A method of heat treating a wafer

Abstract

This invention discloses a heat treatment method for wafers, relating to the field of wafer manufacturing technology. The specific steps are as follows: Step 1: Placement; Step 2: Heating; Step 3: Heating; Step 4: Cooling; Step 5: Removal. This invention utilizes a movable mechanism and a displacement mechanism. A motor drives a movable seat to slide within a movable slot. The movable seat's movement synchronously moves the chamber door and the movable platform. The wafer is placed into a positioning frame, inserted into a positioning slot, and positioned within the positioning frame. Then, the positioning frame is placed into a placement slot, where a protrusion inserts into a groove to limit its movement. When the movable seat moves towards the heating chamber, the movable platform drives the positioning frame into the heating chamber. A fixing block automatically moves and inserts into a fixing slot to fix the positioning frame. This facilitates positioning during wafer entry into the heating chamber and ensures a gap between wafers, preventing them from sticking together and affecting uniform heating.

Description

Technical Field

[0001] This invention relates to the field of wafer manufacturing technology, specifically a method for heat treatment of wafers. Background Technology

[0002] Wafer thermal processing is a core process in semiconductor manufacturing. It refers to heating and cooling silicon wafers in a controlled environment to change their physical or chemical properties, thereby achieving specific device functions. This process is mainly divided into two categories based on heating rate, temperature and application scenario: traditional furnace tube process and rapid thermal processing (RTP). The main purpose of wafer thermal processing is to repair lattice defects, activate doped atoms, relieve stress, improve interface quality and promote thin film flow and planarization.

[0003] Rapid thermal processing is a key process in semiconductor manufacturing that heats wafers to high temperatures (typically on the order of 1000°C) within seconds to minutes and optimizes material properties through rapid cooling. This technology uses heat sources such as high-intensity halogen lamps, resistance heaters, or lasers to achieve an extremely fast heating rate of 50°C-100°C per second through thermal radiation, and can precisely control temperature uniformity (within ±1°C). It is mainly used in front-end semiconductor processes such as ion implantation activation, metal film annealing, and ultrathin oxide layer growth, and can effectively reduce thermal budget, reduce lattice defects, and improve device electrical performance.

[0004] However, during the heat treatment process, the wafers need to be arranged on a movable stage. The movable stage moves to bring the wafers into the heating chamber. However, during the movement, the wafers can easily slip off the movable stage and be damaged. In order to position the wafers on the movable stage and avoid the wafers sticking together and affecting the uniformity of heating, a wafer heat treatment method is provided. Summary of the Invention

[0005] The purpose of this invention is to provide a heat treatment method for wafers in order to position the wafers on the moving stage and avoid the wafers from sticking together and affecting the uniformity of heating.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a method for heat treatment of wafers, the specific steps of which are as follows: Step 1: Placement, placing the wafer into the rapid thermal processing equipment; Step 2: Heating. The wafer is heated to the target temperature at a controlled rate using radiant heating, and temperature is controlled using a temperature measuring device to ensure wafer temperature uniformity. Step 3: Heat preservation. The wafer is kept at the target temperature for a preset time to perform electrical activation of impurity atoms, repair of lattice damage, and stress release. Step 4: Cooling down, the wafer is cooled to room temperature at a controlled cooling rate to avoid thermal stress defects; Step 5: Remove the wafer from the rapid thermal processing equipment; As a further embodiment of the present invention: the rapid heat treatment equipment in step one includes a heating chamber, the heating chamber having a heating compartment inside, a mounting base fixedly connected to one end of the heating chamber, a partition fixedly connected to the outer wall of the mounting base, a control terminal provided on one side of the heating chamber, the wafer entering the heating compartment through a movable mechanism, the movable mechanism including a motor, the motor being mounted on one end of the mounting base, the output end of the motor being connected to a first threaded rod, a movable groove being provided on the outer wall of the mounting base above the partition, a movable seat being slidably connected to the inner wall of the movable groove, the first threaded rod passing through the movable seat, a compartment door being fixedly connected to the outer wall of the movable seat, a movable platform being fixedly connected to the outer wall of the compartment door, and a placement groove being provided at the top of the movable platform.

