An electrical connection structure, a filter assembly, a vehicle and a design method of the electrical connection structure

Abstract

The application discloses an electrical connection structure, a filter assembly, a vehicle and a design method of the electrical connection structure, and belongs to the technical field of electrical insulation. The electrical connection structure comprises a shell, a first conductive row, an insulating barrier and a second conductive row; the shell is provided with a containing groove and a mounting opening communicated with the containing groove; the first conductive row, the insulating barrier and the second conductive row are sequentially and spacedly distributed along a first direction, and each of the first conductive row, the insulating barrier and the second conductive row has a part fixed in the containing groove and a part extending from the mounting opening; at least one of the first conductive row and the second conductive row is a target conductive row, the target conductive row is provided with a recessed area on at least one side of the target conductive row in a second direction, the recessed area is provided with at least a first opening and a second opening, the first opening is located on a side surface of the target conductive row, and the second opening is located on a surface of the target conductive row facing the insulating barrier; a part of the recessed area is covered by an insulating filling part, and another part of the recessed area protrudes from an insulating interface.

Description

Technical Field

[0001] This application relates to the field of electrical insulation technology, and in particular to a design method for an electrical connection structure, a filter component, a vehicle, and an electrical connection structure. Background Technology

[0002] In electrical structures, creepage distance refers to the shortest path between two conductive components measured along an insulating surface.

[0003] In the prior art, increasing the creepage distance by replacing the insulation material with one that has a higher tracking index (CTI) will lead to a decrease in the durability and other properties of the insulation material. For example, the insulation material may crack and fail under temperature shock. Moreover, replacing the insulation material will increase the cost of testing and verification, significantly increasing the cost of the electrical structure. Increasing the distance between two conductive parts will increase the volume of the electrical structure, which is not conducive to the miniaturization of the electrical structure. Summary of the Invention

[0004] This application provides a design method for an electrical connection structure, a filter component, a vehicle, and an electrical connection structure. It solves the problem in related technologies of increasing the creepage distance between two conductive bars at low cost without increasing the volume of the electrical connection structure or changing the insulation material. The technical solution is as follows: On the one hand, an electrical connection structure is provided, including: a housing, a first conductive bus, an insulating barrier, a second conductive bus, and an insulating filler; The housing has a receiving groove and a mounting opening communicating with the receiving groove, the receiving groove being used to receive an insulating filler portion; The first conductive bus, the insulating barrier, and the second conductive bus are distributed sequentially at intervals along a first direction. Each of the first conductive bus, the insulating barrier, and the second conductive bus has a portion fixed in the receiving groove and a portion extending out from the mounting opening. Wherein, at least one of the first conductive bus and the second conductive bus is a target conductive bus, and the target conductive bus has a recessed area on at least one side in the second direction. The recessed area has at least a first opening and a second opening. The first opening is located on the side of the target conductive bus, and the second opening is located on the side of the target conductive bus facing the insulating barrier. A portion of the recessed area is located in the receiving groove, and another portion extends out from the mounting opening. The second direction is the width direction of the target conductive bus.

[0005] By creating a recessed area on the side of the target busbar, with a first opening on the side of the target busbar and a second opening on the side of the target busbar facing the insulating barrier, a portion of the recessed area is located within a receiving groove, while another portion extends from the mounting opening. After the insulating filler is placed within the receiving groove, a portion of the recessed area is enclosed within the insulating filler, while the other portion protrudes beyond the insulating interface. This allows the recessed area to form part of a critical creepage path, thereby lengthening the high-risk critical creepage path and increasing the effective creepage distance between the first and second busbars at the insulating interface. This method eliminates the need for adjustments to the insulating barrier or insulating filler material, avoiding the degradation of other material properties (such as durability) caused by changes in the insulating material. It also saves on the verification test costs for material changes and the high material costs. Furthermore, the manufacturing process of the recessed area is mature and low-cost. Moreover, it is possible to increase the effective creepage distance between the first and second busbars without changing the overall volume of the electrical connection structure or the insulating material, ensuring the miniaturization of the electrical connection structure.

[0006] In some possible implementations, the extension length of the recessed area extending out of the receiving groove in a third direction perpendicular to the mounting opening is less than the extension length of the target conductive bus extending out of the receiving groove.

[0007] By ensuring that the extension length of the recessed area protruding from the insulation interface is less than the extension length of the target busbar protruding from the insulation interface, it can be ensured that the recessed area is only located in a localized region of the target busbar in the third direction, rather than penetrating the end face of the target busbar in the third direction away from the mounting opening. This guarantees the cross-sectional area of ​​the target busbar outside the recessed area, reduces the impact of the recessed area on the conductivity of the target busbar, and keeps the thermal equilibrium temperature of the target busbar lower.

[0008] In some possible implementations, the recessed area has a first groove wall and a second groove wall disposed opposite to each other in the third direction, and a connecting groove wall located between the first groove wall and the second groove wall; The first groove wall is located outside the receiving groove and is spaced apart from the installation opening in the third direction; the second groove wall is located inside the receiving groove.

[0009] By setting a recessed area with a first groove wall, a second groove wall, and a connecting groove wall, the target conductive bus can be formed by only partially grooving the target conductive bus. The process is simple and low-cost, and it does not increase the volume of the target conductive bus, thus meeting the compactness requirement of the target conductive bus.

[0010] In some possible implementations, there are two connecting groove walls inside the recessed area: a first connecting groove wall and a second connecting groove wall; the first connecting groove wall intersects with the second connecting groove wall; the first connecting groove wall is disposed opposite to the first opening and intersects with the side of the target conductive bus facing the insulating barrier; the second connecting groove wall is disposed opposite to the second opening and intersects with the side of the target conductive bus. Alternatively, the number of connecting groove walls inside the recessed area is one; the connecting groove wall intersects with the side of the target conductive bus and with the side of the target conductive bus facing the insulating barrier. Alternatively, the recessed area may also have a third opening located on the side of the target conductive bus away from the insulating barrier, and the number of connecting groove walls inside the recessed area is one, with the connecting groove wall arranged parallel to the side of the target conductive bus.

[0011] Any of the three solutions mentioned above can be used to extend the critical creepage path and increase the creepage distance in the recessed area.

[0012] In some possible implementations, within the same recessed area, the included angle between the first groove wall and the connecting groove wall is greater than or equal to 90°; And / or, the angle between the second groove wall and the connecting groove wall is greater than or equal to 90°; And / or, if there are two connecting groove walls, which are the first connecting groove wall and the second connecting groove wall respectively, the included angle between the first connecting groove wall and the second connecting groove wall is greater than or equal to 90°.

[0013] This creates a flared structure in the recessed area, facilitating mold release, improving process yield, and reducing process costs.

[0014] In some possible implementations, the recessed area also has a fourth opening located outside the receiving groove and distributed on the side of the target conductive bus away from the mounting opening.

[0015] By setting a fourth opening, a through-type recessed area structure is formed on the target busbar. A larger recessed area not only increases the creepage distance on the insulation interface, but also increases the electrical clearance between the target busbar and the insulating barrier at the recessed area, and helps to reduce the volume of the target busbar, thereby minimizing the volume of the electrical connection structure.

[0016] In some possible implementations, the recessed area has a third groove wall disposed opposite to the fourth opening, and a connecting groove wall located between the fourth opening and the third groove wall; The third groove wall is located inside the receiving groove.

[0017] By setting a third groove wall and a connecting groove wall inside the recessed area, and distributing a fourth opening on one side, a stepped groove is formed in the recessed area. It can be formed by only partially grooving the target conductive bus, which is simple and low-cost, and does not increase the volume of the target conductive bus, thus meeting the compactness requirement of the target conductive bus.

[0018] In some possible implementations, there are two connecting groove walls inside the recessed area: a third connecting groove wall and a fourth connecting groove wall; the third connecting groove wall intersects with the fourth connecting groove wall; the third connecting groove wall is disposed opposite to the first opening and intersects with the side of the target conductive bus facing the insulating barrier; the fourth connecting groove wall is disposed opposite to the second opening and intersects with the side of the target conductive bus. Alternatively, the number of connecting groove walls inside the recessed area is one; the connecting groove wall intersects with the side of the target conductive bus and with the side of the target conductive bus facing the insulating barrier. Alternatively, the recessed area may also have a fifth opening located on the side of the target conductive bus away from the insulating barrier; and the number of connecting groove walls inside the recessed area is one, with the connecting groove wall arranged parallel to the side of the target conductive bus.

[0019] Any of the three solutions mentioned above can be used to extend the critical creepage path and increase the creepage distance in the recessed area.

[0020] In some possible implementations, for the target conductive bus extending out of the receiving groove, a chamfered surface is provided between the side of the target conductive bus facing away from the mounting opening and the side surface of the target conductive bus, and the fourth opening is located on the chamfered surface.

[0021] In this way, by setting a chamfered surface between the side of the target conductive bus away from the installation opening and the side of the target conductive bus, and setting the fourth opening on the chamfered surface, sharp edges can be avoided at the edge of the target conductive bus, ensuring a smooth transition of the cross-section of the conductive bus, improving conductivity, and reducing the thermal equilibrium temperature.

[0022] In some possible implementations, a first chamfer is provided between the inner wall of the recessed area and the outer surface of the target conductive busbar; And / or, a second chamfer is provided between two different groove walls connected inside the recessed area.

[0023] The first chamfer prevents the recessed area from forming a sharp edge with the outer surface of the target conductive busbar. This reduces manufacturing difficulty and thus lowers manufacturing costs. The second chamfer also prevents the recessed area from forming a sharp edge with the outer surface of the target conductive busbar. This reduces manufacturing difficulty and thus lowers manufacturing costs.

[0024] On the other hand, a filtering component is provided, the filtering component including: a filtering circuit and an insulating filling part, as well as the above-mentioned electrical connection structure; The filter circuit is located in the receiving groove and is electrically connected to the first conductive bus and the second conductive bus. The insulating filling part is located in the receiving groove and covers the first conductive bus, the second conductive bus and the insulating blocking member located in the receiving groove.

[0025] By adopting the above-described electrical connection structure, the first and second conductive busbars can be used as target conductive busbars. By setting a recessed area on the target conductive busbar, the creepage path on the insulation interface can be effectively extended, thereby increasing the creepage distance of the first and second conductive busbars on the insulation interface. This results in low manufacturing cost and does not increase the size of the filter component.

[0026] On the other hand, a vehicle is provided that integrates the aforementioned filtering components.

[0027] By adopting the above-mentioned filter components, the first and second conductive busbars can be used as target conductive busbars. By setting a recessed area on the target conductive busbar, the creepage path on the insulation interface can be effectively extended, thereby increasing the creepage distance of the first and second conductive busbars on the insulation interface. The manufacturing cost is low, and the volume of the filter components is not increased, thus improving the space utilization of the filter components in the vehicle.

[0028] On another front, a design method for an electrical connection structure is provided, the electrical connection structure comprising: a first conductive bus, an insulating barrier, and a second conductive bus sequentially spaced along a first direction; wherein the first conductive bus, the insulating barrier, and the second conductive bus all contain portions that can be covered by the insulating filling portion; the design method includes: A safe creepage distance that meets the insulation standard is obtained based on at least one of the materials of the insulating barrier and the insulating filler. Based on the key dimensions of the electrical connection structure, the effective creepage distance between the first conductive bus and the second conductive bus is determined; After determining that the effective creepage distance is less than the safe creepage distance, the critical dimensions of at least one of the first conductive bus, the second conductive bus, and the insulating barrier are optimized so that the effective creepage distance between the first conductive bus and the second conductive bus is greater than or equal to the safe creepage distance.

