Fault analysis method, device and system for temperature sensor

Abstract

The application is suitable for the field of nuclear power technology, and provides a fault analysis method, device and system of a temperature sensor, comprising: collecting temperature values of a temperature sensor to be analyzed within a first preset time length to obtain a plurality of temperature values to be analyzed; collecting temperature values of sensors belonging to a same sensor group as the temperature sensor to be analyzed within the first preset time length to obtain a plurality of reference temperature values, wherein the difference between the temperature values of each sensor in the same sensor group is less than a first difference threshold; if the difference between the temperature values to be analyzed and the reference temperature values is greater than a second difference threshold, and the distribution trend of the plurality of temperature values to be analyzed is different from the distribution trend of the plurality of reference temperature values, it is determined that the temperature sensor to be analyzed is suspected to have a wiring error, wherein the second difference threshold is greater than or equal to the first difference threshold. Through the above method, the troubleshooting efficiency can be improved.

Description

Technical Field

[0001] This application belongs to the field of nuclear power technology, and in particular relates to fault analysis methods, devices, electronic equipment, computer-readable storage media, and computer program products for temperature sensors. Background Technology

[0002] The containment vessel of a nuclear power plant is the last physical barrier to prevent the escape of radioactive materials, and it is constructed of prestressed concrete.

[0003] To achieve long-term monitoring of the stress, strain, and temperature distribution of the containment structure, a large number of temperature sensors need to be pre-installed in various parts of the containment. These temperature sensors are connected to a data acquisition box with terminal blocks via cables. Inside the acquisition box, the sensors are categorized by measurement signal type and paired with the terminals. Then, they are connected via cables to an automated data acquisition cabinet, where a high-performance data acquisition unit automatically collects and stores the data. Due to the large number and variety of pre-installed sensors and limited installation space, incorrect wiring sequences are prone to occur during construction or maintenance. This means that a sensor signal may be incorrectly connected to a different terminal channel in the acquisition box. Such errors lead to confusion between data and physical location, severely impacting the validity of the monitoring data and the accuracy of structural safety assessments.

[0004] Currently, troubleshooting errors in temperature sensor wiring terminals mainly relies on manual point-by-point testing and comparison with drawings. However, this method is labor-intensive and inefficient. Summary of the Invention

[0005] This application provides a fault analysis method for temperature sensors, which can solve the problem of low troubleshooting efficiency in existing methods when checking wiring errors of temperature sensors in containment enclosures.

[0006] In a first aspect, embodiments of this application provide a fault analysis method for a temperature sensor, comprising: Within a first preset time period, the temperature value of the temperature sensor to be analyzed is collected to obtain multiple temperature values ​​to be analyzed. The temperature sensor to be analyzed is a temperature sensor pre-embedded in the containment. Within the first preset time period, the temperature values ​​of sensors belonging to the same sensor group as the temperature sensor to be analyzed are collected to obtain multiple reference temperature values, wherein the difference between the temperature values ​​of each sensor in the same sensor group is less than a preset first difference threshold. If the difference between the temperature value to be analyzed and the reference temperature value is greater than a second difference threshold, and the distribution trend of the multiple temperature values ​​to be analyzed is different from the distribution trend of the multiple reference temperature values, then it is determined that the temperature sensor to be analyzed is suspected of having a wiring error, wherein the second difference threshold is greater than or equal to the first difference threshold.

[0007] The beneficial effects of the embodiments in this application compared with the prior art are: In this embodiment, after collecting the temperature value of the temperature sensor to be analyzed (i.e., the temperature value to be analyzed) and the temperature value of the sensor belonging to the same sensor group as the temperature sensor to be analyzed (i.e., the reference temperature value) within a first preset time period, if it is determined that the difference between the temperature value to be analyzed and the reference temperature value is greater than a second difference threshold, and the distribution trend of multiple temperature values ​​to be analyzed is different from the distribution trend of multiple reference temperature values, then it is determined that the temperature sensor to be analyzed is suspected of having a wiring error. Since the difference in temperature values ​​of each sensor within the same sensor group is less than a preset first difference threshold, and the second difference threshold is greater than or equal to the first difference threshold, when it is determined that the difference between the temperature value to be analyzed and the reference temperature value is greater than the second difference threshold, it indicates that the difference between the temperature value to be analyzed and the reference temperature value must be greater than the first difference threshold. At this time, the temperature sensor to be analyzed may have its own fault, environmental common-mode interference, or wiring error. Building upon this, a distribution trend comparison is further introduced as an auxiliary judgment condition: when there is a fault in the sensor itself or common-mode interference in the environment, the temperature value to be analyzed and the reference temperature value are usually still constrained by the same physical environment or the same signal link characteristics, and their change patterns (i.e., distribution trends) are usually consistent, only showing an overall numerical shift or amplitude scaling. However, when there is a wiring error, the actual signal source connected to the temperature sensor to be analyzed has changed, and its temperature change pattern deviates fundamentally from the real physical environment pattern reflected by the reference sensor in the group, resulting in different distribution trends of multiple temperature values ​​to be analyzed and multiple reference temperature values. Therefore, by superimposing the dual conditions of "numerical difference greater than the second difference threshold" and "different distribution trends," a single numerical shift caused by its own fault or common-mode interference in the environment can be effectively eliminated, thereby significantly improving the accuracy of judging whether the temperature sensor to be analyzed has a suspected wiring error. In addition, since the fault analysis method of the temperature sensor provided in this application embodiment does not require manual comparison one by one, it is beneficial to improve the troubleshooting efficiency.

[0008] Secondly, embodiments of this application provide a fault analysis device for a temperature sensor, comprising: The module for acquiring temperature values ​​to be analyzed is used to collect temperature values ​​from the temperature sensor to be analyzed within a first preset time period to obtain multiple temperature values ​​to be analyzed. The temperature sensor to be analyzed is a temperature sensor pre-embedded in the containment. The reference temperature value acquisition module is used to collect the temperature values ​​of sensors belonging to the same sensor group as the temperature sensor to be analyzed within the first preset time period, and obtain multiple reference temperature values, wherein the difference between the temperature values ​​of the various sensors in the same sensor group is less than a preset first difference threshold. A wiring error suspected detection module is used to determine that the temperature sensor to be analyzed is suspected of having a wiring error if the difference between the temperature value to be analyzed and the reference temperature value is greater than a second difference threshold, and the distribution trend of multiple temperature values ​​to be analyzed is different from the distribution trend of multiple reference temperature values. The second difference threshold is greater than or equal to the first difference threshold.

[0009] Thirdly, embodiments of this application provide an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the method described in the first aspect.

[0010] Fourthly, embodiments of this application provide a computer-readable storage medium storing a computer program that, when executed by a processor, implements the method described in the first aspect.

[0011] Fifthly, embodiments of this application provide a computer program product that, when run on an electronic device, causes the electronic device to perform the method described in the first aspect.

[0012] It is understood that the beneficial effects of the second to fifth aspects mentioned above can be found in the relevant descriptions in the first aspect mentioned above, and will not be repeated here. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0014] Figure 1 This is a schematic diagram of the structure of a nuclear power plant containment vessel provided in an embodiment of this application; Figure 2 This is a flowchart illustrating a fault analysis method for a temperature sensor provided in an embodiment of this application. Figure 3 This is an example diagram illustrating the application of a temperature sensor pre-embedded at a containment monitoring point, as provided in one embodiment of this application. Figure 4 This is a schematic diagram of the structure of a fault analysis device for a temperature sensor provided in an embodiment of this application; Figure 5 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Detailed Implementation

[0015] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0016] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0017] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0018] Furthermore, in the description of this application and the appended claims, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0019] References to "one embodiment" or "some embodiments" in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized.

[0020] The containment vessel of a nuclear power plant is a large-volume reinforced concrete structure with the highest nuclear safety rating. It is typically a cylindrical structure with a diameter of about 40 meters and a height of about 51 meters (e.g., Figure 1 As shown in the figure, the interior is equipped with a large number of horizontal and vertical prestressed steel strands, steel sealing linings, high-strength steel bars, embedded parts, and coarse and fine aggregates. Among them, these embedded parts include a large number of sensors, such as strain gauges and temperature sensors (such as thermistors and thermocouples).

[0021] Because of the large number and variety of sensors embedded within the containment structure, incorrect wiring sequence at the temperature sensor terminals is a common problem during construction and maintenance. Manually checking for wiring errors is inefficient due to the large number of temperature sensors and the limited time and energy available for inspection.

[0022] To improve troubleshooting efficiency while ensuring accuracy, this application provides a fault analysis method for temperature sensors. This method utilizes the characteristic that the temperature values ​​measured by various temperature sensors in the same sensor group embedded within the containment structure are relatively similar to those measured by the sensor itself to analyze whether there are wiring errors in the temperature sensors.

[0023] The fault analysis method for the temperature sensor provided in the embodiments of this application will be described below with reference to the accompanying drawings.

