Phase change heat spreader and electronic device

Abstract

The application relates to a phase change heat sink and an electronic device. The phase change heat sink includes a first plate and a second plate. The first plate is used to contact a heat-generating element and has a first inner cavity. The second plate has a second inner cavity, which is connected to the first inner cavity. The second plate and the first plate have a first preset angle greater than 90°, that is, the second plate is tilted. This reduces the difficulty of the liquid heat exchange medium flowing back into the first cavity and also reduces the risk that the liquid heat exchange medium will accumulate in the second plate and cannot flow back due to the tilted installation of the phase change heat sink. This ensures the amount of liquid heat exchange medium in the first cavity, so as to improve the heat dissipation efficiency of the phase change heat sink for the heat-generating element.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a phase change heat sink and electronic device. Background Technology

[0002] Electronic devices such as power converters contain power components such as diodes. These power components generate heat when they operate. To reduce their temperature, phase change heat sinks are typically attached to their surfaces. These heat sinks contain a liquid medium that absorbs heat from the power components, causing their temperature to drop. Simultaneously, some of the liquid medium absorbs heat and evaporates into a gaseous state. This gaseous medium flows through the cooling channels of the heat sink, where it exchanges heat with the external environment. This process lowers the temperature of the gaseous medium, causing it to condense back into a liquid and eventually flow back to the power components.

[0003] In the application scenarios of phase change heat sinks, there are situations where the phase change heat sink is installed at an angle away from the power components. In this case, the liquid medium inside the phase change heat sink will accumulate on the side of the cooling channel away from the power components and cannot flow back. This reduces the amount of liquid medium in contact with the power components and increases the difficulty of the liquid medium flowing back in the cooling channel, thus obstructing the circulation of the medium and affecting the heat dissipation efficiency of the phase change heat sink.

[0004] Therefore, how to reduce the risk of decreased heat dissipation performance caused by tilted installation of phase change heat sinks in application scenarios is an urgent problem to be solved in this field. Summary of the Invention

[0005] In view of this, this application provides a phase change heat sink and electronic device that can reduce the risk of reduced heat dissipation performance caused by tilted installation of the phase change heat sink in application scenarios.

[0006] The first aspect of this application provides a phase change heat sink, which includes a first plate and a second plate. The first plate is used to contact a heat-generating element and has a first inner cavity. The second plate has a second inner cavity that communicates with the first inner cavity. The second plate and the first plate have a first preset angle greater than 90°. The first plate has a first mounting hole, and a portion of the second plate is mounted in the first mounting hole. The extension direction of the central axis of the first mounting hole is perpendicular to the height direction of the first plate.

[0007] In this application, the second plate is tilted, which reduces the difficulty of the liquid heat exchange medium in the second inner cavity flowing back into the first inner cavity. It also reduces the risk that the liquid heat exchange medium will accumulate in the second plate and cannot flow back in the tilted installation scenario of the phase change heat sink. This ensures the amount of liquid heat exchange medium in the first inner cavity, so as to improve the heat dissipation efficiency of the phase change heat sink for the heat-generating element.

[0008] The sidewall of the first mounting hole extends horizontally along the second direction to facilitate the machining of the first mounting hole and reduce the machining difficulty of the first plate.

[0009] In one possible design, the first preset included angle α satisfies: 95°≤α≤150°.

[0010] In this application, α ≥ 95° increases the tilt angle of the second plate, thereby further improving the reflux efficiency of the liquid heat exchange medium within the second plate. α ≤ 150° reduces the installation difficulty of the second plate, thus helping to reduce the installation cost of the phase change radiator and shorten the installation cycle.

[0011] In one possible design, the second plate includes a first body and a first protrusion, and a second inner cavity is disposed in the first body. The first body has a first surface that abuts against the sidewall of the first mounting hole in a first direction. The first protrusion has a second surface that abuts against the end face of the first plate in a second direction. The first surface and the second surface are connected and have a fifth preset included angle. The height direction of the first plate is the first direction, and the extension direction of the central axis of the first mounting hole is the second direction.

[0012] In this application, an opening structure is provided on the side of the second plate near the first plate to form an adjacent first surface and a second surface. By the contact between the first surface and the first plate in a first direction and the contact between the second surface and the first plate in a second direction, the relative positions of the first plate and the second plate are restricted, thereby improving the accuracy of the installation position of the second plate on the first plate.

[0013] In one possible design, the fifth preset included angle is 90°.

[0014] In this application, the fifth preset included angle is 90°, which makes the first surface parallel to the side wall of the first mounting hole and the second surface parallel to the outer wall of the first plate. This increases the area of ​​the contact surface between the first surface and the first plate in the first direction and the area of ​​the contact surface between the second surface and the first plate in the second direction, thereby improving the stability of the contact between the first plate and the second plate and reducing the risk of the second plate shaking during installation.

[0015] In one possible design, the second plate has a first partition that divides the second inner cavity into at least two flow channels arranged along a first direction; the phase change radiator also includes a third plate along the extension direction of the second plate, the third plate being located on the side of the second plate away from the first plate, the third plate being used to block the side of the flow channels away from the first inner cavity.

[0016] In this application, the second inner cavity is divided into multiple flow channels by the first partition, which reduces the risk of a single flow channel having a large size in the first direction. This reduces the risk of reduced flow velocity due to the diverse flow directions of the gaseous heat exchange medium in the flow channel, thereby improving the consistency of the flow direction of the gaseous heat exchange medium in the flow channel. This facilitates the increase of the flow velocity of the gaseous heat exchange medium in the flow channel, which in turn helps to improve the return flow efficiency of the medium, thereby improving the heat dissipation efficiency of the phase change heat sink and electronic devices.

[0017] By blocking the flow channel with the third plate, the second plate can adopt a flat tubular structure with openings at both ends, which simplifies the second plate and helps to reduce the processing cost of the second plate.

