Equipment front-end module, control method and semiconductor manufacturing equipment

Abstract

This application discloses a front-end module, control method, and semiconductor manufacturing equipment for use in semiconductor manufacturing equipment, relating to the field of semiconductor manufacturing automation equipment technology. The front-end module includes a frame, loading port, transmission device, pre-alignment device, and controller. This application sets multiple independent adsorption zones on the end effector and equips each zone with an adjustable and detectable negative pressure component. When an area experiences abnormal negative pressure due to workpiece warping or localized air leakage, enhanced adsorption can be applied to that area. Simultaneously, the motion parameters of the transmission device are dynamically reduced, thereby improving the adsorption reliability and anti-drop capability of large, easily warped workpieces during transport without sacrificing overall cycle time. Simultaneously, the pre-alignment device acquires the workpiece's position and orientation information, and the controller dynamically corrects the spatial orientation of the end effector during transport, ensuring the workpiece's actual position and orientation align with the downstream process equipment.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor manufacturing automation equipment, and more particularly to a front-end module, control method and semiconductor manufacturing equipment. Background Technology

[0002] As electronic products become thinner, lighter, and more high-performance, advanced packaging technologies are becoming increasingly important. Panel-level packaging (PLP) technology uses rectangular panels (such as glass substrates, PCB substrates, etc.) instead of traditional circular wafers for packaging, which can improve area utilization and reduce production costs.

[0003] However, compared to traditional wafer-level packaging (WLP), PLP faces new challenges: 1. PLP panels are typically larger and heavier, placing higher demands on the load and arm length of the transfer robot. 2. Due to their large area and thinness, panels are prone to warping during processing. Traditional rigid end effectors struggle to effectively hold severely warped panels, easily leading to chip loss or vacuum alarms. 3. Circular wafers rely on notches or flat edges for alignment, while rectangular panels require alignment using edges or corners, making existing equipment front-end modules (EFEMs) unsuitable for direct application. Summary of the Invention

[0004] The main objective of this application is to provide a front-end module, control method, and semiconductor manufacturing equipment, which aims to solve the technical problems of unstable adsorption and insufficient alignment accuracy of large-sized, easily warped workpieces during automatic transfer in the prior art.

[0005] To achieve the above objectives, this application proposes a front-end module for use in semiconductor manufacturing equipment, the semiconductor manufacturing equipment including back-end process equipment, the front-end module being connected to the front side of the back-end process equipment for aligning and transferring workpieces to the back-end process equipment, including: The frame defines a transfer chamber for transferring the workpiece; A loading port, located on the front side of the frame, is used to support and dock a carrier containing the workpiece; A transmission device, located in the transmission chamber, is used to transport the workpiece. It includes an end effector, which has multiple independent adsorption zones. Each adsorption zone is connected to a negative pressure component for adjusting and detecting the negative pressure state. A pre-alignment device, located in the transmission chamber, is used to detect and acquire the pose information of the workpiece; The controller is electrically connected to the transmission device, each of the negative pressure components, and the pre-alignment device. It is used to independently adjust the adsorption state of the corresponding adsorption zone and dynamically adjust the motion parameters of the transmission device according to the negative pressure detection data of each adsorption zone to stabilize the current adsorption state of the workpiece. It is also used to correct the spatial posture of the end effector when transporting the workpiece according to the pose information output by the pre-alignment device to achieve alignment and transmission with the back-end process equipment.

[0006] In one embodiment, the controller is further configured to control the transmission device to transport the workpiece with a first motion parameter when the negative pressure detection data indicates that the negative pressure values ​​of all adsorption zones are within a preset normal range; And, when the negative pressure detection data indicates that the negative pressure value of at least one adsorption zone is lower than a preset threshold, it is determined that the workpiece is in a warped state, and the transmission device is controlled to transport the workpiece with the second motion parameter to enhance the adsorption state of the corresponding adsorption zone. Wherein, the acceleration and / or velocity of the second motion parameter are lower than those of the first motion parameter.

[0007] In one embodiment, each of the adsorption regions of the end effector is provided with an elastic component, which is used to compensate for the deformation gap between the workpiece surface and the end effector when the workpiece is in a warped state.

[0008] In one embodiment, each of the adsorption zones includes an adsorption hole formed on the end effector, and the elastic component is an elastic suction cup installed at the adsorption hole and connected to the air passage of the corresponding negative pressure component, used to tightly fit the workpiece surface in a warped state through its own deformation.

[0009] In one embodiment, the transmission device includes: A transverse axis, disposed within the transmission chamber, is used to provide driving force in the horizontal linear direction; A robotic arm is mounted on the transverse axis, and an end effector is connected to the end of the robotic arm. The robotic arm is used to move a workpiece via the end effector.

[0010] In one embodiment, the pre-alignment device includes: A motion platform is used to carry and drive the workpiece to move in a horizontal plane; An optical detection assembly is fixedly mounted above the motion platform, including a vision sensor for acquiring a reference mark image of the workpiece surface and a distance sensor for non-contact measurement of the height information of the workpiece surface. The controller is used to calculate the position and rotation deviation of the workpiece in the plane based on the reference mark image, calculate the height and tilt deviation of the workpiece in the vertical direction based on the height information, and fuse them into the six-degree-of-freedom pose information of the workpiece, and correct the target space coordinates and attitude of the end effector based on the six-degree-of-freedom pose information.

[0011] In one embodiment, the loading port includes: A door opening mechanism for opening the sealed door of the vehicle; The limit adjustment mechanism includes guide blocks that can slide along the width direction of the loading port. The limit adjustment mechanism is used to adapt to vehicles of different sizes by adjusting the spacing of the guide blocks.

[0012] In one embodiment, it further includes: A fan filter unit, located at the top of the frame, is used to provide vertically downward laminar clean air into the transmission chamber so that the transmission chamber meets a preset cleanliness standard.

