A graphite coating based microcontroller heat sink

Abstract

This invention relates to the field of heat sink technology and discloses a microcontroller heat sink based on a graphite coating. The heat sink includes a base for supporting the microcontroller, with an internal cavity; a heat sink base plate disposed within the cavity, the outer surface of which is coated with a graphite coating; and several sets of heat sink tiles disposed within the cavity. Each set of heat sink tiles comprises multiple tiles arranged radially along the diameter of the heat sink base plate. These multiple heat sink tiles are designed to be movable along the diameter of the heat sink base plate. This invention utilizes an adjustable spacing between adjacent heat sink tiles, allowing the device to adjust the spacing in real time according to the temperature of the fluid being measured. This alters the heat dissipation efficiency of the heat sink tiles, enabling the microcontroller to operate normally in low-temperature environments. Furthermore, this adjustment method is simple and requires no manual intervention.

Description

Technical Field

[0001] This invention relates to the field of heat sink technology, and more particularly to a microcontroller heat sink based on a graphite coating. Background Technology

[0002] A target flow meter is an instrument that uses fluid momentum to drive a target plate (baffle) to generate mechanical displacement, which is then converted into an electrical signal by a force or displacement sensor to measure the flow rate. It falls under category G01F1 / 20, which covers devices that measure flow rate using the movement of mechanical parts. In industries such as chemical, metallurgical, and energy, it is often necessary to measure the flow rate of high-temperature gases (e.g., hot blast furnace exhaust gas, high-temperature flue gas, hot air, etc.). In such applications, the heat from the high-temperature gas is continuously conducted to the flow meter's signal processing unit through the measuring pipe wall, target rod, and connecting parts, especially the electronic compartment where the microcontroller (MCU) is located, causing a rapid increase in the microcontroller's temperature. If heat dissipation is insufficient, the microcontroller will overheat, resulting in signal drift, decreased accuracy, or even permanent damage.

[0003] To address this issue, existing technologies typically employ a heat sink between the microcontroller and high-temperature components, utilizing highly thermally conductive materials to rapidly transfer heat to the external environment, thus protecting the microcontroller. Graphite-coated heat sinks, due to their lightweight, high thermal conductivity, and excellent heat dissipation capabilities, are a common choice, effectively preventing the heat from high-temperature gases from being conducted into the microcontroller. However, in many practical applications, the ambient temperature of the flow meter is extremely low. For example, outdoor pipelines installed in frigid regions, high-altitude open-air pipelines, or equipment operating in winter may experience ambient temperatures as low as -40°C or even lower. In such cases, the high thermal conductivity of the heat sink becomes a disadvantage: it not only dissipates the heat from the high-temperature gases but also excessively dissipates the small amount of heat generated by the microcontroller itself, leading to excessively low internal temperatures. When the temperature falls below the microcontroller's rated operating range (e.g., -40°C or -20°C), serious problems such as crystal oscillator failure, data storage errors, sluggish display response, or even failure to start may occur. In other words, when the ambient temperature is very low, a certain amount of heat conduction to the microcontroller's interior is necessary to prevent its internal temperature from becoming too low.

[0004] Existing technologies offer two main solutions to this problem. One is an active temperature control scheme, which adds temperature sensors and electric heating elements to the electronic compartment. A microcontroller monitors its own temperature and controls the heaters for compensation. While this scheme can actively control the temperature, it increases the complexity of the electronic system, power consumption, and potential for failure, and is limited in applications with high intrinsic safety requirements. The other is a mechanical replacement scheme, where heat sinks with different thermal conductivity coefficients are manually replaced according to different seasons or operating conditions. This method is not only inconvenient to operate but also cannot adapt to rapid fluctuations in intraday temperature differences or gas temperature, making continuous self-adaptation difficult. Summary of the Invention

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a microcontroller heat sink based on a graphite coating.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: A microcontroller heat sink based on a graphite coating, comprising: A base for supporting the microcontroller, and the base has an internal cavity for receiving it; A heat dissipation base plate is disposed inside the receiving cavity, and the outer surface of the heat dissipation base plate is coated with a graphite coating. Several sets of heat dissipation tiles are disposed inside the receiving cavity. Each set of heat dissipation tiles includes multiple heat dissipation tiles and is arranged radially along the diameter direction of the heat dissipation base plate. Each set of multiple heat dissipation tiles is configured to be movable along the diameter direction of the heat dissipation base plate. An adjustable gap is provided between two adjacent heat dissipation tiles. When the heat dissipation tiles move along the diameter direction of the heat dissipation base plate, the gap size can be changed. The lower surface of the heat dissipation tile is flush with the upper surface of the heat dissipation base plate, and the outer surface of the heat dissipation tile is coated with a graphite coating.

