Chemical polishing equipment based on integrated circuit processing

Abstract

This invention discloses a chemical polishing device based on integrated circuit processing, relating to the field of integrated circuit wafer manufacturing. It includes a polishing pad, a polishing head, a liquid infusion rack, a nozzle, and a frame. The frame is equipped with a cleaning mechanism, a driver, and a push-pull mechanism. The cleaning mechanism includes a cleaning frame mounted on the frame, with a sliding frame slidably mounted within the cleaning frame. A cleaning roller brush connected to the driver is rotatably mounted at the bottom of the sliding frame, and a suction box is provided on one side of the sliding frame. The outer wall of the sliding frame is connected to the push-pull mechanism. This invention, through an integrated structure of opposing rotating and reciprocating cleaning roller brushes with intermediate suction, completely solves the problems of traditional cleaning devices, such as single trajectory, blind spots, and easy secondary adhesion of impurities. It achieves efficient cleaning of the entire surface of the polishing pad without dead angles, significantly improving the uniformity and surface flatness of wafer polishing, meeting the high-precision processing requirements of integrated circuits.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit wafer manufacturing technology, specifically to a chemical polishing device based on integrated circuit processing. Background Technology

[0002] In the field of integrated circuit wafer manufacturing, chemical mechanical polishing (CMP) is a core precision process for achieving atomic-level global planarization of the wafer surface. It directly determines the chip manufacturing precision, surface quality, and yield, and is widely used in advanced semiconductor chip processing. CMP polishing equipment uses a polishing head to hold the wafer and a rotating polishing platform to drive the polishing pad. Combined with the chemical etching and mechanical abrasion of the polishing slurry, it completes the ultra-precision planarization of the wafer surface. The polishing pad cleaning mechanism is a key supporting component that ensures polishing precision and prevents impurities from scratching the wafer.

[0003] Existing chemical mechanical polishing (CMP) equipment for integrated circuit processing mainly consists of a main unit, a wafer polishing head, a rotary polishing platform, a polishing pad, a polishing slurry supply system, and a polishing pad cleaning head. Its polishing pad cleaning mechanism employs a composite motion structure of cleaning head rotation and frame oscillation. The high-speed rotation of the cleaning head generates brushing force, while the drive frame simultaneously propels the cleaning head to oscillate reciprocally along the polishing pad surface. Through this combination of rotational brushing and oscillating coverage, residual abrasive particles, wafer debris, and polishing slurry reactants are removed from the polishing pad surface, maintaining a clean surface and unobstructed pores. This is currently the most commonly used polishing pad cleaning technology solution in CMP equipment.

[0004] However, this type of cleaning structure has obvious defects in actual operation: the cleaning head only relies on its own rotation and the swing of the frame to achieve cleaning. The movement trajectory is simple and the coverage range is limited. It cannot completely cover the entire surface of the polishing pad, which easily creates fixed cleaning blind spots. The impurities remaining in the blind spots will continue to affect the polishing uniformity. At the same time, when the cleaning head swings back from the edge of the polishing pad to the center, it pushes and accumulates the debris brushed off towards the center of the polishing pad. It cannot remove the impurities from the cleaning area in time, causing the debris to re-adhere to the surface of the polishing pad, which greatly reduces the overall cleaning effect and affects the surface roughness and flatness accuracy of wafer polishing. It is difficult to meet the ultra-precision processing requirements of advanced integrated circuit manufacturing processes. Summary of the Invention

[0005] The purpose of this invention is to provide a chemical polishing device based on integrated circuit processing to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a chemical polishing device based on integrated circuit processing, comprising a polishing pad, a polishing head, an infusion rack, a nozzle, and a frame. The frame is equipped with a cleaning mechanism, a driver, and a push-pull mechanism. The cleaning mechanism includes a cleaning frame mounted on the frame, and a sliding frame is slidably mounted inside the cleaning frame. A cleaning roller brush connected to the driver is rotatably mounted on the bottom of the sliding frame. A suction box is provided on one side of the sliding frame, and the outer wall of the sliding frame is connected to the push-pull mechanism. A linkage is provided between the frame and the infusion stand, which includes a slide base installed on the top of the sliding frame and a slide frame slidably installed in the cleaning frame, as well as gears two and three rotatably installed on the outer wall of the cleaning frame and connected to each other. One side of the slide frame is connected to the slide base, and the other side is equipped with a rack one that meshes with gear two. A mounting bracket corresponding to the nozzle is slidably installed on the infusion stand, and a rack two that meshes with gear three is installed at the end of the mounting bracket.

