Plasma device

Abstract

This disclosure provides a plasma device, relating to the field of semiconductor equipment technology. The plasma device includes: a dielectric cylinder; a first cover plate covering the upper part of the dielectric cylinder, forming a plasma generation space together with the dielectric cylinder; a coil disposed on the outside of the dielectric cylinder for exciting process gas in the plasma generation space into plasma; a housing located below the dielectric cylinder; a second cover plate connected to the lower part of the dielectric cylinder and covering the upper part of the housing, forming a workpiece processing space together with the housing; a grid located between the plasma generation space and the workpiece processing space; a drive device mounted on the second cover plate and fixedly connected to the coil to drive the coil to move axially along the dielectric cylinder to adjust the position of the generated plasma in the plasma generation space; and a control module communicatively connected to the drive device for controlling the drive device to drive the coil to rise or fall.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor equipment technology, and more particularly to a plasma device. Background Technology

[0002] Plasma equipment based on remote plasma technology is an important process device in semiconductor chip manufacturing. Remote plasma technology can generate plasma in a region far from the wafer. When the plasma passes through a grid, the grid can eliminate most of the ions in the plasma to reduce the bombardment of the wafer by the ions. Meanwhile, the free radicals in the plasma, which are now electrically neutral, continue to move to the wafer surface and carry out chemical reactions with the wafer surface to complete the surface treatment. Summary of the Invention

[0003] This disclosure provides a plasma device.

[0004] As one aspect of this disclosure, an embodiment provides a plasma device, comprising: a dielectric cylinder; a first cover plate covering the upper part of the dielectric cylinder, forming a plasma generation space together with the dielectric cylinder; a coil disposed on the outside of the dielectric cylinder for exciting process gas in the plasma generation space into plasma; a housing located below the dielectric cylinder; a second cover plate connected to the lower part of the dielectric cylinder and covering the upper part of the housing, forming a workpiece processing space together with the housing; a grid located between the plasma generation space and the workpiece processing space; a drive device mounted on the second cover plate and fixedly connected to the coil to drive the coil to move axially along the dielectric cylinder to adjust the position of the generated plasma in the plasma generation space; and a control module communicatively connected to the drive device for controlling the drive device to drive the coil to rise or fall.

[0005] In some embodiments, the driving device is a plurality of such devices, and the plurality of driving devices are spaced apart and uniformly distributed along the circumference of the medium cylinder.

[0006] In some embodiments, the driving device includes: a mounting bracket fixedly connected to the second cover plate; and a driving member mounted on the mounting bracket and fixedly connected to the coil.

[0007] In some embodiments, the driving element includes a drive motor; the driving device further includes a transmission assembly connected between the driving element and the coil, for converting the rotational motion output by the drive motor into linear motion.

[0008] In some embodiments, the transmission assembly includes: a lead screw connected to the drive motor; the axis of the lead screw is parallel to the axis of the medium cylinder; and a nut cooperating with the lead screw and fixedly connected to the coil.

[0009] In some embodiments, the mounting bracket includes: a first mounting plate extending axially along the medium cylinder; the bottom of the first mounting plate being fixedly connected to the second cover plate; a second mounting plate connected to the top of the first mounting plate and folded inward relative to the first mounting plate; and the drive motor being mounted on the second mounting plate.

[0010] In some embodiments, a slider is provided outside the nut, and a rolling bearing is provided between the nut and the slider; the slider is detachably connected to the coil.

[0011] In some embodiments, the first mounting plate is further provided with a slide groove, and the slider is slidably engaged with the slide groove.

[0012] In some embodiments, the mounting bracket further includes a third mounting plate, which is connected to the inner side of the first mounting plate and fixedly connected to the second cover plate.

[0013] In some embodiments, the mounting bracket further includes a reinforcing plate connected to the inner side of the first mounting plate and to the lower side of the second mounting plate.

[0014] In some embodiments, the distance between the coil and the workpiece located in the workpiece processing space along the axial direction of the medium cylinder is greater than or equal to 30 mm and less than or equal to 100 mm.