[0007] As a further embodiment of the present invention, the outer surface of the heat dissipation tile is provided with a notch, a rod is provided at the top of the heat dissipation tile, the microcontroller is provided at the top of the rod, a plurality of heat-conducting rods are provided on the outer surface of the rod, the heat-conducting rods are provided inside the notch, and the outer surface of the heat-conducting rods is flush with the inner wall of the notch, and the other end of the heat-conducting rods is fixedly connected to the outer surface of the base.

[0008] As a further embodiment of the present invention, a plurality of through slots are equidistantly provided on the upper surface of the heat dissipation base plate in the circumferential direction, and a block is provided on the lower surface of the heat dissipation tile. The block is disposed inside the through slot and can slide along the inner wall of the through slot. Limiting slots are symmetrically provided on the inner walls of the through slots on opposite sides. Two protrusions are symmetrically provided on the outer surface of the block. The protrusions are matched with the limiting slots and are disposed inside the limiting slots.

[0009] As a further embodiment of the present invention, a first plate is provided inside the base receiving cavity. The first plate is located at the bottom of the heat dissipation base plate. The first plate is configured to rotate around the center of the heat dissipation base plate. Multiple sets of guide grooves are formed on the outer surface of the first plate. Each set of guide grooves includes multiple guide grooves. A guide post is provided at the bottom of the block. The guide post is slidably installed with the inner wall of the guide groove.

[0010] As a further embodiment of the present invention, the outer surface of the first plate is provided with a plurality of openings, the interior of the base receiving cavity is provided with a second cylinder, a piston rod is slidably mounted on the inner wall of the second cylinder, one end of the piston rod is rotatably connected to the outer surface of the first plate, and one end of the second cylinder is rotatably connected to the lower surface of the heat dissipation base plate.

[0011] As a further embodiment of the present invention, a third cylinder is fixedly installed on the lower surface of the base, a connecting pipe is fixedly connected to the top end of the third cylinder, the other end of the connecting pipe passes through the inner wall of the base and is fixedly connected to the second cylinder, the third cylinder is connected to the second cylinder through the connecting pipe, the interior of the third cylinder, the connecting pipe and the second cylinder is filled with hydraulic oil, and a first piston is slidably installed on the inner wall of the third cylinder, the first piston being configured to move along the central axis of the third cylinder.

[0012] As a further embodiment of the present invention, a second plate is fixedly installed at the bottom end of the rod through the lower surface of the base, a first cylinder is fixedly connected to one end of the second plate, a second piston is slidably installed on the inner wall of the first cylinder, a first rod is fixedly connected to the top end of the second piston, and the top end of the first rod is fixedly connected to the lower surface of the first piston.

[0013] As a further embodiment of the present invention, a round rod is provided at the bottom end of the rod body, and a baffle is fixedly connected to the bottom end of the round rod. A through hole is provided on the outer surface of the second plate body, and a rotating arm is provided at the bottom of the second plate body. A rotating shaft is provided at one end of the rotating arm, and the rotating shaft is rotatably installed with the through hole. A slot is provided at the bottom end of the rotating arm, and the round rod is disposed between the inner walls of the slot.

[0014] As a further embodiment of the present invention, a second rod is fixedly connected to the bottom end of the second piston, and a drive rod is fixedly connected to the bottom end of the second rod through the outer surface of the first cylinder. A drive column is provided at one end of the drive rod, and a drive groove is opened on the outer surface of the rotating arm. The drive column is slidably installed with the inner wall of the drive groove.

[0015] As a further embodiment of the present invention, the guide groove is composed of an inclined groove and an arc-shaped groove. The arc-shaped groove is disposed at one end of the guide groove near the rod body. The arc-shaped groove and the heat dissipation base plate are located at the same center. A group of multiple guide grooves are arranged radially along the diameter direction of the heat dissipation base plate.

