Sputtering cathode, cathode mechanism, and magnetron sputtering device

Abstract

The present application relates to a sputtering cathode, a cathode mechanism, and a magnetron sputtering device. A sputtering cathode (200) comprises: a target tube (10), the outer surface of the target tube (10) being provided with a sputtering target material; a sealing tube body (21) arranged inside the target tube (10); a magnetic rod (30) arranged inside the sealing tube body (21); and a plurality of adjustment assemblies (40) arranged at intervals sequentially in the axial direction of the sealing tube body (21) on the sealing tube body (21), the plurality of adjustment assemblies (40) being separately connected to the magnetic rod (30) and used for adjusting the distance between at least part of the magnetic rod (30) and the sputtering target material.

Description

Sputtering cathode, cathode mechanism and magnetron sputtering device

[0001] Related applications

[0002] This application claims priority to Chinese Patent Application No. 2024231105333, filed on December 17, 2024, entitled "Sputtering Cathode, Cathode Mechanism and Magnetron Sputtering Apparatus", the entire contents of which are incorporated herein by reference; and also claims priority to Chinese Patent Application No. 2024229220475, filed on November 28, 2024, entitled "Cathode Mechanism and Magnetron Sputtering Apparatus", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of magnetron sputtering technology, and in particular to sputtering cathodes, cathode mechanisms and magnetron sputtering apparatus. Background Technology

[0004] Magnetron sputtering is a type of physical vapor deposition that can be used to prepare various materials, including metals, semiconductors, and insulators. The working principle of magnetron sputtering is based on the synergistic effect of electric and magnetic fields. In a vacuum environment, argon gas is introduced and ionized to form argon ions (Ar). + In a magnetron sputtering device, the sputtering cathode receives a negative voltage from an external power source, causing the target surface to become negatively charged. This attracts argon ions to accelerate toward the sputtering cathode. When these high-energy argon ions collide with the target surface, they knock out atoms or molecules of the target, forming sputtered particles. These sputtered particles are deposited on the substrate surface with the gas flow, thus forming a thin film.

[0005] In magnetron sputtering, the uniformity of the film layer is typically adjusted by regulating the magnetic field strength on the target surface. A common method for adjusting the magnetic field strength is to adjust the distance between the magnet and the target surface. However, in current magnetron sputtering devices, the adjustment method used to regulate the distance between the magnet and the target surface is difficult to improve in terms of accuracy. Low accuracy affects the overall sputtering performance of the magnetron sputtering device.

[0006] Currently, current or signal transmission is typically achieved by connecting the sputtering cathode and the end cap, a connection method widely used in various sputtering devices. However, this connection method has certain instabilities, leading to instability in current or signal transmission. This instability can adversely affect the sputtering process, thereby impacting the quality of the produced thin film. Summary of the Invention

[0007] In a first aspect, according to various embodiments of this application, this application provides a sputtering cathode, a cathode mechanism, and a magnetron sputtering apparatus.

[0008] This application provides a sputtering cathode, the sputtering cathode comprising:

[0009] The target tube has a sputtering target material on its outer surface;

[0010] The sealing tube body is disposed inside the target tube;

[0011] A magnetic rod is disposed inside the sealing tube body; and,

[0012] Multiple adjustment components are sequentially and spaced apart along the axial direction of the sealing tube body. Each adjustment component is connected to the magnetic rod and is used to adjust the distance between at least a portion of the magnetic rod and the sputtering target. Each adjustment component includes a mounting base, a first mounting member, and a lifting unit. The mounting base is disposed on the sealing tube body and located on the side of the magnetic rod facing away from the sputtering target. The mounting base has an installation space. The first mounting member is disposed in the installation space. The lifting unit is disposed on the first mounting member and connected to the magnetic rod. The lifting unit is used to drive the magnetic rod to move up and down relative to the sputtering target.

[0013] In one embodiment, the magnetic rod includes a plurality of magnetic elements, which are sequentially disposed inside the sealing tube body along the axial direction of the sealing tube body; a plurality of adjustment components are connected to the plurality of magnetic elements in a one-to-one correspondence, and the adjustment components are capable of adjusting the distance between the corresponding magnetic element and the sputtering target.

[0014] In one embodiment, the adjustment assembly further includes a first connector detachably disposed on the side of the magnetic rod facing the adjustment assembly and connected to the lifting unit.

[0015] In one embodiment, the first mounting member has a first mounting groove, and the first mounting member has a first through hole on the side facing the first connector, the first through hole communicating with the first mounting groove; the lifting unit includes a driving member, a reducing member, and a lifting member, the driving member and the reducing member are both disposed in the first mounting groove, the output end of the driving member is connected to the reducing member, the lifting member is inserted into the first through hole, one end of the lifting member is connected to the reducing member, and the other end of the lifting member is connected to the first connector.

[0016] In one embodiment, the adjustment assembly further includes a position sensor and a controller disposed in the first mounting slot. The position sensor is located on one side of the lifting member, and the position sensor is communicatively connected to the controller and is used to monitor the position of the lifting member in real time and transmit real-time data to the controller. The controller is communicatively connected to the drive member and is used to receive the real-time data and control the movement of the drive member.

[0017] In one embodiment, the adjustment assembly further includes a first guide member disposed on the side of the first connector opposite to the magnetic rod; the first mounting member is correspondingly provided with a first guide channel for sliding the first guide member, the first guide channel being disposed along the direction in which the lifting unit drives the magnetic rod to rise and fall relative to the sputtering target.

[0018] In one embodiment, the mounting base has a second guide channel, which is arranged along the direction in which the lifting unit drives the magnetic rod to rise and fall relative to the sputtering target; the adjustment assembly further includes a second guide member, which includes a first end and a second end arranged opposite to each other, the first end being connected to the magnetic rod, and the second end being slidably disposed within the second guide channel.

[0019] In one embodiment, the sealing tube body has multiple mounting holes, which are spaced apart sequentially along the axial direction of the sealing tube body and correspond one-to-one with multiple mounting seats. The mounting seat includes a second mounting member and a third mounting member. The third mounting member is disposed inside the sealing tube body, and the second mounting member is disposed outside the sealing tube body and connected to the third mounting member. The second mounting member has a second mounting groove communicating with the mounting holes, and the third mounting member has a second through hole communicating with the mounting holes. The mounting space is formed by the second mounting groove, the second through hole, and the mounting holes.

