Energy storage converter, energy storage device and power utilization device

Abstract

This application relates to the field of energy storage technology and discloses an energy storage converter, an energy storage device, and an electrical device. The energy storage converter includes a housing, a cover, a heat sink, and an airflow generator. The housing has an inner cavity, and the housing has a first through hole, a second through hole, and a clearance hole communicating with the inner cavity. Multiple circuit boards are disposed within the housing, with a first device located away from the clearance hole and a second device exposed through the clearance hole into the inner cavity. The cover is connected to the housing and encloses the first through hole, the second through hole, and the second device. A first through hole and a second through hole are respectively provided on opposite sides of the cover. The heat sink is connected to the housing and located within the cover, contacting the second device. The airflow generator is connected to the housing and located between the first through hole and the heat sink. The energy storage converter, energy storage device, and electrical device provided by this application can ensure that the heat dissipation structure configured in the energy storage converter provides good heat dissipation for heat-generating devices in different areas.

Description

Technical Field

[0001] This application relates to the field of energy storage technology, and in particular to an energy storage converter, an energy storage device, and an electrical device. Background Technology

[0002] With the continuous development of new energy technologies, energy storage devices are being used more and more widely. Energy storage devices store electrical energy through battery packs formed by encapsulating battery cells, and output it to the outside world when needed. In addition to the battery pack, energy storage devices also include battery management devices, energy management devices, and energy storage converters that work in conjunction with the battery pack. The energy storage converter ensures the normal charging and discharging process of the battery pack and is a key component for achieving bidirectional energy conversion.

[0003] Energy storage converters comprise numerous electronic components, some of which generate heat during operation, causing the internal temperature of the converter to rise. Typically, the locations of these heat-generating components within the energy storage converter vary. Therefore, ensuring that the heat dissipation structure of the energy storage converter can effectively cool these components in different areas is a crucial issue. Summary of the Invention

[0004] The purpose of this application is to provide an energy storage converter, an energy storage device, and an electrical device that can ensure that the heat dissipation structure configured in the energy storage converter provides good heat dissipation for heat-generating devices in different areas.

[0005] To address the aforementioned technical problems, this application provides an energy storage converter. The energy storage converter includes a housing, a cover, a heat sink, and an airflow generator. The housing has an inner cavity, and the housing has a first through hole, a second through hole, and a clearance hole communicating with the inner cavity. Multiple circuit boards are disposed within the housing, each circuit board having a first device located away from the clearance hole and a second device exposed through the clearance hole into the inner cavity. The cover is connected to the housing and encloses the first through hole, the second through hole, and the second device. A first through hole and a second through hole are respectively provided on opposite sides of the cover. The heat sink is connected to the housing and located within the cover, contacting the second device. The airflow generator is connected to the housing and located between the first through hole and the heat sink. Multiple airflow driving components are disposed within the housing, located in the airflow path from the first through hole to the second through hole.

[0006] This application also provides an energy storage device. The energy storage device includes a battery device and an energy storage converter, the battery device being electrically connected to the energy storage converter, and the energy storage converter employing the aforementioned energy storage converter.

[0007] An embodiment of this application also provides an electrical device. The electrical device includes the energy storage converter described above.

[0008] The energy storage converter, energy storage device, and power supply device provided in this application have a clearance hole on one side of the enclosure, allowing a second device mounted on the circuit board inside the enclosure to be exposed. A cover is connected to one side of the enclosure, forming an independent airflow space, allowing cooling airflow to flow towards the heat sink after entering the cover. Furthermore, some cooling airflow can pass through a first through-hole on one side of the enclosure to enter the enclosure and dissipate heat from other heat-generating devices mounted on the circuit board. Heat from the exposed electronic devices can be transferred to the cooling airflow through the heat sink and carried away to the outside. By distributing heat-generating devices and controlling the flow of cooling airflow in different areas, the energy storage converter can achieve good heat dissipation in different areas, thus ensuring that the heat dissipation structure of the energy storage converter provides good heat dissipation for heat-generating devices in different areas.

[0009] In some embodiments, there are multiple airflow generators arranged in a straight line, with the first through hole located near the airflow generator at the edge and on the side of the airflow generator closest to the heat sink.

[0010] In some embodiments, the plurality of airflow actuators include a first airflow actuator, the plurality of circuit boards include a first circuit board, the first airflow actuator is located in an airflow path flowing from a first through hole toward the first circuit board, a baffle is provided inside the housing, the baffle is separated on the side of the first through hole near the second through hole, and the distance between the baffle and the first circuit board is less than the distance between the first airflow actuator and the first circuit board.

[0011] In some embodiments, an enclosure plate is provided inside the housing, which encloses one side of the first circuit board to form a channel, with one end of the channel facing the first airflow drive component.

[0012] In some embodiments, the enclosure plate is provided with a protrusion extending from one end of the channel toward a first airflow drive member, the first airflow drive member being located between the protrusion and the first through hole.

[0013] In some embodiments, the first circuit board is connected to a plurality of copper busbars located on the side of the first airflow drive member close to the first circuit board. The copper busbars include a first segment and a second segment connected together. The first segment is parallel to the first circuit board, and the second segment is parallel to the direction of the airflow blown out by the first airflow drive member.

[0014] In some embodiments, the multiple circuit boards also include a second circuit board, which is disposed opposite to the first circuit board. A second device is located on the side of the second circuit board away from the first circuit board. A plurality of third devices are disposed on the side of the second circuit board closer to the first circuit board. The heat generated by the third devices is less than that generated by the second devices.

[0015] In some embodiments, a partition is provided inside the housing, the partition is located between the first circuit board and the second circuit board, the first circuit board is located on the partition, and the partition is spaced from the third device.

[0016] In some embodiments, a bracket is provided on the side of the housing near the cover, the airflow generator is connected to the bracket, the bracket is provided with a folding plate, the projection of the folding plate toward the housing at least covers the first through hole, the folding plate is provided with multiple through holes, and the end of the folding plate near the radiator is located close to the housing.

[0017] In some implementations, multiple circuit boards are staggered within the cavity.

[0018] In some implementations, multiple airflow actuators are positioned near the corners of the housing, and these multiple airflow actuators correspond to circuit boards in different areas.

[0019] In some embodiments, the circuit board is provided with a plurality of fourth devices, which pass through clearance holes and are located on the side of the heat sink away from the airflow generator. The cover is provided with opposing first and second air guide plates, which are located between the heat sink and the fourth devices. The ends of the first and second air guide plates away from the heat sink are located close to the fourth devices.