[0013] Furthermore, to achieve the above objectives, this application also proposes a control method, implemented based on the aforementioned device front-end module, comprising: The end effector of the transmission device is controlled to grasp the workpiece; Acquire negative pressure detection data for each independent adsorption zone, and adjust the negative pressure state of each adsorption zone independently and dynamically adjust the motion parameters of the transmission device when transporting the workpiece accordingly. The transmission device is controlled to transmit the workpiece to the pre-alignment device for detection in order to obtain the workpiece's pose information; Based on the pose information, the transmission device is controlled to correct the spatial pose of the end effector so as to align and transmit the corrected workpiece to the downstream process equipment.

[0014] In addition, to achieve the above objectives, this application also proposes a semiconductor manufacturing equipment, including back-end process equipment and a front-end module as described above, wherein the front-end module is connected to the front side of the back-end process equipment and is used to load, unload and align workpieces to the back-end process equipment.

[0015] One or more technical solutions proposed in this application have at least the following technical effects: This application establishes multiple independent adsorption zones on the end effector and equips each zone with an adjustable and detectable negative pressure component. The controller can adjust the pressure of each zone individually based on the negative pressure detection data. When an area experiences abnormal negative pressure due to workpiece warping or localized air leakage, enhanced adsorption can be applied to that area. Simultaneously, the motion parameters of the transport device are dynamically reduced. This improves the adsorption reliability and anti-drop capability of large, easily warped workpieces during transport without sacrificing the overall cycle time. Furthermore, a pre-alignment device acquires the workpiece's position and orientation information, allowing the controller to dynamically correct the spatial posture of the end effector during transport. This ensures the workpiece's actual position and orientation are aligned with the downstream process equipment, effectively reducing placement deviation and improving alignment accuracy and subsequent process yield. Attached Figure Description

[0016] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This application provides an internal structure diagram of an embodiment of a device front-end module; Figure 2 This is a schematic diagram of the structure of an embodiment of a device front-end module provided in this application; Figure 3 This is a schematic diagram of an end effector structure provided in one embodiment of a device front-end module according to this application; Figure 4 This is a schematic diagram of the external structure of an embodiment of a device front-end module provided in this application; Figure 5 This is a flowchart illustrating an embodiment of a control method provided in this application.

[0019] Reference numerals: Frame 10, Fan and filter unit 11, Transparent window 12, Loading port 20, Carrier 21, Door opening mechanism 22, Limit adjustment mechanism 23, Transmission device 30, Robotic arm 31, End effector 32, Fork arm body 321, Elastic suction cup 322, Negative pressure sensor 323, Pre-alignment device 40, Motion platform 41, Optical detection assembly 42, Vision sensor 421, Distance sensor 422, Controller 50.

[0020] The purpose, features, and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0021] It should be understood that the specific embodiments described herein are merely illustrative of the technical solutions of this application and are not intended to limit this application.

[0022] To better understand the technical solution of this application, a detailed description will be provided below in conjunction with the accompanying drawings and specific implementation methods.

[0023] As electronic products evolve towards thinner, lighter, higher-performance, and more highly integrated designs, chip packaging has progressed from traditional wire-level packaging and ball grid array (BGA) packaging to wafer-level packaging and panel-level packaging. Panel-level packaging (PLP) is a process route that simultaneously packages and redistributes a large number of chips on a large rectangular substrate. Compared to wafer-level packaging (WLP), which uses circular silicon wafers, PLP uses rectangular panels such as glass substrates, organic carriers, or PCB substrates as the process carrier. This allows for the placement of more chip units on the same area, theoretically significantly improving area utilization and reducing the packaging cost per chip.

[0024] However, it is precisely this characteristic of "large size, rectangular panel" that brings about a series of engineering problems completely different from traditional WLP. First, in terms of size and weight, the side length and overall weight of large-area panels far exceed those of traditional wafers, placing higher demands on automated transfer equipment. Transfer robots need greater working stroke and higher load capacity, and the rigidity and dynamic performance of the mechanical structure face challenges. During high-speed handling and acceleration / deceleration, if the end effector's support surface is insufficient, the force is uneven, or the dynamic control is improper, the panel is prone to shaking or slipping, affecting safety and yield.

[0025] Secondly, warping is particularly prominent in PLP (Plastic Panel Processing). Due to the large area and thin thickness of the panels, and the frequent use of multi-layered structures or heterogeneous materials (such as glass and organic materials, resin and copper circuitry), residual stress, mismatched coefficients of thermal expansion, and gravity itself can all cause overall or localized warping and sagging of the panels during processes such as coating, lamination, heat treatment, and metal deposition. This type of warping is often non-linear and irregular, with differences in height and tilt in different areas of the panel. Traditional rigid end effectors designed for wafers typically assume that the workpiece is a "basically flat, rigid disk" and that the adsorption surface can fit well with the back of the workpiece. This premise no longer holds true in the PLP scenario: when the panel is partially warped or partially recessed, a gap forms between the end effector and the back of the panel, making it difficult to establish an effective seal during vacuum adsorption. This leads to insufficient negative pressure, frequent vacuum alarms, and even wafer detachment accidents during high-speed movement.

[0026] Furthermore, there are fundamental differences between rectangular panels and circular wafers in terms of alignment logic and alignment methods. Wafers typically have standardized notches or flat edges. Most existing Equipment Front End Modules (EFEMs) are equipped with pre-alignment devices that rotate the wafer and use an edge finder to detect the position of the notch or flat edge, calculating the wafer's center and angle to complete pre-alignment. This "rotation edge finding + notch / flat alignment" method heavily relies on circular edges and standardized features, which is not suitable for rectangular panels. The geometric features of rectangular panels are straight edges and corners, and their alignment usually relies on reference marks on the panel edges, corners, or layout. If the wafer-style rotation edge finding method is still used, rotating and scanning the rectangular panel is not only computationally complex and has limited accuracy, but may also require mechanical contact, leading to scratches and particle contamination risks. Furthermore, many current EFEM pre-alignment mechanisms, vision system layouts, and workpiece support platform forms are built around "circular wafers + Notch / Flat". Directly migrating them to rectangular panels often requires significant modifications, resulting in high costs and unsatisfactory results.