[0020] A cathode mechanism includes an end, a support, and a sputtering cathode as described in any of the preceding claims. The sputtering cathode includes a third end and a fourth end disposed opposite to each other, the third end being detachably connected to the end and the fourth end being detachably connected to the support.

[0021] A magnetron sputtering apparatus includes a vacuum chamber and a cathode mechanism as described above, wherein the sputtering cathode of the cathode mechanism is disposed within the vacuum chamber.

[0022] Secondly, according to various embodiments of this application, this application provides a cathode mechanism and a magnetron sputtering apparatus.

[0023] A cathode mechanism, the cathode mechanism comprising:

[0024] The end includes a support member and a docking member. The support member has a first wiring channel that communicates with the outside. The docking member is disposed on one side of the support member and has a plug-in cavity that communicates with the first wiring channel.

[0025] A sputtering cathode includes a target tube and a magnetic rod connector. The target tube is detachably connected to one side of the end cap. The magnetic rod connector is located at the end of the target tube near the end cap and is inserted into the insertion cavity. The magnetic rod connector has a receiving cavity.

[0026] A transmission cable, one end of which is located outside the end cap, and the other end of which passes through the first wiring channel and is inserted into the receiving cavity of the magnetic rod connector for electrical connection with the magnetic rod connector. The transmission cable is used to transmit power and / or data signals.

[0027] In one embodiment, the transmission cable includes a cable body and a connector, the connector being inserted into the receiving cavity, one end of the cable body being located outside the end, and the other end of the cable body passing through the first wiring channel and connected to the connector.

[0028] In one embodiment, the inner wall of the insertion cavity is provided with a limiting groove arranged along the axial direction, and the outer wall of the magnetic rod connector is provided with a corresponding limiting protrusion, the limiting protrusion being slidably disposed in the limiting groove.

[0029] In one embodiment, the docking member includes a mounting portion and a docking portion. The mounting portion is connected to the support member, and the mounting portion has a second wiring channel communicating with the first wiring channel. The docking portion is located on the side of the mounting portion near the sputtering cathode, and the insertion cavity is located in the docking portion and communicates with the second wiring channel.

[0030] In one embodiment, the end further includes a bearing, a rotating sleeve, a connector, and a rotating assembly. The bearing is sleeved outside the mating portion, the rotating sleeve is sleeved outside the bearing, the connector is connected to the end of the rotating sleeve near the sputtering cathode and is detachably connected to the target tube, and the rotating assembly is connected to the rotating sleeve to drive the rotating sleeve to rotate relative to the mating portion.

[0031] In one embodiment, the rotating assembly includes a driving component and a transmission unit, the driving component and the transmission unit being located on the same side of the support member, the output end of the driving component being connected to the transmission unit, and the transmission unit being connected to the rotating sleeve.

[0032] In one embodiment, the transmission unit includes a drive gear and a driven gear. The drive gear is located on one side of the support member and is connected to the output end of the drive component. The driven gear is located on the side of the drive gear near the docking portion and meshes with the drive gear. The driven gear is connected to the rotating sleeve.

[0033] In one embodiment, the connector includes a connector body and an annular protrusion. The connector body is connected to the end of the rotating sleeve near the sputtering cathode. The annular protrusion is arranged circumferentially along the connector body and located at the end of the connector body near the rotating sleeve. A fixing member is sleeved at the end of the target tube near the end. The fixing member has a receiving groove arranged circumferentially around it. The connector and the fixing member are engaged and connected by the annular protrusion and the receiving groove.

[0034] In one embodiment, the end further includes a delivery pipe and a discharge pipe, which are respectively connected to the support member; the support member has a first delivery pipe and a first discharge pipe arranged along the axial direction of the support member, the first delivery pipe communicating with the delivery pipe and the first discharge pipe communicating with the discharge pipe; the mounting portion has a second delivery pipe and a second discharge pipe, the second delivery pipe communicating with the first delivery pipe and the second discharge pipe communicating with the first discharge pipe; the docking portion has a third delivery pipe and a third discharge pipe arranged along the axial direction of the docking portion, the third delivery pipe and the third discharge pipe being disposed opposite each other on both sides of the insertion cavity, the third delivery pipe communicating with the second delivery pipe and the third discharge pipe communicating with the second discharge pipe; the sputtering cathode further includes a sealing tube and a magnetic rod, the sealing tube being disposed inside the target tube and connected to the magnetic rod connector, the magnetic rod being disposed inside the sealing tube, and the gap between the target tube and the sealing tube forming a cooling channel; the cooling channel is respectively connected to the third delivery pipe and the third discharge pipe.

[0035] A magnetron sputtering apparatus includes a vacuum chamber and a cathode mechanism as described above, wherein the sputtering cathode of the cathode mechanism is disposed within the vacuum chamber.

[0036] Details of one or more embodiments of this application are set forth in the following drawings and description. Other features, objects, and advantages of the invention will become apparent from the specification, drawings, and claims. Attached Figure Description

[0037] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the disclosed drawings without creative effort.

[0038] Figure 1 is a schematic diagram of the structure of a sputtering cathode provided in an embodiment of the first aspect of this application.

[0039] Figure 2 is a cross-sectional schematic diagram of a sputtering cathode provided in an embodiment of the first aspect of this application.

[0040] Figure 3 is an enlarged view of point A in Figure 2.

[0041] Figure 4 is a schematic diagram of the structure of the adjustment component in a sputtering cathode provided in an embodiment of the first aspect of this application.

[0042] Figure 5 is a schematic diagram of the structure of the sealing tube in a sputtering cathode provided in an embodiment of the first aspect of this application.

[0043] Figure 6 is a schematic diagram of the structure of a cathode mechanism provided in an embodiment of the first aspect of this application.

[0044] Figure 7 is an exploded view of a cathode mechanism provided in an embodiment of the second aspect of this application.

