A method for manufacturing a semiconductor structure, a manufacturing apparatus, and a support base

Abstract

The application provides a semiconductor structure preparation method, a preparation device and a support base. The support base is internally provided with an adsorption chamber. The support base is provided with a bearing top wall for bearing a connecting piece at the top of the adsorption chamber. The bearing top wall is provided with at least one unit bearing area. Each unit bearing area is provided with a plurality of adsorption holes which are in communication with the adsorption chamber. The support base is provided with a plurality of plugging control pieces which are respectively corresponding to at least part of the adsorption holes. The plugging control pieces are used for plugging or opening the corresponding adsorption holes. The support base can be used for connecting pieces in the form of a plurality of independent structures, so that a connecting piece with a redundant connecting structure, such as a lead frame, is not needed. The support base is suitable for the preparation of products with various sizes, is beneficial to cost reduction, and can be used for connecting pieces made of different materials and is suitable for the preparation of more types of semiconductor products.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a method for preparing a semiconductor structure, preparation equipment, and a support base. Background Technology

[0002] Currently, there are various semiconductor packaging forms, such as TO-220, TO-247, QFN, PDFN, TOLL, and TOLT. Different semiconductor packaging forms have different requirements and standards, and different packaging forms generally cannot share the same lead frame. In order to realize different packaging forms, related technologies construct separate pipelines for different packaging forms to achieve production. Summary of the Invention

[0003] This application provides a support base, the support base having an adsorption chamber inside, the support base having a bearing top wall located at the top of the adsorption chamber and used to support the connector, the bearing top wall having at least one unit bearing area, each unit bearing area having a plurality of adsorption holes that can communicate with the adsorption chamber; the support base having a sealing control component corresponding to at least some of the adsorption holes respectively, the sealing control component being used to seal or open the corresponding adsorption holes.

[0004] In some embodiments, the support base includes a support bottom wall opposite to the bearing top wall, and the sealing control member includes a driving part and a sealing part disposed on the driving part. The driving part is disposed on the support bottom wall, and the corresponding adsorption hole is sealed or opened by controlling the extension and retraction of the sealing part through the driving part. The sealing part extends into the corresponding adsorption hole to seal the adsorption hole, and the sealing part retracts from the adsorption hole into the adsorption chamber to open the adsorption hole.

[0005] In some embodiments, the drive unit includes a deformable quadrilateral support frame consisting of a first rod, a second rod, a third rod, and a fourth rod connected end to end in sequence, and a set of control links connected to a set of diagonals of the quadrilateral support frame, the length of which is adjustable; the sealing part is connected to one of the diagonals of another set of diagonals of the quadrilateral support frame; the support base is configured to control the extension and retraction of the sealing part by controlling the length of the control links.

[0006] In some embodiments, the control link includes a first connecting part, a second connecting part, a control motor, and a screw connected to the output shaft of the control motor. The control motor is disposed in the first connecting part, the screw is disposed in the second connecting part, and the drive part is the control motor. The support base is configured to control the length of the control link by controlling the control motor to rotate forward or backward.

[0007] In some embodiments, each adsorption pore corresponds to a sealing control element, and the support base further includes:

[0008] The controller, with a PLC matrix control circuit, is configured to control each plugging control element to plug or open the corresponding adsorption orifice.

[0009] In some embodiments, the support base includes a support bottom wall opposite to the support top wall, the support bottom wall having two first side walls opposite each other in a first direction, the support top wall having two second side walls opposite each of the two first side walls, the first side walls, the second side walls, the support bottom wall and the support top wall forming the adsorption chamber, and a sealing strip being provided at the connection between the first side walls and the second side walls.

[0010] In some embodiments, the first sidewall and the opposite second sidewall are mortise and tenon connected.

[0011] In some embodiments, the support base includes a support body and two opposing support brackets. The support body includes a support bottom wall, a load-bearing top wall, a first side wall, and a second side wall. The two support brackets are respectively disposed at both ends of the support body in a second direction.

[0012] The support base is equipped with a lifting drive mechanism, which can be used to adjust the height of the support body.

