Apparatus and method for bending a stripped portion of an interconnect busbar of a solar module onto an electrical contact portion of a junction box of the solar module

Abstract

The present invention relates to a device (10) for bending a stripped portion of an interconnecting busbar (14) of a solar module to an electrical contact portion (16) of a junction box (18) of the solar module, comprising a finger device (20) having a first end (36) and a second end (38), an actuator device (22), and a control device (24) configured to control the actuator device (22). The actuator device (22) is attached to the finger device (20) at the second end (38), and the actuator device (22) is configured to move the finger device (20) along a first direction and a second direction perpendicular to the first direction. The first end (36) includes a first surface region (42) and a second surface region (44). The first surface region (42) is offset from the first end (36) in a first direction from the first end (36) toward the second end (38). The second surface region (44) connects the first surface region (42) to the first end (36). The control device (24) is configured to control the actuator device (22) to move the finger device (20) in the first direction and then move the finger device (20) in the second direction to bend the stripped interconnect busbar (14) over the electrical contact portion (16).

Description

Technical Field

[0001] This disclosure relates to an apparatus and method for bending a stripped portion of an interconnecting busbar of a solar module to an electrical contact portion of the junction box of the solar module using a finger device and an actuator device. Background Technology

[0002] Solar modules used to generate electricity from sunlight include one or more junction boxes (JBs) connected to interconnecting busbars (ICBs). Typically, the junction boxes are manually installed onto the solar module. The installation procedure includes stripping the interconnecting busbars (ICBs); installing the junction box through the stripped interconnecting busbars; and bending the interconnecting busbars onto the solder pads of the junction box for a subsequent (automatic) soldering process to solder the bent interconnecting busbars to the solder pads. The step of bending the interconnecting busbars onto the solder pads of the junction box is usually performed manually.

[0003] CN 111 112 392 A, CN 107 626 853 A, CN 203 610 813 U, CN 103 639 562 A and CN 207 154 951 U describe various forms of methods and devices for attaching junction boxes to interconnecting busbars. Summary of the Invention

[0004] This objective is achieved through the objective of the independent claim. The supplementary claim describes preferred embodiments of the invention.

[0005] According to a first aspect of the invention, there is provided an apparatus for bending a stripped portion of an interconnect busbar of a solar module to an electrical contact portion of a junction box of the solar module. The apparatus includes a finger device having a first end and a second end, an actuator device, and a control device configured to control the actuator device. The actuator device is attached to the finger device at the second end and is configured to move the finger device in a first direction (selectively perpendicular to the plane of the solar module) and along a second direction perpendicular to the first direction (selectively parallel to the extension direction of the interconnect busbar). The first end includes a first surface region (e.g., a region or portion), and / or a second surface region (e.g., a region or portion), and / or a third surface region (e.g., a region or portion). The first surface region is offset from the third surface region and / or formed in a first direction from the first end toward the second end. The second surface region connects the first surface region to the first end and / or the third surface region. The third surface region may be disposed at the first end. The control device is configured to control the actuator device to move the finger device (e.g., toward the interconnect bus) in the first direction, and then move the finger device in the second direction to bend the stripped interconnect bus over the electrical contact portion.

[0006] According to a second aspect of the invention, a method is provided for bending a stripped portion of an interconnect busbar of a solar module onto an electrical contact portion of a junction box of the solar module. The method comprises the steps of: a) positioning a first end portion of a finger device in a cavity of the junction box, the first end portion including a first surface region, a second surface region, and / or a third surface region, the first surface region being offset from the first end portion and / or the third surface region in a first direction away from the first end portion, the second surface region connecting the first surface region to the first end portion and / or the third surface region; and b) bending the stripped portion of the interconnect busbar onto the electrical contact portion by moving the finger device along a second direction perpendicular to the first direction and parallel to the extension direction of the interconnect busbar.

[0007] The bending of the stripped portion of the interconnect busbar can be achieved through two (linear) movements corresponding to steps a) and b). These movements allow the stripped portion of the interconnect busbar to bend rapidly. Furthermore, reliable results can be obtained. The bending of the stripped portion of the interconnect busbar is achieved through the shape / profile of the finger device. The movement of the finger device presses the stripped portion of the interconnect busbar against the finger device, causing the bending of the finger device to conform to its shape / profile.

[0008] After bending the stripped portion of the interconnect busbar, the bent portion is positioned above or in contact with a contact portion, which may be a solder pad of a junction box. In subsequent steps, the bent portion of the interconnect busbar may be pressed into the contact portion and / or soldered to the contact portion.

[0009] The apparatus and method disclosed herein can replace manual bending of the stripped portion of the interconnect busbar. This improves the reliability of the bending process by eliminating human error. If the interconnect busbar is not bent or is not bent correctly, power loss may occur in the solar module due to imperfect electrical connections between the interconnect busbar and the junction box. For example, reliable bending of the interconnect busbar improves the quality of the welded connection between the interconnect busbar and the contact portion. Furthermore, the manual labor required to attach the junction box to the solar module can be reduced.

[0010] A solar module may include a plurality of solar cells electrically connected to each other via interconnecting busbars. The interconnecting busbars may be strip-shaped. In other words, the interconnecting busbars may include flat, elongated structures and / or be composed of conductive materials such as metals (e.g., copper). The interconnecting busbars may be fixedly attached to the solar module, for example, by adhesives and / or soldering. The interconnecting busbars may include metal-based flat wires for electrically connecting silicon cells and / or conducting current in crystalline silicon and / or thin-film photovoltaic modules. The interconnecting busbars may be directly soldered to silicon crystals to interconnect the solar cells in the solar panel. The interconnecting strips can transmit the current generated in the solar cells to the PV busbars.

[0011] A portion of the interconnect busbar is stripped to attach to the junction box. For example, the ends of the interconnect busbar are bent away from the solar module, causing them to protrude from the solar module. Alternatively, the interconnect busbar is cut open and stripped from the solar module in two parts. The junction box is attached to the stripped portion of the interconnect busbar.

[0012] A junction box may include an enclosure that protects the connection (junction) of two or more current-carrying wires (such as interconnecting busbars). This protection is typically needed to prevent fire and maintain a secure, reliable connection for many years. The junction box may be attached to the rear side of the solar module, that is, the side of the solar module not exposed to sunlight. The junction box may be the electrical output interface of the solar module and / or may act as a bypass diode. The junction box may include one or more bypass diodes.