[0016] This invention features an adjustable spacing between adjacent heat dissipation tiles, allowing the device to adjust the spacing in real time according to the temperature of the fluid being measured. This alters the heat dissipation efficiency of the tiles, enabling the microcontroller to operate normally in low-temperature environments. Furthermore, this adjustment method is simple and requires no manual intervention. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of a microcontroller heat sink based on a graphite coating proposed in this invention. Figure 2 This is a bottom view of the structure of a microcontroller heat sink based on a graphite coating proposed in this invention. Figure 3 This is a schematic diagram of the base of a microcontroller heat sink based on a graphite coating proposed in this invention. Figure 4 This is a partial cross-sectional schematic diagram of the base of a microcontroller heat sink based on a graphite coating proposed in this invention. Figure 5 This is a cross-sectional view of the base structure of a microcontroller heat sink based on a graphite coating proposed in this invention. Figure 6 This is a schematic diagram of a heat dissipation base plate for a microcontroller heat sink based on a graphite coating proposed in this invention. Figure 7 This is a schematic diagram of the first plate body of a microcontroller heat sink based on a graphite coating proposed in this invention. Figure 8 This is a schematic diagram of the second plate of a microcontroller heat sink based on a graphite coating proposed in this invention. Figure 9 This is a schematic diagram of the rotating arm of a microcontroller heat sink based on a graphite coating proposed in this invention. Figure 10 This is a schematic diagram of a heat dissipation tile for a microcontroller heat sink based on a graphite coating, as proposed in this invention.

[0018] In the diagram: 100, base; 200, rod; 210, heat-conducting rod; 300, heat dissipation plate; 310, block; 311, protrusion; 320, notch; 330, guide post; 400, baffle plate; 500, heat dissipation base plate; 510, through groove; 511, limiting groove; 600, first plate; 610, guide groove; 700, first cylinder; 800, second plate; 810, through hole; 900, Second cylinder; 910, Piston rod; 1000, Third cylinder; 1010, Connecting pipe; 1100, First rod; 1110, First piston; 1120, Second piston; 1200, Rotating arm; 1210, Slot; 1220, Drive slot; 1230, Rotating shaft; 1300, Second rod; 1400, Drive rod; 1410, Drive column. Detailed Implementation

[0019] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0020] In the description of this invention, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0021] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0022] In order to enable the internal temperature of the microcontroller to be adjusted in real time according to the ambient temperature, such as Figure 1 and Figure 2 As shown, this invention proposes a microcontroller heat sink based on a graphite coating, comprising: a base 100, a heat sink base plate 500, and several sets of heat sink tiles 300. Specifically, the base 100 is used to support the microcontroller, and the base 100 has an internal cavity. The heat sink base plate 500 is disposed inside the cavity. In this embodiment, the heat sink base plate 500 is circular, and several sets of heat sink tiles 300 are disposed inside the cavity, such as... Figure 3As shown, a set of heat dissipation tiles 300 includes multiple heat dissipation tiles 300, which are radially arranged along the diameter direction of the heat dissipation base plate 500. The multiple heat dissipation tiles 300 form a structure similar to heat dissipation fins on the surface of the heat dissipation base plate 500, allowing the heat dissipation tiles 300 to dissipate absorbed heat through heat exchange with the surrounding air. To improve the efficiency of heat exchange between the heat dissipation tiles 300 and the surrounding air, such as... Figure 3 As shown, a group of multiple heat dissipation tiles 300 are configured to move along the diameter of the heat dissipation base plate 500. An adjustable gap is provided between adjacent heat dissipation tiles 300. When the heat dissipation tiles 300 move along the diameter of the heat dissipation base plate 500, the gap size can be changed. When a group of multiple heat dissipation tiles 300 moves in a direction away from the center of the heat dissipation base plate 500, the gap between adjacent heat dissipation tiles 300 becomes smaller, and their thermal boundary layers will overlap each other, blocking the air channel in the middle and forming a slow-flowing "hot air cushion". Since cold air cannot enter to replenish the heat, the heat cannot be carried away, and the heat dissipation efficiency naturally drops significantly. Conversely, when a group of multiple heat dissipation tiles 300 move along the direction close to the center of the heat dissipation base plate 500, the distance between two adjacent heat dissipation tiles 300 increases, the airflow is smooth, and the heat dissipation efficiency is greatly improved. Through this setting, the device can adjust the distance between the heat dissipation tiles 300 in real time according to the temperature of the fluid being measured (how to adjust it is detailed below), thereby changing the heat dissipation efficiency of the heat dissipation tiles 300, so that the microcontroller can be used normally in low temperature environments. Moreover, this adjustment method is simple and does not require manual intervention.