[0015] The plasma device provided in this embodiment can adjust the position of the plasma generated and adjust the spatial distribution of the plasma, thereby affecting the etching rate, etching uniformity, and anisotropy.

[0016] The above overview is for illustrative purposes only and is not intended to be limiting in any way. Further aspects, embodiments, and features of this disclosure will become readily apparent from the accompanying drawings and the following detailed description, in addition to the illustrative aspects, embodiments, and features described above. Attached Figure Description

[0017] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this disclosure and should not be construed as limiting the scope of this disclosure.

[0018] Figure 1A schematic diagram of the structure of a plasma device according to an embodiment of the present disclosure is shown.

[0019] Explanation of reference numerals in the attached drawings: 10, first cover plate; 20, dielectric cylinder; 21, plasma generation space; 30, coil; 31, insulating support; 40, second cover plate; 50, housing; 51, bearing device; 52, workpiece processing space; 60, grid; 70, driving device; 71, drive motor; 72, lead screw; 73, nut; 74, mounting bracket; 741, first mounting plate; 742, second mounting plate; 743, third mounting plate; 90, workpiece. Detailed Implementation

[0020] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this disclosure. Therefore, the drawings and description are to be considered exemplary in nature and not restrictive.

[0021] During plasma etching, a thin "sheath" forms on the surface of the workpiece. The electric field within the sheath is oriented almost perpendicular to the wafer surface.

[0022] Anisotropy refers to the difference in etching rate in different directions. In ideal anisotropic etching, the etching rate in the vertical direction (depth direction, i.e., axial direction) is much greater than the etching rate in the horizontal direction (lateral direction), thus enabling the etching of patterns with steep sidewalls and precise linewidth.

[0023] In related technologies, the location of plasma generation directly affects the electric field and potential distribution of the sheath. A more uniform potential distribution in the sheath results in a more uniform energy distribution of the ions and better etching uniformity. A stronger electric field in the sheath leads to a more perpendicular ion incident direction and better anisotropy. Balancing the electric field strength and potential uniformity of the sheath is one of the important research topics.

[0024] This embodiment provides a plasma device. The control module can control the drive device to drive the coil to move along the axial direction of the dielectric cylinder, so as to flexibly adjust the position of the generated plasma to meet the anisotropy requirement or the process uniformity requirement according to the current needs. The smaller the distance between the coil and the workpiece, the lower the position of the generated plasma, the stronger the electric field in the sheath, the more perpendicular the incident direction of the ions, and the better the anisotropy. The larger the distance between the coil and the workpiece, the higher the position of the generated plasma, the more uniform the potential distribution in the sheath, and the better the uniformity of the plasma concentration on the workpiece surface.

[0025] The structure, function, and implementation process of the plasma device provided in this embodiment will be illustrated below with reference to the accompanying drawings.

[0026] like Figure 1 As shown, the plasma equipment provided in this embodiment includes: a dielectric cylinder 20; a first cover plate 10, which covers the upper part of the dielectric cylinder 20 and together with the dielectric cylinder 20 forms a plasma generation space 21; a coil 30, which is disposed on the outside of the dielectric cylinder 20 and is used to excite the process gas in the plasma generation space 21 into plasma; a housing 50, which is located below the dielectric cylinder 20; a second cover plate 40, which is connected to the lower part of the dielectric cylinder 20 and covers the upper part of the housing 50, together with the housing 50 forming a workpiece processing space 52; a grid 60, which is located between the plasma generation space 21 and the workpiece processing space 52; a drive device 70, which is mounted on the second cover plate 40 and fixedly connected to the coil 30, so as to drive the coil 30 to move along the axial direction of the dielectric cylinder 20 to adjust the position of the plasma generated in the plasma generation space 21; and a control module, which is communicatively connected to the drive device 70 and is used to control the drive device 70 to drive the coil 30 to rise or fall.

[0027] The plasma equipment adopts a vertical layout, and its internal space includes a plasma generation space 21 and a workpiece processing space 52 from top to bottom.