[0007] As a further embodiment of the present invention: the movable mechanism further includes a positioning frame, which is slidably connected to the inner wall of the placement slot. The top of the positioning frame is symmetrically provided with positioning slots, and the bottom sides of the positioning frame are symmetrically provided with fixing slots. The bottom end of the positioning frame is provided with a groove. A protrusion is fixedly connected to the bottom end of the inner wall of the placement slot. A fixing block is symmetrically slidably connected inside the movable platform. The fixing block extends into the inner cavity of the placement slot and is located on both sides of the protrusion. A second threaded rod is rotatably connected inside the movable platform, passing through the fixing block. A spur gear is fixedly connected to one end of the second threaded rod. A gear is slidably connected inside the movable platform at the top end of the spur gear. The gear is displaced by a moving mechanism.

[0008] As a further embodiment of the present invention: the moving mechanism includes a displacement groove, which is formed at the bottom end of the movable seat. A displacement seat is slidably connected to the inner wall of the displacement groove. The displacement seat is fixedly connected to the gear. A support plate is fixedly connected to the outer wall of the mounting base. A baffle is fixedly connected to the top of the support plate. A locking block extending above the support plate is slidably connected inside the support plate. A first spring is connected between the locking block and the support plate. A push frame extending out of the displacement seat is slidably connected inside the displacement seat. A second spring is connected between the push frame and the displacement seat. An inclined groove is formed on the outer wall of the push frame. A sliding rod is slidably connected to the inner wall of the inclined groove. A pressing block is fixedly connected to the outer wall of the sliding rod. The pressing block is slidably connected to the inside of the displacement seat and extends out of the displacement seat.

[0009] As a further embodiment of the present invention: the inner wall of the movable groove is in contact with the outer wall of the movable seat, and the outer wall of the movable seat is provided with a first threaded hole, which matches the first threaded rod.

[0010] As a further embodiment of the present invention: the bottom outer wall of the positioning frame is in contact with the inner wall of the placement groove, and the inner wall of the groove is in contact with the outer wall of the protrusion.

[0011] As a further embodiment of the present invention: the bottom end of the rack is provided with a tooth groove, which meshes with the spur gear.

[0012] As a further embodiment of the present invention: the outer wall of the second threaded rod is symmetrically provided with external threads, the outer wall of the fixing block is provided with a second threaded hole, the second threaded hole matches the external threads, and one end of the outer wall of the fixing block is in contact with the inner wall of the fixing groove.

[0013] As a further embodiment of the present invention: the end of the card block extending from the support plate is provided with an inclined surface, and the outer wall of the displacement seat is in contact with the inner wall of the displacement groove.

[0014] As a further embodiment of the present invention: the inner wall of the inclined groove is in contact with the outer wall of the slide rod, and the top of the push frame is provided with a vertical groove for the extrusion block to slide.

[0015] Compared with the prior art, the beneficial effects of the present invention are: By setting up a movable mechanism and a displacement mechanism, the motor drives the movable seat to slide in the movable slot. The movable seat moves, causing the chamber door and the movable table to move synchronously. The wafer is placed into the positioning frame and inserted into the positioning slot, positioning the wafer in the positioning frame. Then, the positioning frame is placed into the placement slot, at which point the protrusion is inserted into the groove to limit the positioning frame. When the movable seat moves towards the heating chamber, the movable table drives the positioning frame into the heating chamber, and the fixing block automatically moves and inserts into the fixing slot to fix the positioning frame. This facilitates positioning during the wafer's entry into the heating chamber and ensures that there is a gap between the wafers to prevent them from sticking together and affecting the uniformity of heating. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a schematic diagram of the motor installation according to the present invention; Figure 3 This is a schematic diagram of the positioning frame of the present invention; Figure 4 This is a cross-sectional view of the positioning frame of the present invention; Figure 5 This is a schematic diagram of the structure of the movable platform of the present invention; Figure 6 This is a schematic diagram of the installation of the second threaded rod of the present invention; Figure 7 This is a schematic diagram of the installation of the displacement seat of the present invention; Figure 8 This is a schematic diagram of the support plate of the present invention; Figure 9 This is a cross-sectional view of the support plate of the present invention; Figure 10 This is a cross-sectional view of the displacement seat of the present invention; Figure 11 This is a schematic diagram of the pusher frame of the present invention.

