Four-step platform chip lifting device

Abstract

This invention relates to a four-step platform chip lifting device, comprising a base, a four-step lifting mechanism disposed on the inner side of the base, and a drive mechanism fixedly connected to the bottom inner side of the base. The output end of the drive mechanism is fixedly connected to the bottom of the four-step lifting mechanism. The drive mechanism includes a motor, an output sleeve, a feedback component, and an unlocking component. The motor is fixedly connected to the bottom inner side of the base, and its output end is fixedly connected to the bottom of the output sleeve. The top of the output sleeve is fixedly connected to the four-step lifting mechanism. A feedback component is disposed on the outer side of the output sleeve, comprising an L-shaped rotating rod, a counterweight ball, a hinge plate, and a sliding ring. The middle part of the L-shaped rotating rod is hinged to the outer wall of the output sleeve, and the counterweight ball is fixedly connected to the outer end of the L-shaped rotating rod. This invention achieves purely mechanical automatic timing control of the four-step graded lifting action, eliminating the timing difference and signal interference problems of electronic control graded lifting. The constant speed lifting throughout avoids stress abrupt changes during chip peeling, improving the stability and reliability of the device operation.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, specifically a four-step platform chip lifting device. Background Technology

[0002] With the rapid development of artificial intelligence and automotive electronics industries, the market demand for high-density, high-reliability memory chips continues to grow, and ultra-thin multi-layer chip packaging technology has become the mainstream technology in the field of memory chip packaging. In the die bonding process of semiconductor packaging, the four-step platform chip lifting device is the core fixture for achieving damage-free chip removal from the blue film on the wafer. The timing control accuracy and lifting speed stability of its staged lifting actions directly determine the packaging yield of ultra-thin chips and the production line efficiency, making it an indispensable key piece of equipment in the semiconductor die bonding process.

[0003] Currently, the four-step platform chip lifting devices on the market generally adopt a multi-axis servo motor combined with an electronic control system to achieve the action control of graded lifting. The position signals of each platform are collected by position sensors, and the controller calculates and controls the lifting start, stop and running speed of each platform to complete the four-step graded lifting action.

[0004] However, since the timing control of the staged lifting is entirely dependent on the electronic control system, it is difficult to achieve automatic timing control and constant speed lifting of the staged actions through a purely mechanical structure. In the strong electromagnetic environment of the semiconductor production workshop, signal interference and timing deviation problems are likely to occur. At the same time, sudden changes in lifting speed can easily cause stress concentration during chip peeling, resulting in chip chipping and microcracks in ultra-thin chips, which seriously affects the stability of the device operation and the chip packaging yield. Summary of the Invention

[0005] The purpose of this invention is to provide a four-step platform chip lifting device, which aims to improve the problem that the timing control of the staged lifting in the prior art relies entirely on the electronic control system and is prone to signal interference and timing deviation.

[0006] The objective of this invention is achieved through the following technical solution: a four-step platform chip lifting device, comprising a base, a four-step lifting mechanism disposed on the inner side of the base, a driving mechanism fixedly connected to the bottom of the inner side of the base, and the output end of the driving mechanism fixedly connected to the bottom of the four-step lifting mechanism. The drive mechanism includes a motor, an output sleeve, a feedback component, and an unlocking component. The motor is fixedly connected to the bottom inner side of the base, the output end of the motor is fixedly connected to the bottom of the output sleeve, and the top of the output sleeve is fixedly connected to the four-step top. A feedback element is provided on the outer side of the output sleeve. The feedback element includes an L-shaped rotating rod, a counterweight ball, a hinge plate, and a sliding ring. The middle part of the L-shaped rotating rod is hinged to the outer wall of the output sleeve. The counterweight ball is fixedly connected to the outer end of the L-shaped rotating rod. One end of the hinge plate is hinged to the inner end of the L-shaped rotating rod, and the other end of the hinge plate is hinged to the sliding ring. The sliding ring is coaxially slidably sleeved on the outer side of the output sleeve.