[0020] In some embodiments, the cover is provided with opposing third and fourth air guide plates, which are located between the fourth device and the second perforation. The distance between the ends of the third and fourth air guide plates near the second perforation is less than the distance between the ends of the third and fourth air guide plates near the fourth device. Attached Figure Description

[0021] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0022] Figure 1 This is a three-dimensional structural schematic diagram of an energy storage converter provided in some embodiments of this application; Figure 2 This is a top view schematic diagram of the energy storage converter provided in some embodiments of this application; Figure 3 It is along Figure 2 Schematic diagram of the cross-sectional structure along the AA direction; Figure 4 This is a schematic diagram of the structure of the heat sink in the energy storage converter provided in some embodiments of this application; Figure 5 This is a schematic diagram of the structure of the second device in the energy storage converter provided in some embodiments of this application; Figure 6 This is a schematic diagram of the air inlet and outlet arrangement of the housing in an energy storage converter provided in some embodiments of this application; Figure 7 This is a schematic diagram of the internal structure of the housing in an energy storage converter provided in some embodiments of this application; Figure 8 This is a schematic diagram of the arrangement of internal components in the energy storage converter provided in some embodiments of this application; Figure 9 This is a schematic diagram of the arrangement of the internal circuit board in the energy storage converter provided in some embodiments of this application; Figure 10 yes Figure 9 Enlarged structural diagram at point B; Figure 11 This is a schematic diagram of the heat dissipation structure arrangement in an energy storage converter provided in some embodiments of this application; Figure 12 This is a schematic diagram of the heat dissipation structure in the energy storage converter provided in some embodiments of this application for heat dissipation of the lower circuit board.

[0023] Figure label: 11. Housing; 111. Inner cavity; 112. First through hole; 113. Second through hole; 114. Clearance hole; 115. Bracket; 1151. Folding plate; 1152. Through hole; 116. Partition; 1101. Bottom shell; 1102. Top cover; 12. Circuit board; 121. First circuit board; 122. Second circuit board; 123. Copper busbar; 1231. First section; 1232. Second section; 1201. First component; 1202. Second component; 1203. Third component; 1204. Fourth component; 13. Heat sink; 14. Airflow generator; 15. Cover; 151. First perforation; 152. Second perforation; 153. First air guide plate; 154. Second air guide plate; 155. Third air guide plate; 156. Fourth air guide plate; 16. Airflow drive component; 161. First airflow drive component; 162. Second airflow drive component; 163. Third airflow drive component; 164. Fourth airflow drive component; 17. Baffle; 18. Enclosure plate; 181. Protrusion. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the various embodiments of this application will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been presented in the various embodiments of this application to enable readers to better understand this application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical solutions claimed in this application can be implemented. The division of the various embodiments below is for the convenience of description and should not constitute any limitation on the specific implementation of this application. The various embodiments can be combined with and referenced by each other without contradiction.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0026] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0027] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A exists, A and B exist simultaneously, and B exists. In addition, the character " / " in this document generally indicates that the related objects before and after it have an "or" relationship.

[0028] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0029] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0030] In the accompanying drawings corresponding to the embodiments of this application, the thickness and / or area of ​​layers, films, panels, regions, etc., are enlarged for better understanding and ease of description. Throughout the specification, the same reference numerals denote the same elements. It should be understood that when describing a component (such as a layer, film, region, or substrate) on or on the surface of another component, the component may be "directly" located on the surface of the other component, or there may be an intermediate component between the two components. Conversely, when describing a component on the surface of another component, or a component "directly" on another component, or a component surface on which another component is formed or disposed, it indicates that there is no intermediate component between the two components. Furthermore, when describing a component as "generally" formed on another component, it means that the component is not formed on the entire surface (or front surface) of the other component, nor is it formed on a portion of the edge of the entire surface.

[0031] With the continuous increase in new energy power generation, the importance of energy storage is also increasing. Energy storage devices use battery cells as energy storage units to form electrochemical energy storage systems. The power conversion system (PCS) is the part of the energy storage device that controls the AC / DC bidirectional conversion process during charging and discharging, and it is the core device of the energy storage device.

[0032] As the battery capacity of energy storage devices continues to increase, the power of energy storage converters is also increasing. During operation, the internal electrical components of the energy storage converter generate significant heat, causing the internal temperature of the converter to rise and affecting its normal operation.

[0033] Energy storage converters contain numerous heat-generating components distributed across multiple areas, such as the inductors at the bottom and the power boards at the top. Given these numerous heat-generating components, a robust heat dissipation structure is necessary to ensure effective cooling and prevent disruption to the converter's normal operation. The PCS enclosure contains many heat-generating components scattered across different areas, with limited space for heat dissipation devices, which can easily lead to poor heat dissipation and affect normal operation.

[0034] To ensure the heat dissipation effect of the heat dissipation structure within the energy storage converter, some embodiments of this application provide an energy storage converter. The energy storage converter is designed with different cooling spaces for different heat-generating devices, and the heat dissipation structure can generate airflow within these spaces. As the airflow flows through the energy storage converter, it diffuses across the different cooling spaces. Electronic devices that generate more heat can be positioned in areas with larger airflow, while for electronic devices that generate less heat, the airflow can be controlled to circulate, allowing the heat generated during operation to be promptly conducted to the outside. Thus, the continuous airflow within the energy storage converter effectively dissipates heat from different heat-generating devices, ensuring effective heat dissipation for all electronic components.

[0035] The following is combined with Figures 1 to 12 This application describes the structure of an energy storage converter provided in some embodiments.

[0036] like Figures 1 to 5 As shown, some embodiments of this application provide an energy storage converter including a housing 11, and a heat sink 13, an airflow generator 14, and a cover 15 connected to the housing 11. The housing 11 has an inner cavity 111, and the housing 11 has a first through hole 112, a second through hole 113, and a clearance hole 114 communicating with the inner cavity 111. Multiple circuit boards 12 are disposed within the housing 11. Each circuit board 12 has a first device 1201 located away from the clearance hole 114, and a second device 1202 exposed through the clearance hole 114 into the inner cavity 111. The cover 15 encloses the first through hole 112, the second through hole 113, and the second device 1202. A first through hole 151 and a second through hole 152 are respectively provided on opposite sides of the cover 15. The heat sink 13 contacts the second device 1202. The airflow generator 14 is located between the first through hole 151 and the heat sink 13. The housing 11 is provided with a plurality of airflow driving components 16, which are located in the airflow path from the first through hole 112 toward the second through hole 113.