[0045] Figure 8 is a cross-sectional schematic diagram of a portion of the structure of a cathode mechanism provided in an embodiment of the second aspect of this application.

[0046] Figure 9 is a cross-sectional schematic diagram of a portion of the structure of a cathode mechanism provided in another embodiment of the second aspect of this application.

[0047] Figure 10 is a schematic diagram of the structure of the docking member in the cathode mechanism provided in an embodiment of the second aspect of this application.

[0048] Figure 11 is a cross-sectional schematic diagram of the docking member in a cathode mechanism provided in an embodiment of the second aspect of this application.

[0049] Figure 12 is an enlarged view of point A in Figure 8. Detailed Implementation

[0050] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0051] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0052] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0053] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0054] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0055] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0056] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0057] Firstly, in response to the aforementioned problem of difficulty in improving adjustment accuracy, this application provides a sputtering cathode, a cathode mechanism, and a magnetron sputtering device to solve the problem that in current magnetron sputtering devices, the adjustment method used to adjust the distance between the magnet and the target surface is difficult to improve adjustment accuracy, resulting in low adjustment accuracy and affecting the overall sputtering effect of the magnetron sputtering device.

[0058] Please refer to Figures 1 and 2. Figure 1 shows a schematic diagram of the structure of a sputtering cathode 200 provided in an embodiment of the first aspect of this application, and Figure 2 shows a cross-sectional schematic diagram of a sputtering cathode 200 provided in an embodiment of the first aspect of this application.

[0059] An embodiment of this application provides a sputtering cathode 200, including a target tube 10, a sealing tube 20, a magnetic rod 30, and a plurality of adjustment components 40. The outer surface of the target tube 10 is provided with a sputtering target (not shown). The sealing tube 20 is disposed inside the target tube 10, and the magnetic rod 30 is disposed inside the sealing tube 20. The plurality of adjustment components 40 are sequentially and spaced apart along the axial direction of the sealing tube 20. Each adjustment component 40 is connected to the magnetic rod 30 and is used to adjust the distance between at least a portion of the magnetic rod 30 and the sputtering target. The plurality of adjustment components 40 in the sputtering cathode 200 can collectively adjust the distance between the magnetic rod 30 and the sputtering target. Simultaneously, each adjustment component 40 can independently adjust the position of the magnetic rod 30 relative to the sputtering target, improving adjustment accuracy, precisely controlling the magnetic field strength on the target surface, helping to ensure the uniformity of the sputtering process, and improving the quality of the thin film.

[0060] In some embodiments, the sputtering cathode 200 further includes two second connectors 50, which are respectively disposed at both ends of the sealing tube 20, which facilitates the rapid installation and disassembly of the sputtering cathode 200 and the external structure.

[0061] In some embodiments, the magnetic rod 30 includes a plurality of magnetic elements 31, which are sequentially arranged inside the sealing tube 20 along the axial direction of the sealing tube 20. A plurality of adjustment components 40 are connected one-to-one with the plurality of magnetic elements 31 to adjust the distance between the plurality of magnetic elements 31 and the sputtering target. Each adjustment component 40 is used to adjust the distance between a corresponding magnetic element 31 and the sputtering target. Each magnetic element 31 can be independently adjusted in position, allowing for more flexible adaptation to different materials and process requirements. For example, under different sputtering target and atmosphere conditions, the position of each magnetic element 31 can be individually adjusted as needed to obtain the optimal sputtering effect. Furthermore, compared to a continuous magnetic rod 30 structure, the independent magnetic elements 31 are not constrained or interfered with by adjacent magnetic elements 31 when adjusting their position, allowing for a larger adjustment range. During sputtering, local fine-tuning of the magnetic field can be performed for different targets or different sputtering areas, precisely controlling the sputtering rate during the sputtering process, ensuring uniform deposition of the thin film throughout the entire area, and reducing problems such as uneven thickness.

[0062] Please refer to Figures 3 and 4 together. Figure 3 shows an enlarged schematic diagram of point A in Figure 2, and Figure 4 shows a structural schematic diagram of the adjustment component 40 in the sputtering cathode 200 provided in an embodiment of the first aspect of this application. In some embodiments, the adjustment component 40 includes a mounting base 41, a first mounting member 42, a lifting unit 43, and a first connecting member 44. The mounting base 41 is disposed on the sealing tube 20 and located on the side of the magnetic rod 30 facing away from the sputtering target. The mounting base 41 has an installation space. The first mounting member 42 is disposed in the installation space. The first connecting member 44 is disposed on the side of the magnetic rod 30 facing the adjustment component 40. The lifting unit 43 is disposed on the first mounting member 42 and connected to the first connecting member 44, and is used to drive the magnetic rod 30 to rise and fall relative to the sputtering target.

[0063] In some embodiments, the first mounting member 42 has a first mounting groove 421 and a first through hole 422 on the side of the first mounting member 44 facing the first connector 44. The first through hole 422 communicates with the first mounting groove 421. The lifting unit 43 includes a driving member 431, a reducing member 432 and a lifting member 433. The driving member 431 and the reducing member 432 are both disposed in the first mounting groove 421. The output end of the driving member 431 is connected to the reducing member 432. The lifting member 433 is inserted into the first through hole 422. One end of the lifting member 433 is connected to the reducing member 432 and the other end of the lifting member 433 is connected to the first connector 44. In some embodiments, the drive component 431 is a motor, the output shaft of the motor is connected to the reducer 432, the reducer 432 is connected to the lifting component 433, the speed of the motor can be effectively reduced by the reducer 432, the speed of the lifting component 433 can be controlled by setting the reduction ratio, so as to ensure that the lifting action of the lifting component 433 is smooth and the lifting action of the lifting component 433 is precisely controlled, thereby precisely controlling the lifting of the magnetic rod 30 relative to the sputtering target and improving the adjustment accuracy.

