Network transceiver mainboard heat dissipation structure
The combination of air pump-driven heat exchange pipes and dustproof components solves the problems of uneven heat dissipation and dust ingress on the network transceiver motherboard, achieving uniform heat dissipation and dustproof effect, making it suitable for dusty and humid environments.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- CHENGDU TIANCHUANG MICROWAVE CO LTD
- Filing Date
- 2026-06-01
- Publication Date
- 2026-07-14
AI Technical Summary
Existing network transceiver motherboard heat dissipation structures suffer from uneven heat dissipation, easy dust ingress, and component corrosion and aging, which are particularly evident in industrial and outdoor humid and dusty conditions.
It adopts a combination structure of air pump, heat exchange pipe, dustproof component and heat dissipation fin. The air pump delivers air, the heat exchange pipe disperses heat dissipation, and the dustproof component filters dust to ensure uniform heat dissipation and airtightness.
It achieves uniform heat dissipation of the network transceiver motherboard, prevents dust from entering, extends the life of components, and is suitable for dusty and humid environments.
Smart Images

Figure CN122395916A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of network transceiver technology, and more specifically, to a heat dissipation structure for a network transceiver motherboard. Background Technology
[0002] The network transceiver motherboard is the core circuit board of fiber optic transceivers and optical modules. It is responsible for the conversion between optical and electrical signals and physical layer data processing, enabling long-distance transmission and connection between twisted-pair cables and optical fibers.
[0003] The heat dissipation structure for a network transceiver motherboard disclosed in Chinese Utility Model Patent Application Publication No. CN211506402U utilizes the excellent thermal conductivity of metal materials to conduct some of the heat generated by the network transceiver motherboard to the air for heat dissipation. However, this utility model is limited to centralized heat dissipation in the middle, resulting in poor overall airflow heat exchange. The airflow cannot be evenly diffused to the entire area of the motherboard, leading to inadequate heat dissipation in some areas and severe local heat accumulation. Furthermore, the use of ventilation windows and holes in the shell for direct airflow between the inside and outside for heat dissipation is not suitable for environments with high dust levels. The entire unit is not airtight, and dust and moisture can easily enter the transceiver, causing dust accumulation on the motherboard and corrosion and aging of components. This makes it unsuitable for industrial or outdoor humid and dusty conditions. Summary of the Invention
[0004] In view of the above situation and to overcome the defects of the prior art, the present invention provides a heat dissipation structure for a network transceiver motherboard, which aims to solve the problems in the background art.
[0005] To achieve the above objectives, this application provides the following technical solution: a network transceiver motherboard heat dissipation structure, including a base, the upper part of which is connected to an upper housing, the motherboard being disposed on the upper part of the base, an air pump being disposed on the lower part of the upper housing, a first air exchange port being disposed on one side of the air pump, and a heat exchange pipe being disposed on the other side, the heat exchange pipe being disposed on the lower part of the upper housing and fixed by several brackets disposed on the lower part of the upper housing, the outer end of the heat exchange pipe extending upward and penetrating the upper housing, a dustproof component being disposed on the upper part of the upper housing, the lower part of the dustproof component corresponding to the outer end of the heat exchange pipe.
[0006] The present invention is further configured such that a fixing plate is slidably connected in the fixing groove opened in the side plate of the base, one side of the fixing plate is connected to the temperature conducting plate by a third fixing bolt, and heat dissipation fins are fixedly connected to the outer side of the temperature conducting plate. The heat dissipation fins are inserted into the heat dissipation holes opened in the fixing plate and extend out of the base.
[0007] The present invention is further configured such that a locking block is fixedly connected to one side of the fixing groove, a locking groove is opened on one side of the fixing plate, a locking block is slidably connected inside the locking groove, and the lower part of the upper housing abuts against the fixing plate.
[0008] The present invention is further configured such that the interior of the fixing groove is provided with a linear array of through-type heat dissipation holes, the heat dissipation holes correspond to the positions of the linear array of heat dissipation fins, and the heat dissipation fins extend out of the base through the heat dissipation holes.
