一种电路板加工用磨板装置
The grinding device with automatic clamping and double-sided synchronous grinding brush has solved the problems of cumbersome manual operation and low efficiency in the circuit board grinding process, realizing efficient and stable processing of circuit boards and improving production efficiency and product quality.
CN122401249APending Publication Date: 2026-07-17JIAN JINSHUN ELECTRONIC TECHNOLOGY CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- JIAN JINSHUN ELECTRONIC TECHNOLOGY CO LTD
- Filing Date
- 2026-06-16
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
The existing circuit board grinding process relies on manual operation, which results in cumbersome procedures, low efficiency, unstable quality, and is prone to uneven grinding and damage from bumps and knocks.
Method used
The grinding plate device, which adopts automatic clamping, double-sided synchronous grinding brush, step-type conveying and reciprocating lifting structure, realizes the self-adaptive positioning of circuit boards and double-sided continuous grinding, simplifies the operation process and improves production efficiency and quality.
Benefits of technology
It significantly shortens the processing cycle, improves the quality of grinding plates and product yield, reduces the intensity of manual labor, and meets the needs of mass production and high efficiency.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN122401249A_ABST
Abstract
本发明公开了一种电路板加工用磨板装置，涉及电路板加工设备技术领域，包括主体和电路板，所述主体内部两侧固定有固定架，且两组固定架内侧皆弹性连接有弹性夹紧架。本发明通过集成自动夹紧、双面同步的磨刷、步进式自动输送及往复升降打磨结构，有效解决了传统人工磨板操作繁琐、效率低、质量不稳定等问题；装置采用弹性夹紧与居中导向机构，可自适应不同厚度电路板的自动定位与夹紧，上料后无需人工手持、翻面及二次定位，大幅简化操作流程；双磨刷同步旋转作业，配合丝杆驱动往复升降，实现电路板双面一次性连续打磨，显著缩短加工周期，提升整体生产效率。
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