[0027] To address the aforementioned problems, this application proposes a front-end module for use in semiconductor manufacturing equipment. The semiconductor manufacturing equipment includes back-end process equipment, and the front-end module is connected to the front of the back-end process equipment for aligning and transferring workpieces to the back-end process equipment. Figure 1 and Figure 4 As shown, it includes: Frame 10 defines a transfer chamber for transporting workpieces; loading port 20, located at the front of frame 10, is used to support and dock a carrier containing workpieces; transfer device 30, located within the transfer chamber, is used to transport workpieces and includes an end effector 32, which has multiple independent adsorption zones, each connected to a negative pressure component for adjusting and detecting negative pressure; pre-alignment device 40, located within the transfer chamber, is used to detect and acquire the workpiece's positional information; controller 05, electrically connected to transfer device 30, each negative pressure component, and pre-alignment device 40, is used to independently adjust the adsorption state of the corresponding adsorption zone and dynamically adjust the motion parameters of transfer device 30 based on the negative pressure detection data of each adsorption zone to stabilize the current adsorption state of the workpiece; and to correct the spatial posture of end effector 32 when transporting workpieces based on the positional information output by pre-alignment device 40, so as to achieve alignment and transfer with downstream process equipment.

[0028] This application sets multiple independent adsorption zones on the end effector 32 and equips each zone with an adjustable and detectable negative pressure component. The controller 05 can adjust the negative pressure of each zone based on the negative pressure detection data. When a zone experiences abnormal negative pressure due to workpiece warping or localized air leakage, the adsorption in that zone can be enhanced. Simultaneously, the motion parameters of the transmission device 30 are dynamically reduced. This improves the adsorption reliability and anti-drop capability of large, easily warped workpieces during transport without sacrificing the overall cycle time. Meanwhile, the pre-alignment device 40 acquires the workpiece's position and orientation information. Based on this, the controller 05 dynamically corrects the spatial orientation of the end effector 32 during transport, ensuring that the actual position and orientation of the workpiece are aligned with the downstream process equipment. This effectively reduces placement deviation and improves alignment accuracy and subsequent process yield.

[0029] This embodiment of the device front-end module is a specific implementation of this application, used to illustrate how the technical solution proposed in this application achieves the expected functions and technical effects through a specific structural combination. In this embodiment, the frame 10 defines a transfer chamber, forming a closed space for the transfer, alignment, and buffering of workpieces within the device front-end module. The frame 10 provides an installation reference for fixing the transfer device 30, the pre-alignment device 40, and the negative pressure pipeline system, ensuring the relative positional accuracy and structural stability of each component. A loading port 20 is provided on the front side of the frame 10 for carrying and docking with a carrier containing workpieces, realizing the transfer of workpieces between the external logistics system and the device front-end module. The loading port 20 is isolated from the atmosphere of the transfer chamber and can be configured with nitrogen or clean air environment according to process requirements to maintain the cleanliness level required for the production process.

[0030] The transfer device 30, located inside the transfer chamber, is used to transport workpieces between the loading port 20 and the downstream process equipment. The transfer device 30 includes a multi-degree-of-freedom robotic arm 31 and an end effector 32. The robotic arm 31 is driven by a control system to move its joints, enabling translation, rotation, and attitude adjustment of the workpiece in space. The end effector 32 is connected to the end of the robotic arm 31 and directly carries the workpiece, fixing it using negative pressure adsorption. The end effector 32 has multiple independent adsorption zones, each corresponding to a different area of ​​the panel. Each adsorption zone is independently connected to a negative pressure assembly, which includes a vacuum circuit, a pressure sensor, a pressure regulating valve, and an electronic control switch module. Each negative pressure assembly monitors and adjusts the negative pressure value of its corresponding adsorption zone in real time, controlling the adsorption force based on the detection data to adapt to the warping state of different areas of the workpiece. When the panel is uneven in some areas, each adsorption zone independently compensates for the adsorption gap, maintaining overall adsorption stability. When the negative pressure state is abnormal, the system can issue an alarm and pause the transfer to prevent workpiece drop and damage.

[0031] The pre-alignment device 40 is located in the transfer chamber and is used to detect and acquire the spatial pose information of the workpiece. The pre-alignment device 40 includes a non-contact optical detection component 42 and a height measurement component mounted on a fixed platform. After the transfer device 30 moves the workpiece to the pre-alignment position, the pre-alignment device 40 calculates the planar position and angle of the workpiece by identifying reference marks, edge features, and corner information on the workpiece. Simultaneously, the height measurement component collects height values ​​at multiple locations on the workpiece surface to obtain six-degree-of-freedom pose parameters. The detection process is completed in a static state, avoiding mechanical contact that could contaminate or scratch the workpiece.

[0032] The controller 05 is electrically connected to the transmission device 30, each negative pressure component, and the pre-alignment device 40. The controller 05 receives negative pressure detection signals from each adsorption zone and independently adjusts the negative pressure value of each adsorption zone based on the detection results, achieving closed-loop control of the adsorption state. Based on the pose information output by the pre-alignment device 40, the controller 05 calculates the required spatial attitude compensation and drives the transmission device 30 to complete attitude correction. During the handling process, the controller 05 updates motion parameters in real time, adaptively adjusting acceleration, speed, and trajectory according to panel deformation and system dynamic response to maintain stable workpiece adsorption and improve alignment accuracy.

[0033] The front-end module of the equipment achieves reliable handling and high-precision alignment of large, easily warped rectangular workpieces through an integrated design of independent negative pressure control, visual inspection, and posture compensation. A multi-zone adsorption structure reduces the risk of leakage caused by localized warping and improves vacuum stability. A non-contact pre-alignment method provides high-precision posture detection results, meeting the wafer insertion posture requirements of downstream process equipment. Closed-loop coordinated control of the system enhances handling safety and production cycle time, enabling the front-end module to adapt to the automated transfer and alignment needs of different sized substrates in panel-level packaging processes.

