Electronic device

Abstract

This application provides an electronic device. The electronic device includes a housing, a motherboard, a camera, a display panel, and electronic components. The display panel includes a display surface and a non-display surface, which are disposed opposite to each other along the thickness direction of the display panel. The display panel is located on one side of the housing along its thickness direction and is connected to the housing. A receiving cavity is formed between the display panel and the housing, and the non-display surface is located within the receiving cavity. The motherboard and the camera are both located within the receiving cavity and are fixedly connected to the housing, and the camera is offset from the motherboard along the thickness direction of the electronic device. The electronic components are located on the non-display surface and are electrically connected to the display panel. Along the thickness direction of the electronic device, at least a portion of the electronic components are disposed opposite to the camera, and at least a portion of the electronic components are offset from the motherboard. The electronic device provided by this application can solve the technical problem of low space utilization of the motherboard in existing electronic devices.

Description

Technical Field

[0001] This application relates to the field of electronic technology, and more particularly to an electronic device. Background Technology

[0002] With the continuous development of science and technology, mobile phones and other electronic devices are widely used in people's daily lives and work, becoming indispensable everyday items. Electronic devices include numerous functional components such as display modules, motherboards, and camera modules. In existing technologies, the internal screen devices in the display module are mostly located within the projection area of ​​the motherboard. Since these internal screen devices generally have a certain height, a device clearance zone needs to be set in the motherboard area corresponding to the internal screen device to avoid obstructing its movement. However, setting a clearance zone on the motherboard wastes space, resulting in low space utilization. Summary of the Invention

[0003] This application provides an electronic device that can solve the technical problem of low space utilization of the motherboard in existing electronic devices.

[0004] To address the above problems, this application provides an electronic device. The electronic device includes a housing, a motherboard, a camera, and a display module. The display module includes a display panel and electronic components. The display panel includes a display surface and a non-display surface, which are disposed opposite to each other along the thickness direction of the display module. The display panel is disposed on one side of the housing along its thickness direction and is connected to the housing. A receiving cavity is formed between the display panel and the housing, and the non-display surface is located within the receiving cavity. The motherboard and the camera are both disposed within the receiving cavity and are fixedly connected to the housing. Along the thickness direction of the electronic device, the camera and the motherboard are at least partially offset. The electronic components are disposed on the non-display surface and are electrically connected to the display panel. Along the thickness direction of the electronic device, at least a portion of the electronic components are disposed opposite to the camera, and at least a portion of the electronic components are offset from the motherboard. That is, at least a portion of the electronic components are disposed between the camera and the display panel.

[0005] In this embodiment, by setting the electronic components at least partially opposite to the camera along the thickness direction of the electronic device, the stacking of the electronic components and the motherboard in the thickness direction of the electronic device can be reduced or even avoided. This reduces the area of ​​the restricted area on the motherboard, or even avoids setting a restricted area on the motherboard, thereby improving the space utilization of the motherboard and the utilization of the internal space of the electronic device.

[0006] In one possible implementation, along the thickness direction of the electronic device, the projection of the electronic component is entirely within the projection of the camera, and the projection of the electronic component is completely offset from the projection of the motherboard. That is, the electronic component is entirely positioned between the camera and the display panel.

[0007] In this embodiment, by placing the electronic components entirely within the projection area of ​​the camera, the space between the camera and the display panel can be fully utilized, avoiding the stacking of electronic components and the motherboard in the thickness direction of the electronic device. This avoids setting a no-display zone on the motherboard, further improving the space utilization of the motherboard and the internal space utilization of the electronic device.

[0008] In one possible implementation, the motherboard has a clearance hole that extends through the motherboard along its thickness direction, and the camera is at least partially located within the clearance hole.

[0009] In this embodiment, by setting a clearance hole on the motherboard and placing at least part of the camera inside the clearance hole, the camera and the motherboard have shared space in the thickness direction of the electronic device, thereby improving the space utilization rate inside the electronic device and reducing the height of the camera protruding from the back of the electronic device, which is beneficial to the thinning and lightening of the electronic device.

[0010] In one possible implementation, the camera is a periscope camera. The camera includes a driver, a substrate, and a sensor. The substrate is connected to the driver along a first direction, and the thickness direction of the substrate is parallel to the first direction; the sensor is disposed on the substrate and electrically connected to the motherboard; along the thickness direction of the electronic device, the electronic component is disposed opposite to the driver; wherein, the first direction is perpendicular to the thickness direction of the electronic device.

[0011] In this embodiment, by arranging the electronic components and the driving components in the camera relative to each other along the thickness direction of the electronic device, the space between the driving components and the display panel can be fully utilized, thereby improving the space utilization rate within the electronic device.

[0012] In one possible implementation, the substrate protrudes from the driving member along the thickness direction of the electronic device and toward the display panel. The electronic components are disposed opposite to the driving member along the thickness direction of the electronic device. Along this first direction, the projection of the electronic components at least partially coincides with the projection of the substrate.

[0013] It should be noted that in periscope cameras, due to the large number of sensors mounted on the substrate, the height of the substrate is usually greater than the height of the driving component, meaning the substrate is the height bottleneck of the camera. In this embodiment, by arranging the electronic components and the driving component opposite each other along the thickness direction of the electronic device, and ensuring that the projection of the electronic components along the thickness direction parallel to the substrate at least partially coincides with the projection of the substrate, the step difference between the substrate and the driving component can be fully utilized. Furthermore, the electronic components are accommodated at the corresponding positions of the driving components, allowing the electronic components and the camera to share space in the thickness direction of the electronic device. This enables the thinning of the electronic device and further improves the utilization rate of the internal space of the electronic device.