[0029] This design method combines the safe creepage distance of insulation standards, the effective creepage distance of electrical connection structures, and the optimization of critical dimensions of electrical connection structures. This ensures that the effective creepage distance of the electrical connection structure is greater than or equal to the safe creepage distance, guaranteeing compliance with insulation standards. This approach enables rapid and efficient design of electrical connection structures, improving design efficiency and streamlining the design process. By optimizing critical dimensions to achieve an effective creepage distance greater than or equal to the safe creepage distance, there is no need to adjust the materials of insulating barriers or insulating fillers. This avoids the degradation of other properties of the insulating material caused by changes in insulation materials, such as cracking and failure under temperature shock. It also saves on the testing and verification costs of new materials. Furthermore, it can effectively increase the effective creepage distance of the first and second conductive busbars without changing the overall volume of the electrical connection structure or the insulation material. Moreover, it can increase the effective creepage distance even with a combined path of insulating barriers and insulating fillers.

[0030] In some possible implementations, optimizing the critical dimensions of at least one of the first conductive bus, the second conductive bus, and the insulating barrier includes: At least one of the first conductive bus and the second conductive bus is used as the target conductive bus, and a recessed area is designed on the target conductive bus to increase the effective creepage distance between the first conductive bus and the second conductive bus. The recessed area is located on at least one side of the target conductive bus in a second direction, and the recessed area has at least a first opening and a second opening. The first opening is located on the side of the target conductive bus, and the second opening is located on the side of the target conductive bus facing the insulating barrier. The second direction is the width direction of the target conductive bus.

[0031] In this way, by designing a recessed area on the target conductive bus, the effective creepage distance can be increased without changing the overall spacing between the first and second conductive buses, thereby meeting insulation requirements and ensuring the compactness of the electrical connection structure. There is no need to replace the insulating barrier and insulating filler with higher CTI materials, avoiding the high costs and reliability risks associated with material changes, and also without adding extra insulating components, thus ensuring the compactness of the electrical connection structure.

[0032] In some possible implementations, the design method further includes: The following dimensions are defined as quantitative: the distance between the first conductive busbar and the second conductive busbar, the distance between the target conductive busbar and the insulating barrier, the thickness of the insulating barrier, and the distance by which the insulating barrier protrudes relative to the target conductive busbar in the second direction; The design dimensions of the recessed area are set as variables; An objective function is established using the quantitative terms, the variables, and the safe creepage distance; the objective function must at least satisfy the following: the effective creepage distance is greater than or equal to the safe creepage distance. The variables are solved based on the objective function to obtain the design dimensions of the recessed area.

[0033] Compared to the process of manually modifying key dimensions and then verifying the effective creepage distance, this application establishes a quantitative and variable objective function to ensure the safe creepage distance. Solving the objective function yields the results of the variables, thus obtaining the design dimensions for the recessed area to meet the safe creepage distance. Moreover, the variable solution process is scientific and reliable, significantly improving design efficiency.

[0034] In some possible implementations, determining the effective creepage distance between the first and second conductive busbars based on the critical dimensions of the electrical connection structure includes: Based on the critical dimensions of the electrical connection structure, multiple potential risk creepage paths are identified on the insulation interface of the insulation filler. Select a critical creepage path from the plurality of potential risk creepage paths; the critical creepage path includes at least one of the following paths: the path with the shortest distance and the path with the least resistance among the plurality of potential risk creepage paths; Based on the key creepage path, the effective creepage distance is obtained.

[0035] In this way, while fully considering the insulation risk between the first and second busbars based on multiple potential creepage paths, the design efficiency is improved by selecting critical creepage paths, thus ensuring the reliability and efficiency of the design.

[0036] In some possible implementations, the safe creepage distance is obtained based on the material of the insulating barrier, and the effective creepage distance is the portion of the critical creepage path distributed on the insulating barrier; And / or, the safe creepage distance is obtained based on the material of the insulating filler, and the effective creepage distance is the portion of the critical creepage path distributed on the insulating filler; And / or, the effective creepage distance is the overall size of the critical creepage path, and the safe creepage distance is the maximum value of the first safe creepage distance and the second safe creepage distance, wherein the first safe creepage distance is obtained based on the material of the insulating filler and the second safe creepage distance is obtained based on the material of the insulating barrier.

[0037] In this way, by implementing the above three parallel methods, the principles of segmented independence and overall equivalence in insulation design standards are solidified into efficient methods, thereby improving design reliability and efficiency.

[0038] In some possible implementations, obtaining the effective creepage distance based on the key creepage path includes: Select the corresponding superposition tolerance method based on the number of dimensional loops involved in the critical creepage path; If the number of rings in the dimension is not greater than the number of the first rings, then the extreme value method is selected as the superposition tolerance method; If the number of rings in the dimension is greater than the number of rings in the second dimension, and the number of rings in the second dimension is greater than the number of rings in the first dimension, then the Monte Carlo simulation method is selected as the superposition tolerance method. If the number of rings in the dimension is greater than the first number of rings but not greater than the second number of rings, then the root mean square method is selected as the superposition tolerance method. The effective creepage distance is obtained based on the superposition tolerance method.

[0039] In this way, by using the superposition tolerance method, the design results can correspond to the actual manufactured product, avoiding the failure of the electrical connection structure insulation design caused by deviations due to manufacturing process errors, and improving the reliability of the electrical connection structure.

[0040] In some possible implementations, the safe creepage distance is also obtained based on at least one of the following: the applicable voltage of the electrical connection structure, the contamination level of the insulation interface of the insulation filler, the size and number of conductive particles on the insulation interface of the insulation filler, and the applicable altitude.

[0041] In this way, by comprehensively considering multiple factors to obtain the safe creepage distance, the safe creepage distance of electrical connection structures can be assessed more accurately, thereby guiding design optimization. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0043] Figure 1 This is a schematic diagram of the first electrical connection structure provided in the embodiments of this application. Figure 1 .

[0044] Figure 2 This is a schematic diagram of the first electrical connection structure provided in the embodiments of this application. Figure 2 .

[0045] Figure 3 This is a schematic diagram of the first electrical connection structure provided in the embodiments of this application. Figure 3 .

[0046] Figure 4 This is a schematic diagram of the second electrical connection structure provided in the embodiments of this application. Figure 1 .

[0047] Figure 5 This is a schematic diagram of the second electrical connection structure provided in the embodiments of this application. Figure 2 .

[0048] Figure 6 This is a schematic diagram of the second electrical connection structure provided in the embodiments of this application. Figure 3 .

[0049] Figure 7 This is a schematic diagram of the third electrical connection structure provided in the embodiments of this application. Figure 1 .

[0050] Figure 8 This is a schematic diagram of the third electrical connection structure provided in the embodiments of this application. Figure 2 .

[0051] Figure 9 This is a schematic diagram of the third electrical connection structure provided in the embodiments of this application. Figure 3 .

[0052] Figure 10 This is a schematic diagram of the fourth electrical connection structure provided in the embodiments of this application. Figure 1 .

[0053] Figure 11 This is a schematic diagram of the fourth electrical connection structure provided in the embodiments of this application. Figure 2 .

[0054] Figure 12 This is a schematic diagram of the fourth electrical connection structure provided in the embodiments of this application. Figure 3 .

[0055] Figure 13 This is a schematic diagram of the fifth electrical connection structure provided in the embodiments of this application. Figure 1 .

[0056] Figure 14 This is a schematic diagram of the fifth electrical connection structure provided in the embodiments of this application. Figure 2 .

[0057] Figure 15 This is a schematic diagram of the fifth electrical connection structure provided in the embodiments of this application. Figure 3 .

[0058] Figure 16 This is a schematic diagram of the sixth electrical connection structure provided in the embodiments of this application. Figure 1 .

[0059] Figure 17This is a schematic diagram of the sixth electrical connection structure provided in the embodiments of this application. Figure 2 .

[0060] Figure 18 This is a schematic diagram of the sixth electrical connection structure provided in the embodiments of this application. Figure 3 .

[0061] Figure 19 This is a partial structural schematic diagram of the vehicle provided in the embodiments of this application.

[0062] Figure 20 This is a flowchart of the design method for the electrical connection structure provided in the embodiments of this application. Figure 1 .

[0063] Figure 21 This is an initial structural diagram of the electrical connection structure provided in the embodiments of this application.

[0064] Figure 22 This is a flowchart of the design method for the electrical connection structure provided in the embodiments of this application. Figure 2 .

[0065] Figure 23 This is a schematic diagram illustrating the modeling of potential creepage paths in conjunction with geometric dimensions according to an embodiment of this application.

[0066] Figure 24 This is a flowchart of the design method for the electrical connection structure provided in the embodiments of this application. Figure 3 .

[0067] Figure 25 This is a schematic diagram of the first or fourth electrical connection structure provided in the embodiments of this application, designed based on the electrical connection structure design method. Figure 1 .

[0068] Figure 26 This is a schematic diagram of the first or fourth electrical connection structure provided in the embodiments of this application, designed based on the electrical connection structure design method. Figure 2 .

[0069] Figure 27 This is a schematic diagram of the second or fifth electrical connection structure provided in the embodiments of this application, designed based on the electrical connection structure design method. Figure 1 .

[0070] Figure 28 This is a schematic diagram of the second or fifth electrical connection structure provided in the embodiments of this application, designed based on the electrical connection structure design method. Figure 2 .

[0071] Figure 29This is a schematic diagram of the third or sixth electrical connection structure provided in the embodiments of this application, designed based on the electrical connection structure design method. Figure 1 .

[0072] Figure 30 This is a schematic diagram of the third or sixth electrical connection structure provided in the embodiments of this application, designed based on the electrical connection structure design method. Figure 2 .

[0073] Figure 31 This is the creepage distance calculation table from the IEC 60664 insulation standard. Detailed Implementation

[0074] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0075] This application provides an electrical connection structure. For example... Figure 1 and Figure 2 As shown, the electrical connection structure 000 may include: a housing 100, a first conductive bar 210, an insulating barrier 400, and a second conductive bar 220.

[0076] The housing 100 may have a receiving groove R1 and a mounting opening P1 communicating with the receiving groove R1 for accommodating the insulating filler 500. The insulating filler 500 may be made of an insulating material such as epoxy resin or silicone. For example, the insulating filler 500 is prepared using a potting compound with a CTI greater than 600.

[0077] The first conductive bus 210, the insulating barrier 400, and the second conductive bus 220 are sequentially spaced along a first direction X. Each of the first conductive bus 210, the insulating barrier 400, and the second conductive bus 220 has a portion fixed within a receiving groove R1 and a portion extending from a mounting opening P1. The first direction X can be the thickness direction of the first conductive bus 210 and the second conductive bus 220. For example, the distance between the first conductive bus 210 and the second conductive bus 220 is 6 mm. On a plane perpendicular to the first direction X, the edge of the insulating barrier 400 extends 0.15 mm beyond the edge of the first conductive bus 210.

[0078] Here, the first busbar 210 and the second busbar 220 are conductive buses for transmitting current. For example, the first busbar 210 and the second busbar 220 are the positive busbar and the negative busbar, respectively.

[0079] The insulating barrier 400 is used to isolate the first conductive bus 210 and the second conductive bus 220 to prevent electrical short circuits between the different first conductive bus 210 and second conductive bus 220. The insulating barrier 400 can be made of insulating materials such as plastic or rubber. For example, the material of the insulating barrier 400 is a composite material of polyphenylene sulfide (PPS) with 40% glass fiber (GF) reinforcement, and the composite material has a Comparative Tracking Index (CTI) greater than 175.

[0080] The housing 100 is the external support structure of the electrical connection structure 000, used to house and support the first conductive bus 210, the second conductive bus 220, and the insulating barrier 400, and can accommodate the insulating filler 500 through the receiving groove R1. The housing 100 can be made of materials such as plastic or rubber. For example, the housing 100 is a composite material made of polyphenylene sulfide (PPS) material reinforced with 40% glass fiber (GF).

[0081] After the receiving groove R1 accommodates the insulating filler 500, the side of the insulating filler 500 near the mounting opening P1 becomes the insulating interface G, i.e., the interface between the insulating filler 500 and the external environment. The insulating filler 500 can cover the first conductive bus 210, the second conductive bus 220, and the insulating barrier 400 within the receiving groove R1, improving the insulation performance of the first conductive bus 210 and the second conductive bus 220. Simultaneously, the first conductive bus 210 and the second conductive bus 220 form a creepage path on the insulating interface G. The creepage path can be any continuous path between the first conductive bus 210 and the second conductive bus 220.

