending portion 164 connects the first sub-bending portion 163 and the first flat plate portion 161, and the other second sub-bending portion 164 connects the first sub-bending portion 163 and the second flat plate portion 162. The arc segment 133 of the third display area 13 is supported on the rotating shaft mechanism 23 by means of the first sub-bending portion 163, and the first transition segment 131 and the second transition segment 132 of the third display area 13 are supported on the rotating shaft mechanism 23 by means of the second sub-bending portions 164.

[0111] Please refer to Figures 5 and 6. The bent portion 160 has a hollow structure 165 to increase its flexibility. The hollow structure 165 includes multiple through holes 165a and multiple grooves 165b.

[0112] Multiple through holes 165a are provided in the first sub-bend portion 163. The multiple through holes 165a penetrate the bend portion 160 along the Z-axis direction, that is, the multiple through holes 165a penetrate the support plate 16 along the thickness direction of the support plate 16. In the embodiment shown in Figure 6, the through holes 165a are elongated holes.

[0113] In other embodiments, the through hole 165a may also be a round hole, a rectangular hole, a square hole, etc., and this application does not limit the shape of the through hole 165a. The processing methods of the through hole 165a include, but are not limited to, chemical etching and laser cutting. This embodiment and the embodiments described below use chemical etching as an example to illustrate the processing method of the through hole 165a.

[0114] Multiple second grooves 165c are disposed in the second sub-bend portion 164, and the multiple second grooves 165c are formed by recessing from the second surface 16b toward the first surface 16a. In the embodiment shown in FIG6, the second grooves 165c are elongated, and the length direction of the second grooves 165c is parallel to the Y-axis direction. The bend portion 160 is bent relative to the axis L1, and the support plate 16 includes a first end face 16c and a second end face 16d that are opposite to each other along the axis L1 direction. In some embodiments, the two ends of the second grooves 165c along the axis L1 direction penetrate through the first end face 16c and the second end face 16d.

[0115] The processing methods for the second groove 165c include, but are not limited to, chemical etching and laser cutting. This embodiment and the embodiments described below will use chemical etching as an example to illustrate the processing method of the second groove 165c.

[0116] When the size of the cutout structure 165 is large, the support plate 16 has good bending resilience. However, the larger size of the cutout structure 165 reduces the solid portion of the support plate 16, thereby reducing the rigidity of the support plate 16 and lowering the reliability of the support plate 16 in supporting the display panel 15. When the electronic device 100 is subjected to collisions, compression, or other situations, the display module 10 is prone to failure problems such as bright spots and black spots.

[0117] When the size of the cutout structure 165 is small, the support plate 16 has high rigidity, improving the reliability of the support plate 16 in supporting the display panel 15. However, the small size of the cutout structure 165 results in poor bending resilience of the support plate 16, requiring more force to bend, which in turn affects the user's handling.

[0118] Therefore, in order to balance the rigidity and bending resilience of the support plate 16, the dimensions of the cutout structure 165 on the support plate 16 need to be kept within a reasonable range. However, due to the manufacturing limitations of the support plate 16, the actual dimensions of the cutout structure 165 deviate from the design dimensions, which in turn affects the reliability of the support plate 16 in supporting the display panel 15.

[0119] The specific process limitations of the support plate 16 are as follows, please refer to Figure 7, which is a structural schematic diagram of the etching process during the processing of the support plate 16 provided in some embodiments of this application. In some embodiments, during the processing of the support plate 16, the support plate blank 24 is etched by spraying etching solution 25 to form a hollow structure 165 on the support plate 16.

[0120] The support blank 24 includes a third surface 24a and a fourth surface 24b along its own thickness direction. The spraying etching solution 25 can adopt a spraying method that combines vertical spraying. Vertical spraying means that a part of the etching solution 25 is sprayed from the side of the third surface 24a away from the fourth surface 24b toward the third surface 24a, and a part of the etching solution 25 is sprayed from the side of the fourth surface 24b away from the third surface 24a toward the fourth surface 24b.

[0121] Please refer to Figure 8, which is a structural schematic diagram of the etching process during the processing of the support plate 16 according to other embodiments of this application. In other embodiments, during the processing of the support plate 16, the support plate blank 24 is immersed in the etching solution 25, and the etching solution 25 etches the support plate blank 24 to obtain the support plate 16.

[0122] The support plate 16 obtained by the above method has a hollow structure 165 whose actual size is larger than the design size. Please refer to Figure 9, which is a schematic diagram of the support plate 16 shown in Figure 6 cut along line AA. Taking the through hole 165a as an example, the through hole 165a includes a first opening 165a1 located on the first surface 16a and a second opening 165a2 located on the second surface 16b.

[0123] During the processing of the support plate 16, the third surface 24a and the fourth surface 24b of the support plate blank 24 are in contact with the etching solution 25 for a longer time and have a larger capacity of the etching solution 25, while the part of the support plate blank 24 located between the third surface 24a and the fourth surface 24b is in contact with the etching solution 25 for a shorter time and has a smaller capacity of the etching solution 25.

[0124] Therefore, the support plate 16 processed by the above process has a large area of ​​both the first opening 165a1 and the second opening 165a2. Taking the size of the through hole 165a along the first direction as an example, in some embodiments, the first direction is perpendicular to the thickness direction and the axis L1 direction of the support plate 16, which is the X-axis direction in Figure 9.

[0125] The dimensions W1 of the first opening and W2 of the second opening are larger than the designed dimensions. The first opening 165a1 and the second opening 165a2 are the maximum dimensions of the through hole 165a along the thickness direction of the support plate 16. The dimension W1 of the first opening is typically greater than or equal to 0.15 mm and less than or equal to 0.16 mm. The dimension W2 of the second opening is typically greater than or equal to 0.15 mm and less than or equal to 0.16 mm. The minimum dimension W3 of the through hole 165a along the thickness direction of the support plate 16 is located between the first opening 165a1 and the second opening 165a2. The minimum dimension W3 is typically greater than or equal to 0.11 mm and less than or equal to 0.13 mm.

[0126] As a result, the solid area on the first surface 16a used to support the display panel 15 becomes smaller, which means that the contact area between the support plate 16 and the display panel 15 is smaller. When the display module 10 is involved in collisions, compressions, or other situations, stress is easily concentrated on the first surface 16a when it is transferred to the support plate 16. This makes the support plate 16's support for the display panel 15 weaker and the support plate 16's support for the display panel 15 less reliable.

[0127] From another perspective, the solid portion of the support plate 16 near the display panel 15 becomes smaller, which reduces the rigidity of the support plate 16 near the display panel 15. When the display module 10 is subjected to collisions, compressions, or other situations, the stress is transferred to the support plate 16, which is prone to deformation or even breakage. The support plate 16 has poor impact resistance, and the display module 10 is prone to problems such as bright spots and black spots.

[0128] To avoid the above problems and improve the reliability of the support plate 16 in supporting the display panel 15, this application also provides a support plate 16, which is designed to increase the solid area of ​​the support plate 16 near the display panel 15, thereby increasing the rigidity of the support plate 16 and the contact area between the support plate 16 and the display panel 15, and further improving the reliability of the support plate 16 in supporting the display panel 15.