[0034] It is worth noting that even in the front-end modules of traditional equipment that process circular wafers, the overall scheme proposed in this application, which includes independent negative pressure control of multiple adsorption areas, an elastic warp compensation structure, and spatial correction of the grasping posture of the transfer robot based on the six-degree-of-freedom attitude data output by the pre-alignment device 40, can still bring the following improvements: By employing multi-zone negative pressure detection and closed-loop control, the adsorption reliability and anti-drop capability of thin or warped wafers during high-speed handling are improved. Through elastic components, the end effector 32 can adapt to localized warping and dishing deformation of the wafer, reducing reliance on the flatness of the wafer's back side. The pre-alignment device 40 acquires the wafer's height and warping information and feeds it back to the transfer robot in the form of six-degree-of-freedom attitude data, achieving compensated transfer of the wafer's three-dimensional attitude, thereby improving the alignment accuracy and safety when the wafer is loaded onto back-end process equipment.

[0035] In another specific embodiment, the controller 05 is further configured to control the transmission device 30 to transport the workpiece with a first motion parameter when the negative pressure detection data indicates that the negative pressure values ​​of all adsorption zones are within a preset normal range; and to determine that the workpiece is in a warped state when the negative pressure detection data indicates that the negative pressure value of at least one adsorption zone is lower than a preset threshold, and to control the transmission device 30 to transport the workpiece with a second motion parameter and enhance the adsorption state of the corresponding adsorption zone; wherein the acceleration and / or speed of the second motion parameter is lower than that of the first motion parameter.

[0036] In this embodiment, the negative pressure detection data of multiple independent adsorption zones are used to reflect the actual adsorption state of the workpiece on the end effector 32. When the negative pressure values ​​of all adsorption zones are within the preset normal range, the controller 05 identifies the current state as one of sufficient and uniform adsorption. At this time, the control transmission device 30 uses the first motion parameter for transport, and the acceleration and speed corresponding to the first motion parameter meet the production line cycle requirements. In this state, the inertial load borne by the workpiece during transport matches the adsorption and retention capacity, enabling normal cycle transmission while ensuring reliable adsorption.

[0037] When negative pressure detection data indicates that the negative pressure value of at least one adsorption zone is lower than a preset threshold, the controller 05 determines that the workpiece has warped, poorly adhered, or leaked in that area based on the abnormal negative pressure value. In this state, if the first motion parameter is still used for handling, the inertial force experienced by the workpiece during acceleration and deceleration may exceed the local adsorption capacity, posing a risk of partial detachment or complete drop of the workpiece. Therefore, after determining that the workpiece is warped, the controller 05 switches the motion mode of the transmission device 30, using a second motion parameter to handle the workpiece. The acceleration and / or speed of the second motion parameter are lower than the first motion parameter, thereby reducing the dynamic load applied to the workpiece during handling. Simultaneously, the controller 05 sends an adjustment command to the negative pressure component of the corresponding adsorption zone, increasing the negative pressure setpoint or adjusting the vacuum supply method to enhance the adsorption force of that adsorption zone, enabling the warped area to maintain effective adsorption even under lower motion impact conditions.

[0038] Through the coordination of the above control logic, the equipment can maintain high transmission efficiency when the adsorption state is good. When an abnormal local negative pressure is detected, it automatically reduces the movement intensity and strengthens local adsorption to reduce the probability of workpiece slippage and detachment during transportation. At the same time, by using the independent negative pressure monitoring results of multiple adsorption zones for state determination and parameter switching, compared with the coarse monitoring method of a single vacuum channel, it can respond to local warping or local leakage, thereby ensuring both safety and transmission efficiency, and improving the stability of the automatic transportation process of large-sized, easily warped workpieces.

[0039] In one embodiment, such as Figure 1 and Figure 3 As shown, each adsorption zone of the end effector 32 is provided with an elastic component, which is used to compensate for the deformation gap between the workpiece surface and the end effector 32 when the workpiece is in a warped state.

[0040] Specifically, each adsorption zone includes an adsorption hole on the end effector 32, and an elastic component is an elastic suction cup 322 installed at the adsorption hole and connected to the air passage of the corresponding negative pressure component, used to tightly adhere to the warped surface of the workpiece through its own deformation. The elastic suction cup 322 can extend and retract in the vertical direction according to the deformation of the bottom of the workpiece, thereby adjusting its own height position when the workpiece is partially warped or drooping, so that the suction cup lip remains in close contact with the workpiece surface.

[0041] In this embodiment, the end effector 32 includes a fork body 321. The upper surface of the fork body 321 has several vacuum adsorption holes, each serving as a vacuum channel for a corresponding adsorption zone. Each vacuum adsorption hole is equipped with the aforementioned elastic suction cup 322, and a vacuum generator and a negative pressure sensor 323 are connected to it via air circuit connections. The vacuum generator provides negative pressure to each adsorption zone, and the negative pressure sensor 323 collects the negative pressure status of each adsorption zone in real time and feeds the detection data back to the control unit. When a workpiece is placed on the end effector 32 and vacuum adsorption is initiated, the elastic suction cup 322 contacts the workpiece surface under negative pressure, compressing or elongating within the allowable range of the elastomer structure to adapt to the height difference and warping shape of the workpiece surface, forming multiple locally sealed adsorption areas.

[0042] When the workpiece warps downwards or upwards, the gap between part of the adsorption area and the back of the workpiece changes. The elastic suction cup 322 compensates for the gap through its own compression stroke, keeping the contact surface sealed. If the warping causes insufficient negative pressure in some adsorption areas, the negative pressure sensor 323 detects that the negative pressure value of the adsorption area is lower than a preset threshold. The control unit adjusts the output of the corresponding vacuum generator according to the detection result to enhance the negative pressure of the adsorption area and improve the adsorption capacity of that area. At the same time, the control unit can be linked with the motion control logic to appropriately reduce the motion acceleration and / or speed of the robotic arm 31, reduce the inertial load generated during the handling process, and reduce the possibility of detachment in areas with insufficient negative pressure.

