Micro stress clamping mechanism and semiconductor device

Abstract

This application relates to the field of semiconductor technology, providing a micro-stress clamping mechanism and a semiconductor device. The micro-stress clamping mechanism includes a base, a clamping member, a driving member, and an elastic member. The space between the first clamping part and the second clamping part can be used to accommodate a thin-film target object, including but not limited to a wafer. The driving member drives the second clamping part to move toward the first clamping part, so that the second clamping part can move to contact the upper surface of the wafer, so that the second clamping part and the first clamping part can clamp and fix the wafer. The elastic member is connected to the second clamping part, and the elastic force of the elastic member can drive the second clamping part to move toward the first clamping part, thereby providing a stable clamping force acting on the wafer. When wafers of different thicknesses are disposed between the second clamping part and the first clamping part, the elastic member can drive the second clamping part to stably clamp the upper surface of the wafer, so that wafers of different thicknesses can be stably and reliably fixed.

Description

Technical Field

[0001] This application relates to a micro-stress clamping mechanism and semiconductor equipment, belonging to the field of semiconductor measurement technology. Background Technology

[0002] In the field of semiconductor metrology, it is necessary to measure the flatness, warpage, nano-morphology, and edge curl of wafers to monitor the wafer manufacturing process and results. Correspondingly, a fixing device is needed to stabilize the wafer during precision measurement, thereby improving measurement accuracy.

[0003] Current fixing devices hold wafers in place by clamping their edges. However, it is difficult to maintain a consistent clamping force when measuring wafers of different thicknesses. This can lead to excessive clamping force on some wafers, causing deformation, which in turn reduces measurement accuracy or even damages the wafers. Summary of the Invention

[0004] This application provides a micro-stress clamping mechanism and semiconductor device to solve the problem of unstable clamping force of automatic wafer fixing devices in related technologies.

[0005] To achieve the above objectives, this application adopts the following technical solution: In a first aspect, this application provides a micro-stress clamping mechanism for clamping thin-film target objects, including but not limited to wafers. The micro-stress clamping mechanism includes: Base; The clamping member includes a first clamping part and a second clamping part, wherein the first clamping part is disposed on the base and the second clamping part is movably disposed on the base; A driving member is connected to the second clamping part, and the driving member is configured to drive the second clamping part to move toward or away from the first clamping part, so as to reduce or increase the distance between the second clamping part and the first clamping part; An elastic element is connected to the second clamping part. When the second clamping part moves away from the first clamping part, the elastic element deforms to generate an elastic force.

[0006] In some embodiments, the direction in which the second clamping portion faces the first clamping portion is a first direction, and the driving member is further configured to drive the second clamping portion to reciprocate along a second direction, the second direction intersecting the first direction.

[0007] In some embodiments, the driving member includes a driving part and a transmission part, the driving part being connected to the second clamping part via the transmission part, the driving force of the driving part being in the second direction, and the transmission part being configured to convert at least a portion of the driving force of the driving part into a force in the first direction.

[0008] In some embodiments, the transmission part includes a transmission plate, a first transmission block, a second transmission block, and an elastic part. The transmission plate is disposed on the base and has a transmission groove. The transmission groove includes a first groove segment and a second groove segment connected together. The first groove segment is disposed along the second direction, and the second groove segment is disposed at an angle of less than 90 degrees to the first groove segment. The first transmission block and the second transmission block are arranged along the second direction and connected by an elastic part. The first transmission block is movably embedded in the transmission groove, and the second clamping part is connected to the second transmission block. The deformation direction of the elastic part is the second direction.

[0009] In some embodiments, the transmission plate further has a guide groove, which is arranged along the first direction, and the second transmission block is movably embedded in the guide groove.

[0010] In some embodiments, the transmission unit further includes a first baffle and a second baffle, the second baffle being located on the side of the first transmission block opposite to the second transmission block, the first baffle being located on the side of the second transmission block opposite to the first transmission block, the first baffle being positioned to limit the second transmission block in the second direction, and the second baffle being positioned to limit the first transmission block in the opposite direction of the second direction.

[0011] In some embodiments, the transmission unit further includes an adjusting rod movably disposed on the transmission plate, the adjusting rod being configured to reciprocate in the first direction to limit the stroke of the second transmission block in the first direction.

[0012] In some embodiments, the adjusting rod is threadedly connected to the transmission plate, and when the adjusting rod rotates 360°, the force exerted by the second clamping part on the wafer changes by 0.006N.

[0013] In some embodiments, the transmission unit further includes a position sensor disposed on the first transmission block and / or the second transmission block, the position sensor being configured to detect the relative position of the first transmission block and / or the second transmission block with respect to the base.

[0014] In some embodiments, there are two transmission plates, which are arranged at intervals relative to each other along a third direction. The two sides of the first transmission block are respectively movably embedded in the transmission grooves of the two transmission plates, and the third direction intersects with both the first direction and the second direction.

[0015] In some embodiments, the clamping member further includes a limiting part disposed on the second transmission block, the elastic element is a flexible spring bearing disposed on the second transmission block, the second clamping part is rotatably connected to the second transmission block through the elastic element, and the limiting part is limited and cooperates with the second clamping part in the rotation direction of the second clamping part.

[0016] In some embodiments, the maximum rotatable angle of the second clamping part relative to the second transmission block is 2.46°, the stiffness coefficient of the flexible spring bearing is 0.26 N·mm / °, the distance between the end of the second clamping part away from the second transmission block and the rotatable connection point of the second clamping part and the second transmission block is 32.4 mm, and the maximum clamping force of the second clamping part on the wafer is 0.08 N.

[0017] In some embodiments, the driving element is a cylinder, the cylinder including a push rod connected to the first transmission block, the push rod being configured to reciprocate along the second direction.

[0018] In some embodiments, the cylinder further includes a cylinder body, a piston, and a return spring. The piston is movably disposed within the cylinder body, the push rod is connected to the piston, and the return spring is connected to the piston. When the piston drives the first transmission block to move in the opposite direction along the second direction via the push rod, the deformation of the return spring increases.

[0019] In some embodiments, the surfaces of the second clamping portion and the first clamping portion opposite to each other are both arc surfaces, and the protrusion directions of the surfaces of the second clamping portion and the first clamping portion opposite to each other are opposite.

[0020] In some embodiments, along the second direction, the outer diameter of the surface of the second clamping portion opposite to the first clamping portion gradually decreases.

[0021] In some embodiments, there are multiple clamping members, multiple driving members, and multiple elastic members, and each of the multiple clamping members, multiple driving members, and multiple elastic members is arranged in a one-to-one correspondence, and the multiple clamping members, multiple driving members, and multiple elastic members are evenly spaced along a preset circumference.

