Aluminum-based composite structures, methods of forming the same, and heat dissipation assemblies including the same

Abstract

This invention provides an aluminum-based composite structure comprising a first Al-Cu-X composite layer, a second Al-Cu-X composite layer, and an interface bonding layer. The second Al-Cu-X composite layer overlaps the first Al-Cu-X composite layer. The interface bonding layer is located between the first Al-Cu-X composite layer and the second Al-Cu-X composite layer, wherein X comprises a high thermal conductivity component. Based on the total weight of the interface bonding layer, the interface bonding layer comprises 60.0 to 90.0 wt% Al, 7.1 to 37.1 wt% Zn, and 0.1 to 2.9 wt% Cu, and the interface bonding layer comprises Al... 60‑70 Cu 30‑40 particle.

Description

Technical Field

[0001] The present invention relates to a composite structure, a method for forming the same, and a heat dissipation assembly comprising the same, and particularly to an aluminum-based composite structure, a method for forming the same, and a heat dissipation assembly comprising the same. Background Technology

[0002] With the advent of the era of green energy, electric vehicles, and AIoT, high-frequency, high-power, and wide-bandgap radio frequency and power components have become the mainstream of market demand. For example, for high-power density power modules with ultra-high operating temperatures (~200℃) and high voltage and high current characteristics required for power conversion such as all-electric vehicles or wind power generation, a comprehensive solution of packaging materials with high heat resistance, high voltage resistance, and high thermal conductivity is needed to enable the module to have the best performance.

[0003] A liquid cold plate is a mainstream heat dissipation component for high-power electronics. Its working principle is to form flow channels inside a metal casing, and electronic components are mounted on the surface of the liquid cold plate. Coolant enters and exits from the inlet and outlet of the flow channels of the liquid cold plate to quickly conduct the heat generated by the electronic components or any other surface with high heat density to the environment.

[0004] However, if the bonding strength of the liquid cooling plate shell is insufficient, it will cause coolant leakage, leading to a decrease in the reliability of the liquid cooling plate. In addition, current liquid cooling plate manufacturing mainly uses vacuum hard welding to join the upper and lower shells, but vacuum hard welding equipment is expensive, and vacuum hard welding has extremely high requirements for welding conditions, resulting in low production efficiency. Summary of the Invention

[0005] An embodiment of the aluminum-based composite structure of the present invention includes a first Al-Cu-X composite layer, a second Al-Cu-X composite layer, and an interface bonding layer. The second Al-Cu-X composite layer overlaps the first Al-Cu-X composite layer. The interface bonding layer is located between the first Al-Cu-X composite layer and the second Al-Cu-X composite layer, wherein X comprises a high thermal conductivity component. Based on the total weight of the interface bonding layer, the interface bonding layer comprises 60.0 to 90.0 wt% Al, 7.1 to 37.1 wt% Zn, and 0.1 to 2.9 wt% Cu, and the interface bonding layer comprises Al. 60-70 Cu 30-40 particle.

[0006] An embodiment of the present invention provides a method for forming an aluminum-based composite structure, which includes sandwiching a bonding material between a first Al-Cu-X composite layer and a second Al-Cu-X composite layer, and heating the bonding material to a bonding temperature, wherein the bonding temperature is higher than a first melting point of the bonding material and lower than a second melting point of the first Al-Cu-X composite layer or the second Al-Cu-X composite layer.

[0007] A heat dissipation assembly according to an embodiment of the present invention includes a housing, wherein the housing includes the aluminum-based composite structure described above. Attached Figure Description

[0008] Figures 1A to 1C This is a flowchart of a method for forming an aluminum-based composite structure according to an embodiment of the present invention.

[0009] Figure 2A This is a scanning electron microscope (SEM) image of the interface bonding layer according to an embodiment of the present invention.

[0010] Figure 2B This is a compositional analysis diagram of the interface bonding layer according to an embodiment of the present invention.

[0011] Figure 2C This is the phase diagram of the Zn-Al alloy.

[0012] Figures 3A to 3D This is an X-ray energy-dispersive X-ray spectroscopy (EDS) image of the interface bonding layer according to an embodiment of the present invention, wherein... Figure 3A EDS images of Al, Zn, Cu, Si, and C. Figure 3B This is an EDS image of Al. Figure 3C EDS image of Zn Figure 3D This is an EDS image of Cu.