[0013] This application also provides a semiconductor structure fabrication apparatus, including the support base as described above, as well as an adsorption and transfer device, a wafer mounting device, a bonding device, and a molding device;

[0014] The adsorption transfer device is used to arrange multiple connectors in a preset arrangement in each unit bearing area of ​​the bearing top wall; the semiconductor structure fabrication equipment is configured to control the sealing control component to seal the adsorption holes located outside the coverage area of ​​each connector, and to open the adsorption holes covered by each connector; wherein, each connector covers at least one adsorption hole; the multiple connectors include a bearing connector and an external connector arranged on at least one side of the bearing connector;

[0015] The mounting device is used to place bare films on each of the supporting connectors;

[0016] The bonding device is used to bond the bare die to the corresponding external connector.

[0017] The sealing device is used to seal the bare sheet and each connector located on the support base.

[0018] In some embodiments, the preparation apparatus further includes a camera device disposed above the support top wall to acquire an image of the surface of the support top wall facing away from the adsorption chamber, so as to determine the adsorption holes located outside the coverage area of ​​each connector and the adsorption holes covered by each connector.

[0019] This application also provides a method for fabricating a semiconductor structure, applied to the semiconductor structure fabrication equipment described above, the method comprising:

[0020] Provides a support base;

[0021] Multiple connectors are arranged in a preset arrangement in each unit bearing area of ​​the bearing top wall, and the sealing control component is controlled to seal the adsorption holes located outside the coverage area of ​​each connector, and to open the adsorption holes covered by each connector so that each connector is adsorbed and fixed by the adsorption holes.

[0022] A bare sheet is set on each load-bearing connector, and the bare sheet is bonded to the corresponding external connector;

[0023] The bare sheet and each connector located on the support base are encapsulated in plastic;

[0024] Remove the support base.

[0025] In some embodiments, after arranging multiple connectors in a preset configuration within the unit bearing area of ​​the bearing top wall, and before controlling the sealing control component to seal the adsorption holes located outside the coverage area of ​​each connector, the method includes:

[0026] Acquire an image of the surface of the top wall of the support that is away from the adsorption chamber;

[0027] Based on the image, the adsorption holes located outside the coverage area of ​​each connector and the corresponding adsorption holes covered by each connector are determined.

[0028] The main technical effects achieved by the embodiments of this application are:

[0029] The semiconductor structure fabrication method, fabrication equipment, and support base provided in this application embodiment utilize the support base, which is configured to have an internal adsorption chamber. The support base has a support top wall located at the top of the adsorption chamber and used to support connectors. The support top wall has at least one unit support area, and each unit support area has multiple adsorption holes that can communicate with the adsorption chamber. The support base is provided with a sealing control component corresponding to at least some of the adsorption holes. The sealing control component is used to seal or open the corresponding adsorption holes. This support base is applicable to connectors with multiple independent structures, eliminating the need for connectors such as lead frames with redundant connection structures. It is suitable for the fabrication of products of various sizes, which helps to reduce costs. It can also be used for connector structures made of different materials, making it suitable for the fabrication of more types of semiconductor products. Attached Figure Description

[0030] Figure 1 This is a flowchart illustrating a method for fabricating a semiconductor structure according to an exemplary embodiment of this application;

[0031] Figures 2 to 6 This is a fabrication process diagram of a semiconductor structure provided in an exemplary embodiment of this application; wherein, Figure 2 (a) shows the provided connector, and (b) shows a schematic diagram of the arrangement of multiple connectors according to a preset arrangement rule. Figure 6 (a), (b), and (c) are schematic diagrams of the semiconductor structure from different perspectives.

[0032] Figure 7 This is a schematic diagram of a connector in a semiconductor fabrication process provided by another exemplary embodiment of this application; wherein, Figure 7 (a) shows the connector provided, and (b) shows the arrangement diagram of multiple connectors arranged according to a preset arrangement rule;

[0033] Figure 8 This is a structural diagram of a support base provided in an exemplary embodiment of this application; Figure 8 (a), (b), and (c) are schematic diagrams of the supporting base from different perspectives;

[0034] Figure 9 It is along Figure 8 The cross-sectional view of the supporting structure obtained by section line AA shown.

[0035] Figure 10 This is a side view of a semiconductor structure fabrication apparatus, including a support base and a camera device, provided in an exemplary embodiment of this application.