[0022] In some embodiments, the micro-stress clamping mechanism further includes a soft pad located on the sidewall of the first clamping portion in the second direction, and the pad is opposite to the wafer.

[0023] In some embodiments, the gasket is made of fluororubber.

[0024] In some embodiments, when the thickness of the wafer is 0.2mm-2.5mm, the clamping force applied to the wafer by the micro-stress clamping mechanism is in the range of 0.08N-0.0997N, 0.07N-0.0872N, or 0.06N-0.0748N; When the thickness of the wafer is greater than 2.5 mm, the micro-stress clamping mechanism applies a clamping force of 4 N to 8 N to the wafer.

[0025] In some embodiments, the first clamping portion has a limiting block, the maximum distance between the limiting block and the second clamping portion being less than 0.2 mm, to limit the wafer in the radial direction.

[0026] Secondly, based on the micro-stress clamping mechanism described above, this application also provides a semiconductor device including the micro-stress clamping mechanism described above.

[0027] In the micro-stress clamping mechanism provided in this application, the space between the first clamping part and the second clamping part can be used to accommodate a thin-film target object, including but not limited to a wafer. The wafer can be disposed on the first clamping part, such that the first clamping part is supported on the lower surface of the wafer. A driving member drives the second clamping part to move toward the first clamping part, so that the second clamping part can move to contact the upper surface of the wafer, so that the second clamping part and the first clamping part can clamp and fix the wafer for inspection. After the wafer inspection is completed, the driving member drives the second clamping part to move away from the first clamping part, so that the second clamping part separates from the upper surface of the wafer, thereby releasing the wafer. An elastic member is connected to the second clamping part, and the elastic force of the elastic member can drive the second clamping part to move toward the first clamping part, thereby providing a stable clamping force acting on the wafer. When wafers of different thicknesses are placed between the second clamping part and the first clamping part, the elastic element has different deformations, and the elastic element can drive the second clamping part to stably clamp the upper surface of the wafer, so that wafers of different thicknesses can be stably and reliably placed between the second clamping part and the first clamping part.

[0028] The semiconductor device provided in this application includes the aforementioned micro-stress clamping mechanism, which enables the semiconductor device to achieve higher precision in semiconductor detection. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1This is a schematic diagram of the micro-stress clamping mechanism provided in the embodiments of this application.

[0031] Figure 2 This is one of the schematic diagrams of the transmission part of the micro-stress clamping mechanism provided in the embodiments of this application.

[0032] Figure 3 This is a second schematic diagram of the transmission part of the micro-stress clamping mechanism provided in the embodiments of this application.

[0033] Figure 4 This is the third schematic diagram of the transmission part of the micro-stress clamping mechanism provided in the embodiments of this application.

[0034] Figure 5 The fourth schematic diagram of the transmission part of the micro-stress clamping mechanism provided in the embodiments of this application.

[0035] Figure 6 The fifth schematic diagram of the transmission part of the micro-stress clamping mechanism provided in the embodiments of this application.

[0036] Figure 7 This is a schematic diagram of the transmission plate of the micro-stress clamping mechanism provided in the embodiments of this application.

[0037] Figure 8 This is a schematic diagram of the elastic element of the micro-stress clamping mechanism provided in the embodiments of this application.

[0038] Figure 9 A schematic diagram showing the maximum included angle between the second clamping part and the first clamping part of the micro-stress clamping mechanism provided in the embodiments of this application.

[0039] Figure 10 This is a schematic diagram of the limiting part of the micro-stress clamping mechanism provided in the embodiments of this application.

[0040] Figure 11 A schematic diagram of the first and second clamping surfaces of the micro-stress clamping mechanism provided in the embodiments of this application.

[0041] Figure 12 This is a schematic diagram showing the wafer disposed between the first clamping part and the second clamping part in the micro-stress clamping mechanism provided in the embodiment of this application.

[0042] Figure 13 A schematic diagram showing the maximum gap between the second clamping part and the first clamping part of the micro-stress clamping mechanism provided in the embodiments of this application.

[0043] Figure 14 This is a schematic diagram showing that the number of clamping elements in the micro-stress clamping mechanism provided in the embodiment of this application is three.

[0044] Figure 15 This is a schematic diagram showing that the number of clamping elements in the micro-stress clamping mechanism provided in the embodiments of this application is six.

[0045] Figure 16 This is a schematic diagram showing the range of clamping force of the second clamping part on the wafer in the micro-stress clamping mechanism provided in the embodiments of this application.

[0046] Explanation of reference numerals in the attached figures: 100-Base; 200 - Clamping component; 210 - First clamping part; 211 - First clamping surface; 212 - Limiting block; 213 - Gasket; 220 - Second clamping part; 221 - Second clamping surface; 230 - Limiting part; 300-Driver component; 310-Drive unit; 311-Push rod; 312-Cylinder body; 313-Piston; 314-Return spring; 320-Transmission unit; 321-Transmission plate; 321a-First groove segment; 321b-Second groove segment; 321c-Guide groove; 322-First transmission block; 322a-First transmission protrusion; 323-Second transmission block; 323a-Second transmission protrusion; 324-Elastic part; 325-First baffle; 326-Second baffle; 327-Adjusting rod; 328-Position sensor; 400 - Elastic component; 500-Wafer. Detailed Implementation

[0047] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0048] In the field of semiconductor metrology, it is necessary to measure the flatness, warpage, nano-morphology, and edge curl of wafers to monitor the wafer manufacturing process and results. Correspondingly, a fixing device is needed to stabilize the wafer during precision measurement, thereby improving measurement accuracy.

[0049] Current fixing devices hold wafers in place by clamping their edges. However, it is difficult to maintain a consistent clamping force when measuring wafers of different thicknesses. This can lead to excessive clamping force on some wafers, causing deformation, which in turn reduces measurement accuracy or even damages the wafers.

[0050] In the micro-stress clamping mechanism proposed in this application, the space between the first clamping part and the second clamping part can be used to accommodate a thin-film target object, including but not limited to a wafer. The wafer can be disposed on the first clamping part, such that the first clamping part is supported on the lower surface of the wafer. A driving member drives the second clamping part to move toward the first clamping part, so that the second clamping part can move to contact the upper surface of the wafer, so that the second clamping part and the first clamping part can clamp and fix the wafer for inspection. After the wafer inspection is completed, the driving member drives the second clamping part to move away from the first clamping part, so that the second clamping part separates from the upper surface of the wafer, thereby releasing the wafer. An elastic member is connected to the second clamping part, and the elastic force of the elastic member can drive the second clamping part to move toward the first clamping part, thereby providing a stable clamping force acting on the wafer. When wafers of different thicknesses are placed between the second clamping part and the first clamping part, the elastic element has different deformations, and the elastic element can drive the second clamping part to stably clamp the upper surface of the wafer, so that wafers of different thicknesses can be stably and reliably placed between the second clamping part and the first clamping part.

