Micro-electro-mechanical gas sensor chip preparation method and chip
By optimizing the linewidth and connection method of the heating electrodes, and combining neural network models and multiphysics coupling simulation, the problem of temperature field non-uniformity in microelectromechanical gas sensors was solved, achieving hardware signal output with zero software compensation, reducing power consumption and improving chip consistency and reliability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHENZHEN ZHIXIN WEINA TECH CO LTD
- Filing Date
- 2026-04-07
- Publication Date
- 2026-07-17
AI Technical Summary
Existing MEMS gas sensors suffer from high power consumption due to software compensation issues caused by uneven temperature field distribution on the surface of micro-hot plates, which cannot meet the extreme energy efficiency requirements of passive IoT or micro wearable devices.
By collaborating across the entire process of design, manufacturing, testing, and circuit solidification, and by employing random key coding and evolutionary algorithms to optimize the linewidth and connection method of the heating electrodes, combined with neural network models and multiphysics coupling simulation, hardware signal output with zero software compensation is achieved.
This achieves microwatt-level power consumption reduction, ensuring chip consistency and reliability, and avoiding energy efficiency losses caused by high-power software algorithms.
Smart Images
Figure CN122409765A_ABST