[0013] Figure 3E and Figure 3F This is a SEM image of an interface bonding layer according to an embodiment of the present invention.

[0014] Figures 4A to 4D This is an EDS image of an interface bonding layer according to an embodiment of the present invention, wherein, Figure 4A EDS images of Al, Zn, Cu and C. Figure 4B This is an EDS image of Al. Figure 4C EDS image of Zn Figure 4D This is an EDS image of Cu.

[0015] Figure 4E and Figure 4F This is a SEM image of an interface bonding layer according to an embodiment of the present invention.

[0016] Figure 4G This is a compositional analysis diagram of the interface bonding layer according to an embodiment of the present invention.

[0017] Figure 5 This is a three-dimensional schematic diagram of a heat dissipation assembly according to an embodiment of the present invention.

[0018] Explanation of icon numbers

[0019] 10: Aluminum-based composite structure

[0020] 110, 120, 510, 520: Al-Cu-X composite laminate

[0021] 110A, 120A: 94Al-5Cu-1BN composite laminate

[0022] 110B, 120B: 94Al-5Cu-1SiC composite laminate

[0023] 110C, 120C: 94Al-5Cu-1C composite laminate

[0024] 130: Bonding material

[0025] 130': Molten bonding material

[0026] 140, 140A, 140B, 140C, 540: Interface bonding layer

[0027] 141, 142, 143: Region

[0028] 50: Heat dissipation components

[0029] 500: Housing

[0030] 550: Flow channel

[0031] 551: Entrance

[0032] 552: Export

[0033] TH: Heat treatment

[0034] PZ: Pressure Treatment Detailed Implementation

[0035] The present invention can be understood by referring to the following detailed description and the accompanying drawings. It should be noted that, for ease of understanding and to keep the drawings concise, many of the drawings in this invention only depict a portion of the electronic device, and specific components in the drawings are not drawn to scale. Furthermore, the number and dimensions of the components in the drawings are for illustrative purposes only and are not intended to limit the scope of the invention.

[0036] Figures 1A to 1C This is a flowchart of a method for forming an aluminum-based composite structure according to an embodiment of the present invention. Some embodiments of the present invention provide a method for forming an aluminum-based composite structure, and in some embodiments, it is a method for tightly bonding two aluminum-copper-X (Al-Cu-X) composite laminates together.

[0037] First, please refer to Figure 1A The bonding material 130 is sandwiched between the Al-Cu-X composite layer 110 and the Al-Cu-X composite layer 120. For example, the bonding material 130 can be placed on the Al-Cu-X composite layer 110 first, and then the Al-Cu-X composite layer 120 can be placed on the bonding material 130. In some embodiments, the Al-Cu-X composite layer 120 can completely overlap the Al-Cu-X composite layer 110. In some embodiments, the Al-Cu-X composite layer 110 and the Al-Cu-X composite layer 120 are the same size, but the invention is not limited thereto. In some embodiments, the Al-Cu-X composite layer 110 and the Al-Cu-X composite layer 120 are different sizes.

[0038] Al-Cu-X composite laminates 110 and 120 may include Al-Cu alloy grains and a high thermal conductivity component X. The Al-Cu alloy grains are formed by mechanical alloying of a solid solution formed by adding Cu to Al, which provides both solid solution strengthening and grain refinement. The high thermal conductivity component X may include, for example, BN (boron nitride), SiC (silicon carbide), C (carbon), or combinations thereof, and may be located at the boundaries of the Al-Cu alloy grains, thereby giving the Al-Cu-X composite laminates 110 and 120 relatively high thermal conductivity. In some embodiments, the Al-Cu-X composite laminate is an aluminum-copper-boron nitride (Al-Cu-BN), aluminum-copper-silicon carbide (Al-Cu-SiC), or aluminum-copper-carbon (Al-Cu-C) composite laminate. For example, the Al-Cu-X composite laminate is a 94Al-5Cu-1BN composite laminate, a 94Al-5Cu-1SiC composite laminate, or a 94Al-5Cu-1C composite laminate, but the present invention is not limited thereto.

[0039] Al-Cu-X composite laminate 110 and Al-Cu-X composite laminate 120 can be formed by mechanical alloying and hot pressing. For example, Al powder, Cu powder, and BN powder with a predetermined ratio are first subjected to mechanical alloying. Mechanical alloying is, for example, a process that gradually achieves alloying by causing atomic diffusion. In detail, Al powder, Cu powder, and BN powder can be placed in a planetary ball mill for ball milling. During the ball milling process, the powders are subjected to collisions and compression by the grinding balls, causing severe plasticity, deformation, fracture, and / or cold welding. That is, the powders are continuously refined, causing atomic diffusion, thereby obtaining alloyed Al-Cu-BN powder.