[0036] Figure 11This is a partial structural schematic diagram of a support base for a semiconductor structure provided in an exemplary embodiment of this application;

[0037] Figure 12 This is a schematic diagram of the structure of a control and blocking control element provided in an exemplary embodiment of this application;

[0038] Figure 13 This is a schematic diagram of a structure for controlling the opening of the adsorption hole by a control element of an exemplary embodiment of this application;

[0039] Figure 14 This is a schematic diagram of the structure of a control and plugging control element for plugging adsorption holes, provided in an exemplary embodiment of this application;

[0040] Figure 15 This is a schematic diagram of the structure of a control linkage provided in an exemplary embodiment of this application;

[0041] Figure 16 This is a side view of a seat support provided in an exemplary embodiment of this application;

[0042] Figure 17 This is a cross-sectional view of the internal structure of a seat provided in an exemplary embodiment of this application;

[0043] Figure 18 This is an exemplary embodiment of a PLC matrix control circuit provided in this application. Detailed Implementation

[0044] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0045] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a,” “the,” and “the” used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0046] The following is in conjunction with the appendix Figures 1 to 18 The following describes some embodiments of this application in detail. Unless otherwise specified, the embodiments and features described below can be combined with each other.

[0047] Reference Figure 1and combine when necessary Figures 2 to 18 As shown, this application provides a method for fabricating a semiconductor structure, which includes the following steps S101 to S109:

[0048] Step S101: A support base is provided, the support base having an adsorption chamber inside, the support base having a bearing top wall located at the top of the adsorption chamber and used to support the connector, the bearing top wall having at least one unit bearing area, each unit bearing area having multiple adsorption holes that can communicate with the adsorption chamber; the support base is provided with a sealing control component corresponding to at least some of the adsorption holes, the sealing control component being used to seal or open the corresponding adsorption hole;

[0049] Step S103: Arrange multiple connectors in a preset layout in each unit bearing area of ​​the bearing top wall, and control the sealing control component to seal the adsorption holes located outside the coverage area of ​​each connector, and open the adsorption holes covered by each connector so that each connector is adsorbed and fixed by the adsorption holes; wherein, each connector covers at least one adsorption hole; the multiple connectors include bearing connectors and external connectors arranged on at least one side of the bearing connectors;

[0050] Step S105: Set bare plates on each bearing connector and bond the bare plates to the corresponding external connectors;

[0051] Step S107: The bare sheet and each connector located on the support base are encapsulated in plastic;

[0052] Step S109: Remove the support base.

[0053] The above-mentioned semiconductor structure fabrication method sets the connectors as multiple independent structures and arranges them on a support base with adsorption holes according to a preset rule. Then, the wafers are mounted, bonded, and encapsulated, and the support base is removed. This eliminates the need for connectors such as lead frames with redundant connection structures, making it suitable for the fabrication of products of various sizes, which helps to reduce costs. Furthermore, it can be used with connector structures made of different materials, making it suitable for the fabrication of more types of semiconductor products.

[0054] The following is combined with Figures 2 to 18 The fabrication method of the above semiconductor structure is described in detail.

[0055] In step S101, a support base 100 is provided. (This is followed by a seemingly unrelated sentence fragment: "in conjunction with...") Figures 8 to 17The support base 100 has an adsorption chamber 102 inside. The support base 100 has a supporting top wall 10 located at the top of the adsorption chamber 102 and used to support the connector 200. The supporting top wall 10 has at least one unit bearing area, and each unit bearing area has multiple adsorption holes 101 that can communicate with the adsorption chamber 102. The support base 100 is provided with sealing control components 50 corresponding to at least some of the adsorption holes 101. The sealing control components are used to seal or open the corresponding adsorption holes 101. When a corresponding adsorption hole 101 needs to be sealed, the sealing control component 50 can seal the corresponding adsorption hole 101; when a corresponding adsorption hole 101 needs to be opened and communicates with the adsorption chamber 102, the sealing control component 50 can open the corresponding adsorption hole 101.

[0056] Each unit carrying region corresponds to the formation of a semiconductor structure. Figure 8 The support base 100 shown may have only one unit bearing area. Accordingly, during the fabrication of a semiconductor structure, it may be used to support only one semiconductor structure at a time.

[0057] In some embodiments, the support base 100 includes a support bottom wall 20 opposite to the bearing top wall 10, and the sealing control member 50 includes a driving part 52 and a sealing part 51 disposed on the driving part 52. The driving part 52 is disposed on the support bottom wall 20, and the extension and retraction of the sealing part 51 is controlled by controlling the driving part 52 to seal or open the corresponding adsorption hole 101. The sealing part 51 extends into the corresponding adsorption hole 101 to seal the adsorption hole 101, such as... Figure 14 As shown. The sealing part 51 retracts from the adsorption hole 101 into the adsorption chamber 102 to open the adsorption hole 101, as... Figure 13 As shown.

