Lighting device

Abstract

A lighting device disclosed in the present application includes a heat sink including a recess, a circuit board arranged in the recess and having a land, a light source portion arranged on the heat sink and including a light emitting device and a joint land, a connecting member connecting the circuit board and the light source portion, and an insulating member arranged at a lower portion of the connecting member, wherein the circuit board and the light source portion are spaced apart from each other in a first direction, the connecting members are spaced apart from each other in a second direction orthogonal to the first direction, the connecting members are connected between the land and the joint land, respectively, the insulating member is arranged between the light source portion and the circuit board, and the insulating member can not contact the land and the joint land.

Description

Technical Field

[0001] The embodiments relate to a lighting device. The embodiments relate to a vehicle light having a lighting device. Background Technology

[0002] Lighting applications include vehicle lighting, display backlighting, and signage backlighting. Light-emitting diodes (LEDs) offer advantages over light sources such as fluorescent and incandescent lamps, including low power consumption, semi-permanent lifespan, fast response speed, safety, and environmental friendliness. LEDs are used in various lighting devices, such as various display devices, indoor lights, and outdoor lights. Recently, luminaires using LEDs as vehicle light sources have been proposed. Compared to incandescent lamps, LEDs have the advantage of low power consumption. Furthermore, the small size of LEDs increases the design freedom of luminaires, and their semi-permanent lifespan offers economic benefits. However, due to the small emission angle of light emitted from LEDs, the luminous area of ​​the luminaire using LEDs needs to be increased when using LEDs as vehicle lights. As prior art related to lighting devices, Korean Patent Application Publication No. KR10-2023-0010550, published on January 19, 2023, is disclosed. Summary of the Invention

[0003] Technical issues

[0004] The embodiments of the invention provide a lighting device with improved reliability. This embodiment also provides a vehicle lamp and a headlight having a lighting device.

[0005] Technical solution

[0006] The lighting device according to an embodiment of the invention includes: a heat sink including a recess; a circuit board disposed in the recess and having a plurality of pads; a light source portion disposed on the heat sink and including a plurality of light-emitting devices and a plurality of bonding pads; a plurality of connecting members connecting the circuit board and the light source portion; and an insulating member disposed below the connecting members, wherein the circuit board and the light source portion are spaced apart from each other in a first direction, the plurality of connecting members are spaced apart from each other in a second direction orthogonal to the first direction, the plurality of connecting members are respectively connected between the plurality of pads and the plurality of bonding pads, the insulating member is disposed between the light source portion and the circuit board, and the insulating member may not contact the pads and bonding pads.

[0007] According to embodiments of the invention, the insulating member may contact multiple connecting members. Alternatively, the insulating member may not contact multiple connecting members.

[0008] According to an embodiment of the invention, the thickness of the insulating member can be more than 90% of the height of the plurality of connecting members, and the height of the plurality of connecting members is the distance from the heat sink to the connecting member.

[0009] According to an embodiment of the invention, the area having a plurality of pads has a first width in a second direction, the area having a plurality of bonding pads has a second width in a second direction, the width of the insulating member in the second direction is 1 to 1.5 times the first width, and the width of the insulating member can be 1 to 1.3 times the second width.

[0010] According to embodiments of the invention, the length of the insulating member in the first direction can be 50% to 80% of the length of the connecting member. The heat sink includes multiple patterns, and the insulating member can contact the patterns.

[0011] The lighting device according to an embodiment of the invention includes: a heat sink; a circuit board disposed on the heat sink and having a plurality of pads; a light source portion disposed on the heat sink and including a plurality of light-emitting devices and a plurality of bonding pads; a plurality of connecting members connecting the circuit board and the light source portion; and an insulating member disposed on the heat sink, wherein the circuit board and the light source portion are spaced apart from each other in a first direction, the plurality of connecting members are spaced apart from each other in a second direction orthogonal to the first direction, each of the plurality of connecting members includes: one end connected to the plurality of bonding pads; the other end connected to the plurality of pads; and a connecting portion connecting one end and the other end, the connecting portion including a protrusion protruding toward the heat sink, and the insulating member may be disposed at the lower part of the plurality of connecting members.

[0012] According to embodiments of the invention, the lighting device may include a molded portion surrounding a plurality of connecting members. The molded portion and the insulating members may contain the same material.

[0013] According to an embodiment of the invention, the light source includes a support member, a light-emitting device is disposed on the support member, and a connecting portion includes a central portion, a first outer portion, and a second outer portion. The central portion is disposed in the region between the side surface of the support member and the side surface of the circuit board, and the first and second outer portions may be disposed in regions other than the region between the side surface of the support member and the side surface of the circuit board. The central portion protrudes toward the heat sink, and the first and second outer portions may protrude in the opposite direction to the heat sink.

[0014] According to an embodiment of the invention, the heat sink includes a groove having a length in a second direction, and the groove can be disposed between the light source portion and the circuit board. An insulating member is disposed within the groove and can overlap with a plurality of connecting members in the vertical direction.

[0015] Beneficial effects

[0016] The lighting device according to an embodiment includes an insulating member. The insulating member supports a connecting member. The connecting member contacts the insulating member. Therefore, deformation of the connecting member due to external impact can be prevented. Therefore, the bonding force between the connecting member, the pad, and the bonding pad is improved. The connecting member is spaced apart from the insulating member within a predetermined range. Therefore, deformation of the connecting member due to external impact can be prevented. Therefore, the bonding force between the connecting member, the pad, and the bonding pad is improved. Furthermore, the connecting member does not contact the insulating member. Therefore, deformation of the connecting member position due to the difference in thermal expansion coefficients between the connecting member and the insulating member can be prevented. Therefore, the bonding force between the connecting member, the pad, and the bonding pad is improved.

[0017] According to another embodiment of the invention, the lighting device includes an insulating member. Therefore, even if the connecting member deforms towards the heat dissipation portion due to an external impact, the connecting member will not contact the heat dissipation portion due to the insulating member. Thus, electrical connection between the connecting member and the heat dissipation portion can be prevented. Furthermore, even if the shape or position of the connecting member deforms due to the difference in thermal expansion coefficients between the connecting member and the molding portion, contact between the connecting member and the heat dissipation portion can be prevented. Therefore, the reliability of the lighting device can be improved. Attached Figure Description

[0018] Figure 1 This is a perspective view showing an example of a lighting device according to the first embodiment.

[0019] Figure 2 yes Figure 1 A side sectional view of the lighting device.

[0020] Figure 3 It is shown Figure 1 A perspective view of the light source and circuit board of the lighting device.

[0021] Figure 4 This is a plan view of a lighting device with insulating components according to an embodiment of the present invention.

[0022] Figure 5 Show Figure 4 Another example of a lighting device.

[0023] Figure 6 Show Figure 4 Another example of a lighting device.

[0024] Figure 7 yes Figure 5 A side view section taken along line A-A' of the lighting device.

[0025] Figure 8 yes Figure 7 A magnified view of region A.

[0026] Figure 9 This is a perspective view showing an example of a lighting device according to a second embodiment.

[0027] Figure 10 yes Figure 9 A side sectional view of the lighting device.

[0028] Figure 11 It is shown Figure 9 A perspective view of the light source and circuit board of the lighting device.

[0029] Figure 12 yes Figure 11 A plan view of the lighting fixtures.

[0030] Figure 13 It is along Figure 12 The side view section taken by line B-B'.

[0031] Figure 14 Show Figure 12 Another example of a side view section taken along line B-B' of a lighting device.

[0032] Figure 15 yes Figure 11 Another plan view of the lighting fixture.

[0033] Figure 16 yes Figure 15 A side view section taken along line C-C' of the lighting device.

[0034] Figure 17 yes Figure 11 Another plan view of the lighting fixture.

[0035] Figure 18 yes Figure 17 A side view section taken along line D-D' of the lighting device.

[0036] Figure 19 yes Figure 11 Another plan view of the lighting fixture.