[0051] The semiconductor device provided in this application includes the aforementioned micro-stress clamping mechanism, which enables the semiconductor device to achieve higher precision in semiconductor detection.

[0052] The contents of this application will now be described in detail with reference to the accompanying drawings, so that those skilled in the art can have a clearer and more detailed understanding of the contents of this application.

[0053] This application proposes a micro-stress clamping mechanism, referencing... Figures 1 to 2 As shown, it includes a base 100, a clamping member 200, a driving member 300, and an elastic member 400. This micro-stress clamping mechanism can be applied in semiconductor devices.

[0054] The base 100 is the fundamental component of the micro-stress clamping mechanism of this application, and it provides a mounting base for at least some other components of the micro-stress clamping mechanism. The base 100 can be made of metal, giving it better structural strength, thus improving its durability and reliability. Alternatively, the base 100 can be made of polymer material, achieving a certain structural strength while maintaining a relatively light weight. Furthermore, the base 100 can also employ a structure combining some metal and some polymer materials. Specifically, the main structure of the base 100 and parts susceptible to external impact or damage can be made of metal, while other parts can be made of polymer material. This allows the base 100 to achieve good structural strength without excessive weight, thereby reducing the weight of the micro-stress clamping mechanism.

[0055] The clamping member 200 includes a first clamping portion 210 and a second clamping portion 220. The first clamping portion 210 is disposed on the base 100, such that the first clamping portion 210 is relatively fixed to the base 100. The second clamping portion 220 is movably disposed on the base 100, such that the second clamping portion 220 can move relative to the base 100. The second clamping portion 220 is disposed opposite to the first clamping portion 210, and a wafer 500 can be mounted between the second clamping portion 220 and the first clamping portion 210. The wafer 500 can be placed on the first clamping portion 210. A driving member 300 is connected to the second clamping portion 220, and the driving member 300 can drive the second clamping portion 220 to move toward or away from the first clamping portion 210.

[0056] When the driving member 300 drives the second clamping part 220 to move toward the first clamping part 210, the distance between the second clamping part 220 and the first clamping part 210 can be reduced, allowing the second clamping part 220 to move to contact the side of the wafer facing away from the first clamping part 210. In this way, the second clamping part 220 and the first clamping part 210 can clamp the wafer between them to fix the wafer between the second clamping part 220 and the first clamping part 210.

[0057] When the driving member 300 drives the second clamping part 220 to move away from the first clamping part 210, the distance between the second clamping part 220 and the first clamping part 210 can be increased, allowing the second clamping part 220 to move to separate from the side of the wafer away from the first clamping part 210. In this way, the second clamping part 220 and the first clamping part 210 no longer clamp the wafer between them, thus allowing the wafer to be removed from between the second clamping part 220 and the first clamping part 210.

[0058] Furthermore, by controlling the distance between the second clamping part 220 and the first clamping part 210 through the driving member 300, wafers of different thicknesses can be matched with the gap between the second clamping part 220 and the first clamping part 210. In this way, wafers of different thicknesses can be clamped by the second clamping part 220 and the first clamping part 210, so that wafers of different thicknesses can be stably fixed between the second clamping part 220 and the first clamping part 210.

[0059] The elastic element 400 is connected to the second clamping portion 220. When the second clamping portion 220 moves away from the first clamping portion 210, the elastic element 400 deforms to generate an elastic force. The elastic force of the elastic element 400 can drive the second clamping portion 220 to move towards the first clamping portion 210, providing pressure on the side of the wafer facing away from the first clamping portion 210. Specifically, when wafers of different thicknesses are disposed between the second clamping portion 220 and the first clamping portion 210, the distance between the second clamping portion 220 and the first clamping portion 210 is different, resulting in different degrees of deformation of the elastic element 400. The greater the stroke of the second clamping portion 220 moving away from the first clamping portion 210, the greater the degree of deformation of the elastic element 400, and the greater the elastic force generated. In this way, wafers of different thicknesses can be fixed between the second clamping portion 220 and the first clamping portion 210 by driving the second clamping portion 220 through the elastic force of the elastic element 400.

[0060] In this application, the driving member 300 can drive the second clamping part 220 to move until the distance between the second clamping part 220 and the first clamping part 210 is less than the thickness of the wafer to be tested. When the wafer is placed between the second clamping part 220 and the first clamping part 210, the wafer can push the second clamping part 220 to move away from the first clamping part 210, causing the elastic member 400 to deform and generate an elastic force. The elastic force of the elastic member 400 can drive the second clamping part 220 to make close contact with the side of the wafer away from the first clamping part 210. Wafers of different thicknesses cause the elastic member 400 to deform to different degrees. By controlling the deformation of the elastic member 400 within a certain range, the force exerted by the elastic member 400 on the second clamping part 220 on wafers of different thicknesses can be kept within a certain range, avoiding excessive pressure on wafers with excessive thickness and thus preventing damage. After the wafer is fixed by the micro-stress clamping mechanism of this application, multiple tests can be performed on the wafer by the testing equipment. Since the wafer is fixed stably and reliably, and the wafer structure is stable and undeformed, the testing accuracy of the wafer is higher.

[0061] In some implementations, reference Figure 1 As shown, the direction of the second clamping part 220 toward the first clamping part 210 is the first direction. The driving member 300 is also configured to drive the second clamping part 220 to reciprocate along the second direction, which intersects with the first direction. This allows the driving member 300 to move the second clamping part 220 to be opposite or offset from the first clamping part 210. The second direction and the first direction can be perpendicular, so that during the process of the driving member 300 driving the second clamping part 220 to be opposite or offset from the first clamping part 210, the distance between the second clamping part 220 and the first clamping part 210 can remain consistent. The first direction is... Figure 1 The direction of the middle X-axis, the second direction is Figure 1 The direction of the Y-axis.

[0062] Specifically, when it is necessary to clamp and fix the wafer disposed on the first clamping part 210, the driving member 300 can first drive the second clamping part 220 to move to be opposite to the first clamping part 210, and then drive the second clamping part 220 to move toward the first clamping part 210, so that the second clamping part 220 can move to contact the surface of the wafer on the side opposite to the first clamping part 210, so that the second clamping part 220 and the first clamping part 210 can clamp and fix the wafer.