[0082] Among the numerous creepage paths, one or more are critical creepage paths. These critical creepage paths allow for the rapid determination of whether a short-circuit risk exists in the design of the electrical connection structure 000. For example, critical creepage paths include the shortest creepage path and the creepage path with the least resistance. The shortest creepage path and the creepage path with the least resistance are typically the path between the edge of the first conductive bus 210 and the edge of the second conductive bus 220 on the same side.

[0083] like Figure 2 As shown, for example, the shortest creepage path includes a first path J1, a second path, and a third path J3 connected in sequence. The first path J1 starts from the edge of the first conductive bar 210 in the second direction Y and extends directly in a straight line to the edge of the insulating barrier 400 on the same side in the second direction Y. The second path passes through the surface of the insulating barrier 400 in the second direction Y along the first direction X. The third path J3 extends directly in a straight line from the edge of the insulating barrier 400 to the edge of the second conductive bar 220 on the same side in the second direction Y.

[0084] like Figure 2 As shown, for example, the creepage path with the least resistance includes: the fourth path J4, the fifth path J5, the sixth path J6, the seventh path J7, and the eighth path J8 connected in sequence. The fourth path J4 is located between the first conductive bus 210 and the insulating barrier 400, and the eighth path J8 is located between the second conductive bus 220 and the insulating barrier 400. The fifth path J5, the sixth path J6, and the seventh path J7 are all located on the surface of the insulating barrier 400. The extension directions of the fourth path J4, the sixth path J6, and the eighth path J8 are parallel to the first direction X, and the extension directions of the fifth path J5 and the seventh path J7 are parallel to the second direction Y. The CTI of the insulating barrier 400 is smaller than the CTI of the insulating filler 500. The fifth path J5, the sixth path J6, and the seventh path J7, all located on the surface of the insulating barrier 400, constitute the largest proportion of the critical creepage paths, thus forming the creepage path with the least resistance.

[0085] It is evident that the critical creepage path described above is not only located on the insulating interface G of the insulating filler 500, but also involves the insulating barrier 400. In other words, the critical creepage path is a composite path involving at least two insulating materials.

[0086] In this design, at least one of the first conductive busbar 210 and the second conductive busbar 220 is the target conductive busbar 300. The target conductive busbar 300 may have a recessed area 310 on at least one side in the second direction Y. The recessed area 310 may have at least a first opening W1 and a second opening W2. The first opening W1 is located on the side surface 301 of the target conductive busbar 300, and the second opening W2 is located on the side of the target conductive busbar 300 facing the insulating barrier 400. A portion of the recessed area 310 is located within the receiving groove R1, and another portion extends out from the mounting opening P1. The second direction Y is the width direction of the target conductive busbar 300. The side surface 301 of the target conductive busbar 300 refers to the side surface 301 of the target conductive busbar 300 in the second direction Y. Here, after the receiving groove R1 is filled with the insulating filling portion 500, the portion of the recessed area 310 on the target conductive busbar 300 located within the receiving groove R1 is covered by the insulating filling portion 500, and the portion of the recessed area 310 extending out from the mounting opening P1 extends beyond the insulating interface G.

[0087] In the first conductive busbar 210 and the second conductive busbar 220, only one can be the target conductive busbar 300, or both can be the target conductive busbar 300. The target conductive busbar 300 can have a recessed area 310 on only one side in the second direction Y, or it can have a recessed area 310 on both sides in the second direction Y.

[0088] For example, taking a scenario where both the first conductive bus 210 and the second conductive bus 220 are target conductive buses 300, and both the first conductive bus 210 and the second conductive bus 220 have a recessed area 310 on the same side in the second direction Y, the following description will be provided. On the insulating interface G, the first path J1, which is the shortest creepage path, starts from the inner wall or edge of the recessed area 310 of the first conductive bus 210 and then extends towards the insulating barrier 400; the third path J3 starts from the inner wall or edge of the recessed area 310 of the second conductive bus 220 and then extends towards the insulating barrier 400. The recessed area 310 on the first conductive bus 210 lengthens the first path J1, and the recessed area 310 on the second conductive bus 220 lengthens the second path, thereby lengthening the shortest creepage path.

[0089] Similarly, the fourth path J4, the creepage path of least resistance, originates from the inner wall or edge of the recessed area 310 of the first conductive bus 210 and then extends towards the insulating barrier 400; the eighth path J8 originates from the inner wall or edge of the recessed area 310 of the second conductive bus 220 and then extends towards the insulating barrier 400. The recessed area 310 on the first conductive bus 210 lengthens the fourth path J4, and the recessed area 310 on the second conductive bus 220 lengthens the eighth path J8, thereby lengthening the creepage path of least resistance.

[0090] For critical creepage paths, whether for the shortest distance or the path with the least resistance, by providing recessed areas 310 on the first conductive bus 210 and the second conductive bus 220, there is no need to adjust the materials of the insulating barrier 400 or the insulating filler 500. This avoids the degradation of other properties of the insulating material caused by changes in the insulating material, such as cracking and failure under temperature shock. Moreover, it saves the testing and verification costs of new materials and saves high material costs. The manufacturing process of the recessed area 310 is mature and low-cost. Furthermore, without changing the overall volume of the electrical connection structure 000 or the insulating material, the creepage distance of the first conductive bus 210 and the second conductive bus 220 can be effectively increased, ensuring the miniaturization of the electrical connection structure 000. In addition, it achieves an effective increase in the creepage distance in composite paths.

[0091] In some embodiments, both the first conductive bus 210 and the second conductive bus 220 can be target conductive bus 300. The first conductive bus 210 has recessed areas 310 on both sides in the second direction Y, and the second conductive bus 220 also has recessed areas 310 on both sides in the second direction Y. In this way, the creepage distance of the first conductive bus 210 and the second conductive bus 220 on the same side in the second direction Y can be maximized without changing the volume of the electrical connection structure 000, and the creepage distance of the first conductive bus 210 and the second conductive bus 220 on both sides in the second direction Y can be maximized.

[0092] In summary, by setting a recessed area on the side of the target busbar, with the first opening of the recessed area located on the side of the target busbar and the second opening located on the side of the target busbar facing the insulating barrier, a portion of the recessed area is located within a receiving groove, while another portion extends out from the mounting opening. After the insulating filler is filled into the receiving groove, a portion of the recessed area is covered within the insulating filler, while the other portion protrudes outside the insulating interface. This allows the recessed area to form part of a critical creepage path, thereby lengthening the high-risk critical creepage path and increasing the effective creepage distance between the first and second busbars at the insulating interface. This is achieved without adjusting the insulating barrier or insulating filler material, avoiding the degradation of other material properties (such as durability) caused by changes in the insulating material. It also saves on the verification test costs of material changes and the high material costs. Furthermore, the manufacturing process of the recessed area is mature and low-cost. Moreover, the effective creepage distance between the first and second busbars can be increased without changing the overall volume of the electrical connection structure or the insulating material, ensuring the miniaturization of the electrical connection structure.

[0093] like Figures 1-9 As shown, in some possible implementations, the extension length of the recessed area 310 extending out of the receiving groove R1 in the third direction Z perpendicular to the mounting opening P1 is less than the extension length of the target conductive bus 300 extending out of the receiving groove R1. Here, the third direction Z is also the length direction of the target conductive bus 300.

[0094] In this way, by making the extension length of the recessed region 310 protruding from the insulating interface G less than the extension length of the target conductive bus 300 protruding from the insulating interface G, it can be ensured that the recessed region 310 is only located in a local area of ​​the target conductive bus 300 in the third direction Z, rather than penetrating the end face of the target conductive bus 300 in the third direction Z away from the mounting opening P1. This ensures the cross-sectional area of ​​the target conductive bus 300 outside the recessed region 310, reduces the impact of the recessed region 310 on the conductivity of the target conductive bus 300, and keeps the thermal equilibrium temperature of the target conductive bus 300 lower.

[0095] like Figures 1-9 As shown, in some possible implementations, the recessed area 310 may have a first groove wall 311 and a second groove wall 312 disposed opposite each other in the third direction Z, and a connecting groove wall 314 located between the first groove wall 311 and the second groove wall 312. Here, the first groove wall 311, the second groove wall 312, the connecting groove wall 314, and the side of the target conductive bus 300 near the insulating barrier 400 form a second opening W2. The first groove wall 311, the second groove wall 312, the connecting groove wall 314, and the side surface 301 of the target conductive bus 300 form a first opening W1.

[0096] The first groove wall 311 is located outside the receiving groove R1 and is spaced apart from the mounting opening P1 in the third direction Z. The second groove wall 312 is located inside the receiving groove R1.

[0097] In other words, neither the first groove wall 311 nor the second groove wall 312 is in contact with the insulating interface G, while the connecting groove wall 314 between the first groove wall 311 and the second groove wall 312 intersects with the insulating interface G. The connecting groove wall 314 can form part of the critical creepage path. Thus, the critical creepage path can enter the recessed area 310 from the first opening W1 or the second opening W2 and extend along the connecting groove wall 314, thereby lengthening the critical creepage path and increasing the creepage distance.

[0098] Here, by setting a recessed area 310 with a first groove wall 311, a second groove wall 312 and a connecting groove wall 314, the target conductive bus 300 can be formed by only partially grooving the target conductive bus 300. The process is simple and low-cost, and at the same time, it does not increase the volume of the target conductive bus 300, thus meeting the requirement of compactness of the target conductive bus 300.

[0099] like Figures 1-3 As shown, in one embodiment, there are two connecting groove walls 314 inside the recessed area 310: a first connecting groove wall 314a and a second connecting groove wall 314b. The first connecting groove wall 314a intersects with the second connecting groove wall 314b. The first connecting groove wall 314a is disposed opposite to the first opening W1 and intersects with the side of the target conductive bus 300 facing the insulating barrier 400. The second connecting groove wall 314b is disposed opposite to the second opening W2 and intersects with the side surface 301 of the target conductive bus 300. For example, the minimum distance between the second groove wall 312 and the insulating interface G can be 2 mm.

[0100] In this way, by setting the intersecting first connecting groove wall 314a and second connecting groove wall 314b, the connecting groove wall 314 of the recessed region 310 has a corner at the intersection of the first connecting groove wall 314a and the second connecting groove wall 314b. Due to the presence of the recessed region 310, at the cross-section where the target conductive bus 300 intersects with the insulating interface G, the thickness of the target conductive bus 300 in the first direction X is reduced, thereby extending the critical creepage path in the first direction X and increasing the creepage distance.

[0101] For example, the recessed area 310 has a dimension of 1.45 mm in the second direction Y, a minimum dimension of 1.25 mm in the first direction X, and a minimum dimension of 3.5 mm in the third direction Z. All of the above dimensions of the recessed area 310 can be within tolerance, for example, ±0.2 mm.

[0102] like Figures 4-6 As shown, in another embodiment, the number of connecting groove walls 314 inside the recessed area 310 is one. The connecting groove wall 314 intersects the side surface 301 of the target conductive bus 300 and the side of the target conductive bus 300 facing the insulating barrier 400. That is, the surface where the connecting groove wall 314 is located is inclined to both the side surface 301 of the target conductive bus 300 and the side of the target conductive bus 300 near the insulating barrier 400. Exemplarily, the connecting groove wall 314 is an inclined surface, distributed on the edge where the side surface 301 of the target conductive bus 300 and the side of the target conductive bus 300 near the insulating barrier 400 intersect.

[0103] For example, the recessed area 310 has a dimension of 1.45 mm in the second direction Y, a minimum dimension of 1.25 mm in the first direction X, and a minimum dimension of 3.5 mm in the third direction Z. All of the above dimensions of the recessed area 310 can be within tolerance, for example, ±0.2 mm.

