A semiconductor wafer cleaning device

Abstract

This application relates to the field of silicon wafer cleaning technology and discloses a semiconductor silicon wafer cleaning device, including a left partition and a right partition. Each partition has a partition groove, and the left partition is movably connected to the left partition via the partition groove, while the right partition is movably connected to the right partition via the partition groove. The silicon wafer is surrounded by the left and right partitions. This invention, by symmetrically arranging two partitions within a carrying frame and securing the silicon wafer within the carrying grooves of the two partitions, and by placing the left partition within one partition and the right partition within the other, protects several linearly arranged silicon wafers. This ensures that when solid particles settled on the shunt plate rise due to the operation of the megaacoustic transducer, the solid particles cannot pass through the left and right partitions and remain suspended around the silicon wafer, effectively improving the protection of the silicon wafer and reducing the possibility of solid particles threatening the silicon wafer surface.

Description

Technical Field

[0001] This application relates to the field of silicon wafer cleaning technology, and more particularly to a semiconductor silicon wafer cleaning apparatus. Background Technology

[0002] Semiconductor silicon wafers are thin, circular sheets with atomically flat surfaces formed by processing monocrystalline silicon as a substrate through a series of processes (cutting, grinding, polishing, etc.). Semiconductor silicon wafers are the core material for chip manufacturing. Through processes such as photolithography, etching, and deposition, hundreds of millions of transistors and interconnect circuits can be built on the surface of silicon wafers.

[0003] Silicon wafer cleaning is a core process throughout the entire chip manufacturing process. Its purpose is to restore the surface of the silicon wafer to an atomically clean state before each process step. Semiconductor silicon wafer cleaning often uses a wet cleaning process, in which the silicon wafer is placed vertically in a carrier frame and sequentially passes through cleaning tanks containing different chemical solutions, combined with megasonic waves, to achieve thorough cleaning of the silicon wafer surface.

[0004] However, existing semiconductor silicon wafer cleaning equipment still has some defects in use: First, during operation, the megasonic transducer is installed at the bottom of the tank, and its acoustic flow effect drives the liquid to form a macroscopic circulation flow, causing some solid particles that have settled at the bottom of the tank to rise and float around the silicon wafer, thus threatening the surface of the silicon wafer; Second, because the carrier frame generally uses point contact to clamp the silicon wafer, the small contact area between the two leads to stress concentration, thereby increasing the risk of silicon wafer edge breakage. Summary of the Invention

[0005] This application proposes a semiconductor silicon wafer cleaning apparatus, which has the advantages of effectively designing the separation method of the silicon wafer to reduce the possibility of solid particles threatening the surface of the silicon wafer, and changing the clamping method of the silicon wafer to reduce the possibility of edge breakage of the silicon wafer, thereby solving the above-mentioned problems.

[0006] To achieve the above objectives, this application adopts the following technical solution: a semiconductor silicon wafer cleaning apparatus, comprising:

[0007] A carrying frame, wherein the carrying frame is a rectangular frame;

[0008] The container frame is fixedly connected to the left and right sides inside, and the two partitions are arranged symmetrically.

[0009] The silicon wafers have several loading slots on one side of each of the two separators, and the silicon wafers are placed vertically between the loading slots of the two separators. The number of silicon wafers is several, and the silicon wafers are arranged in a linear manner.

[0010] The left and right partitions each have a partition groove. The left partition is movably connected to the left partition through the partition groove, and the right partition is movably connected to the right partition through the partition groove. The silicon wafer is surrounded by the left and right partitions. When the settled solid particles rise again, the left and right partitions can be used to protect the silicon wafer.

[0011] Furthermore, both the left and right partitions consist of an arc-shaped member and multiple inclined members. The arc-shaped member is located in the upper half of the left and right partitions, and the center of the arc-shaped member coincides with the center of the silicon wafer. The inclined members are located in the lower half of the left and right partitions, and the inclined members on the left and right partitions are in opposite directions. The inclined members on the left and right partitions are arranged in a cross pattern, and the number of silicon wafers is one less than the number of inclined members.

[0012] Furthermore, power components are provided on both the front and rear sides of the interior of the partition, and one end of the power component is fixedly connected to the end of the left or right partition. Two power components on the same partition move in opposite directions, and two power components on different partitions but on the same side move in the same direction.