[0040] Subsequently, the alloyed Al-Cu-BN powder can be subjected to hot pressing. In some embodiments, hot pressing includes vacuum hot pressing sintering. Vacuum hot pressing sintering is, for example, a process combining sintering and pressure forming. Specifically, the alloyed Al-Cu-BN powder can be placed in a patterned mold, and then the mold containing the alloyed Al-Cu-BN powder can be placed in a hot press furnace to simultaneously press and sinter the alloyed Al-Cu-BN powder. After vacuum hot pressing sintering of the alloyed Al-Cu-BN powder, heat treatment can be performed to form an Al-Cu-BN composite laminate.

[0041] The Al-Cu-X composite laminate 110 and Al-Cu-X composite laminate 120 of the present invention have relatively high mechanical strength and thermal conductivity, and are suitable for use in heat dissipation components, such as liquid cooling plates, but the present invention is not limited thereto.

[0042] The bonding material 130 may include a ductile alloy or solder, such as a Zn-Al-Cu alloy. In some embodiments, the bonding material 130 comprises 82Zn-15Al-3Cu, but the invention is not limited thereto. For example, the preparation of the bonding material 130 may include the following steps: First, the components of the bonding material 130 are mixed in a formula ratio (e.g., 82 grams of zinc powder, 15 grams of aluminum powder, and 3 grams of copper powder) to form a bonding mixture. Next, the bonding mixture can be hot-pressed to form a bonding block, wherein the hot pressing can be performed continuously at a temperature of about 400°C and a pressure of about 40 MPa for about 1 hour. Next, the bonding block can be rolled to form a bonding sheet for subsequent application. In some embodiments, the melting point of the bonding material 130 is lower than the melting point of the Al-Cu-X composite laminates 110 and 120. In some embodiments, the melting point of the bonding material 130 may be 380 to 500°C.

[0043] Please refer to Figure 1BThe bonding material 130 is subjected to a heat treatment TH to perform a transient liquid phase bonding process. The heat treatment TH raises the bonding material 130 to a bonding temperature, which can be higher than the melting point of the bonding material 130 but lower than the melting point of the Al-Cu-X composite layers 110 and 120. In some embodiments, the bonding temperature is approximately 490 to 550°C, for example, 500°C or 520°C. The Al-Cu-X composite layers 110 and 120 may also be heated simultaneously with the heating of the bonding material 130. Simultaneously with the heat treatment TH of the bonding material 130, the Al-Cu-X composite layers 110 and / or 120 may also be subjected to a pressure treatment PZ to perform the transient liquid phase bonding process, thereby improving the bonding strength between the Al-Cu-X composite layers 110 and 120. In some embodiments, the pressure of the pressurization process is 3 to 15 MPa, 6 MPa or 12 MPa, but the invention is not limited thereto.

[0044] During the transient liquid-phase bonding process, the bonding material 130 first transforms into a molten bonding material 130', allowing the metallic components within it to diffuse into each other. After heating and pressurizing for a period of time, the molten bonding material 130' can be completely transformed into an intermetallic compound (IMC), i.e., the interfacial bonding layer 140, such as... Figure 1C As shown. The fabrication of the aluminum-based composite structure 10 is completed after heating and pressurization are stopped. In some embodiments, the duration of the heat treatment TH and the pressurization treatment PZ is 0.5 to 12 hours, for example, 1 hour, 3 hours or 5 hours. Since the heating temperature of the heat treatment TH does not need to be high and the pressure applied in the pressurization treatment PZ does not need to be high, the implementation efficiency of the transient liquid phase bonding process can be improved, thereby improving the production efficiency of the aluminum-based composite structure.

[0045] After the transient liquid phase bonding process is completed, the melting point of the resulting interfacial bonding layer 140 may be higher than the bonding temperature used in the transient liquid phase bonding process. That is, the bonding materials 130 can be bonded in a relatively low-temperature transient liquid phase bonding process, and the resulting interfacial bonding layer 140 can be applied or used in a relatively high-temperature environment. In some embodiments, the bonding temperature is higher than the melting point of the bonding materials 130, and the melting point of the interfacial bonding layer 140 is higher than the melting point of the bonding materials 130.