[0018] In one possible design, the third plate has a third inner cavity and a second mounting hole, the third inner cavity communicating with at least a portion of the flow channel.

[0019] In this application, the liquid heat exchange medium in the flow channel can enter the third inner cavity under the influence of airflow and accumulate at the bottom of the third inner cavity in the first direction under the action of gravity. When the liquid level of the liquid heat exchange medium is higher than the lowest flow channel, the liquid heat exchange medium in the third inner cavity will flow back to the first inner cavity along the lowest flow channel. The third inner cavity can collect the liquid heat exchange medium in the flow channel, reducing the risk of the liquid heat exchange medium being dispersed in multiple flow channels. This reduces the risk of insufficient liquid heat exchange medium in a single flow channel, resulting in slow or even no backflow. Therefore, the third inner cavity can collect the liquid heat exchange medium, thereby enabling concentrated backflow of the liquid heat exchange medium and increasing the single backflow rate and backflow velocity of the liquid heat exchange medium.

[0020] In one possible design, the extension direction of the central axis of the second mounting hole is the second direction, which is perpendicular to the first direction; the second plate includes a second body and a second protrusion, a second inner cavity is disposed in the second body, the second body has a third surface, the third surface abuts against the sidewall of the second mounting hole in the first direction, the second protrusion has a fourth surface, the fourth surface abuts against the third plate in the second direction, the third surface and the fourth surface are adjacent to each other, and there is a sixth preset included angle between the third surface and the fourth surface.

[0021] In this application, the extension direction of the central axis of the second mounting hole is the second direction, that is, the sidewall of the second mounting hole extends horizontally along the second direction, so as to facilitate the processing of the second mounting hole, reduce the processing difficulty of the third plate, and reduce the cost of the phase change heat sink and electronic devices.

[0022] In one possible design, the sixth preset included angle is 90°.

[0023] In this application, the sixth preset included angle is 90°, which makes the third surface parallel to the side wall of the second mounting hole and the fourth surface parallel to the outer wall of the third plate. This increases the area of ​​the contact surface between the third surface and the third plate in the first direction and the area of ​​the contact surface between the fourth surface and the third plate in the second direction, thereby improving the stability of the contact between the second plate and the third plate and reducing the risk of the second plate and the third plate shaking during installation.

[0024] In one possible design, there are multiple second plates, which are spaced apart along a third direction that is perpendicular to the first direction.

[0025] In this application, multiple second plates are provided, so that the gaseous heat exchange medium is dispersed in different second plates, thereby increasing the area of ​​the gaseous heat exchange medium for heat dissipation with the outside, and thus improving the heat dissipation efficiency of the phase change heat sink and electronic devices.

[0026] In one possible design, the phase change heat sink also includes fins, which are located between adjacent second plates along a third direction, with multiple fins spaced apart along the extension direction of the second plates.

[0027] In this application, the fins increase the contact surface between the second plate and the air, thereby increasing the heat exchange efficiency between the second plate and the air, and further improving the heat exchange efficiency between the gaseous heat exchange medium in the second plate and the air. At the same time, the fins divide the space between adjacent second plates into multiple channels. When there is a fan on one side of the second plate in the first direction, when the airflow stirred by the fan passes through the second plate and the fins, the fins can improve the consistency of the airflow direction between adjacent second plates, thereby increasing the airflow velocity, so as to further improve the heat dissipation efficiency of the phase change heat sink and electronic devices.

[0028] In one possible design, the first plate has one or more second partitions that divide the first inner cavity into a first sub-cavity and a second sub-cavity. Both the first and second sub-cavities contain a liquid heat exchange medium. The second plate includes at least a first sub-plate and a second sub-plate. The second inner cavity of the first sub-plate is in communication with the first sub-cavity, and the second inner cavity of the second sub-plate is in communication with the second sub-cavity.

[0029] In this application, the first plate is divided into multiple cavities by a second partition, and each cavity is connected to a second plate and a third plate, so that a phase change heat sink can dissipate heat from multiple heat-generating components at the same time, thereby reducing the number of phase change heat sinks required in electronic devices and reducing the installation space occupied by phase change heat sinks, which is conducive to reducing the overall size of electronic devices and improving the integration of electronic devices.

[0030] In one possible design, the first sub-cavity and the second sub-cavity are arranged along a first direction.

[0031] In this application, the first sub-cavity and the second sub-cavity can be arranged along the first direction, so that one fan can simultaneously meet the heat dissipation needs of the first sub-board and the second sub-board, which can reduce the number of fans required and is conducive to further reducing the overall size of electronic devices and improving the integration of electronic devices.

[0032] A second aspect of this application provides an electronic device, which includes a housing, a heating element, and a phase change heat sink as described in any one of the above claims. The housing has a mounting cavity, and the heating element and the phase change heat sink are both mounted in the mounting cavity. The first plate of the phase change heat sink is in contact with the heating element.

[0033] In this application, the vaporization and liquefaction process of the medium can quickly remove a large amount of heat. Therefore, using a phase change heat sink to dissipate heat from the heat-generating element can improve the heat dissipation efficiency of the heat-generating element, thereby improving the heat dissipation efficiency of the electronic device.

[0034] The tilted design of the second plate reduces the difficulty of the liquid heat exchange medium flowing back into the first inner cavity. It also reduces the risk that the liquid heat exchange medium will accumulate in the second plate and cannot flow back due to the tilted installation of the phase change heat sink. This ensures the amount of liquid heat exchange medium in the first inner cavity, so as to improve the heat dissipation efficiency of the phase change heat sink for heat-generating components and improve the heat dissipation efficiency of electronic devices.

[0035] In one possible design, the electronic device is an inverter, a rectifier, or a communication device.

