Carrier, chip packaging apparatus, and method

Abstract

The present disclosure relates to the technical field of semiconductor, and particularly relates to a carrier, a chip packaging device and a method. The carrier comprises a placing part, the placing part is provided with a plurality of first placing positions, each first placing position is provided with a through hole and a control valve, the control valve is configured to make the through hole in the corresponding first placing position communicate with or disconnect from a vacuum source, and each control valve is independently opened or closed. In use, the chip can be placed on the first placing position, the chips on different first placing positions are independent of each other, all the control valves are opened, so that all the chips are adsorbed and fixed on the corresponding first placing positions; when a target chip needs to be picked up, the control valve corresponding to the target chip can be closed, so that the through hole is disconnected from the vacuum source, to release the vacuum adsorption state of the target chip, realize low-stress grabbing of the chip, and reduce the risk of chip damage.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor technology, and in particular to a carrier, chip packaging equipment and method. Background Technology

[0002] In the DBG (Dicing Before Grinding) process, all the chips need to be carried by a dicing film, and then the chips attached to the dicing film are individually removed by a suction nozzle and placed on the surface of the packaging substrate.

[0003] However, during the chip picking process, a top block or top pin is needed to apply force to the target chip, lifting it from the bottom and then adsorbing it through a vacuum nozzle. At this time, a certain stress will be generated on the target chip and adjacent chips, which can easily damage the chip and cause cracks during the operation. Summary of the Invention

[0004] The purpose of this disclosure is to provide a carrier, chip packaging equipment and method to reduce the risk of chip damage.

[0005] To achieve the above objectives, this disclosure provides a carrier including a placement section, the placement section having a plurality of first placement positions, each first placement position having a through hole and a control valve, the control valve being configured to connect or disconnect the through hole on the corresponding first placement position from a vacuum source, and each control valve being individually opened or closed.

[0006] In one embodiment of this disclosure, the placement portion is provided with a first groove, which is located between two adjacent first placement positions.

[0007] In one embodiment of this disclosure, there are multiple through holes, and the multiple through holes are arranged in rows and columns at the first placement position.

[0008] In one embodiment of this disclosure, the carrier is provided with a positioning mating part, which is used to mate with the positioning part of the workpiece.

[0009] In one embodiment of this disclosure, the positioning mating part includes a protrusion, and the positioning part of the workpiece is a recess.

[0010] In one embodiment of this disclosure, the recess is a notch provided at the edge of the workpiece; the carrier further includes a circumferential sidewall connected to the placement portion to form a placement space, and the protrusion is provided on the inner surface of the circumferential sidewall.

[0011] In one embodiment of this disclosure, the placement portion is used to place a workpiece, the workpiece having a first surface and a second surface, the first surface being detachably provided with a first adhesive layer, the second surface being provided with a second adhesive layer, the workpiece comprising a plurality of independent sub-components, each of the plurality of independent sub-components being fixed between the first adhesive layer and the second adhesive layer, with a gap between adjacent two independent sub-components; wherein, the placement portion is used to contact the second adhesive layer; a plurality of first placement positions are used to correspond one-to-one with the plurality of independent sub-components, wherein, the first adhesive layer is separable from the workpiece when the through hole and the vacuum source are connected, so that the portion of the second adhesive layer exposed in the gap can be cut.

[0012] To achieve the above objectives, this disclosure provides a chip packaging apparatus, including a vacuum device and a carrier according to any one of the claims, wherein the carrier is mounted on the vacuum device, a first placement position is used to place a chip, the vacuum device is used to adsorb all chips onto the corresponding first placement position, and the vacuum source of the vacuum device is disconnectable from the through-hole corresponding to the chip to be grasped.

[0013] In one embodiment of this disclosure, the vacuum device includes a worktable with a plurality of second placement positions, each of which corresponds to a plurality of first placement positions. Each of the plurality of second placement positions is provided with an air extraction hole, which is connected to or disconnected from the through hole via the control valve.

[0014] In one embodiment of this disclosure, the chip packaging apparatus further includes a flipping device configured to flip the carrier by a predetermined angle, or the flipping device configured to flip the chip by a predetermined angle.

[0015] To achieve the above objectives, this disclosure provides a chip packaging method applied to the aforementioned chip packaging equipment. The chip packaging method includes: providing a plurality of chips fixed on a first adhesive layer; bonding a second adhesive layer to the side of the plurality of chips away from the first adhesive layer; adsorbing and fixing the plurality of chips with the second adhesive layer attached to a carrier, wherein the second adhesive layer contacts the placement portion, and the plurality of chips correspond one-to-one with a plurality of first placement positions; removing the first adhesive layer; cutting the second adhesive layer through the gap between two adjacent chips to separate the two adjacent chips; placing the carrier carrying the plurality of chips in a vacuum device, the vacuum device adsorbing all the chips onto the placement portion, and a control valve disconnecting the through-hole corresponding to the chip to be grasped from the vacuum source of the vacuum device.