[0046] Experimental Example

[0047] The present invention will be further illustrated by several experimental examples below, but these examples are for illustrative purposes only and are not intended to limit the scope of the present invention.

[0048] [Example 1]

[0049] A bonding material of approximately 120 μm thickness, 82Zn-15Al-3Cu (melting point 460℃), was sandwiched between two 94Al-5Cu-1BN composite layers. A transient liquid-phase bonding process was then performed at a bonding temperature of 500℃ and a bonding pressure of 12 MPa, held for 1 hour. Subsequently, the temperature was lowered to room temperature and the pressure reduced to atmospheric pressure. The bonding strength between the two 94Al-5Cu-1BN composite layers was measured to be 40 MPa, as shown in Table 1 below.

[0050] In addition, the microstructure of the interface bonding layer 140A formed between the two 94Al-5Cu-1BN composite laminates 110A and 120A in Example 1 was analyzed. Figure 2A This is a scanning electron microscope (SEM) image of the interface bonding layer 140A in Example 1. From... Figure 2A It can be seen that the thickness T of the interface bonding layer 140A is approximately 130 μm, and a white precipitate exists in the interface bonding layer 140A. Analysis of its composition shows that this white precipitate includes Al. y Cu 100-y Particles, where 60 ≤ y ≤ 70. That is, this white precipitate includes Al. 60-70 Cu 30-40 Particles. Al y Cu 100-y The precipitate may have a particle size of about 0.1 μm to 10 μm, and its average particle size may be about 5 μm. In some embodiments, the white precipitate is Al2Cu particles.

[0051] In addition, from Figure 2A It can also be seen that the interface bonding layer 140A of Embodiment 1 can be roughly divided into a region 141 near the 94Al-5Cu-1BN composite layer 110A, a region 142 near the 94Al-5Cu-1BN composite layer 120A, and an intermediate region 143 located between region 141 and region 142. The Al composition ratio of the intermediate region 143 is generally less than that of regions 141 and 142, and the Zn composition ratio of the intermediate region 143 is generally more than that of regions 141 and 142.

[0052] Figure 2B This is a composition analysis diagram of the interface bonding layer 140A in Example 1. From... Figure 2BIt can be seen that in the interface bonding layer 140A, the Al composition ratio increases approximately from 70.0% in the middle region 143 to 81.0% or more in regions 141 and 142, while the Zn composition ratio decreases approximately from 29.0% in the middle region 143 to 17.0% or less in regions 141 and 142, and the Cu composition ratio is approximately between 2.0% and 2.3%. In other words, the 82Zn-15Al-3Cu bonding material has been transformed into an interface bonding layer 140A with a completely different composition ratio. Figure 2C This is the phase diagram for Zn-Al alloys. From... Figure 2C It can be seen that when the Al content is 70%, the melting point of the Zn-Al alloy is approximately 630°C, and when the Al content is 80%, the melting point of the Zn-Al alloy is approximately 640°C. Therefore, the melting point of the interface bonding layer 140A can reach above 630°C. In some embodiments, the melting point of the interface bonding layer 140A is approximately 630°C to 640°C.

[0053] [Comparative Example 1]

[0054] The transient liquid phase bonding process was performed in the same manner as in Example 1, except that 77Zn-20Al-3Cu was used instead of 82Zn-15Al-3Cu as the bonding material. After the transient liquid phase bonding process was completed, the bonding strength between the two 94Al-5Cu-1BN composite laminates was measured to be 12 MPa, as shown in Table 1 below.

[0055] In addition, after microstructure analysis of the interface bonding layer formed between the two 94Al-5Cu-1BN composite laminates in Comparative Example 1, it was found that because the melting point of 77Zn-20Al-3Cu (melting point 495℃) is close to the bonding temperature (500℃), the transient liquid phase bonding process cannot be completed, so some 77Zn-20Al-3Cu remains.

[0056] [Examples 2-5]

[0057] The transient liquid phase bonding process was performed in the same manner as in Example 1, except that the transient liquid phase bonding process was performed at bonding pressures of 0 MPa, 3 MPa, 6 MPa, and 15 MPa, respectively. After the transient liquid phase bonding process was completed, the bonding strength between the two 94Al-5Cu-1BN composite laminates was measured to be 3 MPa, 17 MPa, 36 MPa, and 21 MPa, respectively, as listed in Table 1 below.