[0028] The dielectric cylinder 20 can be made of high-purity quartz, possessing excellent insulation, high-temperature resistance, and chemical stability, making it suitable for high-frequency electromagnetic field environments. The dielectric cylinder 20 can be cylindrical. The cylinder surface is smooth to reduce gas turbulence and contaminant accumulation. The dielectric cylinder 20 serves as the sidewall of the plasma generation space 21, isolating the coil 30 from the internal process gas while allowing electromagnetic field penetration to excite the process gas and generate plasma.

[0029] The first cover plate 10 can be a circular plate, covering the upper end of the dielectric cylinder 20 to form the plasma generation space 21. A sealing ring is provided between the first cover plate 10 and the dielectric cylinder 20 to ensure the airtightness of the plasma generation space 21. The first cover plate 10 can be made of metal to facilitate the formation of cooling channels within it. A protective layer can be provided on the lower surface of the first cover plate 10 facing the plasma generation space 21 to prevent it from being corroded by process gases or plasma.

[0030] The first cover plate 10 has a process gas inlet at its center, which is connected to a process gas supply device for introducing process gases, such as a mixture of argon, oxygen, or nitrogen. A flow meter and regulating valve can be installed at the process gas inlet to precisely control the flow rate of the process gas.

[0031] Coil 30 can be a copper RF coil. It is wound around the outer wall of dielectric cylinder 20 in a spiral shape. Coil 30 is coaxially arranged with dielectric cylinder 20. The two ends of coil 30 are connected to an RF power supply. When coil 30 is energized, it generates an alternating electromagnetic field that penetrates the wall of dielectric cylinder 20 and ionizes the process gas in plasma generation space 21 into plasma.

[0032] A Faraday cage may be installed between the coil 30 and the dielectric cylinder 20. The Faraday cage, made of a conductive material such as stainless steel or aluminum, is a cylindrical cover with multiple axially extending gaps. These axial gaps are uniformly distributed along the circumference of the dielectric cylinder 20. The primary function of the Faraday cage is to shield against electromagnetic interference.

[0033] The housing 50 is connected to the second cover plate 40, forming a relatively enclosed workpiece processing space 52 to ensure that the processing is not affected by external contamination. The housing 50 has side walls and a bottom wall connected to the bottom of the side walls. One side wall of the housing 50 may be provided with an observation window. An exhaust port may also be provided on either the side wall or the bottom wall of the housing 50, and the exhaust port is connected to a vacuum pump. A support device 51 for placing the workpiece 90 may also be provided inside the housing 50.

[0034] The second cover plate 40 is installed on the top of the housing 50. The second cover plate 40 is also connected to the bottom of the medium cylinder 20. A sealing ring is provided between the second cover plate 40 and the medium cylinder 20, and a sealing ring is also provided between the second cover plate 40 and the housing 50.

[0035] The second cover plate 40 and the housing 50 can be made of lightweight and corrosion-resistant metal materials to achieve high mechanical strength. However, the materials of the first cover plate 10, the second cover plate 40, and the housing 50 are not limited to these; they can be selected according to actual needs. Additionally, a cooling channel can be provided within the second cover plate 40. The second cover plate 40 and the housing 50 can be designed separately or as a single unit.

[0036] The grid 60 is a mesh plate. The grid 60 has a plurality of evenly distributed through holes. The grid 60 is typically fixed at the connection between the plasma generation space 21 and the workpiece processing space 52. For example, the grid 60 is connected to the lower surface of the second cover plate 40. The opening area of ​​the grid 60 needs to cover the central hole of the second cover plate 40. The grid 60 is used to allow free radicals and small molecules to pass through while blocking large particles or high-energy ions in the plasma.

[0037] The drive unit 70 can be detachably connected to the second cover plate 40. For example, the drive unit 70 is detachably connected to the second cover plate 40 by a plurality of screws. For instance, a through hole is provided in the drive unit 70, and a blind hole with internal threads is provided in the second cover plate 40; the screws pass through the through hole and engage with the threaded hole.

[0038] In some examples, the drive unit 70 includes a motor and a transmission mechanism for transmitting the driving force of the motor to the coil 30 to drive the coil 30 to move axially along the medium cylinder 20. A control module may be electrically connected to the motor to send control signals to it.