[0016] In one embodiment of this disclosure, adsorbing and fixing multiple chips with a second adhesive layer to a carrier includes: placing the carrier above the second adhesive layer; and adsorbing and fixing the multiple chips.

[0017] In one embodiment of this disclosure, before removing the first adhesive layer, the method further includes: flipping the carrier on which multiple chips are adsorbed and fixed at a set angle so that the first adhesive layer faces a set position.

[0018] In one embodiment of this disclosure, the set angle is 180°.

[0019] In one embodiment of this disclosure, adsorbing and fixing multiple chips with a second adhesive layer to a carrier includes: placing multiple chips with a second adhesive layer on top of the carrier, wherein the second adhesive layer is close to the carrier; and adsorbing and fixing the multiple chips.

[0020] In one embodiment of this disclosure, providing a plurality of chips fixed on a first adhesive layer includes: providing a wafer including a first surface and a second surface; dicing the wafer to form a second groove on the first surface; bonding the first adhesive layer to the first surface of the wafer; and grinding the second surface of the wafer to thin the wafer, the thinning thickness being not less than the distance between the bottom of the second groove and the second surface, so as to divide the wafer into a plurality of chips.

[0021] The main beneficial effects of this disclosure are:

[0022] The carrier provided in this disclosure can place chips on the first placement positions during use. Chips in different first placement positions are independent of each other. All control valves are opened so that all chips are adsorbed and fixed on their respective first placement positions. When it is necessary to pick up the target chip, the control valve corresponding to the target chip can be closed so that the through hole is disconnected from the vacuum source, thereby releasing the vacuum adsorption state of the target chip, realizing low-stress chip gripping, and reducing the risk of chip damage.

[0023] The chip packaging equipment provided in this disclosure, and the chip packaging equipment provided in this embodiment, use the carrier provided in this embodiment. Before placing the chip on the packaging substrate, the chip can be placed on the first placement position. The chips on different first placement positions are independent of each other. All control valves are opened so that all chips are adsorbed and fixed on the corresponding first placement positions. When it is necessary to pick up the target chip, the vacuum source of the vacuum device is disconnected from the through hole corresponding to the chip to be picked up, so as to release the vacuum adsorption state of the target chip, realize low-stress chip picking, and reduce the risk of chip damage.

[0024] The chip packaging method provided in this disclosure, and the chip packaging method provided in this embodiment, are applied to the chip packaging equipment provided in this embodiment. A second adhesive layer is bonded to the side of multiple chips away from the first adhesive layer. The multiple chips with the second adhesive layer bonded are adsorbed and fixed to a carrier. Then, the first adhesive layer is removed to expose the gap between two adjacent chips. The second adhesive layer is cut through the gap to completely separate the two adjacent chips. The carrier carrying multiple chips is placed in a vacuum device. The vacuum device adsorbs all the chips into the placement part. When it is necessary to pick up the target chip, the vacuum source of the vacuum device is disconnected from the through hole corresponding to the target chip to be picked up, so as to release the vacuum adsorption state of the target chip, realize low-stress picking, and reduce the risk of chip damage. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the specific embodiments of this disclosure or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0026] Figure 1 A top view of the vehicle provided in an embodiment of this disclosure;

[0027] Figure 2 for Figure 1 A sectional view along line AA;

[0028] Figure 3 for Figure 2 A magnified view of a section at point B in the middle;

[0029] Figure 4 A top view of the worktable in the vacuum apparatus provided in an embodiment of this disclosure;

[0030] Figure 5 for Figure 4 A cross-sectional view along the CC line;

[0031] Figure 6 This is a cross-sectional view of a wafer with a first adhesive layer and a second adhesive layer bonded together in an embodiment of this disclosure;

[0032] Figure 7 A flowchart of a chip packaging method provided in this disclosure embodiment;

[0033] Figures 8A to 16 This is a schematic diagram showing the state of a chip packaging method according to some embodiments of the present disclosure after certain steps have been performed. Detailed Implementation

[0034] The technical solutions of this disclosure will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of this disclosure, not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0035] Generally, terms can be understood, at least in part, based on their use in context. For example, the term "one or more," depending at least in part on the context, can be used to describe any feature, structure, or characteristic in the singular or in the plural form to describe a combination of features, structures, or characteristics. Similarly, terms such as "a" or "described" in this document can also be understood, at least in part on the context, to convey either a singular or plural usage. Furthermore, the term "based on" can be understood not necessarily to convey an exclusive set of factors, but rather to allow for the presence of additional factors that are not necessarily explicitly described, again, depending at least in part on the context.