[0129] Please refer to Figures 10 and 11. Figure 10 is a structural schematic diagram of the first sub-bend 163 provided in some embodiments of this application; Figure 11 is another structural schematic diagram of the support plate 16 shown in Figure 10 cut along line BB.

[0130] The difference between this support plate 16 and the support plate 16 in the above embodiment is that the through hole 165a includes a first opening 165a1 and a second opening 165a2 located at both ends of the through hole 165a, and the area of ​​the first opening 165a1 is smaller than the area of ​​the second opening 165a2.

[0131] The first opening 165a1 is located on the first surface 16a. For example, the dimension W1 of the first opening 165a1 along the first direction is smaller than the dimension W2 of the second opening 165a2 along the first direction. The first surface 16a of the first direction parallel bending portion 160 in the unfolded state is used as an example for explanation.

[0132] In this way, the solid area on the first surface 16a is larger than the solid area on the second surface 16b, and the area of ​​the solid area on the first surface 16a used to support the display panel 15 is also larger. That is to say, the contact area between the support plate 16 and the display panel 15 is increased. When the display module 10 is subjected to collisions, compression, or other situations, the stress is transferred to the support plate 16. The support plate 16 disperses the stress with the help of the first surface 16a. Due to the increase in the solid area of ​​the first surface 16a, stress concentration problems on the support plate 16 are avoided, thereby avoiding the display module 10 display failure problem and further improving the reliability of the support plate 16 in supporting the display panel 15.

[0133] From another perspective, the reduction in the size of the first opening 165a1 increases the solid portion of the support plate 16 near the display panel 15, thereby improving the rigidity of the support plate 16 near the display panel 15. When the display module 10 is subjected to collisions, compression, or other stresses, the stress is transferred to the support plate 16. The support plate 16 has greater rigidity to resist this stress, preventing the support plate 16 from breaking under stress. This, in turn, avoids problems such as bright spots and black spots on the display panel 15, further improving the reliability of the support plate 16 in supporting the display panel 15.

[0134] Please continue to refer to Figures 10 and 11. In some embodiments, the through hole 165a is an elongated through hole 165a, and the length direction of the through hole 165a is parallel to the direction of the axis L1. In this way, during the folding and unfolding process of the electronic device 100, the support plate 16 can distribute stress more evenly, reduce local stress concentration in the support plate 16, and thus reduce fatigue damage to the support plate 16 caused by repeated folding.

[0135] The first plane is parallel to the first surface 16a of the bent portion 160 in its unfolded state, and the first direction can be any direction within the first plane. Based on this, in some embodiments, the first direction can be parallel to the axis L1, that is, the first direction is parallel to the length direction of the through hole 165a.

[0136] In some other embodiments, the first direction may also be perpendicular to the axis L1, that is, the first direction is parallel to the width direction of the through hole 165a, i.e., the X-axis direction in Figures 10 and 11. This embodiment and the following embodiments will be described using the direction in which the first direction is also perpendicular to the axis L1 as an example.

[0137] When the support plate 16 is bent, the degree of bending deformation along the width direction of the through hole 165a on the side of the support plate 16 closer to the display panel 15 is less than the degree of bending deformation on the side of the support plate 16 away from the display panel 15. The bending resilience of the support plate 16 can be adjusted according to the degree of bending deformation of different parts of it. Specifically, the parts of the support plate 16 with smaller bending deformation can be set with lower bending resilience, and the parts of the support plate 16 with larger bending deformation can be set with higher bending resilience.

[0138] For example, if the first direction is perpendicular to axis L1, then the dimension of the first opening 165a1 along the first direction is smaller than the dimension of the second opening 165a2 along the first direction. The flexural resilience of the portion of the support plate 16 near the first opening 165a1 is less than the flexural resilience of the portion of the support plate 16 near the second opening 165a2. Furthermore, the stiffness of the portion of the support plate 16 near the first opening 165a1 is greater than the stiffness of the portion of the support plate 16 near the second opening 165a2.

[0139] Furthermore, different parts of the support plate 16 have different bending resilience and stiffness to accommodate the bending deformation of the support plate 16 during the folding and unfolding process. Specifically, the side of the support plate 16 closest to the display panel 15 has higher stiffness and lower bending resilience. The high stiffness of the support plate 16 can provide sufficient support for the display panel 15, thereby improving the reliability of the support plate 16 in supporting the display panel 15. The lower bending resilience of the support plate 16 can still meet the bending deformation requirements of the side of the support plate 16 closest to the display panel 15.

[0140] The side of the support plate 16 closest to the support device 20 has high bending resilience and low stiffness, resulting in greater bending deformation. The high bending resilience of the support plate 16 can accommodate this bending deformation. Since the second surface 16b of the support plate 16 is supported by the support device 20, the stiffness of the side of the support plate 16 closest to the support device 20 can be lower, allowing the support plate 16 to provide sufficient support to the display panel 15 with the aid of the support device 20.

[0141] The specific form of the hollow structure 165 will be described in detail below.

[0142] Please continue referring to Figure 11. In some embodiments, a through hole 165a penetrates the first surface 16a and the second surface 16b, and a second opening 165a2 is located on the second surface 16b. In this way, multiple through holes 165a penetrate the support plate 16 to form the bamboo book area of ​​the support plate 16. The support plate 16 has a simple structure and is easy to process.

[0143] In some embodiments, the through hole 165a is located between the first opening 165a1 and the second opening 165a2 at its minimum cross-sectional area along the thickness direction perpendicular to the support plate 16. For example, the minimum dimension W3 of the through hole 165a along the first direction is located between the first opening 165a1 and the second opening 165a2.

[0144] In this way, the through hole 165a can be processed by spraying etching solution 25 from both the top and bottom. The duration of the upper spraying etching solution 25 is shorter than that of the lower spraying etching solution 25, or the amount of upper spraying etching solution 25 is less than that of lower spraying etching solution 25. This ensures that the area of ​​the first opening 165a1 is smaller than the area 165a2 of the second opening 165a2. Alternatively, this can be understood as the dimension W1 of the first opening 165a1 along the first direction being smaller than the dimension W2 of the second opening 165a2 along the first direction. Under the action of the upper and lower spraying etching solution 25, the through hole 165a is formed quickly, which helps improve the processing efficiency of the support plate 16.

[0145] Furthermore, in the thickness direction of the support plate 16, the distance between the through hole 165a at its minimum cross-sectional area perpendicular to the thickness direction of the support plate 16 and the first opening 165a1 is a first distance L2. The distance between the through hole 165a at its minimum cross-sectional area perpendicular to the thickness direction of the support plate 16 and the second opening 165a2 is a second distance L3, and the first distance L2 is less than the second distance L3.

[0146] For example, the distance L2 between the minimum dimension of the through hole 165a along the first direction and the first opening 165a1 is less than the distance L3 between the minimum dimension of the through hole 165a along the first direction and the second opening 165a2.

[0147] In this way, during the processing of the support plate 16, the third surface 24a of the support plate blank 24 can contact the etching solution 25 for a shorter time and the amount of etching solution 25 in contact is also less, so as to obtain a smaller first opening 165a1, thereby improving the rigidity of the support plate 16 on the side close to the display panel 15.