[0039] The location in the plasma generation space 21 where plasma is generated can refer to the region in the plasma generation space 21 that corresponds to the coil 30. For example, the orthographic projection of the coil 30 on the side wall of the plasma generation space 21 coincides with the orthographic projection of the location where plasma is generated on the side wall of the plasma generation space 21.

[0040] The smaller the distance between coil 30 and workpiece 90, the lower the position of plasma generation, the stronger the electric field in the sheath, the more perpendicular the incident direction of ions, and the better the anisotropy.

[0041] The greater the distance between coil 30 and workpiece 90, the higher the position of plasma generation, the more uniform the potential distribution in the sheath, and the better the uniformity of plasma concentration on the surface of workpiece 90.

[0042] In other examples, the drive unit 70 may include a cylinder with a piston fixedly connected to the coil 30 to drive the coil 30 to move axially along the dielectric cylinder 20, positioning it at the plasma generation space 21 to generate plasma. The control module sends control signals to the control valve configured on the cylinder.

[0043] The control module may include a controller, electronic device, or hardware device with control functions.

[0044] The plasma equipment provided in this embodiment has a control module that can control the drive device 70 to drive the coil 30 to move along the axial direction of the dielectric cylinder 20, so as to adjust the position of the plasma generated, adjust the etching uniformity, meet the process uniformity requirements, or adjust the anisotropy and etching rate.

[0045] In some embodiments, there are multiple drive devices 70, and the multiple drive devices 70 are spaced apart and evenly distributed along the circumferential direction of the medium cylinder 20.

[0046] For example, there may be two drive devices 70, which are symmetrically distributed about the central axis of the coil 30. Alternatively, there may be three or more drive devices 70, which are spaced apart and evenly distributed along the circumference of the dielectric cylinder 20.

[0047] The control module controls multiple drive devices 70 to synchronously drive the coil 30 along the axial direction of the dielectric cylinder 20. This prevents the coil 30 from becoming skewed due to uneven distribution of driving force, ensuring synchronous movement of the coil 30 throughout its circumference. This contributes to generating a uniform axial plasma distribution, improving the uniformity and symmetry of the plasma distribution, and thus helping to ensure the uniformity of the surface treatment of the workpiece 90. Multiple drive devices 70 can share the load, reducing stress concentration from single-point drive, and improving the service life of the drive devices 70 and the smoothness of the coil 30's movement.

[0048] In some embodiments, the drive device 70 includes: a mounting bracket 74 fixedly connected to the second cover plate 40; and a drive element mounted on the mounting bracket 74 and fixedly connected to the coil 30.

[0049] The mounting bracket 74 is detachably connected to the second cover plate 40. For example, the mounting bracket 74 can be fastened to the second cover plate 40 with multiple screws.

[0050] The drive unit is detachably connected to the mounting bracket 74, and the drive unit can be fastened to the mounting bracket 74 by multiple screws or bolts or other fasteners.

[0051] The drive unit and coil 30 can be welded and fixed or detachably connected, depending on the actual needs.

[0052] The drive unit is fixedly connected to the second cover plate 40 by the mounting bracket 74, which makes the installation position of the drive unit more flexible, reduces the installation difficulty of the drive unit, and facilitates quick replacement or maintenance of the drive unit, thus providing good maintainability.

[0053] In other embodiments, the drive unit can also be directly mounted onto the second cover plate 40.

[0054] In some embodiments, the drive element includes a drive motor 71. The drive device 70 further includes a transmission assembly connected between the drive element and the coil 30 for converting the rotational motion output by the drive motor 71 into linear motion.

[0055] The drive motor 71 can be a stepper motor or a servo motor, which usually has high-precision speed and torque control capabilities. Together with the transmission components, it can achieve fine adjustment of the coil 30, ensuring that the coil 30 moves smoothly and at a constant speed during the motion, and facilitating automatic control.

[0056] The transmission components can take the form of gears and racks, lead screws, connecting rods, etc., which makes the plasma equipment have higher structural stability and transmission efficiency.