[0007] Preferably, two sliding frames are installed inside the cleaning frame. One sliding frame is connected to the push-pull mechanism on its side wall, and the other sliding frame is equipped with a slide seat on its top. The outer walls of the two sliding frames are provided with toothed grooves, and a gear four that meshes with the toothed grooves is rotatably installed inside the cleaning frame. The suction box is located between the two sliding frames, and the length of the suction box and the cleaning roller brush is greater than the radius of the polishing pad.

[0008] Preferably, the driver includes a mounting box mounted on a frame, and two drive cylinders are rotatably mounted inside the mounting box. The outer walls of the two drive cylinders are fitted with meshing gears, and the ends of the drive cylinders are slidably connected to transmission blocks that are fixedly connected to the ends of the cleaning roller brush. The outer ends of the drive cylinders are connected to an external motor.

[0009] Preferably, the push-pull mechanism includes a reciprocating rod slidably mounted on the outer wall of the cleaning frame and connected to the side wall of the sliding frame, and a transmission frame is installed in the middle of the reciprocating rod. A drive disk is rotatably mounted on the outer wall of the cleaning frame, and a drive rod that cooperates with the transmission frame is installed on the outer wall of the drive disk. The drive disk is connected to an external motor.

[0010] Preferably, the slide block has a through hole corresponding to the slide frame to ensure that the slide block will slide and connect with the slide frame, and the diameter of the through hole is larger than the diameter of the cross section at the connection position between the slide frame and the slide block, and the end of the slide block is provided with a positioning mechanism.

[0011] Preferably, the control mechanism includes a lead screw threaded onto a slide, and a force-bearing block rotatably mounted on the inner end of the lead screw, which contacts the side wall of the slide. A limiting groove is provided on the outer wall of the rack, which slides with the force-bearing block. A drive block protruding from the outer wall of the cleaning frame is mounted on the outer end of the lead screw, and a drive handle rotatably mounted on the outer wall of the cleaning frame, which slides with the drive block.

[0012] Preferably, both the transmission block and the drive block have polygonal cross-sections, and the lengths of both the transmission block and the drive block are greater than the length of the sliding frame when it slides to one side.

[0013] Preferably, when one side of the slide is squeezed by the force block, the outer wall of the other side will be in contact with the inner wall of the slide end, and the sliding length of the force block, as well as the length of the rack and the slide, are all greater than the length of the slide that slides to one side, and the diameter of the second gear is smaller than the diameter of the third gear.

[0014] Preferably, multiple nozzles are installed at equal intervals at the bottom of the mounting frame, and a liquid supply pipe connected to the nozzles is connected to the end of the mounting frame, and the liquid supply pipe is designed as a corrugated pipe.

[0015] Compared with the prior art, the beneficial effects of the present invention are: 1. This invention, through the integrated structure of dual cleaning rollers rotating in opposite directions, reciprocating sweeping, and central suction, completely solves the problems of traditional cleaning devices having a single trajectory, blind spots, and easy secondary adhesion of impurities. It achieves efficient cleaning of the entire surface of the polishing pad without dead angles, significantly improves the uniformity and surface flatness of wafer polishing, and meets the high-precision processing requirements of integrated circuits.

[0016] 2. This invention adopts a linkage transmission design between the cleaning mechanism and the spraying system, so that while the cleaning roller brush moves back and forth, it automatically drives the spray head to spray synchronously back and forth, making the polishing liquid more evenly distributed and more fully wetted. There is no need to drive the spray head independently, the structure is simpler, the action is more synchronized, the energy consumption is lower, and the polishing and cleaning synergy effect is better.

[0017] 3. This invention, through an adjustable control mechanism, can flexibly adjust the nozzle travel and spray range, adapting to different specifications of polishing pads and different process requirements. The adjustment operation is simple and intuitive, and the positioning is accurate, greatly improving the equipment's versatility and process adaptability.

