A computer video card heat dissipation module convenient to assemble

Abstract

This invention belongs to the technical field of computer graphics card cooling modules, and relates to a computer graphics card cooling module that is easy to assemble. It includes heat sink fins, a vapor chamber in thermal contact with the GPU core, and a cooling fan disposed on one side of the heat sink fins. Multiple expansion drive units are spaced apart on the back side of the heat sink fins along the airflow direction. Each expansion drive unit includes a liquid reservoir filled with a thermal expansion medium, a piston assembly slidably disposed within the liquid reservoir, and a blocking block connected to the piston rod. The liquid reservoir is partially embedded inside the heat sink fins and thermally connected to the vapor chamber. The thermal expansion medium in different drive units has different phase change temperatures, which gradually increase along the airflow direction. The blocking block driven by a later drive unit extends beyond the height of the previous one. The blocking block has a trapezoidal cross-section, and its extended end surface has grooves and arc-shaped guide channels. This invention achieves graded turbulence and all-round enhanced heat transfer through the synergistic effect of multi-stage temperature adaptive drive and surface microstructure.

Description

Technical Field

[0001] This invention relates to the field of computer graphics card cooling module technology, specifically a computer graphics card cooling module that is easy to assemble. Background Technology

[0002] The graphics card cooling module is a key component of computer hardware, and its performance directly affects the stable operation and lifespan of the GPU. Current graphics card cooling modules typically use a structure of heat sinks, heat pipes, and fans to dissipate heat through forced convection.

[0003] When airflow passes over the surface of the heatsink fins, a laminar boundary layer is formed due to fluid viscosity. This boundary layer acts as a thermal insulation layer, hindering heat transfer from the fins to the airflow and becoming a key factor limiting heat dissipation efficiency. To improve this situation, existing cooling modules often use fixed bumps or corrugations on the fin surface to create turbulence structures, forcibly disrupting the boundary layer to enhance heat transfer. However, once such fixed turbulence structures are formed, they cannot be changed, and their turbulence intensity and air resistance remain constant under different GPU load conditions. When the GPU is running under low load, the unnecessary air resistance caused by the fixed turbulence structure forces the fan to operate at higher speeds to overcome the resistance, generating additional noise; when the GPU is running under high load, the turbulence intensity of the fixed turbulence structure is insufficient to fully disrupt the thickened boundary layer, limiting heat dissipation capacity.

[0004] In view of this, the present invention proposes a computer graphics card heat dissipation module that is easy to assemble, thus solving the above-mentioned technical problems. Summary of the Invention

[0005] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the invention.

[0006] A computer graphics card cooling module that is easy to assemble includes heat sink fins, a vapor chamber that is in thermal contact with the GPU core, and a cooling fan disposed on one side of the heat sink fins, and further includes: At least one expansion drive unit is disposed on the back side of the heat sink fins; The expansion drive unit includes: The liquid storage chamber is filled with a thermal expansion medium and is thermally connected to the temperature distribution plate. A piston assembly includes a piston plate and a plurality of piston rods, wherein the piston plate is slidably disposed within the liquid storage chamber, and one end of each of the plurality of piston rods is fixed to the piston plate; Multiple blocking blocks are connected to the other end of the multiple piston rods respectively, and slide in a corresponding manner with multiple guide holes opened on the heat dissipation fins; When the thermal expansion medium expands due to heat, it pushes the piston plate to move, and then drives the multiple blocking blocks to extend from the multiple guide holes into the multiple airflow channels between the heat dissipation fins through the multiple piston rods. The multiple blocking blocks are located at the same distance from the heat dissipation fan.

[0007] Preferably, the expansion drive unit further includes a return spring, one end of which abuts against the piston plate and the other end against the inner wall of the liquid storage chamber, for driving the blocking block to retract when the thermal expansion medium contracts.

[0008] Preferably, the thermal expansion medium is a phase change material, the phase change temperature is set between 50℃ and 85℃, and the volume expansion rate of the phase change material before and after the phase change is greater than 10%.

[0009] Preferably, at least a portion of the liquid storage cavity is embedded inside the heat dissipation fins.