[0036] In this application, the aforementioned phase change heat sink can meet the heat dissipation requirements of inverters, rectifiers, and communication equipment, reduce the risk of inverters and rectifiers stopping work or even being damaged due to high temperature, and thus improve the working stability of inverters and rectifiers. Attached Figure Description

[0037] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0038] Figure 1 A cross-sectional view of the electronic device provided in this application in one embodiment;

[0039] Figure 2 This is a cross-sectional view of the conventional structure of a phase change heat sink;

[0040] Figure 3 for Figure 1 An enlarged view of part A in the image;

[0041] Figure 4 A cross-sectional view of the electronic device provided in this application in another embodiment;

[0042] Figure 5 for Figure 4 An enlarged view of part B in the image;

[0043] Figure 6 for Figure 2 A cross-sectional view of the structure of the phase change heat sink after installation in one embodiment;

[0044] Figure 7 for Figure 2 A cross-sectional view of the phase change heat sink after installation in another embodiment;

[0045] Figure 8 A schematic diagram of the phase change heat sink provided in this application in one embodiment;

[0046] Figure 9 A cross-sectional view of one embodiment of the phase change heat sink provided in this application, wherein the phase change heat sink is not installed at an angle;

[0047] Figure 10 A cross-sectional view of a phase change heat sink provided in this application in one embodiment, wherein the phase change heat sink is installed at an angle;

[0048] Figure 11 This is a cross-sectional view of the first plate body in one embodiment;

[0049] Figure 12 This is a cross-sectional view of the first plate body in another embodiment;

[0050] Figure 13 This is a schematic diagram of the structure of the second plate in one embodiment;

[0051] Figure 14 for Figure 13 An enlarged view of part D in the image;

[0052] Figure 15 for Figure 9 An enlarged view of part C in the image;

[0053] Figure 16 A cross-sectional view of another embodiment of the phase change heat sink provided in this application;

[0054] Figure 17 A cross-sectional view of the phase change heat sink provided in this application in yet another embodiment;

[0055] Figure 18 for Figure 17 An enlarged view of part E in the image;

[0056] Figure 19 A schematic diagram of the phase change heat sink provided in this application in yet another embodiment;

[0057] Figure 20 A cross-sectional view of the phase change heat sink provided in this application in yet another embodiment.

[0058] Figure label:

[0059] 01-Outer shell; 011-Mounting cavity; 011a-First mounting cavity; 011b-Second mounting cavity; 012-Through hole; 013-Air inlet; 014-Air outlet;

[0060] 02-Heating element; 021-First element; 022-Second element;

[0061] 03-Phase change radiator; 031-Evaporator plate; 032-Condenser tube; 033-Heat exchange medium;

[0062] 1-First plate; 11-First inner cavity; 111-Condensation zone; 112-Evaporation zone; 113-First sub-cavity; 14-Second sub-cavity; 12-Liquid heat exchange medium; 13-First mounting hole; 131-Central axis; 14-Second partition;

[0063] 2-Second plate; 21-Second inner cavity; 211-Flow channel; 22-Main body; 221-First surface; 222-Third surface; 223-First body; 224-Second body; 23-Protrusion; 231-Second surface; 232-Fourth surface; 233-First protrusion; 234-Second protrusion; 24-First partition; 25-First sub-plate; 26-Second sub-plate; 27-First end; 28-Second end;

[0064] 3-Third plate; 31-Third inner cavity; 32-Second mounting hole;

[0065] 4-Fin;

[0066] 5. Fan. Detailed Implementation

[0067] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0068] It should be understood that the described embodiments are merely some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0069] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0070] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0071] This application provides an electronic device, which can be a power converter, communication equipment, etc. Specifically, the power converter can be, but is not limited to, a rectifier, an inverter, etc., and the communication equipment can be, but is not limited to, a wireless communication base station RRU, a multi-antenna MIMO base station, an outdoor independent baseband processing module, an outdoor wired broadband access module. This application does not impose any special limitations on the type or function of the electronic device.

[0072] Figure 1 This is a schematic diagram of the structure of an electronic device in one embodiment. For example... Figure 1 As shown, the electronic device includes a housing 01, which forms a mounting cavity 011. Multiple power components are housed within the mounting cavity 011. The power component that generates high temperatures and requires heat dissipation during operation is designated as the heating element 02. A phase-change heat sink 03 is also installed in the mounting cavity 011. The phase-change heat sink 03 is in contact with the heating element 02, enabling heat exchange between the high-temperature heating element 02 and the low-temperature external environment, thereby dissipating heat from the heating element 02.

[0073] The height direction of the electronic device is denoted as the first direction X, and the distribution direction of the heat-generating element 02 and the phase change heat sink 03 is denoted as the second direction Y.

[0074] Figure 2 This is a cross-sectional view of a phase change heat sink. (Example) Figure 2As shown, the phase change radiator 03 includes an evaporator plate 031 and a condenser tube 032. A heat exchange medium 033 is disposed inside the evaporator plate 03, which exists in both liquid and gaseous states. In the first direction X, the liquid heat exchange medium 033 accumulates at the bottom of the evaporator plate 031 under the influence of gravity, and the heating element 02 is directly opposite the liquid heat exchange medium 033 at the bottom of the evaporator plate 031. When the temperature of the heating element 02 rises, the liquid heat exchange medium 033 is heated, causing some of it to evaporate into a gaseous state. This gaseous heat exchange medium 033 then enters the condenser tube 032 and exchanges heat with the external environment there, causing its temperature to drop and it to condense back into a liquid state. The liquid heat exchange medium 033 in the condenser tube 032 accumulates at the bottom under gravity. As the amount of heat exchange medium 033 accumulated at the bottom of the condenser tube 032 increases, the liquid heat exchange medium 033 flows along the condenser tube 032, meaning it flows back to the bottom of the evaporator plate 031, thus achieving circulation of the heat exchange medium 033 between the evaporator plate 031 and the condenser tube 032. Figure 2 The image shows the state in which the heat exchange medium 033, condensed into a liquid state, accumulates at the bottom of the condenser tube 032 and flows back to the evaporator plate 031.

