Ultra-wideband millimeter wave receiving front-end device based on planar circuit

Abstract

The application discloses a kind of ultra-wideband millimeter wave receiving front end device based on plane circuit, comprising: dielectric substrate and the ultra-wideband logarithmic periodic end-fire antenna, substrate integrated waveguide and low noise amplifier on dielectric substrate;Ultra-wideband logarithmic periodic end-fire antenna, substrate integrated waveguide and low noise amplifier, in the transmission direction of millimeter wave signal, sequentially set on dielectric substrate;Ultra-wideband logarithmic periodic end-fire antenna and substrate integrated waveguide, and between substrate integrated waveguide and low noise amplifier, by ground coplanar waveguide connection;Substrate integrated waveguide is constituted by the upper surface metal layer and lower surface metal layer of dielectric substrate and two rows of metallized via which penetrate dielectric substrate;Center conductor of ground coplanar waveguide and two side ground layers are coplanarly arranged;The spacing of center conductor and two side ground layers inhibits the high-order mode propagation of millimeter wave signal transmitted in ground coplanar waveguide, and is used to realize the interconnection of ground coplanar waveguide and low noise amplifier.

Description

Technical Field

[0001] This application relates to the field of radio frequency microwave, and relates to, but is not limited to, an ultra-wideband millimeter-wave receiving front-end device based on planar circuits. Background Technology

[0002] With the widespread application of millimeter-wave technology in fields such as rail transit radar, driver assistance systems, and foreign object detection, the market has placed stringent demands on its receiving front-end devices, requiring a combination of high performance, high integration, and low cost. However, existing technological solutions struggle to meet these requirements simultaneously.

[0003] In related technologies, combining a horn antenna with a compound semiconductor low-noise amplifier, employing a three-dimensional antenna structure and specialized semiconductor processes, can achieve a wider bandwidth and lower noise figure. The compound semiconductor low-noise amplifier is a chip manufactured using high-performance specialty materials, capable of amplifying weak high-frequency signals. Furthermore, combining a silicon-based low-noise amplifier with a planar antenna fabricated on a circuit board, based on silicon processes and conventional circuit board fabrication techniques, offers advantages in reducing costs and increasing integration.

[0004] However, the combination of a horn antenna and a compound semiconductor low-noise amplifier (LNOA) is costly due to the need for precision-machined three-dimensional horn antennas, dedicated coaxial connectors, and expensive compound semiconductor chips. Furthermore, this combination is a discrete structure, occupying a large space and making it difficult to integrate into miniaturized electronic devices. While the combination of a silicon-based LNOA and a planar antenna offers lower cost and higher integration, the planar antenna has limited gain and bandwidth, resulting in significant signal loss in the planar transmission line. This leads to a higher noise figure and limited operating bandwidth in the entire receiving front-end, thus affecting the detection range and received signal quality. Summary of the Invention

[0005] In view of this, the present application provides an ultra-wideband millimeter-wave receiving front-end device based on planar circuits, which at least solves the problem that existing millimeter-wave receiving front-end technologies cannot simultaneously achieve high performance, high integration and low cost.

[0006] The technical solution of this application embodiment is implemented as follows: This application provides an ultra-wideband millimeter-wave receiving front-end device based on planar circuits. The device includes: a dielectric substrate, and an ultra-wideband log-periodic end-fire antenna, a substrate integrated waveguide, and a low-noise amplifier disposed on the dielectric substrate. The ultra-wideband log-periodic end-fire antenna, the substrate integrated waveguide, and the low-noise amplifier are sequentially disposed on the dielectric substrate along the transmission direction of the millimeter-wave signal; wherein, the ultra-wideband log-periodic end-fire antenna and the substrate integrated waveguide, and the substrate integrated waveguide and the low-noise amplifier are respectively connected through grounded coplanar waveguides; The substrate integrated waveguide is composed of an upper surface metal layer and a lower surface metal layer on the dielectric substrate, as well as two rows of metallized vias penetrating the dielectric substrate, and is used to constrain and transmit the millimeter-wave signal. The center conductor of the grounded coplanar waveguide is coplanar with the two side ground layers; the distance between the center conductor and the two side ground layers is configured to suppress the propagation of higher-order modes of millimeter-wave signals transmitted in the grounded coplanar waveguide and to enable interconnection between the grounded coplanar waveguide and the low-noise amplifier.