[0036] It should be readily understood that, in the description of this disclosure, it is necessary to clarify that the meanings of “on,” “above,” and “above” should be interpreted in the broadest sense, such that “on” not only means “directly on” something, but also includes the meaning of being “on” something with an intermediate feature or layer between them. Furthermore, “above” or “above” not only means “on” or “above” something, but can also include it being “on” or “above” something without an intermediate feature or layer between them (i.e., directly on something).

[0037] Furthermore, for ease of description, this document uses spatially relative terms such as "below," "below," "lower layer," "above," "upper layer," etc., to describe the relationship between one element or feature and another element or feature as shown in the figure. Spatially related terms are intended to include different orientations of the device in use or process steps (in addition to the orientation shown in the figure). The device may be oriented in other directions (rotated 90 degrees or in other orientations), and the spatially related descriptors used herein can be interpreted accordingly.

[0038] See Figures 1 to 3 As shown, this embodiment provides a carrier 1, including a placement part 11. The placement part 11 is provided with a plurality of first placement positions 111. Each first placement position 111 is provided with a through hole 1111 and a control valve 1112. The control valve 1112 is configured to connect or disconnect the through hole 1111 on the corresponding first placement position 111 from a vacuum source. Each control valve 1112 is opened or closed individually.

[0039] For example, Figure 1The part within the dashed box can represent a first placement position 111.

[0040] The carrier provided in this embodiment can place chips on the first placement positions during use. Chips in different first placement positions are independent of each other. All control valves are opened so that all chips are adsorbed and fixed on their respective first placement positions. When it is necessary to pick up the target chip, the control valve corresponding to the target chip can be closed so that the through hole is disconnected from the vacuum source, thereby releasing the vacuum adsorption state of the target chip, realizing low-stress chip gripping, and reducing the risk of chip damage.

[0041] Of course, when it is necessary to pick up the target chip, other methods can be used to disconnect the via from the vacuum source, as long as the vacuum adsorption state of the target chip can be released. For example, each first placement position is connected to an independent vacuum source, and all control valves and all vacuum sources are opened, so that all chips are adsorbed and fixed on the corresponding first placement position, and all control valves can always be kept open; when it is necessary to pick up the target chip, the vacuum source corresponding to the target chip can be closed to release the vacuum adsorption state of the target chip, realize low-stress chip gripping, and reduce the risk of chip damage.

[0042] It should be understood that the individual opening or closing of each control valve means that each control valve can be controlled independently. For example, all control valves can be opened or closed simultaneously, or some valves can be opened while others are closed. Alternatively, each control valve can be opened or closed one by one in a set sequence.

[0043] For example, control valves can take many forms. One example is a gravity-operated valve that closes by gravity, while another is open when a raised structure at the bottom of the valve lifts the valve disc. Alternatively, control valves can be other suitable types of electrically controlled valves.

[0044] In one embodiment, the placement section is used to place the workpiece, see [reference] Figure 6 As shown, the workpiece has a first surface 3101 and a second surface 3102. The first surface 3101 is detachably provided with a first adhesive layer 32, and the second surface 3102 is provided with a second adhesive layer 33. The workpiece includes multiple independent sub-components, all of which are fixed between the first adhesive layer 32 and the second adhesive layer 33. There is a gap 3111 between two adjacent independent sub-components. The placement part 11 is used to contact the second adhesive layer 33. Multiple first placement positions 111 are used to correspond one-to-one with the multiple independent sub-components. The first adhesive layer 32 can be separated from the workpiece when the through hole 1111 is connected to the vacuum source, so that the part of the second adhesive layer 33 exposed in the gap 3111 can be cut.

[0045] The workpiece can be, but is not limited to, a wafer. This embodiment uses wafer 31 as an example to describe the carrier in detail.

[0046] In the DBG (Dicing Before Grinding) process, as shown in Figure 8, blade 41 can be used to cut along the dicing path of wafer 31. The cutting depth does not penetrate wafer 31, and after cutting, wafer 31 remains a single unit, not split into individual chips. Figure 9 As shown, a first adhesive layer 32, such as polishing tape, is applied to the first surface 3101 of the wafer 31. This tape is used to protect the first surface 3101 of the wafer 31. Then, the second surface 3102 of the wafer is polished, causing the wafer to separate into multiple individual chips 311. At this point, see... Figure 11 As shown, each individual chip 311 is connected together by a first adhesive layer 32, with a gap 3111 between adjacent chips 311. Then, a second adhesive layer 33, such as die-attach film (DAF), is applied to the side of the chip facing away from the first adhesive layer 32. See [link to documentation]. Figure 12 As shown, multiple chips 311 are fixed between the first adhesive layer 32 and the second adhesive layer 33 to form an integral structure 31A.