[0009] The present invention is further configured such that the heat exchange pipe includes a fixed pipe, a connecting pipe, and a heat dissipation pipe, one end of the air pump is connected to the fixed pipe via a quick connector, one side of the fixed pipe is connected to the connecting pipe via a swivel head, one side of the connecting pipe is fixedly connected to the heat dissipation pipe, and the end of the heat dissipation pipe is provided with a second air exchange port.
[0010] The present invention is further configured such that the fixed tube is located at the center inside the upper shell, the connecting tubes are arranged on both sides of the fixed tube and are distributed in a linear array, the ends of the connecting tubes are T-shaped tee tubes and are respectively connected to the L-shaped heat dissipation tubes on both sides, the second ventilation port extends upward out of the upper shell and corresponds to the dustproof component, and the heat dissipation tube and the fixed tube are pure copper metal tubes.
[0011] The present invention is further configured such that an installation tube is provided in the middle of the connecting tube, a support frame is fixedly connected inside the installation tube, one side of the support frame is connected to the fan blade through a connecting shaft, and the fan blade corresponds to the center position of the connecting tube.
[0012] The invention is further configured such that the dustproof component includes a limiting frame, a filter screen, a pressure plate, and a second fixing bolt. The upper part of the upper housing is fixedly connected to the limiting frame, the inside of the limiting frame is provided with a filter screen, the lower part of the filter screen is fitted to the upper housing, pressure plates are provided on both sides of the limiting frame, one side of the pressure plate is threadedly connected to the second fixing bolt, the lower part of the second fixing bolt is threadedly connected to the limiting frame, and the lower part of the pressure plate abuts against the filter screen.
[0013] The present invention is further configured such that the lower part of the upper housing is fitted over the side plate of the base, one side of the upper housing is connected to the side plate of the base by a first fixing bolt, and there is a gap between the interior of the upper housing and the upper part of the main board.
[0014] Compared with the prior art, the beneficial effects of the present invention are: 1. By setting up an air pump, a first air exchange port, and a second air exchange port, air is supplied to the inside of the heat exchange pipe to dissipate heat from the motherboard inside the network transceiver. By setting up a fixed pipe, a connecting pipe, and a heat exchange pipe, the air is distributed and supplied to cool the inside of the network transceiver. By setting up a quick connector, the heat exchange pipe can be separated from the air pump. With the help of a pipe rotating head, the second air exchange port at the end of the heat dissipation pipe can be rotated to adjust the direction, switching the heat exchange through the pipe to direct air blowing for cooling. 2. By setting up the fixing slot, the card slot and the card block, the fixing plate is limited inside the base. With the connection between the housing and the base, the fixing plate is fixed on the base. The fixing plate makes it easy to connect with the temperature guide plate and install the temperature guide plate later. By setting up the temperature guide plate and heat dissipation fins, together with the heat exchange pipe, the internal of the network transceiver is sealed and cooled. The fixing plate and heat dissipation holes make it easy for the heat dissipation fins to extend and dissipate heat. They can also be used alone. When the heat exchange pipe is switched to air blowing cooling, they can be used for air output. Attached Figure Description
[0015] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a three-dimensional structural schematic diagram of the overall exploded view of the present invention; Figure 3 This is a three-dimensional structural schematic diagram of the temperature-conducting plate and the fixing plate of the present invention, viewed from top cross-section. Figure 4 For the present invention Figure 3 A magnified three-dimensional structural diagram of a portion at point A in the middle; Figure 5 This is a three-dimensional structural schematic diagram of the heat exchange pipe of the present invention, viewed from top view. Figure 6 For the present invention Figure 5 A magnified three-dimensional structural diagram of part B in the middle; Figure 7 This is a three-dimensional structural diagram of the overall left-side cross-section of the invention and the explosion of the dustproof component; Figure 8 This is a three-dimensional structural diagram of the heat exchange pipeline of the present invention; Figure 9 This is a three-dimensional structural schematic diagram of the overall front cross-section of the present invention; Figure 10 This is a three-dimensional structural diagram of the mounting pipe and fan blade of the present invention.