[0037] The enclosure 11 forms the outer shell of the energy storage converter, protecting the internal circuit board 12 and electronic components. The enclosure 11 has an internal cavity 111 to provide space for the control circuit board 12 and electronic components. The first through-hole 112 and the second through-hole 113 in the enclosure 11 provide channels for the entry and exit of cooling airflow. Simultaneously, the enclosure 11 can be provided with circuit interfaces including DC and AC components to connect the energy storage converter to the circuitry of the energy storage device. The enclosure 11 can adopt a split structure consisting of a bottom shell 1101 and a top cover 1102, with the bottom shell 1101 forming the internal cavity 111 and the top cover 1102 sealing the opening at the top of the bottom shell 1101. Alternatively, the enclosure 11 can adopt an enclosed structure made of sheet metal, with the bottom of the enclosure 11 formed by multiple strips connected end-to-end, and the sides joined by a bottom plate and a cover, respectively.

[0038] The clearance hole 114 allows electronic components with high heat generation to be arranged facing outwards from the housing 11, so that the smooth airflow on one side of the housing 11 can carry away the heat of these electronic components and prevent heat accumulation. There can be one or more clearance holes 114, which can be arranged in a straight line or distributed. The clearance hole 114 can correspond to one or more electronic components, allowing one electronic component to protrude from the housing 11, or multiple electronic components to protrude from the housing 11 simultaneously. The clearance hole 114 can be located at the bottom, top, or side of the housing 11. Mounting holes can be provided near the clearance hole 114 to fix heat dissipation components, ensuring that the heat dissipation components are in close contact with the heat-generating components.

[0039] Circuit board 12 is the part that controls the charging and discharging process of the energy storage converter. Circuit board 12 contains control circuitry and can be equipped with IGBT (Insulated Gate Bipolar Transistor) power modules, capacitors, inductors, and other electronic components. Circuit board 12 can be connected to the inner cavity 111 of the housing 11. The first device 1201, which generates a relatively high amount of heat, can be positioned corresponding to the clearance hole 114. The first device 1201 and the second device 1202 are the electronic components on circuit board 12 that generate a relatively high amount of heat, with the second device 1202 generating a relatively higher amount of heat than the first device 1201. The electronic components on circuit board 12 that generate a relatively high amount of heat include inductors and IGBT power modules. The first device 1201 and the second device 1202 can be the same electronic component or different electronic components.

[0040] The heat sink 13 is a component for dissipating heat from the first device 1201, which generates a high amount of heat. The heat sink 13 can be connected to one side of the housing 11 and positioned corresponding to the clearance hole 114. The heat sink 13 can form thermal contact with the second device 1202, absorbing and carrying away the heat from the second device 1202, and transferring the heat to the outside through airflow. The heat sink 13 is made of a material with good thermal conductivity, such as copper or aluminum. The heat sink 13 can be equipped with fins to form a large heat exchange area with the airflow, so as to promptly transfer the heat from the second device 1202 to the airflow and carry it away to the outside. The heat sink 13 can be fixed to the circuit board 12 or the bottom wall of the housing 11 using fasteners via its own mounting holes, or it can be fixed using handles on both sides of the energy storage converter; that is, the heat sink 13 can be fixed to the handles on the left and right sides using fasteners. The radiator 13 and the housing 11 can also be connected indirectly, with the radiator 13 positioning plate as a transition. This not only facilitates the later maintenance and replacement of the radiator 13, but also makes it easier to position and install the housing 11 and the lower cover 15.

[0041] In practice, the heat dissipation surface at the top of the heat sink 13 can be in close contact with the surface of the second device 1202, forming a better heat transfer effect with the larger surface area of ​​the second device 1202. Furthermore, a thermally conductive layer can be filled between the surface of the heat sink 13 and the surface of the second device 1202 to prevent air from affecting the heat dissipation effect due to gaps. The thermally conductive layer can be thermal grease, thermal adhesive, or a thermal pad. Additionally, grooves corresponding to the second device 1202 can be provided on the surface of the heat sink 13, increasing the contact area between the surface of the heat sink 13 and the second device 1202, while also improving space utilization.

[0042] The airflow generator 14 is used to create a cooling airflow on one side of the housing 11, allowing the cooler airflow from the outside to flow on one side of the housing 11, thereby exchanging heat with the radiator 13 and the heat-generating devices in the inner cavity 111. When the airflow generator 14 is turned on, it can create a negative pressure on one side, causing the cool air on one side to flow to the other side, forming a cooling airflow. The cooling airflow passes through the radiator 13, and a portion of it enters the inner cavity 111 of the housing 11 through the first through-hole 112. In other words, the cooling airflow flowing on one side of the housing 11 can dissipate heat from the second device 1202, which generates more heat, while the cooling airflow flowing in the inner cavity 111 of the housing 11 can dissipate heat from the first device 1201, which generates less heat. The first through-hole 112 can be located in the positive pressure air zone on one side of the airflow generator 14, so that the cooling airflow can pass through the first through-hole 112. The airflow generator 14 can be a fan, blower, or negative pressure fan; the fan can be a DC fan, AC fan, or vortex fan.

[0043] The cover 15 is connected to one side of the housing 11, forming a space relatively isolated from the outside on one side of the housing 11, allowing cooling airflow to flow on one side of the housing 11 and achieving better heat exchange on that side. The airflow generator 14 and the radiator 13 are protected by the cover 15. The first perforation 151 and the second perforation 152 provided in the cover 15 form a channel for cooling airflow, allowing the cooling airflow to enter the interior of the cover 15 and the housing 11 and flow out after heat exchange. The side with the first perforation 151 corresponds to the negative pressure air zone, and the side with the second perforation 152 corresponds to the positive pressure air zone. When the airflow generator 14 is turned on, the cool airflow from the outside can continuously enter the interior of the cover 15 and the housing 11. The cooling airflow entering the housing 11 can flow back into the interior of the cover 15 after flowing along a certain path and flow out together with the airflow that has undergone heat exchange inside the cover 15.

[0044] Multiple airflow actuators 16 are installed in the inner cavity 111 of the housing 11. These actuators actively control the direction of airflow. When activated, the multiple airflow actuators 16 push the airflow entering the housing 11 through the first through-hole 112 along a specific path, thereby dissipating heat from the electronic components on the circuit boards 12 located in different areas. After absorbing heat from the heat-generating components, the airflow exits through the second through-hole 113 and returns to the interior of the housing 15. The airflow actuators 16 can be arranged at different positions within the housing 11, or some can be arranged close together within the housing 11. The airflow actuators 16 can be fans, blowers, or negative pressure fans; the fans can be DC fans, AC fans, or vortex fans.

