Magnetron sputtering coating simulation method, electronic device and storage medium
By optimizing simulation parameters during the magnetron sputtering coating process, the problem of poor film uniformity was solved, achieving film stability and uniformity, reducing color difference between workpieces, and ensuring product quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHENZHENSHI YUZHAN PRECISION TECH CO LTD
- Filing Date
- 2026-03-12
- Publication Date
- 2026-07-17
AI Technical Summary
During magnetron sputtering coating, improper parameter settings can lead to poor film uniformity, resulting in color differences between different workpieces and between different points on the same workpiece, which affects production stability and yield.
By simulating the magnetron sputtering coating process, multiple sets of simulation parameters were obtained, including the number of revolutions, the adjustment strategy for the rotation direction and speed, and the adjustment strategy for the sputtering range and direction of the twin target. The magnetron sputtering coating process was simulated, the film thickness was calculated, and the parameters were optimized to reduce color difference.
High-fidelity digital modeling of the magnetron sputtering coating process has been achieved, ensuring the stability and uniformity of the film layer, reducing color difference between workpieces, and improving product quality stability.
Smart Images
Figure CN122406166A_ABST