[0017] In the diagram: 1. Heating box; 2. Heating chamber; 3. Mounting base; 4. Partition; 5. Control terminal; 6. Movable mechanism; 601. Motor; 602. First threaded rod; 603. Movable groove; 604. Movable seat; 605. Chamber door; 606. Movable platform; 607. Placement groove; 608. Positioning frame; 609. Positioning groove; 610. Fixing groove; 611. Groove; 612. Protrusion; 613. Fixing block; 614. Second threaded rod; 615. Spur gear; 616. Gear rack; 7. Moving mechanism; 701. Displacement seat; 702. Displacement groove; 703. Support plate; 704. Baffle; 705. Locking block; 706. First spring; 707. Push frame; 708. Second spring; 709. Inclined groove; 710. Slide rod; 711. Extrusion block; 8. Vertical groove. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In the description of this invention, it should be noted that unless otherwise explicitly specified and limited, the terms "installed," "connected," "linked," and "set up" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances. The following describes embodiments of the invention based on its overall structure.

[0020] Please see Figures 1 to 11 In this embodiment of the invention, a method for heat treatment of a wafer includes the following specific steps: Step 1: Placement, placing the wafer into the rapid thermal processing equipment; Step 2: Heating. The wafer is heated to the target temperature at a heating rate of 10℃ / s to 250℃ / s, with the target temperature range being 400℃ to 1300℃. Radiation heating is used during the heating process, and closed-loop temperature control is performed through an infrared thermometer to keep the temperature uniformity within the wafer range of ±1℃ to ±5℃.

[0021] Step 3: Heat preservation. Maintain the temperature at the set temperature for a certain period of time to allow the lattice atoms to move and rearrange fully. This stage aims to complete the electrical activation of impurity atoms, lattice damage repair, and stress release. Step 4: Cooling down and controlling the cooling rate. Slowly or quickly cool the wafer to room temperature to avoid the formation of new defects due to thermal stress. Step 5: Remove the wafer from the rapid thermal processing equipment.

[0022] Please refer to this carefully. Figures 2 to 7The rapid heat treatment equipment in step one includes a heating chamber 1, with a heating compartment 2 inside the heating chamber 1. A mounting base 3 is fixedly connected to one end of the heating chamber 1, and a partition 4 is fixedly connected to the outer wall of the mounting base 3. A control terminal 5 is located on one side of the heating chamber 1. The wafer enters the heating compartment 2 through a moving mechanism 6. The moving mechanism 6 includes a motor 601, which is mounted on one end of the mounting base 3. A first threaded rod 602 is connected to the output end of the motor 601. A movable groove 603 is formed on the outer wall of the mounting base 3 above the partition 4. A movable seat 604 is slidably connected to the inner wall of the movable groove 603. The first threaded rod 602 passes through the movable seat 604. A chamber door 605 is fixedly connected to the outer wall of the movable seat 604, and a movable platform 606 is fixedly connected to the outer wall of the chamber door 605. A placement groove 607 is formed at the top of the movable platform 606. Mechanism 6 also includes a positioning frame 608, which is slidably connected to the inner wall of the placement groove 607. The top of the positioning frame 608 is symmetrically provided with positioning grooves 609, and the bottom sides of the positioning frame 608 are symmetrically provided with fixing grooves 610. The bottom end of the positioning frame 608 is provided with a groove 611. The bottom end of the inner wall of the placement groove 607 is fixedly connected with a protrusion 612. The interior of the movable platform 606 is symmetrically slidably connected with a fixing block 613. The fixing block 613 extends into the inner cavity of the placement groove 607 and is located on both sides of the protrusion 612. The interior of the movable platform 606 is rotatably connected with a second threaded rod 614 that passes through the fixing block 613. One end of the second threaded rod 614 is fixedly connected with a spur gear 615. The interior of the movable platform 606 is slidably connected with a rack 616 at the top of the spur gear 615. The rack 616 is displaced by the moving mechanism 7.

