Opto-coupler and method of manufacturing an opto-coupler

Abstract

This application relates to the field of optocoupler manufacturing technology, specifically to an optocoupler and a method for manufacturing an optocoupler. The optocoupler includes a first bracket, a second bracket, a light-emitting chip, and a light-receiving chip. The light-emitting chip is mounted on the first bracket, and the light-receiving chip is mounted on the second bracket. Protective adhesive covers the light-emitting chip and / or the light-receiving chip. An insulating retainer is connected between the first bracket and the second bracket to maintain their positions. The light-emitting chip, the light-receiving chip, the protective adhesive, and the insulating retainer are located inside a housing. The housing is opaque, and the hardness of the protective adhesive is less than that of the housing. By connecting the insulating retainer, the relative displacement of the first bracket and the second bracket is increased, improving the quality of the optocoupler. Furthermore, the use of ovens and wire bonding equipment can be reduced during the installation of the light-emitting chip and the light-receiving chip, thereby lowering the manufacturing cost of the optocoupler.

Description

Technical Field

[0001] This invention relates to the field of optocoupler manufacturing technology, and specifically to an optocoupler and a method for manufacturing an optocoupler. Background Technology

[0002] An optocoupler is a semiconductor device that transmits electrical signals using light as a medium. It consists of a light source (input terminal, with a light-emitting chip), a light receiver (output terminal, with a light-receiving chip), and an isolation medium. The light source and light receiver are encapsulated in the same sealed housing, separated by a transparent insulating material to ensure electrical insulation. During operation, an electrical signal (such as voltage or current) is applied to the input terminal, driving the light-emitting chip to emit light, forming an optical signal. The light receiver receives the optical signal and generates a photocurrent, forming the output signal.

[0003] Traditional optocouplers, constrained by their structure, suffer from several problems in their manufacturing processes: First, material flow during molding can easily cause relative movement between the light-emitting and light-receiving chips, affecting product precision. Second, the mold cavity's venting structure during molding can easily create pores and voids in the package, leading to a drop in isolation voltage (and thus electrical breakdown). Third, the passivation layer on the chip surface is susceptible to cracking due to stress during the curing process of the epoxy molding compound. Fourth, the traditional molding process involves two steps (molding white glue and molding black glue), resulting in poor process continuity, affecting the consistency of batch products, and increasing production costs. Fifth, the large difference in the coefficients of thermal expansion between the white and black glue during molding can easily cause delamination between them, affecting product quality. Summary of the Invention

[0004] The present invention provides an optocoupler for solving at least one of the above-mentioned technical problems; the present invention also provides a method for manufacturing an optocoupler as described above.

[0005] To achieve one of the above objectives, some embodiments of this application provide an optocoupler, including: First support; A light-emitting chip, which is mounted on the first bracket and can emit light when powered; The second support has an insulating gap with the first support; A light-receiving chip is mounted on the second bracket and is capable of receiving light and generating current. A protective adhesive, which encapsulates the light-emitting chip and / or the light-receiving chip; An insulating retainer is provided, which is connected between the first bracket and the second bracket, so that the first bracket and the second bracket can be held in position by means of the insulating retainer during the manufacturing process of the optocoupler; The light-emitting chip, the light-receiving chip, the protective adhesive, and the insulating retainer are located inside the outer casing, which is an opaque shell. The hardness of the protective adhesive is less than that of the outer shell.

[0006] In one embodiment, the light-emitting chip has a mounting surface that mates with the first bracket, and a front light-emitting surface facing away from the mounting surface. It also has a side surface located between the front light-emitting surface and the mounting surface. The first bracket and the second bracket are arranged at intervals along the orientation direction of the side surface. The insulating retainer is an insulating plate, which is located on the side of both the first bracket and the second bracket facing away from the light-emitting chip and the light-receiving chip.

[0007] In one embodiment, the first bracket has a first enclosure structure on the side where the light-emitting chip is disposed, the first enclosure structure being located on the side of the light-emitting chip away from the light-receiving chip; the second bracket has a second enclosure structure on the side where the light-receiving chip is disposed, the second enclosure structure being located on the side of the light-receiving chip away from the light-emitting chip; the protective adhesive is filled between the first enclosure structure and the second enclosure structure, and wraps the light-emitting chip and the light-receiving chip; the protective adhesive forms a light-transmitting structure between the light-emitting chip and the light-receiving chip, and forms an insulating structure between the first bracket and the second bracket.