[0024] Figure 2 This illustration shows a flowchart of a fault analysis method for a temperature sensor according to an embodiment of this application. This fault analysis method can be applied to electronic devices, including mobile devices, workstations, computers, servers, etc. The fault analysis method provided in this embodiment is described in detail below: S21. Collect the temperature value of the temperature sensor to be analyzed within a first preset time period to obtain multiple temperature values ​​to be analyzed. The temperature sensor to be analyzed is a temperature sensor pre-embedded in the containment.

[0025] The temperature sensor to be analyzed is a temperature sensor that has been verified to have no mechanical faults.

[0026] The aforementioned first preset duration can be set according to actual conditions. Considering the large thermal inertia of the containment concrete, the internal temperature field requires a long time to reach a quasi-steady state, and the low temperature change rate of the embedded temperature sensor under conditions without external heat source, the first preset duration can be set to no less than 24 hours to ensure sufficient temperature change samples are obtained.

[0027] In this embodiment of the application, multiple temperature sensors are pre-embedded within the containment structure. For ease of differentiation, the temperature sensor pre-embedded within the containment structure that requires wiring analysis is named the temperature sensor to be analyzed. Multiple temperature values ​​of the temperature sensor to be analyzed are continuously collected within a first preset time period (e.g., 24 hours) to obtain multiple temperature values ​​to be analyzed.

[0028] S22. Within the first preset time period, collect the temperature values ​​of sensors belonging to the same sensor group as the temperature sensor to be analyzed to obtain multiple reference temperature values, wherein the difference between the temperature values ​​of each sensor in the same sensor group is less than a preset first difference threshold.

[0029] In this embodiment, multiple sensors pre-embedded within the same location range of the containment are grouped into the same sensor group. Since the pre-embedded locations of the sensors in the same sensor group are very close within the containment, the temperature values ​​corresponding to these sensors are relatively close, meaning the difference between the temperature values ​​corresponding to these sensors is small, such as less than a preset first difference threshold.

[0030] The aforementioned first difference threshold can be set according to actual conditions. Optionally, the first difference threshold can be set based on the pre-embedded location of the temperature sensor within the containment. Since temperature changes may differ at different locations within the containment, setting the first difference threshold based on the pre-embedded location helps improve the accuracy of the set first difference threshold.

[0031] In this embodiment, based on the pre-embedded location of each sensor within the containment structure, these sensors are assigned to corresponding sensor groups. Each sensor group includes sensor information such as the sensor's identifier, sensor type, and pre-embedded location within the containment structure. When analyzing the wiring of a specific temperature sensor, the sensors belonging to the same sensor group as the temperature sensor to be analyzed are determined based on the pre-recorded sensor information from each sensor group. It should be noted that a single sensor group may contain only different types of temperature sensors, or it may contain both temperature sensors and non-temperature sensors (such as pressure gauges); this is not limited here.

[0032] Once a sensor belonging to the same sensor group as the temperature sensor to be analyzed is identified, multiple temperature values ​​(i.e., the temperature values ​​to be analyzed) of the temperature sensor to be analyzed are collected within a first preset time period (e.g., 24 hours). Multiple temperature values ​​of the identified sensor are also collected within the same first preset time period to obtain multiple reference temperature values. Optionally, the temperature values ​​to be analyzed and the reference temperature values ​​are collected at the same frequency and at the same time to improve the accuracy of the comparison results obtained after comparing the temperature values ​​to be analyzed and the reference temperature values.

[0033] S23. If the difference between the temperature value to be analyzed and the reference temperature value is greater than the second difference threshold, and the distribution trend of the multiple temperature values ​​to be analyzed is different from the distribution trend of the multiple reference temperature values, then it is determined that the temperature sensor to be analyzed is suspected of having a wiring error, wherein the second difference threshold is greater than or equal to the first difference threshold.

[0034] In this embodiment, each temperature value to be analyzed is compared with each reference temperature value. This comparison can be achieved through subtraction or other methods, and the difference between the temperature value to be analyzed and the reference temperature value is determined based on the comparison result. Optionally, when the temperature values ​​to be analyzed and the reference temperature values ​​are collected at the same frequency and at the same time, the temperature value to be analyzed at the same time can be compared with the reference temperature value at the corresponding time. If it is determined that there is a temperature value to be analyzed whose difference from the reference temperature value is greater than a second difference threshold, then it is determined that the difference between the temperature value to be analyzed and the reference temperature value is greater than the second difference threshold.

[0035] Optionally, the average value of each temperature to be analyzed and the average value of each reference temperature can be calculated, and then the difference between the two average values ​​can be compared to see if it exceeds a second difference threshold. Of course, in practice, other comparison methods can also be used, which are not limited here.

[0036] In this embodiment, in addition to comparing specific temperature values, the distribution trend of the temperature values ​​is also analyzed. This distribution trend can be represented by one or more of the following: first derivative (or slope), area under the curve, fluctuation frequency, trend strength, periodicity, autocorrelation, etc. Specifically, when the distribution trend is represented by the first derivative, comparing the distribution trend of the temperature values ​​to be analyzed with that of the reference temperature values ​​is equivalent to comparing the first derivative of the temperature values ​​to be analyzed with that of the reference temperature values. If the difference between the two is greater than a third difference threshold, it is determined that the distribution trend of the multiple temperature values ​​to be analyzed is different from the distribution trend of the multiple reference temperature values.

[0037] In this embodiment, after collecting the temperature value of the temperature sensor to be analyzed (i.e., the temperature value to be analyzed) and the temperature value of the sensor belonging to the same sensor group as the temperature sensor to be analyzed (i.e., the reference temperature value) within a first preset time period, if it is determined that the difference between the temperature value to be analyzed and the reference temperature value is greater than a second difference threshold, and the distribution trend of multiple temperature values ​​to be analyzed is different from the distribution trend of multiple reference temperature values, then it is determined that the temperature sensor to be analyzed is suspected of having a wiring error. Since the difference in temperature values ​​of each sensor within the same sensor group is less than a preset first difference threshold, and the second difference threshold is greater than or equal to the first difference threshold, when it is determined that the difference between the temperature value to be analyzed and the reference temperature value is greater than the second difference threshold, it indicates that the difference between the temperature value to be analyzed and the reference temperature value must be greater than the first difference threshold. At this time, the temperature sensor to be analyzed may have its own fault, environmental common-mode interference, or wiring error. Building upon this, a distribution trend comparison is further introduced as an auxiliary judgment condition: when there is a fault in the sensor itself or common-mode interference in the environment, the temperature value to be analyzed and the reference temperature value are usually still constrained by the same physical environment or the same signal link characteristics, and their change patterns (i.e., distribution trends) are usually consistent, only showing an overall numerical shift or amplitude scaling. However, when there is a wiring error, the actual signal source connected to the temperature sensor to be analyzed has changed, and its temperature change pattern deviates fundamentally from the real physical environment pattern reflected by the reference sensor in the group, resulting in different distribution trends of multiple temperature values ​​to be analyzed and multiple reference temperature values. Therefore, by superimposing the dual conditions of "numerical difference greater than the second difference threshold" and "different distribution trends," a single numerical shift caused by its own fault or common-mode interference in the environment can be effectively eliminated, thereby significantly improving the accuracy of judging whether the temperature sensor to be analyzed has a suspected wiring error. In addition, since the fault analysis method of the temperature sensor provided in this application embodiment does not require manual comparison one by one, it is beneficial to improve the troubleshooting efficiency.

[0038] As described above, by combining the dual conditions of "numerical difference greater than the second difference threshold" and "different distribution trend," it is possible to preliminarily determine whether the temperature sensor under analysis is suspected of having a wiring error. To further improve the accuracy of the wiring error judgment, the strain values ​​measured by the strain gauge under constant load and / or pressure test can be used for comprehensive judgment. The pressure test, also known as the pressure test condition, refers to the special conditions under which the overall structural strength test and leakage rate test are conducted in accordance with nuclear safety regulations during pre-service or in-service inspections of the nuclear power plant containment to verify structural integrity and sealing performance.

[0039] When determining whether there is a wiring error in the temperature sensor under analysis by combining the first strain value measured by the strain gauge under constant load: Assuming that the sensors belonging to the same sensor group as the temperature sensor to be analyzed include strain gauges, then after step S23 above, which determines that the temperature sensor to be analyzed is suspected of having a wiring error, the process further includes: A1. Obtain multiple first measured strain values ​​of the strain gauge within a second preset time period, wherein the difference between the second preset time period and 24 hours is within the preset time period difference range.

[0040] In this embodiment, strain gauges belonging to the same sensor group as the temperature sensor to be analyzed and free from wiring errors can be pre-selected. Then, multiple strain values ​​(i.e., the aforementioned first measured strain values) measured by the selected strain gauges within a second preset time period are obtained. For example, multiple first measured strain values ​​measured by the strain gauges within the second preset time period are obtained according to a preset strain value interval. Since the obtained first measured strain values ​​are from strain gauges without wiring errors, this improves the accuracy of subsequent wiring error judgment results.