[0023] In this embodiment: the motor 601 drives the first threaded rod 602 to rotate, the rotation of the first threaded rod 602 drives the movable seat 604 to move, the movable seat 604 slides in the movable groove 603, and the movement of the movable seat 604 drives the door 605 and the movable table 606 to move synchronously; the wafer is placed in the positioning frame 608, the wafer is inserted into the positioning groove 609, the wafer is positioned in the positioning frame 608, and a gap exists between the wafers to avoid sticking together and affecting the uniformity of heating; Next, the positioning frame 608 is placed into the placement slot 607. At this time, the protrusion 612 is inserted into the groove 611 to limit the positioning frame 608. When the movable seat 604 moves towards the heating chamber 2, the movable table 606 drives the positioning frame 608 into the heating chamber 2. At the same time, the rack 616 is displaced relative to the movable table 606 by the cooperation of the parts in the moving mechanism 7. The displacement of the rack 616 drives the spur gear 615 to rotate. The rotation of the spur gear 615 drives the second threaded rod 614 to rotate. The rotation of the second threaded rod 614 drives... Two fixed blocks 613 move closer to each other and are inserted into the fixed groove 610 to fix the positioning frame 608. When the movable seat 604 moves and drives the movable stage 606 out of the heating chamber 2, the toothed rod 616 moves in the opposite direction with the cooperation of the parts in the moving mechanism 7. The fixed blocks 613 move out of the fixed groove 610 and automatically cancel the fixation of the positioning frame 608. This facilitates the positioning of the wafers during the process of entering the heating chamber 2 and ensures that there is a gap between the wafers to avoid them sticking together and affecting the uniformity of heating.

[0024] Please refer to this carefully. Figures 7 to 11 The moving mechanism 7 includes a displacement groove 702, which is located at the bottom of the movable seat 604. A displacement seat 701 is slidably connected to the inner wall of the displacement groove 702. The displacement seat 701 is fixedly connected to the rack 616. A support plate 703 is fixedly connected to the outer wall of the mounting base 3. A baffle 704 is fixedly connected to the top of the support plate 703. A locking block 705 extending above the support plate 703 is slidably connected inside the support plate 703. The locking block 705 and the support plate 703 are connected... A first spring 706 is connected between the displacement seat 701 and the displacement seat 701. A pusher 707 extending out of the displacement seat 701 is slidably connected inside the displacement seat 701. A second spring 708 is connected between the pusher 707 and the displacement seat 701. An inclined groove 709 is opened on the outer wall of the pusher 707. A slide rod 710 is slidably connected to the inner wall of the inclined groove 709. An extrusion block 711 is fixedly connected to the outer wall of the slide rod 710. The extrusion block 711 is slidably connected to the inside of the displacement seat 701 and extends out of the displacement seat 701.

[0025] In this embodiment: when the movable seat 604 moves the movable platform 606 out of the heating chamber 2, the displacement seat 701 is located at the end of the displacement groove 702 near the movable platform 606. The displacement of the movable seat 604 causes the displacement seat 701 to move synchronously until it contacts the baffle 704. During this process, the displacement seat 701 contacts the locking block 705, pushing the locking block 705 to move and squeezing the first spring 706 until the locking block 705 separates from the displacement seat 701. The locking block 705 is reset by the elastic force of the first spring 706, so that the displacement seat 701 is located between the baffle 704 and the locking block 705. When the movable seat 604 drives the movable platform 606 into the heating chamber 2, the movable seat 604 displaces. The displacement seat 701, located between the locking block 705 and the baffle 704, cannot move. This causes the displacement seat 701 to slide relative to the movable seat 604 in the displacement groove 702. The displacement of the displacement seat 701 drives the rack 616 to move synchronously until the pressing block 711 contacts the inner wall of the displacement groove 702. The pressing block 711 is subjected to force and moves. The displacement of the pressing block 711 drives the slide rod 710 to slide in the inclined groove 709, pushing the push frame 707 to move downward, compressing the second spring 708. The displacement of the push frame 707 pushes the locking block 705 to move and separate from the displacement seat 701, so that the displacement seat 701 can move synchronously with the movable seat 604. This facilitates the automatic control of the rack 616 to move when the movable platform 606 moves into and out of the heating chamber 2, thereby automatically fixing and releasing the positioning frame 608.

[0026] Please refer to this carefully. Figures 2 to 7 The inner wall of the movable groove 603 fits against the outer wall of the movable seat 604. The outer wall of the movable seat 604 is provided with a first threaded hole, which matches the first threaded rod 602.