[0043] Through the aforementioned structure and control coordination, when facing workpieces with varying degrees of warping, the multiple elastic suction cups 322 of the end effector 32 can perform position compensation in the vertical direction, ensuring that each adsorption zone still forms an effective adsorption surface even when the bottom height of the workpiece is inconsistent. The vacuum system composed of the negative pressure sensor 323 and the vacuum generator provides real-time monitoring and adjustment capabilities for the negative pressure state of each adsorption zone, enabling the system to respond to local adsorption anomalies. Therefore, when the workpiece is warped, the end effector 32 can maintain a relatively stable adsorption state, reducing the probability of slippage and drop during transport. Furthermore, while ensuring reliable adsorption, it provides adjustable motion parameter space for the transmission device 30, thereby improving the overall stability and adaptability of large, easily warped workpieces during automated transport.

[0044] In one embodiment, such as Figure 1 As shown, the transmission device 30 includes: a transverse axis disposed in the transmission chamber for providing driving force in the horizontal linear direction; a robotic arm 31 disposed on the transverse axis; and an end effector 32 connected to the end of the robotic arm 31, wherein the robotic arm 31 is used to drive the workpiece to move through the end effector 32.

[0045] Specifically, in the front-end module of the equipment, the transfer device 30 can be understood as a transfer robot, located at the center of the frame 10 unit. It includes a transverse axis, a multi-axis robotic arm 31, and an end effector 32 connected to the end of the robotic arm 31, used to transfer panels between the loading port 20 unit, the pre-alignment unit, and external process equipment. The transverse axis is arranged along a predetermined direction, such as along the width or depth of the equipment, and drives the base of the robotic arm 31 to move horizontally in a linear motion mechanism to expand the working coverage of the robotic arm 31. The multi-axis robotic arm 31 uses rotary joints and / or lifting axes to adjust the position of the end effector 32 in the horizontal and vertical directions to meet the path requirements of picking up wafers from inside the carrier, placing them in the pre-alignment device 40, and then having the pre-alignment device 40 pick up the wafers and send them into the back-end process equipment.

[0046] An end effector 32 is mounted at the end of the robotic arm 31. Through cooperation with the traverse axis and the multi-axis robotic arm 31, it enables the gripping, lifting, translation, and placement of workpieces. Combined with the aforementioned configuration of multiple independent adsorption zones and negative pressure components, when gripping a workpiece, the end effector 32 is first moved by the robotic arm 31 to the target position and lowered to a predetermined height. Then, vacuum adsorption is activated in each adsorption zone to remove the workpiece from the carrier, pre-alignment platform, or rear-end equipment interface. During transport, the traverse axis provides long-stroke linear movement, and the robotic arm 31 performs precise local positioning and height adjustment, allowing the workpiece to move along the planned path to the target workstation.

[0047] Through this structural configuration of the transmission device 30, on the one hand, by combining the transverse axis with the multi-axis robotic arm 31, the transmission device 30 achieves a large coverage area and multi-degree-of-freedom movement within a limited chamber space, meeting the multi-point transmission requirements from the loading port 20 to the pre-alignment device 40 and then to the downstream process equipment. On the other hand, the end effector 32, located at the end of the robotic arm 31, corrects the pick-up and placement positions and postures based on the pose information output by the pre-alignment device 40 through linkage with the controller 05, realizing the alignment and transmission of the workpiece between different workstations. The overall structure makes the movement path of the panel within the transmission chamber controllable. Combined with the aforementioned negative pressure monitoring and elastic adsorption structure, it can maintain adsorption stability even when the workpiece is warped. Furthermore, through reasonable motion trajectory and parameter settings, it reduces the posture deviation and abnormal force of the workpiece during handling, thereby improving the stability and alignment accuracy of the panel transmission.

[0048] In one embodiment, such as Figure 1 As shown, the pre-alignment device 40 includes: a motion platform 41 for carrying and driving the workpiece to move in a horizontal plane; and an optical detection assembly 42 fixedly disposed above the motion platform 41, including a vision sensor 421 for acquiring a reference mark image of the workpiece surface and a distance sensor 422 for non-contact measurement of the height information of the workpiece surface. The controller 05 is used to calculate the position and rotation deviation of the workpiece in the plane based on the reference mark image, calculate the height and tilt deviation of the workpiece in the vertical direction based on the height information, and fuse them into the six-degree-of-freedom pose information of the workpiece. Based on the six-degree-of-freedom pose information, the controller 05 corrects the target space coordinates and attitude of the end effector 32.

[0049] Specifically, the pre-alignment device 40 employs a fixed optical path structure to accommodate the characteristic that rectangular panels cannot be aligned by rotational edge finding. The motion platform 41 assembly is located at the bottom of the pre-alignment device 40, supporting the panel and possessing multi-axis motion capabilities in the horizontal plane, including linear movement along the X-axis, linear movement along the Y-axis, and rotational movement around the Z-axis. By controlling the combination of these three degrees of freedom, the motion platform 41 can move a reference mark at any preset position on the panel into the measurement area of ​​the optical detection assembly 42.

[0050] The optical inspection component 42 is suspended or mounted above the motion platform 41, and its position is fixed and does not move with the motion platform 41. The optical inspection component 42 includes a vision sensor 421 and a distance sensor 422. The vision sensor 421 is an industrial camera with a fixed field of view, with its lens perpendicular to the motion platform 41, used to acquire image information of preset reference marks on the panel surface. The distance sensor 422 is a laser displacement sensor or other non-contact distance sensor, installed on the side or at a designated position of the optical inspection component 42, used to measure the height information of the panel surface in the vertical direction.

[0051] During the pre-alignment process, the controller 05 controls the motion platform 41 assembly to move along a predetermined path, causing the reference marks on the panel to sequentially enter the field of view of the vision sensor 421. After the vision sensor 421 acquires an image containing the reference marks, the controller 05 processes the image, identifies the actual position of the reference marks, compares it with the preset theoretical position, and calculates the workpiece's offset and rotational deviation in the plane, including ΔX, ΔY, and the rotational deviation Δθ around the Z-axis. Simultaneously, the controller 05 controls the ranging sensor 422 to scan or sample the height of the panel surface at one or more measurement points, obtaining the height distribution data of the panel in the Z-axis direction. Based on this data, the average height of the workpiece and its tilt deviation relative to the horizontal plane, such as the tilt angles around the X and Y axes, are calculated, thereby obtaining the workpiece's height deviation and tilt state in the vertical direction.