[0104] In this way, by setting a connecting groove wall 314, the connecting groove wall 314 intersects both the side 301 of the target conductive bus 300 and the side facing the insulating barrier 400, forming a sloped recessed area 310. Due to the existence of the recessed area 310, at the cross-section where the target conductive bus 300 intersects with the insulating interface G, the thickness of the target conductive bus 300 in the first direction X of the recessed area 310 gradually decreases, that is, the thickness of the target conductive bus 300 gradually decreases towards the edge along the second direction Y, and the width of the target conductive bus 300 in the second direction Y of the recessed area 310 also gradually decreases, that is, along the first direction X, the width of the target conductive bus 300 gradually decreases from the side away from the insulating barrier 400 to the side closer to the insulating barrier 400; thereby extending the critical creepage path and increasing the creepage distance in both the first direction X and the second direction Y.

[0105] Compared to the design where the recessed region 310 has a first connecting groove wall 314a and a second connecting groove wall 314b, this design uses a sloping connecting groove wall 314 in the recessed region 310 while keeping the areas of the first opening W1 and the second opening W2 unchanged. This can minimize the material loss of the target conductive bus 300 in the recessed region 310, thereby ensuring the conductivity of the target conductive bus 300 and reducing the thermal equilibrium temperature of the target conductive bus 300.

[0106] like Figures 7-9As shown, in another embodiment, the recessed area 310 may also have a third opening W3, which is located on the side of the target conductive bus 300 facing away from the insulating barrier 400. The recessed area 310 contains one connecting groove wall 314, which is arranged parallel to the side surface 301 of the target conductive bus 300. That is, the connecting groove wall 314 and the first opening W1 face the second direction Y, while the third opening W3 and the second opening W2 face opposite directions in the first direction X.

[0107] By setting a third opening W3 and configuring the connecting groove wall 314 to be parallel to the side 301 of the target conductive bus 300, the recessed area 310 forms a groove structure with a groove depth extending in the second direction Y. The groove structure penetrates both sides of the target conductive bus 300 in the first direction X. Due to the existence of the recessed area 310, at the cross-section where the target conductive bus 300 intersects with the insulating interface G, the thickness of the target conductive bus 300 in the recessed area 310 in the first direction X is 0, and the width of the target conductive bus 300 in the recessed area 310 in the second direction Y is 0. This maximizes the extension of the critical creepage path and increases the creepage distance in both the first direction X and the second direction Y.

[0108] For example, the recessed area 310 has a dimension of 1.45 mm in the second direction Y, a minimum dimension of the recessed area 310 in the first direction X equal to the thickness of the target conductive bus 300 (3 mm), and a minimum dimension of the recessed area 310 in the third direction Z of 3.5 mm. All of the above dimensions of the recessed area 310 can be within tolerance, for example, ±0.2 mm.

[0109] In some embodiments, the target conductive bus 300 having the recessed region 310 can be achieved by processes such as cutting and forming or die stamping. For example, the recessed region 310 can be formed on a target conductive bus 300 that has already been formed and does not have the recessed region 310 by cutting and forming, or the substrate can be stamped into a target conductive bus 300 having the recessed region 310 by die stamping.

[0110] In one implementation, within the same recessed area 310, the included angle between the first groove wall 311 and the connecting groove wall 314 is greater than or equal to 90°. For example, the included angle between the first groove wall 311 and the connecting groove wall 314 is between 120° and 150°. Figure 3 As shown, when the recessed region 310 has a first connecting groove wall 314a and a second connecting groove wall 314b, the angle between the first groove wall 311 and the first connecting groove wall 314a of the recessed region 310 can be 120°. For example... Figure 6 As shown, when the recessed area 310 is inclined, the angle between the first groove wall 311 and the connecting groove wall 314 of the recessed area 310 can be 135°.

[0111] By setting the included angle between the first groove wall 311 and the connecting groove wall 314 to be greater than or equal to 90 degrees, the recessed area 310 forms a flared structure, which facilitates mold demolding, improves the yield of the process, and reduces the process cost.

[0112] In one implementation, the included angle between the second groove wall 312 and the connecting groove wall 314 is greater than or equal to 90°. For example, the included angle between the second groove wall 312 and the connecting groove wall 314 is between 120° and 150°. Figure 3 As shown, when the recessed region 310 has a first connecting groove wall 314a and a second connecting groove wall 314b, the angle between the first groove wall 311 and the connecting groove wall 314 of the recessed region 310 can be 120°. For example... Figure 6 As shown, when the recessed area 310 is inclined, the angle between the first groove wall 311 and the connecting groove wall 314 of the recessed area 310 can be 135°.

[0113] By setting the included angle between the second groove wall 312 and the connecting groove wall 314 to be greater than or equal to 90°, the recessed area 310 forms a flared structure, which facilitates mold demolding, improves the yield of the process, and reduces the process cost.

[0114] like Figure 3 As shown, in one implementation, when there are two connecting groove walls 314, namely a first connecting groove wall 314a and a second connecting groove wall 314b, the included angle between the first connecting groove wall 314a and the second connecting groove wall 314b is greater than or equal to 90°. For example, the included angle between the first connecting groove wall 314a and the second connecting groove wall 314b is between 120° and 150°, for example, 135°.

[0115] By setting the included angle between the first connecting groove wall 314a and the second connecting groove wall 314b to be greater than or equal to 90°, the recessed area 310 can also form a flared structure, which facilitates mold demolding, improves the yield of the process, and reduces the process cost.

[0116] It is understood that the angle between the first groove wall 311 and the connecting groove wall 314 is greater than or equal to 90°, the angle between the second groove wall 312 and the connecting groove wall 314 is greater than or equal to 90°, and the angle between the first connecting groove wall 314a and the second connecting groove wall 314b is greater than or equal to 90°. Of these three, only one may exist in the recessed area 310, or they may all exist in the recessed area 310.

[0117] like Figures 10-18As shown, in some possible implementations, the recessed area 310 may also have a fourth opening W4, which is located outside the receiving groove R1 and distributed on the side of the target conductive bus 300 away from the mounting opening P1. Here, the fourth opening W4 is located on the side of the target conductive bus 300 away from the mounting opening P1 in the third direction Z.

[0118] In this way, by setting the fourth opening W4, the recessed area 310 forms a through-type recessed area 310 structure on the target conductive bus 300. The larger recessed area 310 can not only increase the creepage distance on the insulation interface G, but also increase the electrical clearance between the target conductive bus 300 and the insulating barrier 400 at the recessed area 310, and is conducive to reducing the volume of the target conductive bus 300, thereby minimizing the volume of the electrical connection structure 000.

[0119] like Figures 10-18 As shown, in some possible implementations, the interior of the recessed area 310 may have a third groove wall 313 disposed opposite to the fourth opening W4, and a connecting groove wall 314 located between the fourth opening W4 and the third groove wall 313.

[0120] The third groove wall 313 is located within the receiving groove R1. Here, after the insulating filler 500 fills the receiving groove R1, the third groove wall 313 is covered by the insulating filler 500. The fourth opening W4 and the insulating interface G are spaced apart in the third direction Z. The connecting groove wall 314 extends beyond the insulating interface G, and the recessed area 310 forms part of the creepage path on the connecting groove wall 314, thereby lengthening the creepage path and increasing the creepage distance. For example, the minimum distance between the third groove wall 313 and the insulating interface G can be 2 mm.

[0121] By providing a third groove wall 313 and a connecting groove wall 314 inside the recessed area 310, and distributing a fourth opening W4 on one side, the recessed area 310 forms a stepped groove. It can be formed simply by partially grooving the target conductive bus 300, which is a simple and low-cost process that does not increase the volume of the target conductive bus 300, thus meeting the requirement for compactness.

[0122] like Figures 10-12 As shown, in one embodiment, there are two connecting groove walls 314 inside the recessed area 310: a third connecting groove wall 314c and a fourth connecting groove wall 314d. The third connecting groove wall 314c intersects with the fourth connecting groove wall 314d. The third connecting groove wall 314c is disposed opposite to the first opening W1 and intersects with the side of the target conductive bus 300 facing the insulating barrier 400. The fourth connecting groove wall 314d is disposed opposite to the second opening W2 and intersects with the side surface 301 of the target conductive bus 300.

[0123] Thus, by setting the intersecting third connecting groove wall 314c and fourth connecting groove wall 314d, the connecting groove wall 314 of the recessed region 310 has a corner at the intersection of the third connecting groove wall 314c and the fourth connecting groove wall 314d. Due to the presence of the recessed region 310, at the cross-section where the target conductive bus 300 intersects with the insulating interface G, the thickness of the target conductive bus 300 in the first direction X is reduced, thereby extending the critical creepage path in the first direction X and increasing the creepage distance.

[0124] For example, the recessed area 310 has a size of 1.45 mm in the second direction Y and a minimum size of 1.25 mm in the first direction X. The above-mentioned dimensions of the recessed area 310 can be reserved with tolerance, for example, the tolerance is ±0.2 mm.

[0125] like Figures 13-15 As shown, in another embodiment, the number of connecting groove walls 314 inside the recessed area 310 is one. The connecting groove wall 314 intersects the side surface 301 of the target conductive bus 300 and the side of the target conductive bus 300 facing the insulating barrier 400. That is, the surface where the connecting groove wall 314 is located is inclined to both the side surface 301 of the target conductive bus 300 and the side of the target conductive bus 300 near the insulating barrier 400. Exemplarily, the connecting groove wall 314 is an inclined surface, distributed on the edge where the side surface 301 of the target conductive bus 300 and the side of the target conductive bus 300 near the insulating barrier 400 intersect.

[0126] In this way, by setting a connecting groove wall 314, the connecting groove wall 314 intersects both the side 301 of the target conductive bus 300 and the side facing the insulating barrier 400, forming a sloped recessed area 310. Due to the existence of the recessed area 310, at the cross-section where the target conductive bus 300 intersects with the insulating interface G, the thickness of the target conductive bus 300 in the first direction X of the recessed area 310 gradually decreases, that is, the thickness of the target conductive bus 300 gradually decreases towards the edge along the second direction Y, and the width of the target conductive bus 300 in the second direction Y of the recessed area 310 also gradually decreases, that is, along the first direction X, the width of the target conductive bus 300 gradually decreases from the side away from the insulating barrier 400 to the side closer to the insulating barrier 400; thereby extending the critical creepage path and increasing the creepage distance in both the first direction X and the second direction Y.

[0127] For example, the recessed area 310 has a size of 1.45 mm in the second direction Y and a minimum size of 1.25 mm in the first direction X. The above-mentioned dimensions of the recessed area 310 can be reserved with tolerance, for example, the tolerance is ±0.2 mm.

[0128] like Figures 16-18As shown, in another embodiment, the recessed area 310 may also have a fifth opening W5, which is located on the side of the target conductive bus 300 facing away from the insulating barrier 400. Furthermore, the recessed area 310 contains one connecting groove wall 314, which is arranged parallel to the side surface 301 of the target conductive bus 300. That is, the connecting groove wall 314 and the first opening W1 face the second direction Y, while the fifth opening W5 and the second opening W2 face opposite directions in the first direction X.

[0129] By setting a fifth opening W5 and configuring the connecting groove wall 314 to be parallel to the side 301 of the target conductive bus 300, the recessed area 310 forms a stepped groove structure with a groove depth extending in the second direction Y. The stepped groove structure penetrates both sides of the target conductive bus 300 in the first direction X. Due to the existence of the recessed area 310, at the cross-section where the target conductive bus 300 intersects with the insulating interface G, the thickness of the target conductive bus 300 in the recessed area 310 in the first direction X is 0, and the width of the target conductive bus 300 in the recessed area 310 in the second direction Y is 0. This maximizes the extension of the critical creepage path and increases the creepage distance in both the first direction X and the second direction Y.

[0130] For example, the size of the recessed area 310 in the second direction Y is 1.45 mm, and the size of the recessed area 310 in the first direction X is the thickness of the target conductive bus 300, which is 3 mm. The above-mentioned dimensions of the recessed area 310 can be reserved with tolerance, for example, the tolerance is ±0.2 mm.