[0058] [Example 6]

[0059] The transient liquid phase bonding procedure was performed in the same manner as in Example 1, except that two 94Al-5Cu-1SiC composite laminates were used instead of two 94Al-5Cu-1BN composite laminates. After the transient liquid phase bonding procedure was completed, the bonding strength between the two 94Al-5Cu-1SiC composite laminates was measured to be 37.2 MPa, as shown in Table 1 below.

[0060] In addition, the microstructure of the interface bonding layer 140B formed between the two 94Al-5Cu-1SiC composite laminates 110B and 120B in Example 6 was analyzed. Figures 3A to 3D This is an X-ray energy-dispersive X-ray spectroscopy (EDS) image of the interface bonding layer 140B in Example 6, wherein... Figure 3A EDS images of Al, Zn, Cu, Si, and C. Figure 3B This is an EDS image of Al. Figure 3C EDS image of Zn Figure 3D This is an EDS image of Cu. From Figure 3A It can be seen that the 94Al-5Cu-1SiC composite laminates 110B and 120B do indeed contain SiC. From... Figure 3B It can be seen that the interface bonding layer 140B of Example 6 can be roughly divided into a region 141 near the 94Al-5Cu-1SiC composite layer 110B, a region 142 near the 94Al-5Cu-1SiC composite layer 120B, and an intermediate region 143 located between regions 141 and 142, wherein the Al composition ratio of the intermediate region 143 is approximately less than that of regions 141 and 142. Figure 3C It can be seen that the Zn composition ratio in the middle region 143 is generally higher than that in regions 141 and 142. From... Figure 3D It can be seen that the Cu composition ratio in the middle region 143 is slightly higher than that in regions 141 and 142.

[0061] Figure 3E and Figure 3F This is a SEM image of the interface bonding layer 140B in Example 6. From... Figure 3E It can be seen that white precipitates Al are present in the interface bonding layer 140B. y Cu 100-y Particles, where 60 ≤ y ≤ 70. Additionally, from... Figure 3FIt can be seen that in the interface bonding layer 140B, the Al composition ratio increases approximately from 66.4% in the central region 143 to 79.9% or more in regions 141 and 142, while the Zn composition ratio decreases approximately from 32.8% in the central region 143 to 19.9% ​​or less in regions 141 and 142, and the Cu composition ratio is approximately between 0.1% and 1.3%. In other words, the 82Zn-15Al-3Cu bonding material has been transformed into the interface bonding layer 140B with a completely different composition ratio. Figure 2C As can be seen from the Zn-Al phase diagram, when the Al content is 66.4%, the melting point of the Zn-Al alloy is approximately 620°C, and when the Al content is 80%, the melting point of the Zn-Al alloy is approximately 640°C. Therefore, the melting point of the interface bonding layer 140B can reach above 620°C. In some embodiments, the melting point of the interface bonding layer 140B is approximately 620°C to 640°C.

[0062] [Example 7]

[0063] The transient liquid phase bonding procedure was performed in the same manner as in Example 1, except that two 94Al-5Cu-1C composite laminates were used instead of two 94Al-5Cu-1BN composite laminates. After the transient liquid phase bonding procedure was completed, the bonding strength between the two 94Al-5Cu-1C composite laminates was measured to be 33.6 MPa, as shown in Table 1 below.

[0064] In addition, the microstructure of the interface bonding layer 140C generated between the two 94Al-5Cu-1C composite laminates 110C and 120C in Example 7 was analyzed. Figures 4A to 4D This is an X-ray energy-dispersive X-ray spectroscopy (EDS) image of the interface bonding layer 140C in Example 7, wherein... Figure 4A EDS images of Al, Zn, Cu and C. Figure 4B This is an EDS image of Al. Figure 4C EDS image of Zn Figure 4D This is an EDS image of Cu. From Figure 4A It can be seen that the 94Al-5Cu-1C composite laminates 110C and 120C do indeed contain carbon. From... Figure 4B It can be seen that the interface bonding layer 140C of Example 7 can be roughly divided into a region 141 near the 94Al-5Cu-1C composite layer 110C, a region 142 near the 94Al-5Cu-1C composite layer 120C, and an intermediate region 143 located between regions 141 and 142, wherein the Al composition ratio of the intermediate region 143 is generally less than that of regions 141 and 142. Figure 4C It can be seen that the Zn composition ratio in the middle region 143 is generally higher than that in regions 141 and 142. From... Figure 4D It can be seen that the Cu composition ratio in the middle region 143 is slightly higher than that in regions 141 and 142.