[0045] The energy storage converter has a clearance hole 114 on one side of the housing 11, allowing the second device 1202 mounted on the circuit board 12 inside the housing 11 to be exposed. A cover 15 is connected to one side of the housing 11, forming an independent airflow space. Cooling airflow can flow towards the heat sink 13 after entering the cover 15. Furthermore, some cooling airflow can pass through the first through hole 112 on one side of the housing 11 to enter the housing 11 and dissipate heat from other heat-generating devices mounted on the circuit board 12. Heat from the electronic devices exposed from the housing 11 can be transferred to the cooling airflow through the heat sink 13 and carried away to the outside. By distributing the heat-generating devices and controlling the flow of cooling airflow in different areas, the energy storage converter can achieve good heat dissipation in different areas, thus ensuring that the heat dissipation structure of the energy storage converter provides good heat dissipation for the heat-generating devices in different areas.

[0046] In some embodiments, there may be multiple airflow generators 14. The multiple airflow generators 14 are arranged in a straight line, and the first through hole 112 is disposed near the airflow generator 14 located at the edge and on the side of the airflow generator 14 near the heat sink 13.

[0047] Multiple airflow generators 14 ensure sufficient airflow for the generated cooling airflow, allowing cool air from outside the housing 11 to enter the interior of the housing 15 through the first perforation 151, thereby creating a cooling airflow with sufficient heat dissipation effect. The multiple airflow generators 14 can be arranged along the cross-section inside the housing 15, serving to generate airflow along the entire length or width of the housing 15.

[0048] The first through hole 112 is located near the airflow generator 14 at the edge, which allows part of the cooling airflow formed inside the cover 15 to enter the interior of the housing 11 near the edge, so as to form a cooling airflow flowing close to the edge inside the housing 11. This can form a flow in a large area inside the housing 11, ensuring the heat dissipation effect on the circuit boards 12 and electronic devices located in different areas.

[0049] In practice, the number of airflow generating components 14 can be three, four, five, or six. For example... Figure 3 As shown, five airflow generators 14 are provided, arranged along the width direction of the energy storage converter, forming a cooling airflow that flows along the length direction of the energy storage converter. The cooling airflow can pass through the radiator 13, through the heat exchange gap of the radiator 13, and flow towards the second perforation 152 of the cover 15. Part of the cooling airflow can also enter the interior of the housing 11 through the first through hole 112. A filter structure such as filter cotton can be provided at the first through hole 112 to prevent the cooling airflow from carrying impurities into the interior of the housing 11. The cooling airflow entering the interior of the housing 11 can dissipate heat on the circuit boards 12 and the electronic devices installed on the circuit boards 12 located in different areas under the action of multiple airflow driving components 16. After flowing along a predetermined path, the cooling airflow flowing inside the housing 11 returns to the interior of the cover 15 through the second through hole 113 of the housing 11. It can continue to participate in subsequent heat dissipation using its relatively lower temperature compared to the radiator 13, or it can be directly discharged to the outside. The first through hole 112 and the second through hole 113 can be positioned far apart from each other to ensure that the cooling airflow entering the housing 11 can dissipate heat throughout the entire housing 11 before flowing out.

[0050] In some embodiments, the radiator 13 may be arranged in the negative pressure air zone on one side of the airflow generator 14, so that the cooling airflow entering the shroud 15 can pass through the radiator 13 and then through the airflow generator 14.

[0051] Additionally, the plurality of airflow actuators 16 may include a first airflow actuator 161, and the plurality of circuit boards 12 may include a first circuit board 121. The first airflow actuator 161 is located in the airflow path flowing from the first through hole 112 toward the first circuit board 121. A baffle 17 is provided inside the housing 11, the baffle 17 being separated on the side of the first through hole 112 near the second through hole 113, and the distance between the baffle 17 and the first circuit board 121 is less than the distance between the first airflow actuator 161 and the first circuit board 121.

[0052] The first airflow drive 161 is an airflow drive 16 disposed near the first through hole 112, and the first circuit board 121 is a circuit board 12 disposed near the first through hole 112. The first airflow drive 161 can transfer the cooling airflow passing through the first through hole 112 to the area where the first circuit board 121 is located, so that the cooling airflow entering the housing 11 can flow smoothly to the area where the circuit board 12 is located, so as to dissipate heat from the multiple circuit boards 12 and electronic devices located in different areas inside the housing 11.

[0053] Baffle 17 blocks one side of the first through hole 112, preventing the cooling airflow passing through the first through hole 112 from dispersing into the second through hole 113. This prevents some of the cooling airflow entering the housing 11 from flowing out of the housing 11 through the second through hole 113 without heat exchange, thus achieving efficient utilization of the cooling airflow. The edge of baffle 17 is close to the first circuit board 121, allowing part of baffle 17 to block one side of the first airflow drive member 161, effectively preventing airflow dispersion. The distance between baffle 17 and the first circuit board 121 can be controlled to be around 10mm, such as 10mm, 10.5mm, or 11mm. The distance between baffle 17 and circuit board 12 can also be controlled within a small range, such as 3mm to 5mm, 5mm to 7mm, or 7mm to 10mm, ensuring that baffle 17 and circuit board 12 do not interfere with each other.

[0054] In addition, the baffle 17 can also block heat transfer or isolate radiation interference inside the enclosure 11. The bottom of the baffle 17 can be connected to the lower inner wall of the enclosure 11, and the top of the baffle 17 can abut against the upper inner wall of the enclosure 11. One side of the baffle 17 forms the air intake area inside the enclosure 11, and the other side of the baffle 17 forms the air outlet area inside the enclosure 11. The left side of the baffle 17 can be used to arrange capacitor connection copper busbars, and the right side of the baffle 17 can be used to arrange fan brackets. The baffle 17 separates the connection copper busbars and the fan brackets, which can prevent arcing caused by the connection copper busbars and the fan brackets being too close.

[0055] like Figure 6 and Figure 7As shown, an enclosure plate 18 may be provided inside the housing 11. The enclosure plate 18 encloses one side of the first circuit board 121 to form a channel, with one end of the channel facing the first airflow drive member 161.

[0056] The enclosure plate 18 is shaped to surround the first circuit board 121, forming a channel for cooling airflow on one side of the first circuit board 121. Airflow driven by the first airflow drive 161 flows along the channel, dissipating heat from the first circuit board 121 and its electronic components until it exits the channel and continues flowing to other circuit boards 121 located in other areas. The enclosure plate 18 can be bent, and its bottom can mate with the inner wall of the housing 11 or with a frame inside the housing 11. In other words, the first circuit board 121 can be mounted on the inner wall of the housing 11, or on a partition 116 or support column inside the housing 11.

[0057] The channel can effectively ensure that the airflow driven by the first airflow drive 161 flows along a predetermined path, thereby ensuring that the cooling airflow entering the box 11 can achieve a relatively independent flow path inside the box 11, and avoiding turbulence and crossflow phenomena inside the box 11.