[0131] like Figures 10-18 As shown, in some possible implementations, for the target conductive bus 300 extending out of the receiving groove R1, a chamfered surface 320 is provided between the side of the target conductive bus 300 facing away from the mounting opening P1 and the side surface 301 of the target conductive bus 300, and the fourth opening W4 is located on the chamfered surface 320.

[0132] Here, the side of the target conductive bus 300 facing away from the mounting opening P1 refers to the end face of the target conductive bus 300 extending out of the receiving groove R1 in the third direction Z. The side surface 301 of the target conductive bus 300 refers to the side surface 301 of the target conductive bus 300 in the second direction Y. The chamfered surface 320 can be in the form of a rounded surface or a bevel, etc.

[0133] In this way, by setting a chamfered surface 320 between the side of the target conductive bus 300 away from the mounting opening P1 and the side surface 301 of the target conductive bus 300, and setting the fourth opening W4 on the chamfered surface 320, it is possible to avoid forming sharp edges on the edge of the target conductive bus 300, ensure a smooth transition of the cross-section of the conductive bus, improve conductivity, and reduce the thermal equilibrium temperature.

[0134] In some possible implementations, a first chamfer 331 is provided between the inner wall of the recessed area 310 and the outer surface of the target conductive bus 300. The first chamfer 331 can be an arc surface or a bevel.

[0135] like Figure 3 As shown, a first chamfer 331 is provided between the first connecting groove wall 314a and the side of the target conductive bus 300 near the insulating barrier 400. The first chamfer 331 can be a rounded corner with a diameter of 0.4 mm. Figure 6 As shown, when the recessed area 310 is sloped, a first chamfer 331 is provided between the connecting groove wall 314 and the side of the target conductive busbar 300 near the insulating barrier 400. The first chamfer 331 can be a rounded corner with a diameter of 0.3 mm. Figure 9 As shown, when the recessed area 310 has a third opening W3, a first chamfer 331 is provided between the second groove wall 312 and the side surface 301 of the target conductive bus 300. The first chamfer 331 can be a rounded corner with a diameter of 0.4 mm.

[0136] like Figure 12 As shown, when the recessed area 310 has a third connecting groove wall 314c and a fourth connecting groove wall 314d, the third connecting groove wall 314c has a first chamfer 331 between it and the side of the target conductive bus 300 near the insulating barrier 400. The first chamfer 331 can be a rounded corner with a diameter of 0.4 mm. Figure 18 As shown, when the recessed area 310 has a fifth opening W5, a first chamfer 331 is provided between the third groove wall 313 and the side surface 301 of the target conductive bus 300. The first chamfer 331 can be a rounded corner with a diameter of 0.4 mm. It can be understood that when the recessed area 310 has a fourth opening W4 and is sloped, a first chamfer 331 can also be provided between the third groove wall 313 and the side surface 301 of the target conductive bus 300, and the first chamfer 331 is provided on the side surface 301 of the target conductive bus 300 near the insulating barrier 400. The first chamfer 331 can be a rounded corner with a diameter of 0.3 mm.

[0137] In this way, the first chamfer 331 can prevent the recessed area 310 from forming a sharp edge with the outer surface of the target conductive bus 300. This reduces the difficulty of the process, improves the yield rate, and thus reduces manufacturing costs. At the same time, the smooth transition of the first chamfer 331 facilitates mold manufacturing and demolding, and avoids damage to the mold during the manufacturing process.

[0138] In some possible implementations, a second chamfer 332 is provided between two different groove walls connected inside the recessed area 310. Exemplarily, the second chamfer 332 can be an arc surface or a bevel.

[0139] like Figure 3As shown, when the recessed area 310 has a first connecting groove wall 314a and a second connecting groove wall 314b, a second chamfer 332 is provided between the first groove wall 311 and the connecting groove wall 314, a second chamfer 332 is provided between the second groove wall 312 and the second connecting groove wall 314b, and a second chamfer 332 is provided between the first connecting groove wall 314a and the second connecting groove wall 314b. The second chamfer 332 can be a rounded corner with a diameter of 0.4 mm. Figure 6 As shown, when the recessed area 310 has a first groove wall 311 that is inclined, a second chamfer 332 is provided between the first groove wall 311 and the connecting groove wall 314, and a second chamfer 332 is provided between the second groove wall 312 and the connecting groove wall 314. The second chamfer 332 can be a rounded corner with a diameter of 0.3 mm. Figure 9 As shown, when the recessed area 310 has a first groove wall 311 and a third opening W3, a second chamfer 332 is provided between the first groove wall 311 and the connecting groove wall 314, and a second chamfer 332 is provided between the second groove wall 312 and the connecting groove wall 314. The second chamfer 332 can be a rounded corner with a diameter of 0.4 mm.

[0140] like Figure 12 As shown, when the recessed area 310 has a third connecting groove wall 314c and a fourth connecting groove wall 314d, a second chamfer 332 is provided between the third connecting groove wall 314c and the fourth connecting groove wall 314d, a second chamfer 332 is provided between the third groove wall 313 and the third connecting groove wall 314c, and a second chamfer 332 is provided between the third groove wall 313 and the fourth connecting groove wall 314d. The second chamfer 332 can be a rounded corner with a diameter of 0.4 mm. Figure 18 As shown, when the recessed area 310 has a fourth opening W4 and a fifth opening W5, a second chamfer 332 is provided between the third groove wall 313 and the connecting groove wall 314. The second chamfer 332 can be a rounded corner with a diameter of 0.4 mm. It can be understood that when the recessed area 310 has a fourth opening W4 and is inclined, a second chamfer 332 can also be provided between the third groove wall 313 and the connecting groove wall 314. The second chamfer 332 can be a rounded corner with a diameter of 0.3 mm.

[0141] In this way, the second chamfer 332 can prevent the recessed area 310 from forming a sharp edge with the outer surface of the target conductive bus 300. This reduces the difficulty of the process, improves the yield rate, and thus reduces manufacturing costs. At the same time, the smooth transition of the second chamfer 332 facilitates mold manufacturing and demolding, and avoids damage to the mold during the manufacturing process.

[0142] On the other hand, embodiments of this application provide a filtering component. For example... Figure 1 , Figure 2 and Figure 19As shown, the filter assembly may include: a filter circuit 600 and an insulating filling part 500, as well as the electrical connection structure 000 described above.

[0143] The filter circuit 600 is located in the receiving groove R1 and is electrically connected to the first conductive bus 210 and the second conductive bus 220. The insulating filling part 500 is located in the receiving groove R1 and covers the first conductive bus 210, the second conductive bus 220 and the insulating blocking member 400 located in the receiving groove R1.

[0144] The filter circuit 600 is a circuit used to filter out noise and interference in the power supply. The filter circuit 600 typically includes components such as capacitors, inductors, or resistors. The insulating filling part 500 is used to fill the receiving groove R1, which, while fixing the components of the filter assembly, enhances the insulation between the first conductive bus 210 and the second conductive bus 220.

[0145] By adopting the above-mentioned electrical connection structure 000, the first conductive bus 210 and the second conductive bus 220 can be used as the target conductive bus 300. By setting the recessed area 310 on the target conductive bus 300, the creepage path on the insulation interface G can be effectively extended, thereby increasing the creepage distance of the first conductive bus 210 and the second conductive bus 220 on the insulation interface G. The manufacturing cost is low and the volume of the filter component is not increased.

[0146] For example, the filter component can be a DC filter component. The filter circuit 600 includes a common-mode inductor 601, which surrounds the entire first busbar 210 and second busbar 220. The common-mode inductor 601 can effectively filter out common-mode interference signals in the power supply line.

[0147] In some embodiments, the filter circuit 600 further includes two differential-mode inductors 602, one of which surrounds the periphery of the first busbar 210, and the other surrounds the periphery of the second busbar 220. The two independently configured differential-mode inductors 602 can respectively filter out differential-mode interference signals on the first busbar 210 and the second busbar 220.

[0148] In some embodiments, the filter circuit 600 further includes an X capacitor 603 and two Y capacitors 604. The two sides of the X capacitor 603 are respectively connected to a first busbar 210 and a second busbar 220. One side of one Y capacitor 604 is grounded, and the other side is electrically connected to the first busbar 210; the other Y capacitor 604 is grounded, and the other side is electrically connected to the second busbar 220. The X capacitor 603 is used to suppress differential-mode interference, while the Y capacitors 604 are used to suppress common-mode interference, ensuring the safety and electromagnetic compatibility of the device.

[0149] Furthermore, embodiments of this application provide a vehicle that integrates the aforementioned filtering components. Here, the vehicle includes, but is not limited to, electric vehicles or hybrid vehicles.

[0150] like Figure 19 As shown, exemplarily, the vehicle includes a power supply bus 701 and a battery pack 702. A first conductive bus 210 and a second conductive bus 220 at one end of a filter assembly are connected to the power supply bus 701, and the first conductive bus 210 and the second conductive bus 220 at the other end of the filter assembly are connected to the battery pack 702. The battery pack 702 supplies power to the power supply bus 701, which in turn supplies power to the vehicle's electrical equipment, such as a drive motor. The filter assembly filters out differential-mode interference and common-mode interference, thereby maintaining stable operation of the battery pack 702 and the electrical equipment.

[0151] The peak voltage of battery pack 702 can be 950V.

[0152] By adopting the above-mentioned filter assembly, the first conductive bus 210 and the second conductive bus 220 can be used as the target conductive bus 300. By setting the recessed area 310 on the target conductive bus 300, the creepage path on the insulation interface G can be effectively extended, thereby increasing the creepage distance of the first conductive bus 210 and the second conductive bus 220 on the insulation interface G. The manufacturing cost is low, and the volume of the filter assembly is not increased, thus improving the space utilization of the filter assembly in the vehicle.

[0153] On another front, embodiments of this application provide a design method for an electrical connection structure, such as... Figure 20 and Figure 21 As shown, the electrical connection structure may include: a first conductive bar 210, an insulating barrier 400, and a second conductive bar 220 sequentially spaced along a first direction X. Each of the first conductive bar 210, the insulating barrier 400, and the second conductive bar 220 contains portions that can be covered by the insulating filling portion 500.

[0154] Referring to the embodiment of the electrical connection structure described above, the first conductive bus 210 and the second conductive bus 220 form a creepage path on the insulation interface G. The creepage path can be any continuous path between the first conductive bus 210 and the second conductive bus 220. Here, the creepage path with higher risk between the first conductive bus 210 and the second conductive bus 220 typically involves both the insulation filler 500 and the insulation barrier 400; that is, the creepage path is usually a composite path of two insulating materials: the insulation filler 500 and the insulation barrier 400.

[0155] Design methods may include: The safe creepage distance IEC[L] that meets the insulation standard is obtained based on at least one of the materials of the insulating barrier 400 and the insulating filler 500. Here, the safe creepage distance IEC[L] can be obtained in three ways: first, it can be obtained based solely on the material of the insulating barrier 400; second, it can also be obtained based solely on the material of the insulating filler 500; and third, it can be obtained based on both the materials of the insulating barrier 400 and the insulating filler 500. All three methods are applicable to paths where the insulating filler 500 and the insulating barrier 400 are composite insulating materials.

[0156] For example, the insulation standard can be IEC 60664, i.e., the insulation coordination standard for low-voltage systems. The material of the insulating barrier 400 can be a composite material of PPS and GF40 with a CTI greater than 175. The material of the insulating filler 500 can be potting compound with a CTI greater than 600. Based on the IEC 60664 standard, for the insulating filler 500 with a CTI greater than 600, the safe creepage distance IEC[L] can be obtained as 6 mm, depending on the material of the insulating filler 500. For the insulating barrier 400 with a CTI greater than 175, the safe creepage distance IEC[L] can be obtained as 10.7 mm, depending on the material of the insulating barrier 400.

[0157] Based on the key dimensions of the electrical connection structure, the effective creepage distance between the first conductive bus 210 and the second conductive bus 220 is determined.