[0007] The beneficial effects of the technical solutions provided in this application include at least the following: This application proposes an ultra-wideband millimeter-wave receiving front-end device based on planar circuitry. The device includes a dielectric substrate, and an ultra-wideband log-periodic end-fire antenna, a substrate-integrated waveguide, and a low-noise amplifier disposed on the dielectric substrate. Integrating the ultra-wideband log-periodic end-fire antenna, substrate-integrated waveguide, and low-noise amplifier onto the dielectric substrate achieves miniaturization and reduces cost. The ultra-wideband log-periodic end-fire antenna, substrate-integrated waveguide, and low-noise amplifier are sequentially disposed on the dielectric substrate along the transmission direction of the millimeter-wave signal. The ultra-wideband log-periodic end-fire antenna and the substrate-integrated waveguide, as well as the substrate-integrated waveguide and the low-noise amplifier, are respectively connected via grounded coplanar waveguides. This grounded coplanar waveguide connection provides good impedance matching for the millimeter-wave signal transmission, reducing reflection loss. The substrate-integrated waveguide consists of upper and lower surface metal layers on the dielectric substrate, and two rows of metallized vias penetrating the dielectric substrate, used to constrain and transmit the millimeter-wave signal. The substrate-integrated waveguide, through a closed metal wall structure formed by the upper and lower surface metal layers and two rows of metallized vias, confines the electromagnetic energy of millimeter-wave signals within a rectangular tube-like space, guiding the millimeter-wave signals along a predetermined path and preventing energy loss in undesired directions. This achieves low-loss transmission of millimeter-wave signals. The central conductor of the grounded coplanar waveguide is coplanar with the two side ground layers; the spacing between the central conductor and the two side ground layers is configured to suppress the propagation of higher-order modes of the millimeter-wave signals transmitted in the grounded coplanar waveguide and to interconnect the grounded coplanar waveguide with a low-noise amplifier, improving the quality of the transmitted millimeter-wave signal. Simultaneously, the interconnection between the grounded coplanar waveguide and the low-noise amplifier allows the device of this application to be compatible with both wire bonding and surface mount processes, possessing high manufacturing flexibility and wide applicability. Therefore, the ultra-wideband millimeter-wave receiving front-end device based on planar circuits proposed in this application has the advantages of high performance, high integration, and low cost. Attached Figure Description

[0008] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein: Figure 1 A schematic diagram of the structure of an ultra-wideband millimeter-wave receiving front-end device based on planar circuits provided in an embodiment of this application; Figure 2 A schematic diagram of the return loss of the device provided in the embodiments of this application; Figure 3Two-dimensional antenna radiation pattern at 75 GHz for the device provided in the embodiments of this application; Figure 4 Two-dimensional antenna radiation pattern at 80 GHz for the device provided in the embodiments of this application; Figure 5 Two-dimensional antenna radiation pattern at 90 GHz for the device provided in the embodiments of this application; Figure 6 The three-dimensional radiation pattern of the antenna of the device provided in the embodiments of this application at 80 GHz. Detailed Implementation

[0009] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. The following embodiments are used to illustrate this application, but are not intended to limit the scope of this application. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0010] In the following description, references are made to “some embodiments,” which describe a subset of all possible embodiments. However, it is understood that “some embodiments” may be the same subset or different subsets of all possible embodiments and may be combined with each other without conflict.

[0011] It should be noted that the terms "first, second, and third" used in the embodiments of this application are merely to distinguish similar objects and do not represent a specific ordering of objects. It is understood that "first, second, and third" can be interchanged in a specific order or sequence where permitted, so that the embodiments of this application described herein can be implemented in an order other than that illustrated or described herein.

[0012] It will be understood by those skilled in the art that, unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which the embodiments of this application pertain. It should also be understood that terms such as those defined in general dictionaries should be understood to have a meaning consistent with their meaning in the context of the prior art, and should not be interpreted in an idealized or overly formal sense unless specifically defined as herein.