[0075] During the vaporization and liquefaction of medium 033, a large amount of heat is carried away. Therefore, using phase change heat sink 03 to dissipate heat from heat-generating element 02 can improve the heat dissipation efficiency of heat-generating element 02, thereby improving the heat dissipation efficiency of electronic devices.

[0076] Refer again Figure 1 The outer casing 01 includes a first mounting cavity 011a and a second mounting cavity 011b. The heating element 02 is located in the first mounting cavity 011a, and the phase change heat sink 03 is located in the second mounting cavity 011b. An air inlet 013 and an air outlet 014 are respectively provided on two side walls of the second mounting cavity 011b that are arranged opposite each other along the first direction X.

[0077] In this embodiment, placing the heating element 02 within the first mounting cavity 011a helps meet the airtightness requirements of the heating element 02, thereby improving its operational stability. Simultaneously, the phase change radiator 03 is placed in the second mounting cavity 011b. Low-temperature gas from the outside can enter the second mounting cavity 011b through the air inlet 013. When the low-temperature air flows through the condenser tube 032, it exchanges heat with the heat exchange medium 033 within the condenser tube 032. The low-temperature air absorbs heat from the gaseous heat exchange medium 033, causing its temperature to rise. The heated air is then discharged to the outside through the air outlet 014. A fan 5 can also be installed in the second mounting cavity 011b. By agitating the airflow within the second mounting cavity 011b, the fan 5 promotes the entry of low-temperature air from the outside into the second mounting cavity 011b through the air inlet 013, thereby improving the heat dissipation efficiency of the medium 033 at the condenser tube 032, and consequently, improving the heat dissipation efficiency of the phase change radiator 03 for the heating element 02.

[0078] By placing the heating element 02 and the phase change heat sink 03 in the first mounting cavity 011a and the second mounting cavity 011b respectively, the requirements of the heating element 02 for the airtightness of the space and the heat dissipation requirements of the phase change heat sink 03 can be met simultaneously, thereby improving the heat dissipation efficiency of the heating element 02 without affecting the working stability of the heating element 02.

[0079] In order to achieve heat dissipation of the heating element 02 by the phase change heat sink 03, it is necessary to ensure contact between the heating element 02 and the phase change heat sink 03. The contact between the heating element 02 and the phase change heat sink 03 can be direct contact or indirect contact through thermally conductive materials.

[0080] Figure 3 for Figure 1 A magnified view of part A in the middle. Figure 3 The connection relationship between the heating element 02 and the phase change heat sink 03 in one embodiment is shown as follows: Figure 3 As shown, the heating element 02 and the phase change heat sink 03 can be indirectly contacted through the housing 01 or other parts with good thermal conductivity. In this embodiment, reference is also made to... Figure 1 The heating element 02 and the phase change heat sink 03 are indirectly in contact through the outer shell 01, so that the heating element 02 can be placed in the first mounting cavity 011a with good sealing performance, which helps to meet the requirements of the heating element 02 for the sealing of the space and reduces the difficulty of sealing the space.

[0081] Figure 4 This is a schematic diagram showing the connection relationship between the heating element 02 and the phase change heat sink 03 in another embodiment. Figure 5 for Figure 4 A magnified view of a local structure. For example... Figure 5As shown, the outer casing 01 is provided with a through hole 012. A part of the heating element 02 extends through the through hole 012 to the evaporation plate 031 of the phase change heat sink 03. That is, the heating element 02 is in direct contact with the evaporation plate 031 of the phase change heat sink 03, which helps to improve the heat transfer efficiency between the heating element 02 and the phase change heat sink 03, and thus helps to improve the heat dissipation efficiency of the phase change heat sink 03 on the heating element 02.

[0082] In the application scenarios of phase change heat sink 03, phase change heat sink 03 is sometimes installed at an angle. In one case, phase change heat sink 03 is tilted toward the heating element 02, and in another case, phase change heat sink 03 is tilted away from the heating element 02. Figure 6 This is a sectional view of the phase change radiator 03 after installation. Figure 6 The phase change radiator 03 is shown to be installed at an angle toward the heat-generating element 02. (As shown) Figure 6 As shown, the phase change radiator 03 is tilted towards the heating element 02. In this case, the liquid heat exchange medium 033 inside the phase change radiator 03 will accumulate on the side of the condenser tube 032 near the heating element 02. In another case, the phase change radiator is tilted away from the heating element 02. Figure 7 This is a sectional view of the phase change radiator 03 after installation. Figure 7 The phase change heat sink 03 is shown to be installed at an angle away from the heat-generating element 02. (As shown) Figure 7 As shown, the liquid heat exchange medium 033 inside the phase change radiator 03 will accumulate on the side of the condenser tube 032 away from the heating element 02, resulting in a reduction in the amount of liquid medium 033 in contact with the heating element 02, thereby reducing the heat dissipation efficiency of the heating element 02. At the same time, it increases the difficulty of the return flow of the liquid medium 033 in the condenser tube 032, which hinders the circulation of the medium 033 in the phase change radiator 03, affecting the heat dissipation performance of the phase change radiator 03 and also reducing the heat dissipation efficiency of the heating element 02.

[0083] Therefore, this application provides a phase change heat sink that can reduce the impact of tilted installation on heat dissipation efficiency.