[0148] In this way, when the display panel 15 is subjected to external pressure or impact, the display panel 15 transfers the stress to the support plate 16. The portion of the support plate 16 closest to the display panel 15 has greater rigidity, providing sufficient support for the display panel 15 and preventing deformation, thus maintaining its original state and improving the reliability of the support plate 16 in supporting the display panel 15. Furthermore, the portion of the support plate 16 away from the display panel 15 has higher bending resilience to accommodate bending deformation.

[0149] The second plane is parallel to the thickness direction of the support plate 16. After the support plate 16 is cut along the second plane, the cross-sectional shape of the through hole 165a can be an arc, a straight line, a curve, etc. The structure of the through hole 165a can be flexibly selected according to different application scenarios, which can better meet the needs of specific application scenarios and achieve a balance between functionality and economy.

[0150] Please continue to refer to Figure 11. In some embodiments, from the minimum cross-sectional area of ​​the through hole 165a along the thickness direction perpendicular to the support plate 16 to both ends of the through hole 165a, the cross-sectional area of ​​the through hole 165a along the thickness direction perpendicular to the support plate 16 gradually increases.

[0151] For example, along the thickness direction of the support plate 16, from the first opening 165a1 to the minimum dimension of the through hole 165a along the first direction, the dimension of the through hole 165a gradually decreases along the first direction. For example, the dimension of the through hole 165a along the first direction can gradually decrease in an arc. From the minimum dimension of the through hole 165a to the second opening 165a2, the dimension of the through hole 165a gradually increases along the first direction. For example, the dimension of the through hole 165a along the first direction can gradually increase in an arc.

[0152] In this way, the through-hole 165a can be processed by spraying the etching solution 25 from both above and below. Under the action of spraying the etching solution 25 from both above and below, the through-hole 165a is formed faster, which helps to improve the processing efficiency of the support plate 16. Furthermore, the type of etching solution 25 and the spraying direction of the etching solution 25 in the etching process determine the shape of the inner wall of the through-hole 165a. The above-mentioned structure of the through-hole 165a is easy to process using conventional etching solution 25 types and spraying directions, which helps to reduce the processing difficulty of the support plate 16.

[0153] Please refer to Figure 12, which is a structural schematic diagram of the first sub-bend 163 provided in some embodiments of this application. In other embodiments, from the first opening 165a1 to the minimum size of the through hole 165a along the first direction, the size of the through hole 165a along the first direction can gradually decrease linearly. From the minimum size of the through hole 165a to the second opening 165a2, the size of the through hole 165a along the first direction can gradually increase linearly.

[0154] Please refer to Figure 13, which is a structural schematic diagram of the first sub-bend 163 provided in some embodiments of this application. In other embodiments, the size of the through hole 165a along the first direction can gradually decrease in a curved manner from the first opening 165a1 to the minimum size of the through hole 165a along the first direction. From the minimum size of the through hole 165a to the second opening 165a2, the size of the through hole 165a along the first direction can gradually increase in a curved manner.

[0155] In other embodiments, the size of the through hole 165a along the first direction can gradually decrease in a stepped manner from the first opening 165a1 to the minimum size of the through hole 165a along the first direction. The size of the through hole 165a along the first direction can gradually increase in a stepped manner from the minimum size of the through hole 165a to the second opening 165a2.

[0156] In this way, the inner wall of the through hole 165a can have a variety of shapes, and different shapes of the inner wall of the through hole 165a can be selected for processing according to different application scenarios. This is beneficial to improving the flexibility of the processing method of the support plate 16 and reducing the difficulty of processing the support plate 16.

[0157] The above embodiment is described using the example of the minimum cross-sectional area of ​​the through hole 165a along the thickness direction perpendicular to the support plate 16, located between the first opening 165a1 and the second opening 165a2. The following is a detailed description of the minimum cross-sectional area of ​​the through hole 165a along the thickness direction perpendicular to the support plate 16, located at the first opening 165a1.

[0158] Please refer to Figure 14, which is a structural schematic diagram of the first sub-bend 163 provided in some embodiments of this application. In the direction from the first opening 165a to the second opening 165b, the cross-sectional area of ​​the through hole 165a gradually increases along the thickness direction perpendicular to the support plate 16.

[0159] For example, along the thickness direction of the support plate 16, from the first opening 165a1 to the second opening 165a2, the size of the through hole 165a gradually increases along the first direction. For instance, the size of the through hole 165a along the first direction can gradually increase in an arc. In this way, the structure of the through hole 165a is simple and easy to process.

[0160] Please refer to Figure 15, which is a structural schematic diagram of the first sub-bend 163 provided in some embodiments of this application. In other embodiments, along the thickness direction of the support plate 16, from the first opening 165a1 to the second opening 165a2, the size of the through hole 165a can also gradually increase linearly along the first direction.

[0161] Please refer to Figure 16, which is a structural schematic diagram of the first sub-bend 163 provided in some embodiments of this application. In other embodiments, along the thickness direction of the support plate 16, from the first opening 165a1 to the second opening 165a2, the size of the through hole 165a along the first direction may also gradually increase in a curved manner.

[0162] In this way, the inner wall of the through hole 165a can have a variety of shapes, and different shapes of the inner wall of the through hole 165a can be selected for processing according to different application scenarios. This is beneficial to improving the flexibility of the processing method of the support plate 16 and reducing the difficulty of processing the support plate 16.

[0163] The dimensions of the through hole 165a in the above embodiment will be explained in detail below.

[0164] When the dimension of the through hole 165a along the first direction is too large, the solid portion of the support plate 16 is too small, the rigidity of the support plate 16 is low, which in turn affects the structural strength of the support plate 16 and reduces the reliability of the support plate 16 in supporting the display panel 15. Therefore, in some embodiments, the dimension of the first opening 165a1 along the first direction is less than or equal to the thickness of the support plate 16.

[0165] In this way, the solid part of the support plate 16 has a larger volume ratio and greater rigidity, so as to meet the structural strength requirements of the support plate 16 in supporting the display panel 15, thereby improving the reliability of the support plate 16 in supporting the display panel 15.

[0166] However, due to limitations in the manufacturing process of the support plate 16, the through hole 165a on the support plate 16 cannot be made too small. Furthermore, in order to ensure the bending resilience of the support plate 16 and the heat dissipation performance of the display panel 15, the difference between the dimension of the first opening 165a1 along the first direction and the thickness of the support plate 16 has a lower limit. In some embodiments, the difference between the dimension of the first opening 165a1 along the first direction and the thickness of the support plate 16 is less than or equal to 0.04 mm. For example, the thickness of the support plate 16 minus the dimension of the first opening 165a1 along the first direction is 0.04 mm, 0.03 mm, 0.02 mm, 0.01 mm, etc.

[0167] In this way, the size of the through hole 165a is not much smaller than the thickness of the support plate 16. Under the premise that the support plate 16 meets the rigidity requirements, it can also ensure that the support plate 16 has better bending resilience and heat dissipation performance, thereby improving the user's hand feel when using the electronic device 100.