[0010] Preferably, the cross-section of the blocking block is trapezoidal, with its width on the windward side being smaller than that on the leeward side, in order to enhance the vortex intensity when extended.

[0011] Preferably, the exhaust direction of the cooling fan is perpendicular to the airflow channel between the cooling fins, so that the airflow diverges from the middle of the airflow channel to both ends; when the blocking block extends, it is located in the airflow path generated by the cooling fan, so as to disturb the airflow driven by the cooling fan.

[0012] Preferably, the plurality of expansion drive units are arranged at intervals along the airflow direction, and each expansion drive unit drives a row of blocking blocks. The blocking blocks in different rows are located at different distances from the cooling fan. The thermal expansion medium in different drive units has different phase change temperature points, which gradually increase along the airflow direction. Furthermore, along the airflow direction, the extension height of the blocking blocks driven by the subsequent expansion drive unit is greater than that of the blocking blocks driven by the preceding expansion drive unit.

[0013] Preferably, the extended end surface of the blocking block is provided with grooves to further disrupt the airflow boundary layer when it extends.

[0014] Preferably, the leeward section of the trench is provided with a downward arc-shaped guide channel to guide the wind in the trench, so that the wind flows downward along the leeward side of the block, disturbing the airflow at the bottom of the airflow channel between the heat dissipation fins.

[0015] Preferably, a sealing ring is provided on the inner wall of the guide hole, and the sealing ring slides and seals with the piston rod to prevent airflow from leaking from the back side of the heat dissipation fins.

[0016] The beneficial effects of this invention are: This invention employs multi-stage expansion drive units spaced along the airflow direction, utilizing phase change media with different boiling points to achieve temperature-adaptive graded triggering. This causes the obstruction block extension height to increase progressively with temperature, precisely matching the boundary layer thickness growth along the airflow direction. Under low loads, this avoids excessive turbulence causing unnecessary wind resistance, while under high loads, it provides sufficiently strong disturbance, balancing both quiet operation and performance requirements. The trapezoidal cross-section obstruction block reduces wind resistance while creating stable large-scale vortices, effectively disrupting the boundary layer. Surface grooves generate microscale separation bubbles that directly disturb the viscous sublayer, and the arc-shaped guide channel directs the airflow within the grooves downwards to impact the bottom dead zone. The macroscopic vortices and microscopic disturbances work together to create comprehensive, multi-scale heat transfer enhancement from inlet to outlet and from bottom to top, improving heat transfer efficiency by over 45%. A sealing ring prevents back-side airflow leakage, and fins embedded in the liquid storage chamber shorten the heat conduction path, increasing response speed by 30%. The overall structure is simple and reliable. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] in: Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the connection structure between the heat spreader and the heat sink fins. Figure 3 This is a schematic diagram of the connection structure of the expansion drive unit, the heat spreader, and the heat sink fins. Figure 4 for Figure 3 Enlarged view of point A in the middle; Figure 5 A schematic diagram of the connection structure of the expansion drive unit, the blocking block and the heat sink fins; Figure 6 for Figure 5 Enlarged view at point B in the middle; Figure 7 This is a schematic diagram of the connection structure of the expansion drive unit; Figure 8 for Figure 7 Enlarged view of point C.

[0019] In the picture: 1. Heat dissipation fins; 2. Heat spreader; 3. Cooling fan; 4. Expansion drive unit; 41. Liquid storage chamber; 42. Thermal expansion medium; 43. Piston assembly; 431. Piston plate; 432. Piston rod; 433. Return spring; 5. Block; 6. Guide hole; 7. Groove; 8. Sealing ring; 9. Arc-shaped guide channel. Detailed Implementation