[0013] Furthermore, the movable range of the left and right partitions is the horizontal width of an inclined member.

[0014] Furthermore, each of the spacers is provided with a set of support members, and each set of support members consists of two vertically symmetrical support members. Each silicon wafer is provided with two sets of support members, and the two sets of support members are symmetrical from left to right. The support members include:

[0015] The support shell has a support hole on the inner wall of the partition, and the support hole connects the loading groove and the partition groove. The outer wall of the support shell is fixedly sleeved with the support hole of the partition.

[0016] The support shaft is movably sleeved between the inner wall of the support shell and one end of the support shaft. The other end of the support shaft is arc-shaped and is provided with a buffer pad that can contact the edge surface of the silicon wafer. A compression spring is provided between the support shell and the support shaft.

[0017] Furthermore, the interior of the partition is fixedly embedded with magnetic conditions, and the magnetic conditions and the support members are located on both sides of the left partition or the right partition, respectively. Each partition is provided with two magnetic conditions, and the two magnetic conditions are symmetrical vertically. The two magnetic conditions correspond to several support members at the same height and in different groups.

[0018] The magnetic condition is an electromagnet, and when energized, the magnet has a magnetic field that repels the support shaft.

[0019] Furthermore, the left and right partitions are made of a material that can shield magnetic fields, and each of the left and right partitions has two sets of magnetic penetration holes, with each set of magnetic penetration holes corresponding to a magnetic condition.

[0020] For two sets of magnetic holes arranged diagonally, the two sets of magnetic holes are arranged in the same axial direction on the left and right partitions. For two sets of magnetic holes arranged at the same height, the two sets of magnetic holes are arranged alternately and overlapped in the axial direction on the left and right partitions.

[0021] Furthermore, the loading frame, separator, left partition, right partition, power component, magnetic condition, and support component together constitute a fixing mechanism, which is used to load silicon wafers.

[0022] Furthermore, the fixing mechanism is placed within the working mechanism, the working mechanism comprising:

[0023] The outer tank and the inner tank are fixedly fitted inside the outer tank. The top surface of the inner tank is lower than the top surface of the outer tank, and the inner tank divides the internal space of the outer tank into a cleaning tank and a recycling tank.

[0024] Connecting plates are fixedly connected to the front and rear sides of the inner tank;

[0025] Diverter plate, the top of the connecting plate is fixedly mounted on the diverter plate;

[0026] The inlet pipe has two inlet pipes fixedly sleeved inside the connecting plate. The inlet end of the inlet pipe passes through the outer tank and is connected to the liquid system. The outlet end of the inlet pipe faces the diversion plate.

[0027] The slag discharge pipeline has a discharge port on the inner wall of the outer tank located on the top surface of the connecting plate, and a discharge port on the inner wall of the outer tank located on the bottom surface of the recovery tank. The outer tank is movably connected to the slag discharge pipeline through the discharge port.

[0028] The connecting plate has three mega-sound transducers fixedly sleeved inside it, and the three mega-sound transducers are located at the left, middle and right ends of the connecting plate, respectively.

[0029] The top of the diversion plate is fixedly connected to two sets of lower plates, and the two sets of lower plates are symmetrical from left to right. Each set of lower plates is composed of two symmetrically arranged lower plates, and the cross-section of the lower plate is a right triangle.

[0030] An upper upright plate is fixedly mounted between the upper half of the two lower upright plates in the same group.

[0031] The beneficial effects of this invention are as follows:

[0032] This application provides a semiconductor silicon wafer cleaning apparatus. By symmetrically arranging two separators within a carrying frame and clamping the silicon wafers into the carrying slots of the two separators, and by arranging a left separator within one separator and a right separator within the other separator, the left and right separators protect several linearly arranged silicon wafers. Thus, when the megaacoustic transducer operates and causes solid particles that have settled onto the shunt plate to surge upwards, the apparatus ensures that the solid particles cannot pass through the left and right separators and remain suspended around the silicon wafers, effectively improving the protection of the silicon wafers and reducing the possibility of solid particles threatening the surface of the silicon wafers.