[0063] When it is necessary to separate the second clamping part 220 from the wafer, the drive member 300 can first drive the second clamping part 220 to move away from the first clamping part 210, and then drive the second clamping part 220 to move to a position that is misaligned with the first clamping part 210, and then the wafer can be removed from the first clamping part 210.

[0064] By driving the second clamping part 220 to move along the second direction using the driving member 300, the second clamping part 220 is misaligned with the first clamping part 210, allowing for a larger distance between them. This enables the wafer to be placed on the first clamping part 210 from above, preventing interference between the wafer and the second clamping part 220 during installation or removal from the first clamping part 210, and facilitating easy loading and unloading of the wafer from the first clamping part 210.

[0065] When the driving component 300 drives the second clamping part 220 to reciprocate along the second direction, the second clamping part 220 and the wafer have a certain distance between them, so that the second clamping part 220 will not contact the wafer. In this way, the second clamping part 220 will not exert a radial force on the wafer, so that the wafer will not be subjected to additional force and deformation, ensuring the structural stability of the wafer, thereby improving the testing accuracy of the wafer.

[0066] In addition, the second clamping part 220 does not contact the wafer when it reciprocates along the second direction, which can also prevent the second clamping part 220 from rubbing against the wafer, causing particulate contaminants to be generated on the wafer surface, thus ensuring the cleanliness of the wafer surface.

[0067] In some implementations, reference Figure 2 As shown, the drive unit 300 of this application may further include a drive unit 310 and a transmission unit 320. The drive unit 310 is connected to the second clamping unit 220 through the transmission unit 320. The driving force direction of the drive unit 310 is a second direction, and the transmission unit 320 is configured to convert at least a portion of the driving force of the drive unit 310 into a force in a first direction.

[0068] By providing the transmission unit 320, the drive unit 310 can output driving force in a single direction, thereby driving the second clamping unit 220 to move along either the first or second direction. This simplifies the structure of the drive unit 310, eliminating the need for it to output driving force in multiple directions.

[0069] In some implementations, reference Figures 2 to 7 As shown, in order to convert a portion of the driving force output by the drive unit 310 into a force in a first direction, the transmission unit 320 of this application includes a transmission plate 321, a first transmission block 322, a second transmission block 323, and an elastic part 324. The transmission plate 321 is disposed on the base 100 and has a transmission groove. The transmission groove includes a first groove segment 321a and a second groove segment 321b connected together. The first groove segment 321a is disposed along a second direction, and the second groove segment 321b is disposed at an angle of less than 90 degrees to the first groove segment 321a. Specifically, one end of the first groove segment 321a is connected to one end of the second groove segment 321b, making the entire transmission groove bend and extend in two directions.

[0070] The first transmission block 322 and the second transmission block 323 are arranged along the second direction and connected by an elastic part 324. The first transmission block 322 is movably embedded in the transmission groove, and the second clamping part 220 is connected to the second transmission block 323. The first transmission block 322 can move along the transmission groove, specifically from the first groove segment 321a to the second groove segment 321b, or from the second groove segment 321b to the first groove segment 321a. Because the first transmission block 322 and the second transmission block 323 are connected, the second transmission block 323 can move along with the first transmission block 322.

[0071] When the drive unit 310 applies a driving force in the second direction to the first transmission block 322, and the first transmission block 322 moves along the first groove segment 321a, the second transmission block 323 and the second clamping part 220 connected to the second transmission block 323 also move along the first groove segment 321a, thereby causing the second clamping part 220 to move along the second direction until the second clamping part 220 is opposite to the first clamping part 210. Because the second groove segment 321b is bent relative to the first groove segment 321a, the second groove segment 321b extends both along the first direction and the second direction. The drive unit 310 continues to drive the first transmission block 322 to move along the second groove segment 321b, so that the driving force applied by the drive unit 310 to the first transmission block 322 can be converted into a partial movement along the first direction and a partial movement along the second direction. The second groove segment 321b can guide the first transmission block 322 to move entirely along the second direction while also moving along the first direction.

[0072] Since the second transmission block 323 is connected to the first transmission block 322 through the elastic part 324, and the deformation direction of the elastic part 324 is the second direction, the elastic part 324 can absorb the force exerted by the first transmission block 322 on the second transmission block 323 in the second direction. Thus, the force exerted by the first transmission block 322 on the second transmission block 323 in the first direction can drive the second transmission block 323 to move along the first direction, causing the second clamping part 220 to also move along the first direction. This allows the second clamping part 220 to move toward the first clamping part 210 until the second clamping part 220 clamps the wafer.

[0073] When the driving unit 310 drives the first transmission block 322 to move in the opposite direction of the second direction, the elastic part 324 can absorb the force exerted by the first transmission block 322 on the second transmission block 323 in the opposite direction of the second direction, causing the second transmission block 323 to move in the opposite direction of the first direction, and the second transmission block 323 will not move in the opposite direction of the second direction at this time. After the first transmission block 322 moves to the connection between the second groove segment 321b and the first groove segment 321a, the first transmission block 322 can continue to move in the opposite direction of the second direction within the first groove segment 321a, so that the second transmission block 323 can also move in the opposite direction of the second direction, so that the second clamping part 220 can be misaligned with the first clamping part 210.

[0074] Specifically, the first transmission block 322 may include a first transmission protrusion 322a, which may be embedded in the transmission groove so that the first transmission protrusion 322a can slide along the transmission groove.

[0075] In some implementations, reference Figures 2 to 6 As shown, the transmission plate 321 of this application may further include a guide groove 321c, which is disposed along a first direction, and the second transmission block 323 is embedded in the guide groove 321c. The guide groove 321c serves to guide the second transmission block 323, thereby limiting the movement direction of the second transmission block 323, so that the second transmission block 323 can only reciprocate along the first direction. This prevents the second transmission block 323 from deflecting during reciprocating movement along the first direction, so that the second clamping part 220 can stably clamp the wafer.

[0076] Specifically, the second transmission block 323 may include a second transmission protrusion 323a, which may be embedded in the guide groove 321c, so that the second transmission protrusion 323a can slide along the guide groove 321c.

[0077] In some implementations, reference Figure 2As shown, the transmission unit 320 also includes a first baffle 325 and a second baffle 326. The second baffle 326 is located on the side of the first transmission block 322 facing away from the second transmission block 323, and the first baffle 325 is located on the side of the second transmission plate 321 facing away from the first transmission block 322. The first baffle 325 upper limit the second transmission block 323 in the second direction, and the second baffle 326 upper limit the first transmission block 322 in the opposite direction of the second direction.