[0013] The junction box includes a chamber extending from a first side of the junction box to an opposite second side. The first side of the junction box contacts the solar module and may cover the portion of the interconnecting busbar that is not detached from the solar module. The junction box is positioned such that the detached portion of the interconnecting busbar protrudes into the chamber of the junction box. The junction box can be positioned manually or mechanically.

[0014] The junction box's chamber allows insertion of a finger device from a second side. The chamber is a continuous space within the junction box or may include various spaces associated with individual contact portions. Contact portions may be positioned within the chamber. Contact portions may be made of conductive material and are parts / parts of the junction box to which the busbar is connected. Specifically, the junction box includes two contact portions. Each stripped portion of the interconnecting busbar is electrically connected to an individual contact portion. Therefore, each stripped portion of the interconnecting busbar is bent after a bending process to be positioned above or in contact with a contact portion.

[0015] The contact portion may include a flat metal surface that extends parallel to the plane of the solar module when the junction box is positioned on the solar module. However, the contact portion may have different shapes. For example, the contact portion may include solder pads that may include a circular profile protruding away from the solar module.

[0016] Multiple junction boxes may be disposed on the solar module. The junction boxes are used to electrically connect the solar module to an external power line. The purpose, composition, and / or embodiments of the junction boxes are known in the prior art and will not be discussed further herein. Similarly, the solar module and / or interconnecting busbars may include components known in the prior art and have embodiments known in the prior art.

[0017] The first end of the finger device is inserted into the cavity of the junction box. This corresponds to the positioning of the finger device within the cavity of the junction box. After completing the positioning step and / or step a), the first end of the finger device may approach and / or contact the solar module. Furthermore, the finger device may not contact the stripped portion of the interconnect busbar. For example, a gap may exist between the finger device and the stripped portion of the interconnect busbar in a second direction. This second direction may extend parallel to the extension direction of the interconnect busbar, particularly the portion of the interconnect busbar that is not stripped from the solar module.

[0018] The positioning step and / or step a) may include a pre-positioning step of positioning the finger device above the cavity of the junction box. This pre-positioning step may include positioning the finger device in a second direction such that the finger device is arranged above the cavity. The finger device may then be moved linearly in the first direction until the final position of the positioning step and / or step a) is reached. The positioning step and / or step a) may consist only of linear movement along the first direction. However, during the positioning step and / or step a), the finger device may be moved along the first direction and in a direction perpendicular to the first direction (such as the second direction) to laterally position the finger device within the cavity.

[0019] The first end of the finger device may be the end of the finger device closest to the solar module and / or the portion of the interconnect busbar that has not been detached from the solar module after the positioning step and / or step a) is completed. This may include inserting the first end of the finger device into the cavity of the junction box first. The second end of the finger device may remain outside the cavity of the junction box throughout the bending process.

[0020] When the final position of the positioning step and / or step a) is reached, the first surface region can be positioned at a certain height above the contact portion, but offset in the second direction. Therefore, when the final position of the positioning step and / or step a) is reached, the first surface region can be positioned offset relative to the contact portion in both the first and second directions. Furthermore, when the final position of the positioning step and / or step a) is reached, the contour of the first surface region can be aligned with the contour of the contact portion.

[0021] When the final position is reached in the positioning step and / or step a), the third surface region and / or the first surface region may be arranged parallel to the surface of the solar module. The third surface region and / or the second surface may be offset from the surface of the solar module in a first direction.

[0022] The first, second, and / or third surface regions can be portions of the outer surface of the finger device. The finger device may include a single (solid or hollow) component with the first, second, and / or third surface regions located thereon. However, the first, second, and / or third surface regions may be constituted by components capable of being removably or releasably attached to the finger device. The contours of the first and / or second surface regions are important for the stripped portions that bend the interconnecting busbars. For example, in the case of a sharp first end, the third surface region may be omitted. This may be the case if the second surface region directly connects to and / or terminates on the side surface of the finger device.

[0023] The third surface region may be (generally) flat and may form the first end (e.g., end face) of the finger device. The first surface region may be offset from the third surface region in a first direction. Therefore, when viewed along the first direction, the first end / third surface region and the first surface region are separated by a gap. Thus, when the third surface region contacts a flat surface (e.g., the flat surface of a solar module), the first surface region will not contact this flat surface.

[0024] The first surface region has a profile that allows the stripped portion of the interconnect busbar to bend. Specifically, the profile of the first surface region generally defines the shape of the bent portion of the interconnect busbar. For example, the first surface region may be (generally) flat and may extend (generally) parallel to the third surface region. In this case, the bent portion of the interconnect busbar extends parallel to the surface of the solar module after the bending process is completed. The first surface region and the third surface region may be parallel to each other. The first surface region may be configured to bend the interconnect busbar along a first direction of the finger device.

[0025] However, the contour of the first surface region is not limited to this. Other shapes are also possible, as long as movement of the finger device in the second direction causes bending of the stripped portion of the interconnect busbar. For this purpose, the first surface region extends partially or only along the second direction. For example, the first surface region may include a surface portion extending parallel to the plane of the third surface region and / or the solar module when the finger device is positioned. In another alternative embodiment, a portion of the first surface region conforms to a portion of the contour / shape of the contact portion (e.g., has a corresponding or matching shape). The first surface region may extend at least partially perpendicular to the first direction.

[0026] The second surface region connects the first end or the third surface region to the first surface region. In other words, the second surface region refers to a portion of the surface of the finger device disposed between the first end or the third surface region and the first surface region when moving along the outer surface of the finger device. Since the third surface region and the first surface region are separated along a first direction, the second surface region extends at least partially along the first direction. The second surface region may be shaped to mate with a portion of a junction box, and during a bending process, the second surface region may press against said portion, such as an adjacent portion of the junction box. The second surface region may be perpendicular to the third surface region and / or the first surface region. The first surface region may be configured to bend the interconnecting busbar in a direction perpendicular to the first direction of the finger device.

[0027] The adjacent portion of the junction box may be directly adjacent to the contact portion and extend at least partially along a first direction. The adjacent portion may also include a side surface of the contact portion facing the finger device. For example, the adjacent portion of the junction box may be perpendicular to the upper surface of the contact portion (or the average direction of the contact portion). The adjacent portion may include a portion of the junction box wall that limits the cavity. The adjacent portion may include a wall of the junction box supporting the contact portion, or the contact portion may be disposed on or attached to said wall. The wall may be exposed to the cavity. The adjacent portion may extend between a first side of the junction box and the contact portion.