[0064] In some embodiments, the adjustment assembly 40 further includes a position sensor 47 and a controller, both of which are disposed within the first mounting slot 421. The position sensor 47 is located on one side of the lifting member 433, and is communicatively connected to the controller, used to monitor the position of the lifting member 433 in real time and transmit real-time data to the controller. The controller is communicatively connected to the drive member 431, used to receive real-time data from the position sensor 47 and control the movement of the drive member 431. In some embodiments, the controller is used to control the start, stop, acceleration, or deceleration of the drive member 431. In some embodiments, the position sensor 47 includes, but is not limited to, a photoelectric sensor or a potentiometer sensor. By setting the position sensor 47 and the controller, precise control of the distance between the magnetic rod 30 and the sputtering target can be achieved, ensuring stability and efficiency during the sputtering process.

[0065] It is understandable that integrating the drive component 431, reducer 432, and lift component 433 of the lifting unit 43, as well as the position sensor 47 and controller, into the first mounting slot 421 of the first mounting component 42 can reduce the size of the external structure, avoid space waste caused by component dispersion, and thus improve the overall compactness of the adjustment assembly 40. The compact structure of the adjustment assembly 40 reduces the space occupied and improves space utilization. It can reduce the distance between two adjacent adjustment assemblies 40, allowing more adjustment assemblies 40 to be installed in the limited space inside the target tube 10, improving the adjustment accuracy of the sputtering cathode 200, realizing fine adjustment of the magnetic field strength on the outer surface of the target tube 10, improving the quality and uniformity of the thin film, and meeting more complex and variable production needs.

[0066] In some embodiments, the adjustment assembly 40 further includes a first guide 45, which is disposed on the side of the first connector 44 facing away from the magnetic rod 30. The first mounting member 42 is provided with a corresponding first guide channel 423, which is disposed along the direction in which the lifting unit 43 drives the magnetic rod 30 to rise and fall relative to the sputtering target. The position and shape of the first guide channel 423 are adapted to the first guide 45 for sliding of the first guide 45.

[0067] In some embodiments, the mounting base 41 has a second guide channel, which is arranged along the direction in which the lifting unit 43 drives the magnetic rod 30 to rise and fall relative to the sputtering target. The adjustment assembly 40 also includes a second guide member 46, which has a first end and a second end disposed opposite to each other. The first end is connected to the magnetic rod 30, and the second end is slidably disposed within the second guide channel. The first guide member 45 and the second guide member 46 of the adjustment assembly 40 ensure that the adjustment assembly 40 can achieve high-precision and high-stability control during the rising and falling of the magnetic rod 30, thereby maintaining a stable magnetic field strength and a uniform sputtering area.

[0068] Please refer to Figure 5. Figure 5 shows a schematic diagram of the structure of the sealing tube 20 in the sputtering cathode 200 provided in an embodiment of the first aspect of this application. In some embodiments, the sealing tube 20 includes a sealing tube body 21 and two side tubes 22. The two side tubes 22 are detachably disposed on both sides of the sealing tube body 21 for passing through cooling fluid, thereby effectively removing the heat of the sealing tube body 21. The magnetic rod 30 is disposed inside the sealing tube body 21, and a plurality of adjustment components 40 are sequentially and spaced apart along the axial direction of the sealing tube body 21.

[0069] In some embodiments, the sealing tube body 21 is recessed towards the interior of the sealing tube body 21 on the side near the side tube 22 to form a mounting groove 212, and the inner cavity of the sealing tube body 21 forms a first chamber 213, a second chamber 214, and a third chamber 215 arranged radially along the sealing tube body 21, the first chamber 213, the second chamber 214, and the third chamber 215 being interconnected. The side tube 22 includes a base portion 221 and a protrusion 222, wherein the base portion 221 has a first cooling channel (not shown) for cooling fluid to pass through, and the base portion 221 has a drainage hole 223 communicating with the first cooling channel for introducing cooling fluid from the target tube 10 into the cooling channel to remove heat from the sealing tube body 21. The protrusion 222 is located on the side of the base 221 near the sealing tube body 21. The side tube 22 and the sealing tube body 21 are connected by the protrusion 222 and the mounting groove 212. The protrusion 222 has a second cooling channel (not shown) for the cooling fluid to pass through. The second cooling channel is connected to the first cooling channel, which can remove the heat of the sealing tube body 21 more quickly and improve the heat dissipation efficiency.

[0070] In some embodiments, the sealing tube body 21 has a plurality of mounting holes 211, which are arranged sequentially at intervals along the axial direction of the sealing tube body 21 and correspond one-to-one with a plurality of mounting seats 41. The mounting seat 41 includes a second mounting member 412 and a third mounting member 413. The third mounting member 413 is disposed inside the sealing tube body 21, and the second mounting member 412 is disposed outside the sealing tube body 21 and connected to the third mounting member 413. The second mounting member 412 has a second mounting groove 4123 that communicates with the mounting holes 211. The third mounting member 413 has a second through hole that communicates with the mounting holes 211. The mounting space of the mounting seat 41 is formed by the second mounting groove 4123, the second through hole, and the mounting holes 211.

[0071] In some embodiments, the third mounting member 413 includes a main body 4131 and two insertion parts 4132. The main body 4131 is disposed in the second chamber 214 and the third chamber 215 of the sealing tube body 21. The two insertion parts 4132 are respectively disposed on the side of the main body 4131 near the inner wall of the sealing tube body 21. The third mounting member 413 and the sealing tube body 21 are connected by the insertion parts 4132 and the third chamber 215, which facilitates the quick installation and disassembly of the mounting base 41 and the sealing tube body 21.

[0072] The sputtering cathode 200 provided in this application is equipped with multiple compact adjustment components 40, reducing the space occupied and narrowing the distance between adjacent adjustment components 40. This allows for the installation of more adjustment components 40 within the limited space inside the target tube 10, thereby improving the adjustment accuracy of the sputtering cathode 200 and enabling fine adjustment of the magnetic field strength on the outer surface of the target tube 10. Furthermore, the magnetic rod 30 is composed of multiple magnetic elements 31 arranged sequentially, with each adjustment component 40 connected to a corresponding magnetic element 31. This allows each magnetic element 31 to be independently adjusted, providing greater flexibility to accommodate different materials and process requirements.