[0084] Figure 8 This is a schematic diagram of a phase change heat sink, as shown below. Figure 8 As shown, the phase change radiator 03 includes a first plate 1 and a second plate 2. Figure 9 This is a cross-sectional view of a phase change heat sink, such as... Figure 9As shown, the first plate 1 is used to contact the heating element 02. The first plate 1 has a first inner cavity 11, which has a condensation region 111 and an evaporation region 112 distributed along the first direction X. The condensation region 111 contains a liquid heat exchange medium 12. When the temperature of the heating element 02 rises, the temperature of the liquid heat exchange medium 12 in the condensation region 111 also rises. At least a portion of the liquid heat exchange medium 12 evaporates into a gaseous heat exchange medium, which flows along the first direction X and enters the evaporation region 112. Figure 9 As shown, the second plate 2 has a second inner cavity 21, which is connected to the first inner cavity 11. Specifically, the second inner cavity 21 is connected to the evaporation region 112. The gaseous heat exchange medium in the evaporation region 112 will enter the second inner cavity 21. The gaseous heat exchange medium exchanges heat with the external environment in the second inner cavity 21 and is recooled into a liquid heat exchange medium 12. The liquid heat exchange medium 12 drips onto the side wall of the second plate 2 under the action of gravity and gradually gathers at the bottom of the second plate 2.

[0085] Among them, such as Figure 9 As shown, the second plate 2 and the first plate 1 have a first preset angle α greater than 90°, i.e., α > 90°, causing the extension direction T of the second inner cavity 21 to be inclined relative to the first direction. When the phase change radiator 03 is not installed at an incline, as... Figure 9 As shown, the first plate 1 extends along the first direction X. At this time, the second plate 2 is inclined, and the second plate 2 has a second preset angle β with the horizontal plane, that is, the second plate 2 has a second preset angle β with the extension direction T and the second direction Y. The second plate 2 has a first end 27 and a second end 28 arranged opposite to each other. The first end 27 is connected to the first plate 1. At this time, the height of the first end 27 along the first direction X is lower than the height of the second end 28 along the first direction X. When the liquid heat exchange medium 12 in the second inner cavity 21 drips under the action of gravity, the liquid heat exchange medium 12 can flow along the inclined side wall of the second inner cavity 21, so that the liquid heat exchange medium 21 gradually approaches and enters the first inner cavity 11.

[0086] Figure 10 This is a cross-sectional view of a phase change heat sink. When the phase change heat sink 03 is installed at an angle away from the end of the heat-generating element 02, as shown... Figure 10 As shown, the first plate 1 has a third preset angle γ relative to the first direction X. At this time, the second plate 2 is inclined and has a fourth preset angle δ between itself and the horizontal plane, that is, the extension direction T of the second plate 2 has a fourth preset angle δ with the second direction Y. In some embodiments, such as... Figure 10As shown, when the inclination of the first plate 1 is small (γ is small), δ can be greater than 0°, that is, the second plate 2 is still inclined, and δ < β. At this time, the height of the first end 27 along the first direction X is lower than the height of the second end 28 along the first direction X. When the liquid heat exchange medium 12 in the second inner cavity 21 drips under the action of gravity, the liquid heat exchange medium 12 can flow along the inclined side wall of the second inner cavity 21, thereby causing the liquid heat exchange medium 21 to gradually approach and enter the first inner cavity 11. In other embodiments, δ can be 0°, that is, the second plate 2 is horizontal. When the liquid heat exchange medium 12 in the second inner cavity 21 drips under the action of gravity, the liquid heat exchange medium 12 can flow along the inclined side wall of the second inner cavity 21, thereby causing the liquid heat exchange medium 21 to gradually approach and enter the first inner cavity 11. Therefore, in this embodiment, the second plate 2 is tilted, which reduces the difficulty of the liquid heat exchange medium 21 flowing back into the first inner cavity 11. It also reduces the risk that the liquid heat exchange medium 21 will accumulate in the second plate 2 and cannot flow back due to the tilted installation of the phase change heat sink 03. This increases the content of liquid heat exchange medium 12 in the first inner cavity 11, so as to improve the heat dissipation performance of the phase change heat sink 03 on the heat-generating element 02, thereby improving the heat dissipation efficiency of electronic devices. When the electronic devices are inverters, rectifiers, or communication equipment, the above-mentioned phase change heat sink can meet the heat dissipation requirements of inverters, rectifiers, and communication equipment, reducing the risk that inverters, rectifiers, and communication equipment will stop working or even be damaged due to high temperature, thereby improving the working stability of inverters, rectifiers, and communication equipment.

[0087] The first preset included angle α can satisfy: α ≥ 95°. Specifically, the first preset included angle can be 95°, 96°, 97°, 98°, 99°, 100°, 101°, 102°, 103°, 104°, 105°, 106°, 107°, 108°, 109°, 110°, 111°, 112°, 113°, 114°, 115°, 116°, 117°, 118°, 119°, 120°, 121°, 122°, 123°, 124°, 125°, 126°, 127°, 128°, 129°, 130°, 131°, 132°, 133°, 134°, 1... 35°, 136°, 137°, 138°, 139°, 140°, 141°, 142°, 143°, 144°, 145°, 146°, 147°, 148°, 149°, 150°, 151°, 152°, 153°, 154°, 155°, 156°, 157°, 158°, 159°, 160°, 161°, 162°, 163°, 164°, 165°, 166°, 167°, 168°, 169°, 170°, 171°, 172°, 173°, 174°, 175°, 176°, 177°, 178°, 179°, etc.

[0088] In one specific implementation, 95°≤α≤150°, and the first preset included angle can be 95°, 96°, 97°, 98°, 99°, 100°, 101°, 102°, 103°, 104°, 105°, 106°, 107°, 108°, 109°, 110°, 111°, 112°, 113°, 114°, 115°, 116°, 117°, 118°, 119°, 120°, 120°, 110°, 111°, 112°, 113°, 114°, 115°, 116°, 117°, 118°, 119 ...0°, 111°, 112°, 113°, 114°, 115°, 116°, 117°, 118°, 119° 0°, 121°, 122°, 123°, 124°, 125°, 126°, 127°, 128°, 129°, 130°, 131°, 132°, 133°, 134°, 135°, 136°, 137°, 138°, 139°, 140°, 141°, 142°, 143°, 144°, 145°, 146°, 147°, 148°, 149°, 150°, etc.