[0013] This application provides an ultra-wideband millimeter-wave receiving front-end device based on planar circuits. Figure 1 A schematic diagram of a planar circuit-based ultra-wideband millimeter-wave receiving front-end device is provided for an embodiment of this application, as shown below. Figure 1As shown, the device 100 includes: a dielectric substrate 110, and an ultra-wideband log-periodic end-fire antenna 120, a substrate integrated waveguide 130, and a low-noise amplifier 140 disposed on the dielectric substrate. The ultra-wideband log-periodic end-fire antenna, the substrate integrated waveguide, and the low-noise amplifier are sequentially disposed on the dielectric substrate along the transmission direction of the millimeter-wave signal; wherein, the ultra-wideband log-periodic end-fire antenna and the substrate integrated waveguide, and the substrate integrated waveguide and the low-noise amplifier are respectively connected by grounded coplanar waveguide 150. The substrate integrated waveguide is composed of an upper surface metal layer and a lower surface metal layer on the dielectric substrate, as well as two rows of metallized vias penetrating the dielectric substrate, and is used to constrain and transmit the millimeter-wave signal. The center conductor of the grounded coplanar waveguide is coplanar with the two side ground layers; the distance between the center conductor and the two side ground layers is configured to suppress the propagation of higher-order modes of millimeter-wave signals transmitted in the grounded coplanar waveguide and to enable interconnection between the grounded coplanar waveguide and the low-noise amplifier.

[0014] An ultra-wideband log-periodic end-fire antenna is disposed on a dielectric substrate and located at the beginning of the millimeter-wave signal transmission path of the device of this application.

[0015] The ultra-wideband log-periodic end-fire antenna (hereinafter referred to as the antenna) adopts a planar log-periodic structure, consisting of multiple pairs of radiating elements with gradually varying lengths, linewidths, and spacing. The dimensions of the radiating elements are scaled sequentially according to a fixed scaling factor. The scaling factor is less than 1, and the dimensions of the radiating elements can include the length of each individual radiating element and the distance between adjacent radiating elements.

[0016] By adjusting the size of the radiating element, elements of different lengths resonate at different operating frequencies, enabling the antenna to cover an extremely wide frequency range. The ultra-wideband log-periodic end-fire antenna has an operating relative bandwidth greater than 25%, meeting the application requirements of ultra-wideband.

[0017] The minimum linewidth of the radiating oscillator is no less than 75 micrometers to ensure that the circuit pattern can be etched.

[0018] Millimeter-wave signals are electromagnetic waves with frequencies between 30 GHz and 300 GHz. When millimeter-wave signals propagate in free space, they are radiated electromagnetic waves. When millimeter-wave signals propagate within a grounded coplanar waveguide or substrate-integrated waveguide, they are guided electromagnetic waves. Therefore, an antenna converts radiated electromagnetic waves propagating in space into guided electromagnetic waves.

[0019] Substrate integrated waveguides (DIWBs) are positioned after ultra-wideband log-periodic end-fire antennas to achieve low-loss transmission of millimeter-wave signals. A DWB is a waveguide structure integrated within a dielectric substrate. The top and bottom walls of the DWB are formed by metal layers on the upper and lower surfaces of the substrate, respectively, while the left and right sidewalls are formed by two rows of metallized vias penetrating the substrate. This creates a rectangular channel within the dielectric that confines the propagation of electromagnetic waves.

[0020] The dielectric substrate features low-loss characteristics to reduce transmission attenuation. The spacing between two rows of metallized vias is a key parameter determining the operating frequency band of the substrate-integrated waveguide. The larger the spacing between adjacent metallized vias, the lower the operating frequency of the device, and the more low-frequency signals it can pass through; conversely, the smaller the spacing, the higher the operating frequency of the device.

[0021] In some embodiments, the spacing can be configured to a specific value, for example, the spacing can be 0.35 mm, thereby setting the operating frequency band within a desired range, for example, the operating frequency band range is above 70 GHz.

[0022] The grounded coplanar waveguide serves as a transition structure and consists of two sections: the first section connects the ultra-wideband log-periodic end-fire antenna to the substrate integrated waveguide; the second section connects the substrate integrated waveguide to the low-noise amplifier.