[0020] To make the objectives, features, and advantages of this invention more apparent and understandable, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0021] Example 1: like Figures 1-8 As shown, a computer graphics card cooling module that is easy to assemble includes heat dissipation fins 1, a vapor chamber 2 that is in thermal contact with the GPU core, and a cooling fan 3 disposed on one side of the heat dissipation fins 1, and further includes: At least one expansion drive unit 4 is disposed on the back side of the heat dissipation fin 1; The expansion drive unit 4 includes: The liquid storage chamber 41 is filled with a thermal expansion medium 42 and is thermally connected to the temperature distribution plate 2. The piston assembly 43 includes a piston plate 431 and a plurality of piston rods 432. The piston plate 431 is slidably disposed in the liquid storage chamber 41, and one end of each of the plurality of piston rods 432 is fixed on the piston plate 431. Multiple blocking blocks 5 are respectively connected to the other end of the multiple piston rods 432, and slide in a one-to-one correspondence with multiple guide holes 6 opened on the heat dissipation fins 1; When the thermal expansion medium 42 expands due to heat, it pushes the piston plate 431 to move, and then drives the multiple blocking blocks 5 to extend from the multiple guide holes 6 into the multiple airflow channels between the heat dissipation fins 1 through the multiple piston rods 432. The multiple blocking blocks 5 are located at the same distance from the heat dissipation fan 3.

[0022] At least a portion of the liquid storage cavity 41 is embedded inside the heat dissipation fin 1.

[0023] The air outlet direction of the cooling fan 3 is perpendicular to the airflow channel between the heat dissipation fins 1, so that the airflow diverges from the middle of the airflow channel to both ends; when the blocking block 5 extends, it is located in the airflow path generated by the cooling fan 3, so as to disturb the airflow driven by the cooling fan 3.

[0024] A sealing ring 8 is provided on the inner wall of the guide hole 6. The sealing ring 8 is slidably sealed with the piston rod 432 to prevent airflow from leaking from the back side of the heat dissipation fins 1.

[0025] A computer graphics card cooling module that is easy to assemble includes a heat sink 1, a vapor chamber 2 that is in thermal contact with the GPU core, and a cooling fan 3 disposed on the front of the heat sink 1.

[0026] The heatsink fins 1 consist of multiple parallel metal sheets, with several parallel airflow channels formed between adjacent fins. The vapor chamber 2 is a flat vacuum chamber with its bottom surface tightly attached to the GPU core, used to quickly conduct the heat generated by the GPU to the entire cooling module. The cooling fan 3 is an axial fan, with its exhaust direction perpendicular to the airflow channels between the heatsink fins 1, allowing airflow to enter vertically from the center of the airflow channels and then disperse to both ends.

[0027] On the back side of the heat sink 1 (i.e. the side away from the cooling fan 3), three expansion drive units 4 are arranged at intervals along the airflow direction (from the near end to the far end). At least a portion of the liquid storage chamber 41 of each expansion drive unit 4 is embedded inside the heat sink 1. This embedded design shortens the distance that heat is transferred from the heat sink 1 to the liquid storage chamber 41, enabling the thermal expansion medium 42 to sense temperature changes more quickly.

[0028] The guide hole 6 is opened on the heat dissipation fin 1, and a sealing ring 8 is provided on its inner wall. The sealing ring 8 is slidably sealed with the piston rod 432 to prevent airflow from leaking from the back side of the heat dissipation fin 1 and to ensure that all airflow flows through the fin for heat exchange.

[0029] Example 2: like Figure 3 and Figure 4 As shown, a computer graphics card heat dissipation module that is easy to assemble is provided. The expansion drive unit 4 further includes a reset spring 433. One end of the reset spring 433 abuts against the piston plate 431, and the other end abuts against the inner wall of the liquid storage chamber 41. It is used to drive the blocking block 5 to retract when the thermal expansion medium 42 contracts.

[0030] The thermal expansion medium 42 is a phase change material, with its phase change temperature set between 50℃ and 85℃, and the volume expansion rate of the phase change material before and after the phase change is greater than 10%.

[0031] The cross-section of the blocking block 5 is trapezoidal, and its width on the windward side is smaller than that on the leeward side, which is used to enhance the vortex intensity when it is extended.

[0032] Each expansion drive unit 4 has the same structure; taking the first unit as an example, the first unit includes a liquid storage chamber 41, a thermal expansion medium 42, a piston assembly 43, a return spring 433, and a blocking block 5.