[0028] The bending of the stripped portion of the interconnect busbar is achieved by moving the finger device along a second direction (linearly), while optionally maintaining the position of the finger device along a first direction. The bending of the stripped portion of the interconnect busbar can be achieved by linearly moving the finger device. During the movement in step b), the finger device contacts the stripped portion of the interconnect busbar and presses it along the movement direction. The stripped portion of the interconnect busbar can directly contact or be close to the adjacent portion of the junction box. The bending of the stripped portion of the interconnect busbar is limited by the adjacent portion of the junction box. In other words, the stripped portion of the interconnect busbar is pressed against the adjacent portion. If the adjacent portion and the second surface region have matching shapes, the second surface region can imprint the shapes of the adjacent portion and the second surface region onto the portion of the stripped portion of the interconnect busbar that contacts the adjacent portion.

[0029] The portion of the stripped section of the interconnect busbar that is actually bent is the portion positioned above the adjacent portion. Therefore, movement of the finger device causes this portion of the stripped section of the interconnect busbar to bend around or near the upper end or edge of the adjacent portion and above the contact portion. The contour of the first surface region defines the final shape of the bent portion of the stripped section of the interconnect busbar. Specifically, the degree of bending is defined by the degree of inclination of the first surface region relative to the second surface region.

[0030] After the bending process is completed, the bent portion of the stripped section of the interconnect busbar follows the contour of the first surface region and / or the second surface region. Simultaneously, the non-bent portion of the stripped section of the interconnect busbar is sandwiched between the second surface region and the adjacent portion, selectively making direct contact with one or both. Further optionally, the stripped portion of the interconnect busbar makes full contact with the first surface region and / or the second surface region after the bending process is completed.

[0031] Since the first surface region is located above the contact portion before step b) (bending step), the bent portion of the stripped portion of the interconnect busbar can be arranged above the contact portion, i.e., a gap exists between the contact portion and the bent portion of the stripped portion of the interconnect busbar in the first direction. Alternatively, the bent portion of the stripped portion of the interconnect busbar can contact the contact portion.

[0032] Individual movement of the finger device is provided by an actuator device, which includes one or more electric and / or hydraulic devices for moving the finger device. The actuator device may include a robotic arm, a linear motor, and / or additional components that provide the movement in steps a) and b). The actuator device may include a first actuator configured to move the finger device in a first direction and a second actuator configured to move the finger device in a second direction.

[0033] The control device may be electrically or electronically connected to the actuator device. The control device can control the actuator device to move and position the finger device. The control device may be arranged remotely from the actuator device and / or the finger device. The control device may include one or more processors and / or one or more memories storing algorithms and / or other programs for controlling the actuator device. The control device may include a computer and / or a server. The control device may be configured to perform the methods described herein.

[0034] The first and / or second directions can be linear or non-rotational. The first and second directions can define two directions in a Cartesian coordinate system that can be aligned with the upper surface and / or plane of the solar module.

[0035] The optional features will now be listed. These can be applied individually or in any combination with any aspect.

[0036] In an optional embodiment, step b) includes moving the finger device along the second direction until the stripped portion of the interconnecting busbar has a profile that matches the profile of the first surface region and / or the second surface region.

[0037] After completing step b), the stripped portion of the interconnect busbar may contact the complete first surface region and / or second surface region. The stripped portion of the interconnect busbar may conform to the shape of the first surface region and / or second surface region. In other words, the contour / shape of the first surface region and / or second surface region defines the curvature of the stripped portion of the interconnect busbar. The contour / shape of the first surface region and / or second surface region may be imprinted on the stripped portion of the interconnect busbar. Therefore, the contour / shape of the first surface region and / or second surface region may define the curvature / shape of the stripped portion of the interconnect busbar.

[0038] The bending process is completed once the second surface area contacts the stripped portion of the interconnect busbar, particularly when the stripped portion of the interconnect busbar is pressed between the second surface area and the adjacent portion. In other words, the second surface area is in direct contact with the stripped portion of the interconnect busbar that is pressed tightly against the adjacent portion. At this position, the finger device can no longer move further in the second direction because the adjacent portion prevents further movement. Therefore, the adjacency of the second surface area with the adjacent portion (with the stripped portion of the interconnect busbar therebetween) defines the endpoint of movement in the second direction.

[0039] Step b) may include moving the finger device a predetermined distance in the second direction. The finger device may be positioned after step b) is completed such that the second surface area is arranged at a distance from the adjacent portion. For example, step a) includes positioning the finger device at a predetermined position away from the contact portion. This may include positioning the finger device such that the outer surface of the finger device (located on the opposite side relative to the second surface area) contacts the outer wall of the junction box. This corresponds to the position furthest from the adjacent portion in the second direction.

[0040] In an optional embodiment, the control device is further configured to control the actuator device to move the finger device along a first direction such that the first surface region bends the curved interconnect bus toward the electrical contact portion, which optionally includes pressing the curved interconnect bus into the electrical contact portion.

[0041] In another alternative embodiment, the method further includes step c), which further bends the bent interconnect bus toward the electrical contact portion by moving the finger device along a first direction, wherein optionally, step c) also includes pressing the bent interconnect bus into the electrical contact portion.

[0042] After the bending procedure or step b) is completed, at least a portion of the first surface area can be positioned above the contact portion. Therefore, moving the finger device towards the contact portion along the first direction causes the bent portion of the interconnect busbar to bend towards the contact portion. This additional bending or step c) ensures that the bent portion of the interconnect busbar does not spring back and / or move away from the contact portion when the finger device is removed. Specifically, step c) helps to keep the bent portion of the interconnect busbar positioned above or in contact with the contact portion.

[0043] If the further bending step or step c) includes bending the bent portion of the interconnect busbar to the extent that the bent portion of the interconnect busbar is pressed against or into the contact portion, this positioning of the bent portion of the interconnect busbar can be more reliable. In this case, the bent portion of the interconnect busbar can adhere to and / or be bonded to the contact portion, which eliminates the risk of the bent portion of the interconnect busbar moving away from the contact portion when the finger device is removed. Therefore, the improved positioning / bending of the bent portion of the interconnect busbar helps to more reliably weld the bent portion of the interconnect busbar to the contact portion.

[0044] Further bending is provided by a first surface region that moves toward the contact portion. Therefore, the first surface region presses the bent portion of the interconnecting busbar into the contact portion. This can include deformation of the contact portion, for example, if the contact portion includes circular solder pads.