[0158] Here, key dimensions may include: the thickness L4 of the insulating barrier 400 along the first direction X; the dimension H1 by which the edge of the insulating barrier 400 extends beyond the first conductive bus 210; the distance L1 between the insulating barrier 400 and the first conductive bus 210; and the distance L0 between the first conductive bus 210 and the second conductive bus 220. The distance between the insulating barrier 400 and the second conductive bus 220 may be the same as the distance L1 between the insulating barrier 400 and the first conductive bus 210. The effective creepage distance is the actual creepage distance of the electrical connection structure at this time. If the effective creepage distance is greater than or equal to the safe creepage distance IEC[L], the electrical connection structure meets the insulation requirements.

[0159] After determining that the effective creepage distance is less than the safe creepage distance IEC[L], the critical dimensions of at least one of the first conductive bus 210, the second conductive bus 220 and the insulating barrier 400 are optimized so that the effective creepage distance between the first conductive bus 210 and the second conductive bus 220 is greater than or equal to the safe creepage distance IEC[L].

[0160] Here, by optimizing the geometric dimensions of the first conductive bus 210, the second conductive bus 220, and the insulating barrier 400, the effective creepage distance is made greater than or equal to the safe creepage distance IEC[L].

[0161] In this way, this design method combines the safe creepage distance IEC[L] of the insulation standard, the effective creepage distance of the electrical connection structure, and the optimization of the critical dimensions of the electrical connection structure, so that the effective creepage distance of the electrical connection structure is greater than or equal to the safe creepage distance IEC[L]. This ensures that the electrical connection structure conforms to the insulation standard, realizes the rapid and efficient design of the electrical connection structure, improves the design efficiency of the electrical connection structure, and realizes the processization of the design method. By optimizing the critical dimensions to achieve the goal of the effective creepage distance being greater than or equal to the safe creepage distance IEC[L], there is no need to adjust the materials of the insulating barrier 400 and the insulating filler 500. This avoids the degradation of other properties of the insulating material caused by the change of the insulating material, such as the insulating material cracking and failing under temperature shock. It saves the testing and verification costs of new materials. Without changing the overall volume of the electrical connection structure 000 and without changing the insulating material, the effective creepage distance of the first conductive bus 210 and the second conductive bus 220 can be effectively increased. Moreover, the effective creepage distance can be increased under the combined path of the insulating barrier 400 and the insulating filler 500.

[0162] like Figure 22 As shown, in some possible implementations, determining the effective creepage distance between the first conductive bus 210 and the second conductive bus 220 based on the critical dimensions of the electrical connection structure may include: Based on the critical dimensions of the electrical connection structure, multiple potential creepage paths are identified on the insulation interface G of the insulation filler 500. This allows for a full consideration of the insulation risks between the first conductive bus 210 and the second conductive bus 220, thereby improving the safety of the electrical connection structure.

[0163] The critical creepage path is selected from multiple potential risk creepage paths. The critical creepage path may include at least one of the following: the shortest path and the path with the least resistance among the multiple potential risk creepage paths. Here, the shortest creepage path refers to the shortest path between the edge of the first conductive bus 210 and the edge of the second conductive bus 220 on the same side. The creepage path with the least resistance refers to the path between the edge of the first conductive bus 210 and the edge of the second conductive bus 220 on the same side, where the proportion of low CTI material is largest among both the insulating barrier 400 and the insulating filler 500.

[0164] Based on the key creepage path, the effective creepage distance is obtained.

[0165] In this way, while fully considering the insulation risk between the first conductive bus 210 and the second conductive bus 220 based on multiple potential creepage paths, the design efficiency is improved by selecting critical creepage paths, thus ensuring the reliability and efficiency of the design.

[0166] like Figure 21 As shown, in some embodiments, the insulating barrier 400 has a thickness L4 along the first direction X, the edge of the insulating barrier 400 extends beyond the dimension H1 of the first conductive bus 210, the distance L1 between the insulating barrier 400 and the first conductive bus 210, and the distance L0 between the first conductive bus 210 and the second conductive bus 220. These key dimensions remain constant and satisfy the following relationships:

[0167] like Figure 23 As shown, any potential creepage path includes: a first sub-path F1, a second sub-path F2, a third sub-path F3, a fourth sub-path F4, and a fifth sub-path F5. The first sub-path F1 extends from the first conductive bus 210 to the insulating barrier 400, and θ is the phase angle of the first sub-path F1 relative to the first direction X. The second sub-path F2 is the creepage distance of the current along the second direction Y on the insulating barrier 400. The third sub-path F3 is the creepage distance of the current along the first direction X on the insulating barrier 400. The first sub-path F1 is symmetrical to the fifth sub-path F5, and the second sub-path F2 is symmetrical to the fourth sub-path F4. The length of the first sub-path F1 is L2, and the length of the second sub-path F2 is L3.

[0168] The first sub-path F1 and the second sub-path F2 satisfy the following equation:

[0169] like Figure 21 and Figure 23 As shown, in this arbitrary potential creepage path, the effective creepage distance on the insulating filler 500 is K1, and the effective creepage distance on the insulating barrier 400 is K2. The sum of K1 and K2 is L. A parametric model of the potential creepage path can be established through the following equation:

[0170]

[0171] (Formula 1) Based on the above parameterized model, the effective creepage distance of any potential creepage path can be calculated, thereby realizing the calculation of the effective creepage distance under critical creepage paths.

[0172] The relationship between the safe creepage distance IEC[L] and the effective creepage distance can be determined according to at least one of the principles in the IEC 60664 standard: the segmented independence principle or the overall equivalence principle. The segmented independence principle means that there must be at least one insulation segment in the path whose effective creepage distance can independently withstand the full system voltage. The overall equivalence principle means that the total effective creepage distance of the entire path, calculated based on the requirements of the material with the lowest CTI performance in the path, can withstand the full system voltage. Meeting at least one of the following three implementation methods indicates that the effective creepage distance is greater than or equal to the safe creepage distance IEC[L].

[0173] In the first implementation, the safe creepage distance IEC[L] is obtained based on the material of the insulating filler 500, and the effective creepage distance is the portion of the critical creepage path distributed on the insulating filler 500. That is to say, based on the principle of segmented independence, the insulating filler 500 itself can independently withstand the full voltage of the system.

[0174] In the second implementation, the safe creepage distance IEC[L] is obtained based on the material of the insulating barrier 400, and the effective creepage distance is the portion of the critical creepage path distributed on the insulating barrier. That is to say, based on the principle of segmented independence, the insulating barrier 400 itself can independently withstand the full voltage of the system.

[0175] In the third implementation, the effective creepage distance is the overall size of the critical creepage path, and the safe creepage distance IEC[L] is the maximum value of the first safe creepage distance and the second safe creepage distance. The first safe creepage distance IEC(W1) is obtained based on the material of the insulating filler 500, and the second safe creepage distance IEC(W2) is obtained based on the material of the insulating barrier 400. That is to say, based on the principle of overall equivalence, the equivalent sum of the insulating barrier 400 and the insulating filler 500 can withstand the full voltage of the system.

[0176] In this way, by implementing the above three parallel methods, the principles of segmented independence and overall equivalence in insulation design standards are solidified into efficient methods, thereby improving design reliability and efficiency.

[0177] For example, the thickness L4 of the insulating barrier 400 along the first direction X, the edge of the insulating barrier 400 extending beyond the dimension H1 of the first conductive bus 210, the distance L1 between the insulating barrier 400 and the first conductive bus 210, and the nominal values ​​and tolerances of the distance L0 between the first conductive bus 210 and the second conductive bus 220 are shown in the table below:

[0178] For the insulating filler 500 with a CTI greater than 600, the first safe creepage distance IEC(W1) is 6 mm. For the insulating barrier 400 with a CTI greater than 175, the second safe creepage distance IEC(W2) is 10.7 mm.

[0179] When the effective creepage distance K1 is the portion of the critical creepage path distributed on the insulation fill 500, the minimum effective creepage distance K1 is calculated as follows: (Formula 2) The effective creepage distance K1 is 3.7mm, which is less than 6mm and does not meet the design requirements.

[0180] Furthermore, when the effective creepage distance is the portion of the critical creepage path distributed on the insulating filler 500, and in the case of minimizing it, the effective creepage distance K2 can be calculated as the portion of the critical creepage path distributed on the insulating barrier 400, as follows: (Formula 3) The effective creepage distance K2 is 4.6mm, which is less than 10.7mm and does not meet the design requirements.

[0181] When the effective creepage distance is the portion of the critical creepage path distributed on the insulating barrier 400, the minimum effective creepage distance is calculated as follows:

[0182] The effective creepage distance K2 is 1.95mm, which is less than 10.7mm and does not meet the design requirements.

[0183] Furthermore, if the effective creepage distance is minimized to the extent that the critical creepage path is distributed on the insulating barrier 400, the effective creepage distance K1 can be calculated as the extent that the critical creepage path is distributed on the insulating fill 500, as follows:

[0184]

[0185] The effective creepage distance K1 is 4.5mm, which is less than 6mm and does not meet the design requirements.

[0186] After verifying the two segmented independence principles mentioned above, it was found that no single segment of material under the critical creepage path can independently bear the total system voltage. Therefore, it is necessary to calculate the effective creepage distance under the entire critical creepage path based on the overall equivalence principle.

[0187] like Figure 22 As shown, in some possible implementations, obtaining the effective creepage distance based on the critical creepage path can include: The appropriate overlay tolerance method is selected based on the number of dimensional loops involved in the critical creepage path. Here, the number of dimensional loops refers to the number of critical dimensions.

[0188] If the number of dimension rings is not greater than the number of the first ring, then the extreme value method is selected as the method for superimposing tolerances. For example, the number of the first ring can be 3. In the calculation formula for L in Formula 1 above, only three critical dimensions L4, H1, and L1 are involved, that is, the number of dimension rings is 3. In this case, the extreme value method is selected as the method for superimposing tolerances, as shown in Formulas 2 and 3 above, to calculate the effective creepage distance.

[0189] If the number of dimension rings is greater than the number of the second ring, and the number of the second ring is greater than the number of the first ring, then the Monte Carlo simulation method is chosen as the superposition tolerance method. In the calculation formula for L in Formula 1 above, when the distance L1 between the first conductive busbar 210 and the insulating barrier 400 is different from the distance between the second conductive busbar 220 and the insulating barrier 400, the fifth sub-path F5 is asymmetrical with the first sub-path F1, and the insulating barrier 400 is asymmetrical on both sides in the first direction. Therefore, the second sub-path F2 is asymmetrical with the fourth sub-path F4. The calculation of L involves not only the three dimensions L4, H1, and L1, but also the distance between the second conductive busbar 220 and the insulating barrier 400, the distance of the second sub-path F5, the length of the second sub-path F2, and the length of the fourth sub-path F4, with a dimension ring number of 7. In this case, the Monte Carlo simulation method is chosen as the superposition tolerance method.

[0190] If the number of dimension rings is greater than the number of the first rings but not greater than the number of the second rings, the root mean square method is selected as the method for superimposing tolerances. For example, the number of the second rings can be 5. In the calculation formula for L in Formula 1 above, when the distance L1 between the first conductive busbar 210 and the insulating barrier 400 is different from the distance between the second conductive busbar 220 and the insulating barrier 400, the fifth sub-path F5 is asymmetrical with the first sub-path F1. The calculation of L involves not only the three dimensions L4, H1, and L1, but also the distance between the second conductive busbar 220 and the insulating barrier 400, and the distance of the second sub-path F5, i.e., the number of dimension rings is 5. In this case, the root mean square method is selected as the method for superimposing tolerances.

[0191] Effective creepage distances are obtained using a superimposed tolerance method. Referring to Table 1, each critical dimension in the quantitative analysis has a corresponding tolerance dimension. The superimposed tolerance method ensures that the design results correspond to the actual manufactured product, avoiding deviations caused by manufacturing process errors that could lead to insulation design failures in electrical connection structures, thus improving the reliability of the electrical connection structure.