[0016] In the diagram: 1. Base; 2. Upper shell; 3. Air pump; 4. First fixing bolt; 5. Fixing plate; 6. Heat dissipation fins; 7. Fixing groove; 8. Filter screen; 9. Limiting frame; 10. Pressure plate; 11. Second fixing bolt; 12. Second air exchange port; 13. Slot; 14. Temperature guiding plate; 15. Connecting pipe; 16. Main board; 17. Locking block; 18. Heat dissipation hole; 19. Third fixing bolt; 20. Heat dissipation pipe; 21. Fixing pipe; 22. First air exchange port; 23. Support frame; 24. Mounting pipe; 25. Fan blade; 26. Quick connector; 27. Tube head. Detailed Implementation
[0017] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.
[0018] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.
[0019] In this invention, unless otherwise stated, the directional terms such as "up" and "down" generally refer to the directions shown in the accompanying drawings, or to the vertical, perpendicular, or gravitational direction; similarly, for ease of understanding and description, "left" and "right" generally refer to the left and right shown in the accompanying drawings; "inner" and "outer" refer to the inner and outer contours of each component itself, but the above directional terms are not intended to limit this invention.
[0020] Please see Figure 1 , Figures 5-10 The system includes a base 1, the upper part of which is connected to the upper housing 2. A main board 16 is provided on the upper part of the base 1. An air pump 3 is provided on the lower part of the upper housing 2. A first air exchange port 22 is provided on one side of the air pump 3, and a heat exchange pipe is provided on the other side. The heat exchange pipe is located on the lower part of the upper housing 2 and is fixed by several brackets provided on the lower part of the upper housing 2. The outer end of the heat exchange pipe extends upward and penetrates the upper housing 2. A dustproof component is provided on the upper part of the upper housing 2, and the lower part of the dustproof component corresponds to the outer end of the heat exchange pipe.
[0021] Specifically, the lower part of the upper shell 2 is fixedly connected to the outer shell of the air pump 3, and the heat dissipation end of the air pump 3 is located at the upper part of the upper shell 2 for easy heat dissipation. A first air exchange port 22 is provided on one side of the air pump 3, which extends through one side of the upper shell 2 for air exchange. A heat exchange pipe is provided on the other side, which is located between the upper shell 2 and the base 1. Several brackets (snap-fit brackets are known technology and are not shown in the figure) are provided at the lower part of the upper shell 2. The brackets are quick-release snap-fit brackets, which fix the heat exchange pipe to the upper shell 2 and facilitate disassembly and assembly. The outer end of the heat exchange pipe extends upward and is inserted into the interior of the upper shell 2, and passes through it for air exchange at the other end of the heat exchange pipe. A dustproof component is provided at the upper part of the upper shell 2, and the lower part of the dustproof component corresponds to the outer end of the heat exchange pipe. When the outer end of the heat exchange pipe draws in air, it filters the dust in the air to prevent it from entering the heat exchange pipe and the interior of the air pump 3 and affecting them.
[0022] Please see Figures 1-5A fixing plate 5 is slidably connected in the fixing groove 7 opened in the side plate of the base 1. One side of the fixing plate 5 is connected to the temperature conducting plate 14 by the third fixing bolt 19. A heat dissipation fin 6 is fixedly connected to the outside of the temperature conducting plate 14. The heat dissipation fin 6 is inserted into the heat dissipation hole 18 opened in the fixing plate 5 and extends out of the base 1.
[0023] Specifically, the side plate of the base 1 has a fixing groove 7, and a fixing plate 5 is slidably connected inside the fixing groove 7. One side of the fixing plate 5 is connected to the third fixing bolt 19, and the third fixing bolt 19 is connected to the temperature conducting plate 14, fixing the temperature conducting plate 14 to the inner side of the fixing plate 5. A heat dissipation fin 6 is fixedly connected to the outer side of the temperature conducting plate 14. The fixing plate 5 has a long strip-shaped heat dissipation hole 18. The heat dissipation fin 6 is inserted into the heat dissipation hole 18 and extends until it extends out of the base 1. The outer side of the heat dissipation fin 6 is in contact with the outside.