[0018] 4. This invention adopts a dual sliding frame with synchronous reverse motion and gear transmission. The two cleaning rollers move smoothly and cover a large area. Combined with the extra-long cleaning rollers and suction box, it can remove abrasives and residues in time, effectively avoiding the accumulation of impurities and micropore blockage, and extending the service life of the polishing pad. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure when the present invention is in use; Figure 2 This is a schematic diagram of the structure of a partial part of the present invention; Figure 3 This is a schematic diagram of the cut-open structure of the cleaning frame and mounting box of the present invention; Figure 4 This is a schematic diagram of the structure of some parts of the cleaning mechanism, driver, and push-pull mechanism of the present invention; Figure 5 For the present invention Figure 4 A schematic diagram of the structure of the disassembled components; Figure 6 This is a schematic diagram of the structure of a part of the present invention after partial cross-section; Figure 7 This is a cross-sectional structural diagram of the slide block, slide frame, rack, and other components of the present invention. Figure 8 This is a structural diagram of some parts of the linkage and control mechanism of the present invention after disassembly.

[0020] In the diagram: 1. Polishing pad; 2. Polishing head; 3. Infusion stand; 4. Nozzle; 41. Mounting bracket; 42. Infusion supply pipe; 5. Frame; 6. Cleaning mechanism; 61. Cleaning frame; 62. Sliding frame; 63. Cleaning roller brush; 64. Suction box; 7. Driver; 71. Mounting box; 72. Drive cylinder; 73. Gear 1; 74. Transmission block; 8. Push-pull mechanism; 81. Reciprocating rod; 82. Transmission frame; 83. Drive disc; 84. Drive rod; 9. Linkage device; 91. Slide; 92. Slide frame; 93. Rack 1; 94. Gear 2; 95. Gear 3; 96. Rack 2; 10. Positioning mechanism; 101. Lead screw; 102. Force block; 103. Limiting groove; 104. Drive block; 105. Drive handle; 11. Gear groove; 12. Gear 4. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] Please see Figures 1-8The present invention provides the following technical solution: a chemical polishing device based on integrated circuit processing, comprising a polishing pad 1, a polishing head 2, an infusion rack 3, a nozzle 4, and a frame 5. A cleaning mechanism 6, a driver 7, and a push-pull mechanism 8 are mounted on the frame 5. The cleaning mechanism 6 includes a cleaning frame 61 mounted on the frame 5, and a sliding frame 62 is slidably mounted within the cleaning frame 61. A cleaning roller brush 63 connected to the driver 7 is rotatably mounted on the bottom of the sliding frame 62. A suction box 64 is provided on one side of the sliding frame 62, and the outer wall of the sliding frame 62 is connected to the push-pull mechanism 8. The mechanism 8 is connected; a linkage 9 is provided between the frame 5 and the infusion stand 3, which includes a slide seat 91 installed on the top of the slide frame 62 and a slide 92 slidably installed in the cleaning frame 61, as well as gear 2 94 and gear 3 95 rotatably installed on the outer wall of the cleaning frame 61 and connected to each other. One side of the slide 92 is connected to the slide seat 91, and the other side is equipped with a rack 1 93 that meshes with gear 2 94. A mounting bracket 41 corresponding to the nozzle 4 is slidably installed on the infusion stand 3, and a rack 2 96 that meshes with gear 3 95 is installed at the end of the mounting bracket 41.

[0023] In one embodiment of the present invention, two sliding frames 62 are installed in the cleaning frame 61. One sliding frame 62 is connected to the push-pull mechanism 8 on its side wall, and the other sliding frame 62 is equipped with a slide seat 91 on its top. The adjacent outer walls of the two sliding frames 62 are provided with toothed grooves 11, and a gear 12 that meshes with the toothed grooves 11 is rotatably installed in the cleaning frame 61. The suction box 64 is located between the two sliding frames 62, and the length of the suction box 64 and the cleaning roller brush 63 is greater than the radius of the polishing pad 1. The dual sliding frame 62 achieves synchronous reverse movement through gear 4 12. Together with the long-size cleaning roller brush 63 and suction box 64, it can achieve full-width cleaning of the polishing pad 1 without blind spots, effectively reducing the probability of impurity residue and secondary pollution.

[0024] As one embodiment of the present invention, the driver 7 includes a mounting box 71 mounted on the frame 5, and two drive cylinders 72 are rotatably mounted inside the mounting box 71. The outer walls of the two drive cylinders 72 are fitted with meshing gears 73, and the ends of the drive cylinders 72 are slidably connected to transmission blocks 74 that are fixedly connected to the ends of the cleaning roller brush 63. The outer ends of the drive cylinders 72 are connected to an external motor. The dual rollers rotate in opposite directions, concentrating impurities into the central suction box 64. The sliding connection of the transmission block 74 ensures uninterrupted power when the cleaning roller brush 63 moves.