[0014] In one possible implementation, the camera further includes a prism and a lens assembly, which are arranged side-by-side within the driving member, with the lens assembly located between the prism and the substrate. The camera also has a light inlet located on one side of the camera in the height direction and opposite to the prism.

[0015] The periscope camera in this embodiment, by setting a prism, can convert light along the thickness direction of the electronic device into light along the direction perpendicular to the thickness direction of the electronic device. This enables the electronic device to achieve telephoto photography while reducing its thickness and the height of the camera protruding from the back of the electronic device, which is beneficial for making the electronic device thinner and lighter.

[0016] In one possible implementation, the driving member has a groove on its surface facing the display panel. The electronic device includes a body and a protrusion, the protrusion being disposed on the surface of the body facing away from the display panel and protruding relative to the body in a direction away from the display panel. The protrusion and the groove are disposed opposite each other along the thickness direction of the electronic device, and the protrusion is at least partially located within the groove.

[0017] In this embodiment, by at least partially placing the protrusion in the electronic device within the groove, the groove on the drive component can be fully utilized to accommodate the electronic device, thereby increasing the reuse space between the electronic device and the camera in the thickness direction of the electronic device, further improving the utilization rate of the internal space of the electronic device, and further achieving the thinning of the electronic device.

[0018] In one possible implementation, the surface of the driving member facing the display panel includes a flat area and a recessed area, the recessed area being recessed relative to the flat area towards the camera, forming a groove. There are multiple electronic devices, two of which are designated as a first electronic device and a second electronic device. Along the thickness direction of the electronic device and towards the camera, the second electronic device protrudes from the first electronic device. Along the thickness direction of the electronic device, the first electronic device is disposed opposite to the flat area, and the second electronic device is disposed opposite to the recessed area, with the second electronic device at least partially located within the groove.

[0019] In this embodiment, the surface of the driving component facing the display panel is uneven. The electronic components can be arranged according to the contour of the surface of the driving component facing the display panel. For example, the taller electronic components can be positioned opposite the recessed area, and the shorter electronic components can be positioned opposite the flat area. In this way, the recessed area can be fully utilized to accommodate the electronic components, increasing the reuse space between the electronic components and the camera in the thickness direction of the electronic device. This further improves the utilization rate of the internal space of the electronic device and further enables the thinning of the electronic device.

[0020] In one possible implementation, the camera is a main camera, or a wide-angle camera or an ultra-wide-angle camera.

[0021] In one possible implementation, the display panel further includes a display portion and a connecting portion. The display surface and the non-display surface are disposed opposite to each other along the thickness direction of the display portion. The connecting portion is disposed on the non-display surface and connected to the display portion. The electronic device further includes a connecting circuit board, which is disposed on the non-display surface and adjacent to the connecting portion, and is electrically connected to the connecting portion. The electronic device is disposed on the side of the connecting circuit board facing away from the display portion and is electrically connected to the connecting circuit board.

[0022] In one possible implementation, the electronic device is a foldable electronic device. The electronic device further includes a first main body, a second main body, and a hinge mechanism. The first main body and the second main body are respectively connected to opposite sides of the hinge mechanism in the width direction and are rotatable relative to the hinge mechanism. The first main body includes the housing. The display unit includes a first display portion, a second display portion, and a flexible portion. The first display portion is mounted on the first main body, the second display portion is mounted on the second main body, and the flexible portion is disposed opposite to the hinge mechanism. The connecting portion, the connecting circuit board, and the electronic components are all disposed between the first display portion and the first main body, and the connecting portion is connected to the end of the first display portion away from the second display portion.

[0023] In summary, the electronic device provided in this application, by setting the electronic components at least partially opposite to the camera along the thickness direction of the electronic device, can reduce or even avoid the stacking of electronic components and the motherboard in the thickness direction of the electronic device. This can reduce the area of ​​the restricted area on the motherboard, or even avoid setting a restricted area on the motherboard, thereby improving the space utilization of the motherboard and the utilization of the internal space of the electronic device. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application or the background art, the accompanying drawings used in the embodiments of this application or the background art will be described below.

[0025] Figure 1 This is a schematic diagram of the electronic device provided in the first embodiment of this application in a folded state;

[0026] Figure 2 yes Figure 1 A schematic diagram of the electronic device in its deployed state;

[0027] Figure 3 yes Figure 2 A schematic diagram of a partial cross-sectional structure of the electronic device shown after it has been cut along point AA.

[0028] Figure 4 yes Figure 2 A partially exploded structural diagram of the electronic device shown.

[0029] Figure 5 yes Figure 4 An exploded view of the camera in the electronic device shown.

[0030] Figure 6 yes Figure 4 A schematic diagram of the cross-sectional structure of the camera in the electronic device shown.

[0031] Figure 7yes Figure 2 A schematic diagram of the display module in the electronic device shown.

[0032] Figure 8 This is a partial cross-sectional structural schematic diagram of the electronic device provided in the second embodiment of this application;

[0033] Figure 9 This is a partial cross-sectional structural schematic diagram of the electronic device provided in the third embodiment of this application;

[0034] Figure 10 This is a partial cross-sectional structural diagram of the electronic device provided in the fourth embodiment of this application. Detailed Implementation

[0035] The embodiments of this application are described below with reference to the accompanying drawings.

