Method for manufacturing optical resin wafer

Abstract

The present application aims to provide a method for manufacturing an optical resin wafer that can obtain an optical resin wafer with improved flatness. The method for manufacturing an optical resin wafer includes a mold preparation step of preparing a mold that satisfies (a) or (b) below, and a curing step of casting a curable composition as a raw material of the wafer in the mold and curing it to obtain an optical resin wafer precursor. By the method for manufacturing an optical resin wafer, an optical resin wafer with improved flatness can be obtained. (a) The mold has one or more spacers in the central part of the cavity space. (b) The thickness t of the central part of the cavity space of the mold satisfies the relationship t m0 The thickness t of the central part of the cavity space of the mold satisfies the relationship t m1 > t m0 > t m1 .

Description

Technical Field

[0001] This invention relates to a method for manufacturing optical resin wafers. Background Technology

[0002] In the field of optical devices, resin materials are needed for reasons such as lightweighting and improved impact resistance.

[0003] Patent document 1 discloses an optical component comprising an organic polymer and including a surface A, the area of ​​which is 1 mm². 2 The above describes the measurement of an area of ​​1 mm² using a non-contact optical flatness meter. 2 When the flatness of the region is considered, the aforementioned flatness is 80 μm or less. Furthermore, Patent Document 1 states that "the object of this disclosure is to provide a lightweight optical component capable of high-precision optical information transmission, a method for manufacturing the same, and an optical information transmission device having the aforementioned optical component."

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: International Publication No. 2020 / 170801 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] One known method for manufacturing optical components using resin materials is by casting the resin material into a mold. However, when molding using a mold, the flatness of the optical resin wafer can sometimes be poor due to curing shrinkage during resin curing.

[0009] The present invention provides a method for manufacturing an optical resin wafer that can obtain an optical resin wafer with improved flatness.

[0010] Methods for solving problems

[0011] According to the present invention, a method for manufacturing an optical resin wafer is provided as shown below.

[0012] 1. A method for manufacturing an optical resin wafer, comprising: a mold preparation step, preparing a mold that satisfies either (a) or (b) below; and a curing step, casting a curable composition as a raw material for the optical resin wafer into the mold and curing it to obtain an optical resin wafer precursor.

[0013] (a) The above mold has one or more spacers in the central part of the cavity space.

[0014] (b) The thickness t of the central portion of the cavity space of the above mold m0The thickness t of the cavity space of the mold described above, located 5 mm from the outer periphery towards the center. m1 The relationship is t m0 >t m1 .

[0015] 2. The method for manufacturing an optical resin wafer according to 1. further includes a processing step, which involves performing at least one processing step selected from the group consisting of notching, deburring, chamfering, cutting, grinding, polishing and heating on the optical resin wafer precursor to obtain the optical resin wafer.

[0016] 3. The method for manufacturing an optical resin wafer according to 1. or 2, wherein the mold satisfies (a) above and has one or more spacers within a range of 25 mm from the end of the cavity space toward the center.

[0017] 4. The method for manufacturing an optical resin wafer according to 3, wherein the mold satisfies (a) above, and the spacer is arranged such that it occupies more than 80% of the outer periphery of the cavity space.

[0018] 5. A method for manufacturing an optical resin wafer according to any one of 1. to 4, wherein the mold satisfies (a) above, and the spacer is cylindrical, polygonal, cylindrical or square in shape.

[0019] 6. A method for manufacturing an optical resin wafer according to any one of 1. to 5, wherein the mold satisfies (a) above, and the spacer has a structure capable of casting the curable composition into the cavity space.

[0020] 7. A method for manufacturing an optical resin wafer according to any one of 1. to 6, wherein the mold satisfies (a) above, and the spacer comprises at least one selected from the group consisting of glass, ceramic, metal and resin.

[0021] 8. A method for manufacturing an optical resin wafer according to any one of 1 to 7, wherein the mold comprises glass.

[0022] 9. A method for manufacturing an optical resin wafer according to any one of 1. to 8, wherein the optical resin wafer comprises at least one selected from the group consisting of (thio)urethane optical resin, epoxy optical resin, polycarbonate optical resin, cyclosulfide optical resin, allyl carbonate optical resin, nylon optical resin, polyamide optical resin and polyimide optical resin.

[0023] 10. A method for manufacturing an optical resin wafer according to any one of 1. to 9, wherein the refractive index of the optical resin wafer is 1.47 or higher.

[0024] 11. A method for manufacturing an optical resin wafer according to any one of 1. to 10, wherein the curing shrinkage rate A of the curable composition calculated by the following formula (x) is 15% or less.

[0025] A=(V0-V1) / V0×100

[0026] A: Curing shrinkage rate [%)

[0027] V0: Volume of the above-mentioned curable composition (before curing)

[0028] V1: Volume of the aforementioned optical resin wafer precursor (after curing)

[0029] 12. A method for manufacturing an optical resin wafer according to any one of 1. to 11. wherein the average thickness of the optical resin wafer is 0.1 mm to 3.0 mm.

[0030] 13. A method for manufacturing an optical resin wafer according to any one of 1. to 12, wherein the diameter of the optical resin wafer is 50 mm to 350 mm.

[0031] 14. A method for manufacturing an optical resin wafer according to any one of 1. to 13, wherein the flatness of the optical resin wafer is 350 μm or less.

[0032] Invention Effects

[0033] According to the present invention, a method for manufacturing an optical resin wafer is provided, which can produce an optical resin wafer with improved flatness. Attached Figure Description

[0034] Figure 1 The diagram shows a cross-sectional view (1A) and a top view (1B) schematically illustrating an example of a mold used in the manufacturing method of the optical resin wafer of Embodiment 1.

[0035] Figure 2 The diagram shows a cross-sectional view (2A) and a top view (2B) schematically illustrating an example of a mold used in the manufacturing method of the optical resin wafer of Embodiment 1.

[0036] Figure 3 The figures are a cross-sectional view (3A) and a top view (3B) schematically showing an example of a mold used in the manufacturing method of the optical resin wafer of Embodiment 1.

[0037] Figure 4The diagram shows a cross-sectional view (4A) and a top view (4B) of an example of a mold used in the manufacturing method of the optical resin wafer of Embodiment 1.

[0038] Figure 5 This is a cross-sectional view schematically showing an example of a mold used in the manufacturing method of the optical resin wafer of Embodiment 2.

[0039] Figure 6 This is a schematic cross-sectional view showing an example of an optical resin wafer obtained by the optical resin wafer manufacturing method of Embodiment 2.

[0040] Figure 7 This is a diagram schematically illustrating an example of a method for manufacturing an optical component according to this embodiment.