[0192] like Figure 1 , Figure 2 and 24As shown, in some possible implementations, optimizing the critical dimensions of at least one of the first conductive bus 210, the second conductive bus 220, and the insulating barrier 400 may include: At least one of the first conductive bus 210 and the second conductive bus 220 is designated as the target conductive bus 300, and a recessed area 310 is designed on the target conductive bus 300 to increase the effective creepage distance between the first conductive bus 210 and the second conductive bus 220.

[0193] The recessed area 310 is located on at least one side of the target conductive bus 300 in the second direction Y, and the recessed area 310 may have at least a first opening W1 and a second opening W2. The first opening W1 is located on the side 301 of the target conductive bus 300, and the second opening W2 is located on the side of the target conductive bus 300 facing the insulating barrier 400. The second direction Y is the width direction of the target conductive bus 300.

[0194] In this way, by designing a recessed area 310 on the target conductive bus 300, the effective creepage distance can be increased without changing the overall arrangement spacing of the first conductive bus 210 and the second conductive bus 220, thereby meeting the insulation requirements and ensuring the compactness of the electrical connection structure. There is no need to replace the insulating barrier 400 and the insulating filler 500 with higher CTI materials, avoiding the high costs and reliability risks associated with material changes, and also without adding additional insulating components, thus ensuring the compactness of the electrical connection structure. For details regarding the design of the recessed area 310 on the target conductive bus 300, please refer to the detailed embodiment of the electrical connection structure; it will not be repeated here.

[0195] Here, key dimensions for obtaining the effective creepage distance may include: the thickness L4 of the insulating barrier 400 along the first direction X, the dimension H1 of the edge of the insulating barrier 400 extending beyond the first conductive bus 210, the distance L1 between the insulating barrier 400 and the first conductive bus 210, and the distance L1 between the insulating barrier 400 and the second conductive bus 220. The distance L1 between the insulating barrier 400 and the first conductive bus 210 may be the same as the distance L1 between the insulating barrier 400 and the second conductive bus 220. In other embodiments, the distance L1 between the insulating barrier 400 and the first conductive bus 210 and the distance L1 between the insulating barrier 400 and the second conductive bus 220 may be different. Key dimensions that can be optimized include: the depth of the recessed region 310 (the dimension of the recessed region 310 in the first direction X), the length of the recessed region 310 (the dimension of the recessed region 310 in the third direction Z), and the width of the recessed region 310 (the dimension of the recessed region 310 in the second direction Y).

[0196] like Figure 24 As shown, among some possible implementations, the design methodology may also include: The following dimensions are set as quantitative: the distance L0 between the first conductive bar 210 and the second conductive bar 220, the distance L1 between the target conductive bar 300 and the insulating barrier 400, the thickness L4 of the insulating barrier 400, and the distance H1 by which the insulating barrier 400 protrudes relative to the target conductive bar 300 in the second direction Y.

[0197] The design dimensions of the recessed area 310 are set as variables. For example, the variables may include: the width of the recessed area 310 in the second direction Y, the depth of the recessed area 310 in the first direction X, and the length of the recessed area 310 in the third direction Z.

[0198] An objective function is established using a quantitative, variable, and safe creepage distance IEC[L]. The objective function must at least satisfy the following condition: the effective creepage distance is greater than or equal to the safe creepage distance IEC[L].

[0199] The variables are solved based on the objective function to obtain the design dimensions of the recessed region 310.

[0200] Compared to the process of manually modifying key dimensions and then verifying the effective creepage distance, this application establishes a quantitative objective function that satisfies the safe creepage distance IEC[L]. Solving the objective function yields the results of the variables, thus obtaining the design dimensions of the recessed area 310 that meet the safe creepage distance IEC[L]. Moreover, the variable solution process is scientific and reliable, significantly improving the design efficiency.

[0201] like Figure 25 and Figure 26As shown, in some embodiments, for a recessed region 310 having a first connecting groove wall 314a and a first connecting groove wall 314b, the following variables are defined: the depth l of the recessed region 310 in the first direction X, the total width h2 of the recessed region 310 in the second direction Y, and the width h1 of the second connecting groove wall 314b of the recessed region 310 in the second direction Y. Starting from the first edge Q1, the second edge Q2, and the third edge Q3, there are four critical creepage paths: the first critical creepage path N1, the second critical creepage path N2, the third critical creepage path N3, and the fourth critical creepage path N4. The first critical creepage path N1 extends obliquely from the first edge Q1 along the shortest distance to the insulating barrier 400, and is the creepage path with the shortest distance starting from the first edge Q1, wherein the path of the insulating filling part 500 is the longest. The second critical creepage path N2 extends vertically from the first edge Q1 to the insulating barrier 400, and is the shortest creepage distance of the first edge Q1 at the insulating interface G. The third critical creepage path N3 starts from the second edge Q2 and extends vertically to the insulating barrier 400, representing the shortest creepage distance of the second edge Q2 at the insulating interface G. The fourth critical creepage path N4 starts from the third edge Q3 and extends vertically to the insulating barrier 400, representing the shortest creepage distance of the third edge Q3 at the insulating interface G.

[0202] Four sets of objective functions are established as follows: the first set of objective functions is based on the first critical creepage path; the second set of objective functions is based on the second critical creepage path; the third set of objective functions is based on the third critical creepage path; and the fourth set of objective functions is based on the fourth critical creepage path.

[0203] The first set of objective functions is:

[0204]

[0205] The second set of objective functions is:

[0206]

[0207] The third objective function is:

[0208]

[0209] The objective function for the fourth group is:

[0210]

[0211] By substituting the quantitative values ​​and solving the first and second sets of objective functions, the depth l of the recessed region 310 in the first direction X can be obtained. In the third set of objective functions, the width h1 of the first connecting groove wall 314b in the second direction Y is defined as more than half of the width h2 of the recessed region 310 in the second direction Y. By substituting the quantitative values ​​and solving the fourth set of objective functions, the width h2 of the recessed region 310 in the second direction Y can be calculated in reverse. Thus, the variables can be solved to obtain the design dimensions of the recessed region 310 with the first connecting groove wall 314a and the first connecting groove wall 314b. Under this design dimension, the recessed region 310 meets the requirement that the effective creepage distance is greater than or equal to the safe creepage distance IEC[L]. The design method of the recessed region 310 with the third connecting groove wall 314c and the fourth connecting groove wall 314d is similar to this process and will not be described in detail here.

[0212] For example, in the quantitative analysis, the distance L0 between the first conductive bus 210 and the second conductive bus 220 can be 6 mm. The distance L1 between the target conductive bus 300 and the insulating barrier 400 can be 2 mm. The thickness L4 of the insulating barrier 400 can be 2 mm. The distance H1 by which the insulating barrier 400 protrudes relative to the target conductive bus 300 in the second direction Y can be 0.15 mm.

[0213] For example, after solving, the minimum value of the depth l of the recessed area 310 in the first direction X is 1.25 mm, the minimum value of the width h2 of the recessed area 310 in the second direction Y is 1.25 mm, and the minimum value of the width h1 of the second connecting groove wall 314b in the second direction Y is 0.625 mm.

[0214] like Figure 27 and Figure 28 As shown, in some embodiments, for a recessed area 310 that is sloped and has a first groove wall 311, the following variables are defined: the depth l of the recessed area 310 in the first direction X, and the total width h2 of the recessed area 310 in the second direction Y. Starting from the fourth edge Q4 and the fifth edge Q5, there are three critical creepage paths: the fifth critical creepage path N5, the sixth critical creepage path N6, and the seventh critical creepage path N7. The fifth critical creepage path N5 starts from the fourth edge Q4 and extends obliquely along the shortest distance to the insulating barrier 400, which is the shortest creepage distance for the fourth edge Q4, but the path of the insulating filling part 500 is the longest. The sixth critical creepage path N6 starts from the fourth edge Q4 and extends vertically to the insulating barrier 400, which is the shortest creepage distance for the fourth edge Q4 on the insulating interface G. The seventh critical creepage path N7 starts from the fifth edge Q5 and extends vertically to the insulating barrier 400, which is the shortest creepage distance for the fifth edge Q5 on the insulating interface G.

[0215] The following three sets of objective functions are established: the fifth set of objective functions is based on the fifth critical creepage path N5; the sixth set of objective functions is based on the sixth critical creepage path N6; the seventh set of objective functions is based on the seventh critical creepage path N7; and the third set of objective functions is based on the fourth critical creepage path.

[0216] The objective function for the fifth group is:

[0217]

[0218] The objective function for the sixth group is:

[0219]

[0220] The objective function for the seventh group is:

[0221]

[0222] Using the fifth and sixth sets of objective functions, the depth l of the recessed area 310 in the first direction X can be calculated in reverse; using the seventh set of objective functions, the total width h2 of the recessed area 310 in the second direction Y can be calculated in reverse, thus solving for the variables and obtaining the design dimensions of the recessed area 310, which is sloping and has a first groove wall 311. Under this design dimension, the recessed area 310 meets the requirement that the effective creepage distance is greater than or equal to the safe creepage distance IEC[L]. The design method for the recessed area 310, which is sloping and has a third groove wall 313, is similar and will not be described in detail here.

[0223] For example, in the quantitative calculation, the distance L0 between the first conductive bus 210 and the second conductive bus 220 can be 6 mm. The distance L1 between the target conductive bus 300 and the insulating barrier 400 can be 2 mm. The thickness L4 of the insulating barrier 400 can be 2 mm. The distance H1 by which the insulating barrier 400 protrudes relative to the target conductive bus 300 in the second direction Y can be 0.15 mm. After solving, the minimum value of the depth l of the recessed area 310 in the first direction X is 1.25 mm, and the minimum value of the total width h2 of the recessed area 310 in the second direction Y is 1.25 mm.

[0224] like Figure 29 and Figure 30As shown, in some embodiments, for the recessed region 310 having a first groove wall 311 and a third opening W3, a variable is defined: the total width h2 of the recessed region 310 in the second direction Y. Starting from the sixth edge Q6, there are two critical creepage paths: the eighth critical creepage path N8 and the ninth critical creepage path N9. The eighth critical creepage path N8 extends obliquely from the sixth edge Q6 along the shortest distance to the insulating barrier 400, which is the shortest creepage distance for the sixth edge Q6, but the path of the insulating filling portion 500 is the longest. The ninth critical creepage path N9 extends vertically from the sixth edge Q6 to the insulating barrier 400, which is the shortest creepage distance for the sixth edge Q6 at the insulating interface G.

[0225] The following two sets of objective functions are established: the eighth set of objective functions is based on the eighth critical creepage path N8; the ninth set of objective functions is based on the ninth critical creepage path N9.

[0226] The objective function for the eighth group is:

[0227]

[0228] The objective function for the ninth group is:

[0229]

[0230] Using the eighth and ninth objective functions, the total width h2 of the recessed region 310 in the second direction Y can be calculated in reverse; thus, the variables can be solved to obtain the design dimensions of the recessed region 310 with the first groove wall 311 and the third opening W3. Under this design dimension, the recessed region 310 meets the requirement that the effective creepage distance is greater than or equal to the safe creepage distance IEC[L]. The design method for the recessed region 310 with the third groove wall 313 and the fifth opening W5 is similar to this process and will not be described in detail here.

[0231] For example, in the quantitative calculation, the distance L0 between the first conductive bus 210 and the second conductive bus 220 can be 6 mm. The distance L1 between the target conductive bus 300 and the insulating barrier 400 can be 2 mm. The thickness L4 of the insulating barrier 400 can be 2 mm. The distance H1 by which the insulating barrier 400 protrudes relative to the target conductive bus 300 in the second direction Y can be 0.15 mm. After solving, the minimum value of the total width h2 of the recessed area 310 in the second direction Y is 1.25 mm.

[0232] like Figure 31As shown, in some possible implementations, the safe creepage distance IEC[L] is also obtained based on at least one of the following: the applicable voltage of the electrical connection structure, the pollution level of the insulating interface G of the insulating fill 500, the size and number of conductive particles of the insulating interface G of the insulating fill 500, and the applicable altitude.