[0089] In this embodiment, α ≥ 95° increases the tilt angle of the second plate 2, thereby further improving the reflux efficiency of the liquid heat exchange medium 12 within the second plate 2. α ≤ 150° reduces the installation difficulty of the second plate 2, thus helping to reduce the installation cost of the phase change radiator 03 and shorten the installation cycle.

[0090] Refer again Figure 8 The first plate 1 is provided with a first mounting hole 13, and a portion of the second plate 2 is located within the first mounting hole 13, i.e., the second plate 2 is inserted into the first mounting hole 13 to achieve connection between the first plate 1 and the second plate 2. The second plate 2 is sealed to the side wall of the first mounting hole 13 to reduce the risk of leakage of the liquid heat exchange medium 12 from the first mounting hole 13, thereby improving the stability of the medium quantity within the phase change heat sink and thus enhancing the stability of the heat dissipation performance of the phase change heat sink. Simultaneously, it reduces the risk of environmental pollution from leakage of the liquid heat exchange medium 12, thereby improving the environmental performance of the phase change heat sink and electronic devices.

[0091] Figure 11 This is a cross-sectional view of the first plate 1 in one embodiment. Since the extension direction T of the second plate 2 is inclined relative to the first direction X, therefore, in one embodiment, as... Figure 11 As shown, the central axis 131 of the first mounting hole 13 can be inclined along the extension direction T of the second plate 2, that is, the side wall of the first mounting hole 13 is also inclined along the extension direction T of the second plate 2, so as to facilitate the installation of the second plate 2.

[0092] Figure 12 This is a cross-sectional view of the first plate 1 in another embodiment. In another embodiment, as shown... Figure 12As shown, the extension direction of the central axis 131 of the first mounting hole 13 is the second direction Y, which is perpendicular to the first direction X. That is, the sidewall of the first mounting hole 13 extends horizontally along the second direction Y to facilitate the processing of the first mounting hole 13, reduce the processing difficulty of the first plate 1, and reduce the cost of the phase change heat sink and electronic devices.

[0093] Figure 13 This is a schematic diagram of the structure of the second plate 2. Figure 14 This is a magnified view of a portion of the structure of the second plate 2. Figure 15 This is an enlarged view of the connection position between the first plate 1 and the second plate 2. When the first mounting hole 13 is... Figure 12 When the structure is shown, such as Figure 13 As shown, the second plate 2 includes a body portion 22 and a protrusion portion 23, as... Figure 14 As shown, the second inner cavity 21 is disposed in the main body 22, and at the same time, referencing Figure 15 Along the second direction Y, the main body 22 includes a first body 223 and the protrusion 23 includes a second protrusion 233. The first body 223 and the second protrusion 223 are both located on the side of the second plate 2 close to the first plate 1. The first body 223 has a first surface 221, which abuts against the sidewall of the first mounting hole 13 in the first direction X. The second protrusion 233 has a second surface 231, which abuts against the first plate 1 in the second direction Y. The first surface 221 and the second surface 231 are adjacent to each other and have a fifth preset angle.

[0094] In this embodiment, an opening structure is provided on the side of the second plate 2 close to the first plate 1 to form an adjacent first surface 221 and second surface 231. By the contact between the first surface 221 and the first plate 1 in the first direction X, and the contact between the second surface 231 and the first plate 1 in the second direction Y, the relative positions of the first plate 1 and the second plate 2 are restricted, thereby improving the accuracy of the installation position of the second plate 2 on the first plate 1.

[0095] The included angle between the first surface 221 and the second surface 231 is 90°, that is, the fifth preset included angle is 90°, so that the first surface 221 is parallel to the side wall of the first mounting hole 13 and the second surface 231 is parallel to the outer wall of the first plate 1. This increases the area of ​​the contact surface between the first surface 221 and the first plate 1 in the first direction X and the area of ​​the contact surface between the second surface 231 and the first plate 1 in the second direction Y, thereby improving the stability of the contact between the first plate 1 and the second plate 2 and reducing the risk of the second plate 2 shaking during installation.

[0096] The sidewall of the first mounting hole 13 extends horizontally along the second direction Y, and the included angle between the first surface 221 and the second surface 231 is 90°, so that the second plate 2 can be inserted vertically into the first mounting hole 13 along the second direction Y, thereby reducing the difficulty of inserting the second plate 2 into the first mounting hole 13 and helping to shorten the assembly cycle of the first plate 1 and the second plate 2.

[0097] Figure 16 This is a cross-sectional view of a phase change heat sink. (Example) Figure 16 As shown, the second plate 2 has a first partition 24, which divides the second inner cavity 21 into at least two flow channels 211. The flow channels 211 are arranged along the first direction X and extend along the extension direction T of the second plate 2.

[0098] In this embodiment, the second inner cavity 21 is divided into multiple flow channels 211 by the first partition 24, which reduces the risk of a large size of a single flow channel 211 in the first direction X. This reduces the risk of reduced flow velocity due to the diverse flow directions of the gaseous heat exchange medium in the flow channel 211, thereby improving the consistency of the flow direction of the gaseous heat exchange medium in the flow channel 211. This facilitates the increase of the flow velocity of the gaseous heat exchange medium in the flow channel, which in turn helps to improve the reflux efficiency of the liquid heat exchange medium 12, thereby improving the heat dissipation efficiency of the phase change heat sink and electronic devices.

[0099] like Figure 16 As shown, the phase change heat sink also includes a third plate 3. Along the extension direction T of the second plate 2, the third plate 3 is located on the side of the second plate 2 away from the first plate 1. The third plate 3 is used to block the flow channel 211 on the side away from the first inner cavity 11.

[0100] In this embodiment, by blocking the flow channel 211 by the third plate 3, the second plate 2 can adopt a flat tube structure with openings at both ends, thereby simplifying the second plate 2 and helping to reduce the processing cost of the second plate 2.