[0073] The aforementioned sputtering cathode is equipped with multiple adjustment components, which are sequentially spaced along the axial direction of the sealing tube body and connected to a magnetic rod. These components are used to adjust the distance between at least a portion of the magnetic rod and the sputtering target. By integrating the lifting unit into the first mounting component, the space wasted due to component dispersion can be reduced, and the compactness of the adjustment components can be improved. The compact structure of the adjustment components reduces the space occupied and improves space utilization, thereby reducing the distance between two adjacent adjustment components. More adjustment components can be installed in the limited space inside the target tube, improving the adjustment accuracy of the sputtering cathode, enabling fine adjustment of the magnetic field strength on the outer surface of the target tube, improving the quality and uniformity of the thin film, and meeting more complex and variable production needs.

[0074] Please refer to Figure 6, which shows a schematic diagram of the cathode mechanism provided in an embodiment of the first aspect of this application. The cathode mechanism provided in this embodiment includes an end 100, a support 300, and a sputtering cathode 200 as described above. The sputtering cathode 200 includes a third end and a fourth end disposed opposite to each other. The third end is detachably connected to the end 100, and the fourth end is detachably connected to the support 300. The end 100 is connected to an external high-voltage power supply or power system to provide a negative voltage to the sputtering cathode 200. The support 300 provides stable support for the sputtering cathode 200 to ensure that the sputtering cathode 200 does not shift during sputtering, thus ensuring the stability of the sputtering process. During magnetron sputtering, the end 100 transmits a negative voltage to the sputtering cathode 200 via an electrical connection, attracting positive ions in the gas and accelerating them to collide with the surface of the sputtering cathode 200. Under the action of the negative voltage, the positive ions are accelerated and collide with the sputtering target of the sputtering cathode 200, causing the sputtering target to be sputtered out and deposited on the substrate.

[0075] This application also provides a magnetron sputtering apparatus, which includes a vacuum chamber and a cathode mechanism as described above. The sputtering cathode 200 of the cathode mechanism is disposed within the vacuum chamber. The magnetron sputtering apparatus provided by this application can improve the sputtering process, making the sputtering process more stable and uniform, thereby improving the quality and consistency of thin film deposition, ensuring uniform film thickness, strong adhesion, and improving sputtering efficiency. In addition, the finely adjusted magnetic field can adapt to the sputtering characteristics of different materials, improving the flexibility and controllability of the process.

[0076] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0077] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

[0078] Secondly, in view of the above-mentioned problem of unstable current or signal transmission, this application provides a cathode mechanism and a magnetron sputtering device to solve the problem of unstable current or signal transmission when current or signal is transmitted by connecting the sputtering cathode and the end.

[0079] As mentioned in the background section, current transmission or signal delivery is generally achieved by connecting a sputtering cathode and a connector. A connector typically consists of two parts: one part is installed inside the connector head, and the other part is installed inside the sputtering cathode. By inserting the connector head into the sputtering cathode, the connector enables the transmission of current and / or data signals, ensuring that the sputtering cathode can receive the required current and / or data signals. However, this type of connector has certain shortcomings. First, due to the small overall size of the connector, the mating precision required between the connector head and the sputtering cathode is high. Misalignment can easily occur during the mating process, potentially causing mechanical damage to the connector and affecting the lifespan of both the connector head and the sputtering cathode. Second, the connection stability of the connector is also questionable. A loose connection or poor contact can lead to interruptions in current or signal transmission, thus affecting the stability of the sputtering process.

[0080] To address the aforementioned problems, this application provides a cathode mechanism. Please refer to Figures 7 and 8. Figure 7 shows an exploded view of the cathode mechanism provided in an embodiment of the second aspect of this application, and Figure 8 shows a partial cross-sectional view of the cathode mechanism provided in an embodiment of the second aspect of this application.

[0081] An embodiment of this application provides a cathode mechanism including an end 100, a sputtering cathode 200, a transmission cable 80, and a support 300. The sputtering cathode 200 includes a third end and a fourth end disposed opposite to each other. The third end is detachably connected to the end 100, and the fourth end is detachably connected to the support 300. The end 100 includes a support member 11 and a docking member 12. The support member 11 has a first wiring channel 111 inside, which communicates with the outside and is used for the transmission cable 80 to pass through. The docking member 12 is disposed on the side of the support member 11 near the sputtering cathode 200. The docking member 12 has a insertion cavity 1221, which communicates with the first wiring channel 111. The sputtering cathode 200 includes a target tube 10 and a magnetic rod connector 24. The target tube 10 is detachably connected to one side of the end 100. The magnetic rod connector 24 is located at the end of the target tube 10 near the end 100 and is inserted into the insertion cavity 1221 of the mating member 12. The magnetic rod connector 24 has a receiving cavity 241 for accommodating a transmission cable 80. One end of the transmission cable 80 is located outside the end 100, and the other end of the transmission cable 80 passes through a first wiring channel 111 and is inserted into the receiving cavity 241 of the magnetic rod connector 24 for electrical connection with the magnetic rod connector 24. The transmission cable 80 is used to transmit power and / or data signals.

[0082] It is understood that the cathode mechanism provided in this application uses a transmission cable 80 to transmit power and / or data signals. One end of the transmission cable 80 is located outside the end cap 100, and the other end of the transmission cable 80 passes through the first wiring channel 111 of the end cap 100 and is inserted into the receiving cavity 241 of the magnetic rod connector 24 for electrical connection with the magnetic rod connector 24. This avoids unstable connections and ensures the stability of current and / or signal transmission, thereby making the current during sputtering more stable and improving sputtering efficiency and film quality. In addition, it simplifies the connection process, making the installation and disassembly of the cathode mechanism easier and saving operation time.

[0083] Please also refer to Figure 9, which shows a partial cross-sectional schematic diagram of the cathode mechanism provided in another embodiment of the second aspect of this application. In some embodiments, the transmission cable 80 includes a cable body 81 and a connector 32, wherein the connector 32 is inserted into the receiving cavity 241 of the magnetic rod connector 24, one end of the cable body 81 is located outside the end 100, and the other end of the cable body 81 is connected to the connector 32 through the first wiring channel 111. Such a transmission cable 80 can more reliably realize the transmission of current and / or signals, improving the reliability of the sputtering process; at the same time, it can also realize the quick insertion and removal of the transmission cable 80 and the magnetic rod connector 24, making it easier to disassemble and replace the transmission cable 80.