[0025] As one embodiment of the present invention, the push-pull mechanism 8 includes a reciprocating rod 81 that is slidably mounted on the outer wall of the cleaning frame 61 and connected to the side wall of the sliding frame 62, and a transmission frame 82 is installed in the middle of the reciprocating rod 81. A drive disk 83 is rotatably mounted on the outer wall of the cleaning frame 61, and a drive rod 84 that cooperates with the transmission frame 82 is installed on the outer wall of the drive disk 83. The drive disk 83 is connected to an external motor. The push-pull mechanism 8 achieves stable reciprocating push-pull, with smooth movement, low failure rate, and is suitable for long-term continuous online cleaning.

[0026] In one embodiment of the present invention, a through hole corresponding to the slide 92 is provided through the slide 91, and the diameter of the through hole is larger than the diameter of the cross section at the position where the slide 92 and the slide 91 are connected. A control mechanism 10 is provided at the end of the slide 91. The control mechanism 10 includes a lead screw 101 threaded on the slide 91, and a force-receiving block 102 that contacts the side wall of the slide 91 is rotatably installed at the inner end of the lead screw 101. A limiting groove 103 that slides with the force-receiving block 102 is provided on the outer wall of the rack 93. A drive block 104 that protrudes from the outer wall of the cleaning frame 61 is installed at the outer end of the lead screw 101. A drive handle 105 that slides with the drive block 104 is rotatably installed on the outer wall of the cleaning frame 61. The linkage trigger stroke can be changed by adjusting the position of the force block 102, so that the movement range of the nozzle 4 can be adjusted to meet different needs.

[0027] In one embodiment of the present invention, both the transmission block 74 and the drive block 104 have polygonal cross sections, and the lengths of both the transmission block 74 and the drive block 104 are greater than the length of the sliding frame 62 that slides to one side. The polygonal cross-section ensures stable torque transmission, and the long stroke design ensures uninterrupted transmission and non-disengagement throughout the entire stroke of the sliding frame 62.

[0028] As one embodiment of the present invention, when one side of the slide block 91 is squeezed by the force block 102, the outer wall of the other side will be in contact with the inner wall of the end of the slide 92. The sliding length of the force block 102, as well as the length of the rack 1 93 and the slide 92, are all greater than the length of the slide 62 sliding to one side. The diameter of the gear 2 94 is smaller than the diameter of the gear 3 95. The gear speed-increasing transmission makes the spray head 4 move a greater distance than the sliding length of the sliding frame 62, resulting in a wider spray range and more uniform liquid distribution.

[0029] In one embodiment of the present invention, multiple nozzles 4 are installed at equal intervals at the bottom of the mounting frame 41, and a liquid supply pipe 42 connected to the nozzles 4 is connected to the end of the mounting frame 41. The liquid supply pipe 42 is designed as a corrugated pipe. The multiple nozzles are evenly arranged and the corrugated pipe provides flexible liquid supply, ensuring smooth liquid supply and no leakage when moving back and forth.