[0041] Figure 8 This is a diagram schematically illustrating an example of a method for manufacturing an optical component according to this embodiment.

[0042] Figure 9 This is a cross-sectional view schematically showing an example of an optical information transmission device using the optical components of this embodiment. Detailed Implementation

[0043] The embodiments of the present invention will be described below.

[0044] 1. Manufacturing method of optical resin wafers

[0045] The method for manufacturing an optical resin wafer according to this embodiment includes: a mold preparation step of preparing a mold that satisfies either (a) or (b) below; and a curing step of casting a curable composition, which is the raw material for the optical resin wafer of this embodiment, into the mold of this embodiment and curing it to obtain an optical resin wafer precursor.

[0046] (a) The mold of this embodiment has one or more spacers in the center of the cavity space.

[0047] (b) The thickness t of the central portion of the cavity space of the mold in this embodiment m0 The thickness t of the mold cavity space of this embodiment at a distance of 5 mm from the outer periphery towards the center. m1 The relationship is t m0 >t m1 .

[0048] The following describes the manufacturing method of optical resin wafers using Embodiment 1 and Embodiment 2.

[0049] 1-1. Implementation Method 1

[0050] Figure 1This is a cross-sectional view schematically showing an example of a mold used in the manufacturing method of the optical resin wafer of Embodiment 1. Figure 1 1A) and top view ( Figure 1 (1B).

[0051] The method for manufacturing an optical resin wafer according to Embodiment 1 (hereinafter, sometimes simply referred to as "Embodiment 1") includes: a mold preparation step (hereinafter, sometimes simply referred to as "mold preparation step") for preparing a mold 51 that satisfies (a) below; and a curing step (hereinafter, sometimes simply referred to as "curing step") for casting a curable composition as a raw material for an optical resin wafer into the mold 51 and curing it to obtain an optical resin wafer precursor.

[0052] (a) Mold 51 has one or more spacers in the center of the cavity space.

[0053] Mold 51 is, for example, a glass mold, having a cylindrical cavity space 52. Additionally, for example, a cylindrical glass spacer 54 is disposed in the central portion 53 of the cavity space 52.

[0054] The inventors have confirmed that when a curable composition used as a raw material for an optical resin wafer is cast, curing shrinkage occurs, causing depressions in the central portion of the cured material, making it difficult to ensure the flatness of the resulting optical resin wafer. Furthermore, the inventors have discovered that by placing one or more spacers in the center of the mold cavity, the depression in the central portion of the cured material is suppressed, making it easier to ensure the flatness of the optical resin wafer. It is believed that the depression in the central portion of the cured material is caused by the composition being pulled towards the center due to curing shrinkage, but this phenomenon is believed to be suppressed by the presence of spacers in the central portion.

[0055] In this embodiment 1, a spacer 54 is arranged in the cavity space 52, and a mold 51 is prepared so that it can be used in the curing process. Furthermore, regarding the mold preparation process, even if no specific work is performed, as long as the mold can be used in the curing process, it can be considered that the mold has been prepared.

[0056] The prepared mold 51 is provided with a resin casting path (not shown), through which a curable composition containing isocyanate compounds, polythiols, etc., which is the raw material for the optical resin wafer, is injected. Then, for example, the curable composition is heat-cured by heating, and the optical resin wafer precursor made of (thio)carbamate-based optical resin is taken out from the mold.

[0057] The obtained optical resin wafer precursor is subjected to deburring processing, such as removing residual "burrs" on the outer periphery, and notching processing, such as forming cuts (notches) at the ends of the optical resin wafer precursor, to obtain an optical resin wafer made of (thio)carbamate-based optical resin.

[0058] In this embodiment 1, the mold 51 preferably has one or more spacers within a range of 25 mm from the end 55 of the cavity space towards the central portion 53. By using such a mold, it is easier to ensure the flatness of the optical resin wafer. It should be noted that the spacers 54 disposed within a range of 25 mm from the end of the cavity space towards the central portion can also be used to form notches, and the resulting notches can function as markers indicating the orientation of the optical resin wafer.

[0059] Figure 2 This is a schematic cross-sectional view illustrating another example of the mold used in Embodiment 1. Figure 2 2A) and top view ( Figure 2 (2B). Figure 2 In this embodiment, the mold 51 has a spacer 54 disposed in the central portion 53 of the cavity space 52, and the spacer 54 is disposed within a range of 25 mm from the end 55 of the cavity space 52 toward the central portion 53. The mold of this embodiment 1 can also be a mold with the spacer disposed in this way. By using such a mold, it is easier to ensure the flatness of the optical resin wafer. In addition, the spacer 54 disposed within a range of 25 mm from the end of the cavity space toward the central portion can also be used to form a notch, and the resulting notch can function as a mark for indicating the orientation of the optical resin wafer.

[0060] Figure 3 This is a schematic cross-sectional view illustrating another example of the mold used in Embodiment 1. Figure 3 3A) and top view ( Figure 3 (3B). Figure 3 In this embodiment, mold 51 has a spacer 54 disposed in the central portion 53 of cavity space 52, and two spacers 54 are disposed symmetrically around the central portion 53 within a range of 25 mm from the end 55 of cavity space 52 toward the central portion 53. The mold of this embodiment 1 can also be a mold with spacers disposed in this manner. The mold of this embodiment 1 preferably has two or more spacers, more preferably four or more spacers, further preferably six or more spacers, and particularly preferably eight or more spacers. By using such a mold, it is easier to ensure the flatness of the optical resin wafer.

[0061] It should be noted that the spacer 54 (preferably the spacer 54 located at the end 55 of the cavity space) can have a structure capable of casting the curable composition into the cavity space 52. Thus, the spacer also serves as a resin casting path, eliminating the need for a separate resin casting path and easily reducing manufacturing costs.

[0062] Figure 4 This is a schematic cross-sectional view illustrating another example of the mold used in Embodiment 1. Figure 4 4A) and top view ( Figure 4 (4B). Figure 4 In this embodiment, a spacer 54 is disposed in the central portion 53 of the cavity space 52 of the mold 51, and the cylindrical (ring-shaped when viewed from above) spacer 54 is disposed in such a way that it occupies more than 80% of the outer periphery of the cavity space 52. The mold of this embodiment 1 can also be a mold with the spacer disposed in this way. The mold of this embodiment 1 can preferably have a spacer occupying more than 85% of the outer periphery, and more preferably has a spacer occupying more than 90% of the outer periphery. By using such a mold, it is easier to ensure the flatness of the optical resin wafer. In addition, the outer periphery of the mold in this embodiment refers to the range within 25 mm from the end 5 of the cavity space 52 of the mold 51 toward the central portion 53.

