A laser chip far field divergence angle verification device

By using vector prediction and high-frequency closed-loop linkage interpolation technology, the problems of optical axis pointing deviation, sampling strategy and dynamic range matching of the laser chip far-field divergence angle measurement device were solved, and efficient and accurate laser chip far-field divergence angle measurement was achieved.

CN122409149APending Publication Date: 2026-07-17CENT CHINA OPTOELECTRONICS TECH RES INST (CHINA STATE SHIPBUILDING CORP 717TH RES INST) +1

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
CENT CHINA OPTOELECTRONICS TECH RES INST (CHINA STATE SHIPBUILDING CORP 717TH RES INST)
Filing Date
2026-06-04
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing laser chip far-field divergence angle measurement devices suffer from problems such as low testing efficiency due to optical axis pointing deviation, inability to balance efficiency and accuracy with fixed sampling strategies, and difficulty in dynamic range matching.

Method used

By employing vector prediction and high-frequency closed-loop linkage interpolation technology, and through the linkage of Z-axis, X-axis and Y-axis displacement mechanisms, combined with adaptive sampling and dynamic exposure strategies, the linear propagation equation of the laser chip beam in three-dimensional space is calculated and efficient image acquisition is achieved.

Benefits of technology

It enables rapid and accurate measurement of the far-field divergence angle of laser chips, shortens testing time, improves measurement accuracy and efficiency, and adapts to the testing needs of different types of laser chips.

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Abstract

本发明涉及一种激光芯片远场发散角验证装置,包括固定架、Z轴位移机构、X轴位移机构、Y轴位移机构、光束质量分析仪和控制器,固定架用于安装待测的激光芯片;Z轴位移机构与所述固定架相对设置;X轴位移机构安装于所述Z轴位移机构上;Y轴位移机构安装于所述X轴位移机构上;光束质量分析仪安装于所述Y轴位移机构上;控制器的控制端与所述Z轴位移机构、X轴位移机构、Y轴位移机构和光束质量分析仪的受控端电连接。本发明采用矢量预测和高频闭环联动插补,消除了传统方法中的死时间,使单颗芯片的发散角全行程测试时间从常规的数十秒骤降至数秒内,打通了激光芯片从前期研发阶段迈向小批量及规模化量产过程中的检测产能瓶颈。
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