[0065] Figure 4E and Figure 4F This is an SEM image of the interface bonding layer 140C in Example 7. Figure 4G This is a composition analysis diagram of the interface bonding layer 140C in Example 7. From... Figure 4E It can be seen that white precipitates Al are present in the interface bonding layer 140C. y Cu 100-y Particles, where 60 ≤ y ≤ 70. Additionally, from... Figure 4F and Figure 4G It can be seen that in the interface bonding layer 140C, the Al composition ratio increases approximately from 70.2% in the middle region 143 to 83.1% or more in regions 141 and 142, while the Zn composition ratio decreases approximately from 29.0% in the middle region 143 to 14.8% or less in regions 141 and 142, and the Cu composition ratio is approximately between 0.8% and 2.1%. In other words, the 82Zn-15Al-3Cu bonding material has been transformed into the interface bonding layer 140C with a completely different composition ratio. Figure 2C As can be seen from the Zn-Al phase diagram, when the Al content is 70%, the melting point of the Zn-Al alloy is approximately 630°C, and when the Al content is 83.1%, the melting point of the Zn-Al alloy is approximately 645°C. Therefore, the melting point of the interface bonding layer 140C can reach above 630°C. In some embodiments, the melting point of the interface bonding layer 140C is approximately 630°C to 645°C.

[0066] [Table 1]

[0067]

[0068] As shown in Table 1, Examples 1-5, which involved transient liquid phase bonding under pressures of 0–15 MPa, all achieved bonding strengths of 3 MPa or higher. Specifically, Example 1, performed at 12 MPa, achieved a bonding strength as high as 40 MPa. Furthermore, Examples 6 (bonding two 94Al-5Cu-1SiC composite laminates with 82Zn-15Al-3Cu) and 7 (bonding two 94Al-5Cu-1C composite laminates with 82Zn-15Al-3Cu) both achieved bonding strengths of 30 MPa or higher.

[0069] Figure 5This is a perspective view of a heat dissipation assembly 50 according to an embodiment of the present invention. The heat dissipation assembly 50 is, for example, a liquid cold plate, which can be installed on high-power electronic products (e.g., servers, electric vehicles, etc.) to help dissipate heat from the high-power electronic products. The heat dissipation assembly 50 may include a housing 500, wherein the housing 500 may include an aluminum-based composite structure formed by Al-Cu-X composite laminates 510, 520 and an interface bonding layer 540.

[0070] In some embodiments, Al-Cu-X composite laminates 510 and 520 comprise 94Al-5Cu-1BN, and the interface bonding layer 540 comprises (70.0-81.0)Al-(17.0-29.0)Zn-(2.0-2.3)Cu. In some embodiments, Al-Cu-X composite laminates 510 and 520 comprise 94Al-5Cu-1SiC, and the interface bonding layer 540 comprises (66.4-79.9)Al-(19.9-32.8)Zn-(0.1-1.3)Cu. In some embodiments, Al-Cu-X composite laminates 510 and 520 comprise 94Al-5Cu-1C, and the interface bonding layer 540 comprises (70.2-83.1)Al-(14.8-29.0)Zn-(0.8-2.1)Cu. In some embodiments, the interface bonding layer 540 further comprises Al y Cu 100-y Particles, where 60≤y≤70.

[0071] The heat dissipation assembly 50 may also include a flow channel 550, which is a hollow channel located between the Al-Cu-X composite layer 510 and the Al-Cu-X composite layer 520. The working fluid can flow into the heat dissipation assembly 50 through the inlet 551 and exit through the outlet 552, thereby carrying away heat from the surrounding area of ​​the heat dissipation assembly 50 to achieve the purpose of heat dissipation. For example, the working fluid may be water, ethylene glycol / water solution, fluorocarbon, or polyalphaolefin (PAO).