[0037] Figure 20 yes Figure 19 A side view section taken along line E-E' of the lighting device. Detailed Implementation

[0038] Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings. However, the technical concept of the present invention is not limited to the described embodiments, but can be implemented in various different forms, and one or more components may be selectively combined and substituted between embodiments if within the scope of the technical concept of the present invention. Furthermore, the terminology (including technical and scientific terms) used in the embodiments of the present invention, unless explicitly defined and described, is to be interpreted as having a meaning commonly understood by one of ordinary skill in the art to which this disclosure pertains, and common terms, such as those defined in dictionaries, may be interpreted in the context of the relevant art. The terminology used in the embodiments of the present invention is for describing embodiments and is not intended to limit the invention. In this specification, unless specifically stated in the phrase, the singular form may include the plural form, and when described as “at least one (or more) of A and / or B and C,” it may include at least one of all combinations of A, B, and C. Furthermore, terms such as first, second, A, B, (a), and (b) may be used to describe components of embodiments of the present invention. These terms are intended only to distinguish components from other components and are not determined by their nature, order, or sequence. Furthermore, when a component is described as being "connected," "joined," or "attached" to another component, this includes not only cases where the component is directly connected, joined, or attached to another component, but also cases where the component is "connected," "joined," or "attached" due to the presence of another component between them. Additionally, when describing each component as being formed or positioned "above" or "below," "above" or "below" includes not only cases where two components are in direct contact with each other, but also cases where one or more components are formed or positioned between two components. Furthermore, when expressed as "above" or "below," it can include not only upward movement based on a component but also downward movement based on a component.

[0039] The lighting device according to an embodiment will now be described with reference to the accompanying drawings.

[0040] Figures 1 to 8 A lighting device according to a first embodiment is shown. (Refer to...) Figures 1 to 8 The lighting device according to the first embodiment includes a heat sink 101, a circuit board 110, a light source 130, connecting members 141 and 142, and an insulating member 200.

[0041] Circuit board 110 is mounted on heat sink 101. Light source unit 130 includes multiple light-emitting devices 131. Light source unit 130 is mounted on heat sink 101. Connecting members 141 and 142 connect light source unit 130 and circuit board 110. Connecting members 141 and 142 electrically connect light source unit 130 and circuit board 110. Insulating member 200 is disposed between connecting members 141 and 142 and heat sink 101. Insulating member 200 supports connecting members 141 and 142. Insulating member 200 supports a portion of each of connecting members 141 and 142.

[0042] This lighting device is applied to various luminaires that require illumination. For example, it can be used in vehicle lighting, household lighting, or industrial lighting. Specifically, it can be used in vehicle lighting, including headlights, side mirror lights, side maker lights, fog lights, taillights, brake lights, daytime running lights, interior lights, door sills, rear combination lights, or backup lamps. Additionally, it can be used in indoor or outdoor advertising displays, display devices, and in railway vehicle applications.

[0043] Heat sink 101 supports circuit board 110. Heat generated by circuit board 110 is transferred through heat sink 101. Heat sink 101 comprises metal. For example, heat sink 101 can be formed as a single metal layer or a multi-layer stacked structure. Heat sink 101 can be formed as a single layer or multiple layers. Heat sink 101 can comprise ceramic material, aluminum nitride (AlN), or aluminum material with an anodized surface layer. The metal layers can include at least one of Al, Ni, Mo, Cu, Cu alloy, Cu-W, Ag, or Au.

[0044] The heat sink 101 includes a heat dissipation portion 102 and a side portion 103. The heat dissipation portion 102 includes a recess 108. A circuit board 110 is disposed in the recess 108. The area of ​​the heat dissipation portion 102 may be larger than the area of ​​the circuit board 110. The side portion 103 bends downward from the edge of the heat dissipation portion 102. One or more side portions 103 may be disposed along the outer side of the heat dissipation portion 102. The interior of the side portion 103 and the lower part of the heat dissipation portion 102 may provide an empty space 109, or may be integrated into another structure. The recess 108 is formed from the upper surface of the heat dissipation portion 102 to a predetermined depth. The depth of the recess 108 may be equal to or less than the thickness of the circuit board 110. The top view shape of the recess 108 may be the same as the top view shape of the circuit board 110. For example, the top view shape of the recess 108 may include a polygonal shape.

[0045] The circuit board 110 is inserted into the recess 108. The circuit board 110 can be bonded to the bottom surface of the recess 108 by an adhesive member 155. The adhesive member 155 may include a thermally conductive adhesive. The upper surface of the circuit board 110 may be disposed on the same plane as the upper surface of the heat sink 101. As another example, the upper surface of the circuit board 110 may be disposed at a position higher than the upper surface of the heat sink 101. The adhesive member 155 is disposed on the outer periphery of the recess 108. The surface of the heat sink 102 can be bonded to the circuit board 110.

[0046] The circuit board 110 may comprise resin or metal. For example, the circuit board 110 may comprise any one of a ceramic PCB, a metal core PCB, a flexible PCB, and a resin PCB. The circuit board 110 includes a lower metal layer, an upper circuit layer including pads, an insulating material protective layer for protecting the upper circuit layer, and an insulating layer between the metal layer and the circuit layer. The circuit board 110 may be configured as an MCPCB with a metal layer on its lower layer. Furthermore, the circuit board 110 can transfer heat to the heat sink 101.

[0047] The circuit board 110 can be fastened to the heat sink 102 via a fastening unit 119. The fastening unit 119 may include one or more screws. The circuit board 110 and the heat sink 102 can be fastened and tightly fitted by the screws. When the circuit board 110 is fixed by the fastening unit 119, the adhesive member 155 can be removed. This facilitates the separation of the circuit board 110. The circuit board 110 may include multiple pads. Pads 111 and 112 may include a first pad 111 and a second pad 112 spaced apart from each other. The first pad 111 and the second pad 112 are connected to a connector 115 disposed on the upper part of the circuit board 110 via a circuit layer of the circuit board 110. The connector 115 can receive drive signals and power from the outside. Pads 111 and 112 and the connector 115 may be disposed at opposite edges of the circuit board 110. The fastening unit 119 may be disposed in the area between the pads 111 and 112 and the connector 115.

[0048] The first pad 111 and the second pad 112 are disposed near one side surface of the circuit board 110. The pads 111 and 112 may be selected from Ti, Ru, Rh, Ir, Mg, Zn, Al, In, Ta, Pd, Co, Ni, Si, Ge, Ag, Au and their optional alloys.

[0049] A light source portion 130 is disposed on a heat dissipation portion 102. The light source portion 130 may be adjacent to a recess 108. The light source portion 130 may be adjacent to one side surface of a circuit board 110. One side surface of the circuit board 110 may be disposed between pads 111 and 112 and the light source portion 130. The light source portion 130 and the circuit board 110 may be spaced apart from each other in a first direction Y. The first pad 111 and the second pad 112 may be spaced apart from each other in a second direction X. The first direction Y is perpendicular to the second direction X. A third direction is the thickness direction of the light source portion 130 and the circuit board 110, and is perpendicular to the first direction Y and the second direction X.

[0050] The light source unit 130 may include a support member 133 and at least one light-emitting device 131 disposed on the support member 133. The light source unit 130 may include a resin member 132. The resin member 132 may be disposed on the support member 133. Multiple light-emitting devices 131 may be disposed on the support member 133. The resin member 132 is disposed around the multiple light-emitting devices 131 and may seal the sides of the light-emitting devices 131. The support member 133 may include a ceramic substrate or a semiconductor substrate. The support member 133 may support the multiple light-emitting devices 131.

[0051] The light source unit 130 may include bonding pads 134 and 135. Bonding pads 134 and 135 may be electrically connected to connecting members 141 and 142. The support member 133 may include conductive patterns. Multiple light-emitting devices 131 may be electrically connected via the conductive patterns. Bonding pads 134 and 135 may be electrically connected to the light-emitting devices 131 via the conductive patterns. Multiple light-emitting devices 131 may be connected in series or in parallel.