[0168] In some embodiments, the difference between the maximum dimension of the first opening 165a1 along the first direction and the maximum dimension of the second opening 165a2 along the first direction is greater than or equal to 0.03 mm and less than or equal to 0.16 mm. For example, the difference between the maximum dimension of the second opening 165a2 along the first direction and the maximum dimension of the first opening 165a1 along the first direction is 0.03 mm, 0.04 mm, 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, 0.1 mm, 0.12 mm, 0.14 mm, 0.16 mm, etc.

[0169] The difference between the maximum dimension of the first opening 165a1 along the first direction and the maximum dimension of the second opening 165a2 along the first direction has a lower limit of 0.03 mm, so that different parts of the support plate 16 have different bending resilience and stiffness. Under the premise of satisfying the bending resilience of the support plate 16, the stiffness of the support plate 16 is improved, thereby improving the reliability of the support plate 16 in supporting the display panel 15.

[0170] The difference between the maximum dimension of the first opening 165a1 along the first direction and the maximum dimension of the second opening 165a2 along the first direction has an upper limit of 0.16 mm. In this way, the size difference between different segments of the through hole 165a is small, reducing the processing difficulty of the through hole 165a.

[0171] The following examples illustrate the dimensions of the through holes 165a in support plates 16 of different thicknesses, where t is the thickness of the support plate 16, W1 is the dimension of the first opening 165a1 along the first direction, W2 is the dimension of the second opening 165a2 along the first direction, and W3 is the minimum dimension of the through hole 165a along the first direction.

[0172] Table 1. Thickness of support plate and size of through holes

[0173] Please refer to Figure 17, which is a schematic diagram of the structure of the support plate 16 provided in some embodiments of this application. The above embodiments are illustrated using the example of the first sub-bending portion 163 including only through holes 165a. In other embodiments, the bending portion 160 also has a first groove 165b, which is formed by the second surface 16b recessed towards the first surface 16a. In the thickness direction of the support plate 16, multiple through holes 165a are located within the range of the first groove 165b, and the second opening 165a2 penetrates the bottom wall of the first groove 165b. It can be understood that the portion of the support plate 16 where the through holes 165a are provided is thinned by a certain thickness, which is the depth of the first groove 165b along the direction of the support plate 16.

[0174] Please refer to Figure 18, which is a partial structural schematic diagram of the support plate 16 provided in some embodiments of this application. Based on any of the above embodiments, in the thickness direction of the support plate 16, a plurality of through holes 165a are located within the range of the first groove 165b, and the second opening 165a2 penetrates the bottom wall of the first groove 165b.

[0175] In this way, the second opening 165a2 of the through hole 165a is located between the first surface 16a and the second surface 16b. In the thickness direction of the support plate 16, the depth of the through hole 165a along the thickness direction of the support plate 16 is reduced, which helps to improve the processing efficiency of the through hole 165a. Furthermore, the reduced depth of the through hole 165a allows for the processing of smaller first openings 165a1 and 165a2, thereby ensuring the rigidity of the support plate 16 on the side close to the display panel 15, and thus improving the reliability of the support plate 16 in supporting the display panel 15.

[0176] Furthermore, a first groove 165b is provided on the side of the support plate 16 facing away from the display panel 15. The first groove 165b can improve the bending resilience of the side of the support plate 16 facing away from the display panel 15, so as to match the deformation when the side of the support plate 16 facing away from the display panel 15 is bent, thereby improving the user's feel when using the electronic device 100.

[0177] As the length of the through hole 165a along the thickness direction of the support plate 16 is reduced, the time for spraying the etching solution 25 on the area of ​​the through hole 165a is shortened during the processing of the support plate 16, thus avoiding the problem that the size of the first opening 165a1 and the second opening 165a2 has a large error compared with the design size, thereby improving the processing accuracy of the through hole 165a.

[0178] Based on the above embodiment, the dimension W1 of the first opening 165a1 along the first direction is less than or equal to the length L4 of the through hole 165a along the thickness direction of the support plate 16. The length L4 of the through hole 165a along the thickness direction of the support plate 16 is the thickness of the support plate 16 minus the depth of the first groove 165b along the thickness direction of the support plate 16.

[0179] In this way, the volume of the solid part of the support plate 16 can be guaranteed to meet the rigidity requirements of the support plate 16, thereby meeting the structural strength requirements of the support plate 16 supporting the display panel 15, and further improving the reliability of the support plate 16 supporting the display panel 15.

[0180] However, due to limitations in the manufacturing process of the support plate 16, the through hole 165a on the support plate 16 cannot be made too small. Furthermore, to ensure the bending resilience of the support plate 16 and the heat dissipation performance of the display panel 15, in some embodiments, the difference between the dimension W1 of the first opening 165a1 along the first direction and the length L4 of the through hole 165a along the thickness direction of the support plate 16 is less than or equal to 0.04 mm. For example, the difference between the length L4 of the through hole 165a along the thickness direction of the support plate 16 and the dimension W1 of the first opening 165a1 along the first direction is 0.04 mm, 0.03 mm, 0.02 mm, 0.01 mm, etc.

[0181] In this way, the dimension W1 of the first opening 165a1 along the first direction is not much smaller than the depth L4 of the through hole 165a along the thickness direction of the support plate 16. Under the premise that the support plate 16 meets the rigidity requirements, it can also ensure that the support plate 16 has better bending resilience and heat dissipation performance, thereby improving the user's feel when using the electronic device 100.

[0182] In this embodiment, similarly, the difference between the dimension W1 of the first opening 165a1 along the first direction and the dimension W2 of the second opening 165a2 along the first direction is greater than or equal to 0.03 mm and less than or equal to 0.16 mm. For example, the difference between the dimension W2 of the second opening 165a2 along the first direction and the dimension W1 of the first opening 165a1 along the first direction is 0.03 mm, 0.04 mm, 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, 0.1 mm, 0.12 mm, 0.14 mm, 0.16 mm, etc.

[0183] The difference between the dimension of the first opening 165a1 along the first direction and the dimension of the second opening 165a2 along the first direction has a lower limit of 0.03 mm, so that different parts of the support plate 16 have different bending resilience and stiffness. Under the premise of satisfying the bending resilience of the support plate 16, the stiffness of the support plate 16 is improved, thereby improving the reliability of the support plate 16 in supporting the display panel 15.

[0184] The difference between the dimension of the first opening 165a1 along the first direction and the dimension of the second opening 165a2 along the first direction has an upper limit of 0.16 mm. In this way, the dimensions of different segments of the through hole 165a are relatively small, reducing the processing difficulty of the through hole 165a.

[0185] In some embodiments, in the thickness direction of the support plate 16, the ratio of the depth t1 of the first groove 165b to the thickness t of the support plate 16 is greater than or equal to 0.1 and less than or equal to 0.4. For example, the ratio of the depth t1 of the first groove 165b to the thickness t of the support plate 16 is 0.1, 0.2, 0.3, 0.4, etc.

[0186] The ratio of the depth of the first groove 165b to the thickness of the support plate 16 has a lower limit of 0.1, so as to ensure that the depth of the first groove 165b can improve the bending resilience of the support plate 16 on the side facing away from the display panel 15, thereby improving the user's tactile experience.