[0007] As a further description of the above technical solution: A fixed rod is fixedly connected to the top of the base, and a movable seat is provided at the top of the fixed rod. A suction head is provided at the output part of the movable seat. A conveyor belt is also provided on the inner side of the base, and the conveyor belt is located above the four-step top and below the suction head. As a further description of the above technical solution: The output sleeve includes an outer tube, inner tube one, inner tube two, inner tube three and a central shaft. The bottom of the outer tube is fixedly connected to the output end of the motor. Inner tube one, inner tube two and inner tube three are coaxially threaded to the inner side of the outer tube from the outside to the inside. The central shaft is coaxially threaded to the center of the inner side of inner tube three. The thread pitch of the inner side of the outer tube, inner tube one, inner tube two and inner tube three gradually decreases. As a further description of the above technical solution: The outer side of the output sleeve is also provided with an unlocking component, which includes a support ring, a second hinge plate and a nested locking plate. The support ring is fixedly connected to the top of the sliding ring. One end of the second hinge plate is hinged to the support ring, and the other end of the second hinge plate is hinged to the nested locking plate. The other end of the nested locking plate is fixedly connected to the top of the central shaft. As a further description of the above technical solution: The four-step top includes a fourth-level platform, a third-level platform, a second-level platform, and a first-level platform that are nested and slidably connected from the outside to the inside. The bottom of the fourth-level platform is fixedly connected to the top of the inner tube one through a cross plate one. The bottom of the third-level platform is fixedly connected to the top of the inner tube two through a cross plate two. The bottom of the second-level platform is fixedly connected to the top of the inner tube three through a cross plate three. The bottom of the first-level platform is fixedly connected to the top of the central axis. As a further description of the above technical solution: The top of the fourth-level platform, the third-level platform, the second-level platform, and the first-level platform are evenly provided with a number of pin insertion holes; As a further description of the above technical solution: The top of the fourth-level platform, the third-level platform, the second-level platform, and the first-level platform are all provided with several vacuum adsorption holes. The interior of the fourth-level platform, the third-level platform, the second-level platform, and the first-level platform are all provided with connecting air channels, which are connected to the vacuum adsorption holes on the corresponding platforms. The outer side of the fourth-level platform is provided with four sets of connectors. As a further description of the above technical solution: The fourth-level platform, the third-level platform, the second-level platform, and the first-level platform are provided with staggered flow holes, and the distance between two corresponding staggered flow holes is the same as the relative sliding distance between the fourth-level platform, the third-level platform, the second-level platform, and the first-level platform.

[0008] Compared with the prior art, the advantages of the present invention are as follows: 1. The motor drives the outer tube of the output sleeve to rotate synchronously. Relying on the gradient matching pitch thread structure of the outer tube, inner tube one, inner tube two, and inner tube three, the inner tubes of each level are driven to rise synchronously and at a constant speed with the central shaft. Then, the centrifugal force generated by the rotation of the output sleeve drives the counterweight ball to swing outward step by step with the change of rotation speed, driving the L-shaped rotating rod to rotate around the central hinge point. Through hinge plate one, the sliding ring slides along the axis of the output sleeve. Then, through hinge plate two, the nested locking plate retracts and locks the corresponding level platform in stages. This realizes the pure mechanical automatic timing control of the four-step graded lifting action, eliminating the timing difference and signal interference problems of the electronic control graded lifting. The constant speed lifting throughout avoids the stress change of chip peeling, improving the stability and reliability of the device operation.

[0009] 2. By connecting the negative pressure air source to the external connector of the fourth-level platform, and cooperating with the connecting air channels inside each level platform and the vacuum adsorption holes on the upper surface, the relative sliding of adjacent platforms during the staged lifting process drives the corresponding misaligned flow holes to align and connect step by step. This achieves synchronous linkage between the negative pressure adsorption area and the staged lifting action, ensuring that the blue film is uniformly adsorbed and fixed throughout the entire lifting process. Combined with the ejector pin insertion hole structure of the first-level platform that allows for flexible arrangement of ejector pins, it enables the non-destructive peeling of chips of different sizes, reduces the defect rate of chip edge breakage and microcracks, reduces the cost of custom fixtures, and improves the changeover efficiency of the production line. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the main body of an embodiment of a four-step platform chip lifting device proposed in this invention; Figure 2 This is a schematic diagram of the suction head of a four-step platform chip lifting device proposed in this invention; Figure 3 This is a schematic diagram of the drive mechanism of a four-step platform chip lifting device proposed in this invention; Figure 4 This is a schematic diagram of the four-step lifting structure of a four-step platform chip lifting device proposed in this invention; Figure 5 This is a schematic diagram of the feedback component of a four-step platform chip lifting device proposed in this invention; Figure 6 This is a schematic diagram of the output sleeve of a four-step platform chip lifting device proposed in this invention; Figure 7 This is a schematic diagram of the unlocking component of a four-step platform chip lifting device proposed in this invention; Figure 8 for Figure 4 Enlarged view of point A in the middle.