[0047] Therefore, the wafer used for placement on the placement section is a diced wafer, which includes multiple individual chips, meaning that each individual component can be a single chip. During wafer placement, the second adhesive layer 33 is brought into contact with the placement section 11.

[0048] For example, during the production of the carrier, the size of the placement part and the size and arrangement of the first placement position 111 can be determined according to the size of the wafer to be carried and the size and arrangement of the individual chips, so as to ensure that each chip can be individually adsorbed or released.

[0049] When the overall structure 31A is placed on the placement part 11, each chip can correspond to the corresponding first placement position 111.

[0050] As mentioned earlier, the first adhesive layer 32 can be abrasive tape. To remove the abrasive tape, the through-hole 1111 can be connected to a vacuum source to adsorb and fix the chip 311 with the second adhesive layer attached onto the carrier. Then, the first adhesive layer is removed. At this time, the gap 3111 between two adjacent chips 311 is exposed. The portion of the second adhesive layer 33 exposed to the gap 3111 can be cut. After cutting, the second adhesive layer 33 is divided into multiple sub-layers 331, see [reference]. Figure 16 As shown, each chip 311 has a sub-layer 331 attached to its second surface to form an independent chip structure, which is then placed on a packaging substrate for packaging.

[0051] It should be noted that a carrier is used to support a workpiece (such as a wafer), but the carrier does not include the workpiece; that is, the workpiece is not part of the carrier.

[0052] In some embodiments, the DBG process also requires attaching a dicing film to the DAF. After peeling off the polishing tape, the DAF is cut to separate the DAF on the back of each chip. At this point, all the chips need to be supported by the dicing film, and then the chips attached to the dicing film are individually removed using a suction nozzle and placed on the surface of the packaging substrate. The dicing film is a consumable, while the carrier can be recycled. Using a carrier to support the chips can eliminate the need for the dicing film, which can reduce production costs to some extent.

[0053] See Figure 15 As shown, when cutting the second adhesive layer 33, a cutting device (such as a laser cutter 42) can be used to cut the second adhesive layer 33. During cutting, the second adhesive layer 33 will be melted by the laser. To prevent the molten second adhesive layer from sticking to the surface of the placement part 11, see [reference needed]. Figure 2 and Figure 3 As shown, the placement part 11 is provided with a first groove 112, which is located between two adjacent first placement positions 111.

[0054] When the overall structure 31A is placed on the placement part 11, the gap 3111 between two adjacent chips 311 can correspond to the first groove 112. When the laser cuts the second adhesive layer 33 through the gap 3111, the cut part is in a suspended state and does not contact the placement part 11, so the molten second adhesive layer will not stick to the surface of the placement part 11.

[0055] Typically, the width of the first groove 112 is not less than the width of the gap 3111. For example, the width of the first groove 112 is less than or equal to 1.5 times the width of the gap.

[0056] In one embodiment, each first placement position 111 has multiple through holes 1111, and the multiple through holes 1111 are arranged in rows and columns in the first placement position 111.

[0057] By arranging multiple through holes 1111 in rows and columns at the first placement position 111, stress is more dispersed under vacuum adsorption, reducing the risk of chip edge warping.

[0058] For example, the number and arrangement of vias on the first placement position with the same size and structure can be identical, which facilitates manufacturing. When arranging the vias, efforts should be made to ensure that the stress on the chip is more dispersed under vacuum adsorption conditions.

[0059] In one embodiment, the carrier 1 is provided with a positioning mating part, which is used to mate with the positioning part of the workpiece. This facilitates the accurate placement of the workpiece on the placement part.

[0060] For example, see Figure 1 As shown, the positioning and mating part includes a protrusion 121, and the positioning part of the workpiece is a recess.

[0061] In this embodiment, the workpiece is a wafer, and the edge of the wafer is usually provided with a notch; the carrier 1 also includes a circumferential sidewall 12, which is connected to the placement part 11 to form a placement space, and the protrusion 121 is provided on the inner surface of the circumferential sidewall 12.

[0062] See Figure 1 and Figure 2 As shown, the placement part can generally be a circular plate structure with a circumferential tube-shaped circumferential sidewall. The circumferential sidewall can be welded to the placement part, or it can be detachably connected by a structure such as a snap-fit, or it can be integrally formed. For example, the axial length of the circumferential sidewall can be less than the inner diameter of the circumferential sidewall, which facilitates the placement of the entire structure 31A within the placement space.

[0063] The outline of the protrusion 121 can be adapted to the sidewall outline of the notch. For example, the outline shape of the protrusion 121 can be triangular or fan-shaped.

[0064] This embodiment also provides a chip packaging device, including a vacuum device 2 and a carrier 1 provided in this embodiment. The carrier 1 is installed on the vacuum device 2. The first placement position 111 is used to place the chip. The vacuum device 2 is used to adsorb all the chips onto the corresponding first placement position 111. The vacuum source of the vacuum device 2 can be disconnected from the through hole 1111 corresponding to the chip to be grasped.