[0045] The welding step can be an additional step to the bending process of this disclosure. Welding can be performed using a separate welding device. However, the finger device can include means for welding the bent portion of the interconnect busbar to the contact portion, for example, immediately after the bent portion of the interconnect busbar is pressed onto the contact portion. In this case, the finger device is not removed from the bent portion of the interconnect busbar before the welding step, which ensures that the bent portion of the interconnect busbar is in contact with the contact portion during the welding step. This provides a reliable welded connection because it eliminates the risk of the bent portion of the interconnect busbar moving away from the contact portion. The finger device can include a heater for heating the first surface area.

[0046] The positioning step or step a) may include moving the finger device along a first direction such that the third surface area points in the direction of movement. The bending step or step b) may include moving the finger device along a second direction such that the second surface area points in the direction of movement. The additional bending / pressing step or step c) may include moving the finger device along the first direction such that the first surface area points in the direction of movement.

[0047] In an optional embodiment, step a) includes positioning the first surface region at a first height position in a first direction, the first height position being greater than a second height position in the first direction where the upper surface of the contact portion is located, wherein optionally, the difference between the first height position and the second height position is a predetermined value.

[0048] The first and second height positions relate to positions in a first direction. For example, the first and second height positions define distances relative to the plane of the solar module or the bottom plane of the junction box. Alternatively, the first and second height positions may be determined relative to the upper surface of the junction box or the opening of the junction box into which the finger device is inserted (corresponding to the upper limit of the chamber). The difference between the first and second height positions can be an absolute value.

[0049] The first height position can refer to the point on the first surface region that protrudes the most towards the first end in the first direction. Similarly, the second height position can refer to the point on the contact portion that protrudes the farthest away from the solar module in the first direction.

[0050] The predetermined value can be a measurement of the distance between the bent portion and the contact portion of the interconnect busbar, because the second height position defines the height position of the first surface region, and thus defines the height position at the point where the stripped portion of the interconnect busbar is bent. Therefore, reducing the predetermined value results in a reduction in the distance between the bent portion and the contact portion of the interconnect busbar.

[0051] During the additional bending step or step c), the finger device needs to move a predetermined value at least in the first direction in order to press the bent portion of the interconnect busbar into the contact portion.

[0052] In an optional embodiment, step a) includes positioning the first surface region parallel to the surface of the solar module.

[0053] The surface of the solar module can be the surface of the solar module to which the junction box is attached. This can be the upper surface or the outer surface of the solar module. Alternatively, the first surface area is flat, i.e., extends in a plane. In this case, the first surface area is positioned parallel to the plane or surface of the solar module in step a) and / or remains in said orientation during step b).

[0054] More generally, the primary orientation of the first surface region is parallel to the plane or surface positioning of the solar module. For example, if the first surface region has a profile / shape that matches the profile / shape of the contact portion, the first surface region is positioned such that the profile / shape of the first surface region and the contact portion have the same orientation. The primary orientation can refer to the average orientation or the orientation of a portion of the first surface region that constitutes the largest part of the first surface region. Other methods for determining the primary orientation are also possible. In other words, the first surface region is positioned based on its profile / shape and relative to the profile / shape of the contact portion. This ensures that the stripped portion of the interconnect busbar is bent into a profile / shape that matches the profile / shape of the contact portion.

[0055] In an optional embodiment, the device further includes a camera, selectively a 3D camera, wherein the selective control device is configured to use the camera to position the finger device.

[0056] In a further optional embodiment, step a) includes imaging the junction box using a camera (selectively a 3D camera) and / or locating the finger device based on the image captured by the camera.

[0057] The camera can be positioned in a fixed location. Alternatively, the camera can be movable, allowing it to be positioned above the junction box. The camera can be detached from the control device, finger device, and / or actuator device. The camera can be positioned such that it can image onto the chamber and / or contact portion. Thus, the camera provides information on where the finger device is positioned in the positioning step or step a). In other words, the camera facilitates the positioning of the finger device relative to the contact portion.

[0058] A camera can be a video camera, i.e., a camera that provides image streaming. A camera may include an optical system and an optical sensor for generating electrical signals based on light incident on it. An optical system is provided to focus / guide / direct light from around the camera onto the optical sensor. Therefore, a camera is an imaging system that converts visual information into electrical or electronic information. The camera is electrically or electronically connected to a control device, which includes a program or algorithm for analyzing the electrical data generated by the camera to control actuator devices, particularly positioning the finger device in the positioning step or step a). The information generated by the camera may not be used during the bending steps (step b) and / or step c), which may be performed independently of the camera or with the camera off.

[0059] Optionally, one or more cameras are provided to obtain a three-dimensional (3D) representation of the chamber and / or contact portion. Alternatively or additionally, a 3D camera configured to obtain 3D images is provided. The 3D camera may include two optical systems and two optical sensors offset from each other to obtain a 3D representation.

[0060] Cameras can also be used to position junction boxes on solar modules. For example, a robotic device (such as a robotic arm) positions the junction box above a stripped portion of the interconnect busbar, where images captured by the camera are used to determine the location of the stripped portion of the interconnect busbar.

[0061] Alternatively or additionally, in step a), the finger device can be positioned based on information about its current position and the current position of the contact portion. These positions can be determined using one or more sensors, or they can be input into a control device. Based on the current positions of the finger device and the contact portion, the control device can be configured to calculate a trajectory for moving the finger device in the positioning step (step a).

[0062] In an optional embodiment, the finger device includes a first finger and a second finger, wherein optionally, the first finger and the second finger each include a separate third surface region, a separate first surface region and a separate second surface region, and wherein optionally the second surface region of the first finger faces the second surface region of the second finger.

[0063] In a further optional embodiment, the finger device includes a first finger and a second finger, wherein optionally, the first finger and the second finger each include a separate third surface region, a separate first surface region and a separate second surface region, the second surface region of the first finger facing the second surface region of the second finger, and wherein step b) further optionally includes (simultaneously) moving the first finger and the second finger toward each other to bend two stripped portions of the interconnect busbar onto separate contact portions.

[0064] The first finger may include a third surface region, a first surface region, and a second surface region, and / or the second finger may include a third surface region, a first surface region, and a second surface region.