[0052] A protective element for protecting the light-emitting device 131 can be disposed on the support member 133. The protective element can be implemented as a thyristor, Zener diode, or transient voltage suppressor. Therefore, the light-emitting device 131 can be protected from electrostatic discharge. The support member 133 can be formed of ceramic material or MCPCB material. The light source section 130 can transfer the heat generated by the light-emitting device 131 to the heat sink 101 through the support member 133. The support member 133 and the heat sink 101 can be bonded together by an adhesive 138. The adhesive 138 can include a thermally conductive adhesive containing metal powder or inorganic powder in a resin material. For example, the adhesive 138 can contain a thermal interface material. The adhesive 138 can be disposed along the lower surface and lower side surface of the support member 133. The adhesive 138 is disposed on the outer side of the side surface of the support member 133 and can contact each side surface of the support member 133.

[0053] Multiple light-emitting devices 131 are arranged in one direction or disposed in at least one row. The multiple light-emitting devices 131 may be connected in series with each other. The multiple light-emitting devices 131 may include at least one of blue LED chips, green LED chips, or red LED chips. The multiple light-emitting devices 131 may be flip-chip bonded or wire-bonded. The light-emitting devices 131 may include multiple semiconductor layers made of compound semiconductors of group II and VI elements and / or compound semiconductors of group III and V elements. At least one or all of the multiple semiconductor layers may include compound semiconductors such as AlInGaN, InGaN, AlGaN, GaN, GaAs, InGaP, AlInGaP, InP, or InGaAs.

[0054] The resin component 132 may comprise silicone or epoxy resin. A phosphor layer 131a is disposed on the light-emitting device 131 and performs wavelength conversion on the light emitted by the light-emitting device 131. The resin component 132 may include a transparent layer and / or the phosphor layer 131a on the light-emitting device 131. As another example, the phosphor layer 131a may be formed separately from the resin component 132 or disposed in a different region. The resin component 132 may serve as a reflective wall around the light-emitting device 131 and the transparent layer and / or the phosphor layer 131a. The resin component 132 may also include a convex lens. The phosphor layer may include at least one or more of yellow, green, blue, or red phosphors. The light source portion 130 may emit one or more of blue, green, and red light, or may emit white light.

[0055] Reference Figures 3 to 6 The light-emitting device 131 is disposed on the upper part of one side of the support member 133. Bonding pads 134 and 135 are exposed on the upper part of the other side of the support member 133. Bonding pads 134 and 135 may include a first bonding pad 134 connected to the cathodes of the plurality of light-emitting devices 131 and a second bonding pad 135 connected to the anodes of the plurality of light-emitting devices 131. The first bonding pad 134 may be color-coded and serve as a cathode terminal, and the second bonding pad 135 may serve as an anode terminal. The first bonding pad 134 and the second bonding pad 135 may be selected from Ti, Ru, Rh, Ir, Mg, Zn, Al, In, Ta, Pd, Co, Ni, Si, Ge, Ag, Au, and optional alloys thereof. The first bonding pad 134 and the second bonding pad 135 are disposed on the support member 133 and electrically connected to the conductive pattern of the support member 133. The upper surfaces of the first bonding pad 134 and the second bonding pad 135 can be set at a height lower than the upper surface of the resin component 132, or they can be set at a height higher than the upper surface of the resin component 132.

[0056] First bonding pad 134 and first pad 111 are connected by a first connecting member 141. Second bonding pad 135 and second pad 112 are connected by a second connecting member 142. The first connecting member 141 and the second connecting member 142 can be formed as conductive lines. The first connecting member 141 and the second connecting member 142 can contain at least one of Au, Al, Ag, and Ni. The width of the first connecting member 141 and the second connecting member 142 can be greater than their thickness. That is, the first connecting member 141 and the second connecting member 142 can be configured as strip-shaped conductive lines.

[0057] One end 41 of each of the first connecting member 141 and the second connecting member 142 is respectively bonded to the first bonding pad 134 and the second bonding pad 135, and the other end 43 of each is respectively bonded to the first pad 111 and the second pad 112. The first connecting member 141 and the second connecting member 142 include a central portion 42 extending from one end 41 to the other end 43. The central portion 42 can extend from the other side of the light source portion 130 towards one side of the circuit board 110. The central portion 42 can extend above the recess 108 between the circuit board 110 and the heat sink portion 102. The height of one end 41 can be higher than the height of the other end 43. The height of the central portion 42 can be higher than one end 41.

[0058] like Figures 4 to 7 As shown, the light source unit 130 and the circuit board 110 are electrically connected via a first connecting member 141 and a second connecting member 142. Since the connecting members 141 and 142 are strip-shaped and configured as long conductors in the first direction Y, they may deform due to external impacts. Consequently, the electrical connection characteristics between the light source unit 130 and the circuit board 110 may be reduced. To prevent such problems, an insulating member 200 according to the embodiment can be provided between the light source unit 130 and the circuit board 110. Additionally, the insulating member 200 can be provided between the connecting members 141 and 142 and the heat sink 101.

[0059] Insulating member 200 comprises resin. For example, the insulating member may comprise epoxy resin, acrylate, polyurethane, polyolefin, silicone, or mixtures thereof. Connecting members 141 and 142 comprise metal. Accordingly, when the insulating member 200 covers the entire area of ​​connecting members 141 and 142, the connection characteristics of connecting members 141 and 142 may be reduced. More specifically, the insulating member 200 comprises a different material than connecting members 141 and 142. Accordingly, the coefficient of thermal expansion of the insulating member is different from that of the connecting members 141 and 142. Accordingly, the shrinkage and expansion characteristics of the insulating member 200 are different from those of the connecting members 141 and 142. Therefore, when the temperature of the lighting fixture changes, connecting members 141 and 142 may deform due to the difference in coefficients of thermal expansion. Accordingly, a portion of connecting members 141 and 142 may separate from at least one of pads 111 and 112 and bonding pads 134 and 135. Accordingly, the electrical characteristics and reliability of the lighting fixture may be reduced.

[0060] Therefore, in order to solve the above-mentioned problems, the lighting device according to the embodiment can prevent the deterioration of the electrical characteristics of the connecting members 141 and 142 by using an insulating member 200. (Refer to...) Figures 4 to 6 An insulating member 200 is disposed at the lower part of connecting members 141 and 142. Accordingly, connecting members 141 and 142 are disposed on the insulating member 200. Connecting members 141 and 142 may contact the insulating member 200. As another example, connecting members 141 and 142 may be spaced apart from the insulating member 200. As another example, a portion of the connecting members 141 and 142 may be spaced apart from the insulating member 200, while other portions may contact the insulating member 200.

[0061] Reference Figure 4 The insulating member 200 may comprise a single insulating member. Accordingly, the first connecting member 141 and the second connecting member 142 may be supported by a single insulating member. When the insulating member 200 is a single insulating member, the insulating member 200 may have a shape formed by a resin molding process. That is, the insulating member 200 may be elliptical or circular. In addition, the length L of the insulating member 200 may be maximum at the bottom of the central region between the first connecting member 141 and the second connecting member 142 in the first direction Y, and gradually decreases as the distance from the central region increases in the second direction X.

[0062] Reference Figure 5 and Figure 6 The insulating member 200 may include multiple insulating members. For example... Figure 5As shown, the insulating member 200 may include a first insulating member 210 and a second insulating member 220. The first insulating member 210 and the second insulating member 220 may be in contact with or connected to each other. The first insulating member 210 and the second insulating member 220 may each have an elliptical or circular shape. The insulating member 200 may include a curved surface. The insulating member 200 including the first insulating member 210 and the second insulating member 220 may have a curved surface. The upper surface of the insulating member 200 may have a curved surface. The edges of the insulating member 200 may have a curved shape.