[0078] The first baffle 325 can limit the movement of the second transmission block 323 in the second direction, preventing the second transmission block 323 from moving excessively in the second direction. Correspondingly, it can prevent the first transmission block 322 and the second clamping part 220 connected to the second transmission block 323 from moving excessively in the second direction. Specifically, when the driving part 310 drives the first transmission part 320 to move in the second direction until the second transmission block 323 abuts against the first baffle 325, the second clamping part 220 and the first clamping part 210 can be directly opposite each other.

[0079] The second baffle 326 can limit the movement stroke of the first transmission block 322 in the opposite direction of the second direction, preventing the first transmission block 322 from moving excessively in the opposite direction of the second direction. Correspondingly, it can prevent the second transmission block 323 and the second clamping part 220 connected to the first transmission block 322 from moving excessively in the opposite direction of the second direction. Specifically, when the driving part 310 drives the first transmission part 320 to move in the opposite direction of the second direction until the first transmission block 322 abuts against the second baffle 326, the second clamping part 220 and the first clamping part 210 can be completely misaligned.

[0080] In some implementations, reference Figure 8 and Figure 9 As shown, the transmission part 320 of this application also includes an adjusting rod 327, which is movably disposed on the transmission plate 321. The adjusting rod 327 is configured to reciprocate in a first direction to limit the stroke of the second transmission block 323 in the first direction. Specifically, when the second transmission block 323 moves to the point where the second clamping part 220 is opposite to the first clamping part 210, the adjusting rod 327 can move in the first direction to change the distance between the adjusting rod 327 and the second transmission block 323. When the distance between the adjusting rod 327 and the second transmission block 323 is large, the second transmission block 323 can move a large stroke in the second direction before abutting against the adjusting block and being limited. When the distance between the adjusting rod 327 and the second transmission block 323 is small, the second transmission block 323 can move a small stroke in the second direction before abutting against the adjusting block and being limited.

[0081] The greater the stroke of the second transmission block 323 along the second direction, the smaller the distance between the second clamping part 220 and the first clamping part 210, and the thinner the wafer that can be clamped and fixed between the second clamping part 220 and the first clamping part 210. Therefore, by changing the position of the adjusting rod 327, the thickness range of the wafer that can be fixed by the micro-stress clamping mechanism of this application can be adjusted accordingly, making the applicability of the micro-stress clamping mechanism better.

[0082] The adjusting rod 327 is connected to the transmission plate 321 via a threaded connection. Rotating the adjusting rod 327 allows it to move axially, thus reciprocating in a first direction. Specifically, rotating the adjusting rod 327 one full turn (360°) adjusts the force exerted by the second clamping part 220 on the wafer by 0.006N. Correspondingly, rotating the adjusting rod 327 two full turns (720°) adjusts the force exerted by the second clamping part 220 on the wafer by 0.012N. Similarly, by controlling the direction and number of rotations of the adjusting rod 327, the force exerted by the second clamping part 220 on the wafer can be further precisely adjusted, ensuring that the second clamping part 220 reliably secures the wafer without causing damage due to excessive force.

[0083] In some implementations, reference Figure 1 As shown, the transmission unit 320 of this application also includes a position sensor 328, which is disposed on the first transmission block 322 and / or the second transmission block 323. The position sensor 328 is configured to detect the relative position of the first transmission block 322 and / or the second transmission block 323 with respect to the base 100. Specifically, the position sensor 328 can detect the distance by which the drive unit 310 drives the first transmission block 322 and the second transmission block 323 to move. When the first transmission unit 320 and the second transmission unit 320 move to the point where the second clamping part 220 is opposite to the first clamping part 210, the position sensor 328 can send a signal accordingly. When the first transmission unit 320 and the second transmission unit 320 move to the point where the second clamping part 220 is misaligned with the first clamping part 210, the position sensor 328 can also send a signal accordingly.

[0084] Specifically, the position sensor 328 may include a first detection unit and a second detection unit. The first detection unit may be disposed on the first transmission unit 320, and the second detection unit may be disposed on the second transmission unit 320. The first detection unit can detect the relative position between the first transmission unit 320 and the base 100, and the second detection unit can detect the corresponding position between the second transmission unit 320 and the base 100. The first and second detection units may be photoelectric sensors or metal detection sensors, both of which can detect the relative position between the first and second transmission units 320 and the base 100.

[0085] In some implementations, reference Figure 2 As shown, there are two transmission plates 321 in this application. The two transmission plates 321 are arranged at intervals relative to each other along a third direction, and the third direction intersects both the first direction and the second direction. The two sides of the first transmission block 322 are respectively movably embedded in the transmission grooves of the two transmission plates 321, and the two sides of the second transmission block 323 are respectively movably embedded in the guide grooves 321c of the two transmission plates 321.

[0086] Specifically, the first, second, and third directions are perpendicular to each other, and the first and second transmission parts 320 are mounted between two transmission plates 321. The first transmission part 320 has transmission protrusions on both sides, which are movably fitted into the transmission grooves of the two transmission plates 321. The second transmission part 320 has guide protrusions on both sides, which are movably fitted into the guide grooves 321c of the two transmission plates 321. This allows the first and second transmission parts 320 to maintain balance and stability during movement.

[0087] In some implementations, reference Figure 10 As shown, the micro-stress clamping mechanism of this application also includes a limiting part 230, which is disposed on the second transmission block 323. The elastic element 400 is a flexible spring bearing, which is disposed on the second transmission block 323. The second clamping part 220 is rotatably connected to the second transmission block 323 through the elastic element 400. The limiting part 230 is in a limiting cooperation with the second clamping part 220 in the rotation direction of the second clamping part 220.

[0088] Specifically, the second clamping part 220 can rotate in a direction close to or away from the first clamping part 210. Different wafer thicknesses allow the second clamping part 220 to rotate at different angles away from the first clamping part 210. When the wafer thickness is greater, the angle at which the second clamping part 220 rotates away from the first clamping part 210 is larger, and the elastic force generated by the torsion of the flexible spring bearing by the second clamping part 220 is greater. When the wafer thickness is smaller, the angle at which the second clamping part 220 rotates away from the first clamping part 210 is smaller, and the elastic force generated by the torsion of the flexible spring bearing by the second clamping part 220 is smaller. The elastic force generated by the flexible spring bearing drives the second clamping part 220 to press against the surface of the wafer facing away from the first clamping part 210, thereby clamping and fixing the wafer.