[0063] The spacer used in Embodiment 1 can be, for example, cylindrical, polygonal, cylindrical, or rectangular. From the viewpoint of easy demolding, a cylindrical shape is preferred. Additionally, located in... Figure 4 The spacer 54 at the end 55 of the cavity space of the mold 51 has a cylindrical (ring-shaped when viewed from above) shape.

[0064] The material of the mold used in this embodiment 1 is not particularly limited, and the coefficient of linear expansion of the mold is α. m The preferred value is 0.1×10 -6 / ℃ or higher, more preferably 0.5×10 -6 / ℃ or higher, further preferably 1×10 -6 / ℃ or higher, further preferably 2×10 -6 / ℃ or higher, more preferably 3×10 -6 / ℃ or higher, and preferably 100×10 -6 Below / ℃, more preferably 50×10 -6 Below / ℃, further preferably 40×10 -6 Below / ℃, more preferably 30×10 -6 Below / ℃, more preferably 20×10 -6 Below / ℃, more preferably 15×10 -6 Below / ℃. This further improves the flatness of the optical resin wafer. It should be noted that am It was obtained by measuring from 25°C to 150°C at a heating rate of 5°C / minute, in accordance with Japanese Industrial Standard JIS K-7197:2012.

[0065] As the material of the mold used in Embodiment 1, the coefficient of linear expansion a is selected from... m Starting from the perspective of setting an appropriate range, for example, it can be metal materials such as SUS, copper, silver, and iron (9~20×10). -6 / ℃), white glass, blue glass and other glass materials (9~20×10) -6 / ℃), borosilicate glass, alumina, single-crystal sapphire and other inorganic materials (3~8×10) -6 / ℃), quartz (0.5×10 -6 The material is preferably metal, glass, or inorganic material, and more preferably glass.

[0066] The material of the spacer used in this embodiment 1 is not particularly limited. The linear expansion coefficient α of the spacer in this embodiment is... s The preferred value is 0.1×10 -6 / ℃ or higher, more preferably 0.5×10 -6 / ℃ or higher, further preferably 1×10 -6 / ℃ or higher, further preferably 2×10 -6 / ℃ or higher, more preferably 3×10 -6 / ℃ or higher, and preferably 500×10 -6 Below / ℃, more preferably 400×10 -6 Below / ℃, more preferably 200×10 -6 Below / ℃, further preferably 80×10 -6 Below / ℃, further preferably 65×10 -6 Below / ℃, more preferably 20×10 -6 / ℃ or below. This allows for further improvement in the flatness of the optical resin wafer. Additionally, a s It was obtained by measuring from 25℃ to 150℃ according to JIS K-7197:2012, under the condition of heating rate of 5℃ / min.

[0067] The material used for the spacer in this embodiment is such that its coefficient of linear expansion α is... s From the perspective of an appropriate range, for example, elastomers such as silicon, styrene, chloroprene, and nitrile (60~400×10). -6 / ℃), LDPE (100~400×10 -6 Engineering plastic materials such as polycarbonate, PET, and nylon (50~80×10) at / ℃ -6 / ℃), SUS, copper, silver, iron and other metallic materials (9~20×10 -6 / ℃), white glass, blue glass, and other glass (9~20×10) -6 / ℃), borosilicate glass, alumina, single-crystal sapphire and other inorganic materials (3~8×10) -6 / ℃), quartz (0.5×10 -6 ( / ℃), preferably metal, glass, or inorganic materials.

[0068] Furthermore, the material used for the spacer in this embodiment is designed to have a coefficient of linear expansion α. s From the perspective of appropriate range and ease of processing of spacers, it is preferred to include at least one of the following: glass, ceramic, metal and resin, and glass is particularly preferred.

[0069] From the viewpoint of improving optical properties, the material of the optical resin wafer manufactured in Embodiment 1 preferably includes at least one selected from the group consisting of (thio)carbamate optical resin, epoxy optical resin, polycarbonate optical resin, cyclosulfide optical resin, allyl carbonate optical resin (preferably diallyl carbonate optical resin), nylon optical resin, polyamide optical resin and polyimide optical resin, more preferably including (thio)carbamate optical resin, and particularly preferably including thiocarbamate resin.

[0070] The components of the curable composition used in Embodiment 1 are appropriately selected according to the material of the target optical resin wafer. When the material of the target optical resin wafer is a (thio)carbamate-based optical resin, it can be obtained by polycondensation of iso(thio)cyanate compound with a difunctional or higher active hydrogen compound (such as polythiol compound, polyol compound, etc.).

[0071] Examples of isocyanate compounds used in the curable composition of Embodiment 1 include hexamethylene diisocyanate, pentamethylene diisocyanate, phenyl diisocyanate, isophorone diisocyanate, bis(isocyanate methyl)cyclohexane, bis(isocyanate cyclohexyl)methane, 2,5-bis(isocyanate methyl)bicyclo-[2.2.1]-heptane, 2,6-bis(isocyanate methyl)bicyclo-[2.2.1]-heptane, toluene diisocyanate, phenyl diisocyanate, and 4,4'-diphenylmethane diisocyanate.

[0072] Examples of polythiol compounds used in the curable composition of Embodiment 1 include, for example, pentaerythritol tetra(2-mercaptoacetate), pentaerythritol tetra(3-mercaptopropionate), bis(2-mercaptoethyl) sulfide, 4-mercaptomethyl-1,8-dimercapto-3,6-dithiaoctane, 5,7-dimercaptomethyl-1,11-dimercapto-3,6,9-trithiaundecane, and 4,7-dimercaptomethyl-1,11-dimercapto-3 ,6,9-trithiaundecane, 4,8-dimercaptomethyl-1,11-dimercapto-3,6,9-trithiaundecane, 2,5-dimercaptomethyl-1,4-dithiaane, 1,1,3,3-tetra(mercaptomethylthio)propane, 4,6-bis(mercaptomethylthio)-1,3-dithiaane, 2-(2,2-bis(mercaptomethylthio)ethyl)-1,3-dithiacyclobutane, ethylene glycol bis(3-mercaptopropionate), etc.

[0073] Examples of polyol compounds used in the curable composition of Embodiment 1 include ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, dipropylene glycol, tripropylene glycol, 1,3-propanediol, 2,2-dimethyl-1,3-propanediol, 2,2-diethyl-1,3-propanediol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 3-methyl-1,3-butanediol, 1,2-pentanediol, 1,3-pentanediol, 1,5-pentanediol, 2,4-pentanediol, and 2-methyl-1,3-butanediol. Straight-chain or branched aliphatic alcohols such as 2,4-pentanediol, 3-methyl-1,5-pentanediol, 1,6-hexanediol, 2,5-hexanediol, glycerol, diglycerol, polyglycerol, trimethylolpropane, pentaerythritol, and di(trimethylolpropane); alicyclic alcohols such as 1,2-cyclopentanediol, 1,3-cyclopentanediol, 3-methyl-1,2-cyclopentanediol, 1,2-cyclohexanediol, 1,3-cyclohexanediol, 1,4-cyclohexanediol, 4,4'-bicyclohexanol, and 1,4-cyclohexanediol.