[0023] Each grounded coplanar waveguide segment includes a center conductor and grounding layers located in the same plane and arranged on both sides of it. The spacing between the center conductor and the two grounding layers is a preset parameter, configured to suppress the propagation of higher-order modes of millimeter-wave signals transmitted in the grounded coplanar waveguide, ensuring the purity and stability of signal transmission.

[0024] The low-noise amplifier (LNOA) is the core component of the receiving front-end device in this application, located at the end of the signal link. The LNOA is connected to the substrate integrated waveguide via a grounded coplanar waveguide and is used to receive millimeter-wave signals collected by the antenna and transmitted through the substrate integrated waveguide. The main function of the LNOA is to initially amplify the millimeter-wave signal while reducing the introduction of additional noise. The millimeter-wave signal amplified by the LNOA has sufficient amplitude for subsequent processing by down-conversion circuits, filtering circuits, and demodulation circuits.

[0025] The top and bottom structures of the substrate integrated waveguide are the upper surface metal layer and the lower surface metal layer of the dielectric substrate.

[0026] In an ultra-wideband log-periodic end-fire antenna, the lengths of adjacent radiating elements gradually change in a fixed ratio, giving the antenna's geometry a log-periodic periodicity. The length and spacing of the radiating elements gradually change from one end of the antenna to the other, with longer elements resonating at lower frequencies and shorter elements resonating at higher frequencies. Multiple radiating elements work together to cover an extremely wide frequency range, thus achieving the antenna's ultra-wideband characteristics.

[0027] Higher-order modes can lead to energy dispersion, signal distortion, and increased transmission loss. By setting the spacing between the center conductor of the grounded coplanar waveguide and the grounding layers on both sides, the propagation of higher-order modes can be structurally suppressed, ensuring that millimeter-wave signals are transmitted in a pure dominant mode.

[0028] This application proposes an ultra-wideband millimeter-wave receiving front-end device based on planar circuits. The device includes a dielectric substrate, and an ultra-wideband log-periodic end-fire antenna, a substrate integrated waveguide, and a low-noise amplifier disposed on the dielectric substrate. Integrating the ultra-wideband log-periodic end-fire antenna, substrate integrated waveguide, and low-noise amplifier onto the dielectric substrate achieves miniaturization and reduces cost. The ultra-wideband log-periodic end-fire antenna, substrate integrated waveguide, and low-noise amplifier are sequentially disposed on the dielectric substrate along the transmission direction of the millimeter-wave signal. The ultra-wideband log-periodic end-fire antenna and the substrate integrated waveguide, as well as the substrate integrated waveguide and the low-noise amplifier, are respectively connected via grounded coplanar waveguides. The grounded coplanar waveguide connection provides good impedance matching for the millimeter-wave signal transmission, reducing reflection loss. The substrate integrated waveguide consists of upper and lower surface metal layers on the dielectric substrate, and two rows of metallized vias penetrating the dielectric substrate, used to constrain and transmit the millimeter-wave signal. The substrate-integrated waveguide, through a closed metal wall structure formed by the upper and lower surface metal layers and two rows of metallized vias, confines the electromagnetic energy of millimeter-wave signals within a rectangular tube-like space, guiding the millimeter-wave signals along a predetermined path and preventing energy loss in undesired directions. This achieves low-loss transmission of millimeter-wave signals. The center conductor of the grounded coplanar waveguide is coplanar with the two side ground layers; the spacing between the center conductor and the two side ground layers is configured to suppress the propagation of higher-order modes of the millimeter-wave signals transmitted in the grounded coplanar waveguide and to interconnect the grounded coplanar waveguide with a low-noise amplifier, improving the quality of the transmitted millimeter-wave signal. Simultaneously, the interconnection between the grounded coplanar waveguide and the low-noise amplifier allows the device of this application to be compatible with both wire bonding and surface mount processes, possessing high manufacturing flexibility and wide applicability. Therefore, the ultra-wideband millimeter-wave receiving front-end device based on planar circuits proposed in this application has the advantages of high performance, high integration, and low cost.

[0029] Optionally, the ultra-wideband log-periodic end-fire antenna includes multiple pairs of radiating elements with gradually varying lengths, linewidths, and spacings.