[0063] A portion of each of the first insulating member 210 and the second insulating member 220 may be interconnected in the central region between the first connecting member 141 and the second connecting member 142. The first insulating member 210 and the second insulating member 220 are formed sequentially. For example, the second insulating member 220 is formed after the first insulating member 210 is formed. In this case, the second insulating member 220 is formed to partially overlap the first insulating member 210 in the vertical direction. Accordingly, the first insulating member 210 and the second insulating member 220 are connected and arranged. The first insulating member 210 and the second insulating member 220 may be disposed between pads 111 and 112 and bonding pads 134 and 135.

[0064] like Figure 6 As shown, the insulating member 200 may include a first insulating member 210, a second insulating member 220, and a third insulating member 230. The first insulating member 210, the second insulating member 220, and the third insulating member 230 may be in partial contact with each other. The first insulating member 210, the second insulating member 220, and the third insulating member 230 are connected. The second insulating member 220 is disposed between the first insulating member 210 and the third insulating member 230, and may be connected to both the first insulating member 210 and the third insulating member 230. That is, the two ends of the second insulating member 220 in the second direction X may be connected to one end of the first insulating member 210 and the other end of the third insulating member 230, respectively, or may overlap with them in the vertical direction.

[0065] The first insulating member 210, the second insulating member 220, and the third insulating member 230 may each be circular or elliptical. The insulating member 200 may include a curved surface. The insulating member 200, including the first insulating member 210, the second insulating member 220, and the third insulating member 230, may have a curved surface. The upper surface of the insulating member 200 may have a curved surface. The edges of the insulating member 200 may have a curved shape.

[0066] The first insulating member 210 may overlap with the first connecting member 141 in the vertical direction. The third insulating member 230 may overlap with the second connecting member 142 in the vertical direction. The second insulating member 220 may overlap with at least one or both of the first connecting member 141 and the second connecting member 142 in the vertical direction.

[0067] The first insulating member 210, the second insulating member 220, and the third insulating member 230 are formed sequentially. For example, the second insulating member 220 is formed after the first insulating member 210 is formed. In this case, the second insulating member 220 is formed to partially overlap with the first insulating member 210. Subsequently, the third insulating member 230 is formed. The third insulating member 230 is formed to partially overlap with the second insulating member 220. Accordingly, the first insulating member 210, the second insulating member 220, and the third insulating member 230 are connected and arranged. The insulating member 200 may be disposed between pads 111 and 112 and bonding pads 134 and 135. The first insulating member 210, the second insulating member 220, and the third insulating member 230 may be disposed between pads 111 and 112 and bonding pads 134 and 135.

[0068] Reference Figures 4 to 6 The insulating member 200 may not overlap with the first pad 111, the second pad 112, the first bonding pad 134, and the second bonding pad 135 in the vertical direction. For example... Figure 4 As shown, the insulating member 200 is not disposed on the first pad 111 and the second pad 112. More specifically, the insulating member 200 does not contact the first pad 111 and the second pad 112. The insulating member 200 is not disposed on the first bonding pad 134 and the second bonding pad 135. More specifically, the insulating member 200 does not contact the first bonding pad 134 and the second bonding pad 135.

[0069] like Figure 5 As shown, the first insulating member 210 and the second insulating member 220 are not disposed on the first pad 111 and the second pad 112. More specifically, the first insulating member 210 and the second insulating member 220 do not contact the first pad 111 and the second pad 112. The first insulating member 210 and the second insulating member 220 are not disposed on the first bonding pad 134 and the second bonding pad 135. More specifically, the first insulating member 210 and the second insulating member 220 do not contact the first bonding pad 134 and the second bonding pad 135.

[0070] like Figure 6As shown, the first insulating member 210, the second insulating member 220, and the third insulating member 230 are not disposed on the first pad 111 and the second pad 112. More specifically, the first insulating member 210, the second insulating member 220, and the third insulating member 230 do not contact the first pad 111 and the second pad 112. The first insulating member 210, the second insulating member 220, and the third insulating member 230 are not disposed on the first bonding pad 134 and the second bonding pad 135. More specifically, the first insulating member 210, the second insulating member 220, and the third insulating member 230 do not contact the first bonding pad 134 and the second bonding pad 135.

[0071] like Figure 4 As shown, the top view shape of the insulating member 200 can be, for example, elliptical. More specifically, the insulating member 200 can have a predetermined width W and length L. The width W is the length in the second direction X, corresponding to the dimension in the width direction of the connecting members 141 and 142. The length L is the length in the first direction Y, corresponding to the dimension in the length direction of the connecting members 141 and 142. The insulating member 200 can be formed as an ellipse with a width W greater than the length L. That is, when the lighting device is viewed from above, the insulating member 200 can appear elliptical. In other words, the upper surface of the insulating member 200 can be elliptical.

[0072] like Figure 5 and Figure 6 As shown, the insulating member 200 can be formed in a dumbbell shape or a peanut shape. More specifically, the first insulating member 210 and the second insulating member 220 can each be formed in an ellipse. The first insulating member 210 and the second insulating member 220 can each be formed in an ellipse with a width greater than its length. The first insulating member 210 and the second insulating member 220 overlap each other. Accordingly, the insulating member 200 can be formed in a dumbbell shape or a peanut shape with its central portion shorter. That is, when the lighting device is viewed from above, the insulating member 200 can have a dumbbell shape or a peanut shape. That is, the bottom surface shape of the insulating member 200 can have a dumbbell shape or a peanut shape. The side surface shape of the insulating member 200 can have a hyperbolic shape.

[0073] Reference Figure 5 , Figure 7 and Figure 8The insulating member 200 may have a predetermined size. The width W of the insulating member 200 may be greater than or equal to the size of the arrangement area of ​​the first pad 111 and the second pad 112, and the size of the arrangement area of ​​the first bonding pad 134 and the second bonding pad 135. The arrangement area of ​​the first pad 111 and the second pad 112 may have a first width W1 in the second direction X. Additionally, the arrangement area of ​​the first bonding pad 134 and the second bonding pad 135 may have a second width W2 in the second direction X. The first width W1 and the second width W2 may be different from each other. For example, the second width W2 may be greater than the first width W1. For example, the first width W1 may be 25 mm to 35 mm. Additionally, the second width W2 may be 45 mm to 55 mm. The width W of the insulating member may be greater than or equal to the first width W1. More specifically, the width W of the insulating member 200 may be 1 to 1.5 times the first width W1. When the width W of the insulating member 200 is less than twice the first width W1, the first connecting member 141 and the second connecting member 142 may not be supported by the insulating member 200. Consequently, the first connecting member 141 and the second connecting member 142 may deform due to external impact. Therefore, the reliability of the lighting device may be reduced.

[0074] When the width W of the insulating member 200 exceeds 1.5 times the first width W1, the arrangement area of ​​the insulating member 200 increases. Consequently, light emitted from the light-emitting device 131 may interfere with the insulating member 200, and the brightness of the lighting device may decrease. The width W of the insulating member 200 can be greater than or equal to the second width W2. More specifically, the width W of the insulating member 200 can be 1 to 1.3 times the second width W2. When the width W of the insulating member 200 is less than 1 times the second width W2, the first connecting member 141 and the second connecting member 142 may not be supported by the insulating member 200. Consequently, the first connecting member 141 and the second connecting member 142 may deform due to external impact. Therefore, the reliability of the lighting device may decrease. When the width W of the insulating member 200 exceeds 1.3 times the second width W2, the arrangement area of ​​the insulating member 200 increases. Consequently, light emitted from the light-emitting device 131 may interfere with the insulating member 200, and the brightness of the lighting device may decrease.