[0074] The curing conditions in the curing process of Embodiment 1 should be appropriately selected according to the material of the target optical resin wafer. From the viewpoint of suppressing thermal runaway and convection caused by the heat of reaction, the curing temperature is preferably glass transition temperature (Tg) + 10°C or higher, more preferably glass transition temperature (Tg) + 15°C or higher, even more preferably glass transition temperature (Tg) + 20°C or higher, preferably glass transition temperature (Tg) + 40°C or lower, more preferably glass transition temperature (Tg) + 35°C or lower, and even more preferably glass transition temperature (Tg) + 30°C or lower.

[0075] In addition, the specific curing temperature is usually 110℃~140℃.

[0076] From the viewpoint of suppressing thermal runaway and convection caused by the heat of reaction, the heating time in the curing process of Embodiment 1 is preferably 1 hour or more, more preferably 1.1 hours or more, even more preferably 1.2 hours or more, even more preferably 1.8 hours or more, even more preferably 1.9 hours or more, and even more preferably 2 hours or more.

[0077] It should be noted that when the amount of optical resin is large, the heating time can be more than 12 hours, more than 14 hours, more than 16 hours, more than 20 hours, more than 22 hours, or more than 24 hours.

[0078] Furthermore, when the amount of optical resin is large, the heating time can be more than 24 hours, more than 26 hours, more than 28 hours, more than 44 hours, more than 46 hours, or more than 48 hours.

[0079] From the viewpoint of suppressing thermal runaway and convection caused by the heat of reaction, the holding time of the curing temperature in the curing process of Embodiment 1 is preferably 1 hour or more, more preferably 1.1 hours or more, even more preferably 1.2 hours or more, even more preferably 1.8 hours or more, even more preferably 1.9 hours or more, and even more preferably 2 hours or more.

[0080] From the viewpoint of reducing unreacted matter, the cooling time in the curing process of Embodiment 1 is preferably 1 hour or more, more preferably 1.1 hours or more, even more preferably 1.2 hours or more, even more preferably 1.8 hours or more, even more preferably 1.9 hours or more, and even more preferably 2 hours or more.

[0081] It should be noted that when the amount of optical resin is large, the cooling time can be more than 12 hours, more than 14 hours, more than 16 hours, more than 20 hours, more than 22 hours, or more than 24 hours.

[0082] Furthermore, when the amount of optical resin is large, the cooling time can be more than 24 hours, more than 26 hours, more than 28 hours, more than 44 hours, more than 46 hours, or more than 48 hours.

[0083] This embodiment 1 preferably includes a processing step of performing at least one of the following processes on the optical resin wafer precursor: notching, deburring, chamfering, cutting, grinding, polishing, and heating to obtain the optical resin wafer.

[0084] Notch processing refers to the process of forming a cut (notch), which serves as a marker indicating the orientation of an optical resin wafer. There are no particular limitations on the equipment and conditions used in notch processing; well-known equipment and conditions can be appropriately employed.

[0085] Deburring is a process that removes burrs (rough edges) and other protrusions generated on the outer periphery of an optical resin wafer precursor. There are no particular limitations on the equipment and conditions used in deburring; known equipment and conditions can be appropriately employed.

[0086] Chamfering refers to the process of cutting off the outer corners of the optical resin wafer precursor and rounding the corners (beveling) in the thickness direction. There are no particular limitations on the equipment and conditions used in chamfering; known equipment and conditions can be used appropriately.

[0087] Cutting is the process of cutting the precursor of an optical resin wafer in order to produce an optical resin wafer of a target thickness. There are no particular limitations on the equipment and conditions used in cutting; well-known equipment and conditions such as wire saws and blade saws can be used appropriately.

[0088] Grinding refers to the process of grinding the surface of an optical resin wafer precursor to ensure flatness, etc. Similarly, polishing refers to the process of polishing the surface of an optical resin wafer precursor to ensure flatness, etc. There are no particular limitations on the methods or conditions for grinding and polishing; for example, the methods described in paragraphs

[0047] to

[0062] of International Publication No. 2020 / 170801 may be appropriately adopted.

[0089] Heating is a process in which the cured material is heated to alleviate internal stress in the optical resin wafer precursor. Heating activates the movement of molecules that make up the optical resin wafer precursor, removes strain from the precursor, and thereby planarizes the optical resin wafer.

[0090] From the viewpoint of further planarizing the optical resin wafer, the heating temperature during heat processing is preferably 60°C or higher, more preferably 70°C or higher, even more preferably 80°C or higher, even more preferably 90°C or higher, and even more preferably 100°C or higher. Furthermore, based on the glass transition temperature (Tg) of the optical resin used as the raw material for the optical resin wafer, it is preferably Tg-20°C or higher, more preferably Tg-10°C or higher, even more preferably Tg or higher, even more preferably Tg+10°C or higher, even more preferably Tg+20°C or higher, even more preferably Tg+30°C or higher, even more preferably Tg+40°C or higher, and even more preferably Tg+50°C or higher. If the thermal degradation of the optical resin wafer is within acceptable limits, it can, for example, be below 200°C. It should be noted that when determining the heat processing temperature, the temperature dependence of storage modulus and loss modulus can be referenced by measuring viscoelasticity. It should also be noted that, from the viewpoint of further suppressing warping, pressure can be further applied during heat processing. Specifically, pressure can be applied by clamping and pressing the optical resin wafer of this embodiment with a flat plate.

[0091] The average thickness of the optical resin wafer manufactured in Embodiment 1 can be appropriately adjusted according to the application of the optical resin wafer. Preferably, it is 0.1 mm or more, more preferably 0.2 mm or more, and even more preferably 0.3 mm or more. Furthermore, it is preferably 3.0 mm or less, more preferably 2.0 mm or less, and even more preferably 1.0 mm or less. Additionally, the average thickness of the optical resin wafer manufactured in Embodiment 1 is the arithmetic mean of the thickness at a distance of 5 mm from the end of the hole towards the outer periphery of the optical resin wafer and the thickness at a distance of 5 mm from the outer periphery towards the center of the optical resin wafer.