[0030] Optionally, the operating relative bandwidth of the ultra-wideband log-periodic end-fire antenna is greater than 25%.

[0031] Optionally, the minimum linewidth of the radiating oscillator is greater than or equal to 75 micrometers.

[0032] Optionally, in the substrate integrated waveguide, the spacing between the two columns of metallized vias is configured to determine the operating frequency band of the device.

[0033] Optionally, the spacing between the two columns of metallized vias is 0.35 mm; in each column of metallized vias, each metallized via is arranged at equal intervals, and the distance between adjacent metallized vias in the same column is 1.5 mm; the cutoff operating frequency of the substrate integrated waveguide is 70 GHz.

[0034] Optionally, the dielectric substrate is made of a low-loss dielectric material.

[0035] The dielectric substrate is made of a specific dielectric material with low-loss characteristics. Selecting a specific dielectric material can reduce the dielectric loss of millimeter-wave signals propagating in the dielectric from the source, thereby achieving a low noise figure and high transmission efficiency in the device of this application. Low-loss dielectric materials, such as high-frequency circuit boards with low loss tangent values, are crucial for ensuring planar transmission between the substrate-integrated waveguide and the ground coplanar waveguide.

[0036] Optionally, a surface dielectric layer is also laminated above the radiation region of the ultra-wideband log-periodic end-fire antenna, the contour of which extends beyond the outer contour of the antenna in the horizontal direction.

[0037] Above the radiating region of the ultra-wideband log-periodic end-fire antenna, in the area where the radiating elements are located, an additional surface dielectric layer is laminated. The projected size of this surface dielectric layer on the horizontal plane is larger than the outer contour boundaries of all the radiating elements below it. This extended design provides physical protection for the delicate radiating element pattern, preventing damage; at the same time, it optimizes the electromagnetic environment in the near field of the antenna, helping to improve the antenna's radiation efficiency, radiation pattern characteristics, and impedance bandwidth, effectively enhancing the antenna's performance.

[0038] The following describes an ultra-wideband millimeter-wave receiving front-end device based on planar circuits, according to an embodiment of this application. The specific embodiments described below are only for better illustrating the present invention and do not constitute an undue limitation on the scope of protection of the present invention.

[0039] The device proposed in this embodiment is based on a high-frequency substrate. The core dielectric layer of the substrate has a thickness of 0.127 mm, the surface copper foil has a thickness of 18 μm, and additional dielectric layers with a thickness of 1 mm are laminated above and below the core dielectric layer to form the required multilayer structure.

[0040] The substrate-integrated waveguide is located in the middle region of the device in this application. The spacing between two columns of metallized vias, i.e., the column spacing, is set to 0.35 mm, and the distance between adjacent metallized vias in the same column, i.e., the row spacing, is set to 1.5 mm. These structural dimensions determine that the operating frequency of the substrate-integrated waveguide is approximately 70 GHz, allowing millimeter-wave signals with frequencies higher than 70 GHz to pass through, while attenuating millimeter-wave signals with frequencies lower than 70 GHz.

[0041] Upstream of the substrate-integrated waveguide, at the input end of millimeter-wave signal transmission, an ultra-wideband log-periodic end-fire antenna is integrated. The antenna comprises four pairs of radiating elements, each with a gradually varying length, width, and spacing. The parameters of this gradually varying design were determined through calculation and electromagnetic simulation optimization. To ensure the feasibility of the circuit board manufacturing process, the minimum linewidth of the antenna radiating elements was set to 75 μm.

[0042] Downstream of the substrate-integrated waveguide, at the millimeter-wave signal output, it is also connected to the grounded coplanar waveguide via a tapered transmission line. The center conductor linewidth of the grounded coplanar waveguide is set to 0.28 mm. The interface structure of the grounded coplanar waveguide meets the requirements of two mainstream chip interconnection processes: it can interconnect with bare chips via gold wire bonding, and it can interconnect with packaged chips via surface mount technology. This design provides excellent process compatibility and interconnection flexibility for the receiving front-end device.

[0043] The following is combined Figures 2 to 6 The simulation results illustrate the performance characteristics of the ultra-wideband millimeter-wave receiving front-end device provided in the embodiments of this application.