[0075] The length L of the insulating member 200 can be less than the lengths of the connecting members 141 and 142. More specifically, the length L of the insulating member 200 can be more than 50% of the lengths of the connecting members 141 and 142. More specifically, the length L of the insulating member 200 can be 50% to 80%, 55% to 75%, or 60% to 70% of the lengths of the connecting members 141 and 142. When the length L of the insulating member 200 is less than 50% of the lengths of the connecting members 141 and 142, the area supported by the insulating member 200 in the connecting members 141 and 142 may decrease. Accordingly, the area in the connecting members 141 and 142 not supported by the insulating member 200 may increase. Therefore, the supporting force of the connecting members 141 and 142 is reduced. Therefore, the connecting members 141 and 142 may be more susceptible to deformation due to external impact. Accordingly, the electrical connection characteristics between the light source unit 130 and the circuit board 110 may be reduced. Accordingly, the reliability of the lighting device may be reduced.

[0076] The insulating member 200 may have a predetermined thickness T. The thickness T of the insulating member 200 may be less than or equal to the height H of the connecting members 141 and 142. The height H of the connecting members 141 and 142 is the distance from the heat dissipation portion 102 to the connecting members 141 and 142. For example, the thickness T of the insulating member 200 may be 90% to 100% of the height H of the connecting members 141 and 142. Accordingly, the connecting members 141 and 142 may contact the insulating member 200. More specifically, the connecting members 141 and 142 may include areas that contact the insulating member 200. Accordingly, the connecting members 141 and 142 are supported by the insulating member 200. Accordingly, even if a physical force is applied from the outside, deformation of the connecting members 141 and 142 can be prevented. When a physical force is applied from the outside, the shape of the connecting members 141 and 142 may become concave. Accordingly, the bonding force between the connecting members 141 and 142 and the pads 111 and 112 and the bonding pads 134 and 135 may be reduced. Alternatively, the connection between the connecting members 141 and 142 and the pads 111 and 112 and the bonding pads 134 and 135 may be broken.

[0077] The deformation of connecting members 141 and 142 is limited by the insulating member 200. Therefore, even if a physical force is applied from the outside, the deformation of connecting members 141 and 142 can be minimized. Thus, it is possible to prevent a decrease in the bonding force between connecting members 141 and 142 and pads 111 and 112, as well as bonding pads 134 and 135, due to external forces.

[0078] As another example, connecting members 141 and 142 may be spaced apart from insulating member 200. More specifically, connecting members 141 and 142 may not include areas in contact with insulating member 200. Accordingly, the deformation of connecting members 141 and 142 is limited by insulating member 200. More specifically, even if a physical force is applied from the outside, the deformation of connecting members 141 and 142 is limited to the areas in contact with insulating member 200. Therefore, the deformation of connecting members 141 and 142 can be minimized. Thus, it is possible to prevent a decrease in the bonding force between connecting members 141 and 142 and pads 111 and 112, and bonding pads 134 and 135, due to external forces.

[0079] Connecting members 141 and 142 do not contact the insulating member 200. The lighting device generates heat during operation. Connecting members 141 and 142 are made of different materials from the insulating member 200. Therefore, connecting members 141 and 142 have different coefficients of thermal expansion than the insulating member 200. Consequently, at the same temperature, the amount of deformation of connecting members 141 and 142 relative to the insulating member 200 may differ. Therefore, connecting members 141 and 142 do not contact the insulating member 200. This prevents the insulating member 200 from causing deformation of connecting members 141 and 142.

[0080] The thickness T of the insulating member 200 can be more than 90% of the height H of the connecting members 141 and 142. When the thickness T of the insulating member 200 is less than 90% of the height H of the connecting members 141 and 142, the deformation of the connecting members 141 and 142 due to external impact may increase. Consequently, the bonding force between the connecting members 141 and 142 and the pads, as well as the bonding pads, may decrease.

[0081] Reference Figure 8 The heat dissipation portion 102 may include a pattern P. The insulating member 200 is formed in a droplet shape. Accordingly, the contact area between the insulating member 200 and the heat dissipation portion 102 is reduced. Therefore, the adhesion of the insulating member 200 may be reduced. Accordingly, multiple patterns P can be formed on the surface of the heat dissipation portion 102. The insulating member 200 can contact the pattern P. Through the pattern P, the contact area between the insulating member 200 and the heat dissipation portion 102 can be increased. Therefore, the adhesion of the insulating member 200 can be increased. Therefore, peeling of the insulating member 200 can be prevented. Accordingly, the reliability of the lighting device can be improved.

[0082] The lighting device according to the first embodiment includes an insulating member. The insulating member supports a connecting member. The connecting member contacts the insulating member. This prevents the connecting member from deforming due to external impact. Therefore, the bonding force between the connecting member and the pads and bonding pads is improved. The connecting member is spaced apart from the insulating member within a predetermined range. This prevents the connecting member from deforming due to external impact. Therefore, the bonding force between the connecting member and the pads and bonding pads is improved. Furthermore, the connecting member does not contact the insulating member. This prevents the connecting member from deforming due to the difference in thermal expansion coefficients between the connecting member and the insulating member. Therefore, the bonding force between the connecting member and the pads and bonding pads is improved.

[0083] Hereinafter, a lighting device according to the second embodiment will be described with reference to the accompanying drawings. Descriptions similar to those of the lighting device according to the first embodiment described above will be omitted.

[0084] Reference Figures 9 to 20 The lighting device according to the second embodiment includes a heat sink 101, a circuit board 110, a light source 130, and connecting members 141 and 142. Unlike the lighting device according to the first embodiment disclosed above, the lighting device according to the second embodiment does not include a recess. Therefore, the circuit board 110 is arranged on the heat sink 102. The circuit board 110 and the light source 130 are arranged on the same plane. The circuit board 110 and the light source 130 are arranged spaced apart.

[0085] Although not shown in the figures, an adhesive can be applied between the circuit board 110 and the heat sink 102. The circuit board 110 can be bonded to the heat sink 102 with the adhesive. The light source unit 130 and the circuit board 110 are electrically connected by a first connecting member 141 and a second connecting member 142. The connecting members 141 and 142 include wires. Therefore, the connecting members 141 and 142 may be damaged by external impacts. Furthermore, when the connecting members 141 and 142 are exposed to the outside, they may react with substances in the air and be corroded. Therefore, the electrical connection characteristics between the light source unit 130 and the circuit board 110 may be degraded. To solve the above problems, the lighting device according to this embodiment controls the shape of the connecting members.

[0086] Reference Figures 11 to 14 The connecting members 141 and 142 may be concave. More specifically, the connecting members 141 and 142 may be convex downwards. The connecting members 141 and 142 include one end 41, the other end 43, and a connecting portion 42. The connecting portion 42 may include a concave portion. More specifically, the connecting portion 42 may be convex toward the heat sink 101, or it may be a convex portion.

[0087] The connecting portion 42 of connecting members 141 and 142 may include a central portion 42a and outer portions. The outer portions may include a first outer portion 42b1 and a second outer portion 42b2. The first outer portion 42b1 may be arranged adjacent to bonding pads 134 and 135. The second outer portion 42b2 may be arranged adjacent to pads 111 and 112. The central portion 42a is the area disposed between the light source portion 130 and the circuit board 110. More specifically, the central portion 42a is the area disposed between the side surface of the support member 133 and the side surface of the circuit board 110. The first outer portion 42b1 and the second outer portion 42b2 are the areas disposed outside the area between the side surface of the support member 133 and the side surface of the circuit board 110. The central portion 42a may be concave. More specifically, the central portion 42a may convex downwards. The central portion 42a may convex toward the heat sink 101. The outer portions 42b1 and 42b2 may be convex. More specifically, the outer portions 42b1 and 42b2 may protrude upwards. More specifically, the outer portions 42b1 and 42b2 may protrude in the direction opposite to that of the heat sink 101.