[0084] Please refer to Figures 10 and 11 together. Figure 10 shows a structural schematic diagram of the docking member 12 in a cathode mechanism provided in an embodiment of the second aspect of this application, and Figure 11 shows a cross-sectional schematic diagram of the docking member 12 in a cathode mechanism provided in an embodiment of the second aspect of this application. In some embodiments, the docking member 12 includes a mounting portion 121 and a docking portion 122. The mounting portion 121 is connected to the support member 11. A second wiring channel 1211 is provided inside the mounting portion 121. The second wiring channel 1211 communicates with the first wiring channel 111 of the support member 11 for the transmission cable 80 to pass through. The docking portion 122 is disposed on the side of the mounting portion 121 near the sputtering cathode 200. A insertion cavity 1221 is formed in the docking portion 122 and communicates with the second wiring channel 1211.

[0085] Please refer to Figure 12, which shows an enlarged schematic diagram of point A in Figure 8. In some embodiments, the end 100 further includes a bearing 13, a rotating sleeve 14, a connector 15, and a rotating assembly 16. The bearing 13 is sleeved outside the docking portion 122, and the rotating sleeve 14 is sleeved outside the bearing 13. The connector 15 is connected to the end of the rotating sleeve 14 near the sputtering cathode 200 and is detachably connected to the target tube 10. The rotating assembly 16 is connected to the rotating sleeve 14 and is used to drive the rotating sleeve 14 to rotate relative to the docking portion 12. By driving the rotating sleeve 14 to rotate relative to the docking portion 12 through the rotating assembly 16, the connector 15 connected to the rotating sleeve 14 can also rotate relative to the docking portion 12, thereby realizing the rotation of the target tube 10 relative to the docking portion 12. During magnetron sputtering, driving the target tube 10 of the sputtering cathode 200 to rotate relative to the docking portion 12 can improve the utilization rate of the target material located on the surface of the target tube 10. In addition, the rotation of the target tube 10 can also disperse the heat of the target material to different parts, which helps to prevent local overheating.

[0086] In some embodiments, the rotating assembly 16 includes a driving component 161 and a transmission unit 162. The driving component 161 and the transmission unit 162 are located on the same side of the support member 11. The output end of the driving component 161 is connected to the transmission unit 162, and the transmission unit 162 is connected to the rotating sleeve 14. In some embodiments, the driving component 161 is a motor, and the output shaft of the motor is connected to the transmission unit 162. Through the transmission unit 162, the rotating sleeve 14 rotates relative to the docking member 12. In other embodiments, the driving component 161 may also be a pneumatic motor, etc., and is not limited thereto.

[0087] In some embodiments, the transmission unit 162 includes a drive gear 1621 and a driven gear 1623. The drive gear 1621 is located on one side of the support member 11 and is connected to the output end of the drive component 161. The driven gear 1623 is disposed on the side of the drive gear 1621 near the docking portion 122 and meshes with the drive gear 1621. The driven gear 1623 is connected to the rotating sleeve 14. The drive gear 1621 rotates under the drive of the drive component 161, thereby driving the driven gear 1623 to rotate, thus driving the rotating sleeve 14 to rotate relative to the docking member 12. In some embodiments, the transmission unit 162 further includes at least one transmission gear 1622. The transmission gear 1622 is disposed between the drive gear 1621 and the driven gear 1623 and meshes with both of them. The drive gear 1621 rotates under the drive of the drive component 161, thereby driving the transmission gear 1622 to rotate, and thus driving the driven gear 1623 to rotate.

[0088] In some embodiments, a limiting groove 1224 is formed on the inner wall of the insertion cavity 1221 of the docking member 12, and the limiting groove 1224 is arranged along the axial direction of the docking member 12. A limiting protrusion 25 is provided on the outer wall of the magnetic rod connector 24. The limiting protrusion 25 and the limiting groove 1224 on the inner wall of the insertion cavity 1221 are matched in position and shape. The limiting protrusion 25 is slidably disposed in the limiting groove 1224, so that the magnetic rod connector 24 can only be inserted into the insertion cavity 1221 of the docking member 12 in a specific direction and position, avoiding improper insertion or incorrect insertion angle. At the same time, the cooperation between the limiting protrusion 25 and the limiting groove 1224 provides a locking effect after the magnetic rod connector 24 is inserted into the docking member 12, ensuring that the magnetic rod connector 24 remains stationary when the target tube 10 rotates relative to the docking member 12, thereby enhancing the firmness and stability of the connection between the magnetic rod connector 24 and the docking member 12.

[0089] In some embodiments, the connector 15 includes a connector body 151 and an annular protrusion 152. The connector body 151 is connected to one end of the rotating sleeve 14 near the sputtering cathode 200. The annular protrusion 152 is arranged circumferentially along the connector body 151 and located at one end of the connector body 151 near the rotating sleeve 14. A fixing member 26 is sleeved on one end of the target tube 10 near the end 100. The fixing member 26 has a receiving groove 261, which is arranged circumferentially along the fixing member 26 and located at one end of the fixing member 26 near the end 100. The connector 15 and the fixing member 26 are engaged and connected by the annular protrusion 152 and the annular groove, which facilitates the installation and removal of the end 100 and the sputtering cathode 200, and also helps to improve the connection stability and reliability of the end 100 and the sputtering cathode 200.

[0090] In some embodiments, the end 100 further includes a conveying pipe 17 and a discharge pipe (not shown), which are respectively connected to the support member 11. The support member 11 has a first conveying pipe (not shown) and a first discharge pipe (not shown), both of which are arranged along the axial direction of the support member 11. The first conveying pipe communicates with the conveying pipe 17, and the first discharge pipe communicates with the discharge pipe. The mounting portion 121 has a second conveying pipe 1212 and a second discharge pipe 1213, which communicate with the first conveying pipe and the second discharge pipe 1213. The docking part 122 is provided with a third conveying pipe 1222 and a third discharge pipe 1223. The third conveying pipe 1222 and the third discharge pipe 1223 are arranged along the axial direction of the docking part 122. The third conveying pipe 1222 and the third discharge pipe 1223 are arranged opposite to each other on both sides of the insertion cavity 1221. The third conveying pipe 1222 is connected to the second conveying pipe 1212, and the third discharge pipe 1223 is connected to the second discharge pipe 1213.