[0033] By designing the shapes of the left and right partitions and installing power components at both ends of the left and right partitions, the solid particles are effectively restricted from moving downwards during operation. This causes them to tilt downwards along the left and right partitions until they settle on the diversion plate, ensuring smooth settling of the solid particles. Furthermore, the settled solid particles are restricted by their landing position and are less likely to surge back to the silicon wafer, further improving the protection of the silicon wafer. In addition, the power components drive the left and right partitions to move in the same direction, changing the position of the left and right partitions corresponding to the silicon wafer, thereby changing the falling position of the solid particles and preventing too many solid particles from depositing at the same position, which would affect the protection of the silicon wafer.

[0034] By setting a set of supports in each loading slot of the separator, and the supports being composed of a support shell and a support shaft, the contact area with the edge of the silicon wafer is increased by using the supports, turning point contact into surface contact, reducing stress, and lowering the possibility of silicon wafer edge breakage.

[0035] By setting a set of magnetic conditions within the separator, with the magnetic conditions corresponding to the position of the support, and opening magnetic through holes on the left and right separators, when the power component pushes the left and right separators to move, the movement direction of the same set of support components can be changed, thereby changing the position of the silicon wafer clamping point and thus enhancing the thoroughness of silicon wafer cleaning. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort:

[0037] Figure 1 This is a three-dimensional structural diagram of the working mechanism, fixing mechanism, and silicon wafer in this invention;

[0038] Figure 2 This is a cross-sectional three-dimensional structural diagram of the working mechanism, fixing mechanism, and silicon wafer in this invention;

[0039] Figure 3 This is a cross-sectional three-dimensional structural diagram of the working mechanism in this invention;

[0040] Figure 4 This is a three-dimensional structural diagram of the flow divider and its components in this invention;

[0041] Figure 5 This is a three-dimensional structural diagram of the fixing mechanism and silicon wafer in this invention;

[0042] Figure 6 This is a cross-sectional three-dimensional structural diagram of the fixing mechanism and the silicon wafer in this invention;

[0043] Figure 7 This is a three-dimensional cross-sectional view of the fixing mechanism located at the right partition in this invention and the silicon wafer.

[0044] Figure 8 This is a three-dimensional cross-sectional view of the fixing mechanism located at the left spacer in this invention;

[0045] Figure 9 In this invention Figure 8 Enlarged structural diagram at point A;

[0046] Figure 10 In this invention Figure 8 Enlarged structural diagram at point B;

[0047] Figure 11 This is a three-dimensional structural diagram of the fixing mechanism and silicon wafer without a loading frame in this invention;

[0048] Figure 12 This is a three-dimensional structural diagram of the fixing mechanism in this invention that does not have a loading frame, separators, and silicon wafers;

[0049] Figure 13 In this invention Figure 12 Enlarged structural diagram at point C;

[0050] Figure 14 This is a three-dimensional structural diagram of the left partition, right partition, and power component in this invention;

[0051] Figure 15 This is a three-dimensional structural diagram of the silicon wafer, magnetic conditions, and support components in this invention.

[0052] In the diagram: 1. Working mechanism; 11. Outer tank; 12. Inner tank; 13. Liquid inlet pipe; 14. Slag outlet pipe; 15. Connecting plate; 16. Megasonic transducer; 17. Diverter plate; 18. Lower vertical plate; 19. Upper vertical plate; 2. Fixing mechanism; 21. Loading frame; 3. Separator; 4. Silicon wafer; 5a. Left separator; 5b. Right separator; 6. Power component; 7. Magnetic condition; 8. Support component; 81. Support shell; 82. Support shaft. Detailed Implementation

[0053] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0054] Example 1: A semiconductor silicon wafer cleaning apparatus, such as... Figure 1 It includes a working mechanism 1, a fixing mechanism 2 is placed inside the working mechanism 1, and a silicon wafer 4 is vertically placed inside the fixing mechanism 2, specifically:

[0055] like Figure 1- As shown in Figure 4, the working mechanism 1 includes an outer tank 11, an inner tank 12, a liquid inlet pipe 13, a slag outlet pipe 14, a connecting plate 15, a megasonic transducer 16, a flow divider 17, a lower vertical plate 18, and an upper vertical plate 19. The inner tank 12 is fixedly sleeved inside the outer tank 11, and the top surface of the inner tank 12 is lower than the top surface of the outer tank 11. The inner tank 12 divides the internal space of the outer tank 11 into a cleaning tank and a recovery tank. The fixing mechanism 2 carrying the silicon wafer 4 is located in the cleaning tank. The connecting plate 15 is fixedly connected to the front and rear sides of the inner tank 12, and the flow divider 17 is fixedly mounted on the top of the connecting plate 15, so that the liquid entering the inner tank 12 is evenly upward. The spraying process ensures that the chemicals in the solution make uniform contact with each silicon wafer 4 to clean the surface of the silicon wafer 4. Two liquid inlet pipes 13 are fixedly sleeved inside the connecting plate 15, and the inlet end of the liquid inlet pipe 13 passes through the outer tank 11 and is connected to the solution system. The outlet end of the liquid inlet pipe 13 faces the diversion plate 17. A discharge port is opened on the inner wall of the outer tank 11 located on the top surface of the connecting plate 15, and a discharge port is opened on the inner wall of the outer tank 11 located on the bottom surface of the recovery tank. The outer tank 11 is movably sleeved with the slag discharge pipe 14 through the discharge port. Three mega-sonic transducers 16 are fixedly sleeved inside the connecting plate 15, and the three mega-sonic transducers 16 are located at the left, middle and right ends of the connecting plate 15, respectively. At the end, the megasonic transducer 16 utilizes high-frequency sound waves to generate cavitation in the liquid medicine, forming microbubbles that explode and powerfully remove microparticles adsorbed on the surface. Two sets of lower vertical plates 18 are fixedly connected to the top of the diverter plate 17, and these two sets of lower vertical plates 18 are symmetrical. Each set of lower vertical plates 18 consists of two symmetrically arranged lower vertical plates 18, and the cross-section of each lower vertical plate 18 is a right-angled triangle, facilitating the settling of solid particles onto the top surface of the connecting plate 15. An upper vertical plate 19 is fixedly mounted between the upper halves of the two lower vertical plates 18 in the same set, providing a placement point for the fixing mechanism 2 and enhancing its stability within the cleaning tank. In summary, during operation, the solid particles are first... The fixed mechanism 2 is placed inside the working mechanism 1. Then, the liquid is discharged into the bottom of the cleaning tank through the liquid inlet pipe 13 and evenly distributed around each silicon wafer 4 through the diversion plate 17 to clean the surface of the silicon wafer 4. At the same time, the megasonic transducer 16 works to generate high-frequency vibration, which enhances the surface cleaning effect of the silicon wafer 4, removes impurities from the surface of the silicon wafer 4, and makes them accumulate in the liquid. As the liquid inlet pipe 13 continues to supply liquid, organic matter and light particles floating on the liquid surface will overflow out of the cleaning tank and enter the recovery tank. At the same time, large silicon powder particles and metal debris will be deposited on the top surface of the connecting plate 15. Then, the impurities are discharged from the working mechanism 1 by opening each slag outlet pipe 14.

[0056] like Figure 5- As shown in Figure 8, the fixing mechanism 2 includes a carrying frame 21, partitions 3, a left partition 5a, and a right partition 5b. The carrying frame 21 is a rectangular frame, and handles are provided on both the front and rear sides of the carrying frame 21 for easy gripping by the robotic arm, thereby realizing the transfer of the carrying frame 21. Partitions 3 are fixedly connected to the left and right sides of the interior of the carrying frame 21, and the two partitions 3 are symmetrically arranged. Figures 11-12 Each of the two separators 3 has several loading slots on one side, and the silicon wafers 4 are vertically placed between the loading slots of the two separators 3. There are several silicon wafers 4, and they are arranged linearly to facilitate effective cleaning of the surface of the silicon wafers 4 by the cleaning solution. Each of the two separators 3 has a partition groove. The left separator 3 is movably connected to the left partition 5a through the partition groove, and the right separator 3 is movably connected to the right partition 5b through the partition groove. The silicon wafers 4 are surrounded by the left partition 5a and the right partition 5b. When the settled solid particles rise again, the left partition 5a and the right partition 5b can protect the silicon wafers 4, ensuring that the solid particles deposited below the left partition 5a and the right partition 5b cannot pass vertically through the left partition 5a and the right partition 5b and are suspended around the silicon wafers 4, effectively improving the protection of the silicon wafers 4 and reducing the possibility of solid particles threatening the surface of the silicon wafers 4.