[0092] The diameter of the optical resin wafer manufactured in Embodiment 1 can be appropriately adjusted according to the application of the optical resin wafer. From the viewpoint of being able to obtain more optical components from one optical resin wafer, it is preferably 50 mm or more, more preferably 70 mm or more, further preferably 80 mm or more, further preferably 100 mm or more, further preferably 120 mm or more, further preferably 140 mm or more, and, for example, can be 350 mm or less.

[0093] Here, the larger the diameter of the optical resin wafer, the greater the force that pulls the resin composition toward the center of the mold cavity space due to the curing shrinkage of the resin composition, and the flatness of the optical resin wafer is easily reduced. However, according to this embodiment 1, even if the diameter of the optical resin wafer is above the above-mentioned lower limit value, the flatness can be improved.

[0094] For the optical resin wafer manufactured in Embodiment 1, from the perspective of its use as a material for optical products, it is sometimes required to improve flatness and smoothness as well as reduce thickness unevenness. It should be noted that the difference between the measured maximum and minimum values ​​(PV) and WARP can also be used simply as indicators of thickness unevenness reduction. The preferred ranges for the flatness / flatness / flatness indicators (Bow), the thickness unevenness indicator (TTV), and the smoothness indicator (surface roughness Ra) required for the optical resin wafer manufactured in Embodiment 1 are as follows, for example.

[0095] The flatness / flatness / flatness of the optical resin wafer manufactured in Embodiment 1 is preferably 350 μm or less, more preferably 300 μm or less, even more preferably 250 μm or less, even more preferably 200 μm or less, even more preferably 150 μm or less, even more preferably 100 μm or less, even more preferably 50 μm or less, even more preferably 40 μm or less, even more preferably 30 μm or less, and, for example, can be 0.01 μm or more, 0.1 μm or more, 1 μm or more, or 10 μm or more.

[0096] The flatness / flatness / flatness of the optical resin wafer manufactured in Embodiment 1 is the Bow of the optical resin wafer, which can be measured using an ultra-high precision three-dimensional measuring machine. For example, it can be measured under the following conditions. In Embodiment 1, Bow is a quantity representing the distance between the center of the wafer and the reference (datum) plane when the wafer is held in its natural state without vacuum adsorption.

[0097] Device: UA3P (manufactured by Panasonic Production Engineering Co., Ltd.)

[0098] Measurement area: A circular area extending ±30 mm along both the X and Y directions from the center of the optical resin wafer.

[0099] Alternatively, the difference between the measured maximum and minimum values ​​(PV) or WARP can be used as indicators.

[0100] In this embodiment 1, the thickness non-uniformity (TTV) of the optical resin wafer is preferably 10 μm or less, more preferably 5 μm or less, even more preferably 2 μm or less, and even more preferably 1 μm or less. Furthermore, the lower limit of the thickness non-uniformity (TTV) is not particularly limited; for example, it can be 0.01 μm or more, or 0.1 μm or more. In this embodiment, TTV is the difference between the maximum and minimum values ​​of the thickness (distance from the back reference plane) when the wafer is adsorbed and fixed.

[0101] The surface roughness Ra of the optical resin wafer manufactured in Embodiment 1 is preferably 10 nm or less, more preferably 5 nm or less, even more preferably 2 nm or less, and even more preferably 1 nm or less. Furthermore, the lower limit of the surface roughness Ra is not particularly limited; for example, it can be 0.01 nm or more, or 0.1 nm or more. It should be noted that the surface roughness Ra of the optical resin wafer can be determined by measurement according to Japanese Industrial Standard JIS B 0601:2013.

[0102] From the viewpoint of achieving good optical properties and reducing the thickness of the optical resin wafer, the refractive index of the optical resin wafer manufactured in Embodiment 1 is preferably 1.47 or higher, more preferably 1.49 or higher, even more preferably 1.51 or higher, even more preferably 1.53 or higher, and, for example, can be 1.90 or lower, 1.80 or lower, or 1.70 or lower. It should be noted that the refractive index of the optical resin wafer can be determined according to Japanese Industrial Standard JIS K-0062:1992 by measurement at a temperature of 25°C and a wavelength of 587.6 nm.

[0103] For the optical resin wafer manufactured in Embodiment 1, from the viewpoint of enabling further planarization of the optical resin wafer, the curing shrinkage rate A calculated by the following formula (x) is preferably 15% or less, more preferably 10% or less, and even more preferably 5% or less. The curing shrinkage rate A of the optical resin wafer can be determined by measurement according to Japanese Industrial Standard JIS K-6941-2-4:2014.

[0104] A = (V0 - V1) / V0 × 100 (x)

[0105] A: Curing shrinkage rate [%)

[0106] V0: Volume of the curable composition (before curing)

[0107] V1: Volume of the optical resin wafer precursor (after curing)

[0108] The linear expansion coefficient α of the optical resin wafer manufactured in Embodiment 1 is... w Preferably 10×10 -6 / ℃ or higher, more preferably 20×10 -6 / ℃ or higher, more preferably 30×10 -6 / ℃ or higher, more preferably 40×10 -6 / ℃ or higher, and preferably 250×10 -6 Below / ℃, more preferably 200×10 -6 Below / ℃, more preferably 150×10 -6Below / ℃, more preferably 100×10 -6 Below / ℃, further preferably 80×10 -6 / ℃ or below. This allows for further improvement in the flatness of the optical resin wafer. Additionally, a w It was obtained by measuring from 25℃ to 150℃ according to JIS K-7197:2012, under the condition of heating rate of 5℃ / min.

[0109] The optical resin wafer manufactured in Embodiment 1 can be used, for example, in an optical information transmission device. Examples of optical information transmission devices include wearable displays that display virtual reality (VR), augmented reality (AR), and the like.

[0110] When the optical resin wafer manufactured in Embodiment 1 is used in an optical information transmission device, compared to its use in other applications, there is a further requirement for improved flatness and smoothness, and reduced thickness unevenness. As described above, according to Embodiment 1, a wafer with improved flatness and smoothness and reduced thickness unevenness can be obtained, therefore the optical resin wafer obtained by Embodiment 1 is suitable for use in optical information transmission devices.

[0111] 1-2. Implementation Method 2

[0112] Figure 5 This is a cross-sectional view schematically showing an example of a mold used in the manufacturing method of the optical resin wafer of Embodiment 2.

[0113] The method for manufacturing an optical resin wafer according to Embodiment 2 (hereinafter, sometimes simply referred to as "Embodiment 2") includes: a mold preparation step (hereinafter, sometimes simply referred to as "mold preparation step") of preparing a mold 2 that satisfies (b) below; and a curing step (hereinafter, sometimes simply referred to as "curing step") of casting a curable composition as a raw material for the optical resin wafer into the mold 2 and curing it to obtain an optical resin wafer precursor. The thickness t of the central portion of the cavity space m0 The thickness t of the cavity space is greater than the thickness t from the outer periphery towards the center, which is 5 mm larger than the cavity space. m1 Mold 2 is a mold that satisfies condition (b) below. In other words, the forming surface of mold 2 is a concave surface that is recessed toward the outside of the mold.