[0089] When the wafer thickness is too large, the second clamping part 220 rotates away from the first clamping part 210 until it abuts against the limiting part 230. The second clamping part 220 can no longer rotate away from the first clamping part 210, and the flexible spring bearing can no longer twist and deform. The wafer will push the second clamping part 220 to overcome the driving force of the driving part 310, causing the second clamping part 220 to move in the opposite direction of the first direction, thus moving the second clamping part 220 away from the first clamping part 210. This can further increase the distance between the second clamping part 220 and the first clamping part 210, allowing a thicker wafer to be positioned between them. Furthermore, this can prevent excessive deformation of the flexible spring bearing, keeping its elastic force within a certain range, thereby preventing excessive pressure from the flexible spring bearing driving the second clamping part 220 onto the wafer, which could damage the wafer surface.

[0090] In some implementations, reference Figure 13 As shown, the first clamping part 210 has a limiting block 212, and the maximum distance between the limiting block 212 and the second clamping part 220 is less than 0.2 mm, so as to limit the wafer 500 in the radial direction.

[0091] Specifically, when the wafer is not placed on the first clamping part 210, the second clamping part 220 moves away from the first clamping part 210 under the elastic force of the flexible spring bearing, creating a gap between the limiting block 212 and the second clamping part 220. The gap between the limiting block 212 and the second clamping part 220 reaches its maximum when the second clamping part 220 and the limiting part 230 abut against each other. The limiting block 212 is located on one side of the first clamping surface 211. When one side of the wafer 500 is tilted up, causing the wafer 500 to not contact the first clamping surface 211, the distance between the limiting block 212 and the second clamping part 220 is sufficiently small. This prevents the wafer 500 from being dislodged due to radial movement under force, allowing the wafer 500 to be more stably positioned between the first clamping part 210 and the second clamping part 220.

[0092] In some implementations, reference Figure 9 As shown, in this application, the maximum rotatable angle of the second clamping part 220 relative to the second transmission block 323 is 2.46°, the stiffness coefficient of the flexible spring bearing is 0.26 N·mm / °, and the distance between the end of the second clamping part 220 away from the second transmission block 323 and the rotational connection point of the second clamping part 220 and the second transmission block 323 is 32.4 mm.

[0093] Specifically, when the preload value of the flexible spring bearing is adjusted so that the thinnest wafer to be tested is positioned between the second clamping part 220 and the first clamping part 210, the clamping force of the second clamping part 220 on the thinnest wafer to be tested is 0.08N. However, when the thickness of the wafer to be tested is greater, causing the second clamping part 220 to abut against the limiting part 230, and the second clamping part 220 has not yet moved away from the first clamping part 210 along the first direction, the clamping force of the second clamping part 220 on the wafer to be tested is: And because This ensures that the clamping force applied by the flexible spring bearing to wafers of different thicknesses via the second clamping part 220 varies by less than 25%, thus preventing excessive force from damaging the wafer. Simultaneously, it improves measurement accuracy, achieving an impact of less than 10nm on measurement precision.

[0094] In some implementations, reference Figure 8 As shown, the drive unit 310 of this application is a cylinder, which includes a push rod 311 connected to the first transmission block 322. The cylinder can push the push rod 311 by adjusting the internal air pressure, so that the push rod 311 can reciprocate in the second direction, thereby allowing the first transmission block 322 to reciprocate in the second direction, and further allowing the second clamping unit 220 to reciprocate in both the second and first directions.

[0095] In some implementations, reference Figure 8 As shown, the cylinder may include a cylinder body 312, a piston 313 and a return spring 314. The piston 313 is movably disposed in the cylinder body 312. The push rod 311 is connected to the piston 313. The return spring 314 is connected to the piston 313. When the piston 313 drives the first transmission block 322 to move in the opposite direction along the second direction through the push rod 311, the deformation of the return spring 314 increases.

[0096] Specifically, when no gas is introduced into the cylinder 312, the elastic force of the return spring 314 pushes the push rod 311 to move in the second direction, allowing the second clamping part 220 to move in both the second and first directions until it abuts against the wafer. When gas is introduced into the cylinder, the piston 313 is driven by the gas to move in the opposite direction of the second direction, compressing the return spring 314. The piston 313 then drives the push rod 311 to move in the opposite direction of the second direction, causing the second clamping part 220 to move away from the first clamping part 210.

[0097] Furthermore, when the wafer thickness is too large, causing the wafer to push the second clamping part 220 to move in the opposite direction along the first direction, the second transmission block 323 can move in the opposite direction along the second direction, allowing the reset spring 314 to be compressed and generate a greater elastic force. Correspondingly, the elastic force of the reset spring 314 can react on the second transmission block 323, causing the second transmission block 323 to tend to move along the first direction. Thus, the elastic force of the reset spring 314 can act on the wafer through the second clamping part 220, allowing the wafer to be stably clamped by the second clamping part 220 and the first clamping part 210.

[0098] In some implementations, reference Figures 11 to 13 As shown, the surfaces of the second clamping portion 220 and the first clamping portion 210 facing each other are both arc surfaces, and the convex directions of the surfaces of the second clamping portion 220 and the first clamping portion 210 facing each other are opposite. The surfaces of the second clamping portion 220 and the first clamping portion 210 respectively contact opposite sides of the wafer surface in the thickness direction to be measured, and the most protruding part of the arc surface of the second clamping portion 220 and the clamping portion 210 contacts the wafer. The arc surfaces of the second clamping portion 220 and the first clamping portion 210 can reduce the contact area between the second clamping portion 220 and the first clamping portion 210 and the wafer surface, thereby reducing contact damage to the wafer surface caused by the second clamping portion 220 and the first clamping portion 210.

[0099] In addition, the arc surfaces of the second clamping part 220 and the first clamping part 210 contact the wafer, which can also prevent excessive pressure at the contact points between the second clamping part 220 and the first clamping part 210 and the wafer, thus protecting the wafer to a certain extent.

[0100] In some implementations, reference Figure 12 As shown, a pad 213 may also be provided on the first clamping part 210. The pad 213 is located on the side wall of the first clamping part 210 in the second direction, and the pad 213 is opposite to the wafer 500. When the wafer is placed on the first clamping part 210, if the wafer 500 is moved by a force in the second direction, the pad 213 can buffer the wafer 500 and protect it. The pad 213 can be made of a relatively soft material with low hardness, such as fluororubber.