[0057] In some examples, the transmission assembly includes: a lead screw 72 connected to a drive motor 71; and a nut 73 cooperating with the lead screw 72 and fixedly connected to the coil 30. The axial direction of the lead screw 72 is parallel to the axial direction of the medium cylinder 20. The nut 73 is coaxially arranged with the lead screw 72.

[0058] The cooperation between the lead screw 72 and the nut 73 ensures that the rotational motion output by the drive motor 71 is accurately converted into the linear motion of the coil 30, and has high transmission accuracy and repeatability. It can usually achieve relatively precise axial motion, thereby achieving high-precision and stable control of the position of the coil 30.

[0059] Nut 73 is fixedly connected to coil 30. For example, nut 73 is fixedly connected to the insulating bracket 31 of coil 30. Exemplarily, nut 73 is welded to the insulating bracket 31 of coil 30, or fastened by screws, bolts, or other fasteners. This ensures that there is no slippage or jumping between coil 30 and drive motor 71 during movement, improving response speed and smoothness of movement. Combined with the structure of lead screw 72 and nut 73, torque and force can be effectively transmitted, thereby ensuring the reliability and stability of coil 30 during movement.

[0060] Furthermore, the transmission method of the lead screw 72 and nut 73 results in relatively low friction loss during transmission, especially when using the ball screw 72, which has high transmission efficiency. The structure of the lead screw 72 and nut 73 is relatively compact, which facilitates modular arrangement in the drive unit 70 and makes the structure of the drive unit 70 more compact.

[0061] In some examples, the mounting bracket 74 includes: a first mounting plate 741 extending axially along the medium cylinder 20; the bottom of the first mounting plate 741 being fixedly connected to the second cover plate 40; a second mounting plate 742 connected to the top of the first mounting plate 741 and folded inward relative to the first mounting plate 741; and a drive motor 71 mounted on the second mounting plate 742.

[0062] The dimensions of the first mounting plate 741 and the second mounting plate 742 can be set according to actual needs.

[0063] The first mounting plate 741 is parallel to the axial direction of the medium cylinder 20, which helps to maintain the axial symmetry and structural alignment of the mounting bracket 74.

[0064] The second mounting plate 742 is set perpendicular to the first mounting plate 741 and connected to the inner side of the first mounting plate 741. This facilitates the connection between the nut 73 and the insulating bracket 31 of the coil 30, reduces the length and complexity of the transmission path, reduces the overall lateral space occupied by the drive device 70, facilitates miniaturization, improves equipment space utilization, and enhances the structural strength and torsional rigidity of the entire mounting bracket 74, preventing deformation or loosening of the mounting bracket 74 due to changes in the load of the drive motor 71.

[0065] The first mounting plate 741 and the second mounting plate 742 can be installed as a single unit, or fixed by welding, or fastened together by fasteners such as screws or bolts.

[0066] The bottom of the first mounting plate 741 can be welded and fixed to the second cover plate 40, or fastened to the second cover plate 40 with screws to form a stable support structure and improve the overall installation stability of the drive device 70.

[0067] In a scenario where multiple drive devices 70 are distributed circumferentially along the dielectric cylinder 20, the mounting bracket 74 formed by the first mounting plate 741 and the second mounting plate 742 can be designed in a standardized manner, which is suitable for scenarios where multiple drive devices 70 operate synchronously, and is beneficial to improving the uniformity of plasma distribution and process consistency.

[0068] In some examples, a slider is provided outside the nut 73, and a rolling bearing is provided between the nut 73 and the slider; the slider is detachably connected to the coil 30.

[0069] The slider provides a guide support for the coil 30, enabling the coil 30 to maintain axial movement during operation and preventing lateral offset or rotation, thereby ensuring the accurate relative positional relationship between the coil 30 and the medium cylinder 20.

[0070] A rolling bearing is provided between the nut 73 and the slider. The rolling bearing can provide a low-friction, high-load-bearing transmission interface between the nut 73 and the slider, making the movement of the coil 30 smoother, reducing positional offset or motion obstruction caused by friction, improving the stability and accuracy of the axial movement of the coil 30, reducing energy loss during transmission, and improving the overall transmission efficiency of the drive device 70.