[0114] (b) The relationship between the thickness tm0 of the central part of the cavity space of mold 2 and the thickness tm1 of the cavity space of mold 2 at a distance of 5 mm from the outer periphery toward the central part is tm0. m0 >t m1 .

[0115] Mold 2 is a glass mold, for example, having a cylindrical cavity space.

[0116] As described above, the inventors have confirmed that when a curable composition used as a raw material for an optical resin wafer is cast, curing shrinkage occurs, causing depressions in the central portion of the cured material, making it difficult to ensure the flatness of the obtained optical resin wafer. Furthermore, the inventors have discovered that by making the thickness of the central portion of the cavity space greater than the thickness of the cavity space from the outer periphery towards the center by 5 mm, depressions in the central portion of the cured material are suppressed, making it easier to ensure the flatness of the optical resin wafer.

[0117] In this embodiment 2, for example, a mold 2 with a curved molding surface is prepared such that the thickness of the cavity space increases as it moves from the outer periphery toward the center.

[0118] In the prepared mold 2, for example, a resin casting path (not shown) is provided, through which a curable composition, which serves as the raw material for the optical resin wafer, is injected. Then, the curable composition is thermocured by heating, and the optical resin wafer precursor is removed from the mold.

[0119] The optical resin wafer precursor is subjected to deburring processing to remove residual "burrs" on the outer periphery, notching processing to form cuts (notches) at the ends of the optical resin wafer precursor, grinding processing to grind the surface of the optical resin wafer precursor, and heating processing to heat the optical resin wafer precursor to obtain an optical resin wafer.

[0120] In this embodiment 2, the thickness t of the central portion of the mold cavity is preferred. m0 The thickness t of the cavity space at a distance of 5mm from the outer periphery towards the center. m1 Satisfying 0.80X≤t m0 -t m1 The relationship is ≤1.20X. It should be noted that X is a value calculated by the following formula (2). The inventors modeled the amount of deflection generated in the optical resin wafer and studied the quantification of the amount of depression generated in the central part of the optical resin wafer. The results showed that it was highly consistent with X calculated by the following formula (2). Furthermore, it was found that by using a mold with a thickness of the central part that matches the material of the optical resin wafer as the target, 0.80X≤t m0 -t m1 A mold with a value of ≤1.20X can offset the depressions generated in the optical resin wafer, making it easy to ensure the flatness of the optical resin wafer.

[0121] [Number 1]

[0122]

[0123] ν: Poisson's ratio of the mold

[0124] R: Radius of the mold cavity space

[0125] ρ: The force exerted on the molding surface of the mold due to the curing shrinkage of the curing composition.

[0126] E: Young's modulus of the mold

[0127] In the mold used in Embodiment 2, the thickness t of the central part of the cavity space m0 The thickness t of the cavity space at a distance of 5mm from the outer periphery towards the center. m1 The relationship is t m0 -t m1 Preferably, the X value is 0.80X or higher, more preferably 0.85X or higher, even more preferably 0.90X or higher, even more preferably 0.95X or higher, and preferably 1.20X or lower, more preferably 1.15X or lower, even more preferably 1.10X or lower, even more preferably 1.05X or lower. Furthermore, preferably 0.80X or higher and 1.20X or lower, more preferably 0.85X or higher and 1.15X or lower, even more preferably 0.90X or higher and 1.10X or lower, even more preferably 0.95X or higher and 1.05X or lower. This further improves the flatness of the optical resin wafer.

[0128] The type and size of the curved surface of the mold used in Embodiment 2 are not particularly limited; for example, the molding surface can be spherical. When the molding surface of the mold used in Embodiment 2 is spherical, the curvature of the growth surface is preferably the thickness t of the central portion of the manufactured optical resin wafer. w0 The thickness t of the manufactured optical resin wafer at a distance of 5 mm from the outer periphery towards the center. w1 Satisfying 0.80≤t w1 / t w0 The curvature of a relationship ≤1.20. It should be noted that... Figure 6 This is a schematic cross-sectional view showing an example of an optical resin wafer obtained by the optical resin wafer manufacturing method of Embodiment 2, where the thickness t of the central portion of the optical resin wafer is shown. w0 The thickness t of the optical resin wafer at a distance of 5 mm from the outer periphery towards the center. w1 Satisfying 0.80≤t w1 / t w0 Relationship ≤1.20.

[0129] In the case where the forming surface of the mold used in Embodiment 2 is spherical, the curvature of the growth surface is preferably such that 0.80 ≤ t w1 / t w0The curvature of the relationship is more preferably such that 0.85 ≤ t w1 / t w0 The curvature of the relationship is further preferably such that 0.90 ≤ t w1 / t w0 The curvature of the relationship is preferably such that 0.95 ≤ t w1 / t w0 The curvature of the relationship is optimally satisfied by 0.98 ≤ t. w1 / t w0 The curvature of the growth surface of the mold is related to the curvature. Furthermore, the curvature of the mold's growth surface is preferably such that it satisfies t. w1 / t w0 The curvature of a relationship ≤1.15 is more preferably one that satisfies t w1 / t w0 The curvature of the relationship ≤1.10 is further preferably satisfied with t w1 / t w0 The curvature with a relationship ≤1.05 is particularly preferred to satisfy t w1 / t w0 The curvature with a relationship ≤1.02 is optimal for t. w1 / t w0 The curvature is 1.00.

[0130] The materials of the mold used in this embodiment 2, the materials of the optical resin wafer manufactured in this embodiment 2, the curing conditions in the curing process of this embodiment 2, the types of processing in the processing process of this embodiment 2, and the optical resin wafer manufactured in this embodiment 2 are the same as those in this embodiment 1.

[0131] 2. Optical resin wafer

[0132] The optical resin wafer of this embodiment will be described below.

[0133] The optical resin wafer of this embodiment is obtained by the optical resin wafer manufacturing method of this embodiment 1 and the optical resin wafer manufacturing method of this embodiment 2.

[0134] The optical resin wafer manufactured according to Embodiment 1 is, for example, an optical resin wafer 61 comprising a thiocarbamate resin, and has a hole 62 in the central portion of the optical resin wafer 61. It should be noted that... Figure 7 The left figure is a top view schematically showing an example of an optical resin wafer of this embodiment.

[0135] The preferred ranges for the average thickness and diameter of the optical resin wafer in this embodiment are as described above.