[0023] It should be noted that this device cannot use a fan for cooling, because the vibration and noise from a fan are too great and will affect the normal operation of the crystal oscillator inside the microcontroller; in this embodiment, the ideal spacing between the heat dissipation tiles 300 is between 4 mm and 10 mm.

[0024] In this embodiment, in order to achieve better heat dissipation, the lower surface of the heat dissipation tile 300 is flush with the upper surface of the heat dissipation base plate 500, and the outer surface of the heat dissipation base plate 500 is coated with a graphite coating. The outer surface of the heat dissipation tile 300 is also coated with a graphite coating with a thickness of 25μm, thereby ensuring good thermal conductivity between the heat dissipation base plate 500 and the heat dissipation tile 300.

[0025] In this embodiment, to dissipate heat from the microcontroller, such as... Figure 1As shown, the outer surface of the heat dissipation tile 300 has a notch 320, and a rod 200 is provided on the top of the heat dissipation tile 300. The microcontroller is located at the top of the rod 200. Multiple heat-conducting rods 210 are provided on the outer surface of the rod 200. The heat-conducting rods 210 are located inside the notch 320, and the outer surface of the heat-conducting rods 210 is flush with the inner wall of the notch 320. The other end of the heat-conducting rods 210 is fixedly connected to the outer surface of the base 100. When the rod 200 receives heat from the fluid, the heat is conducted to each heat dissipation tile 300 through the heat-conducting rods 210, so that the heat is dissipated through the heat dissipation tile 300, thereby completing the heat dissipation function.

[0026] In this embodiment, in order to limit the installation position and movement direction of the heat dissipation tile 300 on the heat dissipation base plate 500, such as Figure 4 and Figure 10 As shown, the upper surface of the heat dissipation base plate 500 is provided with multiple through slots 510 at equal intervals in the circumferential direction, and the lower surface of the heat dissipation tile 300 is provided with a block 310. The block 310 is disposed inside the through slot 510 and can slide along the inner wall of the through slot 510. The cooperation between the through slot 510 and the block 310 restricts the movement of the heat dissipation tile 300 to only along the diameter direction of the heat dissipation base plate 500. It should be noted that in order for the heat dissipation tile 300 to move correctly, the central axis of the heat conduction rod 210 is located in the same plane as the diameter of the heat dissipation base plate 500, and this plane is perpendicular to the upper surface of the heat dissipation base plate 500.

[0027] In order to prevent the heat dissipation tiles from moving up and down, such as Figure 4 As shown, the through groove 510 has symmetrically formed limiting grooves 511 on its inner walls on both sides, such as... Figure 10 As shown, two protrusions 311 are symmetrically provided on the outer surface of the block 310. The protrusions 311 are matched with the limiting groove 511. The protrusions 311 are located inside the limiting groove 511. Through the cooperation between the protrusions 311 and the limiting groove 511, the heat dissipation tile 300 is restricted from moving up and down.

[0028] In this embodiment, in order to move the heat dissipation tiles 300 along the diameter direction of the heat dissipation base plate 500, such as... Figure 5 and Figure 6 As shown, a first plate 600 is disposed inside the cavity of the base 100. The first plate 600 is disposed at the bottom of the heat dissipation base plate 500. The first plate 600 is configured to rotate about the center of the heat dissipation base plate 500. Figure 7 As shown, the outer surface of the first plate 600 has multiple sets of guide grooves 610, and each set of guide grooves 610 includes multiple guide grooves 610, such as... Figure 10As shown, a guide post 330 is provided at the bottom of the block 310. The guide post 330 is slidably installed on the inner wall of the guide groove 610. The guide groove 610 is composed of an inclined groove and an arc groove. The arc groove is provided at one end of the guide groove 610 near the rod 200. The arc groove and the heat dissipation base plate 500 are located at the same center. A group of multiple guide grooves 610 are arranged radially along the diameter direction of the heat dissipation base plate 500. When the first plate 600 rotates, it will drive the guide groove 610 to rotate around the center of the heat dissipation base plate 500. Through the cooperation of the guide groove 610 and the guide post 330, the heat dissipation tile 300 is driven to move along the diameter direction of the heat dissipation base plate 500, thereby changing the spacing between two adjacent heat dissipation tiles 300.