[0024] Please see Figures 2-4 A locking block 17 is fixedly connected to one side of the fixing groove 7, and a locking groove 13 is opened on one side of the fixing plate 5. The locking block 17 is slidably connected inside the locking groove 13, and the lower part of the upper shell 2 abuts against the fixing plate 5.
[0025] Specifically, a locking block 17 is fixedly connected to one side of the fixing groove 7, and a locking groove 13 is opened on one side of the fixing plate 5. The locking grooves 13 on both sides of the fixing plate 5 slide into the outer side of the locking block 17 to limit and fix the fixing plate 5 and the fixing groove 7. After the upper shell 2 is connected to the base 1, the lower part of the upper shell 2 abuts against the upper part of the fixing plate 5, and fixes the fixing plate 5 in conjunction with the fixing groove 7.
[0026] Please see Figures 2-5 The fixed groove 7 has through-holes 18 arranged in a linear array inside. The heat dissipation holes 18 correspond to the positions of the heat dissipation fins 6 arranged in a linear array, and the heat dissipation fins 6 extend out of the base 1 through the heat dissipation holes 18.
[0027] Specifically, the inside of the fixing slot 7 is provided with through-hole heat dissipation holes 18, and the heat dissipation holes 18 are distributed in a linear array. The heat dissipation fins 6 are also distributed in a linear array, and their positions correspond to the positions of the heat dissipation holes 18. The heat dissipation fins 6 are inserted into the heat dissipation holes 18 and extend out of the housing of the network transceiver to contact the outside.
[0028] Please see Figures 1-8 The heat exchange pipe includes a fixed pipe 21, a connecting pipe 15, and a heat dissipation pipe 20. One end of the air pump 3 is connected to the fixed pipe 21 via a quick connector 26. One side of the fixed pipe 21 is connected to the connecting pipe 15 via a pipe adapter 27. The heat dissipation pipe 20 is fixedly connected to one side of the connecting pipe 15. A second air exchange port 12 is provided at the end of the heat dissipation pipe 20.
[0029] Specifically, one side of the air pump 3 is connected to the end of the fixed pipe 21 via a quick connector 26, allowing the fixed pipe 21 and the air pump 3 to be quickly disassembled. A rotating head 27 is provided on one side of the fixed pipe 21, and one side of the rotating head 27 is connected to the connecting pipe 15. The rotating head 27 drives the connecting pipe 15 to rotate. One side of the connecting pipe 15 is connected to the heat dissipation pipe 20. A second ventilation port 12 is provided at the end of the heat dissipation pipe 20. The rotating head 27 drives the heat dissipation pipe 20 to rotate, allowing the second ventilation port 12 to be adjusted in angle and can be set downwards.
[0030] Please see Figures 5-9 The fixed tube 21 is located in the center of the upper shell 2. The connecting tubes 15 are arranged on both sides of the fixed tube 21 and are distributed in a linear array. The ends of the connecting tubes 15 are T-shaped three-way tubes and are connected to the L-shaped heat dissipation tubes 20 on both sides respectively. The second ventilation port 12 extends upward out of the upper shell 2 and corresponds to the dustproof component. The heat dissipation tube 20 and the fixed tube 21 are pure copper metal tubes.
[0031] Specifically, the fixed tube 21 is located at the center inside the upper housing 2, and the connecting tubes 15 are located on both sides of the fixed tube 21 and are arranged in a linear array. The connecting tubes 15 and the fixed tube 21 are connected to each other to transfer air. The end of the connecting tube 15 is a T-shaped three-way tube. One end is connected to the rotating head 27 of the fixed tube 21, and the other two ends are connected to two heat dissipation tubes 20 respectively. The heat dissipation tubes 20 are L-shaped. The second ventilation port 12 extends upward out of the upper housing 2 and corresponds to the dustproof component set on the upper part of the upper housing 2. The dustproof component filters the air entering the second ventilation port 12 and blocks dust. The heat dissipation tubes 20 and the fixed tubes 21 are both pure copper metal tubes, which can transfer the heat inside the network transceiver to the interior of the heat dissipation tubes 20 and the fixed tubes 21 for heat exchange.