[0136] For the optical resin wafer of this embodiment, from the perspective of its use as a material for optical products, it is sometimes required to improve flatness and smoothness as well as reduce thickness unevenness. The preferred ranges for the flatness, thickness unevenness index (TTV), and smoothness index (surface roughness Ra) required for the optical resin wafer of this embodiment are as described above.

[0137] The refractive index, curing shrinkage, coefficient of linear expansion, and applications of the optical resin wafer in this embodiment are as described above.

[0138] 3. Manufacturing methods for optical components

[0139] The manufacturing method of the optical component according to this embodiment will be described below.

[0140] Figure 7 The right figure is a schematic illustration of an example of a method for manufacturing an optical component according to this embodiment. The method for manufacturing an optical component according to this embodiment includes a process of obtaining a plurality of optical components 22 from the optical resin wafer 21 of this embodiment. The optical component 22 of this embodiment may be, for example, an optical lens, a light guide plate, a filter, or an optical switch. Figure 8 This diagram schematically illustrates another example of a method for manufacturing an optical component according to this embodiment. The method for manufacturing an optical component according to this embodiment includes a process of obtaining a plurality of optical components 5 from the optical resin wafer 4 of this embodiment. The optical component 5 of this embodiment may be, for example, an optical lens, a light guide plate, a filter, or an optical switch.

[0141] 4. Optical components

[0142] The optical components of this embodiment will now be described.

[0143] The optical component of this embodiment is obtained by the manufacturing method of the optical component of this embodiment.

[0144] The optical components of this embodiment can be used, for example, in an optical information transmission device. It should be noted that the optical information transmission device is as described above.

[0145] use Figure 9 The optical information transmission device using the optical component of this embodiment will be described. The optical information transmission device 20 includes a light irradiation unit 11 and an optical component 10 of this embodiment. The light 12 generated by the light irradiation unit 11 is reflected by the optical component 10 of this embodiment, and the reflected light irradiates the user's eye 13. Thus, the light generated by the light irradiation unit 11 is recognized by the user wearing the optical information transmission device 20.

[0146] 5. Molds for manufacturing optical resin wafers

[0147] The mold for manufacturing optical resin wafers according to this embodiment will be described below.

[0148] The optical resin wafer manufacturing mold of this embodiment is an optical resin wafer manufacturing mold used to manufacture optical resin wafers. In this embodiment, one or more spacers are arranged in the central part of the optical resin wafer manufacturing mold.

[0149] The mold for manufacturing optical resin wafers in this embodiment is preferably provided with a resin casting path for casting the optical resin composition. Therefore, the spacer also serves as the resin casting path, eliminating the need for a separate resin casting path and further improving manufacturing efficiency.

[0150] The preferred embodiments of the mold for manufacturing optical resin wafers and the spacers of the mold for manufacturing optical resin wafers in this embodiment are the same as the preferred embodiments of the mold used in the manufacturing method of optical resin wafers in this embodiment described above, so the description here is omitted.

[0151] The embodiments of the present invention have been described above, but these are merely examples, and various configurations other than those described can be employed. Furthermore, the present invention is not limited to the embodiments described above, and modifications and alterations within the scope of achieving the objectives of the present invention are included in the present invention.

[0152] The application claims priority based on Japanese Patent Application No. 2023-221784 and Japanese Patent Application No. 2023-221798, filed on December 27, 2023, and all their disclosures are incorporated herein by reference.

[0153] The present invention can also be implemented in the following ways.

[0154] [1] A method for manufacturing an optical resin wafer, comprising: step A of casting an optical resin composition in a mold and curing it to obtain an optical resin wafer, wherein the forming surface of the mold includes a curved surface, the curved surface having the following curvature: the thickness t of the optical resin wafer at a distance of 5 mm from the outer periphery toward the center. w1 The thickness t of the central portion of the aforementioned optical resin wafer w0 The ratio is t w1 / t w0 The value is above 0.80 and below 1.20.

[0155] [2] According to the manufacturing method of the optical resin wafer described in [1], wherein the thickness of the central portion of the cavity space of the mold is set to t. m0 Let the thickness of the cavity space of the above mold, 5mm from the outer periphery towards the center, be t. m1 When, the following equation (1) is satisfied.

[0156] t m0 >t m1 (1)

[0157] [3] The method for manufacturing an optical resin wafer according to [1] or [2], wherein the optical resin wafer comprises one or more of the group consisting of (thio)carbamate optical resin, epoxy optical resin, polycarbonate optical resin, cyclosulfide optical resin, allyl carbonate optical resin, nylon optical resin, polyamide optical resin and polyimide optical resin.

[0158] [4] The manufacturing method of the optical resin wafer according to [1] or [2], wherein the average thickness of the optical resin wafer is 0.1 mm or more and 3.0 mm or less.

[0159] [5] The manufacturing method of the optical resin wafer according to [1] or [2], wherein the diameter of the optical resin wafer is 50 mm or more and 350 mm or less.

[0160] [6] The manufacturing method of the optical resin wafer according to [1] or [2], wherein the flatness of the optical resin wafer is 350 μm or less.

[0161] [7] The optical resin wafer manufacturing method according to [1] or [2], wherein, according to JIS K-0062:1992, the refractive index of the optical resin wafer at a temperature of 25°C and a wavelength of 587.6 nm is 1.47 or higher.

[0162] [8] The method for manufacturing an optical resin wafer according to [1] or [2], wherein the mold comprises glass.

[0163] [9] The method for manufacturing an optical resin wafer according to [1] or [2] includes a step B of grinding the optical resin wafer taken out from the mold.

[0164]

[10] The method for manufacturing an optical resin wafer according to [1] or [2] includes a step C: planarizing the optical resin wafer by heating.

[0165]

[11] A mold for manufacturing optical resin wafers, wherein the forming surface of the mold includes a curved surface, and the curved surface has the following curvature: the thickness t of the optical resin wafer at a distance of 5 mm from the outer periphery toward the center. w1 The thickness t of the central portion of the aforementioned optical resin wafer w0 The ratio is t w1 / t w0 The value is above 0.80 and below 1.20.

[0166]

[12] According to the optical resin wafer manufacturing mold described in

[11] , the thickness of the central portion in the cavity space of the optical resin wafer manufacturing mold is set as t. m0 Let the thickness of the cavity space of the above-mentioned optical resin wafer manufacturing mold, 5 mm from the outer periphery towards the center, be t. m1 When, the following equation (1) is satisfied.

[0167] t m0 >t m1 (1)

[0168] The present invention can also be implemented in the following ways.

[0169] <1> A method for manufacturing an optical resin wafer includes step A: casting an optical resin composition in a mold and curing it to obtain an optical resin wafer, wherein one or more spacers are disposed in the central part of the cavity space of the mold.