[0044] Figure 2 A schematic diagram of the return loss of the device provided in the embodiments of this application. Figure 2 As shown, the horizontal axis X represents frequency in GHz, ranging from 70.00 to 95.00 GHz, representing the device's operating frequency band. The vertical axis Y represents return loss, a negative value ranging from -5.00 to -35.00. A larger absolute value indicates less reflection of the millimeter-wave signal, better impedance matching, and superior device performance. The red curve in the figure illustrates the device's return loss performance across the entire operating frequency band. Figure 2The table below lists the coordinates of three marked points m1, m2, and m3 on the curve. m1 corresponds to a frequency of 73.9375 GHz with a return loss of -8.6659 dB. m2 corresponds to a frequency of 78.0000 GHz with a return loss of -9.2276 dB; and m3 corresponds to a frequency of 91.6875 GHz with a return loss of -11.7640 dB. Near 73.9375 GHz, 78.0000 GHz, and 91.6875 GHz, the curve is relatively high with small absolute values ​​of return loss, indicating some signal reflection at these frequency points. Between 84 GHz and 85 GHz and between 92 GHz and 93 GHz, the curve exhibits deep valleys with extremely large negative absolute values ​​of return loss, indicating that the device of this application has excellent impedance matching in these frequency bands and can efficiently transmit millimeter-wave signals. Therefore, the device of this application possesses excellent broadband matching characteristics.

[0045] Figure 3 This is a two-dimensional radiation pattern of the antenna at 75 GHz provided in the embodiments of this application. The horizontal axis X in the figure represents frequency in degrees, indicating the radiation angle of the antenna in the vertical plane; the vertical axis Y represents gain, indicating the gain of the antenna in various directions in decibels. The red curve in the figure shows the trend of antenna gain as a function of angle at a fixed azimuth angle of 90 degrees at a frequency of 75 GHz. The angle corresponding to the marked point m1 on the curve is 89 degrees, with a gain reaching its maximum of 3.2970 dB; the angle corresponding to the marked point m2 is 26 degrees, with a gain of -0.9761 dB; and the angle corresponding to the marked point m3 is 150 degrees, with a gain of -0.9797 dB.

[0046] Figure 4 This is a two-dimensional radiation pattern of the antenna at 80 GHz for the device provided in this application embodiment. The horizontal axis X represents angle in degrees, indicating the antenna's radiation angle in the vertical plane; the vertical axis represents gain in various directions, in decibels. The red curve in the figure shows the trend of antenna gain as a function of angle at 80 GHz with a fixed azimuth angle of 90 degrees. Point m1 on the curve corresponds to an angle of 91 degrees, where the gain reaches its maximum value of 4.6562 dB; point m2 corresponds to an angle of 34 degrees with a gain of 2.8064 dB; and point m3 corresponds to an angle of 143 degrees with a total gain of -2.4753 dB.

[0047] Figure 5This is a two-dimensional radiation pattern of the antenna at 90 GHz for the device provided in this application embodiment. The horizontal axis X in the figure represents angle, in degrees, indicating the radiation angle of the antenna in the vertical plane; the vertical axis represents gain, indicating the total gain of the antenna in all directions, in decibels. The red curve in the figure shows the trend of the total antenna gain as a function of angle at a fixed azimuth angle of 90 degrees at 90 GHz. The marked point m1 on the curve corresponds to an angle of 90 degrees, at which point the total gain reaches its maximum value of 3.1073 dB; the marked point m2 corresponds to an angle of 50 degrees, with a total gain of -2.0219 dB; and the marked point m3 corresponds to an angle of 135 degrees, with a total gain of -3.2613 dB.