[0187] The ratio of the depth of the first groove 165b to the thickness of the support plate 16 has an upper limit of 0.4, so as to ensure the structural strength of the support plate 16 in supporting the display panel 15, thereby improving the reliability and stability of the support plate 16 in supporting the display panel 15.

[0188] The following explanation uses the example of a depth t1 of 0.02 in the first groove 165b to illustrate the dimensions of the through hole 165a in the support plate 16 of different thicknesses. Here, t is the thickness of the support plate 16, t1 is the depth of the first groove 165b along the thickness direction of the support plate 16, W1 is the dimension of the first opening 165a1 along the first direction, W2 is the dimension of the second opening 165a2 along the first direction, and W3 is the minimum dimension of the through hole 165a along the first direction.

[0189] Table 2. Thickness of Support Plate and Dimensions of Through Holes

[0190] The support plate of the above embodiment was subjected to actual tests and simulations of drop ball and tip failure. The drop ball test is an experimental method used to evaluate the impact resistance of materials or products. The drop ball test can evaluate the fracture strength of materials when subjected to sudden impact, and test the durability of products that may be subjected to drop impacts during transportation or use.

[0191] The drop ball test comprises a drop ball tester, a steel ball, and measuring instruments. The drop ball tester includes a support at a certain height and a device for fixing the sample. Steel balls typically come in different weights to provide varying impact energy. The measuring instruments are used to measure the diameter and weight of the ball, ensuring the accuracy of the test.

[0192] The Sharp Edge Failure Test (SFT) is a test method used to evaluate the durability or failure of materials or products when subjected to impact from sharp objects. The SFT assesses a product's protective capability against sharp objects and determines the maximum sharp impact force a material can withstand under specific conditions. It examines the risk of damage from sharp objects to products during transportation, storage, or use.

[0193] Tip failure testing comprises a tip failure tester, a force testing device, and a sample holding device. The tip failure tester typically includes a tip device that applies a force to penetrate the sample. The force measuring device measures the force required for the tip to penetrate the sample. The sample holding device ensures the sample remains fixed during the test.

[0194] Tables 3 and 4 are data tables for the drop ball test and the tip failure test. In the drop ball test and the tip failure test, the drop ball and the tip were dropped from above the first surface and from above the second surface, respectively, and the data were measured to show the height and stress of the module failure.

[0195] Table 3. Measured results for different through-hole sizes.

[0196] Table 4 Simulation results for different through-hole sizes

[0197] The display module 10 with a first opening 165a1 having a dimension along the first direction greater than or equal to 0.08 mm and less than or equal to 0.12 mm is the display module 10 provided in this application embodiment. The display module 10 with a first opening 165a2 having a dimension along the first direction greater than or equal to 0.15 mm and less than or equal to 0.15 mm is a display module 10 in related technologies, used for comparison with the display module 10 provided in this application embodiment.

[0198] As can be seen from the measured and simulated data in Tables 3 and 4 above, based on the through-hole structure 165a of the support plate 16 provided in this application embodiment, the display module 10 provided in this application embodiment has a higher failure height and greater failure stress in the actual and simulated drop ball test and tip failure test. In other words, the support plate 16 provided in this application embodiment has greater rigidity, and the support plate 16 can provide more reliable and stable support for the display panel 15.

[0199] When the electronic device 100 is bent, the degree of bending deformation varies at different positions of the display module 10. For example, when the display module 10 is bent, the arc segment 133 of the display module 10 has a larger degree of bending deformation, while the first transition segment 131 and the second transition segment 132 of the display module 10 have a smaller degree of bending deformation.

[0200] Furthermore, when the electronic device 100 is in a folded state, since the display module 10 is in a teardrop shape, the bending deformation directions of the first transition segment 131 and the arc segment 133 are different. The first transition segment 131 bends towards the display panel 15, while the arc segment 133 bends away from the display panel 15. Similarly, the bending deformation directions of the second transition segment 132 and the arc segment 133 are different; the second transition segment 132 bends towards the display panel 15.

[0201] Please refer to Figure 19, which is a structural schematic diagram of the support plate 16 provided in some embodiments of this application. Therefore, in order to accommodate the degree of bending deformation in different areas of the display module 10, in some embodiments, the bending portion 160 of the support plate 16 further includes two second sub-bending portions 164. Along a first direction, the two second sub-bending portions 164 are symmetrically arranged on both sides of the first sub-bending portion. The first direction is perpendicular to both the thickness direction of the support plate 16 and the direction of the axis L1. The second sub-bending portion 164 includes a plurality of second grooves 165c. The second grooves 165c are formed by recessing from the second surface 16b toward the first surface 16a, and the length direction of the second grooves 165c is parallel to the axis L1.

[0202] The first sub-bend 163 is opposite to the arc segment 133 of the display module 10. One second sub-bend 164 is opposite to the first transition segment 131 of the display module 10, and the other second sub-bend 164 is opposite to the second transition segment 132 of the display module 10. The stiffness of the second sub-bend 164 is greater than that of the first sub-bend 163, that is, the structural strength of the second sub-bend 164 is greater than that of the first sub-bend 163.

[0203] In this way, when the support plate 16 is bent, the first sub-bending portion 163, which has a larger degree of bending deformation, has higher bending resilience, while the second sub-bending portion 164, which has a smaller degree of bending deformation, has higher rigidity, thereby improving the reliability and stability of the support plate 16 in supporting the display panel 15. The support plate 16 is divided into different bending portions 160 to accommodate different degrees of deformation when the display module 10 is bent.

[0204] Furthermore, when the support plate 16 is bent, it first transitions from the flat plate portion with greater support strength to the second sub-bending portion 164 with greater support strength, and then further transitions to the first sub-bending portion 163 with lower support strength. This is to avoid the support strength of the flat plate portion and the bending portion 160 being too different, which could cause the flat plate portion and the bending portion 160 to break at the joint, thus improving the overall support strength of the support plate 16.

[0205] Referring to Figure 19, the bent portion 160 includes a first end face 16c and a second end face 16d facing away from each other in the direction of axis L1, and a second groove 165c penetrates at least one of the first end face 16c and the second end face 16d. In some embodiments, the second groove 165c penetrates only the first end face 16c; in other embodiments, the second groove 165c penetrates only the second end face 16d; in still other embodiments, the second groove 165c penetrates both the first end face 16c and the second end face 16d.

[0206] In this way, the length of the second groove 165c can be maximized, thereby improving the bending resilience of the second sub-bend 164 and enhancing the user's handling experience.

[0207] However, during the processing of the support plate 16, due to process limitations, the end of the second groove 165c is prone to incomplete etching. That is, the two ends of the second groove 165c cannot penetrate the first end face 16c and the second end face 16d, resulting in excess material at the end of the second groove 165c, which in turn affects the processing accuracy of the support plate 16.

[0208] Please refer to Figure 19. In order to solve this problem, in some embodiments, the bending portion 160 further includes at least one notch 165d. The notch 165d may be provided on at least one of the first end face 16c and the second end face 16d. The notch 165d penetrates the first surface 16a and the second surface 16b and communicates with the end of the second groove 165c.