[0065] The first and second fingers can provide a double-acting clamp. During the bending step or step b), the first and second fingers can move (linearly) toward each other. This causes the two stripped portions of the interconnecting busbar to bend simultaneously. This reduces the time required for the entire bending process. More importantly, the simultaneous positioning of the first and second fingers in step a) further reduces the time required to complete the bending process. For example, a cycle time of less than two seconds can be achieved. This makes the total cycle time for attaching the junction box to the solar module less than 45 seconds.

[0066] The first and second fingers may include elongated bodies that allow insertion into the chambers of a finite-sized junction box. Furthermore, the first and second fingers are respectively associated with a first contact location and a second contact portion. In other words, the first and second fingers may be configured to bend the first stripped portion and the second stripped portion of the interconnecting busbar, respectively.

[0067] The first and second fingers can be arranged parallel to each other, thereby performing a movement along a second direction and toward each other (maintaining the orientation) during the bending step (step b). Specifically, the third surface regions of the first and second fingers can be arranged parallel to each other. Furthermore, the first surface regions of the first and second fingers can be arranged parallel to each other. The second surface regions of the first and second fingers can be arranged parallel to each other, with their individual second surface regions facing each other. For example, the first finger (or the elongated body of the first finger) can be mirror-symmetrical to the second finger (or the elongated body of the second finger). Throughout the bending process, the perspective orientation of the third surface region, the first surface region, and / or the second surface region can be maintained; only the positions of the first and second fingers (especially their positions relative to each other) change during the bending process. Therefore, during step b), the first and second fingers move linearly toward each other.

[0068] The third, first, and / or second surface regions of the first finger may include the same dimensions, shape, orientation, and location as the third, first, and / or second surface regions of the second finger, respectively. In this case, the first and second fingers provide similar or identical bends in the individual stripped portions of the interconnecting busbar.

[0069] In an optional embodiment, the finger device includes a single finger, wherein optionally, the single finger includes a third surface region, two first surface regions and two second surface regions, and wherein optionally, the second surface regions are arranged on opposite sides of the third surface region.

[0070] In a further optional embodiment, the finger device includes a single finger, wherein optionally, the single finger includes a third surface region, two first surface regions, and two second surface regions, and wherein optionally, the second surface regions are disposed on opposite sides of the third surface region. Optionally, steps a) and b) are performed on a first stripped portion of the interconnect busbar using one of the two first surface regions and one of the two second surface regions, and steps a) and b) are repeated for a second stripped portion of the interconnect busbar using the other of the two first surface regions and the other of the two second surface regions.

[0071] Two first surface regions and two second surface regions can be arranged on opposite sides of the third surface region. For example, a single finger or an elongated body of a single finger is mirror-symmetrical along a first direction. In this case, the two first surface regions and the two second surface regions have the same size, shape, and orientation. However, the single finger is not limited to this. For example, if the first contact portion differs from the second contact solution, the individual two third surface regions and / or two first surface regions can differ from each other.

[0072] After completing step a), one of the two second surface regions can face the adjacent portion, while the other of the two second surface regions can face away from the adjacent portion.

[0073] Steps a) and b) are performed on the first stripped portion of the interconnect busbar using the first surface region of the second and second surface regions. Then, steps a) and b) are repeated on the second stripped portion of the interconnect busbar using the other surface region of the second and second surface regions. Due to the relative arrangement of the second and second surface regions, the single finger device does not need to rotate to bend the first and second stripped portions of the interconnect busbar toward each other. Furthermore, the single finger device can be configured to move linearly in the second direction.

[0074] The bending procedure for the first and second stripped portions of the interconnect bus includes positioning a single finger relative to the first contact portion (step a) and bending the first stripped portion of the interconnect bus at the first contact portion using a first surface region in the second and second surface regions (step b). Optionally, using the first surface region, the first bent portion of the interconnect bus is further bent or pressed into the first contact portion. Next, the single finger is repositioned relative to the second contact portion (step a) without changing its orientation or rotating it. For example, the single finger is moved away from the first contact portion along a first direction, linearly moved along a second direction to a position adjacent to the second contact portion, and then lowered to be positioned adjacent to the second contact portion (step a). Next, the second stripped portion of the interconnect bus is bent over the second contact portion using another surface region in the second and second surface regions (step b). Optionally, the second bent portion of the interconnect bus is further bent or pressed into the second contact portion using another surface region in the first surface region.

[0075] Alternatively, the finger device comprises a single finger, which includes a single third surface region, a single first surface region, and a single second surface region. In this case, the bending procedure described above also applies, and the single finger is rotated 180° about the first direction after bending the first stripped portion of the interconnect busbar and before bending the second stripped portion of the interconnect busbar.

[0076] In an alternative embodiment, the actuator device includes a base, wherein the base includes a first actuator configured to move the finger device in a second direction.

[0077] In a further optional embodiment, step b) includes moving the finger device (linearly) relative to the base.

[0078] A single finger, a first finger, and / or a second finger can be movably attached to a base. Therefore, by moving the base, the finger device, particularly the single finger, the first finger, and / or the second finger, can be moved. Specifically, moving the base causes the first and second fingers to move simultaneously, thereby allowing for simultaneous positioning of the first and second fingers. This helps reduce cycle time.

[0079] The first actuator may include a track, bar, and / or rod on which the finger device can move linearly. Thus, the track, bar, and / or rod supports the finger device (selectively both the first and second fingers) and allows linear movement of the finger device relative to a base. The first actuator may also include one or more electric motors and / or one or more pneumatic actuators to move the finger device on the track, bar, and / or rod. The first actuator may also include a transmission mechanism for converting the movement (e.g., rotational movement) of the electric motors into linear movement. The transmission mechanism may include gears, belts, and / or other means for driving the finger device. Selectively, the first actuator is configured to move the first and second fingers simultaneously, particularly toward each other. For example, the first and second fingers move toward each other at the same speed, thereby providing symmetrical movement of the first and second fingers.

[0080] In an optional embodiment, the actuator device includes a second actuator configured to move the base along a first direction.

[0081] In another alternative embodiment, step a) includes moving the base to which the finger device is attached.

[0082] The second actuator may be a means for moving the base in the first direction to position the finger device in the first direction. The second actuator may further include means for positioning the base above the junction box, i.e., means for moving the base along a second direction and / or a third direction perpendicular to the first and second directions. In other words, the second actuator may allow the base to be positioned above the junction box.

[0083] The second actuator may include a robotic arm for moving the base. However, other devices for moving the base known to those skilled in the art are also possible. The second actuator may include one or more electric motors and / or one or more pneumatic actuators for moving the base.