[0052] The controller 05 fuses the planar position deviation obtained by the vision sensor 421 with the height and tilt deviation obtained by the ranging sensor 422 to form the workpiece's six-degree-of-freedom pose information, including its position in the X, Y, and Z directions and its rotational attitude around the X, Y, and Z axes. Based on this six-degree-of-freedom pose information, the controller 05 corrects the target spatial coordinates and attitude parameters of the end effector 32 in the transmission device 30, so that when the end effector 32 picks up a piece from the motion platform 41 or other workstations, it can spatially align itself according to the actual position and attitude of the workpiece, thereby improving the alignment accuracy during the picking and subsequent placement processes.

[0053] In this embodiment, the motion platform 41 component is used to actively move the workpiece under fixed optical path conditions, aligning the reference area with the optical detection component 42 to achieve scanning and measurement of the workpiece position; the vision sensor 421 is used to acquire reference mark images so that the controller 05 can calculate in-plane positional deviation and rotational deviation; the distance sensor 422 is used to non-contactly acquire information about the workpiece in the height direction so that the controller 05 can calculate height deviation and tilt deviation. Through the above structure and control process, the pre-alignment device 40 can complete the six-degree-of-freedom pose detection of the rectangular panel without rotating the entire panel for edge finding, and use the detection result to guide the transmission device 30 to adjust the picking and placing posture of the end effector 32, realizing gripping and alignment transmission that adapts to panel warping, reducing the probability of picking and placing errors and alignment deviations.

[0054] In one embodiment, such as Figure 2 As shown, the loading port 20 includes: a door opening mechanism 22 for opening the sealed door of the vehicle; and a limit adjustment mechanism 23, including guide blocks that can slide along the width direction of the loading port 20. The limit adjustment mechanism 23 is used to adapt to vehicles of different sizes by adjusting the spacing of the guide blocks.

[0055] In this embodiment, the loading port 20 includes: an opening mechanism 22 for opening the sealed door of the carrier; and a limit adjustment mechanism 23, including guide blocks that can slide along the width direction of the loading port 20. The limit adjustment mechanism 23 is used to adjust the spacing of the guide blocks to accommodate carriers of different sizes. The loading port 20 unit is located on the front side of the frame 10 and is used to dock with the carrier of the transport panel. After the docking of the carrier is completed, it provides a stable pick-and-place station for the transmission device 30.

[0056] Specifically, considering the differences in panel sizes and carrier specifications in the panel-level packaging industry, the loading port 20 is equipped with a limit adjustment mechanism 23. The limit adjustment mechanism 23 includes paired guide blocks that can slide along the width direction of the loading port 20. The guide blocks are mounted on the structure of the loading port 20 via guide rails, sliders, or linear sliding components, and their positions can be adjusted manually or by motor drive. The operator or control system adjusts the spacing between the guide blocks according to the external width of the carrier used in current production (e.g., different sizes of FOUP or Cassette), ensuring that the effective accommodating width between the guide blocks matches the carrier's shape. When the carrier is transported from outside to the loading port 20, the guide blocks limit and guide the carrier's lateral position, achieving a predetermined lateral positioning of the carrier at the loading port 20 position, reducing deviations in the carrier's docking position.

[0057] The door opening mechanism 22 is located inside or adjacent to the loading port 20 and is used to open the sealed door of the carrier after the carrier is docked in place. The door opening mechanism 22 may include mechanical claws, hooks, push-pull rods, or rotating structures, etc., and cooperate with the opening structure of the carrier's sealed door. When it is detected that the carrier has been aligned and docked by the limit adjustment mechanism 23, the controller 05 drives the door opening mechanism 22 to perform the opening action, so that the internal space of the carrier is connected to the transfer chamber. After the door opening action is completed, the end effector 32 in the transfer device 30 can extend into the interior of the carrier through the loading port 20 to remove the workpiece from the carrier or put the workpiece back into the carrier.

[0058] Through the above structure, the loading port 20 unit achieves compatibility with carriers of different widths at the mechanical interface. Adjustable guide blocks limit and guide the carriers, ensuring a stable lateral position and high repeatability during docking. This facilitates the subsequent transfer device 30 in picking up and placing workpieces from fixed positions along a predetermined path. The door opening mechanism 22 automatically opens the carrier's sealed door, reducing manual operation, improving docking efficiency between the carrier and the equipment, and maintaining isolation between the carrier's interior and external environment when the door is closed. Combined with the cleanliness control of the frame 10 and the fan filter unit 11, this reduces the probability of particles entering the transfer chamber and the carrier's interior. Overall, this embodiment, through the mechanical adaptation of the loading port 20 and automated door opening control, enhances the equipment's adaptability to multi-specification carriers and the stability of the workpiece loading and unloading process, facilitating the switching of panel production of different sizes and specifications on the same equipment.

[0059] In one embodiment, such as Figure 2 As shown, it also includes: a fan filter unit 11, which is installed on the top of the frame 10, for providing vertically downward laminar clean air to the transmission chamber so that the transmission chamber meets the preset cleanliness standard.

[0060] In this embodiment, the fan filter unit 11 is arranged in a predetermined area at the top of the frame 10, and can be a single large-area filter module or a filter array formed by combining multiple filter units. The fan filter unit 11 integrates a fan and a high-efficiency filter. The fan draws in outside air, which is then filtered by the filter to remove suspended particles and pollutants from the air. The air is then sent into the transmission chamber from top to bottom at a basically uniform flow rate, forming a vertical laminar airflow from top to bottom. By reasonably setting the air volume, filtration efficiency, and outlet air velocity, a stable, unidirectional clean airflow channel is formed inside the transmission chamber.

[0061] At the bottom of the transfer chamber, a return air vent or grille structure can be installed, allowing clean air supplied from the top to be discharged from the bottom or returned to the external air handling system after flowing through the workpiece, transfer device 30, and pre-alignment device 40. Through the coordination of top air supply and bottom exhaust, the air inside the transfer chamber is continuously refreshed, maintaining the particle concentration below the preset cleanliness standard. The sealed structure of the transparent window 12 and frame 10 restricts the entry of unfiltered external air, reducing the impact of external environmental changes on the cleanliness of the transfer chamber.