[0029] It should be noted that in this embodiment, the guide grooves 610 are arranged radially along the diameter of the heat dissipation base plate 500. Multiple guide grooves 610 are distributed outward from the center of the heat dissipation base plate 500, and the parameters of each guide groove 610 are set individually (i.e., the angle of the inclined groove is different). The rotation angle of the first plate 600 is larger when the temperature of the fluid being measured is higher. At this time, multiple heat dissipation tiles 300 unfold sequentially towards the center of the heat dissipation base plate 500, similar to a telescopic structure. The higher the temperature, the more heat dissipation tiles 300 unfold. This setting allows the heat dissipation tiles 300 to be adjusted more precisely according to the changes in fluid temperature, thereby ensuring that the microcontroller can work within a very small temperature fluctuation range and ensuring the accuracy of the measurement.

[0030] In this embodiment, in order to drive the first plate 600 to rotate, such as Figure 7 and Figure 8 As shown, the outer surface of the first plate 600 has multiple openings. The interior of the accommodating cavity of the base 100 contains a second cylinder 900. A piston rod 910 is slidably mounted on the inner wall of the second cylinder 900. One end of the piston rod 910 is rotatably connected to the outer surface of the first plate 600, and the other end of the second cylinder 900 is rotatably connected to the lower surface of the heat dissipation base plate 500. In actual use, when the piston rod 910 extends out of the second cylinder 900, it pushes the first plate 600 to rotate in the forward direction, thereby causing multiple heat dissipation tiles 300 to extend one by one through the cooperation of the guide groove 610 and the guide post 330. Conversely, when the piston rod 910 retracts into the second cylinder 900, it pulls the first plate 600 to rotate in the reverse direction. At this time, multiple heat dissipation tiles 300 retract one by one through the cooperation of the guide groove 610 and the guide post 330, thereby changing the spacing between the heat dissipation tiles 300.

[0031] In this embodiment, in order to drive the piston rod 910 to extend or retract the second cylinder 900, such as Figure 7 and Figure 8As shown, a third cylinder 1000 is fixedly installed on the lower surface of the base 100. A connecting pipe 1010 is fixedly connected to the top of the third cylinder 1000. The other end of the connecting pipe 1010 passes through the inner wall of the base 100 and is fixedly connected to the second cylinder 900. The third cylinder 1000 is connected to the second cylinder 900 through the connecting pipe 1010. The interiors of the third cylinder 1000, the connecting pipe 1010, and the second cylinder 900 are filled with hydraulic oil. A first piston 1110 is slidably installed on the inner wall of the third cylinder 1000. The first piston 1110 is configured to move along the central axis of the third cylinder 1000. When the first piston 1110 moves upward, it will press the hydraulic oil from the connecting pipe 1010 into the interior of the second cylinder 900, thereby driving the piston rod 910 to extend out of the second cylinder 900. Conversely, when the first piston 1110 moves downward, it will drive the piston rod 910 to retract into the second cylinder 900.

[0032] In order for the first piston 1110 to move according to the fluid temperature, that is, to move upward when the temperature is high and downward when the temperature is low, such as... Figure 8 As shown, the bottom end of the rod 200 passes through the lower surface of the base 100 and is fixedly installed with a second plate 800. One end of the second plate 800 is fixedly connected to a first cylinder 700. A second piston 1120 is slidably installed on the inner wall of the first cylinder 700. The top end of the second piston 1120 is fixedly connected to a first rod 1100. The top end of the first rod 1100 is fixedly connected to the lower surface of the first piston 1110. A cavity is formed between the second piston 1120 and the inner wall of the bottom end of the first cylinder 700. The cavity is filled with helium. In use, the device is fixed to the pipeline valve through the base 100. At this time, the second piston 1120 is inside the pipeline valve and can be directly heated by the heat of the fluid. Then, the helium expands due to heat, causing the second piston 1120 to move upward. When the temperature drops, the helium contracts, causing the second piston 1120 to move downward, thereby causing the first piston 1110 to move.