[0170] <2> according to <1> The method for manufacturing optical resin wafers, wherein one or more spacers are arranged within a range of 25 mm from the end of the cavity space toward the center of the mold.

[0171] <3> according to <1> or <2> The method for manufacturing optical resin wafers, wherein spacers are disposed on more than 80% of the outer periphery of the aforementioned mold.

[0172] <4> according to <1> or <2> In the method for manufacturing the optical resin wafer, the spacer is cylindrical, polygonal, or annular in shape.

[0173] <5> according to <1> or <2> The method for manufacturing an optical resin wafer, wherein, in step A, an optical resin composition is cast from a resin casting path disposed on the spacer.

[0174] <6> according to <1> or <2> The method for manufacturing optical resin wafers, wherein the optical resin wafers comprise one or more of the group consisting of (thio)urethane-based optical resins, epoxy-based optical resins, polycarbonate-based optical resins, cyclosulfide-based optical resins, allyl carbonate-based optical resins, nylon-based optical resins, polyamide-based optical resins, and polyimide-based optical resins.

[0175] <7> according to <1> or <2> The method for manufacturing the optical resin wafer, wherein the average thickness of the optical resin wafer is 0.1 mm or more and 3.0 mm or less.

[0176] <8> according to <1> or <2> The method for manufacturing an optical resin wafer, wherein the diameter of the optical resin wafer is 50 mm or more and 350 mm or less.

[0177] <9> according to <1> or <2> The method for manufacturing the optical resin wafer, wherein the flatness of the optical resin wafer is 350 μm or less.

[0178] <10> according to <1> or <2> The method for manufacturing the optical resin wafer, wherein, according to JIS K-0062:1992, the refractive index of the optical resin wafer at a temperature of 25°C and a wavelength of 587.6 nm is 1.47 or higher.

[0179] <11> according to <1> or <2> The method for manufacturing the optical resin wafer, wherein the curing shrinkage rate obtained by the following formula (1) is 15% or less, based on the volume V0 before curing and the volume V1 after curing of the optical resin composition measured according to JIS K-6941-2-4:2014.

[0180] Curing shrinkage rate (%) = (V1 - V0) / V0 (1)

[0181] <12> according to <1> or <2> The method for manufacturing optical resin wafers, wherein the spacer comprises one or more selected from the group consisting of glass, ceramic, metal and resin.

[0182] <13> An optical resin wafer comprising a thiocarbamate resin, having a hole in the central portion of the optical resin wafer.

[0183] <14> An optical resin wafer manufacturing mold is provided for manufacturing optical resin wafers, wherein one or more spacers are disposed in the central part of the optical resin wafer manufacturing mold.

[0184] Explanation of reference numerals in the attached figures

[0185] 1 Optical resin wafer

[0186] 2. Mold

[0187] 4 Optical resin wafers

[0188] 5 Optical components

[0189] 10 Optical components

[0190] 11 Light irradiation part

[0191] 12 Light

[0192] 13 Eyes

[0193] 20 Optical Information Transmission Device

[0194] 21 Optical Resin Wafer

[0195] 22 Optical components

[0196] 51 Mold

[0197] 52 cavity space

[0198] 53. Central part of the cavity space

[0199] 54 Spacers

[0200] The end of the 55-type cavity space

[0201] 61 Optical Resin Wafer

[0202] 62 holes

[0203] t w0 Thickness of the central portion of optical resin wafer 1

[0204] t w1 The thickness of optical resin wafer 1 at a distance of 5 mm from the outer periphery towards the center.

[0205] t m0 The width of the central part of the cavity space of mold 2

[0206] t m1 The width of the cavity space of mold 2 from the outer periphery towards the center is 5mm.

Claims

1. A method for manufacturing an optical resin wafer, comprising: The mold preparation process involves preparing a mold that meets either (a) or (b) below. as well as In the curing process, a curable composition serving as the raw material for the optical resin wafer is cast into the mold and cured to obtain an optical resin wafer precursor. (a) The mold has one or more spacers in the center of the cavity space. (b) The thickness t of the central portion of the cavity space of the mold m0 The thickness t of the cavity space of the mold at a distance of 5 mm from the outer periphery towards the center. m1 The relationship is t m0 >t m1 .

2. The method for manufacturing an optical resin wafer according to claim 1, further comprising: The processing step involves performing at least one of the following processing steps on the optical resin wafer precursor: notching, deburring, chamfering, cutting, grinding, polishing, and heating to obtain the optical resin wafer.

3. The method for manufacturing an optical resin wafer according to claim 1, wherein, The mold satisfies (a) and has one or more spacers within a range of 25 mm from the end of the cavity space toward the center.

4. The method for manufacturing an optical resin wafer according to claim 3, wherein, The mold satisfies (a) and the spacer is configured to occupy more than 80% of the outer periphery of the cavity space.

5. The method for manufacturing an optical resin wafer according to claim 1, wherein, The mold satisfies (a) and the spacer is cylindrical, polygonal, cylindrical or square.

6. The method for manufacturing an optical resin wafer according to claim 1, wherein, The mold satisfies (a) and the spacer has a structure capable of casting the curable composition into the cavity space.

7. The method for manufacturing an optical resin wafer according to claim 1, wherein, The mold satisfies (a), and the spacer comprises at least one selected from the group consisting of glass, ceramic, metal and resin.

8. The method for manufacturing an optical resin wafer according to claim 1, wherein, The mold contains glass.

9. The method for manufacturing an optical resin wafer according to claim 1, wherein, The optical resin wafer comprises at least one type selected from the group consisting of (thio)carbamate optical resins, epoxy optical resins, polycarbonate optical resins, cyclosulfide optical resins, allyl carbonate optical resins, nylon optical resins, polyamide optical resins, and polyimide optical resins.

10. The method for manufacturing an optical resin wafer according to claim 1, wherein, The refractive index of the optical resin wafer is 1.47 or higher.

11. The method for manufacturing an optical resin wafer according to claim 1, wherein, The curing shrinkage rate A of the curable composition, calculated using the following formula (x), is 15% or less. A = (V0 - V1) / V0 × 100 (x) A: Curing shrinkage rate [%) V0: The volume of the curable composition, i.e., the volume before curing. V1: The volume of the optical resin wafer precursor, i.e., the volume after curing.

12. The method for manufacturing an optical resin wafer according to claim 1, wherein, The average thickness of the optical resin wafer is 0.1 mm to 3.0 mm.

13. The method for manufacturing an optical resin wafer according to claim 1, wherein, The diameter of the optical resin wafer is 50mm to 350mm.

14. The method for manufacturing an optical resin wafer according to claim 1, wherein, The flatness of the optical resin wafer is below 350 μm.

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