[0030] Working principle: Before the chemical polishing equipment based on integrated circuit processing is put into formal operation, the transmission ratio of the linkage 9 and the movement amplitude of the nozzle 4 are precisely adjusted by the control mechanism 10 according to the actual polishing requirements. During adjustment, the drive handle 105 on the outside of the cleaning frame 61 is rotated first. The drive handle 105 will drive the drive block 104 to rotate, and the drive block 104 will drive the lead screw 101 to rotate synchronously. Since the lead screw 101 and the slide 91 are threadedly connected, when the lead screw 101 rotates, it will push the force block 102 to slide in the limiting groove 103 of the rack 93, thereby changing the distance between the force block 102 and the inner wall of the slide 91. If the reciprocating movement of the nozzle 4 needs to be adjusted to the maximum, adjust the force block 102 to be in a state of close contact with and pressing against the side wall of the slide 91, so that both sides of the slide 91 are in contact with the force block 102 and the inner wall of the slide frame 92 respectively. At this time, the movement of the slide 91 will immediately and synchronously drive the slide frame 92 and the rack 93 to move, and the nozzle 4 will obtain the maximum movement stroke. If the movement range of the nozzle 4 needs to be reduced, rotate the drive handle 105 in the opposite direction to make the force block 102 move away from the slide 91. The slide 91 will follow the slide frame 62 for a distance before contacting the force block 102 and driving the rack 93 to move, thereby reducing the movement range of the nozzle 4. To facilitate on-site adjustment, an observation window can be set at the end of the cleaning frame 61, and a scale can be marked on the outer wall of the rack 93 with the limit groove 103, so that the operator can make intuitive and precise adjustments. After adjustment, the polishing process begins. First, the integrated circuit wafer is clamped onto the polishing head 2. The equipment is started, and the nozzle 4 sprays chemical polishing liquid evenly onto the surface of the polishing pad 1 through the liquid supply pipe 42. The polishing pad 1 rotates, and the polishing head 2 drives the wafer to rotate synchronously. Chemical polishing and mechanical grinding are carried out simultaneously. At the same time, the driver 7 and the push-pull mechanism 8 start synchronously to perform online real-time cleaning of the polishing pad 1. The external motor in the driver 7 drives the drive cylinder 72 to rotate, and through the meshing transmission of gear 73, the two drive cylinders 72 rotate in opposite directions. The drive cylinder 72 drives the two cleaning roller brushes 63 to rotate in opposite directions through the transmission block 74, pushing the abrasive debris and reaction residue on the surface of the polishing pad 1 towards the central suction box 64. Under the action of the external negative pressure device, the suction box 64 promptly removes the debris and waste polishing liquid, effectively reducing the probability of secondary adhesion of impurities. At the same time, because the length of the cleaning roller brush 63 is greater than the radius of the polishing pad 1, in conjunction with the rotation of the polishing pad 1, it can achieve full surface cleaning without blind spots, effectively reducing the probability of clogging of the micropores of the polishing pad 1, and maintaining surface flatness and grinding efficiency. The push-pull mechanism 8 operates under the drive of an external motor, causing the drive disc 83 to drive the drive rod 84 in a circular motion. As the drive rod 84 rotates with the drive disc 83, it slides up and down synchronously within the transmission frame 82, pushing the transmission frame 82 to drive the reciprocating rod 81 in a lateral reciprocating motion. At the same time, the reciprocating rod 81 drives one side of the sliding frame 62 to move horizontally back and forth. The sliding frames 62 are connected by toothed grooves 11 and gears 12, which drives the other side of the sliding frame 62 to move synchronously in the opposite direction, so that both cleaning roller brushes 63 perform reciprocating sweeping motions, further expanding the cleaning range and improving the cleaning effect. Furthermore, the length of the transmission block 74 is greater than the sliding stroke of the sliding frame 62, ensuring that the cleaning roller brushes 63 maintain a transmission connection with the drive cylinder 72 throughout the entire movement process, and rotate continuously and stably. During the reciprocating movement of the sliding frame 62, the top slide 91 moves synchronously and drives the rack 93 to reciprocate through the force block 102 and the sliding frame 92; the rack 93 drives the gear 94 to rotate, and the rotation of the gear 94 will drive the coaxial gear 95 to rotate synchronously; because the gear 95 meshes with the rack 96, the rack 96 will drive the mounting frame 41 and the nozzle 4 to reciprocate synchronously, expand the polishing liquid spray range, make the chemical polishing liquid more evenly distributed on the surface of the polishing pad 1, and improve the uniformity and surface quality of wafer polishing; Throughout the entire operation of the equipment, the three major actions of cleaning, liquid supply, and polishing are carried out in tandem, achieving integrated online cleaning, blind-spot-free cleaning, and uniform liquid supply, effectively improving the precision, yield, and operational stability of integrated circuit wafer chemical polishing.

[0031] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A chemical polishing device based on integrated circuit processing, comprising a polishing pad (1), a polishing head (2), an infusion rack (3), a nozzle (4), and a frame (5), characterized in that: The frame (5) is equipped with a cleaning mechanism (6), a driver (7) and a push-pull mechanism (8). The cleaning mechanism (6) includes a cleaning frame (61) installed on the frame (5), and a sliding frame (62) is slidably installed inside the cleaning frame (61). A cleaning roller brush (63) connected to the driver (7) is rotatably installed at the bottom of the sliding frame (62), and a suction box (64) is provided on one side of the sliding frame (62). The outer wall of the sliding frame (62) is connected to the push-pull mechanism (8). A linkage (9) is provided between the frame (5) and the infusion stand (3), which includes a slide (91) installed on the top of the slide frame (62) and a slide (92) slidably installed in the cleaning frame (61), as well as gear two (94) and gear three (95) rotatably installed on the outer wall of the cleaning frame (61) and connected to each other. One side of the slide (92) is connected to the slide (91), and the other side is equipped with a rack one (93) that meshes with gear two (94). A mounting bracket (41) corresponding to the nozzle (4) is slidably installed on the infusion stand (3), and a rack two (96) that meshes with gear three (95) is installed at the end of the mounting bracket (41).