[0041] Optionally, outliers among the acquired first measured strain values ​​can be removed. For example, abrupt jumps in strain values ​​between adjacent sampling points (such as a rate of change exceeding 1 Hz) or occasional jumps caused by high-frequency noise interference can be identified as outliers and removed.

[0042] A2. For any one of the above first measured strain values, adjust the above first measured strain value according to the temperature value corresponding to the strain gauge and the temperature value of the environment where the strain gauge is located, wherein the temperature value corresponding to the strain gauge and / or the temperature value of the environment where the strain gauge is located are represented by the temperature value measured by the temperature sensor to be analyzed.

[0043] In this embodiment, when acquiring each first measured strain value, the temperature value corresponding to the strain gauge and the temperature value of the environment where the strain gauge is located are also acquired. The temperature value corresponding to the strain gauge and / or the temperature value of the environment where the strain gauge is located are represented by the temperature value measured by the temperature sensor to be analyzed. For example, when the strain gauge and the thermistor are in a coordinated relationship, and the thermistor serves as the temperature sensor to be analyzed, the temperature value corresponding to the strain gauge is the temperature value measured by the thermistor. When the distance between the thermocouple and the strain gauge is within a preset distance threshold, the temperature value measured by the thermocouple can be used as the temperature value of the environment where the strain gauge is located.

[0044] Optionally, the aforementioned preset distance threshold can be determined based on the location of the strain gauge and thermocouple within the containment. For example, if the strain gauge and thermocouple are located near a region of severe temperature gradient within the containment (such as the inner or outer surface of the containment, cooling water pipes, penetrations, etc.), the preset distance threshold can be set to a smaller value, such as less than 200 mm; conversely, it can be set to a larger value, such as greater than 200 mm but less than 500 mm. And / or, the aforementioned preset distance threshold can also be determined based on the accuracy requirements of the strain measurement. For example, when the accuracy requirements for strain measurement are high, the aforementioned preset distance threshold can be set to a smaller value; conversely, it can be set to a relatively larger value. For example, when the strain gauge and thermocouple are located near a region of severe temperature gradient within the containment and there are accuracy requirements for strain measurement, the preset distance threshold can be set to less than 100 mm.

[0045] When the temperature sensor to be analyzed is a thermocouple, the temperature value measured by the thermocouple can be used as the temperature value of the environment where the strain gauge is located.

[0046] When the temperature sensor to be analyzed consists only of a thermistor (or thermocouple), a compensation model (such as a strain-temperature characteristic curve) can be pre-established based on the relationship between the temperature value and strain value of the thermistor (or the relationship between the temperature value and strain value of the thermocouple). The first measured strain value at the current temperature is then adjusted according to this compensation model. When the temperature sensor to be analyzed includes both a thermistor and a thermocouple, the temperature value of the thermistor is taken as the temperature value of the strain gauge itself, and the temperature value of the thermocouple (i.e., the temperature of the concrete) is taken as the temperature of the environment where the strain gauge is located. The first measured strain value can be adjusted according to the following formula: .

[0047] in, The first measured strain value after adjustment. The first measured strain value, This is the strain gauge temperature self-compensation coefficient. This is the temperature change of the strain gauge itself, which is equal to the difference between the current temperature of the strain gauge and its initial temperature. This represents the change in ambient temperature, which is equal to the difference between the current ambient temperature and the initial ambient temperature. This is the coefficient of thermal expansion of concrete. The value is the strain gauge sensitivity coefficient.

[0048] A3. Determine the strain difference based on the multiple adjusted strain values ​​measured above.

[0049] In this embodiment, the difference between any two adjacent adjusted first measured strain values ​​can be calculated, and the strain difference can be determined based on multiple difference results, such as determining the largest difference result as the strain difference; alternatively, the difference between two consecutive adjusted first measured strain values ​​can be calculated, and the resulting difference is taken as the strain difference. Of course, in actual practice, other processing can be performed on the adjusted first measured strain values ​​to determine the strain difference, which is not limited here.

[0050] A4. If the strain difference is greater than the preset first strain difference threshold, it is determined that the temperature sensor to be analyzed has a wiring error.

[0051] The aforementioned preset first strain difference threshold can be set according to actual conditions, for example, based on the pre-embedded location of the strain gauge within the containment and the current operating conditions of the containment, in order to improve the accuracy of the determined first strain difference threshold. Optionally, the aforementioned first strain difference threshold can be set to ±5 microstrains.

[0052] Since the difference between the second preset duration and 24 hours is within the preset duration difference range, the strain gauge belonging to the same sensor group as the temperature sensor to be analyzed is equivalent to being under a constant load condition (the strain difference of the strain gauge is only affected by temperature). At this time, the theoretical strain difference of the strain gauge should be 0. Therefore, in this embodiment, the multiple first measured strain values ​​of the strain gauge belonging to the same sensor group as the temperature sensor to be analyzed within the second preset duration are adjusted according to the temperature value of the thermistor and / or the temperature value of the thermocouple. After determining the strain difference based on the multiple adjusted first measured strain values, if it is determined that the strain difference is greater than the first strain difference threshold, it indicates that the temperature value of the temperature sensor to be analyzed does not match the temperature value corresponding to the strain gauge. At this time, it is determined that there is a wiring error in the temperature sensor to be analyzed, which can improve the accuracy of the wiring error judgment result.

[0053] When determining whether there is a wiring error in the temperature sensor to be analyzed by combining the second strain value measured by the strain gauge under pressure test: Assuming that the sensors belonging to the same sensor group as the temperature sensor to be analyzed include strain gauges, after step S23 above, which determines that the temperature sensor to be analyzed is suspected of having a wiring error, the following steps are also included: B1. After conducting an overall pressure test on the containment vessel, obtain the load on the containment vessel and the second measured strain value of the strain gauge.

[0054] In the overall pressure test, the corresponding load refers to the structural integrity test pressure load. This load is a target value predetermined during the design phase based on the containment structural integrity requirements (typically 1.10 to 1.15 times the design pressure). During the dynamic pressurization process of the pressure test, as the gas pressure injected into the containment changes continuously, the real-time pressure load borne by the structure also changes accordingly. Therefore, it is necessary to monitor and obtain the actual pressure load under the current test conditions in real time to control the pressurization rate, record the structural response, and verify whether the predetermined target test pressure has been reached.

[0055] In this embodiment, after the containment vessel undergoes an overall pressure test, the load corresponding to the containment vessel and the strain value corresponding to the strain gauge (i.e., the second measured strain value) are recorded. Optionally, strain gauges that do not have wiring errors and belong to the same sensor group as the temperature sensor to be analyzed are pre-selected, and then multiple strain values ​​(i.e., the aforementioned second measured strain values) measured by the selected strain gauges under pressure conditions are obtained.

[0056] B2. Based on the correspondence between load and theoretical strain value, determine the theoretical strain value of the strain gauge under the load of the containment. The correspondence between the load and theoretical strain value is used to record the theoretical strain value of the strain gauge under different loads of the overall pressure test after the containment is subjected to an overall pressure test.

[0057] In this embodiment, multiple real-time loads after the overall pressure test of the containment vessel can be pre-recorded, as well as the theoretical strain values ​​of the strain gauges under these multiple real-time loads. Based on the recorded real-time loads and theoretical strain values, the correspondence between the loads and theoretical strain values ​​can be obtained. Subsequently, when analyzing the embedded temperature sensors, this correspondence can be quickly retrieved, and the theoretical strain value corresponding to the containment vessel's load can be found based on this correspondence.

[0058] B3. Adjust the second measured strain value according to the temperature value corresponding to the strain gauge and the temperature value of the environment where the strain gauge is located to obtain the actual strain value of the strain gauge. The temperature value corresponding to the strain gauge and / or the temperature value of the environment where the strain gauge is located are expressed by the temperature value measured by the temperature sensor to be analyzed.

[0059] The temperature value corresponding to the strain gauge can be determined by measuring the temperature value of the thermistor attached to the strain gauge, that is, by determining the temperature value output from the terminal corresponding to the thermistor as recorded in advance. It should be noted that since the pre-recorded correspondence between the thermistor and the terminal may be incorrect, the temperature value of the thermistor obtained based on the pre-recorded correspondence may be incorrect.

[0060] The ambient temperature of the strain gauge can be determined by measuring the temperature of thermocouples around the strain gauge (i.e., within a preset distance threshold from the pre-embedded location of the strain gauge), specifically based on the temperature value output from the corresponding terminal of the thermocouple, which has been recorded beforehand. It should be noted that the pre-recorded correspondence between thermocouples and terminals may be incorrect; therefore, the temperature value obtained from the pre-recorded correspondence may be inaccurate.

[0061] Both the thermistors and thermocouples mentioned above can be used as the temperature sensors to be analyzed.