[0062] Through the above structural configuration, the fan filter unit 11 and the enclosed frame unit 10 together form an independent cleanroom space, ensuring that the workpiece remains in a controlled air environment throughout the loading, handling, pre-alignment, and docking with downstream process equipment. The top-down laminar clean airflow reduces the residence time of particles near the workpiece surface. Combined with the exhaust structure at the bottom of the transfer chamber, this reduces the probability of particle accumulation in critical areas, thus minimizing the risk of particle contamination during panel handling and alignment, and improving the yield of subsequent process steps and the stability of equipment operation.

[0063] Furthermore, this application also proposes a control method based on the aforementioned device front-end module, such as... Figure 5 As shown, steps S100~S400 are included: S100: Controls the end effector of the transmission device to grasp the workpiece; S200: Acquire negative pressure detection data for each independent adsorption zone, and adjust the negative pressure state of each adsorption zone independently and dynamically adjust the motion parameters of the conveying device when transporting the workpiece accordingly. S300: The control and transmission device transfers the workpiece to the pre-alignment device for detection in order to obtain the workpiece's pose information; S400: Based on the pose information, control the transmission device to correct the spatial pose of the end effector so as to align and transmit the corrected workpiece to the back-end process equipment.

[0064] Specifically, this application also proposes a control method based on the aforementioned equipment front-end module, used to achieve stable handling and high-precision alignment of workpieces. For example... Figure 5As shown, the method includes steps S100 to S400: In step S100, the end effector of the control transfer device grips the workpiece. Specifically, after the carrier is placed in the loading port unit and in position, the system receives a carrier positioning signal, controls the door opening mechanism to unlock and open the sealed door of the carrier, connecting the interior of the carrier with the transfer chamber. Subsequently, the transfer robot unit drives the end effector to extend into the interior of the carrier, moves the end effector to below the target workpiece, lowers it to a predetermined height, and then activates vacuum suction to grip the workpiece.

[0065] In step S200, negative pressure detection data of each independent adsorption zone is acquired, and the negative pressure state of each adsorption zone is adjusted independently based on this data, as well as the motion parameters of the conveying device when transporting the workpiece are dynamically adjusted. Specifically, after the end effector activates the vacuum, the control unit reads the detection data of each negative pressure sensor in real time. When the negative pressure values ​​of all adsorption zones are within the preset normal range, it is determined that the adsorption state meets the requirements, and the conveying robot is controlled to remove and transport the workpiece from the carrier with the first motion parameters (standard speed and acceleration). When the negative pressure value of at least one adsorption zone is lower than the preset threshold, the control unit determines that the workpiece is warped or has poor local adsorption, switches to warping mode, increases the negative pressure setting of the corresponding adsorption zone while maintaining vacuum supply, and reduces the motion acceleration and / or speed of the conveying robot to the second motion parameters, so as to smoothly move the workpiece out of the carrier under the condition of reducing dynamic load.

[0066] In step S300, the control transfer device transfers the workpiece to the pre-alignment device for detection to obtain the workpiece's pose information. Specifically, the transfer robot transports the adsorbed workpiece from the carrier to the motion platform of the pre-alignment unit, places the workpiece in a predetermined bearing position, and then releases the vacuum. The control unit then drives the motion platform to perform multi-axis motion in the horizontal plane, sequentially moving the preset reference marks on the workpiece to the field of view of the vision sensor, which then acquires an image containing the reference marks. Simultaneously, the control distance sensor measures or scans the height of multiple points on the workpiece surface to obtain the workpiece's height data in the vertical direction.

[0067] In the above process, the control unit calculates the actual coordinates of the reference marker through image processing, and obtains the workpiece's positional deviations ΔX and ΔY in the plane and its rotational deviation Δθ around the Z-axis relative to the theoretical coordinates. Based on the height data collected by the ranging sensor, it calculates the workpiece's height deviation ΔZ in the Z-axis direction and its tilt angles Δθx and Δθy around the X and Y axes, thereby obtaining the workpiece's warping attitude parameters. The control unit combines the planar positional deviations and warping attitude parameters to form the workpiece's six-degree-of-freedom (6-DoF) pose information or six-degree-of-freedom alignment data.

[0068] In step S400, based on the pose information, the control device corrects the spatial attitude of the end effector to align and transfer the workpiece to the back-end process equipment. Specifically, the control unit sends the aforementioned six-degree-of-freedom alignment data to the transfer robot unit. When the transfer robot picks up the workpiece again, it no longer performs the pick-up action based on a fixed teaching point, but instead corrects the target spatial coordinates (X, Y, Z) and attitude angles (Rx, Ry, Rz) of the end effector based on the six-degree-of-freedom alignment data, so that the end effector matches the actual position and warping attitude of the workpiece in space, adhering to the bottom surface of the workpiece for adsorption. After adsorption is completed, the transfer robot transports and places the workpiece to the interface position of the back-end process equipment according to the corrected spatial path and attitude, realizing the alignment and transfer to the back-end process equipment.

[0069] The above control method achieves two main benefits. First, it utilizes negative pressure detection data from multiple adsorption zones to determine the adsorption state and adaptively adjust motion parameters. Standard motion parameters are used to ensure production capacity during normal workpiece adsorption, while increasing local negative pressure and reducing motion intensity when warping or insufficient local negative pressure is detected to mitigate the risk of panel drop. Second, a pre-alignment device acquires the workpiece's six-degree-of-freedom pose information, thereby correcting the end effector's gripping posture and placement path, improving the alignment accuracy between the workpiece and the downstream process equipment interface. This method combines adsorption monitoring, pre-alignment measurement, and motion compensation for enhanced handling stability and alignment accuracy of large-size, easily warped panels in automated production lines.

[0070] In addition, this application also proposes a semiconductor manufacturing equipment, including back-end process equipment and a front-end module as described above. The front-end module is connected to the front side of the back-end process equipment and is used for loading, unloading and aligning workpieces to the back-end process equipment.