[0011] Labeling Explanation: 1. Base; 2. Drive Mechanism; 21. Motor; 22. Output Sleeve; 221. Outer Tube; 222. Inner Tube 1; 223. Inner Tube 2; 224. Inner Tube 3; 225. Central Shaft; 23. Feedback Component; 231. L-shaped Rotating Rod; 232. Counterweight Ball; 233. Hinge Plate 1; 234. Sliding Ring; 24. Unlocking Component; 241. Support Ring; 242. Hinge Plate 2; 243. Nested Locking Plate; 3. Four-Step Top; 301. Fourth-Level Platform; 302. Third-Level Platform; 303. Second-Level Platform; 304. First-Level Platform; 305. Pin Insertion Hole; 306. Vacuum Adsorption Hole; 307. Connecting Air Channel; 308. Connecting Joint; 4. Conveyor Belt; 5. Fixed Rod; 6. Moving Seat; 7. Suction Head. Detailed Implementation

[0012] The present invention will now be described in detail with reference to the accompanying drawings and embodiments: like Figures 1 to 8The diagram shows an embodiment of a four-step platform chip lifting device provided by the present invention. The device includes a base 1, which serves as the mounting and bearing reference for the entire device, providing a stable mounting and positioning space for each core component. A four-step lifting mechanism 3 is disposed on the inner side of the base 1, serving as the core execution body for chip lifting operations. This mechanism achieves damage-free peeling of the chip from the blue film on the wafer through a graded lifting action. A drive mechanism 2 is fixedly connected to the bottom inner side of the base 1, providing core power for the graded lifting action of the four-step lifting mechanism 3. Automatic timing control of the graded lifting action is achieved through a purely mechanical structure. The output end of the drive mechanism 2 is connected to the four-step lifting mechanism 3. The bottom is fixedly connected, and the top of the base 1 is fixedly connected to a fixing rod 5. The fixing rod 5 provides stable installation support and linear sliding guide reference for the moving base 6. The moving base 6 is set on the top of the fixing rod 5. The moving base 6 drives the suction head 7 to complete the horizontal position movement, realizing the precise transfer and delivery of the chip. The output part of the moving base 6 is equipped with a suction head 7. The suction head 7 uses negative pressure adsorption to stably grasp and fix the chip after peeling. The inner side of the base 1 is also equipped with a conveyor belt 4. The conveyor belt 4 realizes the automated delivery of the workpiece to be processed with the wafer blue film attached, and accurately delivers the wafer to be processed to the work station. The conveyor belt 4 is located above the four-step top 3 and below the suction head 7.

[0013] The drive mechanism 2 includes a motor 21, an output sleeve 22, a feedback element 23, and an unlocking element 24. The motor 21 is fixedly connected to the bottom inner side of the base 1. As the core power input component of the entire device, the motor 21 outputs a stable rotational torque, providing continuous and controllable power for the staged lifting action. The output end of the motor 21 is fixedly connected to the bottom of the output sleeve 22. The output sleeve 22, as the core carrier of power transmission, converts the rotational motion of the motor 21 into the linear lifting motion of the four-step lifting 3, and at the same time provides an installation reference for the feedback element 23 and the unlocking element 24. The top of the output sleeve 22 is fixedly connected to the four-step lifting 3. The feedback element 23 realizes the mechanical feedback of the staged lifting action through the change of centrifugal force, converting the speed change of the output sleeve 22 into axial displacement, providing triggering power for the action of the unlocking element 24. The unlocking element 24, in conjunction with the action of the feedback element 23, realizes the step-by-step locking and unlocking of each stage of the lifting platform, ensuring the accurate timing of the staged lifting action.