[0036] Please see Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the electronic device 1000 provided in the first embodiment of this application in a folded state. Figure 2 yes Figure 1 The diagram shows the structure of the electronic device 1000 in its unfolded state.

[0037] Electronic device 1000 includes, but is not limited to, mobile phones, laptops, tablets, personal digital assistants, e-book readers, wearable devices, or in-vehicle devices. In this embodiment, electronic device 1000 is a foldable mobile phone. Electronic device 1000 can switch between an unfolded state and a folded state.

[0038] For ease of description, in this application, the width direction of the electronic device 1000 is defined as the X direction, the length direction of the electronic device 1000 is defined as the Y direction, and the thickness direction of the electronic device 1000 is defined as the Z direction. The X, Y, and Z directions are mutually perpendicular. For example, the extension direction of the rotation axis of the electronic device 1000 is parallel to the Y direction. That is, the electronic device 1000 can be relatively unfolded or relatively folded around the Y-axis.

[0039] in, Figure 1 The electronic device 1000 shown is in a folded state. Figure 2 The electronic device 1000 shown is in an unfolded state. For example, Figure 2 The unfolding angle α of the electronic device 1000 shown is 180 degrees. It should be noted that the angles illustrated in the embodiments of this application are allowed to have slight deviations. For example, Figure 2The unfolding angle α of the electronic device 1000 shown is 180 degrees, which means that α can be 180 degrees, or approximately 180 degrees, such as 170 degrees, 175 degrees, 185 degrees, and 190 degrees.

[0040] The electronic device 1000 shown in this embodiment is an electronic device 1000 capable of being folded once. In some other embodiments, the electronic device 1000 may also be an electronic device 1000 capable of being folded multiple times (more than twice). In this case, the electronic device 1000 may include multiple parts, with two adjacent parts folded relatively close together until the electronic device 1000 is in a folded state, and two adjacent parts unfolded relatively far apart until the electronic device 1000 is in an unfolded state.

[0041] The electronic device 1000 includes a first body 100, a second body 200, a pivot mechanism 300, and a display module 400. The pivot mechanism 300 is disposed between the first body 100 and the second body 200 and is fixedly connected to the first body 100 and the second body 200. The first body 100 and the second body 200 are rotatably connected through the pivot mechanism 300.

[0042] The display module 400 includes a display surface 4111 for displaying text, images, and videos. The display module 400 includes a first display portion 4113, a second display portion 4114, and a flexible portion 4115. The flexible portion 4115 is connected between the first display portion 4113 and the second display portion 4114, and can be bent about a direction with the Y-axis as its axis. The first display portion 4113, the second display portion 4114, and the flexible portion 4115 together constitute the display module 400.

[0043] Display module 400 is mounted on first body 100, second body 200, and pivot mechanism 300. First display portion 4113 is mounted on and fixedly connected to first body 100, and second display portion 4114 is mounted on and fixedly connected to second body 200. Bendable portion 4115 is disposed opposite to pivot mechanism 300. First body 100 and second body 200 can rotate relative to each other via pivot mechanism 300, causing display module 400 to bend or unfold, and enabling electronic device 1000 to switch between folded and unfolded states.

[0044] like Figure 1As shown, when the electronic device 1000 is in a folded state, both the foldable device and the display module 400 are folded. The first main body 100 and the second main body 200 are stacked opposite each other, the bendable portion 4115 bends, and the first display portion 4113 and the second display portion 4114 are stacked opposite each other. At this time, the display module 400 is located between the first main body 100 and the second main body 200, which greatly reduces the probability of damage to the display module 400 and achieves effective protection for the display module 400.

[0045] Please refer to the following: Figure 2 The first main body 100 and the second main body 200 rotate in opposite directions via a pivot mechanism 300, thereby unfolding the display module 400 and bringing the electronic device 1000 to its unfolded state. When the electronic device 1000 is in its unfolded state, the angle between the first main body 100 and the second main body 200 is α, the flexible portion 4115 is unfolded, and the first display portion 4113 and the second display portion 4114 are unfolded relative to each other. At this time, the angles between the first display portion 4113, the second display portion 4114, and the flexible portion 4115 are all α, and the display module 400 has a large display area, achieving a large-screen display for the electronic device 1000 and improving the user experience.

[0046] Please see Figure 3 and Figure 4 , Figure 3 yes Figure 2 This is a schematic diagram of a partial cross-sectional structure of the electronic device 1000 after it has been cut along point AA. Figure 4 yes Figure 2 The diagram shows a partial exploded view of the electronic device 1000. The section along AA refers to a section along the plane containing line AA.

[0047] The first main body 100 includes a housing 10, a motherboard 20, and a camera 30. The housing 10 includes a back cover 11, a camera decorative piece 12, and a mid-frame 13. The mid-frame 13 includes a mid-plate 131 and a frame 132. The frame 132 is located on the outer periphery of the mid-plate 131 and is connected to the mid-plate 131 at an angle. For example, the angle between the frame 132 and the mid-plate 131 is 90 degrees. Alternatively, the angle between the frame 132 and the mid-plate 131 may be slightly greater than 90 degrees or slightly less than 90 degrees.

[0048] The rear cover 11 has a first through hole 111. The first through hole 111 extends through the rear cover 11 along its thickness direction. The rear cover 11 is mounted on one side of the middle plate 131 along its thickness direction. The rear cover 11 can be integrally formed with the middle frame 13 to increase the overall strength of the housing 10. Alternatively, the rear cover 11 can be detachably mounted on the middle frame 13 to facilitate maintenance of the electronic components 430 inside the electronic device 1000.