[0058] Accordingly, controlling the sealing part 51 to seal the adsorption hole 101 may include: controlling the sealing part 51 to extend into the adsorption hole 101 to seal the adsorption hole 101.

[0059] Accordingly, controlling the blocking part 51 to open the adsorption hole 101 may include controlling the driving part 52 to control the blocking part 51 to retract into the adsorption chamber 102.

[0060] In some embodiments, the drive unit 52 includes a deformable quadrilateral support frame composed of a first rod 521, a second rod 522, a third rod 523, and a fourth rod 524 connected end to end, and a control link 525 connected to a set of diagonal corners of the quadrilateral support frame, the length of the control link 525 being adjustable; the sealing part 51 is connected to one diagonal of another set of diagonal corners of the quadrilateral support frame; controlling the extension and retraction of the sealing part 51 by the drive unit 52 includes:

[0061] The length of the control link 525 is controlled to control the extension and retraction of the sealing part 51.

[0062] In some embodiments, the adsorption chamber 102 is provided with a baffle 80 spaced apart from the sealing control member 50. The baffle 80 has multiple openings to facilitate vacuum operation, such as... Figure 11 As shown. The baffle 80 can improve the structural strength of the support base and also prevent mutual interference between adjacent blocking control components 50. A baffle 80 can be installed between every two adjacent blocking control components 50. Baffles 80 can also be installed between some adjacent blocking control components 50. The location and number of baffles 80 can be set according to specific needs.

[0063] In some embodiments, the control link 525 includes a first connecting portion 5251, a second connecting portion 5252, a control motor 5253, and a screw 5254 connected to the output shaft of the control motor 5253. The control motor 5253 is disposed in the first connecting portion 5251, the screw 5254 is disposed in the second connecting portion 5252, and the driving portion 52 is the control motor 5253. Controlling the length of the control link 525 includes:

[0064] The control motor 5253 is controlled to rotate forward or backward to control the length of the control link 525.

[0065] In some embodiments, each adsorption pore 101 corresponds to a sealing control element 50.

[0066] In some embodiments, the support base 100 may also include a controller (not shown).

[0067] The controller may include a PLC matrix control circuit. Accordingly, the controller may use a PLC matrix control circuit to control each sealing control element 50 to seal or open the corresponding adsorption hole 101.

[0068] In some embodiments, the PLC matrix control circuit may be as follows: Figure 18As shown in the diagram, in this PLC matrix control circuit, the blocking control components 50 are arranged in multiple rows and columns. Each row can share one signal switch, and each column can share one signal switch for control. For example, the blocking control components 50 are arranged in 6 rows and 13 columns. The 6 rows are Row1, Row2, Row3, Row4, Row5, and Row6, controlled by signal switches T1 to T6 respectively. The 13 columns are Col1, Col2…Col13, controlled by signal switches S1 to S13 respectively.

[0069] Of course, in some other embodiments, the controller can also control each sealing control element to seal or open the corresponding adsorption hole through other control circuits.

[0070] Combination Figure 2 and Figure 3 as well as Figure 6 and Figure 7 In step S103, multiple connectors 200 are arranged in a preset layout in each unit bearing area of ​​the bearing top wall 10. Each connector 200 covers at least one adsorption hole 101. The sealing control device 50 is controlled to open the adsorption holes 101 covered by each connector 200 so that each connector 200 is adsorbed and fixed by the adsorption holes 101, and the adsorption holes 101 located outside the coverage area of ​​each connector 200 are sealed. The multiple connectors 200 include a bearing connector 201 and external connectors 202 and 203 arranged on at least one side of the bearing connector 201. The bearing connector 201 can be arranged in the middle area of ​​the corresponding unit bearing area.

[0071] The arrangement of connectors 200 can be preset as needed.

[0072] Figure 2 and Figure 7 Two arrangement methods are provided as examples: the load-bearing connectors 201 can be spaced apart or partially connected together to form a larger load-bearing connector. It should be noted that... Figure 2 (a) and Figure 2 The number of connectors in parts (b) are not exactly the same. Figure 2 (a) mainly illustrates several types of connectors by way of example. Figure 2 (b) Arrange the connectors according to these types of connectors. Figure 7 (a) and Figure 7 Similar to (b).