[0058] In practice, the enclosure plate 18 can also be positioned at the locations of other circuit boards 12. Circuit boards 12 located in other areas can also be situated within the space enclosed by the corresponding enclosure plate 18, thereby ensuring the cooling effect of the cooling airflow inside the housing 11 on the circuit boards 12 and the electronic components mounted on them. Different enclosure plates 18 can be arranged along the flow direction of the cooling airflow inside the housing 11, which can guide the flow of cooling airflow while ensuring the cooling effect and improving the cooling effect.

[0059] Furthermore, the enclosure 18 can form a shroud, which can concentrate cooling airflow to dissipate heat from the components inside the housing 11. For example, it can control the cooling airflow to dissipate heat from the inductors on the circuit board 12, preventing airflow from bypassing the core heat dissipation parts due to wind resistance. Continuous heat dissipation can be achieved inside the energy storage converter. The fan inside the enclosure 15 can draw in cool air from the outside environment to cool the area where the core components are located. At the same time, it can also form cooling airflow in the electrical compartment of the housing 11 to dissipate heat from the components inside the housing 11. The airflow flowing in different areas of the energy storage converter can all be exhausted to the outside, thus achieving continuous heat dissipation.

[0060] In some embodiments, the enclosure plate 18 may be provided with a protrusion 181 extending from one end of the channel toward the first airflow drive member 161. The first airflow drive member 161 is located between the protrusion 181 and the first through hole 112.

[0061] like Figure 8 As shown, the protrusion 181 can protrude toward the location of the first airflow drive member 161 and cover the edge of the first airflow drive member 161, so that part of the enclosure plate 18 can cover the first airflow drive member 161, thereby ensuring the shielding effect on the cooling airflow and preventing the cooling airflow from spreading outwards towards the outside of the enclosure plate 18.

[0062] The protrusion 181 can also cover part of the baffle 17 so as to cooperate with part of the baffle 17 to form a relatively isolated space inside the housing 11, ensuring that the cooling airflow in the air intake area can flow completely to the space where the first circuit board 121 is located.

[0063] In practice, the protrusion 181 can be set into a regular shape such as a rectangle or square, or it can be set into an irregular shape. The protrusion 181 extends from part of the edge of the enclosure plate 18 and can be integrally formed with other parts of the enclosure plate 18, or it can be connected in a separate structure. The enclosure plate 18 can also be set into a regular shape, and the bottom of the enclosure plate 18 forms a fastener connection part, which is assembled on top of the circuit board 12 inside the housing 11.

[0064] like Figure 9 and Figure 10 As shown, the first circuit board 121 can be connected to multiple copper busbars 123. The copper busbars 123 are located on the side of the first airflow drive member 161 close to the first circuit board 121. The copper busbars 123 include a first segment 1231 and a second segment 1232 connected together. The first segment 1231 is parallel to the first circuit board 121, and the second segment 1232 is parallel to the direction of the airflow blown out by the first airflow drive member 161.

[0065] The copper busbar 123 can establish circuit connections between different circuit boards 12, and also between the circuit interfaces of the circuit board 12 and the housing 11. There can be one or more copper busbars 123, which can be arranged side-by-side with gaps between them. Different parts of the copper busbar 123 can correspond to different areas, and the copper busbar 123 can act as a bridging element near the first airflow drive component 161 to achieve current transmission.

[0066] The first segment 1231 of the copper busbar 123 corresponds to the horizontally extending portion. The first segment 1231 can be positioned near the first circuit board 121, with one end connected to the first circuit board 121. The second segment 1232 of the copper busbar 123 corresponds to the vertically extending portion. The second segment 1232 can be positioned near the first airflow drive member 161, with one end extending downwards from the first circuit board 121. The second segment 1232 facilitates connection to the conductive busbar located at the interface of the housing 11, thereby forming a conductive path from the interface of the housing 11 to the first circuit board 121.

[0067] By aligning the second segment 1232 parallel to the airflow direction emitted by the first airflow drive member 161, it can be ensured that the thickness direction of the second segment 1232 is perpendicular to the airflow direction emitted by the first airflow drive member 161. That is, the larger surface area of ​​the second segment 1232 is parallel to the airflow direction, preventing it from obstructing the airflow path and creating significant resistance or obstruction. During manufacturing, the copper busbar 123 can be made from L-shaped incoming material, with a portion bent to form the copper busbar 123 comprising the first segment 1231 and the second segment 1232.

[0068] In practice, the first airflow drive 161 can be mounted on a conductive busbar using a conductive busbar as a mounting bracket. The conductive busbar can be provided with mounting holes, and fasteners can pass through the housing of the first airflow drive 161 and be fixed with the mounting holes of the conductive busbar.

[0069] like Figure 9 As shown, the plurality of circuit boards 12 may further include a second circuit board 122. The second circuit board 122 is disposed opposite to the first circuit board 121, and the second device 1202 is located on the side of the second circuit board 122 away from the first circuit board 121. A plurality of third devices 1203 are disposed on the side of the second circuit board 122 closer to the first circuit board 121, and the heat generated by the third devices 1203 is less than the heat generated by the second devices 1202.

[0070] In other words, when multiple circuit boards 12 are arranged inside the housing 11, some circuit boards 12 can be arranged opposite each other to make full use of the space inside the housing 11. The second circuit board 122 and the first circuit board 121 are arranged in the same area, forming a vertical layer. The second circuit board 122 is set close to the bottom wall of the housing 11, and the first circuit board 121 is arranged above the second circuit board 122. A second device 1202 is provided on the side of the second circuit board 122 near the clearance hole 114. The second device 1202 is exposed from the housing 11 through the clearance hole 114 to form a thermally conductive contact with the heat sink 13. At the same time, a third device 1203 is also provided on the side of the second circuit board 122 near the first circuit board 121. The heat generated by the third device 1203 is less than that generated by the second device 1202.

[0071] The third device 1203 is arranged between the first circuit board 121 and the second circuit board 122, utilizing the space between them to make full use of the internal space of the housing 11. Furthermore, the third device 1203 generates relatively little heat, which can be dissipated using the cooling airflow within the housing 11. This ensures both a reasonable arrangement of the circuit boards 12 and effective heat dissipation for different heat-generating components.

[0072] like Figure 9As shown, a partition 116 may be provided inside the housing 11. The partition 116 is located between the first circuit board 121 and the second circuit board 122, the first circuit board 121 is located on the partition 116, and the partition 116 is spaced from the third device 1203.

[0073] The partition 116 provides a connection base for the installation of the first circuit board 121. The partition 116 can be connected and fixed to the bottom wall and / or side wall of the housing 11 using fasteners. The partition 116 forms a support platform inside the housing 11, facilitating the layered arrangement of the circuit boards 12. A gap exists between the partition 116 and the third device 1203, preventing interference and allowing for ventilation on one side of the third device 1203, enabling cooling airflow to pass smoothly through the area where the third device 1203 is located.