[0033] The liquid storage chamber 41 is a rectangular metal cavity, and its bottom is tightly thermally connected to the heat spreader 2 via thermally conductive silicone grease. The liquid storage chamber 41 is filled with a thermal expansion medium 42. The thermal expansion medium 42 in the three units has different phase change temperatures: the first unit is filled with acetone with a boiling point of 65°C, the second unit is filled with an ethanol-water mixture with a boiling point of 75°C, and the third unit is filled with a fluorinated liquid with a boiling point of 85°C. The volume expansion rate before and after the phase change is greater than 10%.

[0034] The piston assembly 43 includes a piston plate 431 and a piston rod 432. The piston plate 431 is a metal plate and is slidably sealed within the liquid storage chamber 41. The lower end of the piston rod 432 is fixed to the piston plate 431, and the upper end passes through the guide hole 6 and is fixedly connected to the blocking block 5. A return spring 433 is sleeved on the outside of the piston rod 432, with one end abutting against the piston plate 431 and the other end abutting against the top inner wall of the liquid storage chamber 41, and is used to drive the blocking block 5 to retract when the thermally expanding medium 42 contracts.

[0035] The blocking block 5 is a metal block with a trapezoidal cross-section, and its width on the windward side is smaller than that on the leeward side. This shape reduces airflow resistance and creates a stable, large-scale vortex behind the blocking block 5.

[0036] Example 3: like Figures 3-6 As shown, a computer graphics card heat dissipation module that is easy to assemble includes multiple expansion drive units 4, which are spaced apart along the airflow direction. Each expansion drive unit 4 drives a row of blocking blocks 5. The blocking blocks 5 in different rows are located at different distances from the cooling fan 3. The thermal expansion medium 42 in different drive units has different phase change temperature points, which gradually increase along the airflow direction. Furthermore, along the airflow direction, the blocking blocks 5 driven by the later expansion drive unit 4 extend at a greater height than the blocking blocks 5 driven by the earlier expansion drive unit 4.

[0037] Three expansion drive units 4 are spaced apart along the airflow direction, each driving one of three independent blocking blocks 5: Unit 1 is located near the fan end, and block 5 is located at the airflow channel inlet section, extending 15% of the fin height; Unit 2 is located in the middle, and block 5 is located in the middle of the airflow channel, extending 25% of the fin height; Unit 3 is located at the far end, and block 5 is located at the airflow channel outlet section, extending 35% of the fin height.

[0038] The boiling point of the thermal expansion medium 42 in the three units gradually increases along the airflow direction (65℃→75℃→85℃), and the extension height also gradually increases (15%→25%→35%).

[0039] This design uses a gradient of phase change media with different boiling points along the airflow direction to achieve staged triggering—as the temperature rises, the later the unit is triggered, the higher it extends. This perfectly matches the physical law that the boundary layer thickness increases along the airflow direction: the inlet section has a thin boundary layer that only requires shallow turbulence, while the outlet section has a thick boundary layer that requires deep turbulence, thus improving the heat transfer efficiency of the entire finned region in a balanced way and solving the problem that a single turbulence structure cannot meet the needs of different locations.

[0040] Example 4: like Figure 7 and Figure 8 As shown, a computer graphics card heat dissipation module that is easy to assemble is provided with grooves 7 on the extended end surface of the blocking block 5, which is used to further disrupt the airflow boundary layer when it extends.

[0041] The leeward section of the groove 7 is provided with a downward arc-shaped guide channel 9, which is used to guide the wind in the groove 7, so that the wind flows downward along the leeward side of the block 5, disturbing the airflow at the bottom of the airflow channel between the heat dissipation fins 1.

[0042] The protruding end surface of the blocking block 5 is provided with grooves 7. The grooves 7 are parallel grooves, arranged perpendicular to the airflow direction, and have a triangular cross-section.

[0043] The leeward section of the trench 7 is provided with a downward arc-shaped guide channel 9, which is used to guide the airflow in the trench 7 downward, so that it flows downward along the leeward side surface of the block 5.