[0008] In one embodiment, the first bracket has a first bend that forms the first enclosure structure, and / or the second bracket has a second bend that forms the second enclosure structure.

[0009] In one embodiment, the first bracket includes a first support portion, the light-emitting chip is mounted on the first support portion, and the first bending portion is bent relative to the first support portion; the second bracket includes a second support portion, the light-receiving chip is mounted on the second support portion, and the second bending portion is bent relative to the second support portion; the first support portion is covered by the insulating plate, and the second support portion is covered by the insulating plate.

[0010] In one embodiment, the outer shell is bonded to the protective adhesive.

[0011] In one embodiment, the insulating retainer is connected to the first bracket and the second bracket by injection molding.

[0012] In one embodiment, the protective adhesive is silicone.

[0013] To achieve one of the above objectives, some embodiments of this application provide a method for manufacturing an optocoupler, comprising the following steps: Prepare the bracket materials, which include a first bracket and a second bracket. An insulating retainer is connected between the first bracket and the second bracket to maintain their position. A light-emitting chip is installed on the first bracket of the bracket receiving material, and a light-receiving chip is installed on the second bracket; The light-emitting chip is electrically connected to the conductive structure on the first support, and the light-receiving chip is electrically connected to the conductive structure on the second support; The light-emitting chip and / or the light-receiving chip are coated with silicone, and the silicone is then cured. A molded housing is used to house the light-emitting chip, the light-receiving chip, the silicone, and the insulating retainer within the housing.

[0014] In one embodiment, during the preparation of the bracket material, multiple bracket groups are formed on the same metal plate. The bracket group includes a first bracket and a second bracket. The manufacturing method of the optocoupler further includes separating the first bracket and the second bracket from the material plate after molding the shell to obtain a single optocoupler.

[0015] According to the optocoupler and its manufacturing method in the above embodiments, since an insulating retainer is connected between the first bracket and the second bracket, the position is stabilized by the insulating retainer, making the relative position between the first bracket and the second bracket more stable. This increases the difficulty of relative displacement between the first bracket and the second bracket during the manufacturing process of the optocoupler, thereby improving the quality of the optocoupler. Furthermore, since the first bracket and the second bracket are connected together to form a whole, when installing the light-emitting chip and the light-receiving chip, they can be baked and cured using a baking device, and the light-emitting chip and the light-receiving chip can be wire-bonded using a wire bonding device, thereby reducing the production cost of the optocoupler. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the optocoupler in some embodiments of this application; Figure 2 This is a schematic diagram illustrating the steps of a method for manufacturing an optocoupler in some embodiments of this application; Figure 3 This is a process flow diagram of the manufacturing method of the optocoupler in some embodiments of this application; Figure 4 This is a schematic diagram of the chip being mounted on a bracket in the manufacturing method steps of the optocoupler in some embodiments of this application; Figure 5 This is a schematic diagram of the chip connection wire structure in the manufacturing method steps of the optocoupler in some embodiments of this application; Figure 6 This is a schematic diagram of the material structure after applying protective adhesive during the manufacturing method steps of the optocoupler in some embodiments of this application; Figure 7 This is a schematic diagram of the structure after the material is encapsulated in the shell during the manufacturing method steps of the optocoupler in some embodiments of this application.

[0017] Label Explanation: Explanation of reference numerals in parentheses in the accompanying drawings: The feature referred to by the reference numerals in parentheses in the accompanying drawings is the feature represented by both the number inside the parentheses and the number outside the parentheses.

[0018] 10. First support bracket; 101. First enclosure structure; 102. First bending section; 103. First supporting section; 20. Second bracket; 201. Second enclosure structure; 202. Second bending section; 203. Second support section; 30. Light-emitting chip; 301. Main light-emitting surface; 302. Side surface; 40. Light-receiving chip; 50. Protective adhesive; 60. Insulation retainer; 70. Housing; 80. Wire; 90. Adhesive receiving area. Detailed Implementation

[0019] The present invention will now be described in further detail with reference to specific embodiments and accompanying drawings. Similar elements in different embodiments are referred to by associated similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of the invention. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to the present invention are not shown or described in the specification. This is to avoid obscuring the core parts of the invention with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0020] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for the clear description of a particular embodiment and do not imply a necessary order, unless otherwise stated that a particular order must be followed.