[0071] This application also proposes a semiconductor manufacturing equipment, including back-end process equipment and a front-end module as described in any of the above embodiments. The front-end module is docked to the front of the back-end process equipment and is used to complete the loading, unloading, and alignment transfer of workpieces in a closed and clean transfer chamber. Specifically, the front-end module docks with the carrier carrying the workpiece through the loading port 20, and uses the end effector 32 of the transfer device 30 to remove the workpiece from the carrier. Combined with negative pressure detection, elastic adsorption structure, and motion parameter adjustment, stable handling of large-sized, easily warped workpieces is achieved. Subsequently, the workpiece is sent to the pre-alignment device 40, and the six-degree-of-freedom pose information of the workpiece is obtained through the motion platform 41 and the optical detection component 42. The controller 05 corrects the gripping and placement posture of the end effector 32 accordingly, and finally transfers the workpiece to the interface position of the back-end process equipment with the corrected spatial position and posture, realizing automatic loading, unloading, and high-precision alignment transfer with the back-end process equipment. By integrating the aforementioned front-end modules with the back-end process equipment, a semiconductor manufacturing equipment suitable for panel-level packaging processes can be constructed, improving the overall machine's automation capabilities and alignment accuracy for large-size panels.

[0072] The above description is only a part of the embodiments of this application and does not limit the patent scope of this application. All equivalent structural transformations made under the technical concept of this application and using the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included in the patent protection scope of this application.

Claims

1. A front-end module for use in semiconductor manufacturing equipment, the semiconductor manufacturing equipment including back-end process equipment, the front-end module being connected to the front side of the back-end process equipment for aligning and transferring workpieces to the back-end process equipment, characterized in that... include: The frame defines a transfer chamber for transferring the workpiece; A loading port, located on the front side of the frame, is used to support and dock a carrier containing the workpiece; A transmission device, located in the transmission chamber, is used to transport the workpiece. It includes an end effector, which has multiple independent adsorption zones. Each adsorption zone is connected to a negative pressure component for adjusting and detecting the negative pressure state. A pre-alignment device, located in the transmission chamber, is used to detect and acquire the pose information of the workpiece; The controller is electrically connected to the transmission device, each of the negative pressure components, and the pre-alignment device. It is used to independently adjust the adsorption state of the corresponding adsorption zone and dynamically adjust the motion parameters of the transmission device according to the negative pressure detection data of each adsorption zone to stabilize the current adsorption state of the workpiece. It is also used to correct the spatial posture of the end effector when transporting the workpiece according to the pose information output by the pre-alignment device to achieve alignment and transmission with the back-end process equipment.

2. The device front-end module as described in claim 1, characterized in that, The controller is also used to control the transmission device to transport the workpiece with a first motion parameter when the negative pressure detection data indicates that the negative pressure value of all adsorption zones is within a preset normal range. And, when the negative pressure detection data indicates that the negative pressure value of at least one adsorption zone is lower than a preset threshold, it is determined that the workpiece is in a warped state, and the transmission device is controlled to transport the workpiece with the second motion parameter to enhance the adsorption state of the corresponding adsorption zone. Wherein, the acceleration and / or velocity of the second motion parameter are lower than those of the first motion parameter.

3. The device front-end module as described in claim 2, characterized in that, Each of the adsorption zones of the end effector is provided with an elastic component, which is used to compensate for the deformation gap between the workpiece surface and the end effector when the workpiece is in a warped state.

4. The device front-end module as described in claim 3, characterized in that, Each of the adsorption zones includes an adsorption hole opened on the end effector, and the elastic component is an elastic suction cup installed at the adsorption hole and connected to the air passage of the corresponding negative pressure component, used to tightly fit the workpiece surface in a warped state through its own deformation.

5. The device front-end module as described in claim 4, characterized in that, The transmission device includes: A transverse axis, disposed within the transmission chamber, is used to provide driving force in the horizontal linear direction; A robotic arm is mounted on the transverse axis, and an end effector is connected to the end of the robotic arm. The robotic arm is used to move a workpiece via the end effector.

6. The device front-end module as described in claim 2, characterized in that, The pre-alignment device includes: A motion platform is used to carry and drive the workpiece to move in a horizontal plane; An optical detection assembly is fixedly mounted above the motion platform, including a vision sensor for acquiring a reference mark image of the workpiece surface and a distance sensor for non-contact measurement of the height information of the workpiece surface. The controller is used to calculate the position and rotation deviation of the workpiece in the plane based on the reference mark image, calculate the height and tilt deviation of the workpiece in the vertical direction based on the height information, and fuse them into the six-degree-of-freedom pose information of the workpiece, and correct the target space coordinates and attitude of the end effector based on the six-degree-of-freedom pose information.

7. The device front-end module as described in claim 2, characterized in that, The loading port includes: A door opening mechanism for opening the sealed door of the vehicle; The limit adjustment mechanism includes guide blocks that can slide along the width direction of the loading port. The limit adjustment mechanism is used to adapt to vehicles of different sizes by adjusting the spacing of the guide blocks.

8. The device front-end module according to any one of claims 1-7, characterized in that, Also includes: A fan filter unit, located at the top of the frame, is used to provide vertically downward laminar clean air into the transmission chamber so that the transmission chamber meets a preset cleanliness standard.

9. A control method, implemented based on the device front-end module according to any one of claims 1-8, characterized in that, include: The end effector of the transmission device is controlled to grasp the workpiece; Acquire negative pressure detection data for each independent adsorption zone, and adjust the negative pressure state of each adsorption zone independently and dynamically adjust the motion parameters of the transmission device when transporting the workpiece accordingly. The transmission device is controlled to transmit the workpiece to the pre-alignment device for detection in order to obtain the workpiece's pose information; Based on the pose information, the transmission device is controlled to correct the spatial pose of the end effector so as to align and transmit the corrected workpiece to the downstream process equipment.

10. A semiconductor manufacturing apparatus, characterized in that, It includes back-end process equipment and a front-end module as described in any one of claims 1-8, wherein the front-end module is connected to the front side of the back-end process equipment and is used to load, unload, and align workpieces to the back-end process equipment.

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