[0027] In this embodiment: the motor 601 drives the first threaded rod 602 to rotate, the rotation of the first threaded rod 602 drives the movable seat 604 to move, and the movable seat 604 slides in the movable groove 603.

[0028] Please refer to this carefully. Figures 2 to 7 The bottom outer wall of the positioning frame 608 fits against the inner wall of the placement groove 607, and the inner wall of the groove 611 fits against the outer wall of the protrusion 612.

[0029] In this embodiment: the wafer is placed in the positioning holder 608, the wafer is inserted into the positioning groove 609, and the wafer is positioned in the positioning holder 608; then the positioning holder 608 is placed in the placement groove 607, at which time the protrusion 612 is inserted into the groove 611 to limit the positioning holder 608.

[0030] Please refer to this carefully. Figures 2 to 7 The bottom end of the rack 616 is provided with a tooth groove, which meshes with the spur gear 615.

[0031] In this embodiment: the displacement of the rack 616 drives the spur gear 615 to rotate, and the rotation of the spur gear 615 drives the second threaded rod 614 to rotate.

[0032] Please refer to this carefully. Figures 2 to 7 The outer wall of the second threaded rod 614 is symmetrically provided with external threads, and the outer wall of the fixing block 613 is provided with a second threaded hole. The second threaded hole matches the external thread, and the outer wall of one end of the fixing block 613 fits against the inner wall of the fixing groove 610.

[0033] In this embodiment: the rotation of the second threaded rod 614 causes the two fixed blocks 613 to move closer to each other and displace. The fixed blocks 613 are displaced and inserted into the fixed groove 610 to fix the positioning frame 608.

[0034] Please refer to this carefully. Figures 7 to 11 The end of the card block 705 extending from the support plate 703 is provided with a slope, and the outer wall of the displacement seat 701 is in contact with the inner wall of the displacement groove 702.

[0035] In this embodiment: the displacement seat 701 contacts the locking block 705, pushing the locking block 705 to move, which compresses the first spring 706 until the locking block 705 separates from the displacement seat 701. The locking block 705 is reset by the elastic force of the first spring 706, so that the displacement seat 701 is located between the baffle 704 and the locking block 705. When the movable seat 604 drives the movable platform 606 into the heating chamber 2, the movable seat 604 moves, and the displacement seat 701 is located between the locking block 705 and the baffle 704 and cannot move, so that the displacement seat 701 slides relative to the movable seat 604 in the displacement groove 702.

[0036] Please refer to this carefully. Figures 7 to 11 The inner wall of the inclined groove 709 fits against the outer wall of the slide bar 710, and the top of the push frame 707 is provided with a vertical groove 8 for the extrusion block 711 to slide.

[0037] In this embodiment: the displacement seat 701 slides relative to the movable seat 604 in the displacement groove 702. The displacement of the displacement seat 701 drives the toothed rod 616 to move synchronously until the pressing block 711 contacts the inner wall of the displacement groove 702. The pressing block 711 is subjected to force and moves. The displacement of the pressing block 711 drives the slide rod 710 to slide in the inclined groove 709, pushing the push frame 707 to move downward, compressing the second spring 708. The displacement of the push frame 707 pushes the locking block 705 to move and separate from the displacement seat 701.

[0038] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A method for heat treatment of a wafer, characterized in that, The specific steps are as follows: Step 1: Placement – ​​Place the wafer into the rapid thermal processing equipment; Step 2: Heating. The wafer is heated to the target temperature at a controlled rate using radiant heating, and temperature is controlled using a temperature measuring device to ensure wafer temperature uniformity. Step 3: Heat preservation. The wafer is kept at the target temperature for a preset time to perform electrical activation of impurity atoms, repair of lattice damage, and stress release. Step 4: Cooling down, the wafer is cooled to room temperature at a controlled cooling rate to avoid thermal stress defects; Step 5: Remove the wafer from the rapid thermal processing equipment; The rapid heat treatment equipment in step one includes a heating box (1), a heating chamber (2) is provided inside the heating box (1), a mounting base (3) is fixedly connected to one end of the heating box (1), a partition (4) is fixedly connected to the outer wall of the mounting base (3), a control terminal (5) is provided on one side of the heating box (1), the wafer enters the heating chamber (2) through a moving mechanism (6), the moving mechanism (6) includes a motor (601), the motor (601) is installed at one end of the mounting base (3), and the motor (601) 1) The output end is connected to a first threaded rod (602). The outer wall of the mounting base (3) is provided with a movable groove (603) above the partition (4). The inner wall of the movable groove (603) is slidably connected to a movable seat (604). The first threaded rod (602) passes through the movable seat (604). The outer wall of the movable seat (604) is fixedly connected to a door (605). The outer wall of the door (605) is fixedly connected to a movable platform (606). The top of the movable platform (606) is provided with a placement groove (607).