[0073] The connector 200 includes at least one of copper sheet, iron sheet, PCB sheet, and circuit board to further improve the applicability of the support base.

[0074] After arranging multiple connectors 200 in a preset layout in each unit bearing area of ​​the bearing top wall 10, and before controlling the sealing control component 50 to seal the adsorption holes 101 located outside the coverage area of ​​each connector, the method includes:

[0075] Acquire an image of the surface of the top wall 10 facing away from the adsorption chamber 102;

[0076] Based on the image, the adsorption holes 101 located outside the coverage area of ​​each connector 200 and the adsorption holes 101 covered by each connector 200 are determined, so as to enable the intelligent control of the sealing control component 50 to seal or open the corresponding adsorption holes 101.

[0077] like Figure 15 As shown, an image of the surface S1001 of the top wall 10 facing away from the adsorption chamber 102 can be obtained.

[0078] In this application, at least a portion of the adsorption holes 101 located outside the coverage area of ​​each connector 200 are all adsorption holes 101 located outside the coverage area of ​​each connector 200.

[0079] Combination Figure 3 As shown, in step S105, a bare die 300 is provided on each bearing connector 201, and the bare die 300 is bonded to the corresponding external connectors 202 and 203 to form a bonding line 400.

[0080] Combination Figure 4 and Figure 5 Step S107: The bare sheet 300 and each connector 200 located on the support base 100 are encapsulated to form an encapsulated body 500. This step can be performed in an encapsulation device 600.

[0081] The molding equipment 600 can be installed on each unit bearing area to cover the connector 200, the bare die 300 and bonding wire 400 installed on the connector 200, etc. Figure 4 and Figure 5 The bare die 300 and part of the bond line 400 are illustrated only as examples.

[0082] The molding apparatus 600 may include a molding material inlet 601 for dispensing molding material.

[0083] Step S109, remove the support base 100, which can form as shown in the figure. Figure 6 The semiconductor structure shown is 1000.

[0084] This application embodiment also provides a semiconductor structure fabrication apparatus, which can be used to perform the above-described semiconductor structure fabrication method, and includes a support base 100, an adsorption and transfer device, a wafer mounting device, a bonding device, and a molding device.

[0085] The support base 100 has an adsorption chamber 102 inside. The support base 100 has a supporting top wall 10 for supporting the connector 200. The supporting top wall 10 has at least one unit supporting area, and each unit supporting area has multiple adsorption holes 101 that can communicate with the adsorption chamber 102. The support base 100 is provided with sealing control components 50 corresponding to at least some of the adsorption holes 101. The sealing control components 50 are used to seal or open the corresponding adsorption holes 101. Specifically, the sealing control components 50 are used to seal the corresponding adsorption holes 101 when they need to be sealed, and to open the corresponding adsorption holes 101 when they need to communicate with the adsorption chamber 102.

[0086] By employing the support base 100, which is configured to have an internal adsorption chamber 102, the support base 100 has a supporting top wall 10 located at the top of the adsorption chamber 102 and used to support the connector 200. The supporting top wall 10 has at least one unit supporting area, and each unit supporting area has multiple adsorption holes 101 that can communicate with the adsorption chamber 102. The support base 100 is provided with a sealing control element 50 corresponding to at least some of the adsorption holes 101. The sealing control element 50 is used to seal or open the corresponding adsorption holes 101. This support base 100 can be used to set the connector 200 as multiple independent structures, and by arranging them on the support base 100 with adsorption holes 101 according to a preset rule, it eliminates the need for connectors such as lead frames with redundant connection structures, making it suitable for the preparation of products of various sizes, which helps to reduce costs. It can also be used for connector structures made of different materials, making it suitable for the preparation of more types of semiconductor products.

[0087] In some embodiments, the support base 100 includes a support bottom wall 20 opposite to the bearing top wall 10, and the sealing control member 50 includes a driving part 52 and a sealing part 51 disposed on the driving part 52. The driving part 52 is disposed on the support bottom wall 20, and the corresponding adsorption hole 101 is sealed or opened by controlling the extension and retraction of the sealing part 51 through the driving part 52. The sealing part 51 extends into the corresponding adsorption hole 101 to seal the adsorption hole 101, such as... Figure 14 As shown. The sealing part 51 retracts from the adsorption hole 101 into the adsorption chamber 102 to open the adsorption hole 101, as... Figure 13 As shown.