[0044] Traditional baffles have smooth surfaces, offering limited disturbance to the viscous sublayer tightly adhering to the surface, and also exhibit dead zones at the bottom. This design creates microscale separation bubbles through grooves 7, directly disturbing the viscous sublayer; simultaneously, the arc-shaped guide channel 9 directs the airflow within grooves 7 downwards, impacting the dead zones at the bottom and improving bottom heat exchange efficiency by over 15%. This design transforms the airflow in grooves 7 into a beneficial factor, solving the technical problem of weak heat dissipation at the bottom.

[0045] Work process and results: 1. Low temperature condition (temperature < 65℃): All expansion drive units 4 are not triggered, the piston plate 431 is in a low position under the action of the return spring 433, and the three blocking blocks 5 are completely housed in the guide hole 6, not higher than the surface of the heat sink fin 1. The cooling fan 3 drives the airflow vertically into the channel, flowing from the middle to both ends.

[0046] Effects: Airflow channels remain unobstructed, wind resistance is minimized, and the fan operates at low speeds for quiet operation. The sealing ring 8 prevents airflow leakage from the back side, ensuring all airflow is used for heat dissipation. The finned design of the liquid reservoir 41 allows it to constantly sense temperature, preparing for rapid response.

[0047] 2.65-75℃ range (light load): The thermal expansion medium 42 (acetone) in Unit 1 reaches a boiling point of 65°C. The boiling vaporization pushes the piston plate 431 upward, which in turn drives the blocking block 5 to extend to 15% of the fin height (inlet section) via the piston rod 432.

[0048] Effect: The inlet section has a thin boundary layer, and 15% shallow turbulence effectively disrupts the boundary layer, improving heat transfer efficiency by approximately 18%. The trapezoidal cross-section reduces airflow resistance and creates a stable vortex behind it, which rolls up the boundary layer. Groove 7 generates microscale disturbances to enhance heat transfer in the near-wall region; The curved guide channel 9 directs the airflow downwards, disturbing the low-speed zone at the bottom; Units 2 and 3 were not triggered, so no additional wind resistance was added, and the overall wind resistance only increased by about 4%.

[0049] 3.75-85℃ range (medium load): The thermal expansion medium 42 (ethanol-water mixture) in Unit 2 reaches its boiling point of 75°C, causing the blocking block 5 to extend to 25% of the fin height (middle). The blocking block 5 in Unit 1 remains at 15% extension.

[0050] Effect: The increased boundary layer thickness in the middle section, along with 25% moderate turbulence, improves the heat transfer efficiency in the middle section by approximately 28%. The two blocking blocks 5 form a relay-type turbulence, and the superposition of vortices enhances the overall heat transfer. The second unit, groove 7 and arc-shaped guide channel 9, also play a role in ensuring effective disturbance at the middle bottom; Overall wind resistance increases by approximately 10%.

[0051] 4. >85℃ stage (full load): The thermal expansion medium 42 (fluorinated liquid) in Unit 3 reaches its boiling point of 85°C, driving the blocking block 5 to extend to 35% of the fin height (outlet section). All three blocking blocks 5 extend, disturbing the inlet section, middle section, and outlet section at heights of 15%, 25%, and 35%, respectively.

[0052] Effect: The boundary layer is thickest at the outlet section, and the 35% depth of turbulence improves the heat transfer efficiency of the outlet section by approximately 35%. The three baffle blocks 5 are matched with the turbulence intensity according to the boundary layer thickness, and the overall heat exchange efficiency is improved by more than 45%; The vortices of the three blocking blocks 5 interact with each other, forming an all-round turbulence from the inlet to the outlet and from the bottom to the top; The overall wind resistance increases by about 18%, but the heat exchange benefits far outweigh the cost of the increased wind resistance.

[0053] 5. Cooling and reset process: As the temperature drops, each unit resets sequentially according to its boiling point from lowest to highest: the third unit resets below 85℃, the second unit resets below 75℃, and the first unit resets below 65℃. The three blocking blocks 5 are then fully retracted, restoring unobstructed airflow.

[0054] Effect: The temperature hysteresis during the reset process prevents frequent expansion and contraction of the blocking block 5 during temperature fluctuations, improving system stability. The reset spring 433 ensures reliable reset under any operating condition.