[0084] The second actuator operates during step a) and / or step c), i.e., when the finger device or base is moved in the first direction. The first actuator operates during step b), i.e., when the finger device is moved in the second direction.

[0085] Those skilled in the art will understand that, unless mutually exclusive, the features or parameters described in relation to any of the foregoing aspects can be applied to any other aspect. Furthermore, unless mutually exclusive, any feature or parameter described herein can be applied to any aspect and / or combined with any other feature or parameter described herein. Attached Figure Description

[0086] Embodiments will now be described by way of example only with reference to the accompanying drawings.

[0087] Figures 1a to 6b each show an isometric view (left) and a cross-sectional view (right) of an embodiment of the device at various stages of the bending process.

[0088] Figure 7 A side view of the first finger of the device shown in Figures 1a to 6b is displayed.

[0089] Figure 8 Showing Figure 7 A three-dimensional view of the first finger (upper part) and an enlarged view of the circled area in the upper part (lower part).

[0090] Figure 9 A partial side view of the first finger according to an embodiment is shown.

[0091] Figure 10 shows a partial side view of the first finger according to an embodiment.

[0092] Figure 11 Block diagrams of the bending process shown in Figures 1a to 6b are displayed. Detailed Implementation

[0093] Embodiments and examples of this disclosure will now be discussed with reference to the accompanying drawings. Other embodiments and examples will be apparent to those skilled in the art.

[0094] In the accompanying drawings, the thickness of substrates, parts, assemblies, etc., may be exaggerated for clarity. Furthermore, it should be understood that when a component such as a layer, film, region, or substrate is referred to as being "on top of" another component, it may be directly on top of the other component, or there may be intermediate components present. Conversely, when a component is referred to as being "directly" on top of another component, there are no intermediate components present.

[0095] Figures 1a to 6b show a device 10 for bending the stripped portion 12 of the interconnect busbar 14 of the solar module above the electrical contact portion 16 of the junction box 18 of the solar module. The solar module is not shown in the figures, but it is positioned below the junction box 18 and the interconnect busbar 14. In other words, the junction box 18 and the interconnect busbar 14 define a plane corresponding to the upper surface behind the solar module. The device 10 includes a finger device 20, an actuator device 22, a control device 24, and / or a camera 26.

[0096] Junction box 18 includes one or more electronic components, such as contact portion 16, for providing electrical connection between junction box 18 and interconnect bus 14. Specifically, junction box 18 includes a cavity 28 surrounding contact portion 16. Junction box 18 (optionally cavity 28) can be closed after interconnect bus 14 is attached to portion 16.

[0097] Junction box 18 may include two contact portions 16, each contact portion 16 may include solder pads. The solder pads are pre-soldered. Each contact portion 16 may connect to an individual stripped portion 12 of interconnect bus 14. The stripped portion 12 of interconnect bus 14 protrudes from the solar module from an extension of the non-stripped portion 12 of interconnect bus 14. The stripped portion 12 of interconnect bus 14 protrudes into chamber 28 before being bent over contact portions 16 (see Figures 1a and 1b). The stripped portion 12 of interconnect bus 14 is bent over contact portions 16 to connect interconnect bus 14 to contact portions 16. Interconnect bus 14 may be soldered to contact portions 16 after the bending process (soldering not shown in the figures).

[0098] Interconnecting busbar 14 can be manually or automatically stripped, resulting in the configuration depicted in Figures 1a and 1b. Similarly, junction box 18 can be manually or automatically positioned and / or attached to the solar module location, as depicted in Figures 1a and 1b. Once the initial phase is complete, the bending procedure of the invention is performed. However, various (optional) components of device 10 are described first.

[0099] In Figure 1a to Figure 8 In the illustrated embodiment, the finger device 20 includes a first finger 30 and a second finger 32. For example... Figure 7 and Figure 8 As can be seen more clearly, the first finger 30 and the second finger 32 include an elongated body 34, a first end 36, and a second end 38. The first end 36 and a portion of the elongated body 34 are inserted into the chamber 28. The second end 38 remains outside the chamber 28. Therefore, since the second end 38 does not need to be inserted into the limited space of the chamber 28, it can have a larger structure compared to the elongated body 34. The finger device 20 can be attached to the actuator device 22 at the second end 38. In the embodiment shown in the figure, the first finger 30 and the second finger 32 include a plurality of holes through which bolts or screws can be inserted to attach individual fingers 30, 32 to the actuator device 22. The first finger 30 and the second finger 32 can be made of rigid and / or solid materials, such as metal.

[0100] The finger device 20 (selectively a first finger 30 and a second finger 32) includes a third surface region 40, a first surface region 42, and a second surface region 44 disposed at a first end portion 36. In the embodiment shown in the figures, the third surface region 40, the first surface region 42, and / or the second surface region 44 are flat defining planes.

[0101] The third surface region 40 may define the farthest region of the first end 36. The first surface region 42 is offset from the third surface region 40 away from the first end 36 and toward the second end 38. Optionally, the third surface region 40 and the first surface region 42 are arranged parallel to each other. The second surface region 44 connects this third surface region 40 to the first surface region 42. The second surface region 44 may be arranged perpendicular to the third surface region 40 and / or the first surface region 42. The transition between the individual surface regions may be circular. The second surface region 44 of the first finger 30 faces the second surface region 44 of the second finger 32.

[0102] Actuator device 22 may include a base 46, a first actuator 48, and / or a second actuator 50. Finger device 20 is movably attached to the base 46. Optionally, finger device 20 may be linearly movable on the base 46 along a second direction (see arrow in FIG. 1a). In the embodiment shown in the figure, the first actuator 48 may include a track on which the first finger 30 and the second finger 32 are movably arranged. The first actuator 48 may also include electronic or programmable means for moving the first finger 30 and the second finger 32 along the track in a second direction.

[0103] The second actuator 50 may be configured to move the base 46. The second actuator 50 may include a robotic arm. The second actuator 50 is at least configured to move the finger device 20 along a first direction, which is perpendicular to the second direction and to the plane of the solar module (see arrows in Figures 2a and 2b).

[0104] The control device 24 may include a computer or server and may be located remotely from the actuator device 22 and / or the finger device 20. The control device 24 is electronically and / or electrically connected to the actuator device 22 to control the movement of the finger device 20.

