A deposition apparatus

Abstract

The utility model discloses a kind of deposition equipment, the deposition equipment includes first chamber and target material arranged in first chamber, the top side of the first chamber forms sputtering channel, the target material includes the emission end opposite with the sputtering channel, the emission end is used to emit particle to substrate, the particle reaches the substrate after passing through sputtering channel, the deposition equipment further includes material blocking assembly, the material blocking assembly includes at least one blocking piece, the blocking piece is arranged between the target material and substrate, one end of the blocking piece can extend to the position opposite with the sputtering channel, and shield the area of the sputtering channel outside the emission end range of target material, to block the particle emitted by target material after reflection by substrate falls into the first chamber. The utility model can improve equipment utilization, improve target material life.

Description

Technical Field

[0001] This utility model relates to the field of deposition technology, specifically to a deposition device. Background Technology

[0002] During deposition, sputtered material (such as metal target fragments and oxide particles) accumulates on the inner wall of the chamber, and may eventually accumulate to form conductive particles. These conductive particles, influenced by plasma turbulence, can enter insulating gaps, leading to a decrease in resistance between the target and the chamber, and even short circuits in the target.

[0003] To avoid the aforementioned problems, plasma deposition equipment in related technologies generally requires frequent shutdowns to open the cavity and clean the particles, which seriously affects the utilization rate of the equipment and the lifespan of the target material. Utility Model Content

[0004] This invention aims to address one of the technical problems in related technologies to a certain extent. To this end, this invention provides a deposition apparatus that can effectively improve equipment utilization and target lifespan.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a deposition apparatus, the deposition apparatus comprising a first chamber and a target material disposed within the first chamber, wherein a sputtering channel is formed on the top side of the first chamber, and the target material includes an emitter end opposite to the sputtering channel, the emitter end being used to emit particles toward a substrate, the particles passing through the sputtering channel and reaching the substrate.

[0006] The deposition apparatus further includes a baffle assembly, which includes at least one blocking member disposed between the target and the substrate. One end of the blocking member can extend to a position opposite to the sputtering channel and block the area of ​​the sputtering channel outside the firing end range of the target.

[0007] In this technical solution, the blocking component is set in the sputtering channel between the target and the substrate, blocking the sputtering channel and preventing the sputtering material accumulated on the inner wall of the deposition equipment from falling into the insulation gap of the first chamber. It can also prevent the particles emitted by the target from falling into the chamber after being emitted by the substrate, thereby avoiding the possible short circuit of the target and reducing the frequency of stopping the machine to open the chamber to clean the particles during operation, thus improving the life of the target.

[0008] Furthermore, the deposition equipment includes a furnace insulation ring and an annular liner. The inner cavity of the furnace insulation ring forms a first chamber. The liner is disposed within the first chamber and surrounds the target material. The top of the liner forms the sputtering channel. The blocking member is movably disposed on the top side of the liner and can switch between a blocking position and a stripping position. In the blocking position, one end of the blocking member extends to a position opposite to the sputtering channel and blocks the area of ​​the sputtering channel outside the target material range. In the stripping position, the blocking member is located outside the sputtering channel.

[0009] Furthermore, the material blocking assembly includes a drive unit and a guide rail. The guide rail is radially disposed on the top side of the guard plate along the sputtering channel. The blocking member is slidably disposed on the blocking member. The drive unit is used to drive the blocking member to switch between the material blocking position and the material ejection position.

[0010] Furthermore, at the material blocking position, one end of the blocking member extends to a position opposite to the end face of the launching end.

[0011] Furthermore, the width of the portion of one end of the blocking member that faces the end face of the transmitting end is between 1 mm and 3 mm.

[0012] Furthermore, multiple blocking elements are provided, and the multiple blocking elements are circumferentially distributed around the axis of the target material. At the blocking position, the multiple blocking elements form a circumferentially closed ring, and the firing end of the target material is opposite to the central cavity formed by the multiple blocking elements.

[0013] Furthermore, the blocking member forms a gap with the launching end of the target material.

[0014] Furthermore, the spacing is between 2mm and 4mm.

[0015] Furthermore, the material blocking assembly also includes a heating module disposed on the surface of the blocking member, the heating module being used to heat the blocking member.