[0049] The camera decorative element 12 includes a top plate 121, a side plate 122, and an extension plate 123. The side plate 122 is disposed around the top plate 121 and is connected to the side plate 122 at an angle. For example, the side plate 122 is perpendicularly connected to the top plate 121. The extension plate 123 is disposed around the side plate 122 and is connected to the side of the side plate 122 facing away from the top plate 121. The extension plate 123 extends outward toward the camera decorative element 12. The top plate 121 is provided with a second through hole 124. The second through hole 124 penetrates the top plate 121 along its thickness direction.

[0050] The camera decorative element 12 is installed in the first through hole 111 and fixedly connected to the back cover 11. An extension plate 123 is located on the side of the back cover 11 facing the receiving cavity 101, and is fixedly connected to the back cover 11. The second through hole 124 connects the receiving cavity 101 and the outer side of the electronic device 1000. In this embodiment, the camera decorative element 12 protrudes from the back cover 11 along the thickness direction of the electronic device 1000. That is, the top plate 121 is located on the side of the back cover 11 facing away from the display module 400. This provides a larger accommodating space for the camera 30.

[0051] The display module 400 is disposed on the housing 10 and is positioned opposite the rear cover 11 along the thickness direction of the electronic device 1000. The display module 400 and the housing 10 enclose a receiving cavity 101.

[0052] like Figure 3 and Figure 4 As shown, the main board 20 is a printed circuit board (PCB). The main board 20 has a clearance hole 21. The clearance hole 21 penetrates the main board 20 along its thickness direction. The main board 20 is disposed within the receiving cavity 101 and is fixedly connected to the middle plate 131. The clearance hole 21 is used to avoid the camera 30.

[0053] Please see Figure 5 , Figure 5 yes Figure 4 An exploded view of the camera 30 in the electronic device 1000 shown. Figure 6 yes Figure 4 A cross-sectional view of the camera 30 in the electronic device 1000 shown.

[0054] In this embodiment, the camera 30 is a periscope camera. The camera 30 includes a drive unit 31, a protective shell 32, a bracket 33, a substrate 34, a lens assembly 35, a prism 36, and a sensor 37. In this embodiment, the drive unit 31 is a motor. For example, the drive unit 31 is a voice coil motor. The drive unit 31 is generally rectangular in shape. The drive unit 31 includes a first bottom surface 311, a first top surface 312, a first side surface 313, and a second side surface 314. The first top surface 312 and the first bottom surface 311 are arranged opposite each other along the height direction of the camera 30, i.e., the Z-direction. The first side surface 313 and the second side surface 314 are arranged opposite each other along the length direction of the camera 30, and both the first side surface 313 and the second side surface 314 are connected between the first top surface 312 and the first bottom surface 311. The drive unit 31 is provided with a receiving groove 315, a first opening 316, and a second opening 317. The first opening 316 is located on the first top surface 312, and the second opening 317 is located on the second side surface 314. Both the first opening 316 and the second opening 317 are connected to the receiving groove 315.

[0055] The protective shell 32 is generally a hollow box structure. A light inlet 321 is provided on the top surface of the protective shell 32. The protective shell 32 covers the top and sides of the driving component 31 and is fixedly connected to the driving component 31. The light inlet 321 is opposite to and communicates with the first opening 316. That is, the light inlet 321 communicates with the receiving groove 315. The second opening 317 is exposed from the side of the protective shell 32. Simultaneously, the first bottom surface 311 is exposed from the protective shell 32. The protective shell 32 protects the driving component 31, reducing or even preventing damage to the camera 30.

[0056] Both the prism 36 and the lens assembly 35 are disposed within the receiving groove 315. The prism 36 and the light inlet 321 are positioned opposite each other along the Z-direction. In this embodiment, the lens assembly 35 and the prism 36 are arranged along the length of the camera 30. In other embodiments, the lens assembly 35 and the prism 36 may also be arranged along the width of the camera 30. The lens assembly 35 is fixedly connected to the driving member 31. The driving member 31 can drive the lens assembly 35 to move within the receiving groove 315 to achieve focusing of the camera 30. The lens assembly 35 can be a single lens or a combination of multiple lenses.

[0057] The bracket 33 is provided with a third through hole 331. The third through hole 331 extends through the bracket 33 along its thickness direction. The bracket 33 is located on the side of the drive member 31 near the second side 314 and is fixedly connected to the housing and the drive member 31. The third through hole 331 is opposite to the second opening 317 and they communicate with each other.

[0058] The substrate 34 can be a printed circuit board, or it can be composed of a flexible printed circuit board (FPC) and a printed circuit board. In this embodiment, the substrate 34 is fixedly connected to the bracket 33. In this embodiment, the substrate 34 and the driving member 31 are arranged along a first direction, and the thickness direction of the substrate 34 is parallel or substantially parallel to the first direction. In this embodiment, the first direction is the length direction of the camera 30, and the substrate 34 and the driving member 31 are arranged along the length direction of the camera 30. In other embodiments, the first direction can also be the width direction of the camera 30, or the first direction can also form an angle with the length direction and the width direction of the camera 30.

[0059] In this embodiment, there are multiple sensors 37. Multiple sensors 37 are disposed on the surface of the substrate 34 facing the support 33. That is, the sensors 37 face the third through hole 331. In other words, the sensors 37 face the lens assembly 35.