[0209] When there is one notch 165d, the notch 165d can be set on the first end face 16c or the second end face 16d. When there are two notches 165d, one notch 165d is set on the first end face 16c and the other notch 165d is set on the second end face 16d.

[0210] The following explanation uses two instances of the 165d gap as an example.

[0211] One notch 165d is formed by a recess from the first end face 16c toward the second end face 16d, and the other notch 165d is formed by a recess from the second end face 16d toward the first end face 16c. The notches 165d penetrate both the first surface 16a and the second surface 16b. The two ends of the second groove 165c along the axis L1 are connected to the notches 165d. The notches 165d can be processed by punching, CNC machining, laser cutting, or other techniques.

[0212] In this way, the support plate 16 can overcome the limitations of the etching process and avoid the problem of excess material forming at the end of the second groove 165c, thereby improving the processing accuracy of the second groove 165c, and thus improving the bending resilience performance of the support plate 16 at the second groove 165c, and improving the user's feel when using the electronic device 100.

[0213] In some embodiments, the depth L5 of the notch 165d in the direction of axis L1 is greater than or equal to 0.05 mm and less than or equal to 0.3 mm. For example, the depth L5 of the notch 165d in the direction of axis L1 is 0.05 mm, 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, etc.

[0214] The depth of the notch 165d has a lower limit of 0.05 mm, which can remove most of the excess material located on the end face of the second groove 165c, thereby improving the machining accuracy of the second groove 165c. The depth of the notch 165d has an upper limit of 0.3 mm, which can ensure the volume of the solid part of the support plate 16, thereby ensuring the rigidity of the support plate 16, and improving the reliability and stability of the support plate 16 in supporting the display panel 15.

[0215] The manufacturing method of support plate 16 will be described in detail below.

[0216] In order to process the area of ​​the first opening 165a1 of the support plate 16 to be smaller than the area of ​​the second opening 165a2, the etching time on both sides during the etching process of the support plate blank 24 is adjusted to obtain the area of ​​the first opening 165a1 to be smaller than the area of ​​the second opening 165a2.

[0217] A first mask layer 26 is formed on the third surface 24a of the support blank 24, and a second mask layer 27 is formed on the fourth surface 24b of the support blank 24. The third surface 24a and the fourth surface 24b are two surfaces of the support blank 24 that are opposite to each other in the thickness direction. The first mask layer 26 has a first perforation 261, and the second mask layer 27 has a second perforation 271.

[0218] The support plate blank 24 is etched through the first perforation 261 and the second perforation 271 to form a through hole 165a penetrating the support plate blank 24 along its thickness direction. The through hole 165a includes a first opening 165a1 and a second opening 165a2 along the thickness direction of the support plate blank 24. The etching time through the first perforation 261 is longer than the etching time through the second perforation 271, so that the area of ​​the first opening 165a1 is larger than the area of ​​the second opening 165a2. The method for manufacturing the support plate 16 can control the etching time through the following specific embodiments.

[0219] Example 1 of the manufacturing method of support plate 16

[0220] Please refer to Figure 20, which is a process diagram of the manufacturing method of the support plate 16 provided in some embodiments of this application. A support plate blank 24 is provided, a first mask layer 26 is formed on the third surface 24a of the support plate blank 24, and a second mask layer 27 is formed on the fourth surface 24b of the support plate blank 24. The third surface 24a and the fourth surface 24b are two surfaces of the support plate blank 24 that are opposite to each other in the thickness direction.

[0221] A mask layer is a material layer used during the etching process to protect specific areas from chemical or physical etching. The mask layer is a thin film resistant to etchants. During the etching process, the areas of the support blank 24 exposed to the mask layer are etched away, while the portions of the support blank 24 covered by the mask layer remain unchanged.

[0222] The first mask layer 26 and the second mask layer 27 can be dry film masks, liquid photoresists, screen-printed masks, rigid masks, etc. In this embodiment, the first mask layer 26 and the second mask layer 27 are liquid photoresists as an example. The liquid photoresist can be a liquid photosensitive material, which is coated on the third surface 24a and the fourth surface 24b by screen printing or coating.

[0223] The support blank 24 undergoes an initial development and exposure process. Specifically, the first mask layer 26 has a first perforation 261 that exposes the area in the third surface 24a where the through-hole 165a is to be formed, and the second mask layer 27 covers the fourth surface 24b. In subsequent etching processes, the portion of the support blank 24 covered by the mask layers will not be etched, while the portion of the support blank 24 exposed to the first perforation 261 can be etched away.

[0224] The support plate blank 24 is subjected to an initial etching process. Specifically, the support plate blank 24 is etched through the first perforation 261 to form a first hole segment 241. The first hole segment 241 extends from the third surface 24a to the fourth surface 24b, and the first hole segment 241 forms part of the through hole 165a on the support plate 16.

[0225] The support blank 24 is subjected to a second development and exposure process. Specifically, a second hollow hole 271 is formed in the second mask layer 27 to expose the area of ​​the through hole 165a to be formed in the fourth surface 24b. The part of the support blank 24 exposed to the second hollow hole 271 can be etched away.

[0226] The support plate blank 24 is etched again. Specifically, the support plate blank 24 is etched through the second hollow hole 271 to form the second hole segment 242; and the second hole segment 242 is etched through the second hollow hole 271 to make the first hole segment 241 and the second hole segment 242 connect to form a through hole 165a.

[0227] In some embodiments, the process of re-etching the support plate blank 24 may involve etching the support plate blank 24 only through the second perforation 271. In other embodiments, the process of re-etching the support plate blank 24 may involve etching the support plate blank 24 simultaneously through both the first perforation 261 and the second perforation 271.

[0228] After the above etching process, the depth of the first hole segment 241 along the thickness direction of the support plate blank 24 is less than the depth of the second hole segment 242 along the thickness direction of the support plate blank 24, so as to ensure that the size of the first opening 165a1 forming the through hole 165a along the first direction is less than the size of the second opening 165a2 along the first direction.

[0229] Through the above-described method for manufacturing the support plate 16, the through hole 165a on the support plate 16 is processed in two steps, which facilitates the control of the dimensions of the first opening 165a1 and the second opening 165a2 along the first direction of the through hole 165a, so as to obtain a support plate 16 that meets the requirements of stiffness and bending resilience, thereby improving the reliability and stability of the support plate 16 in supporting the display panel 15.

[0230] Example 2 of the method for manufacturing support plate 16

[0231] Please refer to Figure 21, which is a process diagram of a method for manufacturing a support plate 16 according to some embodiments of this application. Based on the above embodiments, in forming a first perforated hole 261 exposed in the region of the through hole 165a to be formed in the first mask layer 26, the method for manufacturing the support plate 16 further includes forming a third perforated hole 262 exposed in the region of the second groove 165c to be formed in the third surface 24a in the first mask layer 26, and providing a first protective layer 281 to cover the third perforated hole 262. During the etching process, the first protective layer 281 can be used to protect the material layer of the region of the third perforated hole 262 from the effects of chemical or physical etching.