[0105] Camera 26 may be a 3D camera, i.e., a camera capable of obtaining a three-dimensional (3D) representation of the area imaged by camera 26. Camera 26 may be movably supported so that it can be positioned above junction box 18 to image chamber 28 and / or contact portion 16. Camera 26 is electronically or electrically connected to control device 24, which can analyze the digital information provided by camera 26 to determine the position of junction box 18, contact portion 16, and / or finger device 20. Specifically, control device 24 is configured to use camera 26 to position finger device 20 within chamber 28.

[0106] As shown in Figure 10, the method for bending the stripped portion 12 of the interconnect busbar 14 of the solar module over the electrical contact portion 16 of the junction box 18 includes steps a), b), and / or c). Steps a) to c) will be described in conjunction with Figures 1a to 6b).

[0107] Step a) is depicted in Figures 1a to 2b. First, the finger device 20 is positioned above the junction box 18. This may include positioning the base 46 above the junction box 18 using a second actuator 50. A camera 26 can be used to determine the correct position. The camera 26 can also be used to detect the chamber 28, which can cause the finger device 20 to move in a second direction via the first actuator 48, selectively moving the first finger 30 at the second finger 32, such that the finger device 20 is positioned above the chamber 28 (see Figure 1a). In other words, the first finger 30 and the second finger 32 are positioned along the second direction such that they are arranged on one side of the individual contact portion 16. For example, the first finger 30 and the second finger 32 are positioned along the second direction such that they are flush with the inner wall of the junction box 18 (see Figure 2b). This allows the finger device 20 to move along the first direction toward the solar module, selectively moving the first finger 30 at the second finger 32, such that the second surface area 44 is arranged on one side of the contact portion 16.

[0108] Junction box 18 may have a total width A along a second direction (see FIG. 1b) extending from one sidewall of junction box 18 to the opposite sidewall of junction box 18. Distance D defines the width of the gap between contact portion 16 and the sidewall of junction box 18 (where the first finger 30 and the second finger 32 contact the gap during step a). Alternatively, distance D extends between adjacent portion 54 and the sidewall of junction box 18.

[0109] The adjacent portion 54 may include another wall of the junction box 18 extending along a first direction on one side of the contact portion 16. For example, the adjacent portion 54 may be a side surface of a support structure supporting the contact portion 16. Distance D refers to a dimension that limits the size of the finger device 20; the finger device 20 needs to have a width smaller than distance D at the first end 36. Therefore, the size of the junction box 18 and / or the chamber 28 limits the size of the finger device 20.

[0110] Junction box 18 has a height B extending from its bottom surface to its top surface. Height B represents the maximum extension of chamber 28 along a first direction. Distance C represents the length along the first direction from contact portion 16 to the top surface of junction box 18.

[0111] Following the pre-positioning step shown in FIG1a, the finger device 20 is inserted into the chamber 28 along a first direction, as depicted in FIG2a and FIG2b. This can be accomplished by moving the base 46 along the first direction using the second actuator 50 (see arrows in FIG2a and FIG2b). After the insertion or positioning step is completed, the first surface area 42 separates from the contact portion 16 by a distance X in the first direction. The distance X can be a predetermined value. The distance X can be set by monitoring the movement using the camera 26. Optionally or additionally, after the first end 36 of the finger device 20 enters the chamber 28, the finger device 20 moves a distance E along the first direction. In other words, when the first end 36 of the finger device 20 or the third surface area 40 is at a height corresponding to the top surface of the junction box 18, the finger device 20 further moves a distance E along the first direction. The distance E can be the difference between the height B and the predetermined distance X.

[0112] Step a) is followed by bending step b) (see Figures 3a and 3b). The completion of step b) is shown in Figures 4a and 4b. Step b) includes moving the finger device 20 along a second direction. Alternatively, step b) includes moving the first finger 30 toward the second finger 32 and moving the second finger 32 toward the first finger 30, both along the second direction indicated by the arrows in Figures 3a and 3b. During this movement, the height position of the first surface region 42 or the finger device 20 in the first direction does not change. In other words, the height position of the first surface region 42 is the same before and after step b). This can be achieved by maintaining the position of the base 46 and operating only the first actuator 48.

[0113] The movement of the finger device 20 can end when the second surface region 44 presses against the stripped portion 12 of the interconnect busbar 14 and the interconnect busbar 14 presses against the adjacent portion 54. Alternatively, the finger device 20 can move a predetermined distance along the second direction.

[0114] During the movement in step b), the side surface of the finger device 20 presses against the stripped portion 12 of the interconnect bus 14. This causes the stripped portion 12 of the interconnect bus 14 to bend. This bending stops when the lower portion of the stripped portion 12 of the interconnect bus 14 is pressed against the adjacent portion 54. The stripped portion 12 of the interconnect bus 14 bends around or near the edge between the contact portion 16 and the adjacent portion 54. This bending of the stripped portion 12 of the interconnect bus 14 continues until the stripped portion 12 of the interconnect bus 14 is aligned with the first surface region 42. Since the first surface region 42 extends over the contact portion 16, the bent portion of the stripped portion 12 of the interconnect bus 14 extends over the contact portion 16 (see Figures 4a and 4b).

[0115] Selectively, the first finger 30 and the second finger 32 move simultaneously, causing the two stripped portions 12 of the interconnect bus 14 to bend simultaneously onto the individual contact portions 16. The distance X can be selected such that the bent portions of the stripped portions 12 of the interconnect bus 14 contact the contact portions 16 or separate along a first direction (see FIG. 4b).

[0116] Optional step c) follows step b) and is depicted in Figures 5a and 5b. The finger device 20 moves along a first direction, for example, a distance X. This ensures that the bent portion of the stripped portion 12 of the interconnect bus 14 is pressed into the contact portion 16. However, the finger device 20 may also move less than a distance X in the first direction and toward the contact portion 16. This increases the likelihood that the bent portion of the stripped portion 12 of the interconnect bus 14 will not spring back from the contact portion 16 once the finger device 20 is removed.

[0117] Step c) may include moving the first finger 30 and the second finger 32 by moving the base 46 along the first direction. Therefore, the first finger 30 and the second finger 32 move simultaneously.

[0118] Figure 6a shows the removal of the finger device 20 from the chamber 28 by moving the finger device 20 along a first direction as indicated by the arrow. This can be accomplished by moving the base 46 along the first direction. As a result, the stripped portion 12 of the interconnect bus 14 is bent onto and contacts the contact portion 16. This is depicted in Figure 6b. In an optional step, the bent stripped portion 12 of the interconnect bus 14 is soldered to the individual contact portions 16.