2. The wafer heat treatment method according to claim 1, characterized in that, The movable mechanism (6) also includes a positioning frame (608), which is slidably connected to the inner wall of the placement slot (607). The top of the positioning frame (608) has symmetrically provided positioning slots (609), and the bottom sides of the positioning frame (608) have symmetrically provided fixing slots (610). The bottom end of the positioning frame (608) has a groove (611). A protrusion (612) is fixedly connected to the bottom end of the inner wall of the placement slot (607). A fixing block (612) is symmetrically slidably connected inside the movable platform (606). 13) The fixed block (613) extends into the inner cavity of the placement groove (607) and is located on both sides of the protrusion (612). The movable platform (606) is rotatably connected to a second threaded rod (614) that passes through the fixed block (613). One end of the second threaded rod (614) is fixedly connected to a spur gear (615). The movable platform (606) is slidably connected to a rack (616) at the top of the spur gear (615). The rack (616) is displaced by a moving mechanism (7).

3. The wafer heat treatment method according to claim 2, characterized in that, The moving mechanism (7) includes a displacement groove (702), which is located at the bottom of the movable seat (604). A displacement seat (701) is slidably connected to the inner wall of the displacement groove (702). The displacement seat (701) is fixedly connected to the rack (616). A support plate (703) is fixedly connected to the outer wall of the mounting base (3). A baffle (704) is fixedly connected to the top of the support plate (703). A locking block (705) extending above the support plate (703) is slidably connected to the inside of the support plate (703). The locking block (705) is connected to the support plate (704). 3) A first spring (706) is connected between them. A pusher (707) extending out of the displacement seat (701) is slidably connected inside the displacement seat (701). A second spring (708) is connected between the pusher (707) and the displacement seat (701). An inclined groove (709) is opened on the outer wall of the pusher (707). A slide rod (710) is slidably connected to the inner wall of the inclined groove (709). An extrusion block (711) is fixedly connected to the outer wall of the slide rod (710). The extrusion block (711) is slidably connected inside the displacement seat (701) and extends out of the displacement seat (701).

4. The wafer heat treatment method according to claim 2, characterized in that, The inner wall of the movable groove (603) fits against the outer wall of the movable seat (604), and the outer wall of the movable seat (604) is provided with a first threaded hole, which matches the first threaded rod (602).

5. The wafer heat treatment method according to claim 2, characterized in that, The bottom outer wall of the positioning frame (608) is in contact with the inner wall of the placement groove (607), and the inner wall of the groove (611) is in contact with the outer wall of the protrusion (612).

6. The wafer heat treatment method according to claim 2, characterized in that, The bottom end of the rack (616) is provided with a tooth groove, which meshes with the spur gear (615).

7. The wafer heat treatment method according to claim 2, characterized in that, The outer wall of the second threaded rod (614) is symmetrically provided with external threads, and the outer wall of the fixing block (613) is provided with a second threaded hole. The second threaded hole matches the external thread, and the outer wall of one end of the fixing block (613) is in contact with the inner wall of the fixing groove (610).

8. The wafer heat treatment method according to claim 3, characterized in that, The card block (705) extends from one end of the support plate (703) and is provided with an inclined surface. The outer wall of the displacement seat (701) is in contact with the inner wall of the displacement groove (702).

9. A wafer heat treatment method according to claim 3, characterized in that, The inner wall of the inclined groove (709) is in contact with the outer wall of the slide bar (710), and the top of the push frame (707) is provided with a vertical groove (8) for the extrusion block (711) to slide.

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