[0065] The chip packaging equipment provided in this embodiment uses the carrier provided in this embodiment. Before placing the chip on the packaging substrate, the chip can be placed on the first placement position. The chips on different first placement positions are independent of each other. All control valves are opened so that all chips are adsorbed and fixed on the corresponding first placement position. When it is necessary to pick up the target chip, the vacuum source of the vacuum device 2 is disconnected from the through hole 1111 corresponding to the chip to be picked up, so as to release the vacuum adsorption state of the target chip, realize low-stress chip picking, and reduce the risk of chip damage.

[0066] In one embodiment, see Figure 4 and Figure 5 As shown, the vacuum device 2 includes a worktable 21, which has multiple second placement positions 211, each of which has an air extraction port 2111. Figure 4 The dashed box in the image indicates the second placement position 211; see also Figure 16 As shown, when the carrier 1 is placed on the worktable 21, multiple second placement positions 211 can correspond one-to-one with multiple first placement positions 111. The evacuation port 2111 and the through hole 1111 are connected or disconnected through the control valve 1112. The vacuum device may also include a vacuum pump (not shown in the figure), which is connected to the evacuation port 2111 through a pipeline (not shown in the figure). When the vacuum pump is working, it can evacuate air to form a vacuum, causing all the chips to be adsorbed onto the corresponding first placement position 111.

[0067] For example, each second placement position 211 is provided with an air extraction hole 2111, which facilitates production and processing.

[0068] It should be noted that after wafer dicing, the chips near the wafer edge are not perfectly rectangular; these chips are disposed of as scrap. Therefore, see [link to relevant documentation]. Figure 4 As shown, the second placement positions on the worktable 21 can be simply rectangular placement positions, corresponding one-to-one with the rectangular first placement positions 111. When all the second placement positions 211 correspond one-to-one with all the first placement positions 111, the vent 2111 can also be only located in the rectangular second placement positions 211, while the non-rectangular second placement positions 211 near the edge of the worktable may not have vents. In this case, non-rectangular chips will not be attracted to the corresponding first placement position 111.

[0069] It should be understood that there are at least two ways to disconnect the vacuum source of vacuum device 2 from the through-hole 1111 corresponding to the chip to be grasped. The first way is that when the control valve is an electrically controlled valve, the control valve corresponding to the target chip can be closed, thus disconnecting the through-hole from the vacuum source. When the first way is adopted, a connection port can be set on the worktable, with one end of the pipeline connected to the vacuum pump and the other end of the pipeline connected to all the evacuation ports 2111 through the connection port.

[0070] The second method involves setting a protruding structure (not shown in the figure) at the second placement position 211 when the control valve is a gravity-controlled valve. For example, the protruding structure can be an annular protrusion connected to the air extraction port. When the carrier is placed on the worktable, each protruding structure can open its corresponding control valve, keeping the through hole connected to the air extraction port. In this case, the pipeline can include a main pipeline and multiple branch pipelines. One end of the main pipeline is connected to the vacuum pump, and the other end can be connected to multiple branch pipelines via a gas distributor. For example, the gas distributor includes a main connector and multiple sub-connectors. The main connector is connected to the other end of the main pipeline. In the adsorption state, the multiple sub-connectors are connected to multiple branch pipelines one-to-one. Each sub-connector is equipped with a branch valve. In the adsorption state, all branch valves are open. When it is necessary to pick up the target chip, the corresponding branch valve is closed, thereby cutting off the vacuum source corresponding to the target chip to be picked up.

[0071] In one embodiment, the chip packaging apparatus further includes a flipping device configured to flip the carrier 1 by a set angle.

[0072] In some embodiments, the flipping device may include a frame, a motor, a rotating shaft, and a support unit. The motor is mounted on the frame, the rotating shaft is mounted on the frame via bearings, and the support unit is fixedly mounted on the rotating shaft. The support unit includes a support plate with a clamp. A carrier is placed on the support plate, and the clamp is used to fix the carrier on the support plate. The power output shaft of the motor is connected to the rotating shaft to drive the rotating shaft to rotate around its own axis, thereby causing the support plate and the carrier to flip by a set angle.

[0073] It should be noted that the structure of the flipping device is not limited to the one mentioned above; any device that can achieve the flipping function is acceptable.

[0074] For example, before placing the overall structure 31A, consisting of the second adhesive layer 33, the first adhesive layer 32, and a plurality of individual chips fixed between them, onto the carrier, with the second adhesive layer 33 on top, the carrier can be placed upside down on the overall structure 31A, with the placement part 11 facing the second adhesive layer 33. Then, a vacuum is drawn to adsorb and fix the overall structure 31A onto the placement part 11. At this time, a flipping device is used to flip the carrier at a set angle, for example, the set angle can be 180°. After flipping, the first adhesive layer is on top, so that the first adhesive layer 32 can be peeled off.