[0057] Example 2, based on Example 1, such as Figures 6-14 Both the left partition 5a and the right partition 5b consist of an arc-shaped member and multiple inclined members. The arc-shaped member is located in the upper half of the left partition 5a and the right partition 5b, and the center of the arc-shaped member coincides with the center of the silicon wafer 4. The inclined members are located in the lower half of the left partition 5a and the right partition 5b, and the inclined members on the left partition 5a and the right partition 5b are in opposite directions. The inclined members on the left partition 5a and the right partition 5b are arranged intersectingly, and the number of silicon wafers 4 is one less than the number of inclined members, effectively ensuring that each silicon wafer 4 is always... Located above an inclined member to block the upward surge of solid particles, when solid particles settle downwards, the left partition 5a and right partition 5b effectively define the downward movement path of the solid particles, causing them to move downwards at an angle along the left partition 5a and right partition 5b until they completely settle onto the diversion plate 17, thereby ensuring the smooth settling of solid particles. When solid particles surge upwards again after settling, the solid particles are restricted by the landing position and are not likely to surge upwards to the vicinity of the silicon wafer 4, thereby further improving the protection effect of the silicon wafer 4 and reducing the possibility of solid particles threatening the surface of the silicon wafer 4.

[0058] Example 3, based on Example 2, such as Figures 11-12The fixing mechanism 2 also includes a power component 6. The power component 6 is provided on both the front and rear sides of the interior of the partition 3. One end of the power component 6 is fixedly connected to the end of the left partition 5a or the right partition 5b. The two power components 6 located on the same partition 3 move in opposite directions, and the two power components 6 located on different partitions 3 and on the same side move in the same direction. That is, the power component 6 can provide power for the movement of the left partition 5a and the right partition 5b, so that the left partition 5a and the right partition 5b can move in the same direction and synchronously, thereby changing the tilting member corresponding to the silicon wafer 4.

[0059] like Figure 14 The movable range of the left partition 5a and the right partition 5b is the horizontal width of an inclined member. When the left partition 5a and the right partition 5b move forward or backward by the horizontal width of an inclined member, the corresponding inclined member of the silicon wafer 4 changes. Since the directions of the two adjacent inclined members are opposite, the falling direction of the solid particles is opposite before and after the left partition 5a and the right partition 5b move, thereby changing the falling position of the solid particles and preventing too many solid particles from being deposited at the same position, which would affect the protection effect on the silicon wafer 4.

[0060] Example 4, based on Example 3, such as Figures 11-15 The fixing mechanism 2 also includes support members 8. Each loading slot of a partition 3 is provided with a set of support members 8, and each set of support members 8 consists of two vertically symmetrical support members 8. A silicon wafer 4 is provided with two sets of support members 8, and the two sets of support members 8 are symmetrical from left to right. When the fixing mechanism 2 is lifted and lowered as a whole, the two sets of support members 8 can ensure the stability of the silicon wafer 4. The support member 8 includes a support shell 81 and a support shaft 82, such as Figures 7-10 The inner wall of the separator 3 is provided with a support hole, which connects the loading groove and the separation groove. The outer wall of the support shell 81 is fixedly sleeved with the support hole of the separator 3. The inner wall of the support shell 81 is movably sleeved with one end of the support shaft 82. The other end of the support shaft 82 is arc-shaped and is provided with a buffer pad that can contact the edge surface of the silicon wafer 4. This increases the contact area of ​​the silicon wafer 4 edge by using the support member 8, changing the point contact to a surface contact, thereby reducing stress and reducing the possibility of the silicon wafer 4 edge breaking. In addition, a compression spring is provided between the support shell 81 and the support shaft 82, which can provide power for the support shaft 82 to retract and no longer clamp the silicon wafer 4.