[0088] Therefore, the connecting portion 42 of the connecting members 141 and 142, while extending from the bonding pads 134 and 135 towards the pads 111 and 112, can sequentially protrude upwards and then downwards, thus having multiple protrusions. That is, the connecting portion 42 can be formed in a shape where upwardly protruding portions, downwardly protruding portions, and upwardly protruding portions are connected in sequence. The length of the central portion 42a can be greater than the length of at least one of the first outer portion 42b1 and the second outer portion 42b2. For example, the length of the central portion 42a can be greater than the length of the first outer portion 42b1. Alternatively, the length of the central portion 42a can be greater than the length of the second outer portion 42b2. Alternatively, the length of the central portion 42a can be greater than the sum of the lengths of the first outer portion 42b1 and the second outer portion 42b2. For example, the length of the central portion 42a can be more than 30% of the length of the connecting members 141 and 142. More specifically, the length of the central portion 42a can be 30% to 70%, 35% to 65%, or 40% to 60% of the lengths of the connecting members 141 and 142. When the length of the central portion 42a is less than 30% of the lengths of the connecting members 141 and 142, the area protruding in the direction opposite to the heat sink increases. Therefore, the connecting members may be damaged by external impacts. When the length of the central portion 42a exceeds 70% of the lengths of the connecting members 141 and 142, the curvature of the central portion 42a may increase. Therefore, cracks may form in the connecting members. Furthermore, the connecting members may come into contact with the heat sink.

[0089] The length of at least one of the outer portions 42b1 and 42b2 of connecting members 141 and 142 may be more than 15% of the length of connecting members 141 and 142. More specifically, the length of at least one of the outer portions 42b1 and 42b2 may be 15% to 35%, 20% to 30%, or 22% to 28% of the length of connecting members 141 and 142. When the length of the outer portions 42b1 and 42b2 is less than 15% of the length of connecting members 141 and 142, the connection characteristics between connecting members 141 and 142 and bonding pads 134 and 135, and between connecting members 141 and 142 and pads 111 and 112, may be reduced. When the length of the outer portions 42b1 and 42b2 exceeds 30% of the length of connecting members 141 and 142, the length of connecting members 141 and 142 may increase. Therefore, the size of the lighting device may increase due to connecting members 141 and 142.

[0090] Within the length range of the central and outer portions of the connecting members 141 and 142, the length of the central portion 42a can be greater than the length of at least one of the first outer portion 42b1 and the second outer portion 42b2. For example, the length of the central portion 42a can be greater than the length of the first outer portion 42b1. Alternatively, the length of the central portion 42a can be greater than the length of the second outer portion 42b2. Or, the length of the central portion 42a can be greater than the sum of the lengths of the first outer portion 42b1 and the second outer portion 42b2. That is, a large portion of the connecting members 141 and 142 can be formed in a downwardly convex shape. Therefore, the area of ​​the connecting members 141 and 142 can be arranged between the light source portion 130 and the circuit board 110.

[0091] The connecting members 141 and 142 are protected by their shape. That is, even if an external impact is transmitted, the connecting members 141 and 142 can be protected by the light source unit 130 and the circuit board 110. More specifically, since the areas of the connecting members 141 and 142 are arranged between the light source unit 130 and the circuit board 110, external impacts can be prevented from being transmitted to the connecting members 141 and 142. Therefore, the connecting members 141 and 142 can be prevented from being damaged by external impacts.

[0092] The light source section 130 and the circuit board 110 may be spaced apart from each other. The light source section 130 and the circuit board 110 may be spaced apart from each other at a predetermined distance. The distance d between the light source section 130 and the circuit board 110 in the first direction may be more than 60% of the length of the connecting members 141 and 142. More specifically, the distance d between the light source section 130 and the circuit board 110 may be 60% to 90%, 65% to 85%, or 70% to 80% of the length of the connecting members 141 and 142.

[0093] When the distance d between the light source 130 and the circuit board 110 is less than 60% of the length of the connecting members 141 and 142, the distance d between the light source 130 and the circuit board 110 narrows. Therefore, the curvature of the central portion 42a may increase. Consequently, cracks may form in the connecting members. Furthermore, the connecting members may come into contact with the heat dissipation portion. When the distance d between the light source 130 and the circuit board 110 exceeds 80% of the length of the connecting members 141 and 142, the length of the connecting members may increase. Therefore, the size of the lighting device may increase due to the connecting members.

[0094] Connecting members 141 and 142 may be spaced apart from the heat sink 102. Connecting members 141 and 142 may be spaced apart from the heat sink 101 at a predetermined distance. The minimum distance D between connecting members 141 and 142 and the heat sink 102 in the third direction Z may be 0.1 mm or more. The minimum distance D between connecting members 141 and 142 and the heat sink 102 may be less than the thickness of the supporting member 133 and the circuit board 110. For example, the minimum distance D between connecting members 141 and 142 and the heat sink 102 may be from 0.1 mm to 2 mm.

[0095] The center of the central portion 42a of the connecting members 141 and 142 can be defined. More specifically, the center of the central portion 42a can be defined as the area where the distance between the central portion 42a and the heat dissipation part is minimal. The center of the central portion 42a can be located at or near 1 / 2 of the length of the central portion 42a. More specifically, the center of the central portion 42a can be arranged within ±10% of the 1 / 2 point of the length of the central portion 42a. Therefore, excessive bending of the connecting portion 42 in one direction can be prevented. Therefore, cracks can be prevented from appearing in the connecting members.

[0096] Reference Figure 14 The heat sink 101 may include a groove. More specifically, the heat sink 102 may include a groove G. The groove G is disposed between the light source portion 130 and the circuit board 110. Therefore, the groove G may overlap with the connecting members 141 and 142. More specifically, the groove G may overlap with the central portion 42a. Therefore, it is possible to prevent the connecting members 141 and 142 from contacting the heat sink 101.

[0097] Because the heat sink 101 is made of a conductive material, a short circuit may occur between the circuit board 110 and the light source section 130 when the connecting members 141 and 142 come into contact with the heat sink 101. Therefore, the reliability of the lighting device may be reduced. Therefore, the heat sink 102 includes a recess G. Thus, during the process of forming the connecting members 141 and 142, contact between the central portion 42a and the heat sink 102 can be prevented. That is, the minimum distance D between the connecting members 141 and 142 and the heat sink 102 can be increased. Alternatively, after forming the connecting members 141 and 142, contact between the central portion 42a and the heat sink 102 due to external impact can be prevented. Therefore, the reliability of the lighting device is improved.

[0098] The height of the upper surface of the light source section 130 may differ from the height of the upper surface of the circuit board 110. The height H1 of the upper surface of the light source section 130 is the height from the heat dissipation section 102 to the upper surface of the support member 133. The height H2 of the upper surface of the circuit board 110 is the height from the heat dissipation section 102 to the upper surface of the circuit board 110. The height H1 of the upper surface of the light source section 130 and the height H2 of the upper surface of the circuit board 110 may be the same or similar. More specifically, the height H1 of the upper surface of the light source section 130 may be 90% to 110% of the height H2 of the upper surface of the circuit board 110. When the height H1 of the upper surface of the light source section 130 and the height H2 of the upper surface of the circuit board 110 are outside the aforementioned ranges, the lengths of the outer portions 42b1 and 42b2 may increase. Therefore, the lengths of the connecting members 141 and 142, which are arranged in areas other than the area between the side surface of the light source section 130 and the side surface of the circuit board 110, may increase. Therefore, the connecting members 141 and 142 may be damaged by external impacts.