[0088] In some embodiments, the drive unit 52 includes a deformable quadrilateral support frame composed of a first rod 521, a second rod 522, a third rod 523, and a fourth rod 524 connected end-to-end, and a control link 525 connected to a set of diagonals 501 and 503 of the quadrilateral support frame, the length of which is adjustable. The sealing part 51 is connected to one of the diagonals 504 of another set of diagonals 502 and 504 of the quadrilateral support frame. The other diagonal 502 can be mounted on the support base wall 20 via a baffle or other connecting structure. The support base 100 can be configured to control the extension and retraction of the sealing part 51 by controlling the length of the control link 525 through the drive unit 52.

[0089] In some embodiments, the control link 525 includes a first connecting portion 5251, a second connecting portion 5252, a control motor 5253, and a screw 5254 connected to the output shaft of the control motor 5253. The control motor 5253 is disposed in the first connecting portion 5251, the screw 5254 is disposed in the second connecting portion 5252, and the drive portion 52 is the control motor 5253. The semiconductor structure fabrication apparatus is configured to control the control motor 5253 to rotate forward or backward to control the length of the control link 525.

[0090] In some embodiments, each adsorption pore 101 corresponds to a sealing control element 50.

[0091] The support base 100 may also include a controller (not shown). The controller may be a microcontroller capable of controlling the operation of each control motor, and may be integrated inside the support base 100 or set separately outside the support body including the top wall.

[0092] The controller may include a PLC matrix control circuit. Accordingly, the controller may use a PLC matrix control circuit to control each sealing control element 50 to seal or open the corresponding adsorption hole 101.

[0093] In some embodiments, the PLC matrix control circuit diagram may adopt the following format: Figure 18 The circuit diagram shown is used for control. In this PLC matrix control circuit, the blocking control components 50 are arranged in multiple rows and columns. Each row can share one signal switch, and each column can share one signal switch for control. For example, the blocking control components 50 are arranged in 6 rows and 13 columns. For instance, the 6 rows are Row1, Row2, Row3, Row4, Row5, and Row6, which are controlled by signal switches T1 to T6 respectively. The 13 columns are Col1, Col2...Col13, which are controlled by signal switches S1 to S13 respectively.

[0094] Of course, in some other embodiments, the controller can also control each sealing control element to seal or open the corresponding adsorption hole through other control circuits.

[0095] In some embodiments, the support base 100 includes a support bottom wall 20 opposite to the support top wall 10. The support bottom wall 20 has two first side walls 60 opposite to each other in a first direction W. The support top wall 10 is provided with two second side walls 70 respectively opposite to the two first side walls 60. The first side walls 60, the second side walls 70, the support bottom wall 20, and the support top wall 10 form the adsorption chamber 102. A sealing strip 30 is provided at the connection between the first side walls 60 and the second side walls 70.

[0096] In some embodiments, the first sidewall 60 and the opposite second sidewall 70 are mortised and tenoned together, such as... Figure 9 As shown.

[0097] like Figure 9 As shown, the first sidewall 60 can be integrally formed with the supporting bottom wall 20. The second sidewall 70 can be integrally formed to support the top wall 10.

[0098] It should be noted that the adsorption chamber 102 may also be provided with sealing walls at both ends in the second direction L.

[0099] Combination Figure 9 As shown, for the first sidewall 60 and the opposite second sidewall 70 connected by mortise and tenon joints, the sealing wall 2001 at one end can be integrally formed with the supporting bottom wall 20 and the first sidewall 60, and the sealing wall at the other end can be integrally formed with the bearing top wall 10 and the second sidewall 70.

[0100] Understandably, other methods can also be used to seal the wall. The first and second sidewalls can also be connected using other methods.

[0101] In some embodiments, the support base 100 includes a support body 1 and two support brackets 40. The support body 1 includes a support bottom wall 20, a load-bearing top wall 10, a first side wall 60, and a second side wall 70. The two support brackets 40 are respectively disposed at both ends of the support body 1 in the second direction L.

