An integrated inverter brick, motor control system and vehicle

Abstract

This invention discloses an integrated inverter brick, a motor control system, and a vehicle, including a bus capacitor, a power module, a support block, a drive control circuit board, and high-voltage positive and negative copper busbars. The power module has U, V, and W phase power chips. The upper surface of the support block is provided with U, V, and W phase positive copper foil layers welded to the high-voltage positive copper busbar and U, V, and W phase negative copper foil layers welded to the high-voltage negative copper busbar. The bus capacitor includes U, V, and W phase capacitor cores. The two ends of the U phase capacitor core and the two high-voltage input terminals of the U phase power chip are welded to the U phase positive and negative copper foil layers, respectively. The two ends of the V phase capacitor core and the two high-voltage input terminals of the V phase power chip are welded to the V phase positive and negative copper foil layers, respectively. The two ends of the W phase capacitor core and the two high-voltage input terminals of the W phase power chip are welded to the W phase positive and negative copper foil layers, respectively. Using this invention can reduce the stray inductance of each capacitor core circuit and balance the ripple current distribution among the capacitor cores.

Description

Technical Field

[0001] This invention belongs to the field of motor control systems, specifically relating to an integrated inverter brick, a motor control system, and a vehicle. Background Technology

[0002] Traditional inverter bricks include bus capacitors, power modules, high-voltage positive copper busbars, high-voltage negative copper busbars, U-phase copper busbars, V-phase copper busbars, W-phase copper busbars, and drive control circuit boards. The power modules have U-phase power chips, V-phase power chips, and W-phase power chips with control terminals electrically connected to the drive control circuit board. The two ends of the bus capacitors are electrically connected to the high-voltage positive copper busbars and high-voltage negative copper busbars, respectively. The two ends of the bus capacitors are also electrically connected to the two high-voltage input terminals of the U-phase power chip, the two high-voltage input terminals of the V-phase power chip, and the two high-voltage input terminals of the W-phase power chip, respectively. The high-voltage output terminal of the U-phase power chip is electrically connected to the U-phase copper busbar, the high-voltage output terminal of the V-phase power chip is electrically connected to the V-phase copper busbar, and the high-voltage output terminal of the W-phase power chip is electrically connected to the W-phase copper busbar. Traditional inverter bricks have the following problems: (1) The high-voltage positive copper busbars and high-voltage negative copper busbars are welded to the top and bottom of the capacitor core of the bus capacitor, occupying a large volume and the heat cannot be dissipated in time. They are also easily affected by the temperature conducted by the high-voltage positive copper busbars and high-voltage negative copper busbars (i.e., input copper busbars). (2) The U, V, and W phases share all the capacitor cores, resulting in different ripple currents and heat generation on the capacitor cores. The high voltage positive and negative copper busbars have long paths, making it impossible to achieve complete stacking. They also require welding or bolting, resulting in high inductance and high losses. (3) The drive control circuit board needs to be fixed to the power module and housing with many bolts. Some of the larger and taller components on the drive control circuit board are also prone to failure due to vibration or environmental problems such as salt spray and humidity. (4) As the core component of the high voltage circuit, the bus capacitor plays a role in smoothing the bus voltage and filtering. The temperature of the internal capacitor core determines whether the bus capacitor is working well. In order to estimate the internal temperature of the capacitor core, a temperature sensor needs to be added to the surface of the capacitor core to measure the surface temperature of the capacitor core. However, adding a separate temperature sensor increases the cost of the inverter brick. Summary of the Invention

[0003] The purpose of this invention is to provide an integrated inverter brick, motor control system and vehicle to effectively improve the heating condition of the capacitor core, reduce stray inductance and power loss in the capacitor core circuit, and balance the ripple current distribution among the capacitor cores.