[0060] The camera 30 is mounted on the housing 10 and fixedly connected to it. In this embodiment, the length direction of the camera 30 is parallel or approximately parallel to the width direction of the electronic device 1000, that is, parallel or approximately parallel to the X direction; the width direction of the camera 30 is parallel or approximately parallel to the length direction of the electronic device 1000, that is, parallel or approximately parallel to the Y direction; the height direction of the camera 30 is parallel or approximately parallel to the thickness direction of the electronic device 1000, that is, parallel or approximately parallel to the Z direction. In other embodiments, the length direction of the camera 30 may also be parallel to the Y direction, and the width direction of the camera 30 may be parallel to the X direction. Alternatively, the length direction of the camera 30 may be set at an angle to both the Y and X directions.

[0061] The first bottom surface 311 of the drive component 31 passes through the clearance hole of the motherboard 20 and faces the display module 400. That is, the camera 30 is at least partially located within the clearance hole of the motherboard 20. In this case, the camera 30 reuses the thickness space occupied by the motherboard 20 in the Z direction, which can improve the space utilization rate inside the electronic device 1000 and reduce the height of the camera 30 protruding from the back cover 11, that is, reduce the height of the camera decorative component 12 protruding from the back cover 11, which is to say, reduce the protrusion height of the electronic device 1000 at the position of the camera 30, which is conducive to the thinning and lightening of the electronic device 1000.

[0062] The light inlet 321 is positioned opposite to the third through-hole 331 of the camera decorative piece 12, and is exposed to the outside of the electronic device 1000 through the third through-hole 331. The substrate 34 is electrically connected to the motherboard 20. External light enters the camera 30 through the light inlet 321 and is incident on the prism 36. After being reflected by the prism 36, it is transmitted to the lens assembly 35, and then to the sensor 37 located on the substrate 34, thereby forming image information. The substrate 34 transmits the image information formed by the camera 30 to the motherboard 20. The motherboard 20 processes the image information to form an image or video, which is then displayed on the display module 400 of the electronic device 1000.

[0063] In this embodiment, the camera 30 is a periscope camera. By setting a prism 36 on the camera 30, light rays along the thickness direction of the electronic device 1000 can be converted into light rays along the thickness direction perpendicular to the electronic device 1000. This enables the electronic device 1000 to achieve telephoto photography while reducing the thickness of the electronic device 1000 and reducing the height of the camera 30 protruding from the back of the electronic device 1000, which is beneficial to the thinning and lightening of the electronic device 1000.

[0064] It should be noted that in the periscope camera 30, since there are a large number of sensors 37 on the substrate 34, the height of the substrate 34 is usually greater than the height of the driving component 31, that is, the substrate 34 is the height bottleneck of the camera 30.

[0065] like Figure 3 As shown, in this embodiment, the substrate 34 includes a second bottom surface 341. The second bottom surface 341 faces the display module 400, that is, the orientation of the second bottom surface 341 is the same as that of the first bottom surface 311. Along the thickness direction of the electronic device 1000, the substrate 34 protrudes from the driving member 31. That is, along the thickness direction of the electronic device 1000, the second bottom surface 341 protrudes from the first bottom surface 311. In other words, the second bottom surface 341 is located on the side of the first bottom surface 311 closer to the display module 400. For example, the height difference between the second bottom surface 341 and the first bottom surface 311 is 0.55mm, that is, the distance by which the second bottom surface 341 protrudes from the first bottom surface 311 along the Z direction is 0.55mm. It can be understood that the camera 30 forms a receiving notch 301 on one side of the second bottom surface 341. The projection of the receiving notch 301 along the Y direction is completely located within the projection of the substrate 34 along the Y direction. That is, the receiving gap 301 shares the space of the substrate 34 in the Z direction.

[0066] Please combine Figure 3 , Figure 4 and Figure 7 , Figure 7 yes Figure 2 A schematic diagram of the structure of the display module 400 in the electronic device 1000 shown.

[0067] The display module 400 includes a display panel 410 and a connecting circuit board 420. The display panel 410 includes a display portion 411 and a connecting portion 412. The display portion 411 includes a display surface 4111 and a non-display surface 4112. Along the thickness direction of the display portion 411, the display surface 4111 and the non-display surface 4112 are disposed opposite to each other. The display portion 411 includes a first display portion 4113, a second display portion 4114, and a flexible portion 4115. The connecting portion 412 is electrically connected to the display portion 411, and the connecting portion 412 is folded relative to the display portion 411 towards the non-display surface 4112. It is understood that the connecting portion 412 is disposed on the non-display surface 4112 and is stacked with the first display portion 4113 in the display portion 411 along the thickness direction of the display module 400. Specifically, the connecting part 412 is located between the first display part 4113 and the first main body 100, and is connected to the end of the first display part 4113 away from the flexible part 4115, and is folded relative to the first display part 4113 in the Y direction.

[0068] It should be noted that the connection part 412 being located on the non-display surface 4112 means that the connection part 412 is located on the side where the non-display surface 4112 of the display part 411 is located. The connection part 412 can be directly located on the non-display surface 4112, or the connection part 412 can be indirectly located on the non-display surface 4112. For example, the connection part 412 can be located on the non-display surface 4112 through a layer structure such as adhesive. Similar descriptions in the following text can be understood in the same way.

[0069] A connecting circuit board 420 is disposed on the non-display surface 4112 and is electrically connected to the connecting portion 412. Exemplarily, the connecting circuit board 420 may be a flexible printed circuit (FPC). In some other embodiments, the connecting circuit board 420 may also be a rigid-flex PCB. The connecting circuit board 420 is also electrically connected to the motherboard 20 to achieve an electrical connection between the display module 400 and the motherboard 20. The connecting circuit board 420 can transmit display information sent by the motherboard 20 to the display panel 410, and the display panel 410 displays images, text, videos, and other screens according to the display information.