[0232] In the initial etching process of the support plate blank 24, the etching of the first hollow hole 261 is divided into two steps. First, the support plate blank 24 is etched through the first hollow hole 261 to form a part of the first hole segment 241. Second, the first protective layer 281 covering the third hollow hole 262 is removed, and the support plate blank 24 is simultaneously etched through the first hollow hole 261 and the third hollow hole 262 to form the first hole segment 241 and the second groove 165c.

[0233] Example 3 of the method for manufacturing support plate 16

[0234] Please refer to Figure 22, which is a process diagram of a method for manufacturing a support plate 16 according to some embodiments of this application. The difference between this embodiment and the above embodiment is that the initial development and exposure processing of the support plate blank 24 and the redevelopment and exposure processing are performed in the same step. Specifically, in the above-mentioned initial development and exposure processing of the support plate blank 24, the first mask layer 26 and the second mask layer 27 can be processed simultaneously to form a first perforation 261 on the first mask layer 26 and a second perforation 271 on the second mask layer 27.

[0235] Furthermore, between the development and exposure process and the initial etching process, the method of fabricating the support plate 16 also includes covering the surface of the second mask layer 27 with a second protective layer 282. The second protective layer 282 can be used to protect the material layer of the first perforated hole 261 area from chemical or physical etching, so as to avoid simultaneous etching of the second hole segment 242 during the etching process of the first hole segment 241.

[0236] The difference between this embodiment and the above embodiment is that, after etching the support plate blank 24 through the first hollow hole 261 and the third hollow hole 262, and before etching the support plate blank 24 through the second hollow hole 271, the second protective layer 282 covering the second hollow hole 271 is removed so that the etching liquid 25 can etch the support plate blank 24 through the second hollow hole 271.

[0237] In this way, the development and exposure processing of the support plate blank 24 is set in the same step, which can avoid the processing of the support plate blank 24 switching back and forth between multiple processes, thereby improving the processing efficiency of the support plate 16.

[0238] The support plate 16 is obtained through the manufacturing methods of the above three embodiments. The dimension of the first opening 165a1 along the first direction on the support plate 16 is smaller than the dimension of the second opening 165a2 along the first direction. As a result, the solid area on the first surface 16a of the support plate 16 is larger than the solid area on the second surface 16b, and the area of ​​the solid area on the first surface 16a used to support the display panel 15 is also larger. In other words, the contact area between the support plate 16 and the display panel 15 is increased, thereby improving the reliability of the support plate 16 in supporting the display panel 15.

[0239] Furthermore, the reduction in the size of the first opening 165a1 increases the solid portion of the support plate 16 near the display panel 15, thereby improving the rigidity of the support plate 16 near the display panel 15. When the display module 10 is subjected to collisions, compressions, or other stresses, the support plate 16 has greater rigidity to resist these stresses, preventing breakage and thus avoiding bright spots and black spots on the display panel 15. This further improves the reliability of the support plate 16 in supporting the display panel 15.

[0240] Example 4 of the method for manufacturing support plate 16

[0241] Please refer to Figure 23, which is a process diagram of the manufacturing method of the support plate 16 provided in some embodiments of this application. A first mask layer 26 is formed on the third surface 24a of the support plate blank 24, and a second mask layer 27 is formed on the fourth surface 24b of the support plate blank 24; the third surface 24a and the fourth surface 24b are two surfaces of the support plate blank 24 that are opposite to each other in the thickness direction; the first mask layer 26 has a first perforation 261 that exposes the area of ​​the through hole 165a to be formed in the third surface 24a; the second mask layer 27 covers the fourth surface 24b.

[0242] The support plate blank 24 is etched through the first perforation 261 to form a through hole 165a through the support plate blank 24.

[0243] By using the above-described method for manufacturing the support plate 16, the through hole 165a on the support plate 16 is formed by etching on one side to obtain a first opening 165a1 and a second opening 165a2 with different sizes at both ends of the through hole 165a. Furthermore, the first opening 165a1 is located at the minimum size of the through hole 165a along the first direction, thereby obtaining a support plate 16 that meets the requirements for stiffness and bending resilience, and improving the reliability and stability of the support plate 16 in supporting the display panel 15.

[0244] Please refer to Figure 24, which is a process diagram of a method for manufacturing a support plate 16 according to some embodiments of this application. In some embodiments, in forming a first perforated hole 261 in the first mask layer 26 exposed to the region of the through hole 165a to be formed in the third surface 24a, the method for manufacturing the support plate 16 further includes forming a third perforated hole 262 in the first mask layer 26 exposed to the region of the second groove 165c to be formed in the third surface 24a, and providing a first protective layer 281 to cover the third perforated hole 262.

[0245] During the etching process of the support plate blank 24, the support plate blank 24 is etched through the first perforation 261 to form a portion of the through hole 165a. The protective layer covering the third perforation 262 is removed, and the support plate blank 24 is simultaneously etched through the first perforation 261 and the third perforation 262 to form the through hole 165a and the second groove 165c.

[0246] For any of the above embodiments, the development and exposure process can be implemented in the following way: specifically, the first cutout 261 and the second cutout 271 can be formed by masking the exposure using a film template. Specifically, a film template is prepared, which is a transparent film coated with opaque black patterns that correspond to the patterns on the mask layer. The transparent areas allow light to pass through, while the opaque areas block light. The film template is placed on the support blank 24 that has been coated with the mask layer.

[0247] After the film template is fixed, the support blank 24 is exposed by placing it on an exposure machine. The exposure machine uses ultraviolet light (UV light) to irradiate the support blank 24 from the back of the film template. The UV light passes through the transparent areas of the film template and irradiates the mask layer, causing a chemical change (crosslinking) in these areas of the mask layer, making it insoluble in the developing solution.

[0248] After exposure, the support blank 24 is developed. The developer washes away the mask layer in the unexposed areas, which remain chemically unchanged and still soluble in the developer. The photosensitive ink areas that have undergone exposure and chemical change (i.e., the areas under the opaque part of the film template) remain unchanged, forming a masking layer that protects the support blank 24 from the subsequent etching process.

[0249] After development, the support plate blank 24 is baked to further solidify the mask layer and improve its chemical resistance in subsequent processes. Subsequently, the support plate blank 24 will enter the etching process, in which the part of the support plate blank 24 not covered by the mask layer will be etched away to expose the circuit pattern.

[0250] Based on any of the above embodiments, in the etching process, the support blank 24 can be etched using a wet etching method in chemical etching. For example, the support blank 24 with a mask layer can be immersed in an etching solution 25. Alternatively, the etching solution 25 can be sprayed onto the support blank 24 with the mask layer, and the etching solution 25 can be sprayed from one side of the third surface 24a toward the third surface 24a. The etching solution 25 can be an acidic etching solution, such as sulfuric acid, hydrochloric acid, nitric acid, phosphoric acid, etc., or an alkaline etching solution, such as sodium hydroxide, potassium hydroxide, etc.

[0251] Wet etching is less expensive, improving the economics of the support plate 16. Furthermore, wet etching offers higher precision, ensuring the processing accuracy of the support plate 16. Because the etching solution 25 can uniformly contact the surface of the support plate 16, wet etching typically provides a more uniform etching effect, thereby improving the processing efficiency of the support plate 16.