[0075] In other embodiments, the flipping device can also be used to flip the chip by a set angle. Specifically, the overall structure 31A is first flipped by the flipping device by a set angle, for example, the set angle can be 180°. At this time, the second adhesive layer 33 is located below. Then, the flipped overall structure 31A is placed on the carrier, wherein the second adhesive layer 33 is in contact with the placement part 11.

[0076] Before transferring the carrier and the chips on it to the worktable, all control valves can be closed to lock the vacuum. This ensures that the chips are adsorbed and fixed on the carrier even after the carrier leaves the vacuum source.

[0077] See Figure 7 As shown, this embodiment also provides a chip packaging method, applied to the chip packaging equipment provided in this embodiment. The chip packaging method includes:

[0078] Step S702: Provide a plurality of chips 311 fixed on the first adhesive layer 32;

[0079] Step S704: A second adhesive layer 33 is bonded to the side of the plurality of chips 311 away from the first adhesive layer 32;

[0080] Step S706: A plurality of chips 311 with the second adhesive layer 33 bonded to them are adsorbed and fixed to the carrier 1, wherein the second adhesive layer 33 is in contact with the placement part 11, and the plurality of chips 311 correspond one-to-one with the plurality of first placement positions 111.

[0081] Step S708: Remove the first adhesive layer 32;

[0082] Step S710: Cut the second adhesive layer 33 through the gap 3111 between two adjacent chips 311 to separate the two adjacent chips 311.

[0083] In step S712, the carrier 1 carrying multiple chips is placed in the vacuum device 2. The vacuum device 2 adsorbs all the chips onto the placement part 11. The vacuum source of the vacuum device 2 can be disconnected from the through hole 1111 corresponding to the chip to be grasped.

[0084] The chip packaging method provided in this embodiment is applied to the chip packaging equipment provided in this embodiment. A second adhesive layer 33 is bonded to the side of multiple chips 311 away from the first adhesive layer 32. The multiple chips 311 with the second adhesive layer 33 bonded are adsorbed and fixed to the carrier 1. Then, the first adhesive layer 32 is removed to expose the gap 3111 between two adjacent chips 311. The second adhesive layer 33 is cut through the gap 3111 to completely separate the two adjacent chips 311. The carrier 1 carrying multiple chips is placed in the vacuum device 2. The vacuum device 2 adsorbs all the chips into the placement part 11. When it is necessary to pick up the target chip, the vacuum source of the vacuum device 2 is disconnected from the through hole 1111 corresponding to the target chip to be picked up, so as to release the vacuum adsorption state of the target chip, realize low-stress picking, and reduce the risk of chip damage.

[0085] In addition, using a carrier to hold the chip can eliminate the need for the existing cutting membrane, which can reduce production costs to some extent.

[0086] It should be noted that, Figure 13 The number and arrangement of the first placement positions of the vehicle shown in the figure are similar to Figure 1 The images shown can be the same. Of course, they can also be different.

[0087] It should be understood that, Figure 7 The steps shown are not exclusive; other steps may be performed before, after, or between any of the steps shown. Figure 7 The steps shown can be adjusted in order according to actual needs. Figures 8A to 16 This is a schematic diagram showing the state of a chip packaging method according to some embodiments of the present disclosure after certain steps have been performed.

[0088] In step S702, providing a plurality of chips 311 fixed on the first adhesive layer 32 includes: providing a wafer 31, the wafer 31 including a first surface 3101 and a second surface 3102; cutting the wafer 31 to form a second groove 31011 on the first surface 3101; bonding the first adhesive layer 32 to the first surface 3101 of the wafer 31; and grinding the second surface 3102 of the wafer 31 to thin the wafer, the thinning thickness being not less than the distance between the bottom of the second groove and the second surface, so as to divide the wafer 31 into a plurality of chips 311.

[0089] Specifically, see Figure 6 As shown, the provided wafer 31 includes a substrate 310a and a circuit layer 310b located on one side of the substrate. A second surface 3102 is the surface of the substrate 310a facing away from the circuit layer 310b, and a first surface 3101 is the surface of the circuit layer 310b facing away from the substrate 310a. (See also...) Figure 8A As shown, the first surface has a cutting groove, and a blade 41 is used to cut along the cutting groove. See [reference needed]. Figure 8B As shown, a second groove 31011 is formed on the first surface 3101. The depth of the second groove 31011 penetrates the circuit layer 310b and extends to the substrate 310a, but does not penetrate the substrate 310a. After dicing, the wafer 31 remains a single unit and is not split into individual chips; then see... Figure 9 As shown, a first adhesive layer 32, such as polishing tape, is applied to the first surface 3101 of wafer 31. This tape is used to protect the first surface 3101 of wafer 31; then chemical mechanical polishing is performed, see [link to documentation]. Figure 8B and Figure 10 As shown, grinding the second surface 3102 of the wafer thins the substrate, and the thinning thickness is not less than the distance d between the bottom of the second groove 31011 and the second surface 3102, thereby separating the wafer 31 into multiple individual chips 311. See also... Figure 11 As shown, each individual chip is connected together by the first adhesive layer 32.