[0004] In a first aspect, the present invention provides an integrated inverter brick, comprising a bus capacitor, a power module, a high-voltage positive copper busbar, a high-voltage negative copper busbar, a U-phase copper busbar, a V-phase copper busbar, a W-phase copper busbar, a support block, and a drive control circuit board. The power module has a U-phase power chip, a V-phase power chip, and a W-phase power chip with control terminals electrically connected to the drive control circuit board. The high-voltage output terminal of the U-phase power chip is electrically connected to the U-phase copper busbar, the high-voltage output terminal of the V-phase power chip is electrically connected to the V-phase copper busbar, and the high-voltage output terminal of the W-phase power chip is electrically connected to the W-phase copper busbar. The upper surface of the support block is provided with U-phase positive copper foil layers, V-phase positive copper foil layers, and W-phase positive copper foil layers welded to the high-voltage positive copper busbar, as well as U-phase negative copper foil layers, V-phase negative copper foil layers, and W-phase negative copper foil layers welded to the high-voltage negative copper busbar. The bus capacitor includes a U-phase capacitor core, a V-phase capacitor core, and a W-phase capacitor core placed parallel to the support block. The two ends of the U-phase capacitor core and the two high-voltage input terminals of the U-phase power chip are respectively welded to the U-phase positive copper foil layer and the U-phase negative copper foil layer. The two ends of the V-phase capacitor core and the two high-voltage input terminals of the V-phase power chip are respectively welded to the V-phase positive copper foil layer and the V-phase negative copper foil layer. The two ends of the W-phase capacitor core and the two high-voltage input terminals of the W-phase power chip are respectively welded to the W-phase positive copper foil layer and the W-phase negative copper foil layer.

[0005] Pre-fabricated positive and negative copper foil layers for the U, V, and W phases are used on the support block, which are directly welded to the corresponding phase capacitor cores, high-voltage input terminals of the power chips, and high-voltage copper busbars, forming a phase-independent distributed stacked busbar structure. This shortens the power loop inductance of each phase, reduces stray parameters, and improves the operational stability and reliability of the integrated inverter brick. The U, V, and W phase capacitor cores and power chips are welded to their respective independent positive / negative copper foil layers, achieving electrical isolation and independent decoupling between phase units, avoiding inter-phase coupling interference, optimizing the three-phase output current balance, and improving the balance and reliability of the three-phase output. Direct welding of the three-phase capacitor core ends and the high-voltage input terminals of the power chips to their corresponding copper foil layers eliminates the contact resistance and loosening risks of traditional bolt / plug-in structures, forming a low-impedance, highly reliable permanent electrical connection, reducing conduction losses and temperature rise.

[0006] Furthermore, the U-phase capacitor cores, V-phase capacitor cores, and W-phase capacitor cores are all placed parallel to each other on the support block, effectively reducing the bus capacitor height and facilitating layout. The three-phase (U, V, W-phase) capacitor cores are directly connected to the power chip via corresponding positive and negative copper foil layers. The positive and negative copper foil layers are routed in parallel, resulting in short paths, low stray inductance, and low losses. Moreover, the U, V, and W-phase capacitor cores are separated, effectively distributing ripple current and ensuring uniform heating of each capacitor core. This effectively improves the heating condition of the capacitor cores, reduces stray inductance and power loss in the capacitor core circuit, and balances the ripple current distribution among the capacitor cores.

[0007] Optionally, the surface of the support block is further provided with a U-phase output copper foil layer welded to the U-phase copper busbar, a V-phase output copper foil layer welded to the V-phase copper busbar, and a W-phase output copper foil layer welded to the W-phase copper busbar. The high-voltage output terminal of the U-phase power chip is welded to the U-phase output copper foil layer, the high-voltage output terminal of the V-phase power chip is welded to the V-phase output copper foil layer, and the high-voltage output terminal of the W-phase power chip is welded to the W-phase output copper foil layer. By adding three-phase output copper foil layers to the surface of the support block, the high-voltage output terminals of each power chip are welded to the corresponding phase copper busbars via the corresponding output copper foil layers, further optimizing the electrical path and layout regularity of the power circuit. The copper foil layer transition welding method for each phase power output can shorten the conductive distance from the output terminal of each power chip to the corresponding phase copper busbar, reduce stray inductance and contact resistance of the output circuit, and improve power transmission efficiency and operational reliability. By integrating multiple copper foil layers for input and output through the support block, a partitioned and modular layout of the electrical connections between the input and output of the three-phase power circuit is achieved, reducing cross-interphase interference and enhancing electromagnetic compatibility performance.