[0016] Furthermore, the material blocking assembly also includes a detection module, which includes a position sensor for detecting the position of the blocking component.

[0017] These features and advantages of this utility model will be disclosed in detail in the following specific embodiments and accompanying drawings. The preferred embodiments or means of this utility model will be shown in detail in conjunction with the accompanying drawings, but this is not intended to limit the technical solution of this utility model. In addition, each of these features, elements and components appearing in the following text and drawings is multiple and is labeled with different symbols or numbers for convenience, but all represent parts with the same or similar structure or function. Attached Figure Description

[0018] The present invention will be further described below with reference to the accompanying drawings:

[0019] Figure 1 This is a schematic diagram of the deposition equipment structure according to one embodiment of the present invention (the blocking component is in the material blocking position);

[0020] Figure 2 This is a schematic diagram of the deposition equipment structure according to one embodiment of the present invention (the blocking component is in the unloading position);

[0021] Figure 3 This is a schematic diagram showing the relationship between the blocking member in the blocking position and the target material in one embodiment of the present invention.

[0022] in,

[0023] 11. Furnace insulation ring; 12. Protective plate; 13. First chamber; 14. Second chamber;

[0024] 20. Material stop assembly; 21. Blocking component; 22. Guide rail; 23. Heating module;

[0025] 30. Target material;

[0026] 40. Substrate. Detailed Implementation

[0027] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described are intended to explain this utility model and should not be construed as limiting it.

[0028] The terms "an embodiment," "example," or "trademark" used in this specification refer to a particular feature, structure, or characteristic described in connection with the embodiment itself that may be included in at least one embodiment disclosed in this utility model. The phrase "in an embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment.

[0029] See appendix Figure 1 , 2 One embodiment of this utility model discloses a deposition apparatus, which includes a first chamber and a target 30 disposed within the first chamber. A sputtering channel is formed on the top side of the first chamber. The target 30 includes an emitter end opposite to the sputtering channel, the emitter end being used to emit particles toward a substrate 40. The particles pass through the sputtering channel and reach the substrate 40.

[0030] The deposition apparatus further includes a baffle assembly 20, which includes at least one blocking member 21 disposed between the target 30 and the substrate 40. One end of the blocking member 21 can extend to a position opposite to the sputtering channel and block the sputtering channel from the area outside the firing end range of the target 30.

[0031] In this embodiment, during use, the target 30 and the substrate 40 are located in the same cavity (the cavity of the deposition equipment). Figure 1 As shown by the dashed line, the deposition apparatus is divided into a first chamber 13 for accommodating the target 30 and a second chamber 14 for accommodating the substrate 40. The first chamber 13 and the second chamber 14 are connected by a sputtering channel. The target 30 emits particles onto the substrate 40 through the sputtering channel, as shown in the attached diagram. Figure 1 As shown.

[0032] The deposition apparatus in this embodiment includes a baffle assembly 20, wherein the baffle assembly 20 includes a blocking member 21 disposed between the target 30 and the substrate 40, wherein the blocking member 21 is generally configured as a plate-like structure, and during the deposition process, the blocking member 21 can extend into the sputtering channel. See Appendix. Figure 1 As shown.

[0033] In this embodiment, the blocking component has two main blocking functions during use. First, during operation, the substrate 40 is in an idle state, and the particles emitted by the target 30 accumulate on the inner wall of the second chamber 14. After a long period of accumulation, the sputtered material accumulated on the inner wall of the second chamber 14 will fall off. In related technologies, the fallen sputtered material will fall from the sputtering channel into the first chamber 1313 containing the target. In this embodiment, the blocking component 21 can prevent the sputtered material accumulated on the inner wall of the second chamber 14 from entering the first chamber 13, thereby reducing the risk of the insulation gap in the first chamber 13. Second, during operation, the particles emitted by the target 30, after being emitted by the substrate 40, also have the risk of falling into the first chamber 13 through the sputtering channel. The blocking component 21 can prevent the risk of particles entering the insulation gap in the first chamber 13 from the sputtering channel.