[0090] In step S704, see Figure 12 As shown, a second adhesive layer 33, such as a die-attach film (DAF), is bonded to the side of the plurality of chips 311 away from the first adhesive layer 32. In this case, the plurality of chips 311 are fixed between the first adhesive layer 32 and the second adhesive layer 33, with a gap 3111 between adjacent chips. The overall structure 31A consists of the second adhesive layer 33, the first adhesive layer 32, and the plurality of chips 311 fixed between them.

[0091] In some embodiments of step S706, see Figure 13 As shown, the process of adsorbing and fixing multiple chips 311 with the second adhesive layer 33 onto the carrier 1 includes: placing the carrier 1 above the second adhesive layer 33; and adsorbing and fixing the multiple chips 311.

[0092] Normally, during chemical mechanical polishing, the grinding head is above the second surface 3102. After grinding, the second surface 3102 is still facing upwards. After the second adhesive layer 33 is bonded, the second adhesive layer 33 is located at the top. At this time, the carrier can be inverted from top to bottom on the overall structure 31A, with the placement part 11 facing the second adhesive layer 33. Then, a vacuum is drawn to adsorb and fix the overall structure 31A to the placement part 11.

[0093] At this time, since the carrier 1 is above and the first adhesive layer 32 is located inside the circumferential sidewall and facing downward, some exemplary processes before removing the first adhesive layer 32 also include: using a flipping device to flip the carrier 1, which has multiple chips 311 adsorbed and fixed, by a set angle so that the first adhesive layer 32 faces the set position.

[0094] For example, the angle is set to 180° so that the first adhesive layer 32 is on top, making it easy to peel off.

[0095] In some embodiments of step S706, the plurality of chips 311 with the second adhesive layer 33 bonded to them are adsorbed and fixed to the carrier 1, including: placing the plurality of chips 311 with the second adhesive layer 33 bonded to them on top of the carrier 1, wherein the second adhesive layer 33 is close to the carrier 1; and adsorbing and fixing the plurality of chips 311.

[0096] Specifically, the overall structure 31A is first flipped by a flipping device to a set angle, for example, the set angle can be 180°, and then the flipped overall structure 31A is placed on the carrier, wherein the second adhesive layer 33 is in contact with the placement part 11.

[0097] At this point, the first adhesive layer 32 is on top, making it easy to peel off.

[0098] In step S710, the second adhesive layer 33 is cut through the gap 3111 between two adjacent chips 311 to separate the two adjacent chips 311.

[0099] Specifically, see Figure 14 As shown, after removing the first adhesive layer, the gap 3111 between two adjacent chips is exposed, and the portion of the second adhesive layer 33 exposed to the gap 3111 can be cut. For example, see [link to example]. Figure 15 As shown, the second adhesive layer 33 can be cut using a laser cutting machine 42. After cutting, the second adhesive layer 33 is divided into multiple sub-layers 331, and a sub-layer 331 is attached to the second surface of each chip to form an independent chip structure.

[0100] In step S712, the carrier 1 carrying multiple chips is placed in the vacuum device 2. The vacuum device 2 adsorbs all the chips onto the placement part 11. The vacuum source of the vacuum device 2 can be disconnected from the through hole 1111 corresponding to the chip to be grasped.

[0101] The following detailed explanation uses an electrically controlled valve as an example.

[0102] Before transferring the carrier and the chip structure on the carrier to the worktable 21 of the vacuum device 2, all control valves can be closed to lock the vacuum. This ensures that the chip structure is adsorbed and fixed on the placement part 11 of the carrier 1 after the carrier leaves the vacuum source.

[0103] When transferring the carrier and the chip structure on the carrier to the worktable 21 of the vacuum device 2, the vacuum pump and all control valves can be turned on so that all the chip structures are in an adsorption state. When it is necessary to grab the target chip, the control valve corresponding to the target chip is closed so that the through hole corresponding to the target chip is disconnected from the air extraction hole.

[0104] At this point, a gripping device 5 (e.g., a suction nozzle) can be used to remove the target chip from the carrier and place it on the packaging substrate, facilitating subsequent chip packaging. The structure and working principle of the gripping device are well-understood and easily implemented by those skilled in the art, and therefore will not be described in detail in this embodiment.