2. The chemical polishing equipment based on integrated circuit processing according to claim 1, characterized in that: Two sliding frames (62) are installed inside the cleaning frame (61). One sliding frame (62) is connected to the push-pull mechanism (8) on its side wall, and the other sliding frame (62) is equipped with a slide seat (91) on its top. The outer walls of the two sliding frames (62) are provided with toothed grooves (11), and a gear four (12) that meshes with the toothed grooves (11) is rotatably installed inside the cleaning frame (61). The suction box (64) is located between the two sliding frames (62), and the length of the suction box (64) and the cleaning roller brush (63) is greater than the radius of the polishing pad (1).

3. The chemical polishing equipment based on integrated circuit processing according to claim 2, characterized in that: The driver (7) includes a mounting box (71) mounted on a frame (5), and two drive cylinders (72) are rotatably mounted inside the mounting box (71). The outer walls of the two drive cylinders (72) are fitted with meshing gears (73), and the ends of the drive cylinders (72) are slidably connected to a transmission block (74) that is fixedly connected to the end of the cleaning roller brush (63). The outer end of the drive cylinder (72) is connected to an external motor.

4. The chemical polishing equipment based on integrated circuit processing according to claim 1, characterized in that: The push-pull mechanism (8) includes a reciprocating rod (81) that is slidably installed on the outer wall of the cleaning frame (61) and connected to the side wall of the sliding frame (62). A transmission frame (82) is installed in the middle of the reciprocating rod (81). A drive disk (83) is rotatably installed on the outer wall of the cleaning frame (61). A drive rod (84) that cooperates with the transmission frame (82) is installed on the outer wall of the drive disk (83). The drive disk (83) is connected to an external motor.

5. The chemical polishing equipment based on integrated circuit processing according to claim 3, characterized in that: The slide block (91) has a through hole corresponding to the slide frame (92) to ensure that the slide block (91) will slide and connect with the slide frame (92). The diameter of the through hole is larger than the diameter of the cross section at the connection position of the slide frame (92) and the slide block (91). The end of the slide block (91) is provided with a control mechanism (10).

6. The chemical polishing equipment based on integrated circuit processing according to claim 5, characterized in that: The control mechanism (10) includes a lead screw (101) threaded onto a slide (91), and a force-bearing block (102) rotatably mounted on the inner end of the lead screw (101) in contact with the side wall of the slide (91). A limiting groove (103) is provided on the outer wall of the rack (93) to slide with the force-bearing block (102). A drive block (104) protruding from the outer wall of the cleaning frame (61) is mounted on the outer end of the lead screw (101), and a drive handle (105) rotatably mounted on the outer wall of the cleaning frame (61) to slide with the drive block (104).

7. A chemical polishing device based on integrated circuit processing according to claim 6, characterized in that: The cross-sections of the transmission block (74) and the drive block (104) are both polygonal, and the lengths of the transmission block (74) and the drive block (104) are both greater than the length of the sliding frame (62) sliding to one side.

8. The chemical polishing equipment based on integrated circuit processing according to claim 7, characterized in that: When one side of the slide block (91) is squeezed by the force block (102), the outer wall of the other side will be in contact with the inner wall of the end of the slide frame (92). The length of the force block (102) that can slide, as well as the length of the rack (93) and the slide frame (92), are all greater than the length of the slide frame (62) that slides to one side. The diameter of the gear two (94) is smaller than the diameter of the gear three (95).

9. A chemical polishing device based on integrated circuit processing according to claim 1, characterized in that: The mounting bracket (41) has multiple nozzles (4) installed at equal intervals at its bottom, and the end of the mounting bracket (41) is connected to a liquid supply pipe (42) connected to the nozzles (4), and the liquid supply pipe (42) is designed as a corrugated pipe.

Images