[0034] It should be noted that the blocking member 21 does not block the emission port of the target 30. When the target 30 emits particles to the substrate 40, the particles are less likely to fall into the first chamber after sputtering due to the blocking effect of the blocking member 21, thereby reducing the accumulation of sputtered material in the first chamber and reducing the risk of short circuit.

[0035] In actual installation, the blocking component 21 is generally made of high temperature resistant (≥500℃) and plasma irradiation resistant ceramic (such as SiC, Al2O3) or metal-ceramic composite coating (such as Al matrix + Al2O3 coating). Moreover, the blocking component 21 can be surface treated: DLC (diamond-like carbon) coating (thickness 2-5μm), surface roughness Ra≤0.1μm (contact angle≥120°) to reduce the possibility of particle adhesion.

[0036] This embodiment does not specifically limit how the blocking member 21 is set on the deposition equipment, as long as it can prevent sputtered material from entering the first chamber 13 from the sputtering channel during the deposition process. For example, the blocking member 21 can be a fixed component or a movable component.

[0037] Furthermore, the blocking member 21 in this embodiment can completely block all areas outside the firing port of the target material 30, or it can be set to block only a part of the sputtering channel according to the actual situation. As long as it can prevent the sputtering material from falling into the first chamber 13 and accumulating, it falls within the protection scope of this application.

[0038] As one embodiment of this utility model, see the appendix. Figure 1 , 2 The deposition apparatus includes a furnace insulating ring 11 and an annular protective plate 12. The inner cavity of the furnace insulating ring 11 forms a first chamber 13. The protective plate 12 is disposed within the first chamber 13 and surrounds the target material 30. The top of the protective plate 12 forms the sputtering channel. The blocking member 21 is movably disposed on the top side of the protective plate 12 and can switch between a blocking position and a stripping position. In the blocking position, one end of the blocking member 21 extends to a position opposite to the sputtering channel and blocks the area of ​​the sputtering channel outside the target material 30. In the stripping position, the blocking member 21 is located outside the sputtering channel.

[0039] In this embodiment, the blocking member 21 is configured as a movable member. The movable positions of the blocking member 21 include a material blocking position and a material unblocking position. In the material blocking position, the blocking member 21 can block the sputtering channel and prevent sputtered material from entering the first chamber 13 from the sputtering channel. In the material unblocking position, the blocking member 21 can be moved to the outside of the sputtering channel. At this time, the blocking member 21 no longer blocks the sputtering channel. Generally, during non-deposition operations, the blocking member 21 can be moved to the material unblocking position. At this time, the sputtered material attached to the blocking member 21 can be cleaned, thereby preventing impurities from falling into the first chamber 13 from the sputtering channel during the cleaning process.

[0040] In this embodiment, there is no specific limitation on how the blocking member 21 moves. For example, the blocking member 21 can be set to a sliding form or a rotating form, as long as its moving position has the material blocking position and non-material blocking position mentioned above.

[0041] In this embodiment, the design of the blocking component 21 can prevent large conductive particles from entering the gap between the target material 30 and the protective plate 12, which significantly reduces the probability of large conductive particles entering the gap between the target material 30 and the chamber, solves the short circuit problem of the target material 30, and does not affect the related operations of the target material 30.

[0042] In this embodiment, the material blocking component 20 is easy to integrate with the structure of the deposition equipment itself, has high adaptability, and can add the material blocking function without major structural modifications.

[0043] Of course, it is conceivable that in actual installation, the blocking component 21 can also be detachably connected to the guard plate 12. At the material blocking position, the blocking component 21 is fixed on the guard plate 12. When it is necessary to clean the blocking component 21, the blocking component 21 can be removed from the guard plate 12 for separate cleaning.

[0044] As one embodiment of this utility model, see the appendix. Figure 1 , 2 The material blocking assembly 20 includes a driving unit and a guide rail 22. The guide rail 22 is arranged radially on the top side of the guard plate 12 along the sputtering channel. The blocking member 21 is slidably disposed on the blocking member 21. The driving unit is used to drive the blocking member 21 to switch between the material blocking position and the material ejection position.