[0021] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this invention, unless otherwise specified, include both direct and indirect connections (linkages).

[0022] In existing optocouplers, the light-emitting chip and the light-receiving chip are arranged face-to-face. Based on this structure, during the optocoupler manufacturing stage, one type of support is formed on one metal plate, and another type of support is formed on another metal plate. Before molding the white adhesive, the metal plates with the formed supports undergo chip mounting, baking and curing, and wiring, requiring a lot of equipment. During the white adhesive molding process, the two metal plates with the two types of supports are stacked and molded with white adhesive. In this process, the relative displacement of the two types of supports is easily affected by the flow of the white adhesive material, resulting in a deviation between the designed positions of the light-emitting chip and the light-receiving chip, affecting the quality of the optocoupler.

[0023] In response, this application provides a novel optocoupler structure and a method for manufacturing such an optocoupler. Before chip installation, the two types of supports are connected to maintain their position. During the chip installation stage, only one piece of equipment is needed for both the baking and wiring processes. Furthermore, throughout the entire manufacturing process, stable positional maintenance of the two supports can be achieved, improving the positional accuracy between chips and ensuring the quality of the optocoupler.

[0024] Please refer to Figure 1 Some embodiments of this application provide an optocoupler, which includes a first support 10, a second support 20, a light-emitting chip 30, a light-receiving chip 40, a protective adhesive 50, an insulating retainer 60, and a housing 70. Those skilled in the art will recognize that the optocoupler may also include other structures and elements not shown in the figures for achieving its function.

[0025] The first bracket 10 is, but is not limited to, an IR bracket (Infrared Emitter Bracket), used to fix and mount the light-emitting chip 30 to form a signal input terminal. The second bracket 20 can be, but is not limited to, a PT bracket (Phototransistor Bracket), used to mount the light-receiving chip 40 to form a signal output terminal. The brackets serve to support the chips and hold their positions.

[0026] The light-emitting chip 30 can be, but is not limited to, an IR chip (infrared emitting chip, such as an infrared light-emitting diode), responsible for converting electrical signals into light signals. The light-receiving chip 40 can be, but is not limited to, a PT chip (photosensitive receiving chip, such as a phototransistor or photosensitive integrated circuit), responsible for receiving light signals and converting them back into electrical signals. Both the light-emitting chip 30 and the light-receiving chip 40 need to be connected to a circuit; therefore, corresponding pins are provided for the first bracket 10 and the second bracket 20. These pins are used for electrical connection with the light-emitting chip 30 and the light-receiving chip 40. The pin connected to the light-emitting chip 30 is used to transfer electrical energy to the light-emitting chip 30, causing it to emit light. The pin connected to the light-receiving chip 40 is used to output the electrical signal converted back by the light-receiving chip 40. Please refer to [reference needed]. Figure 1 In some embodiments, the light-emitting chip 30 and the light-receiving chip 40 are electrically connected to corresponding pins via wires 80. The wires 80 may be gold wires.

[0027] The first support 10 and the second support 20 need to be insulated to enable the optocoupler to withstand high voltage. For example, by setting appropriate insulation intervals and insulation isolation structures, the optocoupler can withstand 6000V high voltage.

[0028] A protective adhesive 50 encapsulates the light-emitting chip 30 and / or the light-receiving chip 40. The protective adhesive 50 can be silicone, epoxy resin, polyurethane, etc. For this purpose, the protective adhesive 50 needs to be light-transmitting, electrically insulating, and provide mechanical protection for the chip. The hardness of the protective adhesive 50 is less than that of the outer shell 70. Silicone is preferred for the protective adhesive 50 because it has good light transmittance, allowing light to pass through efficiently. At the same time, silicone has a certain degree of softness, which can absorb impact and vibration, providing mechanical protection for the chip. Silicone also has good insulating properties, improving the internal insulation performance of the optocoupler. In addition, the protective adhesive 50 can also isolate the chip from the external environment and conduct heat generated during chip operation outwards.