[0102] A vacuum inlet 401 may be provided on the support base 40 at one end to evacuate the adsorption chamber 102, thereby allowing the adsorption port 101 to adsorb the corresponding connector 200. Correspondingly, for those with a sealing wall, an inlet hole may be provided on the sealing wall at the end where the vacuum inlet 401 is located.

[0103] In some embodiments, the semiconductor structure fabrication apparatus may further include a vacuum device to evacuate the adsorption chamber 102 when the adsorption connector 200 is required.

[0104] It is understood that in some other embodiments, the support bracket 40 may be configured to include a bracket housing 41. The bracket housing 41 of the support bracket 40 at least at one end may serve as a sealing wall to enclose the bottom support wall 20, the top support wall 10, and the corresponding side walls to form an adsorption chamber 102.

[0105] The support base 40 is provided with a lifting drive mechanism 42, which can be used to adjust the height of the support body 1.

[0106] Combination Figure 16 and Figure 17 As shown, the support seat 40 may include a seat housing 41, which has a seat space inside. A lifting drive mechanism 42 is provided within this seat space. The support body 1 is connected to the lifting drive mechanism 42 and can rise and fall with the lifting drive mechanism 42.

[0107] The lifting drive mechanism 42 can be configured similarly to the drive unit 52. It has two sets of stacked, end-to-end connected linkage units 421. A drive plate 46 is disposed between the two linkage units 421. The support body 1 can be connected to the drive plate 46. A screw 45 can be longitudinally assembled onto the linkage unit 421 and the drive plate 46. As the screw 45 rotates, the drive plate 46 is raised and lowered, thereby driving the support body 1 to rise and fall.

[0108] The seat housing 41 has two opposing mounting holes for mounting the screw 45. Fixing baffles 43 and 44 are respectively provided inside the two opposing mounting holes. These baffles fix the lifting drive mechanism 42 and limit its movement at both ends.

[0109] The screw 45 can be electrically driven or manually driven. If electrically driven, a drive motor can be provided to rotate the screw 45, and the rotation of the screw 45 is controlled by controlling the drive motor. If manually driven, at least one end of the screw 45 is exposed or extends beyond the support housing 41 for rotational operation.

[0110] The adsorption transfer device is used to arrange multiple connectors 200 in a preset arrangement in each unit bearing area of ​​the bearing top wall 10, with each connector 200 corresponding to cover at least one adsorption hole 101; wherein, the semiconductor structure fabrication equipment is configured to control the sealing control device 50 to open the adsorption holes 101 covered by each connector 200 so that each connector 200 is adsorbed and fixed by the adsorption holes 101, and to seal the adsorption holes 101 located outside the area covered by each connector 200; the multiple connectors 200 include a bearing connector 201 located in the middle of each unit bearing area, and external connectors 202, 203 located on at least one side of the bearing connector 201.

[0111] The adsorption transfer device may include a robotic arm with a suction head.

[0112] The mounting device is used to mount bare wafers 300 on each of the supporting connectors 201.

[0113] The bonding device is used to bond the bare die 300 to the corresponding external connectors 202 and 203.

[0114] The molding device is used to mold the bare sheet 300 and each connector 200 located on the support base 100.

[0115] In some embodiments, the semiconductor structure fabrication apparatus further includes an imaging device 700. The imaging device 700 may be disposed above the support top wall 10 to acquire an image of the upper surface S1001 of the support top wall 10 in order to determine the adsorption holes 101 that need to be sealed.

[0116] The camera device 700 can be a high-definition camera. This high-definition camera can acquire images of the upper surface S1001 of the supporting top wall 10, row by row or column by column, along the direction of the arrangement of the adsorption holes 101. Figure 10 As shown. Alternatively, an image of the entire area of ​​the entire upper surface S1001 can be acquired at once.

[0117] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims.

[0118] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A support base, characterized in that, The support base has an adsorption chamber inside. The support base has a bearing top wall located at the top of the adsorption chamber and used to support the connector. The bearing top wall has at least one unit bearing area. Each unit bearing area has multiple adsorption holes that can communicate with the adsorption chamber. The support base is provided with a sealing control component corresponding to at least some of the adsorption holes. The sealing control component is used to seal or open the corresponding adsorption hole.