[0101] In some implementations, reference Figures 11 to 13 As shown, along the second direction, the outer diameter of the surfaces of the second clamping portion 220 and the first clamping portion 210 gradually decreases, making the arc surface of the second clamping portion 220 a variable-diameter arc surface, and the arc surface of the first clamping portion 210 also a variable-diameter arc surface. When the circumferential edge of the wafer has a chamfered structure, the arc surfaces of the second clamping portion 220 and the first clamping portion 210 can match the edge of the wafer, allowing the arc surfaces of the second clamping portion 220 and the first clamping portion 210 to make sufficient and stable contact with the chamfered edge of the wafer, thereby improving the wafer fixing effect of the micro-stress clamping mechanism of this application.

[0102] In some implementations, reference Figures 14 to 15 As shown, the number of clamping members 200, driving members 300 and elastic members 400 in this application are all multiple. Multiple clamping members 200, multiple driving members 300 and multiple elastic members 400 are arranged in a one-to-one correspondence. Multiple clamping members 200, multiple driving members 300 and multiple elastic members 400 are evenly spaced along a preset circumference.

[0103] In this design, multiple driving members 300 can respectively drive the second clamping portion 220 and the first clamping portion 210 of multiple clamping members 200 to move towards each other. The elastic force of multiple elastic members 400 can respectively act on the second clamping portion 220, so that the second clamping portion 220 and the first clamping portion 210 can clamp the wafer. The multiple clamping members 200, multiple driving members 300 and multiple elastic members 400 are evenly spaced along a preset circumference, so that the multiple clamping members 200 can respectively clamp different parts of the wafer in its circumferential direction. In this way, multiple parts of the wafer in its circumferential direction can be fixed, so that the micro-stress clamping mechanism of this application has a better wafer fixing effect.

[0104] In this design, the combined clamping force exerted on the wafer by a single clamping element 200, driving element 300, and elastic element 400 is no greater than 0.08 N. Correspondingly, when there are three clamping elements 200, three driving elements 300, and three elastic elements 400, the micro-stress clamping mechanism of this application can exert a force on the wafer no greater than 0.24 N. When there are six clamping elements 200, six driving elements 300, and six elastic elements 400, the micro-stress clamping mechanism of this application can exert a force on the wafer no greater than 0.48 N. And so on, the more clamping elements 200, six driving elements 300, and six elastic elements 400 there are, the greater the clamping force exerted on the wafer. Therefore, the number of clamping elements 200, six driving elements 300, and six elastic elements 400 can be selected according to the wafer's structural type. When there are multiple clamping elements 200, the multiple clamping elements 200 are evenly distributed on the base 100.

[0105] In some implementations, reference Figure 16As shown, when the wafer thickness is 0.2mm-2.5mm, the micro-stress clamping mechanism of this application drives the second clamping part 220 to apply a clamping force to the wafer through the elastic element 400. At this time, the clamping force ranges from 0.08N-0.0997N, 0.07N-0.0872N, and 0.06N-0.0748N. The clamping force in the range of 0.08N-0.0997N corresponds to... Figure 11 For line A in the diagram, the clamping force in the range of 0.07N-0.0872N corresponds to... Figure 11 The clamping force of line B in the diagram corresponds to a range of 0.06N-0.0748N. Figure 11 The C line in the text.

[0106] The three clamping force ranges mentioned above correspond to different initial values ​​of clamping force. The initial value of clamping force can be adjusted by adjusting the model of the elastic element 400 or the position of the limiting part 230.

[0107] When the wafer thickness is greater than 2.5 mm, the micro-stress clamping mechanism of this application drives the second clamping part 220 to apply a clamping force to the wafer through the elastic part 324, and the clamping force ranges from 4 N to 8 N, corresponding to... Figure 11 The D line in the text.

[0108] In some implementations, reference Figure 13 As shown, the first clamping part 210 has a limiting block 212, and the maximum distance between the limiting block 212 and the second clamping part 220 is less than 0.2 mm, so as to limit the wafer 500 in the radial direction.

[0109] Specifically, the limiting block 212 is located on one side of the first clamping surface 211. When one side of the wafer 500 is tilted up, causing the wafer 500 to not contact the first clamping surface 211, the distance between the limiting block 212 and the second clamping part 220 is small enough to prevent the wafer 500 from being dislodged due to radial movement under force, so that the wafer 500 can be more stably positioned between the first clamping part 210 and the second clamping part 220.

[0110] Based on the micro-stress clamping mechanism described above, this application also proposes a semiconductor device including the micro-stress clamping mechanism described above.

[0111] It should be noted that the terms "one embodiment," "embodiment," "exemplary embodiment," "some embodiments," etc., mentioned in the specification indicate that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Moreover, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not, is within the knowledge scope of those skilled in the art.

[0112] Generally speaking, terms should be understood at least in part by their use in context. For example, at least in part by context, the term "one or more" as used in the text can be used to describe any feature, structure, or characteristic of the singular meaning, or a combination of features, structures, or characteristics of the plural meaning. Similarly, at least in part by context, terms such as "a" or "the" can also be understood to convey either singular or plural usage.

[0113] It should be readily understood that the terms “on,” “above,” and “on top of” in this application should be interpreted in the broadest possible sense, such that “on” means not only “directly on something” but also “on something” with an intermediate feature or layer therebetween, and that “above” or “on top of” means not only “on something” but also “on something” without an intermediate feature or layer therebetween (i.e., directly on something).

[0114] Furthermore, for ease of explanation, spatially relative terms such as "below," "below," "under," "above," and "above" may be used to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation other than those shown in the figures. The device may have other orientations (rotated 90° or in other orientations), and the spatially relative descriptive terms used herein may be interpreted accordingly.

[0115] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A micro-stress clamping mechanism for clamping thin-film target objects, including but not limited to wafers, characterized in that, include: Base (100); The clamping member (200) includes a first clamping part (210) and a second clamping part (220), wherein the first clamping part (210) is disposed on the base (100) and the second clamping part (220) is movably disposed on the base (100); A drive member (300) is connected to the second clamping part (220), and the drive member (300) is configured to drive the second clamping part (220) to move toward or away from the first clamping part (210) so that the distance between the second clamping part (220) and the first clamping part (210) decreases or increases; The elastic element (400) is connected to the second clamping part (220). When the second clamping part (220) moves away from the first clamping part (210), the elastic element (400) deforms to generate an elastic force.

2. The micro-stress clamping mechanism according to claim 1, characterized in that, The direction in which the second clamping part (220) faces the first clamping part (210) is the first direction, and the driving member (300) is also configured to drive the second clamping part (220) to reciprocate along a second direction, which intersects with the first direction.