[0119] In such Figure 9 In another depicted embodiment, the finger device 20 includes a single finger 52 comprising a third surface region 40, two first surface regions 42, and two second surface regions 44. The method for bending the stripped portion 12 of the interconnect busbar 14 over the electrical contact portion 16 of the junction box 18 is similar to the method described above, except that steps a) to c) are repeated for the first stripped portion 12 of the interconnect busbar 14. Next, the single finger 52 is repositioned relative to the other contact portion 16 by moving the single finger 52 along a second direction. Then, step b) is repeated, however, the other of the first surface regions 42 and the second surface regions 44 bends the first and second stripped portions 12 of the interconnect busbar 14.

[0120] In another embodiment depicted in FIG10, the first finger 30 and the second finger 32 include only a first surface region 42 and a second surface region 44. A third surface region 40 is absent. This is because the first end portion 36 is a sharp edge between the second surface region 44 and the side surfaces of the first finger 30 and the second finger 32. Furthermore, the first surface region 42 and the second surface region 44 form a continuous curve, such as a quarter-pipe. The first surface region 42 can be considered as a portion of the quarter-pipe extending substantially perpendicular to the first direction. The second surface region 44 can be considered as a portion of the quarter-pipe extending substantially parallel to the first direction.

[0121] It should be understood that the present invention is not limited to the embodiments described above, and various modifications and improvements can be made without departing from the concepts described herein. Unless mutually exclusive, any feature may be used alone or in combination with any other feature, and this disclosure extends to and includes all combinations and sub-combinations of the one or more features described herein.

[0122] Symbol Explanation 10: Equipment 12: Peeled-off portion 14: Interconnect busbar 16: Contact Point 18: Junction Box 20: Finger device 22: Actuator device 24: Control device 26: Camera 28: Chamber 30: First finger part 32: Second finger 34: Slender body 36: First end 38: Second end 40: Third surface region 42: First surface region 44: Second surface region 46: Base 48: First Actuator 50: Second actuator 52: Single finger 54: Adjacent parts

Claims

1. A device for bending a stripped portion of an interconnecting busbar of a solar module to an electrical contact portion of the junction box of the solar module, comprising: A finger device having a first end and a second end. An actuator device, attached to the finger device at the second end, is configured to move the finger device in a first direction and in a second direction perpendicular to the first direction. A control device configured to control the actuator device. The first end portion includes a first surface region and a second surface region, the first surface region being offset from the first end portion in a first direction from the first end portion toward the second end portion, and the second surface region connecting the first surface region to the first end portion. The control device is configured to control the actuator device to move the finger device along the first direction and then move the finger device along the second direction to bend the stripped interconnect busbar onto the electrical contact portion.

2. The device of claim 1, wherein the control device is further configured to control the actuator device to move the finger device along the first direction such that the first surface region bends the curved interconnect bus toward the electrical contact portion, optionally including pressing the curved interconnect bus into the electrical contact portion.

3. The device of claim 1 or 2, wherein the first end portion includes a third surface region disposed at the first end portion.

4. The device as claimed in any of the preceding claims, wherein the finger device includes a first finger and a second finger, wherein the first finger and the second finger each include a separate first surface region and a separate second surface region, and wherein the second surface region of the first finger faces the second surface region of the second finger.

5. The device as claimed in any one of claims 1 to 3, wherein the finger device comprises a single finger, wherein the single finger comprises two first surface regions and two second surface regions, and wherein the second surface regions are disposed on opposite side finger devices.

6. The device as claimed in any of the preceding claims, wherein the actuator means includes a base, wherein the base includes a first actuator configured to move the finger means in the second direction.

7. The device of claim 6, wherein the actuator means includes a second actuator configured to move the base along the first direction.

8. The device as claimed in any of the preceding claims further includes a camera, optionally including a 3D camera, wherein the control device is configured to use the camera to position the finger device.

9. A method for bending a stripped portion of an interconnecting busbar of a solar module to an electrical contact portion of the junction box of the solar module, comprising the following steps: a) Positioning a first end of the finger device within the cavity of the junction box, the first end including a first surface region and a second surface region, the first surface region being offset from the first end in a first direction away from the first end, and the second surface region connecting the first surface region to the first end. b) Move the finger device along a second direction perpendicular to the first direction and parallel to the extension direction of the interconnect busbar, bending the stripped portion of the interconnect busbar onto the electrical contact portion.

10. The method of claim 9, wherein step b) comprises moving the finger device along the second direction until the stripped portion of the interconnecting busbar has a profile that substantially matches the profile of the first surface region and / or the second surface region.

11. The method of claim 9 or 10, wherein the first end portion includes a third surface region disposed at the first end portion.

12. The method of any one of claims 9 to 11, further comprising step c) bending the bent interconnect bus toward the electrical contact portion by moving the finger device along the first direction, wherein optionally, step c) further comprises pressing the bent interconnect bus into the electrical contact portion.

13. The method of any one of claims 9 to 11, wherein step a) comprises positioning the first surface region at a first height position in the first direction, the first height position being greater than a second height position in the first direction where the upper surface of the contact portion is located, wherein the difference between the first height position and the second height position is a predetermined value.

14. The method of any one of claims 9 to 13, wherein step a) comprises positioning the first surface region as a plane parallel to the solar module.

15. The method of any one of claims 9 to 14, wherein step a) comprises using a camera, selectively using a 3D camera, to image the junction box and to position the finger device based on the image captured by the camera.

16. The method of any one of claims 9 to 15, wherein step a) comprises moving the base to which the finger device is attached.

17. The method of claim 16, wherein step b) includes moving the finger device relative to the base.

18. The method of any one of claims 9 to 16, wherein The finger device includes a first finger and a second finger. The first finger and the second finger each include a first surface region and a second surface region, the second surface region of the first finger facing the second surface region of the second finger, and Step b) includes moving the first finger and the second finger toward each other to bend the two stripped portions of the interconnect busbar onto the individual contact portions.

19. The method of any one of claims 9 to 18, wherein The finger device includes a single finger. The single finger includes the two first surface regions and the two second surface regions, wherein the second surface regions are disposed on opposite sides of the finger device. Steps a) and b) are performed on the first stripped portion of the interconnect busbar using one of the two first surface regions and one of the two second surface regions, and steps a) and b) are repeated on the second stripped portion of the interconnect busbar using the other of the two first surface regions and the other of the two second surface regions.

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