[0045] In this embodiment, the blocking member 21 is slidably arranged along the radial direction of the sputtering channel. By providing a guide rail 22 on the top side of the guard plate 12, the blocking member 21 is slidably arranged on the guide rail 22. The driving unit can drive the blocking member 21 to slide and switch between the blocking position and the unloading position along the guide rail 22. The driving unit and the guide rail 22 can be an integrated pneumatic slide rail structure, or they can be driven separately, such as by a motor, an electric push rod, or a hydraulic cylinder.

[0046] As one embodiment of this utility model, see the appendix. Figure 1 , 3 At the material blocking position, one end of the blocking member 21 extends to a position opposite to the end face of the transmitting end.

[0047] In this embodiment, when the blocking member 21 is in the blocking position, the inner edge of the blocking member 21 and the projection of the end face of the firing end of the target 30 along the axial direction of the sputtering channel overlap. That is, along the axial direction of the sputtering channel, the blocking member 21 can completely cover the edge of the target 30 directly above the blocking member in the blocking position, with no gap between it and the target 30. This can provide a better blocking effect on the sputtered material.

[0048] In specific configurations, the width of the portion of the blocking member 21 opposite to the end face of the emitting end is between 1mm and 3mm. Since the emitting end of the target 30 has a emitting port, the blocking member 21 cannot cover the emitting port. Generally, the width of the blocking member 21 covering the emitting end can be set to 2mm. However, in actual configurations, the width of the blocking member 21 and the relative edges of the target 30 can be adjusted according to the specific dimensions of the emitting end and the emitting port. When the distance between the emitting port and the outer wall of the target 30 is large, a larger coverage distance can be achieved.

[0049] To improve the blocking effect on sputtered material, one embodiment of the present invention provides multiple blocking members 21. The multiple blocking members 21 are circumferentially distributed around the axis of the target material 30. At the blocking position, the multiple blocking members 21 form a circumferentially closed ring. The emitting end of the target material 30 is opposite to the central cavity formed by the multiple blocking members 21.

[0050] See appendix Figure 3 The diagram shows a top view of a deposition apparatus equipped with four circumferentially distributed blocking elements 21. The diagram shows the four blocking elements 21 in the blocking position. As can be seen from the diagram, in the blocking position, the multiple blocking elements 21 are closely fitted together between the side walls in the circumferential direction without gaps, forming a completely closed mechanism on the top side of the sputtering channel. This prevents sputtered material from falling into the first chamber 13 from the gaps between adjacent blocking elements 21, thus improving the blocking effect on sputtered material.

[0051] This embodiment does not specify the exact number of blocking members 21. In actual installation, the number of blocking members 21 can be 2, 3, 4 or more, as long as the multiple blocking members 21 can form a circumferentially closed structure at the material blocking position.

[0052] In this embodiment, the multiple blocking elements 21 can be configured to operate synchronously or individually.

[0053] In one embodiment of this utility model, the blocking member 21 forms a gap with the launching end of the target material 30.

[0054] See appendix Figure 1In this embodiment, the blocking member 21 is located on the top side of the target 30 and is at a certain distance from the target 30. This distance is set to avoid electrofusion during the deposition process, which may be caused by the blocking member 21 being too close to the target 30. Therefore, the blocking member 21 generally needs to maintain a distance of not less than 2 mm from the end face of the target 30. However, if the distance between the blocking member 21 and the target 30 is too large, the gap between them will be too large, which may cause sputtered material to enter the first chamber 13 from the gap. Therefore, the distance between the blocking member 21 and the end face of the target 30 is generally limited to no more than 4 mm.

[0055] The blocking component 21 of this utility model physically blocks the migration path of particles through the coordinated design of "spacing control + coverage width" while avoiding interference with plasma uniformity.

[0056] To facilitate the cleaning of sputtered material adhering to the surface of the blocking member 21, the blocking assembly 20 further includes a heating module 23, which is disposed on the surface of the blocking member 21 and is used to heat the blocking member 21.

[0057] In this embodiment, the heating module 23 can periodically heat the surface of the blocking component 21 (the heating temperature is generally between 200-300℃), and achieve self-cleaning of the surface of the blocking component 21 by thermal expansion to peel off the attached particles (particle shedding rate ≥90%). The heating module 23 can be electrically heated.