[0029] The insulating retainer 60 possesses inherent structural strength. Connected to the first support 10 and the second support 20, the insulating retainer 60 maintains the position between the first support 10 and the second support 20, reducing or preventing relative displacement between the light-emitting chip 30 and the light-receiving chip 40 during the optocoupler manufacturing process. Furthermore, since the first support 10 and the second support 20 are connected by the insulating retainer 60, after the light-emitting chip 30 and the light-receiving chip 40 are mounted on the first support 10 and the second support 20 respectively, they can be cured by heating using the same baking equipment (such as an oven). When connecting the wires 80, the light-emitting chip 30 and the light-receiving chip 40 can be wire-bonded using a single wire bonding machine, thus reducing the manufacturing cost of the optocoupler.

[0030] Regarding the connection method between the insulating retainer 60 and the first bracket 10 and the second bracket 20, in some embodiments, the insulating retainer 60 is connected to the first bracket 10 and the second bracket 20 by injection molding. In other embodiments, the insulating retainer 60 can be molded separately and then connected to the first bracket 10 and the second bracket 20 by assembly, such as by providing a snap-fit ​​connection structure between the insulating retainer 60 and the first bracket 10 and the second bracket 20, or by directly bonding the insulating retainer 60 to the first bracket 10 and the second bracket 20 with adhesive.

[0031] The housing 70 encapsulates the light-emitting chip 30, the light-receiving chip 40, the protective adhesive 50, and the insulating retainer 60. The housing 70 is opaque and can be made of black adhesive, so that as much light emitted by the light-emitting chip 30 as possible is received by the light-receiving chip 40.

[0032] In some embodiments, please refer to Figure 1 The light-emitting chip 30 has a mounting surface that mates with the first bracket 10, and a front-emitting light-emitting surface 301 facing away from the mounting surface. The surface of the light-emitting chip 30 located between the mounting surface and the front-emitting light-emitting surface 301 constitutes the side surface 302 of the light-emitting chip 30. The first bracket 10 and the second bracket 20 are aligned along the orientation direction of the side surface 302. Figure 1 The first support 10 and the second support 20 are arranged at intervals in the horizontal direction. That is, the first support 10 and the second support 20 are not stacked one on top of the other so that the main light-emitting surface 301 of the light-emitting chip 30 faces the light-receiving chip 40 in the traditional way, but are arranged side by side.

[0033] The insulating retainer 60 is an insulating plate located on the side of the first bracket 10 and the second bracket 20 opposite to the light-emitting chip 30 and the light-receiving chip 40. This allows for a greater connection between the insulating retainer 60 and the first bracket 10 and the second bracket 20, ensuring a more stable overall structure. Furthermore, the first bracket 10 and the second bracket 20 are arranged side-by-side, allowing them to be formed on a single raw material plate (e.g., stamped from a single metal plate). This facilitates the use of the same equipment for processing corresponding steps during the optocoupler manufacturing process. For example, during the baking and curing stage, they can be baked in a single baking machine; during the wire bonding stage, the light-emitting chip 30 and the light-receiving chip 40 can be bonded to a single wire bonding machine.

[0034] Of course, in some other embodiments, the first support 10 and the second support 20 can also be stacked vertically, so that the main light-emitting surface 301 of the light-emitting chip 30 faces the light-receiving chip 40. The insulating retainer 60 is arranged vertically between the first support 10 and the second support 20.

[0035] Traditional optocouplers use molded white adhesive as both a light transmission and insulation medium, and molded black adhesive as a shell 70 to prevent light leakage and external light interference. During actual research and development, the inventors of this application discovered that the passivation layer on the chip surface is susceptible to cracking due to stress during the curing process of the molded epoxy molding compound (EMC), affecting the quality of the optocoupler. Based on this finding, the inventors propose that, compared to the traditional method of using only a small amount of silicone for individual chips, this application uses a larger amount of protective adhesive 50 throughout the optocoupler.