[0071] The slider is detachably connected to the insulating bracket 31 of the coil 30, allowing the coil 30 or transmission components to be quickly and easily detached when maintenance or replacement is required, reducing downtime and maintenance difficulty. For example, the slider can be detachably connected to the insulating bracket 31 by fasteners such as bolts or screws, or the slider can be engaged with the insulating bracket 31 by a dovetail groove.

[0072] In other instances, the slider can also be integrated with the coil 30, and correspondingly, the slider is coupled to the insulating support 31 via a rolling bearing.

[0073] In some examples, the first mounting plate 741 is also provided with a groove, and the slider slides in cooperation with the groove.

[0074] The groove provides axial sliding guidance for the slider, which can effectively limit the degree of freedom of the coil 30, so that the coil 30 can only be displaced in the axial direction. This ensures that the coil 30 always remains axially aligned with the medium cylinder 20 during the movement, and avoids affecting the uniform distribution of plasma or the processing effect of the workpiece 90 due to lateral displacement.

[0075] Limiting structures can also be provided in the slide. The upper limiting structure is used to limit the extreme position of the slider's upward movement, thereby limiting the stroke of the coil 30 upward movement; for example, the side wall of the slide closer to the second mounting plate 742 can serve as the upper limiting structure.

[0076] The lower limiting structure is used to limit the extreme position of the slider's downward movement, thereby limiting the downward travel of the coil 30; for example, the side wall of the groove closer to the second cover plate 40 can serve as the lower limiting structure.

[0077] Alternatively, a proximity switch may be installed on the side wall of the slide closer to the second mounting plate 742, and also on the side wall of the slide closer to the second cover plate 40.

[0078] In some embodiments, the mounting bracket 74 further includes a third mounting plate 743, connected to the inner side of the first mounting plate 741 and fixedly connected to the second cover plate 40. The third mounting plate 743 is perpendicular to the first mounting plate 741 and parallel to the second cover plate 40. The lower end of the lead screw 72 can engage with the third mounting plate 743 via a rolling bearing.

[0079] The third mounting plate 743 is connected to the first mounting plate 741 and the second cover plate 40 to form a more stable structural frame, which makes the installation positions of components such as transmission components, coils 30, and motors more reasonable; it can also improve the overall rigidity and strength of the mounting bracket 74 under stress, prevent the mounting bracket 74 from deforming or loosening due to stress, and improve the safety and life of the drive device 70.

[0080] In some embodiments, the mounting bracket 74 further includes a reinforcing plate connected to the inner side of the first mounting plate 741 and the lower side of the second mounting plate 742. The reinforcing plate connects and reinforces the first mounting plate 741 and the second mounting plate 742, thereby enhancing the structural strength and stability of the entire mounting bracket 74 under transmission load.

[0081] In some examples, the reinforcing plate is provided with clearance holes for the lead screw 72 to pass through, so as not to interfere with the transmission of motion. In other examples, the reinforcing plate is located on at least one side of the lead screw 72.

[0082] The reinforcing plate is an inclined plate, and the included angle between the reinforcing plate and the first mounting plate 741 can be greater than or equal to 30° and less than or equal to 60°. For example, the included angle between the reinforcing plate and the first mounting plate 741 can be 45°.

[0083] In addition, a reinforcing plate may be provided between the first mounting plate 741 and the third mounting plate 743 to further improve the structural strength and stability of the mounting bracket 74.

[0084] In some embodiments, along the axial direction of the dielectric cylinder 20, the distance between the coil 30 and the workpiece 90 located in the workpiece processing space 52 is greater than or equal to 30 mm and less than or equal to 100 mm. This helps to balance electromagnetic field distribution and plasma coupling effect, thereby improving both process efficiency and workpiece 90 processing quality.

[0085] The distance between coil 30 and workpiece 90 is a core geometric parameter balancing etching uniformity, anisotropy, and etching rate. It generates complex chain reactions by influencing plasma generation, transport, and ion energy. Therefore, the distance between coil 30 and workpiece 90 can be precisely optimized and adjusted according to the etching material and process objectives.