[0062] In this embodiment of the application, the process of adjusting the second measured strain value according to the temperature value corresponding to the strain gauge and the temperature value of the environment where the strain gauge is located is the same as the process of adjusting the first measured strain value according to the temperature value corresponding to the strain gauge and the temperature value of the environment where the strain gauge is located, and will not be described again here.

[0063] B4. If the absolute value of the difference between the actual strain value and the theoretical strain value of the strain gauge is greater than the preset second strain difference threshold, then it is determined that the temperature sensor to be analyzed has a wiring error.

[0064] The aforementioned second strain difference threshold can be set according to actual conditions, for example, based on the pre-embedded location of the strain gauge within the containment and the current operating conditions of the containment. Optionally, the aforementioned second strain difference threshold can be set to ±5 microstrains.

[0065] In this embodiment, considering that under pressure conditions, the strain gauge is affected not only by temperature but also by the expansion and deformation of the containment vessel under pressure, the second measured strain value of the strain gauge is adjusted according to the temperature value of the temperature sensor to be analyzed. The difference obtained by comparing the adjusted second measured strain value (i.e., the actual strain value) with the theoretical strain value can reflect whether the theoretical strain adjustment calculated based on the temperature value measured by the temperature sensor to be analyzed (such as a thermistor and / or thermocouple) matches the temperature-related strain component actually measured by the strain gauge. If they do not match, it indicates that the temperature sensor to be analyzed cannot correctly represent the actual temperature of the pre-embedded location of the strain gauge, that is, it indicates that the temperature sensor to be analyzed and the strain gauge do not belong to the same sensor group. Therefore, judging whether there is a wiring error in the temperature sensor to be analyzed by the above method is beneficial to improving the accuracy of the obtained wiring error judgment result.

[0066] In this embodiment, considering that the pre-embedded sensors belong to different sensor groups, wiring errors will include two types: wiring sequence errors within a group and crosstalk errors between groups. Therefore, after determining that the temperature sensor to be analyzed has a wiring error, it is possible to further determine which type of wiring error it is. Among them, wiring sequence errors within a group refer to the wiring order of the sensors within the same sensor group being disordered; crosstalk errors between groups refer to a sensor from one sensor group being incorrectly connected to the wiring terminals of another sensor group.

[0067] To accurately determine whether the temperature sensor to be analyzed (such as a thermocouple and / or the aforementioned thermistor) has an intra-group wiring sequence error or an inter-group wiring crosstalk error, a temporary temperature sensor (i.e., the subsequent first temperature sensor) is installed on the inner surface of the containment at the pre-embedded location point (i.e., the containment monitoring point) where the temperature sensor to be analyzed is located, and a temporary temperature sensor (i.e., the subsequent second temperature sensor) is installed on the outer surface of the containment at the pre-embedded location point. The wiring error of the temperature sensor to be analyzed is then determined by combining the first temperature value detected by the first temperature sensor and the second temperature value detected by the second temperature sensor. That is, in some embodiments, after determining that the temperature sensor to be analyzed has a wiring error, the following further steps are taken: C1. Obtain the temperature value of the first temperature sensor to obtain the first temperature value, wherein the first temperature sensor is temporarily installed on the inner surface of the suspected pre-embedded location point corresponding to the temperature sensor to be analyzed.

[0068] In this embodiment, the pre-embedded location of the temperature sensor to be analyzed can be located based on the design drawings of the containment vessel. This pre-embedded location is the aforementioned suspected pre-embedded location. The position of the suspected pre-embedded location can be represented by elevation and direction angle. Here, elevation refers to the vertical height of the suspected pre-embedded location relative to the reference plane, and direction angle refers to the orientation or horizontal angle of the suspected pre-embedded location on the horizontal plane.

[0069] In this embodiment of the application, the same containment monitoring point may include multiple pre-embedded location points, and each pre-embedded location point has one or more sensors pre-embedded. For example... Figure 3 As shown, two temperature sensors are pre-embedded at two different locations within the same containment monitoring point, along the thickness direction. When it is necessary to analyze wiring errors of these two temperature sensors, one temperature sensor can be installed on the inner surface and the other on the outer surface of the containment monitoring point. For ease of distinction, the temperature sensor installed on the inner surface is named the first temperature sensor, and the temperature sensor installed on the outer surface is named the second temperature sensor.

[0070] exist Figure 3In the text, "31" represents the first temperature sensor installed on the inner surface of the containment monitoring point, "32" and "33" both represent two pre-embedded temperature sensors embedded in the containment, which can be used as the temperature sensors to be analyzed in the embodiments of this application, and "34" represents the second temperature sensor installed on the outer surface of the containment monitoring point.

[0071] Optionally, to reduce wiring difficulty, the first temperature sensor can be a temperature sensor with wireless transmission function. In this case, the electronic device can obtain the first temperature value sent by the first temperature sensor through wireless communication, such as by obtaining the first temperature value sent by the first temperature sensor through a wireless repeater and a wireless gateway.

[0072] Of course, in practice, the aforementioned first temperature sensor can also communicate with electronic devices via a wired connection, which is not limited here.

[0073] Optionally, the first temperature sensor can be fixed to the inner surface of the suspected pre-embedded location point by a fixing clamp.

[0074] In this embodiment, a first temperature value from a first temperature sensor can be acquired according to a preset interval, which can be 5 minutes. After acquiring multiple raw first temperature values, these values ​​can be analyzed, and outliers can be removed to eliminate the influence of occasional interference signals on subsequent analysis. For example, raw first temperature values ​​with fluctuations greater than 1°C are identified as outliers and removed.

[0075] C2. Obtain the temperature value of the second temperature sensor to obtain the second temperature value, wherein the second temperature sensor is temporarily installed on the outer surface of the suspected pre-embedded location.

[0076] The suspected pre-embedded location point corresponding to the second temperature sensor mentioned above is the same as the suspected pre-embedded location point corresponding to the first temperature sensor.

[0077] Optionally, the second temperature sensor can be fixed to the outer surface of the suspected pre-embedded location point using a fixing clamp.

[0078] In this embodiment, the electronic device obtains the second temperature value in a similar way to the method described above for obtaining the first temperature sensor value, and will not be repeated here.

[0079] After obtaining multiple raw second temperature values ​​from the second temperature sensor, these raw second temperature values ​​can be analyzed, and outliers can be removed to eliminate the influence of occasional interference signals on subsequent analysis.

[0080] C3. Obtain the temperature value output by the target terminal to obtain the temperature value to be matched. The target terminal is the terminal corresponding to the temperature sensor to be analyzed.

[0081] In this embodiment of the application, after the first temperature sensor and the second temperature sensor are installed, the temperature value of the temperature sensor to be analyzed located between the first temperature sensor and the second temperature sensor is obtained, that is, the temperature value output by the current terminal of the temperature sensor to be analyzed is obtained, and the matching temperature value is obtained.

[0082] In this embodiment, considering that the temperature sensor to be analyzed is embedded in the containment, and the signal of the embedded sensor is transmitted to the acquisition box through a cable, and then to the acquisition cabinet through the acquisition box, the temperature value of the temperature sensor to be analyzed can be obtained from the acquisition box or the acquisition cabinet.

[0083] For example, when acquiring the temperature value of the temperature sensor to be analyzed from the acquisition box, the acquisition box can be connected in parallel with the newly installed acquisition device via a connecting cable with a pluggable terminal on one end. The electronic equipment then acquires the temperature value of the temperature sensor to be analyzed through the newly installed acquisition device. When acquiring the temperature value in this way, it is not necessary to disconnect the wiring of the original monitoring system, thus ensuring that the normal operation of the existing containment automated monitoring system is not affected when acquiring the temperature value.

[0084] C4. Determine the temperature gradient curve based on the first temperature value, the second temperature value, and the thickness of the containment vessel.

[0085] In this embodiment, the slope of the temperature gradient curve can be calculated based on the first temperature value, the second temperature value, and the thickness of the containment, and the temperature gradient curve can be determined based on the slope, the first temperature value, and the second temperature value.

[0086] Optionally, if the thickness of the containment enclosure varies in different areas, the thickness of the containment enclosure can be determined based on the thickness of the area where the temperature sensor to be analyzed is located.

[0087] C5. If the minimum deviation between the above-mentioned temperature value to be matched and the above-mentioned temperature gradient curve is less than the preset deviation threshold, it is determined that the above-mentioned temperature sensor to be analyzed has an incorrect wiring sequence within the group.

[0088] In this embodiment, the temperature value to be matched is compared with the temperature values ​​at each pre-embedded location point of the temperature gradient curve to find the minimum difference (i.e., the minimum deviation) between the temperature value to be matched and the temperature value of the temperature gradient curve. (Reference) Figure 3 Assuming Figure 3If the pre-embedded sensor 32 is the temperature sensor to be analyzed, then the temperature value to be matched corresponding to the temperature sensor to be analyzed is compared with the temperature value of the pre-embedded location point corresponding to the pre-embedded sensor 33 in the temperature gradient curve.