[0014] The output sleeve 22 includes an outer tube 221, an inner tube 1 222, an inner tube 223, an inner tube 3 224, and a central shaft 225. The bottom of the outer tube 221 is fixedly connected to the output end of the motor 21. The outer tube 221 directly receives the rotational power from the motor 21 and provides a reference carrier for the threaded transmission between the inner tubes and the central shaft 225, realizing the step-by-step transmission of rotational power. The inner tubes 1 222, 223, and 3 224 are coaxially threaded to the inside of the outer tube 221 from the outside to the inside. The inner tube 1 222 receives the rotational power from the outer tube 221 through threaded transmission, driving the corresponding platform to complete the lifting action, and at the same time providing transmission support for the inner tubes. The inner tube 223 receives the rotational power from the outer tube 221 through threaded transmission, driving the corresponding platform to complete the lifting action. The action simultaneously provides transmission support for the inner tube. The inner tube 224 receives the rotational power of the outer tube 221 through threaded transmission, driving the corresponding platform to complete the lifting action. At the same time, it provides transmission support for the central shaft 225. The central shaft 225 is coaxially threaded to the inner center of the inner tube 224. The central shaft 225 receives the rotational power of the outer tube 221 through threaded transmission, driving the central platform to complete the final lifting action. At the same time, it provides an end mounting and fixing position for the nested locking plate 243. The thread pitch of the inner sides of the outer tube 221, inner tube 1 222, inner tube 2 223, and inner tube 3 224 gradually decreases. This allows the upward lifting speed of the entire output sleeve 22 to remain balanced even when the output speed of the motor 21 changes, ensuring the consistency of the lifting linear speed of each platform.

[0015] A feedback element 23 is provided on the outer side of the output sleeve 22. The feedback element 23 includes an L-shaped rotating rod 231, a counterweight ball 232, a hinge plate 233, and a sliding ring 234. The middle part of the L-shaped rotating rod 231 is hinged to the outer wall of the output sleeve 22. The L-shaped rotating rod 231 acts as a transmission and conversion component for centrifugal force, converting the radial centrifugal displacement of the counterweight ball 232 into axial transmission displacement, thus realizing the conversion between the direction of force and the form of motion. The counterweight ball 232 is fixedly connected to the outer end of the L-shaped rotating rod 231. The counterweight ball 232 can rotate synchronously with the output sleeve 22 to generate centrifugal force, providing the core triggering power for the action of the feedback element 23. Its centrifugal force can change with the speed of the motor 21. Synchronous changes enable precise triggering of graded actions. One end of the hinge plate 233 is hinged to the inner end of the L-shaped rotating rod 231. The hinge plate 233 acts as a transmission connector for force and displacement, converting the rotational swing of the L-shaped rotating rod 231 into the axial linear displacement of the sliding ring 234, ensuring the synchronicity and stability of power transmission. The other end of the hinge plate 233 is hinged to the sliding ring 234, which is coaxially slidably sleeved on the outside of the output sleeve 22. The sliding ring 234 can slide axially along the outer wall of the output sleeve 22, converting the centrifugal action of the feedback element 23 into the driving displacement of the unlocking element 24, providing stable axial power for the locking action of the unlocking element 24.

[0016] An unlocking component 24 is also provided on the outer side of the output sleeve 22. The unlocking component 24 includes a support ring 241, a second hinge plate 242, and a nested locking plate 243. The support ring 241 is fixedly connected to the top of the sliding ring 234. The support ring 241 provides a stable installation reference for the second hinge plate 242 and can move axially synchronously with the sliding ring 234 to transmit the axial power of the sliding ring 234 to the second hinge plate 242. One end of the second hinge plate 242 is hinged to the support ring 241. The second hinge plate 242 acts as a force and displacement transmitter. The moving connector converts the axial displacement of the support ring 241 into the radial contraction and expansion of the nested locking plate 243, realizing the function conversion of locking and unlocking. The other end of the hinge plate 242 is hinged to the nested locking plate 243, and the other end of the nested locking plate 243 is fixedly connected to the top of the central shaft 225. The nested locking plate 243 can achieve rigid locking and unlocking of the corresponding level platform through radial contraction and expansion, ensuring the accurate timing of the graded lifting action and avoiding unexpected displacement of the platform.