2. The support base as described in claim 1, characterized in that, The support base includes a support bottom wall opposite to the bearing top wall. The sealing control component includes a driving part and a sealing part disposed on the driving part. The driving part is disposed on the support bottom wall. By controlling the driving part to control the extension and retraction of the sealing part, the corresponding adsorption hole is sealed or opened. The sealing part extends into the corresponding adsorption hole to seal the adsorption hole, and the sealing part retracts from the adsorption hole into the adsorption chamber to open the adsorption hole.

3. The support base as described in claim 2, characterized in that, The drive unit includes a deformable quadrilateral support frame consisting of a first rod, a second rod, a third rod, and a fourth rod connected end to end, and a set of control links connected to a set of diagonals of the quadrilateral support frame, the length of which is adjustable; the sealing part is connected to one of the diagonals of another set of diagonals of the quadrilateral support frame; the support base is configured to control the extension and retraction of the sealing part by controlling the length of the control links.

4. The support base as described in claim 3, characterized in that, The control link includes a first connecting part, a second connecting part, a control motor, and a screw connected to the output shaft of the control motor. The control motor is located in the first connecting part, the screw is located in the second connecting part, and the drive part is the control motor. The support base is configured to control the length of the control link by controlling the control motor to rotate forward or backward.

5. The support base as described in any one of claims 1 to 4, characterized in that, Each adsorption hole corresponds to a sealing control component, and the support base also includes: The controller, with a PLC matrix control circuit, is configured to control each plugging control element to plug or open the corresponding adsorption orifice.

6. The support base as described in claim 1, characterized in that, The support base includes a support bottom wall opposite to the support top wall. The support bottom wall has two first side walls opposite to each other in a first direction. The support top wall has two second side walls opposite to the two first side walls respectively. The first side walls, the second side walls, the support bottom wall, and the support top wall form the adsorption chamber. A sealing strip is provided at the connection between the first side walls and the second side walls.

7. The support base as described in claim 6, characterized in that, The support base includes a support body and two opposing support brackets. The support body includes a support bottom wall, a load-bearing top wall, a first side wall, and a second side wall. The two support brackets are respectively located at both ends of the support body in a second direction. The support base is equipped with a lifting drive mechanism, which can be used to adjust the height of the support body.

8. A semiconductor structure fabrication apparatus, characterized in that, It includes a support base as described in any one of claims 1 to 7, as well as an adsorption transfer device, a tablet mounting device, a bonding device, and a molding device; The adsorption transfer device is used to arrange multiple connectors in a preset arrangement in each unit bearing area of ​​the bearing top wall; the semiconductor structure fabrication equipment is configured to control the sealing control component to seal the adsorption holes located outside the coverage area of ​​each connector, and to open the adsorption holes covered by each connector; wherein, each connector covers at least one adsorption hole; the multiple connectors include a bearing connector and an external connector arranged on at least one side of the bearing connector; The mounting device is used to place bare films on each of the supporting connectors; The bonding device is used to bond the bare die to the corresponding external connector. The sealing device is used to seal the bare sheet and each connector located on the support base.

9. The semiconductor structure fabrication apparatus as described in claim 8, characterized in that, The preparation equipment also includes a camera device, which is located above the top wall of the support to obtain an image of the surface of the top wall of the support away from the adsorption chamber, so as to determine the adsorption holes located outside the coverage area of ​​each connector and the adsorption holes covered by each connector.

10. A method for fabricating a semiconductor structure, applied to the fabrication apparatus for the semiconductor structure as described in claim 8 or 9, characterized in that, The method for preparing the semiconductor structure includes: Provides a support base; Multiple connectors are arranged in a preset arrangement in each unit bearing area of ​​the bearing top wall, and the sealing control component is controlled to seal the adsorption holes located outside the coverage area of ​​each connector, and to open the adsorption holes covered by each connector so that each connector is adsorbed and fixed by the adsorption holes. A bare sheet is set on each load-bearing connector, and the bare sheet is bonded to the corresponding external connector; The bare sheet and each connector located on the support base are encapsulated in plastic; Remove the support base.

11. The method for preparing a semiconductor structure as described in claim 10, characterized in that, After arranging multiple connectors in a preset layout within the unit bearing area of ​​the bearing top wall, and before controlling the sealing control component to seal the adsorption holes located outside the coverage area of ​​each connector, the method includes: Acquire an image of the surface of the top wall of the support that is away from the adsorption chamber; Based on the image, the adsorption holes located outside the coverage area of ​​each connector and the corresponding adsorption holes covered by each connector are determined.

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