[0074] Additionally, the bottom of the enclosure plate can be connected to the partition 116, and the enclosure plate can enclose one side of the partition 116 to form a channel. The bent portions on both sides of the enclosure plate can block the opposite sides of the first circuit board 121, thereby forming a unidirectional cooling airflow in the area where the first circuit board 121 is located.

[0075] In practice, the length of the partition 116 can correspond to the width of the internal space of the box 11, that is, the partition 116 can be set along the width direction of the box 11. The two ends of the partition 116 can be assembled inside the box 11 using connectors, thereby separating the lower and upper spaces inside the box 11. Figure 11 and Figure 12 As shown, a portion of the interior of the housing 11 can be fitted with multiple layers of circuit boards 12. Cooling airflow can be directed to the upper and lower circuit boards 12 using airflow drive components 16. Different circuit boards 12 can be arranged separately on different sides of the partition 116, i.e., separately in the lower and upper spaces inside the housing 11. To ensure the heat dissipation effect of the heat dissipation structure on the internal components of the housing 11, at least some of the airflow drive components 16 can be arranged at an angle, or the installation angle of the airflow drive components 16 can be adjusted, thereby ensuring that the circuit boards 12 located at different heights and the electronic devices mounted on them all receive good heat dissipation.

[0076] For example, the mounting base of the airflow drive 16 can be provided with an oblong hole to allow the fasteners to adjust their contact position with the mounting base, thereby adjusting the mounting angle of the airflow drive 16. Furthermore, the angle adjustment of the airflow drive 16 can also be coordinated with the adjustment of the mounting height of the partition 116, meaning the mounting height of the partition 116 within the housing 11 is adjustable. The partition 116 is movably disposed within the housing 11 along the height direction of the housing 11. When the partition 116 moves, the circuit board 12 mounted on it also moves, thereby adjusting the ventilation gap between the upper and lower circuit boards 12 to accommodate their different heat dissipation requirements. When the area where the upper circuit board 12 is located has higher heat, the ventilation gap between the upper and lower circuit boards 12 can be reduced, and the angle of the airflow drive 16 can be adjusted so that the airflow drive 16 blows airflow towards the area where the upper circuit board 12 is located. When the area where the lower circuit board 12 is located is hot, the ventilation gap between the upper and lower circuit boards 12 can be increased, and the angle of the airflow drive 16 can be adjusted so that the airflow drive 16 blows airflow toward the area where the lower circuit board 12 is located.

[0077] In some embodiments, a bracket 115 may be provided on the side of the housing 11 near the cover 15. The airflow generator 14 is connected to the bracket 115, and the bracket 115 is provided with a folding plate 1151. The projection of the folding plate 1151 toward the housing 11 at least covers the first through hole 112. The folding plate 1151 is provided with a plurality of through holes 1152, and the end of the folding plate 1151 near the radiator 13 is located close to the housing 11.

[0078] A bracket 115 is connected to one side of the housing 11, forming a base for fixing the airflow generator 14. The bracket 115 can be fixed to the bottom wall of the housing 11 with fasteners, and the airflow generator 14 is arranged using the hollowed-out area of ​​the bracket 115. A baffle plate 1151 can divert airflow on one side of the airflow generator 14, directing some cooling airflow towards the radiator 13 and another portion towards the first through-hole 112, thereby controlling the airflow volume entering the housing 11. The baffle plate 1151 is inclined relative to the outer wall of the housing 11, and the through-hole 1152 in the baffle plate 1151 allows some cooling airflow to pass through and continue flowing towards the radiator 13. The slope of the baffle plate 1151 guides another portion of the cooling airflow towards the first through-hole 112, thus entering the housing 11. By setting the baffle 1151, the airflow can be effectively diverted, ensuring that there is enough cooling airflow to flow into the cabinet 11, thereby ensuring the cooling airflow's heat dissipation effect on the internal components of the cabinet 11.

[0079] In practice, the folding plate 1151 can be made rotatable to adjust its tilt angle, thereby regulating the airflow distribution effect and changing the volume of cooling air entering the housing 11. When the heat generated by the components inside the housing 11 is low, a small amount of cooling airflow can be controlled to enter the housing 11. Conversely, when the heat generated by the components inside the housing 11 is high, the volume of cooling airflow entering the housing 11 can be increased. This ensures a balanced cooling effect of the heat dissipation structure on different areas, guaranteeing that the temperature of all components remains within a safe range.

[0080] Furthermore, the through hole 1152 of the folding plate 1151 can be offset from the first through hole 112 on the housing 11. The folding plate 1151 can be close to the outer wall of the housing 11 to close the first through hole 112. In addition, a rotatable baffle is provided at the second through hole 113 of the housing 11 to block the second through hole 113, thereby forming an independent airflow inside the housing 11.

[0081] In some embodiments, multiple circuit boards 12 may be staggered within the cavity 111.

[0082] In other words, adjacent circuit boards 12 can be arranged in layers along the height of the housing 11, or staggered along the length or width of the housing 11. By staggering the different circuit boards 12 inside the housing 11, ventilation gaps can be formed at the edges of the circuit boards 12. This not only increases the distance between various electronic components inside the housing 11, facilitating the smooth flow of cooling airflow inside the housing 11, allowing the heat dissipation structure to dissipate heat from each electronic component, but also provides space for the annular airflow inside the housing 11 to contact each electronic component, enabling the cooling airflow to better dissipate heat from each electronic component and improve the overall heat dissipation effect of the energy storage converter.

[0083] In practice, wiring channels can also be formed at the intervals between different circuit boards 12. These wiring channels can include main channels and branch channels. The main channel can be set along the length of the energy storage converter, and the branch channels can be set along the width of the energy storage converter. The cables connecting different circuit boards 12, as well as the interfaces between the circuit boards 12 and the enclosure 11, can be arranged along the main channels and branch channels to avoid messy wiring inside the enclosure 11 and reduce mutual interference between different circuit boards 12.

[0084] In some embodiments, a plurality of airflow actuators 16 are disposed near the corners of the housing 11, and the plurality of airflow actuators 16 are disposed corresponding to circuit boards 12 in different regions.

[0085] In other words, the airflow drive component 16 inside the enclosure 11 can correspond to the corner of the enclosure 11, which can increase the flow space of the cooling airflow inside the enclosure 11, so that there is cooling airflow throughout the electrical compartment of the entire enclosure 11, thereby ensuring the cooling airflow has a heat dissipation effect on the circuit board 12 and the electronic devices installed on the circuit board 12 inside the enclosure 11, as well as other components inside the enclosure 11.

