A composite electroplated layer and electroplating method and electroplating device
By first electroplating a compatible layer on the conductive terminals and dividing the area, and then using insulating tape to cover the electroplated different functional layers, the problem of insufficient adhesion of the electroplated layer was solved, thus achieving thin-layer composite electroplating and good insertion performance of the conductive terminals.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- DONGGUAN PURUIDE METALS-PLASTICS&PROD CO LTD
- Filing Date
- 2026-05-12
- Publication Date
- 2026-07-17
AI Technical Summary
The existing composite electroplating layer has insufficient adhesion between functional electroplating layers, resulting in a large number of electroplating layers and a large thickness, which affects the insertion performance of conductive terminals.
A compatible electroplating layer is first electroplated onto the front side of a flat substrate, and the electroplating areas are divided. After being covered with insulating tape, different functional electroplating layers are gradually formed. The electroplating layer is then partitioned by an electroplating device.
The total thickness of the electroplating layer is reduced, which improves the adhesion of the conductive terminals and the insertion performance during use, and avoids deformation of the female end.
Smart Images
Figure CN122406322A_ABST