[0058] In order to accurately control the position of the blocking member 21, the material blocking assembly 20 of one embodiment of the present invention further includes a detection module, the detection module including a position sensor, the position sensor being used to detect the position of the blocking member 21.

[0059] In this embodiment, the position sensor is generally installed on the blocking component 21 to detect the actual position of the blocking component 21 and provide feedback, facilitating timely understanding of the actual position of the blocking component 21 and enabling precise control. Of course, in actual installation, the position sensor can also be installed on the guide rail 22 or the drive unit, as long as the position of the blocking component 21 can be known. This facilitates precise control of the blocking component 21 in the blocking position or the unloading position according to different working conditions, realizing automatic / manual switching of the "deposition (blocking position) - maintenance (unloading position)" mode (response time ≤ 1s).

[0060] This invention can improve equipment reliability, reduce the short circuit rate of target material 30 by more than 95%, increase equipment utilization by 40%-60%, and increase the utilization rate of target material 30 by 20%-40%, resulting in significant economic benefits.

[0061] The above are merely specific embodiments of this utility model, but the scope of protection of this utility model is not limited thereto. Those skilled in the art should understand that this utility model includes, but is not limited to, the contents described in the accompanying drawings and the specific embodiments above. Any modifications that do not depart from the functional and structural principles of this utility model will be included within the scope of the claims.

Claims

1. A deposition apparatus comprising a first chamber and a target (30) disposed within the first chamber, wherein a sputtering channel is formed on the top side of the first chamber, the target (30) comprising an emitter end opposite to the sputtering channel, the emitter end being used to emit particles toward a substrate (40), the particles passing through the sputtering channel and reaching the substrate (40), characterized in that, The deposition apparatus further includes a baffle assembly (20), which includes at least one blocking member (21) disposed between the target (30) and the substrate (40). One end of the blocking member (21) can extend to a position opposite to the sputtering channel and block the area of ​​the sputtering channel outside the firing end range of the target (30).

2. The deposition apparatus of claim 1, wherein The deposition equipment includes a furnace insulating ring (11) and an annular protective plate (12). The inner cavity of the furnace insulating ring (11) forms a first chamber (13). The protective plate (12) is set inside the first chamber (13) and surrounds the target material (30). The top of the protective plate (12) forms the sputtering channel. The blocking member (21) is movably disposed on the top side of the protective plate (12) and can be switched between a blocking position and a stripping position. In the blocking position, one end of the blocking member (21) extends to a position opposite to the sputtering channel and blocks the area of ​​the sputtering channel outside the target material (30). In the stripping position, the blocking member (21) is located outside the sputtering channel.

3. The deposition apparatus of claim 2, wherein, The material blocking assembly (20) includes a drive unit and a guide rail (22). The guide rail (22) is arranged radially on the top side of the guard plate (12) along the sputtering channel. The blocking member (21) is slidably disposed on the blocking member (21). The drive unit is used to drive the blocking member (21) to switch between the material blocking position and the material ejection position.

4. The deposition apparatus according to any one of claims 1 to 3, wherein At the material blocking position, one end of the blocking member (21) extends to a position opposite to the end face of the transmitting end.

5. The deposition apparatus of claim 4, wherein, The width of the portion of one end of the blocking member (21) opposite to the end face of the transmitting end is between 1 mm and 3 mm.

6. The deposition apparatus according to any one of claims 1 to 3, wherein Multiple blocking members (21) are provided, and the multiple blocking members (21) are circumferentially distributed around the axis of the target material (30). At the blocking position, the multiple blocking members (21) form a circumferentially closed ring. The firing end of the target material (30) is opposite to the central cavity formed by the multiple blocking members (21).

7. The deposition apparatus according to any one of claims 1 to 3, wherein The blocking member (21) forms a gap with the firing end of the target material (30).

8. The deposition apparatus of claim 7, wherein, The spacing is between 2mm and 4mm.

9. The deposition apparatus according to any one of claims 1 to 3, wherein The baffle assembly (20) further includes a heating module (23), which is disposed on the surface of the baffle (21) and is used to heat the baffle (21).

10. The deposition apparatus according to any one of claims 1 to 3, characterized in that, The baffle assembly (20) further includes a detection module, which includes a position sensor for detecting the position of the baffle (21).

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