[0008] Optionally, the two ends of the U-phase capacitor core are welded to the U-phase positive copper foil layer and the U-phase negative copper foil layer respectively via U-phase L-shaped copper sheets; the two ends of the V-phase capacitor core are welded to the V-phase positive copper foil layer and the V-phase negative copper foil layer respectively via V-phase L-shaped copper sheets; and the two ends of the W-phase capacitor core are welded to the W-phase positive copper foil layer and the W-phase negative copper foil layer respectively via W-phase L-shaped copper sheets. Using L-shaped copper sheets to weld each phase capacitor core to the corresponding positive and negative copper foil layers allows for adaptation to the installation height and spatial layout of the capacitor cores, achieving a reliable transition connection between each capacitor core and each copper foil layer. Each phase is independently electrically connected using a corresponding L-shaped copper sheet, maintaining a symmetrical layout of the three-phase power circuit, reducing differences in electrical parameters between phases, thereby reducing stray inductance and circulating current interference, and improving the three-phase output balance.

[0009] Optionally, the support block is formed by welding a support plate, an insulating ceramic substrate, and a copper base plate sequentially from top to bottom. The U-phase capacitor core, V-phase capacitor core, and W-phase capacitor core are placed parallel to each other on the support plate. Correspondingly, the aforementioned copper foil layers are also disposed on the support plate. The support block adopts a three-layer composite structure of a support plate, an insulating ceramic substrate, and a copper base plate welded sequentially from top to bottom, which can achieve mechanical support rigidity while constructing an efficient heat conduction path and reliable electrical insulation isolation. Arranging the three-phase capacitor cores in parallel on the upper support plate can stably support the bus capacitor components, reduce the assembly stress of the components, and improve the overall structural strength and operational reliability. The middle layer insulating ceramic substrate has both high electrical insulation strength and excellent thermal conductivity, which can achieve high-voltage electrical isolation between the power circuit and the grounding base plate, and can also quickly conduct the heat generated by the bus capacitor and the power circuit downwards. The bottom copper base plate can further homogenize heat and enhance external heat dissipation capacity, improve overall heat dissipation efficiency, and suppress temperature rise.

[0010] Optionally, the lower surface of the copper base plate is provided with a heat dissipation structure. Providing a heat dissipation structure on the lower surface of the copper base plate shortens the heat conduction path, reduces thermal resistance, and further increases the effective heat dissipation area. This allows the heat generated by the bus capacitors and power modules to be quickly dissipated to the external environment, significantly improving the efficiency of heat conduction and convection heat transfer, and ensuring that the devices operate within a safe temperature range.

[0011] Optionally, the heat dissipation structure is a heat dissipation pin-fin (i.e., pin-fin). The heat dissipation pin-fin type has the characteristics of low ventilation resistance, high heat exchange efficiency, compact structure, and good heat dissipation uniformity. It can improve heat dissipation capacity without significantly increasing volume and weight, which is conducive to maintaining the high power density and miniaturization advantages of integrated inverter bricks.

[0012] Optionally, the bus capacitor, power module, high-voltage positive copper busbar, high-voltage negative copper busbar, U-phase copper busbar, V-phase copper busbar, W-phase copper busbar, support block, and drive control circuit board are encapsulated into an integrated structure using potting compound. The input connection terminals of the high-voltage positive copper busbar, the high-voltage negative copper busbar, the output connection terminals of the U-phase copper busbar, the V-phase copper busbar, and the W-phase copper busbar, as well as the low-voltage signal terminals on the drive control circuit board, are all located outside the housing of the integrated inverter brick (i.e., extending beyond the housing of the integrated inverter brick). Encapsulating the bus capacitor, power module, various copper busbars, support block, and drive control circuit board into an integrated structure using potting compound eliminates the need for numerous fixing bolts, simplifies the assembly process, and significantly improves the overall structural strength and resistance to vibration and impact. Furthermore, it prevents the influence of external environments such as salt spray, moisture, and dust, eliminates the need for housing sealing design and related cavity airtightness testing requirements, and adapts to the complex operating environment of vehicles.

