Electroplated copper leveler for surface repair and method of making same
By designing a copper plating leveling agent that replaces polyacrylate compounds with pyridine derivatives, the problems of poor adhesion and through-hole filling defects in remanufacturing surface repair were solved, achieving efficient through-hole filling and plating solution stability, which is suitable for the remanufacturing of electronic components.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- NANTONG SIKETE ELECTRONICS CO LTD
- Filing Date
- 2026-06-17
- Publication Date
- 2026-07-17
AI Technical Summary
Existing copper plating leveling agents have problems such as poor adhesion of the repair layer, many defects in through-hole filling, weak resistance to impurities in the plating solution, and short service life in the surface repair of electronic components remanufacturing, which cannot meet the electroplating requirements of high-precision packaging substrates.
By using pyridine derivatives with general formula (I) to replace polyacrylate compounds as leveling agents, and by designing positively charged adsorption sites of pyridine ring quaternary ammonium salts and carboxyl complexation sites, a stable coating bonding layer is formed. Combined with the water solubility of the polyacrylate backbone and the stability of the plating solution, efficient through-hole filling and extended plating solution life are achieved.
It achieves void-free filling of high aspect ratio through holes, strong coating adhesion, strong resistance to impurity contamination of the plating solution, long cycle life, adapts to the remanufacturing production requirements of different specifications of waste electronic components, and has the potential for industrial mass production.
Smart Images
Figure CN122404599A_ABST