[0036] Please refer to Figure 1 In some embodiments, the protective adhesive 50 simultaneously encapsulates both the light-emitting chip 30 and the light-receiving chip 40, forming a light-transmitting structure between the light-emitting chip 30 and the light-receiving chip 40, and an insulating structure between the first support 10 and the second support 20. Structurally, the first support 10 has a first enclosure structure 101 on the side where the light-receiving chip 40 is located, and the first enclosure structure 101 is located on the side of the light-emitting chip 30 away from the light-receiving chip 40. Similarly, the second support 20 has a second enclosure structure 201 on the side where the light-receiving chip 40 is located, and the second enclosure structure 201 is located on the side of the light-receiving chip 40 away from the light-emitting chip 30. An adhesive-receiving area 90 for accommodating the protective adhesive 50 is formed between the first enclosure structure 101 and the second enclosure structure 201. An insulating retainer 60 can block the insulating gap between the first support 10 and the second support 20. This allows for the application of more protective adhesive 50 during the dispensing stage to simultaneously cover both the light-emitting chip 30 and the light-receiving chip 40, achieving better buffer protection for the chips.

[0037] For the formation methods of the first enclosure structure 101 and the second enclosure structure 201, please refer to... Figure 1 In some embodiments, the first bracket 10 has a first bending portion 102 and a first support portion 103. The light-emitting chip 30 is mounted on the first support portion 103. The first bending portion 102 is bent relative to the first support portion 103 to form a first enclosure structure 101. The second bracket 20 has a second bending portion 202 and a second support portion 203. The light-receiving chip 40 is mounted on the second support portion 203. The second bending portion 202 is bent relative to the second support portion 203 to form a second enclosure structure 201. In other embodiments, the first enclosure structure 101 and the second enclosure structure 201 can also be formed by adding material to the first bracket 10 and the second bracket 20, such as welding baffles at corresponding positions on the first bracket 10 and the second bracket 20, with the baffles constituting the enclosure structure. The first enclosure structure 101 and the second enclosure structure 201 can also have different structures, such as one being formed by bending a corresponding bracket, and the other being formed by adding material to a corresponding bracket.

[0038] Please refer to Figure 1The portion of the first bracket 10 located inside the outer casing 70 is bent twice. Along the direction away from the light-emitting chip 30, the first bend forms the first enclosure structure 101, and the second bend forms a portion parallel to the first support portion 103, which extends outward from the outer casing 70. The structure of the second bracket 20 is the same.

[0039] Regarding conventional optocouplers, the inventors of this application have also discovered that the significant difference in the coefficients of thermal expansion between the white adhesive and the black adhesive can easily lead to poor bonding and delamination between them, affecting the quality of the optocoupler. To address this, the inventors propose eliminating the use of white adhesive, with the outer shell 70 directly bonded to the protective adhesive 50. The protective adhesive 50 is more easily deformable than the outer shell 70, thus preventing delamination between the two.

[0040] The outer casing 70 is typically formed using a molding process with black resin, which involves prolonged baking of the resin. The consistency and uniformity of shrinkage during the molding process of the outer casing 70 will affect its overall quality. Please refer to [reference needed]. Figure 1 In some embodiments, the first support portion 103 of the first bracket 10 is covered by an insulating retainer 60, and the second support portion 203 of the second bracket 20 is also covered by an insulating retainer 60. This prevents the corresponding portions of the housing 70 from directly contacting the first support portion 103 and the second support portion 203. The upper portion of the housing 70 is bonded to the protective adhesive 50. If the lower portion directly contacts the first support portion 103 and the second support portion 203, the metal first support portion 103 and the second support portion 203 conduct heat faster, which may cause the lower portion of the housing 70 to heat up and cool down faster than the upper portion, affecting the overall consistency of the heating and cooling of the housing 70.

[0041] Please refer to Figure 2 and Figure 3 Some embodiments of this application also provide a method for manufacturing an optocoupler, comprising the following steps: S100, Prepare the bracket material, which includes a first bracket and a second bracket. An insulating retainer is connected between the first bracket and the second bracket to maintain their position.

[0042] For the case where the first support 10 and the second support 20 are arranged side by side, multiple support groups are formed on the same metal sheet. Each support group includes the first support 10 and the second support 20. Multiple support groups can be formed by stamping on the metal sheet. Each first support 10 and second support 20 is in a cantilevered state on the stamped metal sheet. The first support 10 and the second support 20 are connected by an insulating retainer 60, ensuring that each support has a stable state, is not easily deformed, and guarantees the forming quality of the optocoupler. This also allows for the one-time manufacturing of a complete optocoupler plate.