[0101] In one possible design, such as Figure 16 As shown, the third plate 3 is a solid plate structure, and the flow channel 211 is sealed through the sealing connection between the third plate 3 and the second plate 2.

[0102] Figure 17 This is a cross-sectional view of a phase change heat sink. Figure 18 This is an enlarged view of the connection point between the second plate 2 and the third plate 3. In another possible design, see also... Figure 17 and Figure 18 The third plate 3 has a third inner cavity 31 and a second mounting hole 32. A portion of the second plate 2 extends into the second mounting hole 32 so that the third inner cavity 31 communicates with the flow channel 211.

[0103] In this embodiment, as Figure 17 As shown, the liquid heat exchange medium 12 in the flow channel 211 can enter the third inner cavity 31 under the influence of airflow and accumulate at the bottom of the third inner cavity 31 in the first direction X under the action of gravity. When the liquid level of the liquid heat exchange medium 12 is higher than the lowest flow channel 211, the liquid heat exchange medium 12 in the third inner cavity 31 will flow back to the first inner cavity 11 along the lowest flow channel 211. The third inner cavity 31 can collect the liquid heat exchange medium 12 in the flow channel 211, reducing the risk of the liquid heat exchange medium 12 being dispersed in multiple flow channels 211, thereby reducing the risk of the amount of liquid heat exchange medium 12 in a single flow channel 211 being small and the return flow being slow or even unable to return. Therefore, the third inner cavity 31 can collect the liquid heat exchange medium 12, thereby enabling the liquid heat exchange medium 12 to return in a concentrated manner, increasing the single return flow rate and return rate of the liquid heat exchange medium 12.

[0104] The second plate 2 is sealed to the side wall of the second mounting hole 31 to reduce the risk of leakage of liquid heat exchange medium 12 from the first mounting hole 31, thereby improving the stability of the amount of medium in the phase change heat sink and thus improving the stability of the heat dissipation performance of the phase change heat sink. At the same time, it reduces the risk of leakage of liquid heat exchange medium 12 and polluting the environment, thereby improving the environmental performance of the phase change heat sink and electronic devices.

[0105] Similar to the first mounting hole, the sidewall of the second mounting hole can extend obliquely along the extension direction T of the second plate 2, or extend horizontally along the second direction Y.

[0106] like Figure 18 As shown, the extension direction of the central axis of the second mounting hole 32 is the second direction Y, that is, the sidewall of the second mounting hole 32 extends horizontally along the second direction Y, so as to facilitate the processing of the second mounting hole 32, reduce the processing difficulty of the third plate 3, and reduce the cost of the phase change heat sink and electronic devices.

[0107] like Figure 18 As shown, the main body 22 of the second plate also includes a second body 224, and the protrusion 23 also includes a second protrusion 234. Along the second direction Y, the second body 224 and the second protrusion 234 are both located on the side of the second plate close to the third plate. The second body 224 has a third surface 222, which abuts against the sidewall of the second mounting hole 32 in the first direction X. The second protrusion 234 has a fourth surface 232, which abuts against the third plate 3 in the second direction Y. The third surface 222 and the fourth surface 232 are adjacent to each other, and there is a sixth preset angle between the third surface 222 and the fourth surface 232.

[0108] In this embodiment, an opening structure is provided on the side of the second plate 2 near the third plate 3 to form adjacent third surfaces 222 and fourth surfaces 232. By the contact between the third surface 222 and the third plate 3 in the first direction X, and the contact between the fourth surface 232 and the third plate 3 in the second direction Y, the relative positions of the third plate 3 and the second plate 2 are restricted, thereby improving the accuracy of the installation position of the second plate 2 on the third plate 3.

[0109] The included angle between the third surface 222 and the fourth surface 232 is 90°, that is, the sixth preset included angle is 90°, so that the third surface 222 is parallel to the side wall of the second mounting hole 32 and the fourth surface 232 is parallel to the outer wall of the third plate 3. This increases the area of ​​the contact surface between the third surface 222 and the third plate 3 in the first direction X and the area of ​​the contact surface between the fourth surface 232 and the third plate 3 in the second direction Y, thereby improving the stability of the contact between the second plate 2 and the third plate 3 and reducing the risk of the second plate 2 and the third plate 3 shaking during installation.

[0110] The sidewall of the second mounting hole 32 extends horizontally along the second direction Y, and the angle between the third surface 222 and the fourth surface 232 is 90°, so that the second plate 2 can be inserted vertically into the second mounting hole 32 along the second direction Y, thereby reducing the difficulty of inserting the second plate 2 into the second mounting hole 32 and helping to shorten the assembly cycle of the second plate 2 and the third plate 3.

[0111] Figure 19 This is a schematic diagram of a phase change heat sink. Figure 19 As shown, there are multiple second plates 2, which are arranged at intervals along the third direction Z. The third direction Z, the first direction X, and the second direction Y are perpendicular to each other.

[0112] In this embodiment, multiple second plates 2 are provided so that the gaseous heat exchange medium is dispersed in different second plates 2, thereby increasing the area of ​​the gaseous heat exchange medium for heat dissipation with the outside world, and thus improving the heat dissipation efficiency of the phase change heat sink and electronic devices.

[0113] like Figure 19 As shown, the phase change heat sink also includes fins 4. Along the third direction Z, the fins 4 are located between adjacent second plates 2, and multiple fins 4 are arranged at intervals along the extension direction T of the second plates 2.

[0114] In this embodiment, the fins 4 increase the contact surface between the second plate 2 and the air, thereby increasing the heat exchange efficiency between the second plate 2 and the air, and further improving the heat exchange efficiency between the gaseous heat exchange medium and the air within the second plate 2. At the same time, the fins 4 divide the space between adjacent second plates 2 into multiple channels. When a fan is present on one side of the second plate 2 in the first direction X, the airflow stirred by the fan passes through the second plate 2 and the fins 4. The fins 4 can improve the consistency of the airflow direction between adjacent second plates 2, thereby increasing the airflow velocity and shortening the residence time of the high-temperature air after heat exchange in the second plate 2, so as to further improve the heat dissipation efficiency of the phase change heat sink and electronic devices.