[0089] If the minimum deviation found is less than the preset deviation threshold, it indicates that the temperature value to be matched belongs to the temperature gradient curve. This means that the temperature value to be matched conforms to the spatial continuity of the object characteristics of the temperature values ​​within the sensor group where the temperature gradient curve is located. Combined with the judgment result that the temperature sensor to be analyzed has a wiring error, it can be further determined that the temperature sensor to be analyzed has an incorrect wiring sequence within the group.

[0090] C6. If the minimum deviation between the temperature value to be matched and the temperature gradient curve is not less than the deviation threshold, then it is determined that the temperature sensor to be analyzed has a crosstalk error between groups.

[0091] When it is determined that the minimum deviation between the temperature value to be matched and the temperature gradient curve is not less than the deviation threshold, it indicates that the temperature value to be matched does not conform to the spatial continuity of the temperature value within the sensor group where the temperature gradient curve is located. Combined with the judgment result that the temperature sensor to be analyzed has a wiring error, it can be further determined that the temperature sensor to be analyzed has a crosstalk error between groups.

[0092] In this embodiment, a first temperature sensor and a second temperature sensor are temporarily installed on the inner and outer surfaces of the suspected pre-embedded location corresponding to the temperature sensor to be analyzed, respectively. The temperature values ​​of the first and second temperature sensors are obtained respectively, resulting in corresponding first and second temperature values. Since the temperature sensor to be analyzed is located between the first and second temperature sensors, the arrangement of the first temperature value, the matching temperature value corresponding to the temperature sensor to be analyzed, and the second temperature value (or the second temperature value, the matching temperature value, and the first temperature value) usually has a descending order relationship, or a descending order relationship. Therefore, by determining whether the temperature sensor to be analyzed has an intra-group wiring sequence error or an inter-group wiring crosstalk error based on the minimum deviation between the temperature value of the temperature sensor to be analyzed (i.e., the matching temperature value) and the temperature gradient curve and a preset deviation threshold, it is beneficial to improve the accuracy of the judgment result.

[0093] In some embodiments, after C5 and determining that the temperature sensor to be analyzed has an incorrect wiring sequence within the group, the method further includes: D1. Obtain the temperature values ​​output from the terminals of each temperature sensor in the sensor group containing the temperature sensor to be analyzed, and arrange them according to a preset order of magnitude to obtain a temperature value sequence.

[0094] The preset order of size can be from largest to smallest or from smallest to largest; no limitation is made here.

[0095] In this embodiment of the application, the wiring terminals of each temperature sensor in the sensor group where the temperature sensor to be analyzed is located are determined according to the pre-recorded correspondence between the wiring terminals and the pre-embedded locations of each temperature sensor embedded in the containment, and the temperature values ​​output by these wiring terminals are obtained.

[0096] D2. Based on the theoretical relationship of the temperature values ​​corresponding to each target pre-embedded location point, sort the above-mentioned target pre-embedded location points according to the preset size arrangement order to obtain the target pre-embedded location point sequence. Among them, the above-mentioned target pre-embedded location point is the pre-embedded location point of a temperature sensor in the sensor group where the temperature sensor to be analyzed is located.

[0097] In this embodiment, after pre-embedding various sensors (such as temperature sensors) into the containment, the correspondence between these temperature sensors and their pre-embedded locations is recorded. Based on the recorded correspondence and the pre-embedded locations of the temperature sensors to be analyzed, the target pre-embedded locations can be found. Based on the positions of each target pre-embedded location within the containment and the heat conduction patterns within the containment, the theoretical magnitudes of the temperature values ​​corresponding to each target pre-embedded location are calculated. For example, in... Figure 3 If the temperature value of the first temperature sensor 31 is the highest and the temperature value of the second temperature sensor 34 is the lowest, then the temperature value of the temperature sensor 32 should be higher than the temperature value of the temperature sensor 33. If the preset order of magnitude is from largest to smallest, then... Figure 3 The target pre-embedded location points of the four temperature sensors are arranged in the following order: target pre-embedded location point of the first temperature sensor 31 > target pre-embedded location point of the temperature sensor 32 > target pre-embedded location point of the temperature sensor 33 > target pre-embedded location point of the second temperature sensor 34.

[0098] D3. Based on the above temperature value sequence and the above target pre-embedded location point sequence, determine the correspondence between each of the above target pre-embedded location points and each of the above wiring terminals.

[0099] In this embodiment, the correspondence between the terminals in the temperature value sequence and the target pre-embedded location points is determined according to the positional relationship in the temperature value sequence and the target pre-embedded location point sequence. For example, assuming the temperature value sequence is T1>T2>T3>T4, the terminals corresponding to these temperature values ​​are terminal 1, terminal 2, terminal 3, and terminal 4, respectively, and the target pre-embedded location point sequence is target pre-embedded location point 31>target pre-embedded location point 32>target pre-embedded location point 33>target pre-embedded location point 34, then terminal 1 corresponds to target pre-embedded location point 31, terminal 2 corresponds to target pre-embedded location point 32, and so on. Further details are omitted here.

[0100] Optionally, after determining the correspondence between each target pre-embedded location and each wiring terminal, a first wiring adjustment suggestion is generated.

[0101] The first wiring adjustment suggestion mentioned above may include: adjusting the current wiring terminal of the temperature sensor to be analyzed to its actual corresponding wiring terminal.

[0102] Because the temperature sensors in the same sensor group are close together, the temperature values ​​of these temperature sensors conform to the spatial continuity of objects. That is, the order of each terminal in the temperature value sequence corresponding to the temperature value output by the terminal should match the order of each target pre-embedded location point in the target pre-embedded location point sequence. Therefore, based on the temperature value sequence and the target pre-embedded location point sequence, the correspondence between each target pre-embedded location point and each terminal can be accurately determined.

[0103] In some embodiments, after C6 and determining that the temperature sensor to be analyzed has a group-to-group crosstalk error, the method further includes: E1. Obtain multiple temperature timing measurements of the target terminal block to obtain the first temperature value sequence.

[0104] In this embodiment, the corresponding terminal of the temperature sensor to be analyzed is located based on the pre-recorded correspondence between the terminal blocks and the embedded sensors. Specifically, temperature values ​​at different times (i.e., the aforementioned time-series temperature measurements) can be obtained from the target terminal blocks in chronological order. Since the temperature value at the same embedded location may differ over time, even under the same operating conditions, the target scenario corresponding to the same embedded location may also differ at different times. Therefore, obtaining the aforementioned multiple time-series temperature measurements is equivalent to obtaining multiple time-series temperature measurements under different target scenarios. The target scenario includes information such as operating conditions and / or temperature; when any piece of information differs, the corresponding target scenario also differs.

[0105] E2. Obtain the theoretical temperature time series value corresponding to each target pre-embedded location point to obtain multiple second temperature value sequences. The target pre-embedded location points are the pre-embedded location points in the containment where temperature sensors are pre-embedded. Each target pre-embedded location point corresponds to one of the second temperature value sequences.

[0106] In this embodiment, a target neural network model can be pre-trained. This model can output theoretical temperature time series values ​​corresponding to the pre-embedded location points based on the input scene information and these points. When it is necessary to obtain the theoretical temperature time series values ​​later, the target scene corresponding to the first temperature value sequence (such as the working condition and temperature value corresponding to each temperature time series measurement value in the first temperature value sequence) and the target pre-embedded location points can be used as input to the target neural network model. This will yield the temperature values ​​(i.e., the theoretical temperature time series values) output by the target neural network model corresponding to each target pre-embedded location point. Multiple theoretical temperature time series values ​​corresponding to each target pre-embedded location point constitute a second temperature value sequence. Of course, in practice, the second temperature value sequences corresponding to the target scene can also be determined based on the historical output of each target pre-embedded location point in different scenes; this is not limited here.

[0107] E3. Based on the first temperature value sequence and each of the second temperature value sequences, determine a matching sequence group, wherein the matching sequence group includes one of the first temperature value sequences and at least one of the second temperature value sequences.

[0108] In this embodiment, according to the acquisition time of the temperature time series measurements, the differences between each temperature time series measurement value in the first temperature value sequence and each temperature time series theoretical value in the second temperature value sequence are calculated to obtain the corresponding difference values. If the average of these differences is within a preset difference range, the first temperature value sequence and the second temperature value sequence are determined to be a matching sequence group. In this case, the sequence group includes one first temperature value sequence, but may include one or more second temperature value sequences. Optionally, the first temperature value sequence and the second temperature value sequence with the smallest average difference can also be determined to be a matching sequence group. In this case, the sequence group includes one first temperature value sequence and one second temperature value sequence.

[0109] Optionally, the matching sequence group can be determined by first determining the distribution trend of the first temperature value sequence and the distribution trends of each second temperature value sequence, and then comparing the distribution trend of the first temperature value sequence with the distribution trends of each second temperature value sequence. The distribution trend can be represented by one or more of the following: first derivative (or slope), area under the curve, fluctuation frequency, trend strength, periodicity, autocorrelation, etc. Specifically, when the distribution trend is represented by the first derivative, comparing the distribution trends of the first temperature value sequence and the second temperature value sequence is equivalent to comparing the first derivative of the first temperature value sequence and the first derivative of the second temperature value sequence. If the difference between the two is greater than a preset distribution trend difference threshold, then the distribution trend of the first temperature value sequence is determined to be different from the distribution trend of the second temperature value sequence.