[0032] Please see Figures 8-10 A mounting pipe 24 is provided in the middle of the connecting pipe 15. A support frame 23 is fixedly connected inside the mounting pipe 24. One side of the support frame 23 is connected to the fan blade 25 through a connecting shaft. The fan blade 25 corresponds to the center position of the connecting pipe 15.
[0033] Specifically, a mounting pipe 24 is provided in the middle of the connecting pipe 15, a support frame 23 is provided inside the mounting pipe 24, a connecting shaft is provided in the middle of the support frame 23, and the connecting shaft is connected to the fan blade 25, so that the fan blade 25 rotates around the connecting shaft. The fan blade 25 is located inside the mounting pipe 24 and corresponds to the center position of the connecting pipe 15, so that the air transported in the connecting pipe 15 drives the fan blade 25 to rotate, increasing the air flow speed.
[0034] Please see Figures 1-2 , Figure 7The dustproof component includes a limiting frame 9, a filter screen 8, a pressure plate 10, and a second fixing bolt 11. The upper part of the upper housing 2 is fixedly connected to the limiting frame 9. The filter screen 8 is provided inside the limiting frame 9. The lower part of the filter screen 8 fits against the upper housing 2. Pressure plates 10 are provided on both sides of the limiting frame 9. The second fixing bolt 11 is threadedly connected to one side of the pressure plate 10. The lower part of the second fixing bolt 11 is connected to the limiting frame 9 by threads. The lower part of the pressure plate 10 abuts against the filter screen 8.
[0035] Specifically, a limiting frame 9 is fixedly connected to the upper part of the upper housing 2. A filter screen 8 is placed inside the limiting frame 9. The lower part of the filter screen 8 fits against the upper housing 2 and corresponds to the upper part of the second air exchange port 12, thereby filtering the incoming air. Pressure plates 10 are provided on both sides of the limiting frame 9. A second fixing bolt 11 is threaded to one side of the pressure plate 10. The lower part of the second fixing bolt 11 is connected to the limiting frame 9, connecting the pressure plate 10 and the limiting frame 9. A groove is provided on the upper part of the limiting frame 9. The pressure plate 10 is embedded in the groove for limiting. The lower part of the pressure plate 10 abuts against the filter screen 8, restricting the filter screen 8 inside the limiting frame 9, thereby achieving a stable filtration effect.
[0036] Please see Figures 1-2 The lower part of the upper housing 2 is fitted onto the outside of the side plate of the base 1. One side of the upper housing 2 is connected to the side plate of the base 1 by the first fixing bolt 4. There is a gap between the inside of the upper housing 2 and the upper part of the main board 16.
[0037] Specifically, the lower part of the upper shell 2 is fitted onto the outside of the side plate of the base 1. A first fixing bolt 4 is threadedly connected to one side of the upper shell 2, and one end of the first fixing bolt 4 is threadedly connected to the side plate of the base 1, thus fixing the upper shell 2 and the base 1 together. There is a gap between the inside of the upper shell 2 and the upper part of the main board 16, which facilitates the installation and use of the heat exchange pipes.
[0038] Working principle: During use, the heat dissipation structure is adjusted according to the site environment. In some dust-free environments, heat dissipation is performed on the motherboard 16. First, rotate the tube head 27 to flip the heat dissipation tube 20, and set the second air vent 12 at the end of the heat dissipation tube 20 downward, corresponding to the inside of the network transceiver. Then, connect the end of the fixing tube 21 to one end of the air pump 3 through the quick connector 26. Several clip brackets (not shown in the figure) are provided on the upper part of the upper housing 2 to fix the heat exchange pipe on the upper housing 2. Next, align the slot 13 on one side of the fixing plate 5 with the clip 17 and slide it in to limit the fixing plate 5 inside the fixing slot 7 opened on the side plate of the base 1. After limiting the fixing plate 5, put the upper housing 2 on the side plate of the base 1 to connect the upper housing 2 and the base 1. Connect one side of the upper housing 2 to the side plate of the base 1 through the first fixing bolt 4 to complete the installation of the network transceiver shell. The motherboard 16 is fixed inside the base 1 by bolts, and the different components of the motherboard 16 are connected to different connectors on the upper housing 2 through wires, thereby connecting to external wires.