[0252] The above embodiments are illustrated using an inward-folding electronic device 100 as an example. Furthermore, when the electronic device 100 is in a folded state, the third display area 13 is in the shape of a teardrop. In other embodiments, the technical concept of the support plate 16 described above can also be applied to other types of inward-folding electronic devices 100, outward-folding electronic devices 100, or rollable screen electronic devices 100. In other types of inward-folding electronic devices 100, the third display area 13 may be U-shaped when the electronic device 100 is in a folded state.

[0253] Please refer to Figure 25, which is a schematic diagram of the structure of the support plate 16 provided in some embodiments of this application. In some embodiments, the support plate 16 may only include a through hole 165a extending along the thickness direction of the support plate 16, and the support plate 16 may not have a second groove 165c. Similarly, the size of the first opening 165a1 of the through hole 165a along the first direction is smaller than the size of the second opening 165a2 along the first direction. The support plate 16 can be applied to other types of inward-folding electronic devices 100 and outward-folding electronic devices 100.

[0254] Please refer to Figure 26, which is a schematic diagram of the structure of the support plate 16 provided in some embodiments of this application. In some embodiments, the support plate 16 includes a plurality of arrayed through holes 165a. The through holes 165a can be provided not only in the third display area 13, but also in the first display area 11 and the second display area 12, to improve the bending resilience performance of the rollable screen electronic device 100 in the retracted state. Furthermore, since the dimension of the first opening 165a1 of the through hole 165a along the first direction is smaller than the dimension of the second opening 165a2 along the first direction, the reliability of the support plate 16 in supporting the display module 10 can also be improved.

[0255] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0256] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A support plate, characterized in that, It includes a bendable portion, the bendable portion having multiple through holes that penetrate the support plate along the thickness direction of the support plate; The through hole includes a first opening and a second opening located at both ends of the through hole, wherein the area of ​​the first opening is smaller than the area of ​​the second opening.

2. The support plate according to claim 1, characterized in that, The bent portion can be bent relative to an axis, the through hole is an elongated through hole, and the through hole extends in a direction parallel to the axis.

3. The support plate according to claim 1 or 2, characterized in that, The support plate includes a first surface and a second surface that are opposite to each other along the thickness direction, and the first opening is located on the first surface; The bent portion also has a first groove, which is formed by the second surface recessing into the first surface, and the second openings of the plurality of through holes all penetrate the bottom wall of the first groove.

4. The support plate according to any one of claims 1-3, characterized in that, The through hole is located at the minimum cross-sectional area perpendicular to the thickness direction of the support plate, between the first opening and the second opening.

5. The support plate according to claim 4, characterized in that, In the thickness direction of the support plate, the distance between the through hole and the first opening at the minimum cross-sectional area perpendicular to the thickness direction of the support plate is the first distance; The distance between the through hole at its minimum cross-sectional area perpendicular to the thickness direction of the support plate and the second opening is the second distance, and the first distance is less than the second distance.

6. The support plate according to claim 4 or 5, characterized in that, From the point of minimum cross-sectional area perpendicular to the thickness direction of the support plate to both ends of the through hole, the cross-sectional area of ​​the through hole gradually increases along the thickness direction perpendicular to the support plate.

7. The support plate according to any one of claims 1-3, characterized in that, From the first opening to the second opening, the cross-sectional area of ​​the through hole gradually increases along the thickness direction of the support plate.

8. The support plate according to any one of claims 1-7, characterized in that, The bending portion can be bent relative to an axis, and the first direction is perpendicular to both the axis and the thickness direction of the support plate. The difference between the maximum dimension of the first opening along the first direction and the maximum dimension of the second opening along the first direction is greater than or equal to 0.03 mm and less than or equal to 0.16 mm.

9. The support plate according to claim 8, characterized in that, The dimension of the first opening along the first direction is less than or equal to the length of the through hole along the thickness direction of the support plate.

10. The support plate according to claim 9, characterized in that, The difference between the dimension of the first opening along the first direction and the length of the through hole along the thickness direction of the support plate is less than or equal to 0.04 mm.

11. The support plate according to claim 3, characterized in that, In the thickness direction of the support plate, the ratio of the depth of the first groove to the thickness of the support plate is greater than or equal to 0.1 and less than or equal to 0.

4.

12. The support plate according to any one of claims 1-11, characterized in that, The bending portion can be bent relative to an axis, and the first direction is perpendicular to both the axis and the thickness direction of the support plate. The support plate includes a first surface and a second surface that are opposite to each other along the thickness direction. The bending portion includes a first sub-bending portion and two second sub-bending portions. Along the first direction, the two second sub-bending portions are respectively disposed on both sides of the first sub-bending portion, and the plurality of through holes are located in the first sub-bending portion. The second sub-bend includes a plurality of second grooves, which are formed by recessing from the second surface toward the first surface and extend in a direction parallel to the axis.

13. The support plate according to claim 12, characterized in that, In a direction parallel to the axis, the bent portion includes a first end face and a second end face facing away from each other, and the bent portion also includes at least one notch, which is formed by one of the first end face and the second end face being recessed into the other. The notch extends through the first surface and the second surface, and the second groove communicates with the notch at at least one end in a direction parallel to the axis.

14. The support plate according to claim 13, characterized in that, In a direction parallel to the axis, the depth of the notch is greater than or equal to 0.05 mm and less than or equal to 0.3 mm.

15. A display module, characterized in that, include: The display panel includes a display surface and a backlight surface facing each other; Cover plates are stacked on the display surface; The support plate is the support plate according to any one of claims 1-14, and the support plate is stacked on the backlight surface; the first opening is closer to the display panel than the second opening.

16. An electronic device, characterized in that, include; The display module is the display module as described in claim 15; A support device is disposed on the side of the support plate opposite to the display panel.

17. The electronic device according to claim 16, characterized in that, The support device includes a first housing, a second housing, and a rotating shaft mechanism. The rotating shaft mechanism is disposed between the first housing and the second housing, and the support device supports the display module.

18. A method for manufacturing a support plate, characterized in that, include: A first mask layer is formed on the third surface of the support blank, and a second mask layer is formed on the fourth surface of the support blank. The third surface and the fourth surface are two surfaces of the support plate blank that are opposite to each other in the thickness direction; the first mask layer has a first perforation, and the second mask layer has a second perforation; The support plate blank is etched through the first and second perforations to form a through hole that penetrates the support plate blank along the thickness direction of the support plate blank. The through hole includes a first opening and a second opening along the thickness direction of the support plate blank. The time taken to etch the support plate blank through the first perforation is greater than the time taken to etch the support plate blank through the second perforation, so that the area of ​​the first opening is smaller than the area of ​​the second opening.

19. A method for manufacturing a support plate, characterized in that, include: A first mask layer is formed on the third surface of the support blank, and a second mask layer is formed on the fourth surface of the support blank; The third surface and the fourth surface are two surfaces of the support plate blank that are opposite to each other in the thickness direction. The first mask layer has a first perforation, and the second mask layer covers the fourth surface. The support plate blank is etched through the first perforation to form a through hole penetrating the support plate blank.

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