[0110] E4. Based on the target pre-embedded location point corresponding to the second temperature value sequence in the above-matched sequence group, determine the actual pre-embedded location point corresponding to the target terminal block.

[0111] In this embodiment of the application, when there is only one second strain value sequence in the matched sequence group, the target pre-embedded position point corresponding to the second strain value sequence is taken as the actual pre-embedded position point corresponding to the current terminal of the strain gauge to be analyzed; when there is more than one second strain value sequence in the matched sequence group, the matching relationship between other parameter values ​​of the strain gauge to be analyzed and other parameter values ​​corresponding to the target pre-embedded position point can be further analyzed, so as to determine the correspondence between the current terminal of the strain gauge to be analyzed and the target pre-embedded position point based on the matching situation of other parameter values.

[0112] Optionally, if the number of second temperature value sequences in the matched sequence group is greater than 1, then E4 above determines the actual pre-buried location point corresponding to the target terminal block based on the target pre-buried location point corresponding to the second temperature value sequence in the matched sequence group, including: E41. Obtain the target parameter measurement value sequence corresponding to the temperature sensor to be analyzed above, and obtain the first target parameter measurement value sequence, wherein the target parameter is a non-temperature value parameter.

[0113] The aforementioned non-temperature parameters may include one or more of the following: strain value, pressure value, humidity value, etc. Of course, in practice, parameters from other types of sensors may also be included, which will not be listed here.

[0114] In this embodiment, a non-temperature type sensor belonging to the same sensor group as the temperature sensor to be analyzed can be first located. Then, multiple target parameter measurement values ​​of at least one non-temperature type sensor are obtained, and these target parameter measurement values ​​are used as the first target parameter measurement value sequence corresponding to the temperature sensor to be analyzed. For example, when the non-temperature type sensor is a pressure sensor, multiple pressure measurement values ​​of the pressure sensor are obtained to obtain the first pressure measurement value sequence.

[0115] E42. Obtain the target parameter measurement value sequence corresponding to each of the above-mentioned target pre-embedded location points in the above-mentioned matched sequence group to obtain multiple second target parameter measurement value sequences.

[0116] In this embodiment of the application, for each target pre-embedded location point, a sensor with the same sensor type as the sensor type corresponding to the first target parameter measurement value sequence is found around the target pre-embedded location point (e.g., the distance from the target pre-embedded location point is within a preset distance threshold). The target parameter measurement value sequence corresponding to the found sensor is used as the second target parameter measurement value sequence corresponding to the target pre-embedded location point.

[0117] E43. Based on the above-mentioned first target parameter measurement value sequence and each of the above-mentioned second target parameter measurement value sequences, determine the actual pre-embedded position point corresponding to the above-mentioned target terminal from the target pre-embedded position point corresponding to each of the above-mentioned second target parameter measurement value sequences.

[0118] In this embodiment of the application, when comparing whether the first target parameter measurement value sequence matches a second target parameter measurement value sequence, the matching can be done by subtraction or by distribution trend. The specific matching process is similar to the matching process of the first strain value sequence and the second strain value sequence described above, and will not be repeated here.

[0119] For example, suppose the matched sequence group includes a first temperature value sequence and two second temperature value sequences (let's say second temperature value sequence 1 and second temperature value sequence 2). The temperature sensor corresponding to the first temperature value sequence is the temperature sensor to be analyzed, the temperature sensor corresponding to second temperature value sequence 1 is temperature sensor 1, and the temperature sensor corresponding to second temperature value sequence 2 is temperature sensor 2. If a non-temperature sensor belonging to the same sensor group as the temperature sensor to be analyzed is selected as a strain gauge (let's say strain gauge 1), then the strain value sequence of strain gauge 1 is obtained to obtain the first target parameter measurement value sequence corresponding to the temperature sensor to be analyzed. Additionally, the strain value sequence of the strain gauge belonging to the same sensor group as temperature sensor 1 is obtained to obtain the second target parameter measurement value sequence 1 corresponding to temperature sensor 1, and the strain value sequence of the strain gauge belonging to the same sensor group as temperature sensor 2 is obtained to obtain the second target parameter measurement value sequence 2 corresponding to temperature sensor 2. Analyze the matching relationship between the first target parameter measurement value sequence and the second target parameter measurement value sequence 1 (e.g., by analyzing the distribution trend), and analyze the matching relationship between the first target parameter measurement value sequence and the second target parameter measurement value sequence 2. If the obtained matching relationship indicates that the first target parameter measurement value sequence and the second target parameter measurement value sequence 2 are more matched, then the terminal corresponding to the temperature sensor to be analyzed is determined as the terminal corresponding to the temperature sensor 2 (or the target pre-embedded location point of the temperature sensor 2).

[0120] Since temperature sensors and non-temperature sensors may have different measurement values ​​at the same monitoring point within the containment, combining the first target parameter measurement value sequence and the second target parameter measurement value sequence when determining the correspondence between the wiring terminal and the target pre-embedded location point is beneficial to improving the accuracy of the actual pre-embedded location point corresponding to the determined target wiring terminal.

[0121] Optionally, after determining the actual pre-embedded location point corresponding to the target terminal in E4 based on the target pre-embedded location point corresponding to the second temperature value sequence in the matched sequence group, the method may further include: E5. Generate second wiring adjustment suggestions.

[0122] The second wiring adjustment suggestion mentioned above includes: adjusting the target wiring terminal corresponding to the temperature sensor to be analyzed to the actual wiring terminal mentioned above.

[0123] In this embodiment of the application, considering that crosstalk errors between groups involve different sensor groups, when determining the actual wiring terminal of the temperature sensor to be analyzed, the first temperature value sequence of the target wiring terminal corresponding to the temperature sensor to be analyzed is compared with the second temperature value sequence corresponding to each target pre-embedded location point. This allows for the search of a second temperature value sequence that better matches the first temperature value sequence over a wider range, thereby enabling the determination of a more accurate actual wiring terminal.

[0124] It should be understood that the sequence number of each step in the above embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0125] Corresponding to the fault analysis method for the temperature sensor described in the above embodiments, Figure 4 This diagram illustrates a structural block diagram of a temperature sensor fault analysis device provided in an embodiment of this application. For ease of explanation, only the parts relevant to the embodiment of this application are shown.

[0126] Reference Figure 4 The fault analysis device 4 for this temperature sensor is applied to electronic equipment and includes: a module 41 for acquiring the temperature value to be analyzed, a module 42 for acquiring the reference temperature value, and a module 43 for judging suspected wiring errors. Wherein: The temperature value acquisition module 41 is used to acquire the temperature value of the temperature sensor to be analyzed within a first preset time period to obtain multiple temperature values ​​to be analyzed. The temperature sensor to be analyzed is a temperature sensor pre-embedded in the containment.

[0127] The reference temperature value acquisition module 42 is used to acquire the temperature values ​​of sensors belonging to the same sensor group as the temperature sensor to be analyzed within the first preset time period, and obtain multiple reference temperature values, wherein the difference between the temperature values ​​of the various sensors in the same sensor group is less than a preset first difference threshold.

[0128] The wiring error suspected detection module 43 is used to determine that the temperature sensor to be analyzed is suspected of having a wiring error if the difference between the temperature value to be analyzed and the reference temperature value is greater than a second difference threshold, and the distribution trend of the multiple temperature values ​​to be analyzed is different from the distribution trend of the multiple reference temperature values. The second difference threshold is greater than or equal to the first difference threshold.

[0129] In this embodiment, since the temperature differences among the sensors within the same sensor group are less than a preset first difference threshold, while the second difference threshold is greater than or equal to the first difference threshold, when it is determined that the difference between the temperature value to be analyzed and the reference temperature value is greater than the second difference threshold, it indicates that the difference between the temperature value to be analyzed and the reference temperature value must be greater than the first difference threshold. In this case, the temperature sensor to be analyzed may have its own fault, environmental common-mode interference, or wiring error. Based on this, distribution trend comparison is further introduced as an auxiliary judgment condition: when there is its own fault or environmental common-mode interference, the temperature value to be analyzed and the reference temperature value are usually still constrained by the same physical environment or the same signal link characteristics, and their change pattern (i.e., distribution trend) is usually consistent, only showing an overall numerical shift or amplitude scaling; however, when there is a wiring error, the actual signal source connected to the temperature sensor to be analyzed has changed, and its temperature change pattern deviates fundamentally from the real physical environment pattern reflected by the reference sensor in the group, resulting in the distribution trend of multiple temperature values ​​to be analyzed being different from the distribution trend of multiple reference temperature values. Therefore, by superimposing the dual conditions of "numerical difference greater than the second difference threshold" and "different distribution trend," single numerical deviations caused by their own faults or environmental common-mode interference can be effectively eliminated, thereby significantly improving the accuracy of judging whether the temperature sensor under analysis has a suspected wiring error. Furthermore, since the fault analysis method for the temperature sensor provided in this application embodiment does not require manual comparison of each sensor, it is beneficial to improve troubleshooting efficiency.

