Sample preparation device for testing the tensile shear strength of adhesives based on multidimensional regulation

The multi-dimensionally adjustable sample preparation device solves the problems of insufficient sample preparation efficiency and quality stability in the existing technology for testing the tensile shear strength of adhesives, and realizes efficient and stable sample preparation to meet the testing requirements of different standards.

CN122409306APending Publication Date: 2026-07-17THE 20TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY GROUP CORP

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
THE 20TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY GROUP CORP
Filing Date
2026-04-28
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing equipment for preparing adhesive tensile shear strength test specimens has low production efficiency and quality stability, making it difficult to meet the industrial sector's demand for efficient and stable testing.

Method used

A sample preparation device for tensile shear strength testing of adhesives based on multi-dimensional control is provided, including a sample positioning mechanism, an adhesive layer thickness control component, and a sample pressurization component. The device ensures that the bonding length and width error are within ±0.5 mm through mechanical limiting, and the adhesive layer thickness is continuously adjustable from 0.05 mm to 3.0 mm, which is suitable for sample preparation of different standards.

Benefits of technology

It enables efficient and high-quality preparation of test specimens for standards such as GB/T 7124, GJB 444, and GJB 1709. It can prepare a large number of specimens at a time, with a high specimen pass rate and small deviation in adhesive layer thickness, and can meet the testing needs of different bonding areas.

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Abstract

本申请公开了一种基于多维度调控的胶粘剂拉伸剪切强度测试试样制备装置,包括试样定位机构、胶层厚度调控组件、试验加压组件,其中试样定位机构包括放置试样的托块、调控粘接面长度的定位杆和调控粘接面宽度的限位板,通过机械限位可确保粘接长度和宽度误差满足要求;胶层厚度调控组件由可更换的垫片组成,可实现胶层厚度在一定范围内连续可调,且厚度偏差满足要求。根据本申请实施例,可应用于多个标准不同粘接面积的试样制备,制样效率高、质量稳定性好。
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