Etching solution with high etching rate selection ratio as well as preparation method and application of etching solution

By preparing an etchant containing organic acids, inorganic acids, oxidants, and additives with a high etch rate selectivity, the problems of color residue and insufficient etch rate in existing etchants are solved, achieving fast etch rate, high selectivity, and good etch uniformity, thus improving the imaging quality of semiconductor display panels.

CN122344728APending Publication Date: 2026-07-07LIANSHI NEW MATERIAL CORP LTD
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Patent Information

Application Number
CN202610409095.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-03-31
Publication Date
2026-07-07

AI Technical Summary

Technical Problem

Existing etching solutions may produce a light blue color, which cannot guarantee that the TFT-array will be free of color residue after etching. Furthermore, the etching rate and selectivity are insufficient, affecting the imaging effect of the semiconductor display panel.

Method used

A high etching rate selectivity etching solution is used, which contains organic acid, inorganic acid, oxidant, nitrate and additives. By adjusting the charge distribution on the metal surface and forming a protective film, excessive etching is inhibited. The etching solution is clear and colorless, and the component ratio is 5-10 parts organic acid, 60-80 parts inorganic acid, 8-15 parts oxidant, 1-2 parts nitrate, 1-2 parts additives and 5-15 parts pure water.

Benefits of technology

It achieves clear and colorless etching solution, fast etching rate, high selectivity, and good etching uniformity, avoids metal layer shrinkage, and improves the imaging effect of semiconductor display panels.

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Abstract

The invention discloses an etching solution with a high etching rate selection ratio and a preparation method and application thereof, and the etching solution comprises the following components in parts by mass: 5-10 parts of organic acid, 60-80 parts of inorganic acid, 8-15 parts of an oxidant, 1-2 parts of nitrate, 1-2 parts of an additive and 5-15 parts of pure water. The nitrate comprises at least one of sodium nitrate, potassium nitrate, calcium nitrate and ammonium nitrate; the additive is an organic sulfide substance. The etching liquid is clear, colorless, high in etching rate, high in selection ratio, simple and convenient in preparation method and good in etching uniformity, can be applied to the field of manufacturing of etched semiconductor display panels, and mainly solves the problem that after a Mo / Al / Ti substrate is etched, upper-layer metal (an Al & Mo layer) shrinks inwards seriously.
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