[0130] Optionally, the sensors belonging to the same sensor group as the temperature sensor to be analyzed include strain gauges. The temperature sensor fault analysis device 4 provided in this application embodiment further includes: The first strain measurement value acquisition module is used to acquire multiple first strain measurement values ​​of the strain gauge within a second preset time period after determining that the temperature sensor to be analyzed is suspected of having a wiring error. The difference between the second preset time period and 24 hours is within the preset time period difference range.

[0131] The first strain value adjustment module is used to adjust the first strain value according to the temperature value corresponding to the strain gauge and the temperature value of the environment where the strain gauge is located for any one of the plurality of first strain values, wherein the temperature value corresponding to the strain gauge and / or the temperature value of the environment where the strain gauge is located are represented by the temperature value measured by the temperature sensor to be analyzed.

[0132] The strain difference determination module is used to determine the strain difference based on multiple adjusted first measured strain values.

[0133] The first wiring error determination module is used to determine that the temperature sensor to be analyzed has a wiring error if the strain difference is greater than a preset first strain difference threshold.

[0134] Optionally, the sensors belonging to the same sensor group as the temperature sensor to be analyzed include strain gauges. The temperature sensor fault analysis device 4 provided in this application embodiment further includes: The second strain measurement module is used to acquire the load on the containment vessel and the second strain measurement value of the strain gauge after determining that the temperature sensor to be analyzed is suspected of having a wiring error and after conducting an overall pressure test on the containment vessel.

[0135] The theoretical strain value acquisition module is used to determine the theoretical strain value corresponding to the load of the containment vessel based on the correspondence between the load and the theoretical strain value. The correspondence between the load and the theoretical strain value is used to record the theoretical strain values ​​of the strain gauge under different loads of the overall pressure test after the containment vessel is subjected to an overall pressure test.

[0136] The second strain value adjustment module is used to adjust the second strain value according to the temperature value corresponding to the strain gauge and the temperature value of the environment where the strain gauge is located, so as to obtain the actual strain value of the strain gauge. The temperature value corresponding to the strain gauge and / or the temperature value of the environment where the strain gauge is located are represented by the temperature value measured by the temperature sensor to be analyzed.

[0137] The second wiring error determination module is used to determine that the temperature sensor to be analyzed has a wiring error if the absolute value of the difference between the actual strain value and the theoretical strain value of the strain gauge is greater than a preset second strain difference threshold.

[0138] Optionally, the temperature sensor fault analysis device 4 provided in this application embodiment further includes: The first temperature value acquisition module is used to acquire the temperature value of the first temperature sensor after determining that there is a wiring error in the temperature sensor to be analyzed, and obtain the first temperature value, wherein the first temperature sensor is temporarily installed on the inner surface of the suspected pre-embedded location point corresponding to the temperature sensor to be analyzed.

[0139] The second temperature value acquisition module is used to acquire the temperature value of the second temperature sensor to obtain the second temperature value, wherein the second temperature sensor is temporarily installed on the outer surface of the suspected pre-embedded location point.

[0140] The module for obtaining the temperature value to be matched is used to obtain the temperature value output by the target terminal to obtain the temperature value to be matched. The target terminal is the terminal corresponding to the temperature sensor to be analyzed.

[0141] The temperature gradient curve determination module is used to determine the temperature gradient curve based on the first temperature value, the second temperature value, and the thickness of the containment vessel.

[0142] The module for determining wiring sequence errors within a group is used to determine that the temperature sensor to be analyzed has an internal wiring sequence error if the minimum deviation between the temperature value to be matched and the temperature gradient curve is less than a preset deviation threshold.

[0143] The group-to-group crosstalk error determination module is used to determine that the temperature sensor to be analyzed has a group-to-group crosstalk error if the minimum deviation between the temperature value to be matched and the temperature gradient curve is not less than the deviation threshold.

[0144] Optionally, the temperature sensor fault analysis device 4 provided in this application embodiment further includes: The temperature value sequence acquisition module is used to acquire the temperature values ​​output from the terminals of each temperature sensor in the sensor group where the temperature sensor to be analyzed is located, and arrange them according to a preset size order to obtain the temperature value sequence.

[0145] The target pre-embedded location point sequence determination module is used to sort the target pre-embedded location points according to the theoretical size relationship of the temperature values ​​corresponding to each target pre-embedded location point and according to the preset size arrangement order to obtain the target pre-embedded location point sequence. The target pre-embedded location point is the pre-embedded location point of a temperature sensor in the sensor group where the temperature sensor to be analyzed is located.

[0146] The module for determining the correspondence between location points and terminals is used to determine the correspondence between each of the aforementioned target pre-embedded location points and each of the aforementioned terminals based on the aforementioned temperature value sequence and the aforementioned target pre-embedded location point sequence.

[0147] Optionally, the temperature sensor fault analysis device 4 provided in this application embodiment further includes: The first temperature value sequence determination module is used to obtain the first temperature value sequence by acquiring multiple temperature timing measurements of the target terminal after determining that there is a crosstalk error in the group connection of the temperature sensor to be analyzed.

[0148] The second temperature value sequence determination module is used to obtain the theoretical temperature time series values ​​corresponding to each target pre-embedded location point, and obtain multiple second temperature value sequences. The target pre-embedded location points are the pre-embedded location points in the containment where temperature sensors are pre-embedded. Each target pre-embedded location point corresponds to one of the second temperature value sequences.

[0149] The matching sequence group determination module is used to determine a matching sequence group based on the first temperature value sequence and each of the second temperature value sequences, wherein the matching sequence group includes one of the first temperature value sequences and at least one of the second temperature value sequences.

[0150] The actual pre-embedded location point determination module is used to determine the actual pre-embedded location point corresponding to the target terminal according to the target pre-embedded location point corresponding to the second temperature value sequence in the matched sequence group.

[0151] Optionally, in the aforementioned matched sequence group, the number of the second temperature value sequences is greater than 1, and the aforementioned actual pre-embedded location point determination module includes: The first target parameter measurement value sequence acquisition unit is used to acquire the target parameter measurement value sequence corresponding to the temperature sensor to be analyzed, and obtain the first target parameter measurement value sequence, wherein the target parameter is a non-temperature value parameter.

[0152] The second target parameter measurement value sequence acquisition unit is used to acquire the target parameter measurement value sequence corresponding to each of the above-mentioned target pre-embedded position points in the above-mentioned matched sequence group, and obtain multiple second target parameter measurement value sequences.

[0153] The actual pre-embedded location point determination unit is used to determine the actual pre-embedded location point corresponding to the target terminal from the target pre-embedded location point corresponding to each of the first target parameter measurement value sequences and each of the second target parameter measurement value sequences.

[0154] It should be noted that the information interaction and execution process between the above-mentioned devices / units are based on the same concept as the method embodiments of this application. For details on their specific functions and technical effects, please refer to the method embodiments section, and they will not be repeated here.

[0155] Figure 5 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Figure 5 As shown, the electronic device 5 of this embodiment includes: at least one processor 50 ( Figure 5 The diagram shows only one processor, memory 51, and computer program 52 stored in the memory 51 and executable on at least one processor 50. When the processor 50 executes the computer program 52, it implements the steps in any of the above method embodiments.

[0156] The aforementioned electronic device 5 can be a desktop computer, laptop, handheld computer, or cloud server, etc. This electronic device may include, but is not limited to, a processor 50 and a memory 51. Those skilled in the art will understand that... Figure 5 This is merely an example of electronic device 5 and does not constitute a limitation on electronic device 5. It may include more or fewer components than shown in the figure, or combine certain components, or different components. For example, it may also include input / output devices, network access devices, etc.

[0157] The processor 50 may be a Central Processing Unit (CPU), or it may be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor.

[0158] In some embodiments, the aforementioned memory 51 may be an internal storage unit of the electronic device 5, such as a hard disk or memory of the electronic device 5. In other embodiments, the aforementioned memory 51 may be an external storage device of the electronic device 5, such as a plug-in hard disk, smart media card (SMC), secure digital (SD) card, flash card, etc., equipped on the electronic device 5. Furthermore, the aforementioned memory 51 may include both internal storage units and external storage devices of the electronic device 5. The aforementioned memory 51 is used to store operating systems, applications, bootloaders, data, and other programs, such as the program code of the aforementioned computer programs. The aforementioned memory 51 may also be used to temporarily store data that has been output or will be output.

[0159] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the above device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above system can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0160] This application also provides a computer-readable storage medium storing a computer program that, when executed by a processor, can implement the steps in the above-described method embodiments.