[0115] Figure 20 This is a schematic diagram of a phase change heat sink. Figure 20 As shown, the first plate 1 has a second partition 14, which divides the first inner cavity 11 into at least two cavities. Taking the two cavities as an example, the two cavities are respectively referred to as the first sub-cavity 113 and the second sub-cavity 114. Both the first sub-cavity 113 and the second sub-cavity 114 contain a liquid heat exchange medium 12. The second plate 2 includes at least a first sub-plate 25 and a second sub-plate 26. The second inner cavity 21 of the first sub-plate 25 is connected to the first sub-cavity 113, and the second inner cavity 21 of the second sub-plate 26 is connected to the second sub-cavity 114. The heating element 02 includes at least a first element 021 and a second element 022. The liquid heat exchange medium 12 in the first sub-cavity 113 is used to dissipate heat from the first element 021, and the liquid heat exchange medium 12 in the second sub-cavity 114 is used to dissipate heat from the second element 022.

[0116] In this embodiment, the first plate 1 is divided into multiple cavities by the second partition 14, and each cavity is connected to the second plate 2 and the third plate 3, so that one phase change heat sink can dissipate heat for multiple heat-generating elements 02 at the same time, thereby reducing the number of phase change heat sinks required in the electronic device and reducing the installation space occupied by the phase change heat sink, which is conducive to reducing the overall size of the electronic device and improving the integration of the electronic device.

[0117] like Figure 20 As shown, the first sub-cavity 113 and the second sub-cavity 114 can be arranged along the first direction X, or along... Figure 8 The third party in the Z-direction is arranged. In this embodiment, as... Figure 20 As shown, the first sub-cavity 113 and the second sub-cavity 114 can be arranged along the first direction X, so that one fan can simultaneously meet the heat dissipation of the first sub-board 25 and the second sub-board 26, which can reduce the number of fans required, and is conducive to further reducing the overall size of electronic devices and improving the integration of electronic devices.

[0118] For the same or similar parts among the various embodiments in this specification, please refer to each other.

Claims

1. A phase change radiator, characterized in that, The phase change heat sink includes: A first plate, the first plate being used to contact a heating element, the first plate having a first inner cavity; The second plate has a second inner cavity, which communicates with the first inner cavity. The second plate and the first plate have a first preset angle greater than 90°. The first plate has a first mounting hole, and a portion of the second plate is mounted in the first mounting hole. The extension direction of the central axis of the first mounting hole is perpendicular to the height direction of the first plate.

2. The phase change heat sink according to claim 1, characterized in that, The first preset included angle α satisfies: 95°≤α≤150°.

3. The phase change heat sink according to claim 1, characterized in that, The second plate includes a first body and a first protrusion. The second inner cavity is disposed in the first body. The first body has a first surface, which abuts against the sidewall of the first mounting hole in a first direction. The first protrusion has a second surface, which abuts against the end face of the first plate in a second direction. The first surface and the second surface are connected, and the first surface and the second surface have a fifth preset angle. Wherein, the height direction of the first plate is the first direction, and the extension direction of the central axis of the first mounting hole is the second direction.

4. The phase change heat sink according to claim 3, characterized in that, The fifth preset included angle is 90°.

5. The phase change heat sink according to claim 1, characterized in that, The second plate has a first partition that divides the second inner cavity into at least two flow channels, the two flow channels being arranged along a first direction; The phase change heat sink further includes a third plate, which is located on the side of the second plate away from the first plate along the extension direction of the second plate. The third plate is used to block the side of the flow channel away from the first inner cavity.

6. The phase change heat sink according to claim 5, characterized in that, The third plate has a third inner cavity and a second mounting hole, the third inner cavity being in communication with at least a portion of the flow channel.

7. The phase change heat sink according to claim 6, characterized in that, The extension direction of the central axis of the second mounting hole is the second direction, which is perpendicular to the first direction; The second plate includes a second body and a second protrusion. The second inner cavity is disposed in the second body. The second body has a third surface, which abuts against the sidewall of the second mounting hole in the first direction. The second protrusion has a fourth surface, which abuts against the third plate in the second direction. The third surface and the fourth surface are adjacent to each other, and there is a sixth preset angle between the third surface and the fourth surface.

8. The phase change heat sink according to claim 7, characterized in that, The sixth preset included angle is 90°.

9. The phase change radiator according to any one of claims 1 to 8, characterized in that, The number of the second plates is multiple, and the multiple second plates are arranged at intervals along a third direction, which is perpendicular to the first direction.

10. The phase change heat sink according to claim 9, characterized in that, The phase change heat sink also includes fins, which are located between adjacent second plates along the third direction, and a plurality of fins are arranged at intervals along the extension direction of the second plates.

11. The phase change radiator according to any one of claims 1 to 8, characterized in that, The first plate has one or more second partitions, which divide the first inner cavity into a first sub-cavity and a second sub-cavity. Both the first sub-cavity and the second sub-cavity contain a liquid heat exchange medium. The second plate includes at least a first sub-plate and a second sub-plate. The second inner cavity of the first sub-plate is in communication with the first sub-cavity, and the second inner cavity of the second sub-plate is in communication with the second sub-cavity.

12. The phase change heat sink according to claim 11, characterized in that, The first sub-cavity and the second sub-cavity are arranged along the first direction.

13. An electronic device, characterized in that, The electronic device includes: The housing has a mounting cavity; A heating element, wherein the heating element is mounted in the mounting cavity; The phase change heat sink according to any one of claims 1 to 12, wherein the phase change heat sink is installed in the mounting cavity, and the first plate of the phase change heat sink is in contact with the heating element.

14. The electronic device according to claim 13, characterized in that, The electronic device is an inverter.

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