[0039] At this time, the air pump 3 is activated, causing the first air exchange port 22 to draw in air, which is then transported to the interior of the fixed tube 21. Through the connecting pipes 15 on both sides, the air is distributed to the heat dissipation pipes 20 on both sides. The ends of the connecting pipes 15 are T-shaped tee pipes, each connected to one of the two L-shaped heat dissipation pipes 20. Finally, the air is discharged into the interior of the network transceiver through the second air exchange port 12 at the end of the heat dissipation pipe 20, blowing air onto the motherboard 16. The second air exchange ports 12 of the multiple heat dissipation pipes 20 disperse the air, increasing the uniformity of heat dissipation. The discharged air is then discharged through the heat dissipation holes 18 on the fixed plate 5 and the through holes in the upper housing 2, carrying away the heat inside the network transceiver, thus achieving uniform airflow cooling. The first air exchange port 22 can be connected to an air pipe, allowing the end of the air pipe to be placed in a dust-free environment, thus enabling the network transceiver to be used in a dust-free environment. When the motherboard 16 is in a dusty environment, to dissipate heat, firstly, rotate the heat pipe 20 so that the second vent 12 at the end of the heat pipe 20 is facing upwards and aligns with the through hole in the upper housing 2. Then, connect the fixing pipe 21 to one end of the air pump 3 via the quick connector 26. Several clip brackets (not shown in the figure) are provided on the upper part of the upper housing 2 to fix the heat exchange pipe. At this time, the second vent 12 is inserted into the through hole to complete the installation. Next, insert the heat dissipation fins 6 on one side of the temperature conducting plate 14 into the heat dissipation holes 18 in the fixing plate 5, with the heat dissipation fins 6 extending out of the fixing plate 5. The temperature conducting plate 14 and the fixing plate 5 are fitted together. The temperature conducting plate 14 and the fixing plate 5 are connected and fixed by the third fixing bolt 19. Then, the fixing plate 5 is installed on the upper part of the base 1 and fixed. Then place the filter screen 8 inside the limiting frame 9, and then connect the pressure plate 10 to the limiting frame 9 through the second fixing bolt 11. The pressure plate 10 presses down on the lower filter screen 8, and the filter screen 8 corresponds to the upper part of the second air exchange port 12.
[0040] At this time, the air pump 3 is started and rotated in reverse, causing the second air exchange port 12 to draw in air. The filter screen 8 filters and blocks dust from entering the heat exchange pipes and air pump 3, preventing dust from causing any impact. The drawn-in air enters the interior of the heat dissipation pipe 20, which is a pure copper metal pipe. The incoming air interacts with the heat inside the transceiver, and the exchanged air is then collected inside the fixed pipe 21 through the connecting pipe 15, and then discharged through the first air exchange port 22. The first air exchange port 22 can be connected to an air pipe to discharge the heat-carrying air over a longer distance, reducing the impact of ambient temperature, or recovering the heat for reuse. During heat exchange, the heat dissipation fins 6 and the temperature-conducting plate 14 cooperate to block the heat dissipation holes 18, keeping the interior of the transceiver sealed. The temperature-conducting plate 14 transfers the temperature inside the transceiver to the heat dissipation fins 6, which then discharge the heat to the outside, thus maintaining a seal and assisting in heat dissipation.
[0041] When the above two heat dissipation structures are in use, the middle of the connecting pipe 15 is connected to the mounting pipe 24, and the fan blade 25 is installed inside the mounting pipe 24 with the help of the support frame 23; when the air flows in the pipe, it impacts the fan blade 25 and makes it rotate, thereby increasing the air flow rate.
[0042] Of all the solutions mentioned above, those involving the connection between two components can be selected according to the actual situation, such as welding, bolt and nut connection, bolt or screw connection, or other known connection methods, which will not be elaborated here. For all the fixed connections mentioned above, welding is preferred. Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A heat dissipation structure for a network transceiver motherboard, comprising a base (1), the upper part of which is connected to an upper housing (2), and a motherboard (16) disposed on the upper part of the base (1), characterized in that: An air pump (3) is provided at the lower part of the upper shell (2). A first air exchange port (22) is provided on one side of the air pump (3), and a heat exchange pipe is provided on the other side. The heat exchange pipe is located at the lower part of the upper shell (2) and is fixed by several supports provided at the lower part of the upper shell (2). The outer end of the heat exchange pipe extends upward and penetrates the upper shell (2). A dustproof component is provided at the upper part of the upper shell (2), and the lower part of the dustproof component corresponds to the outer end of the heat exchange pipe.