[0105] It should be noted that the target chip and the chip structure have the same structure, including chip 311 and sub-layer 331.

[0106] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this disclosure.

Claims

1. A vehicle, characterized in that, The device includes a placement section, which has multiple first placement positions. Each first placement position has a through hole and a control valve. The control valve is configured to connect or disconnect the through hole on its corresponding first placement position from a vacuum source. Each control valve can be opened or closed individually.

2. The vehicle according to claim 1, characterized in that, The placement part is provided with a first groove, which is located between two adjacent first placement positions.

3. The vehicle according to claim 1, characterized in that, The number of through holes is multiple, and the multiple through holes are arranged in rows and columns at the first placement position.

4. The vehicle according to claim 1, characterized in that, The carrier is provided with a positioning and mating part, which is used to mate with the positioning part of the workpiece.

5. The vehicle according to claim 4, characterized in that, The positioning and mating part includes a protrusion, and the positioning part of the workpiece is a recess.

6. The vehicle according to claim 5, characterized in that, The recessed portion is a notch provided at the edge of the workpiece; the carrier also includes a circumferential sidewall, which is connected to the placement portion to form a placement space, and the protrusion is provided on the inner surface of the circumferential sidewall.

7. The vehicle according to any one of claims 1 to 6, characterized in that, The placement part is used to place a workpiece, the workpiece having a first surface and a second surface, the first surface being detachably provided with a first adhesive layer, the second surface being provided with a second adhesive layer, the workpiece comprising a plurality of independent sub-components, the plurality of independent sub-components being fixed between the first adhesive layer and the second adhesive layer, with a gap between adjacent two independent sub-components; wherein, the placement part is used to contact the second adhesive layer; Multiple first placement positions are used to correspond one-to-one with multiple independent sub-components, wherein the first adhesive layer is capable of separating from the workpiece when the through hole and the vacuum source are connected, so that the portion of the second adhesive layer exposed in the gap can be cut.

8. A chip packaging device, characterized in that, The device includes a vacuum device and a carrier according to any one of claims 1 to 7, the carrier being mounted on the vacuum device, the first placement position being used to place a chip, the vacuum device being used to adsorb all the chips onto the corresponding first placement position, and the vacuum source of the vacuum device being disconnectable from the through-hole corresponding to the chip to be gripped.

9. The chip packaging equipment according to claim 8, characterized in that, The vacuum device includes a worktable with multiple second placement positions, each corresponding to a first placement position. Each second placement position is provided with an air extraction hole, which is connected to or disconnected from the through hole via a control valve.

10. The chip packaging equipment according to claim 8, characterized in that, It also includes a flipping device configured to flip the carrier by a set angle, or the flipping device configured to flip the chip by a set angle.

11. A chip packaging method, characterized in that, The chip packaging method, applied to any one of claims 8 to 10, comprises: Provides multiple chips fixed on the first adhesive layer; A second adhesive layer is bonded to the side of the plurality of chips away from the first adhesive layer; Multiple chips with a second adhesive layer attached are adsorbed and fixed onto a carrier, wherein the second adhesive layer is in contact with the placement part, and the multiple chips correspond one-to-one with the multiple first placement positions; Remove the first adhesive layer; The second adhesive layer is cut through the gap between two adjacent chips to separate the two adjacent chips; A carrier containing multiple chips is placed in a vacuum device, which then adsorbs all the chips onto the placement area. A control valve disconnects the through-hole corresponding to the chip to be grasped from the vacuum source of the vacuum device.

12. The chip packaging method according to claim 11, characterized in that, Multiple chips with a second adhesive layer bonded to them are adsorbed and fixed onto a carrier, including: Place the vehicle above the second adhesive layer; Multiple chips are adsorbed and fixed.

13. The chip packaging method according to claim 12, characterized in that, Before removing the first adhesive layer, the process also includes: The carrier with multiple chips attached is flipped at a set angle so that the first adhesive layer faces the set position.

14. The chip packaging method according to claim 13, characterized in that, The set angle is 180°.

15. The chip packaging method according to claim 11, characterized in that, Multiple chips with a second adhesive layer bonded to them are adsorbed and fixed onto a carrier, including: Multiple chips with a second adhesive layer attached are placed on top of a carrier, wherein the second adhesive layer is close to the carrier; Multiple chips are adsorbed and fixed.

16. The chip packaging method according to any one of claims 11 to 15, characterized in that, Provides a plurality of chips fixed on a first adhesive layer, including: A wafer is provided, the wafer including a first surface and a second surface; The wafer is cut to form a second groove on the first surface; A first adhesive layer is bonded to the first surface of the wafer; The second surface of the wafer is ground to thin the wafer, the thinning thickness being not less than the distance between the bottom of the second groove and the second surface, so as to divide the wafer into multiple chips.

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