[0086] For example, the control module can pre-store the spacing corresponding to various etching materials under multiple process objectives, where the spacing is the distance between the coil 30 and the workpiece 90. In the application scenario, the control module determines the target spacing based on the current etching material and process objective, and controls the drive device 70 to drive the coil 30 up or down until the distance between the coil 30 and the workpiece 90 reaches the target spacing.

[0087] Optionally, a position sensor can be provided at the bottom of the insulating support 31 of the coil 30. This position sensor is used to detect the distance between the coil 30 and the second cover plate 40, thereby obtaining the distance between the coil 30 and the workpiece 90. The position sensor is electrically connected to the control module, enabling the control module to control the drive device 70 based on the target distance and the detection result of the position sensor, thereby improving the accuracy of adjusting the position of the coil 30.

[0088] Other configurations of the plasma device in the above embodiments can be derived from various technical solutions now and in the future known to those skilled in the art, and will not be described in detail here.

[0089] In the description of this specification, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0090] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this disclosure, "multiple" means two or more, unless otherwise explicitly specified.

[0091] In this disclosure, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0092] In this disclosure, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0093] The foregoing disclosure provides many different implementations or examples for carrying out different structures of this disclosure. To simplify the disclosure, specific examples of components and arrangements have been described above. Of course, these are merely examples and are not intended to limit the scope of this disclosure. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0094] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this disclosure, and these should all be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A plasma device, characterized in that, include: Medium cylinder; The first cover plate is installed on the upper part of the dielectric cylinder, and together with the dielectric cylinder, they form a plasma generation space; A coil, disposed on the outside of the dielectric cylinder, is used to excite the process gas in the plasma generation space into plasma; The housing is located below the medium cylinder; The second cover plate is connected to the lower part of the medium cylinder and covers the upper part of the box body, together with the box body forming a workpiece processing space; A grid is located between the plasma generation space and the workpiece processing space; A driving device is mounted on the second cover plate and fixedly connected to the coil to drive the coil to move axially along the medium cylinder in order to adjust the position of the plasma generated in the plasma generation space. The control module is communicatively connected to the drive device and is used to control the drive device to drive the coil to rise or fall.

2. The plasma device according to claim 1, characterized in that, The driving device is a plurality of such devices, and the plurality of driving devices are spaced apart and evenly distributed along the circumference of the medium cylinder.

3. The plasma device according to claim 1, characterized in that, The driving device includes: The mounting bracket is fixedly connected to the second cover plate; The driving component is mounted on the mounting bracket and is fixedly connected to the coil.

4. The plasma device according to claim 3, characterized in that, The driving component includes a drive motor; The drive device further includes: A transmission assembly, connected between the drive element and the coil, is used to convert the rotational motion output by the drive motor into linear motion.

5. The plasma device according to claim 4, characterized in that, The transmission assembly includes: A lead screw is connected to the drive motor; the axis of the lead screw is parallel to the axis of the medium cylinder. The nut engages with the lead screw and is fixedly connected to the coil.

6. The plasma device according to claim 5, characterized in that, The mounting bracket includes: A first mounting plate extends axially along the medium cylinder; the bottom of the first mounting plate is fixedly connected to the second cover plate. A second mounting plate is connected to the top of the first mounting plate and folded inward relative to the first mounting plate; the drive motor is mounted on the second mounting plate.

7. The plasma device according to claim 6, characterized in that, A slider is provided outside the nut, and a rolling bearing is provided between the nut and the slider; The slider is detachably connected to the coil.

8. The plasma device according to claim 7, characterized in that, The first mounting plate is also provided with a sliding groove, and the slider is also slidably engaged with the sliding groove.

9. The plasma device according to claim 6, characterized in that, The mounting bracket also includes: The third mounting plate is connected to the inner side of the first mounting plate and is fixedly connected to the second cover plate; And / or, A reinforcing plate is connected to the inner side of the first mounting plate and to the lower side of the second mounting plate.

10. The plasma device according to claim 1, characterized in that, Along the axial direction of the medium cylinder, the distance between the coil and the workpiece located in the workpiece processing space is greater than or equal to 30 mm and less than or equal to 100 mm.

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