[0099] The lighting device may also include an insulating member 300. The insulating member 300 is disposed between the light source section 130 and the circuit board 110. The insulating member 300 is disposed on the heat dissipation section 102. The insulating member 300 is disposed below the connecting members 141 and 142. The insulating member 300 is disposed below the central portion 42a. The insulating member 300 faces the connecting members 141 and 142. The insulating member 300 faces the central portion 42a. Figure 14As shown, the insulating member 300 can be arranged within the groove G of the heat sink plate. The groove G of the heat sink plate has a relatively long length in the second direction Y and can overlap with the connecting members 141 and 142 in the vertical direction. The connecting members 141 and 142 are recessed toward the heat sink 102. Therefore, the central portion 42a is arranged adjacent to the heat sink 102. Therefore, when handling the lighting device, the connecting members 141 and 142 may come into contact with the heat sink 102. Alternatively, the connecting members 141 and 142 may come into contact with the heat sink 102 due to external impact. Since the connecting members 141 and 142 and the heat sink 102 are both made of conductive materials, a short circuit may occur when the connecting members 141 and 142 come into contact with the heat sink 102. Therefore, the reliability of the lighting device is reduced. Therefore, the insulating member 300 is provided on the heat sink 102. Therefore, contact between the connecting members 141 and 142 and the heat sink 102 due to deformation of the connecting members 141 and 142 can be prevented. More specifically, even if the connecting members 141 and 142 move closer to the heat sink 102 due to an external impact, the connecting members 141 and 142 will not come into contact with the heat sink 102 due to the insulating member 300. Therefore, electrical connection between the connecting members 141 and 142 and the heat sink 102 can be prevented.

[0100] The connecting members 141 and 142 are made of metal. Therefore, the connecting members 141 and 142 may be corroded by external moisture. Furthermore, the connecting members 141 and 142 may detach from the bonding pads 134 and 135 or pads 111 and 112 due to external impact. Alternatively, after the connecting members 141 and 142 are formed, the central portion 42a may come into contact with the heat dissipation portion 102 due to external impact. To solve the above problems, the lighting device according to this embodiment may further include a molding portion 250.

[0101] Reference Figure 15 and Figure 16 The lighting device may include a molding section 250. The molding section 250 is arranged between the light source section 130 and the circuit board 110.

[0102] The molding portion 250 may surround the connecting members 141 and 142. More specifically, the molding portion 250 may surround a portion of the connecting members 141 and 142. More specifically, the molding portion 250 may surround the connecting portion 42. More specifically, the molding portion 250 may surround a portion of the connecting portion 42. More specifically, the molding portion 250 may surround the central portion 42a. The outer portions 42b1 and 42b2 may be arranged outside the molding portion 250. The central portion 42a occupies most of the area of ​​the connecting members 141 and 142. Therefore, the molding portion 250 may surround most of the area of ​​the connecting members 141 and 142. Therefore, the connecting members 141 and 142 can be prevented from being corroded by external moisture. More specifically, the corrosion rate of the connecting members 141 and 142 can be reduced. In addition, the connecting members 141 and 142 can be prevented from detaching from the bonding pads 134 and 135 or pads 111 and 112 due to external impact. Therefore, the reliability of the lighting device is improved. After forming the connecting members 141 and 142, the central portion 42a can be prevented from contacting the heat dissipation portion 102 due to external impact. Therefore, the electrical characteristics of the lighting device are improved.

[0103] Reference Figure 17 and Figure 18 The lighting device may include a molding portion 250. The molding portion 250 is disposed between the light source portion 130 and the circuit board 110. Furthermore, the molding portion 250 is disposed on the circuit board 110. More specifically, the molding portion 250 is disposed on pads 111 and 112. The molding portion 250 may surround connecting members 141 and 142. More specifically, the molding portion 250 may surround a portion of connecting members 141 and 142. More specifically, the molding portion 250 may surround a connecting portion 42. More specifically, the molding portion 250 may surround a portion of connecting portion 42. More specifically, the molding portion 250 may surround a central portion 42a and a second outer portion 42b2. The first outer portion 42b1 may be disposed outside the molding portion 250. The central portion 42a occupies most of the area of ​​connecting members 141 and 142. Therefore, the molding portion 250 may surround most of the area of ​​connecting members 141 and 142.

[0104] The molding portion 250 prevents the connecting members 141 and 142 from being corroded by external moisture. More specifically, the corrosion rate of the connecting members 141 and 142 can be reduced. Furthermore, it prevents the connecting members 141 and 142 from detaching from the bonding pads 134 and 135 or pads 111 and 112 due to external impact. Therefore, the reliability of the lighting device is improved. Additionally, after forming the connecting members 141 and 142, it prevents the central portion 42a from contacting the heat dissipation portion 102 due to external impact. Therefore, the electrical characteristics of the lighting device are improved. The molding portion 250 surrounds the second outer portion 42b2. The second outer portion 42b2 is located in an area other than the area between the light source portion 130 and the circuit board 110. Therefore, the second outer portion 42b2 may be more susceptible to external impact than the central portion 42a. Since the molding portion 250 surrounds the second outer portion 42b2, damage to the second outer portion due to external impact can be prevented. The molding portion 250 may surround the pads 111 and 112. More specifically, the molding portion 250 may surround the engagement area between the connecting members 141 and 142 and the pads 111 and 112. Therefore, disconnection between the connecting members 141 and 142 and the pads 111 and 112 can be prevented.

[0105] Reference Figure 19 and Figure 20 The lighting device may include a molding portion 250. The molding portion 250 is disposed between the light source portion 130 and the circuit board 110. Furthermore, the molding portion 250 is disposed on the circuit board 110. More specifically, the molding portion 250 is disposed on pads 111 and 112. Furthermore, the molding portion 250 is disposed on the light source portion 130. More specifically, the molding portion 250 is disposed on the support member 133. More specifically, the molding portion 250 is disposed on the bonding pads 134 and 135. The molding portion 250 may surround connecting members 141 and 142. More specifically, the molding portion 250 may surround the entire area of ​​connecting members 141 and 142.

[0106] The molding portion 250 may surround the connecting portion 42. More specifically, the molding portion 250 may surround the entire area of ​​the connecting portion 42. More specifically, the molding portion 250 may surround the central portion 42a, the first outer portion 42b1, and the second outer portion 42b2. Therefore, the connecting members 141 and 142 can be prevented from being corroded by external moisture. More specifically, the corrosion rate of the connecting members 141 and 142 can be reduced. Furthermore, the connecting members 141 and 142 can be prevented from detaching from the bonding pads 134 and 135 or the pads 111 and 112 due to external impact. Therefore, the reliability of the lighting device is improved.

[0107] After forming the connecting members 141 and 142, the central portion 42a can be prevented from contacting the heat dissipation portion 102 due to external impact. Therefore, the electrical characteristics of the lighting device are improved. The molding portion 250 surrounds the first outer portion 42b1. The first outer portion 42b1 is located in an area outside the region between the light source portion 130 and the circuit board 110. Therefore, the first outer portion 42b1 may be more susceptible to external impact than the central portion 42a. Since the molding portion 250 is arranged around the first outer portion 42b1, damage to the first outer portion due to external impact can be prevented.

[0108] The molding portion 250 surrounds the second outer portion 42b2. The second outer portion 42b2 is located outside the area between the light source portion 130 and the circuit board 110. Therefore, the second outer portion 42b2 may be more susceptible to external impacts than the central portion 42a. Since the molding portion 250 is arranged around the second outer portion 42b2, damage to the second outer portion due to external impacts can be prevented.

[0109] The light source unit 130 and the circuit board 110 may include recesses. More specifically, the light source unit 130 may include a first recess G1. The first recess G1 may be formed on the upper surface of the support member 133. The circuit board 110 may include a second recess G2. Bonding pads 134 and 135 may be arranged within the first recess G1. Furthermore, pads 111 and 112 may be arranged within the second recess G2.

[0110] The molding portion 250 may surround the bonding pads 134 and 135. More specifically, the molding portion 250 may surround one end 41. More specifically, the molding portion 250 may surround the bonding area between the connecting members 141 and 142 and the bonding pads 134 and 135. Therefore, disconnection between the connecting members 141 and 142 and the bonding pads 134 and 135 can be prevented. The bonding pads 134 and 135 are arranged within the first recess G1. Therefore, movement of the molding portion 250 toward the light-emitting device 131 can be prevented. That is, the molding portion 250 may only contact the lower part of the side surface of the light-emitting device 131 facing the circuit board 110, or may be spaced apart from the side surface of the light-emitting device 131. Therefore, interference of the molding portion 250 with the light emitted from the light-emitting device 131 can be prevented. Therefore, the brightness of the lighting device is improved.