[0070] The display module 400 also includes electronic components 430. Electronic components 430 are the internal screen devices of the display module 400. Electronic components 430 can be display drivers, such as display driver ICs (DDICs), touch drivers, such as touch panel ICs (TPICs), flash memory chips, or capacitors, resistors, or inductors.

[0071] like Figure 4 and Figure 7 As shown, electronic device 430 is disposed on the surface of connecting circuit board 420 opposite to the non-display surface 4112, and is electrically connected to connecting circuit board 420. It can be understood that electronic device 430 achieves electrical connection with motherboard 20 through connecting circuit board 420.

[0072] Please combine Figure 2 and Figure 3 The display module 400 is disposed on the first main body 100, the second main body 200, and the rotating shaft mechanism 300. The second display portion 4114 is mounted on the second main body 200, and the bent portion of the housing is positioned opposite to the rotating shaft mechanism 300. The first display portion 4113, the connecting portion 412, the connecting circuit board 420, and the electronic device 430 are all mounted on the first main body 100, with the connecting portion 412, the connecting circuit board 420, and the electronic device 430 located between the first display portion 4113 and the first main body 100.

[0073] In this embodiment, the electronic device 430 is at least partially located between the camera 30 and the connecting circuit board 420 of the display module 400. That is, along the thickness direction of the electronic device 1000, the electronic device 430 is at least partially positioned opposite the camera 30, and at least partially offset from the motherboard 20. In this embodiment, the electronic device 430 is completely located between the camera 30 and the connecting circuit board 420 of the display module 400. That is, the electronic device 430 and the camera 30 are positioned opposite each other along the thickness direction of the electronic device 1000. Specifically, the electronic device 430 and the first bottom surface 311 are positioned opposite each other along the thickness direction of the electronic device 1000, and the electronic device 430 is at least partially located within the receiving notch 301. The orthographic projection of the electronic device 430 along the Z-direction lies within the orthographic projection of the first bottom surface 311 along the Z-direction. It is understood that the electronic device 430 is at least partially arranged side-by-side with the substrate 34 along the Y direction, that is, along the thickness direction parallel to the substrate 34, the orthographic projection of the electronic device 430 at least partially coincides with the orthographic projection of the substrate 34. At the same time, the electronic device 430 and the motherboard 20 are offset along the thickness direction of the electronic device 1000, that is, the orthographic projection of the electronic device 430 along the Z direction is not located within the orthographic projection of the motherboard 20 along the Z direction.

[0074] It should be noted that the electronic device 430 generally has a certain height and protrudes from the non-display surface 4112 of the display panel 410. When the electronic device 430 is located within the projection area of ​​the motherboard 20, a device exclusion zone needs to be set within the projection area of ​​the electronic device 430 on the motherboard 20. That is, when the electronic device 430 and the motherboard 20 are positioned relative to each other along the Z-direction, no other devices can be placed within the projection area of ​​the electronic device 430 on the motherboard 20. This wastes space on the motherboard 20, resulting in low space utilization and hindering the utilization of the internal space of the electronic device 1000.

[0075] In this embodiment, by setting the electronic device 430 and camera 30 in the display module 400 opposite to each other along the thickness direction of the electronic device 1000, and setting them offset from the motherboard 20 along the thickness direction of the electronic device 1000, the electronic device 430 and motherboard 20 can be avoided from being stacked in the thickness direction of the electronic device 1000. This avoids setting a no-display area on the motherboard 20, thereby improving the space utilization of the motherboard 20 and the utilization of the internal space of the electronic device 1000.

[0076] Meanwhile, in this embodiment, by arranging the electronic device 430 and the driving component 31 in the camera 30 opposite each other along the thickness direction of the electronic device 1000, and arranging them side by side with the substrate 34 in the camera 30 along the length direction of the electronic device 1000, the step difference between the substrate 34 and the driving component 31 can be fully utilized, and the electronic device 430 can be accommodated at the position corresponding to the driving component 31. This allows the electronic device 430 and the camera 30 to have shared space in the thickness direction of the electronic device 1000, thereby achieving the thinning of the electronic device 1000 and further improving the utilization rate of the internal space of the electronic device 1000.

[0077] In one embodiment, the electronic device 430 is partially located between the camera 30 and the connecting circuit board 420, and partially located between the motherboard 20 and the connecting circuit board 420. That is, the electronic device 430 is partially positioned opposite the camera 30 along the thickness direction of the electronic device 1000, and partially positioned opposite the motherboard 20 along the thickness direction of the electronic device 1000. This reduces the area of ​​the restricted area on the motherboard 20, thereby improving the space utilization of the motherboard 20 and the internal space utilization of the electronic device 1000.

[0078] When there are multiple electronic devices 430, at least one electronic device 430 is positioned opposite to the camera 30 along the thickness direction of the electronic device 1000, and at least one electronic device 430 is positioned opposite to the motherboard 20 along the thickness direction of the electronic device 1000. In this case, the area of ​​the restricted area on the motherboard 20 can be reduced, thereby improving the space utilization of the motherboard 20 and the utilization of the internal space of the electronic device 1000.

[0079] Please see Figure 8 , Figure 8 This is a partial cross-sectional structural diagram of the electronic device 1000 provided in the second embodiment of this application.