[0091] The sputtering cathode 200 also includes a sealing tube 20 and a magnetic rod 30. The sealing tube 20 is disposed inside the target tube 10 and connected to the magnetic rod connector 24. The magnetic rod 30 is disposed inside the sealing tube 20. The gap between the inner wall of the target tube 10 and the sealing tube 20 forms a cooling channel 201 for the passage of cooling fluid. The end 100 is connected to the sputtering cathode 200. A third delivery pipe 1222 and a third discharge pipe 1223 are connected to the cooling channel 201. The delivery pipe 17 is connected to an external device that provides cooling fluid. Cooling fluid enters the delivery pipe 17 and flows through the first delivery pipe, the second delivery pipe 1212, and the third delivery pipe 1222, finally entering the cooling channel 201 within the sputtering cathode 200. The cooling fluid is then discharged from the cooling channel 201, flowing through the third discharge pipe 1223, the second discharge pipe 1213, and the first discharge pipe, finally being discharged to the outside through the discharge pipe. The cooling fluid inside the cathode mechanism is used to remove the heat generated by the magnetic rod 30 during sputtering, preventing the magnetic rod 30 from becoming less magnetic or damaged due to overheating, thereby maintaining the stability of the sputtering process.

[0092] In some embodiments, the docking portion 122 has a plurality of third conveying pipes 1222 and a plurality of third discharging pipes 1223. The plurality of third conveying pipes 1222 and the plurality of third discharging pipes 1223 are respectively arranged on both sides of the insertion cavity 1221. The plurality of third conveying pipes 1222 are arranged at intervals along the circumference of the insertion cavity 1221, and the plurality of third discharging pipes 1223 are arranged at intervals along the circumference of the insertion cavity 1221. The plurality of third conveying pipes 1222 can simultaneously convey cooling fluid to the cooling channel 201, thereby accelerating the speed at which cooling fluid is conveyed into the cooling channel 201. The plurality of third discharging pipes 1223 can quickly discharge the cooling fluid in the cooling channel 201, thereby improving the heat dissipation efficiency of the magnetic rod 30.

[0093] The cathode mechanism provided in this application directly introduces the transmission cable 80 into the receiving cavity 241 of the magnetic rod connector 24. Using the transmission cable 80 for power and / or data signal transmission ensures stable current and / or signal transmission during sputtering, avoiding unstable connections such as poor contact, thereby improving the reliability of the sputtering process and contributing to higher film quality. It also simplifies the connection operation, making the installation and disassembly of the cathode mechanism more convenient and effectively shortening operation time.

[0094] The aforementioned cathode mechanism uses a transmission cable to transmit power and / or data signals. By directly introducing the transmission cable into the receiving cavity of the magnetic rod connector for electrical connection, the connection is more stable and less prone to poor contact or other connection instability issues. This improves the stability of current and / or signal transmission and enhances the reliability of the sputtering process. At the same time, it simplifies the connection process, making the installation and disassembly of the cathode mechanism easier and saving operation time.

[0095] This application also provides a magnetron sputtering apparatus, including a vacuum chamber and a cathode mechanism as described above, wherein the sputtering cathode 200 of the cathode mechanism is disposed within the vacuum chamber. The magnetron sputtering apparatus described above provides stable current during the sputtering process, which is beneficial for improving sputtering efficiency and film quality.

[0096] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0097] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A sputtering cathode, comprising: a target tube, an outer surface of the target tube being provided with a sputtering target material; a tube body, arranged inside the target tube; a magnetic rod, arranged inside the tube body; and a plurality of adjusting assemblies, arranged in sequence along an axial direction of the tube body, each of the adjusting assemblies being connected to the magnetic rod and used for adjusting a distance between at least part of the magnetic rod and the sputtering target material; the adjusting assembly comprises a mounting seat, a first mounting member and a lifting unit, the mounting seat is arranged on the tube body and located on a side of the magnetic rod away from the sputtering target material, the mounting seat is provided with a mounting space, the first mounting member is arranged in the mounting space, and the lifting unit is arranged on the first mounting member and connected to the magnetic rod, the lifting unit being used for driving the magnetic rod to lift relative to the sputtering target material.

2. The sputter cathode of claim 1, wherein The magnetic rod comprises a plurality of magnetic members arranged in sequence along the axial direction of the tube body inside the tube body; each of the plurality of adjusting assemblies is connected to one of the plurality of magnetic members in a one-to-one correspondence, and the adjusting assembly can adjust a distance between the corresponding magnetic member and the sputtering target material.

3. The sputter cathode of claim 1, wherein The adjusting assembly further comprises a first connecting member, the first connecting member being detachably arranged on a side of the magnetic rod facing the adjusting assembly and connected to the lifting unit.

4. The sputter cathode of claim 3, wherein The first mounting member is provided with a first mounting groove, a first through hole is formed on a side of the first mounting member facing the first connecting member, and the first through hole is in communication with the first mounting groove; the lifting unit comprises a driving member, a speed reduction member and a lifting member, the driving member and the speed reduction member are arranged in the first mounting groove, an output end of the driving member is connected to the speed reduction member, the lifting member is inserted into the first through hole, one end of the lifting member is connected to the speed reduction member, and the other end of the lifting member is connected to the first connecting member.

5. The sputter cathode of claim 4, wherein The adjusting assembly further comprises a position sensor arranged in the first mounting groove and a controller, the position sensor is located on a side of the lifting member, the position sensor is in communication connection with the controller, and is used for monitoring a position of the lifting member in real time and transmitting real-time data to the controller; the controller is in communication connection with the driving member, used for receiving the real-time data and controlling an action of the driving member.

6. The sputter cathode of claim 3, wherein The adjusting assembly further comprises a first guide member arranged on a side of the first connecting member away from the magnetic rod; the first mounting member is correspondingly provided with a first guide channel for sliding of the first guide member, and the first guide channel is arranged along a direction in which the lifting unit drives the magnetic rod to lift relative to the sputtering target material.