[0043] S200, a light-emitting chip is installed on the first bracket of the bracket receiving material, and a light-receiving chip is installed on the second bracket.

[0044] Please refer to Figure 4 The light-emitting chip 30 and the light-receiving chip 40 are fixed at corresponding positions on the first bracket 10 and the second bracket 20. The first bracket 10 and the second bracket 20 are arranged side-by-side along the extension direction of the insulating plate, which avoids deformation of the brackets causing them to contact each other when the two brackets are stacked. The light-emitting chip 30 and the light-receiving chip 40 are fixed at their corresponding positions on the first bracket 10 and the second bracket 20 by die bonding. After the die bonding of the light-emitting chip 30 and the light-receiving chip 40 is completed simultaneously, they are baked. In the traditional structure where the first bracket 10 and the second bracket 20 are stacked, each bracket needs to be baked separately after die bonding. Compared with this, this application can save one baking process. In terms of equipment configuration, it can save one baking device and reduce power consumption.

[0045] S300, the light-emitting chip is electrically connected to the conductive structure on the first bracket, and the light-receiving chip is electrically connected to the conductive structure on the second bracket.

[0046] Please refer to Figure 5 The wires 80 of the light-emitting chip 30 and the light-receiving chip 40 can be soldered using a wire bonding machine. A single wire bonding machine can be used to bond the wires to both the light-emitting chip 30 and the light-receiving chip 40. This reduces the need for wire bonding machines and also reduces power consumption.

[0047] S400, apply silicone to the light-emitting chip and / or the light-receiving chip, and then cure the silicone.

[0048] Please refer to Figure 6 This step involves applying a protective adhesive 50 to both the light-emitting chip 30 and the light-receiving chip 40. The protective adhesive 50 simultaneously encapsulates both the light-emitting chip 30 and the light-receiving chip 40. Light emitted from the light-emitting chip 30 propagates through the protective adhesive 50 to the light-receiving chip 40. A UV lamp is placed on the dispensing machine track to cure the protective adhesive 50. After dispensing and UV lamp irradiation, the bracket is conveyed into the material box. Compared to the traditional process of two independent brackets (where the two brackets are formed on two separate metal plates), the process in this application can save a baking process, thus saving on baking oven costs and electricity from a production perspective. (Using an adhesive that can be quickly UV cured, such as silicone). S500, a molded housing, wherein the light-emitting chip, the light-receiving chip, the silicone and the insulating retainer are located within the housing.

[0049] After step S400, the outer shell 70 is molded. The material cured by dispensing adhesive in step S400 is then molded into the outer shell 70 using black adhesive. Please refer to... Figure 7 The outer shell 70 is bonded to the protective adhesive 50, eliminating the need for traditional white adhesive molding. This avoids delamination inside the optocoupler due to the large difference in shrinkage rates between black and white adhesive. Please refer to [reference needed]. Figure 3 After the black resin is molded, it needs to be baked for an extended period. The baking time and temperature are known to those skilled in the art and will not be elaborated here. After the black resin has been baked for an extended period, it is then trimmed and electroplated.

[0050] S600, the first bracket and the second bracket are separated from the material plate to obtain a single optocoupler.

[0051] In this step, the first support 10 and the second support 20 can be cut and separated from the material plate by punching. During the punching process, the portions of the first support 10 and the second support 20 outside the outer casing 70 can be bent simultaneously. Please refer to [reference needed]. Figure 1 This yields a single finished optocoupler.

[0052] Compared with the conventional two-piece support process, the process of this application can save multiple baking processes, and save the steps of stacking the first support 10 and the second support 20 → white glue molding → white glue cutting, etc. It saves the sheet laying machine, white glue mold, molding machine and white glue cutting and glue removal equipment, thus saving equipment purchase costs, as well as labor and electricity costs.

[0053] This document describes various exemplary embodiments with reference to them. However, those skilled in the art will recognize that changes and modifications can be made to the exemplary embodiments without departing from the scope of this document. For example, various operational steps and components for performing operational steps can be implemented in different ways depending on the specific application or considering any number of cost functions associated with the operation of the system (e.g., one or more steps can be deleted, modified, or combined with other steps).

