A PCB circuit board and a manufacturing method thereof
By vertically embedding differential dual-line functional blocks on the PCB circuit board, an interlayer parallel differential structure is constructed, which solves the signal transmission delay problem caused by the non-parallel arrangement of differential dual lines and realizes stable transmission and high integrity of high-speed signals.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- WUS PRINTED CIRCUIT (KUNSHAN) CO LTD
- Filing Date
- 2026-06-04
- Publication Date
- 2026-07-17
AI Technical Summary
Existing PCB circuit boards suffer from signal transmission delay and poor signal integrity due to the non-parallel arrangement of differential dual lines, making it difficult to meet the transmission requirements of ultra-high-speed signals.
By employing a differential dual-line function block, the first and second signal layers are vertically embedded on the mounting surface of the PCB circuit board. The high-speed lines on the two signal layers have overlapping projections, the same shape, and are equidistant. A common shield line is set on both sides of the high-speed line to construct an interlayer parallel differential structure, avoiding the problems of bent traces and trace width necking.
It achieves parallel paths for differential bi-line transmission, eliminates signal delay, ensures signal integrity, reduces signal crosstalk and impedance abrupt changes, and improves the stability and reliability of signal transmission.
Smart Images
Figure CN122421189A_ABST