[0061] Example 5, based on Example 4, such as Figures 7-15The fixing mechanism 2 also includes a magnetic condition 7. The magnetic condition 7 is fixedly embedded inside the partition 3, and the magnetic condition 7 and the support member 8 are located on both sides of the left partition 5a or the right partition 5b, respectively. Each partition 3 is provided with two magnetic conditions 7, and the two magnetic conditions 7 are symmetrical vertically. The two magnetic conditions 7 correspond to several support members 8 at the same height but in different groups. The magnetic condition 7 is an electromagnet, and when the magnetic condition 7 is energized, it has a magnetic repulsion with the support shaft 82. That is, the magnetic condition 7 can provide power for the support shaft 82 to clamp the silicon wafer 4, so that the two magnetic conditions 7 can control the two support members 8 in the same group respectively, while one magnetic condition 7 can simultaneously control several support members 8 in different groups but at the same height.

[0062] like Figure 14 The left spacer 5a and the right spacer 5b are made of a material that can shield magnetic fields. Both the left spacer 5a and the right spacer 5b have two sets of magnetic through holes, and each set of magnetic through holes corresponds to a magnetic condition 7. When the support member 8 corresponds to the magnetic through hole, the magnetic condition 7 can apply a magnetic repulsive force to the support member 8 to push the support member 8 to clamp the silicon wafer 4. When the support member 8 does not correspond to the magnetic through hole, that is, when the wall surface of the left spacer 5a and the right spacer 5b is located between the magnetic condition 7 and the support member 8, the magnetic field is shielded, so that the magnetic condition 7 cannot apply a magnetic repulsive force to the support member 8, so that the support member 8 does not clamp the silicon wafer 4 under the action of the compression spring.

[0063] like Figures 12-15For the two sets of magnetic through holes arranged diagonally, the two sets of magnetic through holes are arranged identically in the axial direction of the left spacer 5a and the right spacer 5b. For the two sets of magnetic through holes arranged at the same height, the two sets of magnetic through holes are alternately arranged and overlapped in the axial direction of the left spacer 5a and the right spacer 5b. This makes the two sets of support members 8 arranged diagonally have the same action effect, and the two sets of support members 8 arranged at the same height have opposite action effects. Therefore, no matter where the left spacer 5a and the right spacer 5b move, there is always a magnetic condition 7 that applies a magnetic repulsive force to the support members 8 to ensure the stability of the silicon wafer 4 being clamped. Specifically, if the left spacer 5a and the right spacer 5b are pushed to the front or rear end of the movable range under the action of the power member 6, only two support members 8 apply a clamping force to the silicon wafer 4, while the other two support members 8... No clamping force is applied to it. The two support members 8 are diagonally designed, and the center line of the two support members 8 passes through the center of the silicon wafer 4. If the left partition 5a and the right partition 5b are pushed to the middle of the movable range under the action of the power member 6, all four support members 8 apply clamping force to the silicon wafer 4. In summary, during the movement of the left partition 5a and the right partition 5b, that is, during the process of changing the clamping point position of the silicon wafer 4, the silicon wafer 4 is first clamped by the two diagonally arranged support members 8, then by the four support members 8 simultaneously, and finally by the two diagonally arranged support members 8. This not only effectively ensures the stability of the silicon wafer 4, but also enhances the thoroughness of the cleaning of the silicon wafer 4 and prevents the surface contact design between the support members 8 and the silicon wafer 4 from affecting the cleaning effect of the surface of the silicon wafer 4.

[0064] The working principle of this invention is as follows:

[0065] Before cleaning, the silicon wafers 4 are installed one by one into the loading slots of the separator 3. Then, the magnetic condition 7 is energized, and the power unit 6 is started and the left separator 5a and the right separator 5b are moved to the middle of the movable range, so that the four support members 8 clamp the silicon wafers 4 at the same time and maintain this state so that the loading frame 21 containing the silicon wafers 4 is transferred into the working mechanism 1.