[0161] This application provides a computer program product that, when run on an electronic device, enables the electronic device to implement the steps described in the various method embodiments above.

[0162] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments of this application can be implemented by a computer program instructing related hardware. The computer program can be stored in a computer-readable storage medium, and when executed by a processor, it can implement the steps of the various method embodiments described above. The computer program includes computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. The computer-readable medium can include at least: any entity or device capable of carrying computer program code to a photographic device / electronic device, a recording medium, a computer memory, a read-only memory (ROM), a random access memory (RAM), an electrical carrier signal, a telecommunication signal, and a software distribution medium. Examples include USB flash drives, portable hard drives, magnetic disks, or optical disks. In some jurisdictions, according to legislation and patent practice, computer-readable media cannot be electrical carrier signals or telecommunication signals.

[0163] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0164] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0165] In the embodiments provided in this application, it should be understood that the disclosed apparatus / network devices and methods can be implemented in other ways. For example, the apparatus / network device embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between devices or units may be electrical, mechanical, or other forms.

[0166] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

Claims

1. A fault analysis method for a temperature sensor, characterized in that, include: Within a first preset time period, the temperature value of the temperature sensor to be analyzed is collected to obtain multiple temperature values ​​to be analyzed. The temperature sensor to be analyzed is a temperature sensor pre-embedded in the containment. Within the first preset time period, the temperature values ​​of sensors belonging to the same sensor group as the temperature sensor to be analyzed are collected to obtain multiple reference temperature values, wherein the difference between the temperature values ​​of each sensor in the same sensor group is less than a preset first difference threshold. If the difference between the temperature value to be analyzed and the reference temperature value is greater than a second difference threshold, and the distribution trend of the multiple temperature values ​​to be analyzed is different from the distribution trend of the multiple reference temperature values, then it is determined that the temperature sensor to be analyzed is suspected of having a wiring error, wherein the second difference threshold is greater than or equal to the first difference threshold.

2. The fault analysis method for a temperature sensor as described in claim 1, characterized in that, Sensors belonging to the same sensor group as the temperature sensor to be analyzed include strain gauges. After determining that the temperature sensor to be analyzed is suspected of having a wiring error, the group further includes: Obtain multiple first measured strain values ​​of the strain gauge within a second preset time period, wherein the difference between the second preset time period and 24 hours is within the preset time period difference range; For any one of the multiple first measured strain values, the first measured strain value is adjusted according to the temperature value corresponding to the strain gauge and the temperature value of the environment where the strain gauge is located, wherein the temperature value corresponding to the strain gauge and / or the temperature value of the environment where the strain gauge is located are represented by the temperature value measured by the temperature sensor to be analyzed; Based on multiple adjusted first measured strain values, the strain difference is determined; If the strain difference is greater than a preset first strain difference threshold, it is determined that the temperature sensor to be analyzed has a wiring error.

3. The fault analysis method for a temperature sensor as described in claim 1, characterized in that, Sensors belonging to the same sensor group as the temperature sensor to be analyzed include strain gauges. After determining that the temperature sensor to be analyzed is suspected of having a wiring error, the group further includes: After conducting an overall pressure test on the containment vessel, the load on the containment vessel and the second measured strain value of the strain gauge are obtained; Based on the correspondence between load and theoretical strain value, the theoretical strain value of the strain gauge corresponding to the load on the containment is determined. The correspondence between load and theoretical strain value is used to record the theoretical strain value of the strain gauge under different loads of the overall pressure test after the containment is subjected to an overall pressure test. The second measured strain value is adjusted according to the temperature value corresponding to the strain gauge and the temperature value of the environment where the strain gauge is located to obtain the actual strain value of the strain gauge, wherein the temperature value corresponding to the strain gauge and / or the temperature value of the environment where the strain gauge is located are represented by the temperature value measured by the temperature sensor to be analyzed; If the absolute value of the difference between the actual strain value and the theoretical strain value of the strain gauge is greater than the preset second strain difference threshold, then it is determined that the temperature sensor to be analyzed has a wiring error.

4. The fault analysis method for a temperature sensor as described in claim 2 or 3, characterized in that, After determining that the temperature sensor to be analyzed has a wiring error, the method further includes: The temperature value of the first temperature sensor is obtained to obtain the first temperature value, wherein the first temperature sensor is temporarily installed on the inner surface of the suspected pre-embedded location point corresponding to the temperature sensor to be analyzed. The temperature value of the second temperature sensor is obtained to obtain the second temperature value, wherein the second temperature sensor is temporarily installed on the outer surface of the suspected pre-embedded location point; Obtain the temperature value output from the target terminal to obtain the temperature value to be matched, wherein the target terminal is the terminal currently corresponding to the temperature sensor to be analyzed; A temperature gradient curve is determined based on the first temperature value, the second temperature value, and the thickness of the containment vessel; If the minimum deviation between the temperature value to be matched and the temperature gradient curve is less than a preset deviation threshold, it is determined that the temperature sensor to be analyzed has an incorrect wiring sequence within the group. If the minimum deviation between the temperature value to be matched and the temperature gradient curve is not less than the deviation threshold, then it is determined that the temperature sensor to be analyzed has a group-to-group crosstalk error.

5. The fault analysis method for a temperature sensor as described in claim 4, characterized in that, After determining that the temperature sensor to be analyzed has an incorrect wiring sequence within the group, the method further includes: The temperature values ​​output from the terminals of each temperature sensor in the sensor group containing the temperature sensor to be analyzed are obtained and arranged in a preset order of magnitude to obtain a temperature value sequence. Based on the theoretical relationship of the temperature values ​​corresponding to each target pre-embedded location point, the target pre-embedded location points are sorted according to the preset size arrangement order to obtain a target pre-embedded location point sequence, wherein the target pre-embedded location point is the pre-embedded location point of a temperature sensor in the sensor group where the temperature sensor to be analyzed is located. Based on the temperature value sequence and the target pre-embedded location point sequence, the correspondence between each target pre-embedded location point and each wiring terminal is determined.

6. The fault analysis method for a temperature sensor as described in claim 4, characterized in that, After determining that the temperature sensor to be analyzed has a group-to-group crosstalk error, the method further includes: Obtain the first temperature value sequence by acquiring multiple temperature timing measurements of the target terminal; The theoretical temperature time series values ​​corresponding to each target pre-embedded location point are obtained to obtain multiple second temperature value sequences. The target pre-embedded location point is the pre-embedded location point in the containment where a temperature sensor is pre-embedded. Each target pre-embedded location point corresponds to one second temperature value sequence. Based on the first temperature value sequence and each of the second temperature value sequences, a matching sequence group is determined, wherein the matching sequence group includes one first temperature value sequence and at least one second temperature value sequence; Based on the target pre-embedded location point corresponding to the second temperature value sequence in the matched sequence group, determine the actual pre-embedded location point sequence group corresponding to the target terminal.

7. The fault analysis method for a temperature sensor as described in claim 6, characterized in that, In the matched sequence group, the number of second temperature value sequences is greater than 1. Determining the actual pre-buried location point corresponding to the target terminal block based on the target pre-buried location point corresponding to the second temperature value sequence in the matched sequence group includes: Obtain the target parameter measurement value sequence corresponding to the temperature sensor to be analyzed to obtain the first target parameter measurement value sequence, wherein the target parameter is a non-temperature value parameter; Obtain the target parameter measurement value sequence corresponding to each target pre-embedded location point in the matched sequence group to obtain multiple second target parameter measurement value sequences; Based on the first target parameter measurement value sequence and each of the second target parameter measurement value sequences, the actual pre-embedded position point corresponding to the target terminal is determined from the target pre-embedded position point corresponding to each of the second target parameter measurement value sequences.

8. A fault analysis device for a temperature sensor, characterized in that, include: The module for acquiring temperature values ​​to be analyzed is used to collect temperature values ​​from the temperature sensor to be analyzed within a first preset time period to obtain multiple temperature values ​​to be analyzed. The temperature sensor to be analyzed is a temperature sensor pre-embedded in the containment. The reference temperature value acquisition module is used to collect the temperature values ​​of sensors belonging to the same sensor group as the temperature sensor to be analyzed within the first preset time period, and obtain multiple reference temperature values, wherein the difference between the temperature values ​​of the various sensors in the same sensor group is less than a preset first difference threshold. A wiring error suspected detection module is used to determine that the temperature sensor to be analyzed is suspected of having a wiring error if the difference between the temperature value to be analyzed and the reference temperature value is greater than a second difference threshold, and the distribution trend of multiple temperature values ​​to be analyzed is different from the distribution trend of multiple reference temperature values. The second difference threshold is greater than or equal to the first difference threshold.

9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the method as described in any one of claims 1 to 7.

10. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by a processor, it implements the method as described in any one of claims 1 to 7.

11. A computer program product, characterized in that, Includes a computer program, which, when executed, causes the electronic device to perform the method according to any one of claims 1 to 7.

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