[0017] The four-step lifting mechanism 3 comprises a fourth-level platform 301, a third-level platform 302, a second-level platform 303, and a first-level platform 304, which are nested and slidably connected from the outside to the inside. The fourth-level platform 301 serves as the outermost reference platform of the four-step lifting mechanism 3, completing the first lifting action and providing outer support and a fixed reference for the wafer blue film. It also provides nested sliding guidance for the three inner platforms. The bottom of the fourth-level platform 301 is fixedly connected to the top of the inner tube 222 via a cross plate, which provides rigidity between the inner tube 222 and the fourth-level platform 301. The connection ensures the synchronization of power transmission, and in conjunction with the nested locking plate 243, it completes the locking and fixing of the corresponding platform. The third-level platform 302, as the secondary outer ring lifting platform of the four-step lifting 3, completes the second-step graded lifting action, realizing the pre-peeling of the outer ring area of ​​the chip, and at the same time provides nested sliding guides for the inner two-level platforms. The bottom of the third-level platform 302 is fixedly connected to the top of the inner tube 223 through the cross plate 2. The cross plate 2 realizes the rigid connection between the inner tube 223 and the third-level platform 302, ensuring the synchronization of power transmission, and in conjunction with the nested locking... Plate 243 completes the locking and fixing of the corresponding platform. The second-level platform 303, as the secondary inner ring lifting platform of the four-step lifting 3, completes the third-step graded lifting action, further expanding the peeling area between the chip and the blue film, and at the same time providing nested sliding guides for the innermost platform. The bottom of the second-level platform 303 and the top of the inner tube 3 224 are fixedly connected by the cross plate 3. The cross plate 3 realizes the rigid connection between the inner tube 3 224 and the second-level platform 303, ensuring the synchronization of power transmission. At the same time, it works with the nested locking plate 243 to complete the locking and fixing of the corresponding platform. The first level Platform 304 serves as the central lifting platform for the four-step lifting process, completing the final lifting action in the fourth step and achieving complete separation of the chip from the blue film. The bottom of the first-level platform 304 is fixedly connected to the top of the central shaft 225. The tops of the fourth-level platform 301, the third-level platform 302, the second-level platform 303, and the first-level platform 304 are evenly provided with several pin insertion holes 305. The pin insertion holes 305 provide flexible mounting positions for flat-headed pins, allowing the installation position and number of pins to be adjusted according to different chip sizes, thus achieving adaptive lifting of chips of different specifications.

[0018] The tops of the fourth-level platform 301, the third-level platform 302, the second-level platform 303, and the first-level platform 304 are all provided with several vacuum adsorption holes 306. These holes 306 can generate adsorption force through negative pressure airflow, firmly adsorbing and fixing the blue film on the upper surface of the corresponding platform. This ensures that the blue film rises synchronously with the platform, preventing chip peeling defects caused by blue film slippage. The interiors of the fourth-level platform 301, the third-level platform 302, the second-level platform 303, and the first-level platform 304 are all... A connecting air passage 307 is provided, which serves as a transmission channel for negative pressure airflow, stably delivering the negative pressure air source to the vacuum adsorption hole 306 of the corresponding platform, ensuring the uniformity and stability of the negative pressure adsorption force. The connecting air passage 307 is connected to the vacuum adsorption hole 306 on the corresponding platform. Four sets of connectors 308 are provided on the outside of the fourth-level platform 301. The connectors 308 enable the external negative pressure air source to be connected to the internal connecting air passage 307 of the device, providing a negative pressure air source input interface for the entire vacuum adsorption system. The fourth-level platform 301, the third-level platform 302, the second-level platform 303, and the first-level platform 304 are provided with staggered flow holes. The staggered flow holes can be aligned and connected and staggered and blocked by the relative sliding of adjacent platforms, so that the negative pressure adsorption area is synchronized with the staged lifting action, ensuring that the blue film is uniformly adsorbed and fixed in the whole lifting process. The distance between two corresponding staggered flow holes is the same as the relative sliding distance between the fourth-level platform 301, the third-level platform 302, the second-level platform 303, and the first-level platform 304.

[0019] Working principle: When the device is in the initial standby state, the outer tube 221, inner tube one 222, inner tube two 223, inner tube three 224 of the output sleeve 22 and the central shaft 225 are all in the lowest position of thread engagement. The upper surfaces of the fourth-level platform 301, third-level platform 302, second-level platform 303, and first-level platform 304 of the four-step top 3 are completely flush. The L-shaped rotating rod 231 on the outside of the output sleeve 22 is in the initial retracted position. The counterweight ball 232 is attached to the outer wall of the output sleeve 22. The sliding ring 234 is in the highest position on the outer wall of the output sleeve 22. The nested locking plate 243 of the unlocking component 24 is in the fully extended state. The movable seat 6 on the top of the base 1 moves to the initial standby position along the fixed rod 5. The suction head 7 is in the negative pressure closed state. After the operation is started, the conveyor belt 4 starts and transports the workpiece to be processed with the blue film on the surface of the wafer to the top of the four-step platform 3, completing the center alignment of the wafer and the top of the four-step platform 3. At the same time, the negative pressure air source is connected through the connector 308 on the outside of the fourth-level platform 301, completing all the preparations before the operation.