[0086] like Figure 7 As shown, an airflow drive component 16 is respectively installed at the four corner positions of the energy storage converter, namely, a first airflow drive component 161, a second airflow drive component 162, a third airflow drive component 163, and a fourth airflow drive component 164. The first airflow drive component 161 is located near the first through hole 112 of the housing 11, with its rear side facing the front side wall of the housing 11. The fourth airflow drive component 164 is located near the second through hole 113 of the housing 11, with its rear side facing the right side wall of the housing 11. The second airflow drive component 162 is located near the first airflow drive component 161, with its rear side facing the left side wall of the housing 11. The second airflow drive component 162 directs the cooling airflow guided by the first airflow drive component 161 to the other side of the housing 11. The third airflow drive 163 is positioned close to the fourth airflow drive 164, with the rear side of the fourth airflow drive 164 facing the rear wall of the housing 11. The third airflow drive 163 directs the cooling airflow guided by the second airflow drive 162 to the area where the second through hole 113 is located. Each of the different airflow drive components 16 can control the direction of the cooling airflow within the housing 11, thereby controlling the cooling airflow within the housing 11 to flow along a predetermined path.

[0087] Multiple airflow drive components 16 can control the cooling airflow to flow in a ring within the electrical compartment of the housing 11. The first through-hole 112 of the housing 11 can be positioned to correspond to the positive pressure area of ​​the lower fan's exhaust, and the second through-hole 113 of the housing 11 can be positioned to correspond to the negative pressure area of ​​the lower fan's intake. By forming a ring flow within the housing 11, heat can be dissipated from components in different areas, preventing heat-generating components from affecting normal operation due to excessive temperature. The heat generated by the components within the housing 11 is relatively low. The airflow exiting from the second through-hole 113 of the housing 11 can flow out through the first perforation 151 of the cover 15, or it can flow through the airflow generator 14 to the heat sink 13, further absorbing some heat before flowing out through the second perforation 152 of the cover 15.

[0088] Additionally, a filter structure can be provided at the first through-hole 112 and / or the second through-hole 113. Optionally, filter screens or filter cotton are provided at the positions corresponding to the air inlet and outlet channels of the housing 11. For example, the filter screen can be fixed to the surface of the housing 11 with screws. By providing filter screens, the air can be effectively filtered, reducing the possibility of foreign objects entering the interior of the housing 11, ensuring the continuous and stable operation of the energy storage converter, and improving the reliability and safety of the energy storage converter in actual use.

[0089] In practice, the first through-hole 112 can be equipped with upper and lower rows of filter screens to form a labyrinth, or a combination of square-hole filter screens and filter cotton can be used. Furthermore, the first airflow drive component 161 can be positioned at a certain distance from the filter structure to reduce the risk of foreign objects being directly sucked into the housing 11.

[0090] like Figure 4 As shown, the circuit board 12 can be connected to multiple fourth devices 1204. The multiple fourth devices 1204 pass through the clearance hole 114 and are located on the side of the heat sink 13 away from the airflow generator 14. The cover 15 is provided with opposing first air guide plates 153 and second air guide plates 154, located between the heat sink 13 and the fourth devices 1204, with the ends of the first air guide plates 153 and second air guide plates 154 away from the heat sink 13 and close to the fourth devices 1204.

[0091] The volume of the fourth device 1204 is larger than that of the second device 1202. Most or all of the fourth device 1204 can be located inside the housing 15, with a gap between adjacent fourth devices 1204 to form a ventilation gap. After the cooling airflow passes through the heat sink 13, it can continue to exchange heat with the fourth device 1204, thereby absorbing the heat from the fourth device 1204, until the cooling airflow flows out from the second perforation 152 of the housing 15.

[0092] Along the airflow direction, the first air guide plate 153 and the second air guide plate 154 are positioned to gradually approach each other. This means that the first air guide plate 153 and the second air guide plate 154 can guide the airflow passing through the heat sink 13 through the gap between two adjacent fourth devices 1204, thereby effectively dissipating heat from the fourth devices 1204. The arrangement of the first air guide plate 153 and the second air guide plate 154 prevents the airflow passing through the heat sink 13 from directly exiting from the areas of low wind resistance on both sides of the multiple fourth devices 1204, thus ensuring that the fourth devices 1204 achieve good heat dissipation.

[0093] like Figure 4As shown, an inductor is designed as the fourth component 1204 below the housing 11. Two air guides are located below the housing 11 between the heat sink 13 and the inductor, guiding the airflow so that it flows out after passing the inductor. The air guides are inclined relative to the airflow direction, guiding the airflow towards a specific area. In practice, the air guides can be fixed to the surface of the cover 15.

[0094] Additionally, the cover 15 may be provided with a third air guide plate 155 and a fourth air guide plate 156. The third air guide plate 155 and the fourth air guide plate 156 are located between the fourth device 1204 and the second perforation 152, and the distance between the ends of the third air guide plate 155 and the fourth air guide plate 156 closest to the second perforation 152 is less than the distance between the ends of the third air guide plate 155 and the fourth air guide plate 156 closest to the fourth device 1204.

[0095] The third air guide plate 155 and the fourth air guide plate 156 are located between the fourth device 1204 and the second perforation 152 of the cover 15, which can prevent the formation of airflow vortices inside the cover 15 and prevent airflow turbulence inside the cover 15. The arrangement of the third air guide plate 155 and the fourth air guide plate 156 can guide the airflow passing through the area where multiple fourth devices 1204 are located towards the second perforation 152, so that it can flow smoothly out to the outside through the second perforation 152, avoiding the phenomenon of airflow stagnation at the corner of the cover 15.

[0096] like Figure 4 and Figure 5 As shown, two air guide plates are designed below the housing 11 on the side of the inductor that is away from the heat sink 13. These plates can guide the airflow and direct it toward the second perforation 152. The air guide plates are inclined relative to the direction of airflow, which can guide the airflow toward a specific area.

[0097] In practice, air guides at different locations serve different purposes. There are four air guides inside the housing 15: two on the left side of the airflow direction and two on the right. The air guides are angled relative to the airflow direction, guiding the airflow towards the second perforation 152. The air guide between the inductor and the heat sink 13 prevents airflow from escaping through areas of low resistance on the side wall of the housing 15, thus preventing a sudden drop in airflow at the inductor's location and ensuring effective cooling. The air guide between the inductor and the second perforation 152 prevents airflow from stagnating near the outlet on the side wall of the inductor and housing 11, thus preventing airflow circulation near the second perforation 152 and ensuring unobstructed airflow. Furthermore, the air guide plate near the second perforation 152 can reduce the air outlet area, thereby increasing the air outlet velocity, which is beneficial for carrying out dust and other substances that may exist inside the cover 15 to the outside.