[0048] Figure 6 This is a three-dimensional radiation pattern of the 80GHz antenna of the device provided in this application embodiment. The three-dimensional graphic in the figure intuitively shows the total gain distribution of the antenna in various spatial directions. The horizontal axis Phi (deg) corresponds to the azimuth angle, and the vertical axis is the angle. The horizontal and vertical axes form a spherical coordinate system, which is used to represent the azimuth angle in the horizontal direction and the elevation angle in the vertical direction of the antenna, respectively. The color changes on the surface of the graphic correspond to the color bar on the left. "Max 4.66" at the top of the color bar represents the maximum gain value, and "Min -31.99" at the bottom represents the minimum gain value. The values ​​in the middle range from -35 to 5. Different colors represent different gain values, indicating the total gain intensity of the antenna under that angle combination. Figure 6 The "4.7" marked above points to the highest point of the main lobe of the beam, indicating that the gain reaches its peak in that direction. The XYZ coordinate axis diagram in the lower right corner is used to indicate the three-dimensional coordinate orientation.

[0049] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of this application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. It should be understood that in the various embodiments of this application, the sequence numbers of the above-described processes do not imply a sequential order of execution; the execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application. The sequence numbers of the above-described embodiments are merely descriptive and do not represent the superiority or inferiority of the embodiments.

[0050] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0051] In the several embodiments provided in this application, it should be understood that the disclosed apparatus can be implemented in other ways. The apparatus embodiments described above are merely illustrative. Furthermore, the coupling, direct coupling, or communication connection between the various components shown or discussed may also be through some interfaces, devices, or units, and may be electrical, mechanical, or other forms.

[0052] The units described above as separate components may or may not be physically separate, and the components shown as units may or may not be physical units; they may be located in one place or distributed across multiple network units; some or all of the units may be selected to achieve the purpose of the embodiments of this application according to actual needs. In addition, each functional unit in the embodiments of this application may be fully integrated into one processing unit, or each unit may be a separate unit, or two or more units may be integrated into one unit; the integrated unit may be implemented in hardware or in the form of hardware plus software functional units.

[0053] The above description is merely an embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A planar circuit-based ultra-wideband millimeter-wave receiving front-end device, characterized in that, The device includes: a dielectric substrate, and an ultra-wideband log-periodic end-fire antenna, a substrate integrated waveguide, and a low-noise amplifier disposed on the dielectric substrate; The ultra-wideband log-periodic end-fire antenna, the substrate integrated waveguide, and the low-noise amplifier are sequentially disposed on the dielectric substrate along the transmission direction of the millimeter-wave signal; wherein, the ultra-wideband log-periodic end-fire antenna and the substrate integrated waveguide, and the substrate integrated waveguide and the low-noise amplifier are respectively connected through grounded coplanar waveguides; The substrate integrated waveguide is composed of an upper surface metal layer and a lower surface metal layer on the dielectric substrate, as well as two rows of metallized vias penetrating the dielectric substrate, and is used to constrain and transmit the millimeter-wave signal. The center conductor of the grounded coplanar waveguide is coplanar with the two side ground layers; the distance between the center conductor and the two side ground layers is configured to suppress the propagation of higher-order modes of millimeter-wave signals transmitted in the grounded coplanar waveguide and to enable interconnection between the grounded coplanar waveguide and the low-noise amplifier.

2. The apparatus according to claim 1, characterized in that, The ultra-wideband log-periodic end-fire antenna comprises multiple pairs of radiating elements with gradually varying lengths, linewidths, and spacings.

3. The apparatus according to claim 2, characterized in that, The ultra-wideband log-periodic end-fire antenna has a relative operating bandwidth of more than 25%.

4. The apparatus according to claim 2, characterized in that, The minimum linewidth of the radiating oscillator is greater than or equal to 75 micrometers.

5. The apparatus according to claim 1, characterized in that, In the substrate integrated waveguide, the spacing between the two columns of metallized vias is configured to determine the operating frequency band of the device.

6. The apparatus according to claim 5, characterized in that, The spacing between the two rows of metallized vias is 0.35 mm; In each column of the metallized vias, each metallized via is arranged at equal intervals, and the distance between adjacent metallized vias in the same column is 1.5 mm; The cutoff operating frequency of the substrate integrated waveguide is 70 GHz.

7. The apparatus according to claim 1, characterized in that, The dielectric substrate is made of a low-loss dielectric material.

8. The apparatus according to claim 1 or 7, characterized in that, Above the radiation region of the ultra-wideband log-periodic end-fire antenna, a surface dielectric layer is also laminated, the contour of which extends beyond the outer contour of the antenna in the horizontal direction.

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