[0080] This embodiment and Figure 3 The difference in the illustrated embodiment is that, in this embodiment, the first bottom surface 311 is provided with a flat area 3111 and a recessed area 3112. The recessed area 3112 is recessed relative to the flat area 3111 towards the first top surface 312, that is, towards the rear cover 11, thereby forming a groove 3113.

[0081] Electronic device 430 includes a body 431 and a protrusion 432. The protrusion 432 is provided on the surface of the body 431 facing away from the connecting circuit board 420, and protrudes relative to the body 431 along the thickness direction of the electronic device 1000. That is, the top surface of the protrusion 432 is located on the side of the top surface of the body 431 facing away from the connecting circuit board 420. Both the top surface of the protrusion 432 and the top surface of the body 431 refer to the surfaces facing away from the connecting circuit board 420.

[0082] Electronic component 430 and the first bottom surface 311 are disposed opposite each other along the thickness direction of electronic device 1000 and face the first bottom surface 311. Protrusion 432 and recessed area 3112 are disposed opposite each other along the thickness direction of electronic device 1000, with protrusion 432 extending into recess 3113, and the side of protrusion 432 facing away from the connecting circuit board 420 located within recess 3113. That is, protrusion 432 is at least partially located within recess 3113.

[0083] The groove 3113 on the first bottom surface 311 can be one or more. The protrusion 432 of the electronic device 430 can be one or more. Each protrusion 432 is provided in the groove 3113.

[0084] In this embodiment, the first bottom surface 311 of the driving member 31 is uneven. The electronic device 430 can be arranged according to the contour of the first bottom surface 311. For example, the protrusion 432 of the electronic device 430 can be provided in the recessed area 3112 of the first bottom surface 311. In this way, the recessed area 3112 of the first bottom surface 311 can be fully utilized, and the electronic device 430 can be accommodated at the corresponding position of the recessed area 3112. This increases the reuse space of the electronic device 430 and the camera 30 in the thickness direction of the electronic device 1000, thereby further improving the utilization rate of the internal space of the electronic device 1000 and further achieving the thinning of the electronic device 1000.

[0085] Please see Figure 9 , Figure 9This is a partial cross-sectional structural diagram of the electronic device 1000 provided in the third embodiment of this application.

[0086] This embodiment and Figure 8 The difference in the illustrated embodiment is that, in this embodiment, there are multiple electronic devices 430. That is, there are two or more electronic devices 430. Two of the multiple electronic devices 430 are designated as a first electronic device 433 and a second electronic device 434. The height of the second electronic device 434 is greater than the height of the first electronic device 433. That is, the top surface of the second electronic device 434 is located on the side of the top surface of the first electronic device 433 that faces away from the connecting circuit board 420. Here, the height of the electronic device 430 refers to the dimension of the electronic device 430 along the thickness direction (Z direction) of the electronic device 1000, and the top surface of the electronic device 430 refers to the surface of the electronic device 430 that faces away from the connecting circuit board 420.

[0087] Both the first electronic device 433 and the second electronic device 434 are disposed opposite to the first bottom surface 311 along the thickness direction of the electronic device 1000. Specifically, the first electronic device 433 is disposed opposite to the flat area 3111 along the thickness direction of the electronic device 1000. The second electronic device 434 is disposed opposite to the recessed area 3112 along the thickness direction of the electronic device 1000, and the side of the second electronic device 434 facing away from the connecting circuit board 420 is located within the groove 3113. That is, the second electronic device 434 is at least partially located within the groove 3113. Along the length or width direction of the electronic device 1000, the orthographic projection of the second electronic device 434 is at least partially located within the orthographic projection of the driving member 31.

[0088] In this embodiment, the first bottom surface 311 of the driving member 31 is uneven. The electronic devices 430 can be arranged according to the contour of the first bottom surface 311. For example, the electronic device 430 with the larger dimension along the Z direction can be positioned opposite the recessed area 3112, and the electronic device 430 with the larger dimension along the Z direction can be extended into the groove 3113. The electronic device 430 with the smaller dimension along the Z direction can be positioned opposite the flat area 3111. In this way, the recessed area 3112 of the first bottom surface 311 can be fully utilized to accommodate the electronic devices 430, increasing the reuse space of the electronic devices 430 and the camera 30 in the thickness direction of the electronic device 1000. This can further improve the utilization rate of the internal space of the electronic device 1000 and further achieve the thinning of the electronic device 1000.

[0089] The first bottom surface 311 can have multiple grooves 3113. The depth of each groove 3113 can be the same, different, or partially the same. There can also be three, four, or more electronic devices 430. The heights of the multiple electronic devices 430 can all be different or partially the same. When arranging the electronic devices 430, their positions can be adjusted according to their heights. For example, the tallest electronic device 430 can be positioned opposite the deepest groove 3113, and a relatively tall electronic device 430 can be positioned opposite a relatively shallower groove 3113, to maximize the use of space within the electronic device 1000.

[0090] Please see Figure 10 , Figure 10 This is a partial cross-sectional structural diagram of the electronic device 1000 provided in the fourth embodiment of this application.