3. The micro-stress clamping mechanism according to claim 2, characterized in that, The drive unit (300) includes a drive part (310) and a transmission part (320). The drive part (310) is connected to the second clamping part (220) through the transmission part (320). The driving force of the drive part (310) is in the second direction. The transmission part (320) is configured to convert at least a portion of the driving force of the drive part (310) into a force in the first direction.

4. The micro-stress clamping mechanism according to claim 3, characterized in that, The transmission part (320) includes a transmission plate (321), a first transmission block (322), a second transmission block (323), and an elastic part (324). The transmission plate (321) is disposed on the base (100). The transmission plate (321) has a transmission groove. The transmission groove includes a first groove segment (321a) and a second groove segment (321b) connected to each other. The first groove segment (321a) is disposed along the second direction. The second groove segment (321b) is disposed at an angle of less than 90 degrees to the first groove segment (321a). The first transmission block (322) and the second transmission block (323) are arranged along the second direction and connected by an elastic part (324). The first transmission block (322) is movably embedded in the transmission groove. The second clamping part (220) is connected to the second transmission block (323). The deformation direction of the elastic part (324) is the second direction.

5. The micro-stress clamping mechanism according to claim 4, characterized in that, The transmission plate (321) also has a guide groove (321c), which is arranged along the first direction, and the second transmission block (323) is movably embedded in the guide groove (321c).

6. The micro-stress clamping mechanism according to claim 4, characterized in that, The transmission unit (320) further includes a first baffle (325) and a second baffle (326). The second baffle (326) is located on the side of the first transmission block (322) facing away from the second transmission block (323). The first baffle (325) is located on the side of the second transmission block (323) facing away from the first transmission block (322). The first baffle (325) limits the second transmission block (323) in the second direction, and the second baffle (326) limits the first transmission block (322) in the opposite direction of the second direction.

7. The micro-stress clamping mechanism according to claim 4, characterized in that, The transmission unit (320) further includes an adjusting rod (327) movably disposed on the transmission plate (321). The adjusting rod (327) is configured to reciprocate in the first direction to limit the stroke of the second transmission block (323) in the first direction.

8. The micro-stress clamping mechanism according to claim 7, characterized in that, The adjusting rod (327) is threadedly connected to the transmission plate (321). When the adjusting rod (327) rotates 360°, the force exerted by the second clamping part (220) on the wafer changes by 0.006N.

9. The micro-stress clamping mechanism according to claim 4, characterized in that, The transmission unit (320) further includes a position sensor (328) disposed on the first transmission block (322) and / or the second transmission block (323), and the position sensor (328) is configured to detect the relative position of the first transmission block (322) and / or the second transmission block (323) with respect to the base (100).

10. The micro-stress clamping mechanism according to any one of claims 4-9, characterized in that, The number of transmission plates (321) is two, and the two transmission plates (321) are arranged at intervals relative to each other along a third direction. The two sides of the first transmission block (322) are respectively movably embedded in the transmission grooves of the two transmission plates (321). The third direction intersects with both the first direction and the second direction.

11. The micro-stress clamping mechanism according to claim 4, characterized in that, The clamping member (200) further includes a limiting part (230), which is disposed on the second transmission block (323). The elastic member (400) is a flexible spring bearing, which is disposed on the second transmission block (323). The second clamping part (220) is rotatably connected to the second transmission block (323) through the elastic member (400). The limiting part (230) is limited and cooperates with the second clamping part (220) in the rotation direction of the second clamping part (220).

12. The micro-stress clamping mechanism according to claim 11, characterized in that, The maximum rotatable angle of the second clamping part (220) relative to the second transmission block (323) is 2.46°, the stiffness coefficient of the flexible spring bearing is 0.26 N·mm / °, the distance between the end of the second clamping part (220) away from the second transmission block (323) and the rotational connection point of the second clamping part (220) and the second transmission block (323) is 32.4 mm, and the maximum clamping force of the second clamping part (220) on the wafer is 0.08 N.

13. The micro-stress clamping mechanism according to any one of claims 4-9, characterized in that, The driving component (300) is a cylinder, which includes a push rod (311) connected to the first transmission block (322), and the push rod (311) is configured to reciprocate along the second direction.

14. The micro-stress clamping mechanism according to claim 13, characterized in that, The cylinder also includes a cylinder body (312), a piston (313), and a return spring (314). The piston (313) is movably disposed within the cylinder body (312). The push rod (311) is connected to the piston (313), and the return spring (314) is connected to the piston (313). When the piston (313) drives the first transmission block (322) to move in the opposite direction along the second direction through the push rod (311), the deformation of the return spring (314) increases.

15. The micro-stress clamping mechanism according to any one of claims 2-9, characterized in that, The surfaces of the second clamping part (220) and the first clamping part (210) opposite each other are both arc surfaces, and the protrusion directions of the surfaces of the second clamping part (220) and the first clamping part (210) opposite each other are opposite.

16. The micro-stress clamping mechanism according to claim 15, characterized in that, Along the second direction, the outer diameter of the surface of the second clamping part (220) opposite to the first clamping part (210) gradually decreases.

17. The micro-stress clamping mechanism according to any one of claims 1-9, characterized in that, The number of clamping members (200), driving members (300) and elastic members (400) are all multiple, and the multiple clamping members (200), multiple driving members (300) and multiple elastic members (400) are arranged in a one-to-one correspondence, and the multiple clamping members (200), multiple driving members (300) and multiple elastic members (400) are evenly spaced along a preset circumference.

18. The micro-stress clamping mechanism according to any one of claims 2-9, characterized in that, The micro-stress clamping mechanism further includes a soft pad (213), which is located on the sidewall of the first clamping part (210) in the second direction and is opposite to the wafer.

19. The micro-stress clamping mechanism according to claim 18, characterized in that, The gasket (213) is made of fluororubber.

20. The micro-stress clamping mechanism according to claim 1, characterized in that, When the thickness of the wafer is 0.2mm-2.5mm, the clamping force applied to the wafer by the micro-stress clamping mechanism is in the range of 0.08N-0.0997N, 0.07N-0.0872N, or 0.06N-0.0748N; When the thickness of the wafer is greater than 2.5 mm, the micro-stress clamping mechanism applies a clamping force of 4 N to 8 N to the wafer.

21. The micro-stress clamping mechanism according to claim 20, characterized in that, The first clamping part (210) has a limiting block (212), the maximum distance between the limiting block (212) and the second clamping part (220) is less than 0.2 mm, so as to limit the wafer in the radial direction.

22. A semiconductor device, characterized in that, Includes the micro-stress clamping mechanism as described in any one of claims 1-21.

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