[0013] Optionally, when estimating the internal temperatures of the U-phase, V-phase, and W-phase capacitor cores, the temperatures measured by the temperature sensors on the drive control circuit board are used as the surface temperatures of the U-phase, V-phase, and W-phase capacitor cores, respectively. After the drive control circuit board and bus capacitors are fully encapsulated, the temperatures measured by the temperature sensors on the drive control circuit board are approximately equal to the temperature of the entire integrated inverter brick encapsulation material, and also equal to the surface temperatures of the capacitor cores. When estimating the internal temperatures of each capacitor core of the bus capacitors, the temperatures measured by these temperature sensors are used as the surface temperatures of each capacitor core. Combined with the thermal resistance of the capacitor cores and the losses caused by ripple current, the internal temperatures of the capacitor cores can be calculated, eliminating the need to add temperature sensors to the capacitor core surfaces and reducing costs.

[0014] Secondly, the present invention provides a motor control system, which includes the aforementioned integrated inverter brick.

[0015] Thirdly, the present invention provides a vehicle that includes the above-described motor control system. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the integrated inverter brick in an embodiment of the present invention.

[0017] Figure 2 This is a schematic diagram of the electrical principle of the bus capacitor and power module in an embodiment of the present invention.

[0018] Figure 3 This is a schematic diagram showing the relationship between the bus capacitor, power module, and support block in an embodiment of the present invention.

[0019] Figure 4 This is a schematic diagram of the drive control circuit board with potting compound attached in an embodiment of the present invention. Detailed Implementation

[0020] To gain a more detailed understanding of the features and technical content of the embodiments of the present invention, the implementation of the embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The accompanying drawings are for reference and illustration only and are not intended to limit the embodiments of the present invention.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing embodiments of the invention only and is not intended to limit the invention.

[0022] In the following description, references are made to “some embodiments,” which describe a subset of all possible embodiments. However, it is understood that “some embodiments” may be the same subset or different subsets of all possible embodiments and may be combined with each other without conflict.

[0023] like Figures 1 to 4As shown, the integrated inverter brick in this embodiment of the invention includes a bus capacitor 1, a power module 2, a high-voltage positive copper busbar 3, a high-voltage negative copper busbar 4, a U-phase copper busbar 5, a V-phase copper busbar 6, a W-phase copper busbar 7, a support block 8, and a drive control circuit board 9. The power module 2 has a U-phase power chip 21, a V-phase power chip 22, and a W-phase power chip 23 whose control terminals are electrically connected (e.g., soldered) to the drive control circuit board 9. The high-voltage output terminal of the U-phase power chip 21 is electrically connected to the U-phase copper busbar 5, the high-voltage output terminal of the V-phase power chip 22 is electrically connected to the V-phase copper busbar 6, and the high-voltage output terminal of the W-phase power chip 23 is electrically connected to the W-phase copper busbar 7. The upper surface of the support block 8 is provided with U-phase positive copper foil layers 81, V-phase positive copper foil layers 84, and W-phase positive copper foil layers 87 soldered to the high-voltage positive copper busbar 3, and U-phase negative copper foil layers 82, V-phase negative copper foil layers 85, and W-phase negative copper foil layers 88 soldered to the high-voltage negative copper busbar 4. The bus capacitor 1 includes a U-phase capacitor core 11, a V-phase capacitor core 12, and a W-phase capacitor core 13, all placed parallel to each other on the support block 8. One end of the U-phase capacitor core 11 is soldered to the U-phase positive copper foil layer 81, and the other end is soldered to the U-phase negative copper foil layer 82. One high-voltage input terminal of the U-phase power chip 21 is soldered to the U-phase positive copper foil layer 81, and the other high-voltage input terminal of the U-phase power chip 21 is soldered to the U-phase negative copper foil layer 82. One end of the V-phase capacitor core 12 is soldered to the V-phase positive copper foil layer 84, and the other end is soldered to the V-phase negative copper foil layer 85. One high-voltage input terminal of the V-phase power chip 22 is soldered to the V-phase positive copper foil layer 84, and the other high-voltage input terminal of the V-phase power chip 22 is soldered to the V-phase negative copper foil layer 85. One end of the W-phase capacitor core 13 is soldered to the W-phase positive copper foil layer 87, and the other end of the W-phase capacitor core 13 is soldered to the W-phase negative copper foil layer 88. One high-voltage input terminal of the W-phase power chip 23 is soldered to the W-phase positive copper foil layer 87, and the other high-voltage input terminal of the W-phase power chip 23 is soldered to the W-phase negative copper foil layer 88.