[0020] Motor 21 starts and rotates in the forward direction, driving the outer tube 221 of output sleeve 22 to rotate synchronously. The outer tube 221 drives the inner tube 1 222, inner tube 223, inner tube 3 224 to rise synchronously with the central shaft 225 through the inner thread transmission. Relying on the gradually increasing thread pitch design of the outer tube 221, inner tube 1 222, inner tube 223, and inner tube 3 224, the lifting linear speed of each level of thread transmission is kept consistent, thereby driving the fourth-level platform 301, the third-level platform 302, the second-level platform 303, and the first-level platform 304 to move synchronously upward until the upper end surface of the fourth-level platform 301 is completely in contact with the lower surface of the wafer blue film.

[0021] After the fourth-level platform 301 reaches the preset maximum lifting stroke, it stops moving upward, and the motor 21 continues to rotate, driving the output sleeve 22 to maintain rotation. During the rotation of the output sleeve 22, the outer L-shaped rotating rod 231 is driven to make a circular motion synchronously. The counterweight ball 232 at the outer end of the L-shaped rotating rod 231 is thrown outward by centrifugal force. The centrifugal force of the counterweight ball 232 will change according to the speed of the motor 21, causing the L-shaped rotating rod 231 to rotate around its central hinge point. The inner end of the L-shaped rotating rod 231 drives the sliding ring 234 to slide downward along the outer wall of the output sleeve 22 through the hinge plate 1 233. At the same time as the sliding ring 234 slides downward, it drives the hinge plate 242 to move through the support ring 241 at the top, which in turn drives the nested locking plate 243 to retract inward. After retraction, the nested locking plate 243 is locked in place at the corresponding position of the third-level platform 302. The relative positions of the fourth-level platform 301, the outer tube 221 and the inner tube 1 222 are completely locked by the cross plate 1. At the same time, the negative pressure airflow enters the connecting air passage 307 inside the fourth-level platform 301 through the connector 308, and then flows into the vacuum adsorption hole 306 on the upper surface of the fourth-level platform 301, so that the vacuum adsorption hole 306 generates a stable negative pressure, which firmly adsorbs and fixes the outer ring area of ​​the blue film to the upper surface of the fourth-level platform 301.

[0022] After the fourth-level platform 301 is locked, the motor 21 accelerates and rotates in the forward direction. The outer tube 221 drives the inner tube 223, inner tube 324 and central shaft 225 to continue to lift upward through the inner thread transmission, which in turn drives the third-level platform 302, the second-level platform 303 and the first-level platform 304 to move upward synchronously, completing the second-level lifting action. When the third-level platform 302 reaches the preset maximum lifting stroke, the relative sliding distance between the third-level platform 302 and the fourth-level platform 301 reaches the preset value. The misaligned flow holes at corresponding positions are fully aligned and connected. The negative pressure airflow enters the connecting airway 307 inside the third-level platform 302 through the aligned misaligned flow holes from the connecting airway 307 of the fourth-level platform 301, and then flows into the vacuum adsorption hole 306 on the upper end face of the third-level platform 302. This causes the vacuum adsorption hole 306 of the third-level platform 302 to generate a stable negative pressure, adsorbing and fixing the blue film in the corresponding area to the upper end face of the third-level platform 302. At the same time, as the output sleeve 22 continues to rotate, the centrifugal force of the counterweight ball 232 further increases, causing the sliding ring 234 to continue sliding downward along the outer wall of the output sleeve 22. The nested locking plate 243 further retracts inward, engaging and fixing at the corresponding position of the second-level platform 303. The relative position of the third-level platform 302 and the inner tube 223 is completely locked by the cross plate 2.