[0033] In this embodiment, to enable fluid flow measurement, a round rod is provided at the bottom end of the rod body 200. The round rod is connected to a sensor inside the microcontroller. A baffle 400 is fixedly connected to the bottom end of the round rod. The baffle 400 is located inside the fluid during use, and flow measurement is performed based on the principle of a target flow meter. Because the temperature of the fluid inside the pipe is initially unstable and may be lower than the minimum temperature of the device, if the fluid's flow rate is low, it may cause excessive resistance to the baffle 400, damaging the sensor and affecting subsequent measurement work. To solve this problem, a through hole 810 is provided on the outer surface of the second plate body 800. The bottom of the second plate 800 is provided with a rotating arm 1200, and one end of the rotating arm 1200 is provided with a rotating shaft 1230. The rotating shaft 1230 is rotatably installed with the through hole 810. The bottom end of the rotating arm 1200 is provided with a slot 1210. The round rod is disposed between the inner walls of the slot 1210. When the slot 1210 is tilted, that is, when the plane where the slot 1210 is located makes an angle of 75° with the round rod, the slot 1210 is a circular hole when viewed along the central axis of the round rod. The size matches the round rod. The round rod is restricted by this slot 1210 to avoid the round rod bearing large fluid resistance when the temperature is low.

[0034] In order to allow the slot 1210 to release the constraint on the round rod when the temperature reaches the standard, such as Figure 6 , Figure 8 and Figure 9 As shown, a second rod 1300 is fixedly connected to the bottom end of the second piston 1120. A drive rod 1400 is fixedly connected to the bottom end of the second rod 1300, penetrating the outer surface of the first cylinder 700. A drive column 1410 is provided at one end of the drive rod 1400. A drive groove 1220 is formed on the outer surface of the rotating arm 1200. The drive column 1410 is slidably installed with the inner wall of the drive groove 1220. When the temperature is sufficient, the second piston 1120 moves upward, driving the drive rod 1400 upward via the second rod 1300. At this time, the rotating arm 1200 rotates upward through the cooperation of the drive groove 1220 and the drive column 1410. The slot 1210 gradually becomes horizontal with the round rod. From the direction of the central axis of the round rod, the slot 1210 appears as an oblong groove, allowing the round rod to swing due to fluid resistance, thus completing normal flow measurement. It should be noted that the shape of the drive groove 1220 is as follows... Figure 9 As shown, ensure that the card slot 1210 can perform the above functions normally.

[0035] In this embodiment, in order for the first plate 600 to be installed normally, such as Figure 5As shown, a hollow column is provided at the center of the first plate 600. The first plate 600 is rotatably installed in the receiving cavity of the base 100 through the hollow column. The hollow column passes through the outer surface of the base 100 and the heat dissipation base plate 500. The heat dissipation base plate 500 is fixedly installed in the receiving cavity of the base 100.

[0036] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed invention.

Claims

1. A microcontroller heat sink based on a graphite coating, characterized in that, include: A base (100) is used to support the microcontroller, and the base (100) has an internal cavity for receiving the microcontroller; A heat dissipation base plate (500) is disposed inside the receiving cavity, and the outer surface of the heat dissipation base plate (500) is coated with a graphite coating; Several sets of heat dissipation tiles (300) are disposed inside the receiving cavity. Each set of heat dissipation tiles (300) includes multiple heat dissipation tiles (300) and is radially arranged along the diameter direction of the heat dissipation base plate (500). Each set of multiple heat dissipation tiles (300) is configured to be movable along the diameter direction of the heat dissipation base plate (500). An adjustable spacing is provided between two adjacent heat dissipation tiles (300). When the heat dissipation tiles (300) move along the diameter direction of the heat dissipation base plate (500), the spacing can be changed. The lower surface of the heat dissipation tile (300) is flush with the upper surface of the heat dissipation base plate (500), and the outer surface of the heat dissipation tile (300) is coated with a graphite coating.

2. The microcontroller heat sink based on graphite coating according to claim 1, characterized in that, The outer surface of the heat dissipation tile (300) has a notch (320), and a rod (200) is provided on the top of the heat dissipation tile (300). The microcontroller is located at the top of the rod (200). Multiple heat-conducting rods (210) are provided on the outer surface of the rod (200). The heat-conducting rods (210) are located inside the notch (320), and the outer surface of the heat-conducting rods (210) is flush with the inner wall of the notch (320). The other end of the heat-conducting rods (210) is fixedly connected to the outer surface of the base (100).