[0024] In some embodiments, the U-phase capacitor core 11, V-phase capacitor core 12, and W-phase capacitor core 13 are cylindrical and horizontally placed parallel to each other on the support block 8. Since the cylinder has a certain radius, L-shaped copper sheets can be designed for bridging. Therefore, the two ends of the U-phase capacitor core 11 are respectively welded to the U-phase positive copper foil layer 81 and the U-phase negative copper foil layer 82 through U-phase L-shaped copper sheets 101. That is, one end of the U-phase capacitor core 11 is welded to the vertical part of a U-phase L-shaped copper sheet 101, and the horizontal part of the U-phase L-shaped copper sheet 101 is welded to the U-phase positive copper foil layer 81. The other end of the U-phase capacitor core 11 is welded to the vertical part of another U-phase L-shaped copper sheet 101, and the horizontal part of the U-phase L-shaped copper sheet 101 is welded to the U-phase negative copper foil layer 82. The two ends of the V-phase capacitor core 12 are respectively welded to the V-phase positive copper foil layer 84 and the V-phase negative copper foil layer 85 through the V-phase L-shaped copper sheet 102. That is, one end of the V-phase capacitor core 12 is welded to the vertical part of a V-phase L-shaped copper sheet 102, and the horizontal part of the V-phase L-shaped copper sheet 102 is welded to the V-phase positive copper foil layer 84. The other end of the V-phase capacitor core 12 is welded to the vertical part of another V-phase L-shaped copper sheet 102, and the horizontal part of the V-phase L-shaped copper sheet 102 is welded to the V-phase negative copper foil layer 85. The two ends of the W-phase capacitor core 13 are respectively welded to the W-phase positive copper foil layer 87 and the W-phase negative copper foil layer 88 through the W-phase L-shaped copper sheet 103. That is, one end of the W-phase capacitor core 13 is welded to the vertical part of a W-phase L-shaped copper sheet 103, and the horizontal part of the W-phase L-shaped copper sheet 103 is welded to the W-phase positive copper foil layer 87. The other end of the W-phase capacitor core 13 is welded to the vertical part of another W-phase L-shaped copper sheet 103, and the horizontal part of the W-phase L-shaped copper sheet 103 is welded to the W-phase negative copper foil layer 88.

[0025] Additionally, the U-phase capacitor core 11, V-phase capacitor core 12, and W-phase capacitor core 13 can also be made into cuboid-like shapes, with no restrictions on specific shape, size, or number. Multiple capacitor cores can be connected in parallel according to capacitance and height requirements. The capacitor cores can be MLCC capacitors, solid-liquid hybrid capacitors, or directly soldered surface-mount capacitors.

[0026] In some embodiments, the surface of the support block 8 is further provided with a U-phase output copper foil layer 83 welded to the U-phase copper busbar 5, a V-phase output copper foil layer 86 welded to the V-phase copper busbar 6, and a W-phase output copper foil layer 89 welded to the W-phase copper busbar 7. The high-voltage output terminal of the U-phase power chip 21 is welded to the U-phase output copper foil layer 83, the high-voltage output terminal of the V-phase power chip 22 is welded to the V-phase output copper foil layer 86, and the high-voltage output terminal of the W-phase power chip 23 is welded to the W-phase output copper foil layer 89. As an example, the U-phase power chip 21, V-phase power chip 22, and W-phase power chip 23 can be IGBTs, or they can be SiC or GaN chips, etc.