[0023] After the third-level platform 302 is locked, the motor 21 accelerates forward rotation again. The outer tube 221 drives the inner tube 224 and the central shaft 225 to continue to rise through the internal thread transmission, thereby driving the second-level platform 303 and the first-level platform 304 to move upward synchronously, completing the third-level lifting action. When the second-level platform 303 reaches the preset maximum lifting stroke, the relative sliding distance between the second-level platform 303 and the third-level platform 302 reaches the preset value, and the misaligned flow holes at the corresponding positions of the two are completely aligned and connected. The negative pressure airflow enters the connecting air passage 307 inside the second-level platform 303 through the aligned misaligned flow holes, and then flows into the vacuum adsorption hole 306 on the upper end face of the second-level platform 303, so that the vacuum adsorption hole 306 of the second-level platform 303 generates a stable negative pressure, adsorbing and fixing the blue film in the corresponding area on the upper end face of the second-level platform 303. At the same time, the centrifugal force of the counterweight ball 232 continues to increase as the output sleeve 22 rotates, causing the sliding ring 234 to continue sliding downward along the outer wall of the output sleeve 22. The nested locking plate 243 further retracts inward, locking and fixing itself at the position corresponding to the first-level platform 304. The relative positions of the second-level platform 303 and the inner tube 224 are completely locked by the cross plate 3.

[0024] After the second-level platform 303 locks, the motor 21 further accelerates forward rotation. The outer tube 221 drives the central shaft 225 to continue to rise through the internal thread transmission, thereby driving the first-level platform 304 to complete the final full-stroke lifting action, completing the fourth-stage lifting. When the first-level platform 304 reaches the preset maximum lifting stroke, the relative sliding distance between the first-level platform 304 and the second-level platform 303 reaches the preset value. The misaligned flow holes at the corresponding positions of the two are completely aligned and connected. The negative pressure airflow enters the connecting air passage 307 inside the first-level platform 304 through the aligned misaligned flow holes, and then flows into the vacuum adsorption hole 306 on the upper surface of the first-level platform 304, so that the vacuum adsorption hole 306 of the first-level platform 304 generates a stable negative pressure, adsorbing and fixing the blue film in the central area of ​​the chip. The flat-headed pins pre-installed in the pin socket 305 at the top of the first-level platform 304 rise synchronously with the platform, lifting the corresponding area of ​​the blue film upwards. By utilizing the deformation difference formed by the elastic deformation of the blue film and the rigidity of the chip, the bonding interface between the chip and the blue film is completely peeled off.

[0025] Furthermore, during acceleration, the higher the speed of motor 21, the greater the swing amplitude of counterweight ball 232, causing sliding ring 234 to continue to move downward, thereby enabling nested locking plate 243 to retract in segments. Moreover, due to the change in pitch between inner tube 1 222, inner tube 223, inner tube 3 224 and outer tube 221, the upward lifting speed of the entire output sleeve 22 remains balanced even when the output speed of motor 21 changes.

[0026] After the chip is completely peeled off from the blue film, the moving seat 6 moves along the fixed rod 5 to directly above the chip, causing the suction head 7 to descend to the upper surface of the chip. The suction head 7 then activates negative pressure adsorption to firmly adsorb and fix the peeled chip. Subsequently, the moving seat 6 moves the suction head 7 to the next process station to complete the chip transfer. After the chip transfer is completed, the motor 21 rotates in the reverse direction, causing the outer tube 221 to rotate in the reverse direction. The rotation speed of the output sleeve 22 gradually decreases, and the centrifugal force of the counterweight ball 232 gradually decreases accordingly. Under the reset action, the sliding ring 234 slides upward along the outer wall of the output sleeve 22, causing the nested locking plate 243 to gradually unfold outward, thereby releasing the locking state of each platform in turn. The reverse rotation of the outer tube 221, through the internal thread transmission, drives the inner tube 1 222, inner tube 223, inner tube 3 224, and central shaft 225 to gradually descend and reset, ultimately driving the fourth-level platform 301, the third-level platform 302, the second-level platform 303, and the first-level platform 304 back to their initial flush state; at the same time, the misaligned flow holes between each level platform are gradually misaligned and blocked, the negative pressure of each level platform is disconnected in sequence, and the device returns to its initial standby state, waiting for the next wafer chip lifting operation cycle.