[0098] The energy storage converter creates air ducts in different areas, allowing fans in each area to control the flow of incoming cool air in specific directions. This enables simultaneous heat dissipation for components in different areas, ensuring overall heat dissipation. Components within the enclosure 11 can be modularly arranged, such as fuse relay modules, relay pre-charge resistor modules, circuit breaker modules, and DC EMI modules. These modules can be assembled externally to the enclosure 11 and then connected internally using copper busbars.

[0099] Some embodiments of this application also provide an energy storage device. The energy storage device includes a battery device and an energy storage converter, the battery device being electrically connected to the energy storage converter, and the energy storage converter employing the aforementioned energy storage converter.

[0100] Energy storage devices include, but are not limited to, residential energy storage cabinets, commercial energy storage cabinets, energy storage containers, energy storage racks, energy storage power stations, energy storage battery packs, or portable energy storage systems. Energy storage devices may also include Energy Management Systems (EMS) and Battery Management Systems (BMS). Battery devices can be electrically connected to the power grid or electrical appliances via energy storage converters. Energy storage converters can convert alternating current (AC) to direct current (DC), and battery devices can store electrical energy. Battery devices can also output DC power, and energy storage converters can convert this DC power back to AC power required by the power grid or the electrical appliances.

[0101] The containerized energy storage system provided in this application embodiment can be widely used in fields requiring high energy density and long cycle life. This system can achieve large-capacity energy storage, comprehensively improving energy density, cycle life, and safety performance. It can meet the needs of long-term energy storage, achieving 4 hours or more of long-term energy storage, for example, it can be applied to energy storage scenarios of 4 hours, 5 hours, 6 hours, 7 hours, and 8 hours. Long-term energy storage refers to the ability to continuously discharge at rated power for 4 hours or even longer, or to achieve large-scale, low-cost energy storage for several days or months.

[0102] Some embodiments of this application also provide an electrical device, which includes the energy storage converter described above.

[0103] Electrical devices include, but are not limited to, mobile phones, tablets, laptops, electric toys, power tools, electric vehicles, electric cars, ships, spacecraft, etc. Among them, electric toys can include stationary or mobile electric toys, such as electric car toys, electric ship toys, and electric airplane toys, etc., and spacecraft can include airplanes, rockets, space shuttles, etc.

[0104] Those skilled in the art will understand that the above embodiments are specific implementations of this application, and in practical applications, various changes can be made in form and detail without departing from the spirit and scope of this application.

Claims

1. An energy storage converter, characterized in that, include: The enclosure has an inner cavity, and the enclosure has a first through hole, a second through hole, and a clearance hole communicating with the inner cavity. The enclosure has multiple circuit boards, and each circuit board has a first device that is away from the clearance hole and a second device that is exposed through the clearance hole into the inner cavity. A cover is connected to the box body and covers the first through hole, the second through hole and the second device inside. The cover has a first through hole and a second through hole on opposite sides. A heat sink is connected to the housing and located inside the cover, and the heat sink is in contact with the second device; An airflow generator is connected to the housing and is located between the first perforation and the radiator. The housing is equipped with multiple airflow driving components, which are located in the airflow path from the first through hole to the second through hole.

2. The energy storage converter according to claim 1, characterized in that, There are multiple airflow generators, which are arranged in a straight line. The first through hole is located near the airflow generator at the edge and is located on the side of the airflow generator that is close to the heat sink.

3. The energy storage converter according to claim 1 or 2, characterized in that, The plurality of airflow driving components include a first airflow driving component, and the plurality of circuit boards include a first circuit board. The first airflow driving component is located in an airflow path flowing from the first through hole toward the first circuit board. A baffle is provided inside the housing. The baffle is separated on the side of the first through hole near the second through hole. The distance between the baffle and the first circuit board is less than the distance between the first airflow driving component and the first circuit board.

4. The energy storage converter according to claim 3, characterized in that, The housing is provided with an enclosure plate, which encloses one side of the first circuit board to form a channel, with one end of the channel facing the first airflow drive component.

5. The energy storage converter according to claim 4, characterized in that, The enclosure plate is provided with a protrusion extending from one end of the channel toward the first airflow drive member, and the first airflow drive member is located between the protrusion and the first through hole.

6. The energy storage converter according to claim 3, characterized in that, The first circuit board is connected to multiple copper busbars, which are located on the side of the first airflow drive unit close to the first circuit board. The copper busbars include a first section and a second section connected together. The first section is parallel to the first circuit board, and the second section is parallel to the direction of the airflow blown out by the first airflow drive unit.

7. The energy storage converter according to claim 3, characterized in that, The plurality of circuit boards also include a second circuit board, which is disposed opposite to the first circuit board. The second device is located on the side of the second circuit board away from the first circuit board. A plurality of third devices are disposed on the side of the second circuit board close to the first circuit board. The heat generation of the third devices is less than that of the second devices.

8. The energy storage converter according to claim 7, characterized in that, The enclosure is provided with a partition, which is located between the first circuit board and the second circuit board. The first circuit board is located on the partition, and the partition is spaced apart from the third device.

9. The energy storage converter according to claim 2, characterized in that, A bracket is provided on the side of the housing near the cover. The airflow generator is connected to the bracket. The bracket is provided with a folding plate. The projection of the folding plate toward the housing at least covers the first through hole. The folding plate is provided with multiple through holes. The end of the folding plate near the radiator is located close to the housing.

10. The energy storage converter according to claim 1, characterized in that, Multiple circuit boards are staggered within the cavity.

11. The energy storage converter according to claim 1, characterized in that, Multiple airflow actuators are positioned near the corners of the housing, and these multiple airflow actuators are positioned corresponding to different areas of the circuit board.

12. The energy storage converter according to claim 1, characterized in that, The circuit board is provided with a plurality of fourth devices, which pass through the clearance hole and are located on the side of the heat sink away from the airflow generator. The cover is provided with opposing first and second air guide plates, which are located between the heat sink and the fourth devices. The ends of the first and second air guide plates away from the heat sink are located close to the fourth devices.

13. The energy storage converter according to claim 12, characterized in that, The cover is provided with a third air guide plate and a fourth air guide plate, which are located between the fourth device and the second perforation. The distance between the ends of the third air guide plate and the fourth air guide plate that are closer to the second perforation is less than the distance between the ends of the third air guide plate and the fourth air guide plate that are closer to the fourth device.

14. An energy storage device, characterized in that, It includes a battery device and an energy storage converter, wherein the battery device is electrically connected to the energy storage converter, and the energy storage converter is the energy storage converter according to any one of claims 1 to 13.

15. An electrical appliance, characterized in that, Includes the energy storage converter as described in any one of claims 1 to 13.

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