[0027] In some embodiments, the support block 8 is formed by welding a support plate 810, an insulating ceramic substrate 811, and a copper base plate 812 sequentially from top to bottom. The U-phase capacitor core 11, V-phase capacitor core 12, and W-phase capacitor core 13 are placed parallel to each other on the support plate 810. The corresponding U-phase power chip 21, V-phase power chip 22, and W-phase power chip 23 are located on the support plate 810.

[0028] In some embodiments, the lower surface of the copper base plate 812 is provided with a heat dissipation structure.

[0029] In some embodiments, the heat dissipation structure is a heat dissipation fin 813. Alternatively, the heat dissipation structure can also be a flat base plate with thermal grease or heat dissipation fins with air cooling, etc. The shape of the heat dissipation fin 813 can be circular, elliptical, or any shape, and the material can be copper or aluminum alloy, etc.

[0030] In some embodiments, the bus capacitor 1, power module 2, high-voltage positive copper busbar 3, high-voltage negative copper busbar 4, U-phase copper busbar 5, V-phase copper busbar 6, W-phase copper busbar 7, support block 8, and drive control circuit board 9 are encapsulated into an integrated structure using potting compound 10. The input connection terminals of the high-voltage positive copper busbar 3, the high-voltage negative copper busbar 4, the output connection terminals of the U-phase copper busbar 5, the V-phase copper busbar 6, and the W-phase copper busbar 7, as well as the low-voltage signal terminals 90 on the drive control circuit board 9, are all located outside the housing of the integrated inverter brick (i.e., extending beyond the housing of the integrated inverter brick and connecting to other electrical components). The bottom of the integrated inverter brick housing is constructed of a copper base plate, the perimeter of the housing can be made of aluminum alloy or rigid plastic, and the top of the housing is a potting cover. As an example, the potting compound 10 can be epoxy resin, silicone, or polyurethane, etc.

[0031] In some embodiments, since a temperature sensor 91 (which is in the prior art and is used to measure the real-time temperature of the drive control circuit board 9) is provided on the drive control circuit board 9, the drive control circuit board 9 and the bus capacitor 1 are encapsulated into a single structure by potting compound 10. When estimating the internal temperature of the U-phase capacitor core, the internal temperature of the V-phase capacitor core, and the internal temperature of the W-phase capacitor core (the estimation method is in the prior art), the temperature measured by the temperature sensor 91 provided on the drive control circuit board 9 can be used as the surface temperature of the U-phase capacitor core, the surface temperature of the V-phase capacitor core, and the surface temperature of the W-phase capacitor core.

[0032] In addition, embodiments of the present invention also provide a motor control system, which includes the aforementioned integrated inverter brick.

[0033] In addition, embodiments of the present invention also provide a vehicle that includes the above-described motor control system.

[0034] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention.

Claims

1. An integrated inverter brick, comprising a bus capacitor (1), a power module (2), a high-voltage positive copper busbar (3), a high-voltage negative copper busbar (4), a U-phase copper busbar (5), a V-phase copper busbar (6), a W-phase copper busbar (7), a support block (8), and a drive control circuit board (9), wherein the power module (2) has a U-phase power chip (21), a V-phase power chip (22), and a W-phase power chip (23) whose control terminals are electrically connected to the drive control circuit board (9), the high-voltage output terminal of the U-phase power chip (21) is electrically connected to the U-phase copper busbar (5), the high-voltage output terminal of the V-phase power chip (22) is electrically connected to the V-phase copper busbar (6), and the high-voltage output terminal of the W-phase power chip (23) is electrically connected to the W-phase copper busbar (7); characterized in that: The upper surface of the support block (8) is provided with a U-phase positive copper foil layer (81), a V-phase positive copper foil layer (84), and a W-phase positive copper foil layer (87) welded to the high-voltage positive copper busbar (3), and a U-phase negative copper foil layer (82), a V-phase negative copper foil layer (85), and a W-phase negative copper foil layer (88) welded to the high-voltage negative copper busbar (4). The bus capacitor (1) includes a U-phase capacitor core (11), a V-phase capacitor core (12) and a W-phase capacitor core (13) placed parallel to the support block (8). The two ends of the U-phase capacitor core (11) and the two high-voltage input terminals of the U-phase power chip (21) are respectively welded to the U-phase positive copper foil layer (81) and the U-phase negative copper foil layer (82). The two ends of the V-phase capacitor core (12) and the two high-voltage input terminals of the V-phase power chip (22) are respectively welded to the V-phase positive copper foil layer (84) and the V-phase negative copper foil layer (85). The two ends of the W-phase capacitor core (13) and the two high-voltage input terminals of the W-phase power chip (23) are respectively welded to the W-phase positive copper foil layer (87) and the W-phase negative copper foil layer (88).