7. The sputter cathode of claim 1, wherein The mounting seat is provided with a second guide channel, the second guide channel is arranged along a direction in which the lifting unit drives the magnetic rod to lift relative the sputtering target material; the adjusting assembly further comprises a second guide member, the second guide member comprises oppositely arranged first and second ends, the first end is connected to the magnetic rod, and the second end is slidingly arranged in the second guide channel.

8. The sputter cathode of claim 1, wherein The sealing pipe body is provided with a plurality of mounting holes, and the plurality of mounting holes are sequentially and spacedly arranged along the axial direction of the sealing pipe body and correspond to the plurality of mounting seats one by one; the mounting seat comprises a second mounting member and a third mounting member, the third mounting member is arranged inside the sealing pipe body, and the second mounting member is arranged outside the sealing pipe body and connected with the third mounting member; the second mounting member is provided with a second mounting groove in communication with the mounting hole, and the third mounting member is provided with a second through hole in communication with the mounting hole, and the mounting space is formed by the second mounting groove, the second through hole and the mounting hole.

9. A cathode mechanism comprising a tip, a support seat and a sputtering cathode according to any one of claims 1-8, wherein the sputtering cathode comprises oppositely arranged third and fourth ends, the third end is detachably connected with the tip, and the fourth end is detachably connected with the support seat.

10. A magnetron sputtering device comprising a vacuum chamber and a cathode mechanism according to claim 9, wherein the sputtering cathode of the cathode mechanism is arranged in the vacuum chamber.

11. A cathode mechanism comprising: a tip comprising a support member and a docking member, an inside of the support member is provided with a first wiring passage in communication with the outside, and the docking member is arranged on one side of the support member and is provided with a plug-in cavity in communication with the first wiring passage; a sputtering cathode comprising a target pipe and a magnet bar joint, the target pipe is detachably connected to one side of the tip, the magnet bar joint is arranged on one end of the target pipe close to the tip and is inserted into the plug-in cavity, and the magnet bar joint is provided with a containing cavity; and a transmission cable, one end of the transmission cable is located outside the tip, the other end of the transmission cable passes through the first wiring passage and is inserted into the containing cavity of the magnet bar joint to be electrically connected with the magnet bar joint, and the transmission cable is used for transmitting power and / or data signals.

12. The cathode mechanism of claim 11, wherein, The transmission cable comprises a cable line body and a connector, the connector is inserted into the containing cavity, one end of the cable line body is located outside the tip, and the other end of the cable line body passes through the first wiring passage and is connected with the connector.

13. The cathode mechanism of claim 11, wherein, An inner wall of the plug-in cavity is provided with a limiting groove arranged along the axial direction, and an outer wall of the magnet bar joint is correspondingly provided with a limiting protrusion, and the limiting protrusion is slidingly arranged in the limiting groove.

14. The cathode mechanism of claim 11, wherein, The docking member comprises a mounting portion and a docking portion, the mounting portion is connected with the support member, and the mounting portion is provided with a second wiring passage in communication with the first wiring passage; the docking portion is arranged on one side of the mounting portion close to the sputtering cathode, and the plug-in cavity is arranged in the docking portion and is in communication with the second wiring passage.

15. The cathode mechanism of claim 14, wherein, The end head further comprises a bearing, a rotating sleeve, a connecting piece and a rotating assembly, the bearing is sleeved outside the butt joint, the rotating sleeve is sleeved outside the bearing, the connecting piece is connected to one end of the rotating sleeve close to the sputtering cathode and detachably connected with the target tube, and the rotating assembly is connected with the rotating sleeve and used to drive the rotating sleeve to rotate relative to the butt joint.

16. The cathode mechanism of claim 15, wherein, The rotating assembly comprises a driving member and a transmission unit, the driving member and the transmission unit are located on the same side of the support, the output end of the driving member is connected with the transmission unit, and the transmission unit is connected with the rotating sleeve.

17. The cathode mechanism of claim 16, wherein, The transmission unit comprises a driving gear and a driven gear, the driving gear is located on one side of the support and connected with the output end of the driving member, the driven gear is arranged on one side of the driving gear close to the butt joint and meshingly connected with the driving gear, and the driven gear is connected with the rotating sleeve.

18. The cathode mechanism of claim 15, wherein, The connecting piece comprises a connecting piece body and an annular protrusion, the connecting piece body is connected to one end of the rotating sleeve close to the sputtering cathode, and the annular protrusion is arranged along the circumference of the connecting piece body and located at one end of the connecting piece body close to the rotating sleeve; one end of the target tube close to the end head is sleeved with a fixing piece, the fixing piece is provided with an accommodating groove arranged along the circumference thereof, and the connecting piece and the fixing piece are connected through the annular protrusion and the accommodating groove.

19. The cathode mechanism of claim 14, wherein, The end head further comprises a conveying pipe and a discharge pipe, the conveying pipe and the discharge pipe are connected with the support respectively; the support is provided with a first conveying pipe and a first discharge pipe arranged along the axial direction of the support, the first conveying pipe is communicated with the conveying pipe, and the first discharge pipe is communicated with the discharge pipe; the mounting portion is provided with a second conveying pipe and a second discharge pipe, the second conveying pipe is communicated with the first conveying pipe, and the second discharge pipe is communicated with the first discharge pipe; the butt joint is provided with a third conveying pipe and a third discharge pipe arranged along the axial direction of the butt joint, the third conveying pipe and the third discharge pipe are oppositely arranged on both sides of the insertion cavity, the third conveying pipe is communicated with the second conveying pipe, and the third discharge pipe is communicated with the second discharge pipe. The sputtering cathode further comprises a sealing tube and a magnetic bar, the sealing tube is arranged inside the target tube and connected with the magnetic bar, the magnetic bar is arranged inside the sealing tube, and the gap between the target tube and the sealing tube forms a cooling channel; the cooling channel is communicated with the third conveying pipe and the third discharge pipe respectively.

20. A magnetron sputtering device, comprising a vacuum chamber and the cathode mechanism according to any one of claims 11 to 19, wherein the sputtering cathode of the cathode mechanism is arranged in the vacuum chamber.

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