[0091] This embodiment and Figure 3 The difference in the illustrated embodiment is that, in this embodiment, the camera 30 is a wide-angle camera. The electronic device 430 is disposed between the camera 30 and the connecting circuit board 420, and the electronic device 430 and the camera 30 are arranged opposite each other along the thickness direction of the electronic device 1000. The orthographic projection of the electronic device 430 along the Z-direction is completely within the orthographic projection of the camera 30 along the Z-direction. Simultaneously, the electronic device 430 and the motherboard 20 are offset along the Z-direction. That is, the orthographic projection of the electronic device 430 along the Z-direction is offset from the orthographic projection of the motherboard 20 along the Z-direction, and is located outside the orthographic projection of the motherboard 20 along the Z-direction. This allows for full utilization of the space at the bottom of the camera 30, avoids stacking the electronic device 430 and the motherboard 20 along the thickness direction of the electronic device 1000, avoids setting a no-layout area on the motherboard 20, and thus improves the space utilization of the motherboard 20 and the internal space utilization of the electronic device 1000.

[0092] In one embodiment, the electronic device 430 may be partially disposed opposite to the camera 30 along the Z direction and partially disposed opposite to the motherboard 20 along the Z direction. In this case, the area of ​​the restricted area on the motherboard 20 can be reduced, thereby improving the space utilization of the motherboard 20 and the utilization of the internal space of the electronic device 1000.

[0093] In one embodiment, camera 30 can also be a regular camera, such as a main camera; or camera 30 can also be an ultra-wide-angle camera. No specific limitation is made on the type of camera 30 here, as long as the electronic device 430 is at least partially positioned opposite the camera 30 along the thickness direction of the electronic device 1000.

[0094] The above are merely some embodiments and implementation methods of this application. The scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electronic device, characterized in that, include: Housing, motherboard, camera, display panel, and electronic components; The display panel includes a display surface and a non-display surface, which are arranged opposite to each other along the thickness direction of the display panel; the display panel is disposed on one side of the thickness direction of the housing and connected to the housing, and a receiving cavity is formed between the display panel and the housing, with the non-display surface located within the receiving cavity; Both the motherboard and the camera are housed within the receiving cavity and are fixedly connected to the housing. Along the thickness direction of the electronic device, the camera and the motherboard are at least partially offset. The electronic device is disposed on the non-display surface and electrically connected to the display panel. Along the thickness direction of the electronic device, the electronic device is at least partially disposed opposite to the camera and at least partially disposed offset from the motherboard.

2. The electronic device according to claim 1, characterized in that, Along the thickness direction of the electronic device, the projection of the electronic device is completely located within the projection of the camera, and the projection of the electronic device is completely misaligned with the projection of the motherboard.

3. The electronic device according to claim 1 or 2, characterized in that, The motherboard has a clearance hole that extends through the motherboard along its thickness direction, and the camera is at least partially located within the clearance hole.

4. The electronic device according to claim 3, characterized in that, The camera is a periscope camera, which includes a driver, a substrate, and a sensor. The substrate is connected to the driver along a first direction, and the thickness direction of the substrate is parallel to the first direction. The sensor is disposed on the substrate and electrically connected to the motherboard. The electronic device is disposed opposite to the driver along the thickness direction of the electronic device. The first direction is perpendicular to the thickness direction of the electronic device.

5. The electronic device according to claim 4, characterized in that, Along the thickness direction of the electronic device and toward the display panel, the substrate protrudes from the driving member; along the thickness direction of the electronic device, the electronic component is disposed opposite to the driving member; along the first direction, the projection of the electronic component at least partially coincides with the projection of the substrate.

6. The electronic device according to claim 4, characterized in that, The camera also includes a prism and a lens assembly, which are arranged side by side within the driving component, with the lens assembly located between the prism and the substrate; The camera is also provided with a light inlet, which is located on one side of the camera in the height direction and is positioned opposite to the prism.

7. The electronic device according to any one of claims 4 to 6, characterized in that, The driving component has a groove on its surface facing the display panel; The electronic device includes a body and a protrusion. The protrusion is disposed on the surface of the body facing away from the display panel and protrudes from the body in a direction away from the display panel. The protrusion and the groove are disposed opposite to each other along the thickness direction of the electronic device, and the protrusion is at least partially located within the groove.

8. The electronic device according to any one of claims 4 to 6, characterized in that, The surface of the driving component facing the display panel includes a flat area and a recessed area, wherein the recessed area is recessed into the camera relative to the flat area, forming a groove; The electronic device comprises multiple components, two of which are designated as a first electronic device and a second electronic device; along the thickness direction of the electronic device and towards the camera, the second electronic device protrudes from the first electronic device. Along the thickness direction of the electronic device, the first electronic device is disposed opposite to the flat area, the second electronic device is disposed opposite to the recessed area, and the second electronic device is at least partially located within the groove.

9. The electronic device according to claim 1, characterized in that, The display panel further includes a display section and a connecting section. The display surface and the non-display surface are arranged opposite to each other along the thickness direction of the display section. The connecting section is located on the non-display surface and is connected to the display section. The electronic device further includes a connection circuit board, which is disposed on the non-display surface and adjacent to the connection portion, and the connection circuit board is electrically connected to the connection portion; The electronic device is located on the side of the connecting circuit board facing away from the display section and is electrically connected to the connecting circuit board.

10. The electronic device according to claim 9, characterized in that, The electronic device further includes a first body, a second body, and a rotating shaft mechanism. The first body and the second body are respectively connected to opposite sides of the rotating shaft mechanism in the width direction and are rotatable relative to the rotating shaft mechanism. The first body includes the housing. The display unit includes a first display portion, a second display portion, and a flexible portion. The first display portion is mounted on the first main body, and the second display portion is mounted on the second main body. The flexible portion is disposed opposite to the rotating shaft mechanism. The connecting portion, the connecting circuit board, and the electronic device are all disposed between the first display portion and the first main body, and the connecting portion is connected to the end of the first display portion away from the second display portion.

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