[0054] While the principles herein have been illustrated in various embodiments, numerous modifications to the structures, arrangements, proportions, elements, materials, and components, particularly suited to specific environments and operational requirements, may be used without departing from the principles and scope of this disclosure. These modifications and other alterations or alterations will be included within the scope of this document. Those skilled in the art will recognize that many changes can be made to the details of the above embodiments without departing from the fundamental principles of the invention.

Claims

1. An optocoupler, characterized in that, include: First support; A light-emitting chip, which is mounted on the first bracket and can emit light when powered; The second support has an insulating gap with the first support; A light-receiving chip is mounted on the second bracket and is capable of receiving light and generating current. A protective adhesive, which encapsulates the light-emitting chip and / or the light-receiving chip; An insulating retainer is provided, which is connected between the first bracket and the second bracket, so that the first bracket and the second bracket can be held in position by means of the insulating retainer during the manufacturing process of the optocoupler; The light-emitting chip, the light-receiving chip, the protective adhesive, and the insulating retainer are located inside the outer casing, which is an opaque shell. The hardness of the protective adhesive is less than that of the outer shell.

2. The optocoupler as described in claim 1, characterized in that, The light-emitting chip has a mounting surface that mates with the first bracket, and a front light-emitting surface facing away from the mounting surface. It also has a side surface located between the front light-emitting surface and the mounting surface. The first bracket and the second bracket are arranged at intervals along the orientation direction of the side surface. The insulating retainer is an insulating plate, which is located on the side of both the first bracket and the second bracket facing away from the light-emitting chip and the light-receiving chip.

3. The optocoupler as described in claim 2, characterized in that, The first bracket has a first enclosure structure on one side of the light-emitting chip, the first enclosure structure being located on the side of the light-emitting chip away from the light-receiving chip. The second bracket has a second enclosure structure on one side of the light-receiving chip, the second enclosure structure being located on the side of the light-receiving chip away from the light-emitting chip. The protective adhesive is filled between the first enclosure structure and the second enclosure structure, and wraps the light-emitting chip and the light-receiving chip. The protective adhesive forms a light-transmitting structure between the light-emitting chip and the light-receiving chip, and forms an insulating structure between the first bracket and the second bracket.

4. The optocoupler as described in claim 3, characterized in that, The first bracket has a first bend, which constitutes the first enclosure structure, and / or the second bracket has a second bend, which constitutes the second enclosure structure.

5. The optocoupler as described in claim 4, characterized in that, The first bracket includes a first support portion, the light-emitting chip is mounted on the first support portion, and the first bending portion is bent relative to the first support portion. The second bracket includes a second support portion, the light-receiving chip is mounted on the second support portion, and the second bending portion is bent relative to the second support portion. The first support portion is covered by the insulating plate, and the second support portion is covered by the insulating plate.

6. The optocoupler as described in any one of claims 1-5, characterized in that, The outer shell is bonded to the protective adhesive.

7. The optocoupler as described in any one of claims 1-5, characterized in that, The insulating retainer is connected to the first bracket and the second bracket by injection molding.

8. The optocoupler as described in any one of claims 1-5, characterized in that, The protective adhesive is silicone.

9. A method for manufacturing an optocoupler, characterized in that, Includes the following steps: Prepare the bracket materials, which include a first bracket and a second bracket. An insulating retainer is connected between the first bracket and the second bracket to maintain their position. A light-emitting chip is installed on the first bracket of the bracket receiving material, and a light-receiving chip is installed on the second bracket; The light-emitting chip is electrically connected to the conductive structure on the first support, and the light-receiving chip is electrically connected to the conductive structure on the second support; The light-emitting chip and / or the light-receiving chip are coated with silicone, and the silicone is then cured. A molded housing is used to house the light-emitting chip, the light-receiving chip, the silicone, and the insulating retainer within the housing.

10. The method for manufacturing an optocoupler as described in claim 9, characterized in that, In the preparation of the bracket material, multiple bracket groups are formed on the same metal plate. The bracket group includes a first bracket and a second bracket. The manufacturing method of the optocoupler further includes separating the first bracket and the second bracket from the material plate after molding the shell to obtain a single optocoupler.

Images