Claims

1. A four-step platform chip lifting device, comprising a base (1) for semiconductor chip manufacturing, characterized in that: The base (1) is provided with a four-step top (3) on its inner side, and a drive mechanism (2) is fixedly connected to the bottom of the inner side of the base (1). The output end of the drive mechanism (2) is fixedly connected to the bottom of the four-step top (3). The drive mechanism (2) includes a motor (21), an output sleeve (22), a feedback component (23), and an unlocking component (24). The motor (21) is fixedly connected to the bottom of the inner side of the base (1). The output end of the motor (21) is fixedly connected to the bottom of the output sleeve (22), and the top of the output sleeve (22) is fixedly connected to the four-step top (3). The output sleeve (22) is provided with a feedback element (23) on the outside. The feedback element (23) includes an L-shaped rotating rod (231), a counterweight ball (232), a hinge plate (233) and a sliding ring (234). The middle part of the L-shaped rotating rod (231) is hinged to the outer wall of the output sleeve (22). The counterweight ball (232) is fixedly connected to the outer end of the L-shaped rotating rod (231). One end of the hinge plate (233) is hinged to the inner end of the L-shaped rotating rod (231), and the other end of the hinge plate (233) is hinged to the sliding ring (234). The sliding ring (234) is coaxially slidably sleeved on the outside of the output sleeve (22).

2. The four-step platform chip lifting device according to claim 1, characterized in that: A fixed rod (5) is fixedly connected to the top of the base (1). A movable seat (6) is provided on the top of the fixed rod (5). A suction head (7) is provided at the output part of the movable seat (6). A conveyor belt (4) is also provided on the inner side of the base (1). The conveyor belt (4) is located above the four-step top (3) and below the suction head (7).

3. The four-step platform chip lifting device according to claim 1, characterized in that: The output sleeve (22) includes an outer tube (221), an inner tube one (222), an inner tube two (223), an inner tube three (224), and a central shaft (225). The bottom of the outer tube (221) is fixedly connected to the output end of the motor (21). The inner tube one (222), inner tube two (223), and inner tube three (224) are coaxially threaded to the inner side of the outer tube (221) from the outside to the inside. The central shaft (225) is coaxially threaded to the center of the inner side of the inner tube three (224). The thread pitch of the inner side of the outer tube (221), inner tube one (222), inner tube two (223), and inner tube three (224) gradually decreases.

4. The four-step platform chip lifting device according to claim 3, characterized in that: The outer side of the output sleeve (22) is also provided with an unlocking component (24). The unlocking component (24) includes a support ring (241), a second hinge plate (242), and a nested locking plate (243). The support ring (241) is fixedly connected to the top of the sliding ring (234). One end of the second hinge plate (242) is hinged to the support ring (241), and the other end of the second hinge plate (242) is hinged to the nested locking plate (243). The other end of the nested locking plate (243) is fixedly connected to the top of the central shaft (225).

5. The four-step platform chip lifting device according to claim 1, characterized in that: The four-step top (3) includes a fourth-level platform (301), a third-level platform (302), a second-level platform (303), and a first-level platform (304) that are nested and slidably connected from the outside to the inside. The bottom of the fourth-level platform (301) is fixedly connected to the top of the inner tube (222) through a cross plate. The bottom of the third-level platform (302) is fixedly connected to the top of the inner tube (223) through a cross plate. The bottom of the second-level platform (303) is fixedly connected to the top of the inner tube (224) through a cross plate. The bottom of the first-level platform (304) is fixedly connected to the top of the central axis (225).

6. The four-step platform chip lifting device according to claim 5, characterized in that: The top of the fourth-level platform (301), the third-level platform (302), the second-level platform (303), and the first-level platform (304) are evenly provided with a number of pin insertion holes (305).

7. The four-step platform chip lifting device according to claim 5, characterized in that: The top of the fourth-level platform (301), the third-level platform (302), the second-level platform (303), and the first-level platform (304) are all provided with a number of vacuum adsorption holes (306). The interior of the fourth-level platform (301), the third-level platform (302), the second-level platform (303), and the first-level platform (304) are all provided with connecting air passages (307). The connecting air passages (307) are connected to the vacuum adsorption holes (306) on the corresponding platforms. The fourth-level platform (301) is provided with four sets of connectors (308).

8. The four-step platform chip lifting device according to claim 7, characterized in that: The fourth-level platform (301), the third-level platform (302), the second-level platform (303), and the first-level platform (304) have vacuum adsorption holes (306) with staggered flow holes, and the distance between two corresponding staggered flow holes is the same as the relative sliding distance between the fourth-level platform (301), the third-level platform (302), the second-level platform (303), and the first-level platform (304).

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