2. The integrated inverter brick according to claim 1, characterized in that: The surface of the support block (8) is also provided with a U-phase output copper foil layer (83) welded to the U-phase copper busbar (5), a V-phase output copper foil layer (86) welded to the V-phase copper busbar (6), and a W-phase output copper foil layer (89) welded to the W-phase copper busbar (7). The high voltage output terminal of the U-phase power chip (21) is welded to the U-phase output copper foil layer (83), the high voltage output terminal of the V-phase power chip (22) is welded to the V-phase output copper foil layer (86), and the high voltage output terminal of the W-phase power chip (23) is welded to the W-phase output copper foil layer (89).

3. The integrated inverter brick according to claim 1, characterized in that: The two ends of the U-phase capacitor core (11) are respectively welded to the U-phase positive copper foil layer (81) and the U-phase negative copper foil layer (82) through the U-phase L-shaped copper sheet (101). The two ends of the V-phase capacitor core (12) are respectively welded to the V-phase positive copper foil layer (84) and the V-phase negative copper foil layer (85) through the V-phase L-shaped copper sheet (102). The two ends of the W-phase capacitor core (13) are respectively welded to the W-phase positive copper foil layer (87) and the W-phase negative copper foil layer (88) through the W-phase L-shaped copper sheet (103).

4. The integrated inverter brick according to claim 1, characterized in that: The support block (8) is formed by welding a support plate (810), an insulating ceramic substrate (811), and a copper base plate (812) from top to bottom. The U-phase capacitor core (11), V-phase capacitor core (12), and W-phase capacitor core (13) are placed parallel to each other on the support plate (810).

5. The integrated inverter brick according to claim 4, characterized in that: The lower surface of the copper base plate (812) is provided with a heat dissipation structure.

6. The integrated inverter brick according to claim 5, characterized in that: The heat dissipation structure is a heat dissipation pin fin (813).

7. The integrated inverter brick according to any one of claims 1 to 6, characterized in that: The bus capacitor (1), power module (2), high voltage positive copper busbar (3), high voltage negative copper busbar (4), U-phase copper busbar (5), V-phase copper busbar (6), W-phase copper busbar (7), support block (8) and drive control circuit board (9) are encapsulated with potting compound (10) to form an integrated structure. The input connection terminal of the high voltage positive copper busbar (3), the input connection terminal of the high voltage negative copper busbar (4), the output connection terminal of the U-phase copper busbar (5), the output connection terminal of the V-phase copper busbar (6), the output connection terminal of the W-phase copper busbar (7) and the low voltage signal terminal (90) on the drive control circuit board (9) are all located outside the housing of the integrated inverter brick.

8. The integrated inverter brick according to claim 7, characterized in that: When estimating the internal temperature of the U-phase capacitor core, the internal temperature of the V-phase capacitor core, and the internal temperature of the W-phase capacitor core, the temperature measured by the temperature sensor (91) set on the drive control circuit board (9) is used as the surface temperature of the U-phase capacitor core, the surface temperature of the V-phase capacitor core, and the surface temperature of the W-phase capacitor core.

9. A motor control system, characterized in that: Including the integrated inverter brick as described in any one of claims 1 to 8.

10. A vehicle, characterized in that: Includes the motor control system as described in claim 9.

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