[0066] During cleaning, the inlet pipe 13 continuously feeds the cleaning solution into the cleaning tank. The solution then passes through the distributor plate 17 and is evenly dispersed around the silicon wafer 4. With the assistance of the high-frequency sound waves from the megasonic transducer 16, the silicon wafer 4 is thoroughly cleaned, allowing impurities on its surface to be removed. Throughout this process, the left partition 5a and right partition 5b continuously block the silicon wafer 4, preventing solid particles that settle along them from rising back up to the surface, effectively improving the protection of the silicon wafer 4 and reducing the possibility of solid particles threatening its surface. During this process, the power unit 6... The positions of the left spacer 5a and the right spacer 5b relative to the silicon wafer 4 can be changed, thereby changing the falling position of the solid particles and preventing too many solid particles from depositing at the same position, which would affect the protective effect on the silicon wafer 4. Specifically, the power unit 6 first moves the left spacer 5a and the right spacer 5b to the front end of the movable range. At this time, the two diagonally opposite support members 8 clamp and fix the silicon wafer 4 and soak it for a period of time. Then, the power unit 6 moves the left spacer 5a and the right spacer 5b to the rear end of the movable range. At this time, the other two diagonally opposite support members 8 clamp and fix the silicon wafer 4 and soak it for the same amount of time.

[0067] After cleaning, the power unit 6 controls the left partition 5a and the right partition 5b to move to the middle of the movable range. At this time, the four support members 8 simultaneously clamp and fix the silicon wafer 4, and maintain this state so that the loading frame 21 containing the silicon wafer 4 is transferred to the outside of the working mechanism 1. Finally, the magnetic condition 7 is de-energized, causing the support members 8 to stop clamping the silicon wafer 4, making it convenient to remove the silicon wafer 4.

[0068] During the immersion cleaning process, the support member 8 is designed to make surface contact with the edge of the silicon wafer 4, which effectively increases the contact area between the two and changes the point contact to surface contact, thereby reducing stress and lowering the possibility of edge breakage of the silicon wafer 4. At the same time, as the left spacer 5a and the right spacer 5b move forward or backward, the clamping point position of the silicon wafer 4 is effectively changed, thereby enhancing the overall cleaning of the silicon wafer 4 and preventing the surface contact design between the support member 8 and the silicon wafer 4 from affecting the cleaning effect on the surface of the silicon wafer 4.

[0069] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A semiconductor silicon wafer cleaning apparatus, characterized in that, include: The container (21) is a rectangular frame; The partition (3) is fixedly connected to the left and right sides of the interior of the carrying frame (21), and the two partitions (3) are symmetrically arranged; The silicon wafer (4) has several loading slots on one side of each of the two separators (3), and the silicon wafer (4) is placed vertically between the loading slots of the two separators (3). The number of silicon wafers (4) is several, and the silicon wafers (4) are arranged in a linear manner. The left partition (5a) and the right partition (5b) are both provided with partition grooves. The left partition (3) is movably connected to the left partition (5a) through the partition groove, and the right partition (3) is movably connected to the right partition (5b) through the partition groove. The silicon wafer (4) is surrounded by the left partition (5a) and the right partition (5b). When the settled solid particles rise again, the left partition (5a) and the right partition (5b) can be used to protect the silicon wafer (4).

2. The semiconductor silicon wafer cleaning apparatus according to claim 1, characterized in that, The left partition (5a) and the right partition (5b) are each composed of an arc-shaped member and multiple inclined members. The arc-shaped member is located in the upper half of the left partition (5a) and the right partition (5b), and the center of the arc-shaped member coincides with the center of the silicon wafer (4). The inclined members are located in the lower half of the left partition (5a) and the right partition (5b), and the inclined members on the left partition (5a) and the right partition (5b) are in opposite directions. The inclined members on the left partition (5a) and the right partition (5b) are arranged in a cross pattern, and the number of silicon wafers (4) is one less than the number of inclined members.

3. The semiconductor silicon wafer cleaning apparatus according to claim 2, characterized in that, Power components (6) are provided on both the front and rear sides of the interior of the partition (3), and one end of the power component (6) is fixedly connected to the end of the left partition (5a) or the right partition (5b). The two power components (6) located on the same partition (3) move in opposite directions, and the two power components (6) located on different partitions (3) and on the same side move in the same direction.

4. The semiconductor silicon wafer cleaning apparatus according to claim 3, characterized in that, The movable range of the left partition (5a) and the right partition (5b) is the horizontal width of an inclined member.