2. The network transceiver motherboard heat dissipation structure according to claim 1, characterized in that: A fixing plate (5) is slidably connected in the fixing groove (7) opened in the side plate of the base (1). One side of the fixing plate (5) is connected to the temperature-conducting plate (14) by a third fixing bolt (19). A heat dissipation fin (6) is fixedly connected to the outside of the temperature-conducting plate (14). The heat dissipation fin (6) is inserted into the heat dissipation hole (18) opened in the fixing plate (5) and extends out of the base (1).
3. The network transceiver motherboard heat dissipation structure according to claim 2, characterized in that: A locking block (17) is fixedly connected to one side of the fixing groove (7), and a locking groove (13) is opened on one side of the fixing plate (5). The locking block (17) is slidably connected inside the locking groove (13), and the lower part of the upper shell (2) abuts against the fixing plate (5).
4. The network transceiver motherboard heat dissipation structure according to claim 2, characterized in that: The fixed groove (7) has through-holes (18) arranged in a linear array inside. The heat dissipation holes (18) correspond to the positions of the heat dissipation fins (6) arranged in a linear array, and the heat dissipation fins (6) extend out of the base (1) through the heat dissipation holes (18).
5. The network transceiver motherboard heat dissipation structure according to claim 2, characterized in that: The heat exchange pipe includes a fixed pipe (21), a connecting pipe (15), and a heat dissipation pipe (20). One end of the air pump (3) is connected to the fixed pipe (21) via a quick connector (26). One side of the fixed pipe (21) is connected to the connecting pipe (15) via a swivel head (27). One side of the connecting pipe (15) is fixedly connected to the heat dissipation pipe (20). The end of the heat dissipation pipe (20) is provided with a second air exchange port (12).
6. The network transceiver motherboard heat dissipation structure according to claim 5, characterized in that: The fixed tube (21) is located in the center of the upper shell (2). The connecting tube (15) is arranged on both sides of the fixed tube (21) and is distributed in a linear array. The end of the connecting tube (15) is a T-shaped three-way tube and the end is connected to the L-shaped heat dissipation tube (20) on both sides. The second air vent (12) extends upward out of the upper shell (2) and corresponds to the dustproof component. The heat dissipation tube (20) and the fixed tube (21) are pure copper metal tubes.
7. The network transceiver motherboard heat dissipation structure according to claim 6, characterized in that: An installation tube (24) is provided in the middle of the connecting tube (15). A support frame (23) is fixedly connected inside the installation tube (24). One side of the support frame (23) is connected to the fan blade (25) through a connecting shaft. The fan blade (25) corresponds to the center position of the connecting tube (15).
8. The network transceiver motherboard heat dissipation structure according to claim 1, characterized in that: The dustproof assembly includes a limiting frame (9), a filter screen (8), a pressure plate (10), and a second fixing bolt (11). The upper part of the upper housing (2) is fixedly connected to the limiting frame (9). The filter screen (8) is provided inside the limiting frame (9). The lower part of the filter screen (8) is attached to the upper housing (2). Pressure plates (10) are provided on both sides of the limiting frame (9). The second fixing bolt (11) is threadedly connected to one side of the pressure plate (10). The lower part of the second fixing bolt (11) is connected to the limiting frame (9) by threads. The lower part of the pressure plate (10) abuts against the filter screen (8).
9. The network transceiver motherboard heat dissipation structure according to claim 1, characterized in that: The lower part of the upper housing (2) is fitted outside the side plate of the base (1). One side of the upper housing (2) is connected to the side plate of the base (1) by the first fixing bolt (4). There is a gap between the interior of the upper housing (2) and the upper part of the main board (16).