[0233] In this way, by comprehensively considering multiple factors to obtain the safe creepage distance IEC[L], the safe creepage distance IEC[L] of electrical connection structures can be evaluated more accurately, thereby guiding design optimization.

[0234] In some embodiments, the insulating barrier 400 is made of a composite material of PPS and GF40, with a CTI greater than 175. The applicable voltage for the electrical connection structure is 950V DC. The pollution level of the insulating interface G can be pollution level 2. The conductive particle size of the insulating interface G can be from 0.1mm to 1mm. The applicable altitude is below 5000 meters. The safe creepage distance IEC[L] is 10.7mm. If the insulating interface G has no conductive particles, the safe creepage distance IEC[L] is 9.5mm.

[0235] In some embodiments, the material of the insulating filler 500 can be potting compound with a CTI greater than 600. The applicable voltage for the electrical connection structure is 950V DC, and the contamination level of the insulating interface G can be contamination level 2. The conductive particle size of the insulating interface G can be 0.1mm to 1mm. The applicable altitude can be below 5000 meters. A safe creepage distance IEC[L] of 6mm is obtained. If the insulating interface G has no conductive particles, the safe creepage distance IEC[L] is 4.8mm.

[0236] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0237] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An electrical connection structure, characterized in that, include: Housing (100), first conductive bus (210), insulating barrier (400), and second conductive bus (220); The housing (100) has a receiving groove (R1) and a mounting opening (P1) communicating with the receiving groove (R1), the receiving groove (R1) being used to receive the insulating filling part (500). The first conductive bus (210), the insulating barrier (400) and the second conductive bus (220) are distributed sequentially at intervals along the first direction (X). The first conductive bus (210), the insulating barrier (400) and the second conductive bus (220) each have a portion fixed in the receiving groove (R1) and a portion extending out from the mounting opening (P1). Wherein, at least one of the first conductive bus (210) and the second conductive bus (220) is a target conductive bus (300), the target conductive bus (300) has a recessed area (310) on at least one side in the second direction (Y), the recessed area (310) has at least a first opening (W1) and a second opening (W2), the first opening (W1) is located on the side (301) of the target conductive bus (300), and the second opening (W2) is located on the side of the target conductive bus (300) facing the insulating barrier (400); a portion of the recessed area (310) is located in the receiving groove (R1), and another portion extends out from the mounting opening (P1); the second direction (Y) is the width direction of the target conductive bus (300).

2. The electrical connection structure according to claim 1, characterized in that, On a third direction (Z) perpendicular to the mounting opening (P1), the extension length of the recessed area (310) extending out of the receiving groove (R1) is less than the extension length of the target conductive bus (300) extending out of the receiving groove (R1).

3. The electrical connection structure according to claim 2, characterized in that, The recessed area (310) has a first groove wall (311) and a second groove wall (312) disposed opposite to each other in the third direction (Z), and a connecting groove wall (314) located between the first groove wall (311) and the second groove wall (312). The first groove wall (311) is located outside the receiving groove (R1) and is spaced apart from the installation opening (P1) on the third direction (Z); the second groove wall (312) is located inside the receiving groove (R1).

4. The electrical connection structure according to claim 3, characterized in that, The number of connecting groove walls (314) inside the recessed area (310) is two, namely: a first connecting groove wall (314a) and a second connecting groove wall (314b); the first connecting groove wall (314a) and the second connecting groove wall (314b) intersect; The first connecting groove wall (314a) is disposed opposite to the first opening (W1) and intersects with the side of the target conductive bus (300) facing the insulating barrier (400); the second connecting groove wall (314b) is disposed opposite to the second opening (W2) and intersects with the side (301) of the target conductive bus (300); Alternatively, the number of connecting groove walls (314) inside the recessed area (310) is one; the connecting groove wall (314) intersects with the side (301) of the target conductive bus (300) and with the side of the target conductive bus (300) facing the insulating barrier (400); Alternatively, the recessed area (310) may also have a third opening (W3) located on the side of the target conductive bus (300) away from the insulating barrier (400), and the number of connecting groove walls (314) inside the recessed area (310) is one, and the connecting groove wall (314) is arranged parallel to the side (301) of the target conductive bus (300).

5. The electrical connection structure according to any one of claims 3-4, characterized in that, Within the same recessed area (310), the included angle between the first groove wall (311) and the connecting groove wall (314) is greater than or equal to 90°; And / or, the angle between the second groove wall (312) and the connecting groove wall (314) is greater than or equal to 90°; And / or, if there are two connecting groove walls (314), namely a first connecting groove wall (314a) and a second connecting groove wall (314b), the included angle between the first connecting groove wall (314a) and the second connecting groove wall (314b) is greater than or equal to 90°.

6. The electrical connection structure according to claim 1, characterized in that, The recessed area (310) also has a fourth opening (W4) located outside the receiving groove (R1) and distributed on the side of the target conductive bus (300) away from the mounting opening (P1).

7. The electrical connection structure according to claim 6, characterized in that, The recessed area (310) has a third groove wall (313) disposed opposite to the fourth opening (W4) and a connecting groove wall (314) located between the fourth opening (W4) and the third groove wall (313). The third groove wall (313) is located inside the receiving groove (R1).

8. The electrical connection structure according to claim 7, characterized in that, The number of connecting groove walls (314) inside the recessed area (310) is two, namely: a third connecting groove wall (314c) and a fourth connecting groove wall (314d); the third connecting groove wall (314c) and the fourth connecting groove wall (314d) intersect. The third connecting groove wall (314c) is disposed opposite to the first opening (W1) and intersects with the side of the target conductive bus (300) facing the insulating barrier (400); the fourth connecting groove wall (314d) is disposed opposite to the second opening (W2) and intersects with the side (301) of the target conductive bus (300); Alternatively, the number of connecting groove walls (314) inside the recessed area (310) is one; the connecting groove wall (314) intersects with the side (301) of the target conductive bus (300) and with the side of the target conductive bus (300) facing the insulating barrier (400); Alternatively, the recessed area (310) may also have a fifth opening (W5) located on the side of the target conductive bus (300) facing away from the insulating barrier (400); and the number of connecting groove walls (314) inside the recessed area (310) is one, and the connecting groove wall (314) is arranged parallel to the side (301) of the target conductive bus (300).

9. The electrical connection structure according to any one of claims 7-8, characterized in that, For the target conductive bus (300) extending out of the receiving groove (R1), a chamfered surface (320) is provided between the side of the target conductive bus (300) facing away from the mounting opening (P1) and the side surface (301) of the target conductive bus (300), and the fourth opening (W4) is located on the chamfered surface (320).

10. The electrical connection structure according to any one of claims 1-4 and 6-8, characterized in that, A first chamfer (331) is provided between the inner wall of the recessed area (310) and the outer surface of the target conductive bus (300). And / or, a second chamfer (332) is provided between two different groove walls connected inside the recessed area (310).

11. A filtering component, characterized in that, The filtering component includes: a filtering circuit (600) and an insulating filling part (500), as well as an electrical connection structure (000) according to any one of claims 1-10. The filter circuit (600) is located in the receiving groove (R1) and is electrically connected to the first conductive bus (210) and the second conductive bus (220). The insulating filling part (500) is located in the receiving groove (R1) and covers the first conductive bus (210), the second conductive bus (220) and the insulating barrier (400) located in the receiving groove (R1).

12. A vehicle, characterized in that, The vehicle is equipped with the filter components described in claims 1-10.

13. A design method for an electrical connection structure, characterized in that, The electrical connection structure (000) includes: a first conductive bus (210), an insulating barrier (400), and a second conductive bus (220) sequentially spaced along a first direction (X); each of the first conductive bus (210), the insulating barrier (400), and the second conductive bus (220) contains a portion that can be covered by an insulating filling portion (500); the design method includes: A safe creepage distance that meets insulation standards is obtained based on at least one of the materials of the insulating barrier (400) and the insulating filler (500); Based on the key dimensions of the electrical connection structure (000), the effective creepage distance between the first conductive bus (210) and the second conductive bus (220) is determined; After determining that the effective creepage distance is less than the safe creepage distance, the critical dimensions of at least one of the first conductive bus (210), the second conductive bus (220) and the insulating barrier (400) are optimized so that the effective creepage distance between the first conductive bus (210) and the second conductive bus (220) is greater than or equal to the safe creepage distance.

14. The design method according to claim 13, characterized in that, Optimizing the critical dimensions of at least one of the first conductive bus (210), the second conductive bus (220), and the insulating barrier (400) includes: At least one of the first conductive bus (210) and the second conductive bus (220) is used as the target conductive bus (300), and a recessed area (310) is designed on the target conductive bus (300) to increase the effective creepage distance between the first conductive bus (210) and the second conductive bus (220); The recessed area (310) is located on at least one side of the target conductive bus (300) in the second direction (Y), and the recessed area (310) has at least a first opening (W1) and a second opening (W2). The first opening (W1) is located on the side (301) of the target conductive bus (300), and the second opening (W2) is located on the side of the target conductive bus (300) facing the insulating barrier (400). The second direction (Y) is the width direction of the target conductive bus (300).

15. The design method according to claim 14, characterized in that, The design method further includes: The following dimensions are set as quantitative: the distance between the first conductive bus (210) and the second conductive bus (220), the distance between the target conductive bus (300) and the insulating barrier (400), the thickness of the insulating barrier (400), and the distance by which the insulating barrier (400) protrudes relative to the target conductive bus (300) in the second direction (Y). The design dimensions of the recessed area (310) are set as variables; An objective function is established using the quantitative terms, the variables, and the safe creepage distance; the objective function must at least satisfy the following: the effective creepage distance is greater than or equal to the safe creepage distance. The variables are solved based on the objective function to obtain the design dimensions of the recessed area (310).

16. The design method according to any one of claims 13-15, characterized in that, Based on the key dimensions of the electrical connection structure, determining the effective creepage distance between the first conductive bus (210) and the second conductive bus (220) includes: Based on the critical dimensions of the electrical connection structure, multiple potential risk creepage paths are identified on the insulation interface (G) of the insulation filler (500); Select a critical creepage path from the plurality of potential risk creepage paths; the critical creepage path includes at least one of the following paths: the path with the shortest distance and the path with the least resistance among the plurality of potential risk creepage paths; Based on the key creepage path, the effective creepage distance is obtained.

17. The design method according to claim 16, characterized in that, The safe creepage distance is obtained based on the material of the insulating barrier (400), and the effective creepage distance is the portion of the critical creepage path distributed on the insulating barrier (400); And / or, the safe creepage distance is obtained based on the material of the insulating filler (500), and the effective creepage distance is the portion of the critical creepage path distributed on the insulating filler (500); And / or, the effective creepage distance is the overall size of the critical creepage path, and the safe creepage distance is the maximum of the first safe creepage distance and the second safe creepage distance, wherein the first safe creepage distance is obtained based on the material of the insulating filler (500), and the second safe creepage distance is obtained based on the material of the insulating barrier (400).

18. The design method according to claim 16, characterized in that, Based on the key creepage path, obtaining the effective creepage distance includes: Select the corresponding superposition tolerance method based on the number of dimensional loops involved in the critical creepage path; If the number of rings in the dimension is not greater than the number of the first rings, then the extreme value method is selected as the superposition tolerance method; If the number of rings in the dimension is greater than the number of rings in the second dimension, and the number of rings in the second dimension is greater than the number of rings in the first dimension, then the Monte Carlo simulation method is selected as the superposition tolerance method. If the number of rings in the dimension is greater than the first number of rings but not greater than the second number of rings, then the root mean square method is selected as the superposition tolerance method. The effective creepage distance is obtained based on the superposition tolerance method.

19. The design method according to any one of claims 13-15 and 17-18, characterized in that, The safe creepage distance is also obtained based on at least one of the following: the applicable voltage of the electrical connection structure, the contamination level of the insulation interface (G) of the insulation filler (500), the size and number of conductive particles of the insulation interface (G) of the insulation filler (500), and the applicable altitude.

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