[0111] The molding portion 250 may surround pads 111 and 112. More specifically, the molding portion 250 may surround the other end 43. More specifically, the molding portion 250 may surround the mating area between the connecting members 141 and 142 and the pads 111 and 112. Therefore, disconnection between the connecting members 141 and 142 and the pads 111 and 112 can be prevented. Pads 111 and 112 are arranged within the second recess G2. Therefore, the size of the molding portion moving toward the circuit board 110 can be controlled. Therefore, the border area of ​​the circuit board is reduced. Therefore, the size of the lighting device can be reduced.

[0112] Reference Figures 15 to 20 The insulating member 300 is covered by the molding portion 250. The insulating member 300 and the molding portion 250 may contain the same material. Alternatively, the insulating member 300 and the molding portion 250 may contain materials with similar coefficients of thermal expansion. Because the insulating member 300 and the molding portion 250 have similar coefficients of thermal expansion, it is possible to prevent the insulating member 300 from separating from the molding portion 250 due to heat generated during the operation of the lighting device, thus preventing the formation of a gap between the insulating member 300 and the molding portion 250.

[0113] Since connecting members 141 and 142 are metal, and the molding portion 250 is made of a non-metallic material, the coefficients of thermal expansion of connecting members 141 and 142 differ from those of the molding portion 250. Therefore, the shape or position of connecting members 141 and 142 may deform due to the heat generated during the operation of the lighting device. Consequently, connecting members 141 and 142 may move towards the heat dissipation portion 102, causing them to contact the heat dissipation portion 102. An insulating member 300 is arranged on the heat dissipation portion 102. Therefore, even if the shape or position of connecting members 141 and 142 deforms due to the difference in their coefficients of thermal expansion with the molding portion 250, contact between connecting members 141 and 142 and the heat dissipation portion 102 can be prevented. Thus, the reliability of the lighting device is improved.

[0114] The lighting device according to the second embodiment includes a connecting member. The connecting member connects the light source unit and the circuit board. More specifically, the connecting member connects to bonding pads and solder pads. The connecting member includes one end, another end, and a connecting portion. The connecting portion connects the one end and the other end. The connecting portion includes a central portion and an outer portion. The central portion occupies most of the area of ​​the connecting portion. The central portion is formed as a concave shape. More specifically, the central portion is formed as a downward convex shape. Therefore, the central portion is arranged in the area between the light source unit and the circuit board. Therefore, when an external impact is transmitted, the central portion can be protected by the light source unit and the circuit board. Therefore, damage to the connecting member due to external impact can be prevented. Therefore, the reliability of the lighting device is improved.

[0115] The lighting device may also include a molding portion. The molding portion may be arranged around at least one of the connecting portion, one end, and the other end. Therefore, corrosion of the connecting member can be prevented. Furthermore, the holding force of the connecting member is improved. Additionally, short circuits between the connecting member, the bonding pad, and the pad can be prevented.

[0116] Furthermore, the light source section includes a first recess, and the circuit board includes a second recess. Bonding pads are arranged within the first recess, and bonding pads are arranged within the second recess. The area of ​​the molding section is controlled by the first and second recesses. Therefore, movement of the molding section towards the light source section can be prevented. Consequently, the brightness of the lighting device is improved. Furthermore, the enlargement of the circuit board border area due to the molding section can be prevented. Therefore, the size of the lighting device can be reduced. Additionally, the lighting device includes an insulating member on the heat dissipation section. Therefore, even if the connecting member deforms in shape or position due to external impact or a difference in thermal expansion coefficient with the molding section, contact between the connecting member and the heat dissipation section can be prevented. Therefore, the reliability of the lighting device is improved by preventing electrical connection between the connecting member and the heat dissipation section.

[0117] Lighting devices can be used to illuminate moving objects such as vehicles or drones. Furthermore, lighting devices can be used for various types of vehicle lighting, such as headlights.

[0118] The features, structures, effects, etc., described in the above embodiments are included in at least one embodiment of the present invention, but are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, etc., shown in the embodiments can be combined or modified by those skilled in the art relative to other embodiments. Therefore, content related to such combinations and modifications should be understood to be included within the scope of the present invention. Moreover, although embodiments have been primarily described above, these embodiments are merely examples and do not limit the present invention. Those skilled in the art will understand that various modifications and applications not shown above can be made without departing from the essential characteristics of the embodiments. For example, each component specifically shown in the embodiments can be modified and implemented. Furthermore, differences related to such modifications and applications should be understood to be included within the scope of the present invention as defined by the appended claims.

Claims

1. A lighting device, comprising: Including the recessed heat sink; A circuit board disposed in the recess and having multiple pads; A light source section is disposed on the heat sink and includes multiple light-emitting devices and multiple bonding pads; Multiple connecting components connecting the circuit board and the light source unit; as well as An insulating member is disposed at the lower part of the connecting member. The circuit board and the light source are spaced apart from each other in a first direction. The plurality of connecting members are spaced apart from each other in a second direction orthogonal to the first direction. The plurality of connecting members are respectively connected between the plurality of pads and the plurality of bonding pads. The insulating member is disposed between the light source and the circuit board, and The insulating component does not contact the solder pads and the bonding pads.

2. The lighting device according to claim 1, wherein, The insulating component contacts the plurality of connecting components.

3. The lighting device according to claim 1, wherein, The insulating component does not contact the plurality of connecting components.

4. The lighting device according to any one of claims 1 to 3, wherein, The thickness of the insulating member is more than 90% of the height of the plurality of connecting members, and The height of the plurality of connecting members is the distance from the heat sink to the connecting member.

5. The lighting device according to any one of claims 1 to 3, wherein, The area where the plurality of pads are arranged has a first width in the second direction. The area where the plurality of bonding pads are arranged has a second width in the second direction. Wherein, the width of the insulating member in the second direction is 1 to 1.5 times the width of the first width, and The width of the insulating member is 1 to 1.3 times the second width.

6. The lighting device according to any one of claims 1 to 3, wherein, The length of the insulating member in the first direction is 50% to 80% of the length of the connecting member.

7. The lighting device according to claim 1, wherein, The heat sink includes multiple patterns, and The insulating component is in contact with the pattern.

8. A lighting device, comprising: Heat sink; A circuit board mounted on the heat sink and having multiple pads; A light source section is disposed on the heat sink and includes multiple light-emitting devices and multiple bonding pads; Multiple connecting components connecting the circuit board and the light source unit; as well as Insulating components disposed on the heat sink. The circuit board and the light source are spaced apart from each other in a first direction. The plurality of connecting members are spaced apart from each other in a second direction orthogonal to the first direction. Each of the plurality of connecting members includes: One end of the plurality of bonding pads is connected; Connected to the other end of the plurality of pads; and The connecting portion that connects one end and the other end, The connecting portion includes a protrusion that protrudes toward the heat sink, and The insulating member is disposed at the lower part of the plurality of connecting members.

9. The lighting device according to claim 8, further comprising: The molded portion surrounding the plurality of connecting members.

10. The lighting device according to claim 9, wherein, The molding part and the insulating component contain the same material.

11. The lighting device according to claim 8, wherein, The light source unit includes a support member. The light-emitting device is disposed on the supporting member. The connecting portion includes a central portion, a first outer portion, and a second outer portion. The central portion is located in the area between the side surface of the support member and the side surface of the circuit board. The first outer portion and the second outer portion are located in the area outside the region between the side surface of the support member and the side surface of the circuit board.

12. The lighting device according to claim 11, wherein, The central portion protrudes towards the heat sink, and The first outer portion and the second outer portion protrude in the direction opposite to that of the heat sink.

13. The lighting device according to claim 8, wherein, The heat sink includes a groove having a long length in the second direction, and The groove is disposed between the light source and the circuit board.

14. The lighting device according to claim 13, wherein, The insulating member is disposed within the groove and overlaps with the plurality of connecting members in the vertical direction.

Images