[0072] In summary, the aluminum-based composite structure of the present invention achieves a bond strength of over 3 MPa by bonding two Al-Cu-X composite layers together using a transient liquid phase bonding process with a bonding material. Furthermore, by combining the transient liquid phase bonding process with pressure treatment, a bond strength as high as 40 MPa can be obtained. Additionally, the transient liquid phase bonding process is easy to operate, thus improving the production efficiency of the aluminum-based composite structure. Moreover, the melting point of the interface bonding layer generated by the transient liquid phase bonding process is higher than that of the bonding material, enabling the aluminum-based composite structure to be applied to heat dissipation components requiring high heat resistance and high thermal conductivity.

[0073] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An aluminum-based composite structure, characterized in that, include: First aluminum-copper-X (Al-Cu-X) composite laminate; A second Al-Cu-X composite layer is overlapped with the first Al-Cu-X composite layer; and An interface bonding layer is located between the first Al-Cu-X composite layer and the second Al-Cu-X composite layer. Wherein X comprises a high thermal conductivity component, and based on the total weight of the interface bonding layer, the interface bonding layer comprises 60.0 to 90.0 wt% Al, 7.1 to 37.1 wt% zinc (Zn), and 0.1 to 2.9 wt% Cu, and the interface bonding layer comprises Al 60-70 Cu 30-40 particle.

2. The aluminum-based composite structure according to claim 1, characterized in that, The high thermal conductivity components include boron nitride (BN), silicon carbide (SiC), carbon (C), or combinations thereof.

3. The aluminum-based composite structure according to claim 2, characterized in that, The first Al-Cu-X composite laminate and the second Al-Cu-X composite laminate are 94Al-5Cu-1BN, 94Al-5Cu-1SiC or 94Al-5Cu-1C.

4. The aluminum-based composite structure according to claim 1, characterized in that, The concentration of Al in the interface bonding layer increases from the interface bonding layer toward the first Al-Cu-X composite laminate or the second Al-Cu-X composite laminate.

5. The aluminum-based composite structure according to claim 1, characterized in that, The concentration of Zn in the interface bonding layer decreases from the interface bonding layer toward the first Al-Cu-X composite laminate or the second Al-Cu-X composite laminate.

6. The aluminum-based composite structure according to claim 1, characterized in that, Based on the total weight of the interface bonding layer, the interface bonding layer comprises 70.0 to 81.0 wt% Al, 17.0 to 29.0 wt% Zn, and 1.0 to 2.3 wt% Cu.

7. The aluminum-based composite structure according to claim 1, characterized in that, The interface bonding layer comprises Al2Cu particles.

8. The aluminum-based composite structure according to claim 1, characterized in that, The Al 60-70 Cu 30-40 The particle size ranges from 0.1 to 10 μm.

9. The aluminum-based composite structure according to claim 1, characterized in that, The melting point of the interface bonding layer is 620°C to 645°C.

10. A method for forming an aluminum-based composite structure, characterized in that, include: The bonding material is sandwiched between the first Al-Cu-X composite layer and the second Al-Cu-X composite layer; as well as The bonding material is heat-treated and heated to the bonding temperature. The bonding temperature is higher than the first melting point of the bonding material and lower than the second melting point of the first Al-Cu-X composite laminate or the second Al-Cu-X composite laminate.

11. The method according to claim 10, characterized in that, The bonding material comprises 82Zn-15Al-3Cu.

12. The method according to claim 10, characterized in that, The first Al-Cu-X composite laminate and the second Al-Cu-X composite laminate are 94Al-5Cu-1BN, 94Al-5Cu-1SiC or 94Al-5Cu-1C.

13. The method according to claim 10, characterized in that, The duration of the heat treatment is 0.5 to 12 hours.

14. The method according to claim 10, characterized in that, The bonding temperature is 490°C to 550°C.

15. The method according to claim 10, characterized in that, The first melting point is 380°C to 500°C.

16. The method according to claim 10, characterized in that, It also includes pressurizing the process simultaneously with the heat treatment, wherein the pressure of the pressurizing process is from 3 MPa to 15 MPa.

17. The method according to claim 16, characterized in that, The heating treatment and the pressurization treatment cause the bonding material to undergo a transient liquid phase bonding process to transform into an interface bonding layer, and the melting point of the interface bonding layer is higher than the first melting point.

18. The method according to claim 17, characterized in that, The melting point of the interface bonding layer is 620°C to 645°C.

19. A heat dissipation component, characterized in that, include: A housing, wherein the housing comprises the aluminum-based composite structure as described in claim 1.

20. The heat dissipation assembly according to claim 19, characterized in that, The heat dissipation component is a liquid cooling plate.

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