3. The microcontroller heat sink based on graphite coating according to claim 2, characterized in that, The upper surface of the heat dissipation base plate (500) is provided with a plurality of through slots (510) at equal intervals in the circumferential direction. The lower surface of the heat dissipation tile (300) is provided with a block (310). The block (310) is disposed inside the through slot (510) and can slide along the inner wall of the through slot (510). The inner walls of the through slot (510) on both sides are symmetrically provided with limiting slots (511). The outer surface of the block (310) is symmetrically provided with two protrusions (311). The protrusions (311) are matched with the limiting slots (511) and are disposed inside the limiting slots (511).

4. The microcontroller heat sink based on graphite coating according to claim 3, characterized in that, The base (100) has a first plate (600) inside its cavity. The first plate (600) is located at the bottom of the heat dissipation base plate (500). The first plate (600) is configured to rotate about the center of the heat dissipation base plate (500). The outer surface of the first plate (600) has multiple guide grooves (610). Each guide groove (610) contains multiple guide grooves (610). The bottom of the block (310) has a guide post (330). The guide post (330) is slidably installed on the inner wall of the guide groove (610).

5. The microcontroller heat sink based on graphite coating according to claim 4, characterized in that, The outer surface of the first plate (600) has multiple openings. The interior of the cavity of the base (100) is provided with a second cylinder (900). A piston rod (910) is slidably installed on the inner wall of the second cylinder (900). One end of the piston rod (910) is rotatably connected to the outer surface of the first plate (600), and one end of the second cylinder (900) is rotatably connected to the lower surface of the heat dissipation base plate (500).

6. The microcontroller heat sink based on graphite coating according to claim 5, characterized in that, A third cylinder (1000) is fixedly installed on the lower surface of the base (100). A connecting pipe (1010) is fixedly connected to the top of the third cylinder (1000). The other end of the connecting pipe (1010) passes through the inner wall of the base (100) and is fixedly connected to the second cylinder (900). The third cylinder (1000) is connected to the second cylinder (900) through the connecting pipe (1010). The interiors of the third cylinder (1000), the connecting pipe (1010), and the second cylinder (900) are filled with hydraulic oil. A first piston (1110) is slidably installed on the inner wall of the third cylinder (1000). The first piston (1110) is configured to move along the central axis of the third cylinder (1000).

7. The microcontroller heat sink based on graphite coating according to claim 6, characterized in that, The bottom end of the rod (200) is fixedly installed through the lower surface of the base (100) with a second plate (800). One end of the second plate (800) is fixedly connected to a first cylinder (700). A second piston (1120) is slidably installed on the inner wall of the first cylinder (700). The top end of the second piston (1120) is fixedly connected to a first rod (1100). The top end of the first rod (1100) is fixedly connected to the lower surface of the first piston (1110).

8. The microcontroller heat sink based on graphite coating according to claim 7, characterized in that, The bottom end of the rod body (200) is provided with a round rod, and the bottom end of the round rod is fixedly connected with a baffle (400). The outer surface of the second plate body (800) is provided with a through hole (810). The bottom of the second plate body (800) is provided with a rotating arm (1200). One end of the rotating arm (1200) is provided with a rotating shaft (1230). The rotating shaft (1230) is rotatably installed with the through hole (810). The bottom end of the rotating arm (1200) is provided with a slot (1210). The round rod is disposed between the inner walls of the slot (1210).

9. The microcontroller heat sink based on graphite coating according to claim 8, characterized in that, The bottom end of the second piston (1120) is fixedly connected to a second rod (1300). The bottom end of the second rod (1300) passes through the outer surface of the first cylinder (700) and is fixedly connected to a drive rod (1400). One end of the drive rod (1400) is provided with a drive column (1410). The outer surface of the rotating arm (1200) is provided with a drive groove (1220). The drive column (1410) is slidably installed on the inner wall of the drive groove (1220).

10. The microcontroller heat sink based on graphite coating according to claim 4, characterized in that, The guide groove (610) is composed of an inclined groove and an arc groove. The arc groove is located at one end of the guide groove (610) near the rod body (200). The arc groove and the heat dissipation base plate (500) are located at the same center. A group of multiple guide grooves (610) are arranged radially along the diameter direction of the heat dissipation base plate (500).

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