5. The semiconductor silicon wafer cleaning apparatus according to claim 4, characterized in that, Each of the partitions (3) has a set of support members (8) in each loading slot, and each set of support members (8) consists of two vertically symmetrical support members (8). Each silicon wafer (4) has two sets of support members (8) corresponding to it, and the two sets of support members (8) are symmetrical from left to right. The support members (8) include: The inner wall of the support shell (81) and the partition (3) is provided with a support hole, and the support hole connects the loading groove and the partition groove. The outer wall of the support shell (81) is fixedly sleeved with the support hole of the partition (3). The inner wall of the support shell (81) is movably connected to one end of the support shaft (82). The other end of the support shaft (82) is arc-shaped, and the end of the support shaft (82) is provided with a buffer pad and can contact the edge surface of the silicon wafer (4). A compression spring is provided between the support shell (81) and the support shaft (82).

6. The semiconductor silicon wafer cleaning apparatus according to claim 5, characterized in that, The separator (3) is fixedly embedded with a magnetic condition (7), and the magnetic condition (7) and the support (8) are located on the left partition (5a) or the right partition (5b) respectively. One separator (3) is provided with two magnetic conditions (7), and the two magnetic conditions (7) are symmetrical from top to bottom. The two magnetic conditions (7) correspond to several support (8) at the same height and in different groups respectively. The magnetic condition (7) is an electromagnet, and the energized magnetic condition (7) has a magnetism that repels the support shaft (82).

7. The semiconductor silicon wafer cleaning apparatus according to claim 6, characterized in that, The left partition (5a) and the right partition (5b) are made of a material that can shield magnetic fields. Both the left partition (5a) and the right partition (5b) are provided with two sets of magnetic penetration holes, and each set of magnetic penetration holes corresponds to a magnetic condition (7). For two sets of magnetic holes arranged diagonally opposite each other, the two sets of magnetic holes are arranged in the same axial direction on the left partition (5a) and the right partition (5b). For two sets of magnetic holes arranged at the same height, the two sets of magnetic holes are arranged alternately and overlapped in the axial direction on the left partition (5a) and the right partition (5b).

8. The semiconductor silicon wafer cleaning apparatus according to claim 7, characterized in that, The loading frame (21), the separator (3), the left separator (5a), the right separator (5b), the power unit (6), the magnetic condition (7) and the support unit (8) together constitute the fixing mechanism (2), and the fixing mechanism (2) is used to load the silicon wafer (4).

9. The semiconductor silicon wafer cleaning apparatus according to claim 8, characterized in that, The fixing mechanism (2) is placed inside the working mechanism (1), and the working mechanism (1) includes: The outer tank (11) and the inner tank (12) are fixedly fitted inside the outer tank (11). The top surface of the inner tank (12) is lower than the top surface of the outer tank (11), and the inner tank (12) divides the internal space of the outer tank (11) into a cleaning tank and a recycling tank. Connecting plate (15): The inner front and rear sides of the inner groove (12) are fixedly connected to the connecting plate (15); Diverter plate (17), the top of the connecting plate (15) is fixedly mounted with diverter plate (17). Two inlet pipes (13) are fixedly sleeved inside the connecting plate (15), and the inlet end of the inlet pipe (13) passes through the outer tank (11) and is connected to the liquid system. The outlet end of the inlet pipe (13) faces the diversion plate (17). The slag discharge pipeline (14) has a discharge port on the inner wall of the outer tank (11) located on the top surface of the connecting plate (15), and a discharge port on the inner wall of the outer tank (11) located on the bottom surface of the recycling tank. The outer tank (11) is movably connected to the slag discharge pipeline (14) through the discharge port. The connecting plate (15) has three mega-sound transducers (16) fixedly sleeved inside it, and the three mega-sound transducers (16) are located at the left end, middle end and right end of the connecting plate (15) respectively. The bottom plate (18) is fixedly connected to the top of the diversion plate (17) with two sets of bottom plates (18), and the two sets of bottom plates (18) are symmetrical from left to right. One set of bottom plates (18) is composed of two symmetrically arranged bottom plates (18), and the cross section of the bottom plate (18) is a right triangle. An upper upright plate (19) is fixedly mounted between the upper halves of the two lower upright plates (18) in the same group.

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