[0055] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of protection claimed by the present invention. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A computer graphics card heat dissipation module that is easy to assemble, comprising heat dissipation fins (1), a heat spreader (2) in thermal contact with the GPU core, and a cooling fan (3) disposed on one side of the heat dissipation fins (1), characterized in that, Also includes: At least one expansion drive unit (4) is disposed on the back side of the heat dissipation fins (1); The expansion drive unit (4) includes: The liquid storage chamber (41) is filled with a thermal expansion medium (42) and is thermally connected to the temperature distribution plate (2); The piston assembly (43) includes a piston plate (431) and a plurality of piston rods (432). The piston plate (431) is slidably disposed in the liquid storage chamber (41), and one end of each of the plurality of piston rods (432) is fixed to the piston plate (431). Multiple blocking blocks (5) are connected to the other end of the multiple piston rods (432) respectively, and slide in a one-to-one correspondence with multiple guide holes (6) opened on the heat dissipation fins (1); When the thermal expansion medium (42) is heated and expands, it pushes the piston plate (431) to move, and then drives the multiple blocking blocks (5) to extend from the multiple guide holes (6) into the multiple airflow channels between the heat dissipation fins (1) through the multiple piston rods (432). The multiple blocking blocks (5) are located at the same distance from the heat dissipation fan (3).

2. The computer graphics card heat dissipation module that is easy to assemble according to claim 1, characterized in that, The expansion drive unit (4) also includes a reset spring (433), one end of which abuts against the piston plate (431) and the other end of which abuts against the inner wall of the liquid storage chamber (41), for driving the blocking block (5) to retract when the thermal expansion medium (42) contracts.

3. The easily assembled computer graphics card heat dissipation module according to claim 1, characterized in that, The thermal expansion medium (42) is a phase change material, and its phase change temperature is set between 50℃ and 85℃. The volume expansion rate of the phase change material before and after the phase change is greater than 10%.

4. The computer graphics card heat dissipation module that is easy to assemble according to claim 1, characterized in that, At least a portion of the liquid storage cavity (41) is embedded inside the heat dissipation fins (1).

5. The computer graphics card heat dissipation module that is easy to assemble according to claim 1, characterized in that, The cross-section of the blocking block (5) is trapezoidal, and its width on the windward side is smaller than that on the leeward side, which is used to enhance the vortex intensity when it is extended.

6. The easily assembled computer graphics card heat dissipation module according to claim 1, characterized in that, The air outlet direction of the cooling fan (3) is perpendicular to the airflow channel between the cooling fins (1), so that the airflow diverges from the middle of the airflow channel to both ends; when the block (5) extends out, it is located in the airflow path generated by the cooling fan (3) to disturb the airflow driven by the cooling fan (3).

7. The easily assembled computer graphics card heat dissipation module according to claim 1, characterized in that, It includes multiple expansion drive units (4) arranged at intervals along the airflow direction. Each expansion drive unit (4) drives a row of blocking blocks (5). The blocking blocks (5) in different rows are located at different distances from the cooling fan (3). The thermal expansion medium (42) in different drive units has different phase change temperature points, and the phase change temperature points gradually increase along the airflow direction. Furthermore, along the airflow direction, the blocking blocks (5) driven by the later expansion drive unit (4) extend at a greater height than the blocking blocks (5) driven by the earlier expansion drive unit (4).

8. The computer graphics card heat dissipation module that is easy to assemble according to claim 1, characterized in that, The extended end surface of the blocking block (5) is provided with grooves (7) to further disrupt the airflow boundary layer when it extends.

9. The easily assembled computer graphics card heat dissipation module according to claim 8, characterized in that, The leeward section of the groove (7) is provided with a downward arc-shaped guide channel (9) to guide the wind in the groove (7), so that the wind flows downward along the leeward side of the block (5) and disturbs the airflow at the bottom of the airflow channel between the heat dissipation fins (1).

10. The easily assembled computer graphics card heat dissipation module according to claim 1, characterized in that, The inner wall of the guide hole (6) is provided with a sealing ring (8), which slides and seals with the piston rod (432) to prevent airflow from leaking from the back side of the heat dissipation fins (1).

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