A cutting apparatus for semiconductor element pin processing

Abstract

The application relates to the technical field of metal material processing, in particular to a cutting equipment for semiconductor element pin processing, which comprises a bottom plate, a support frame is fixedly connected to the outer wall of the bottom plate, a screening cylinder is arranged on the outer wall of the support frame, a stirring motor is fixed to the outer wall of the bottom end of the support frame, a vibrating screening device is arranged in the screening cylinder, a pneumatic intermittent feeding device is arranged at the bottom of the screening cylinder, and a position-adjusting cutting device is arranged on one side of the pneumatic intermittent feeding device. Through the vibrating screening device, the double-layer spiral plates are used to guide the semiconductor element to slide downwards, centrifugal force generated by the rotation of the rotating disc is used to throw the element to the wall of the screening cylinder, the screening and discharging of the semiconductor element are realized, through the pneumatic intermittent feeding device, the feeding is realized while the screening and discharging are realized, through the position-adjusting cutting device, the rotating position-adjusting screw rod is used to compress or loosen the supporting spring, the active shearing cutter and the passive shearing cutter are moved along the cutter guide rod, and the length of the pin cutting is adjustable.

Description

Technical Field

[0001] This invention relates to the field of metal material processing technology, and more specifically to a cutting device for processing semiconductor element leads. Background Technology

[0002] In modern production, with the development of industry and the actual needs of production, the demand for cutting equipment for semiconductor component lead processing is increasing and the requirements are becoming more stringent. Existing cutting equipment has defects. For semiconductor components with double leads, it is not possible to feed while screening and discharging, nor can the cutting length of the leads be adjusted. Often, multiple equipment are required to work together, which is time-consuming and labor-intensive.

[0003] Therefore, in order to address the above-mentioned shortcomings, the present invention provides a cutting device for semiconductor component pin processing. By setting up a vibrating screening device and a pneumatic intermittent feeding device, the device can simultaneously screen and discharge materials and feed them. By setting up an adjustment cutting device, the pin cutting length can be adjusted, thus meeting the urgent needs of the metal material processing industry for cutting equipment for semiconductor component pin processing. Summary of the Invention

[0004] To address the shortcomings of existing technologies, the technical solution adopted by this invention is as follows: a cutting device for semiconductor component lead processing, comprising: a base plate, a support frame fixedly connected to the outer wall of the base plate, a screening cylinder provided on the outer wall of the support frame, a stirring motor fixed to the bottom outer wall of the support frame, a vibrating screening device inside the screening cylinder, a pneumatic intermittent feeding device at the bottom of the screening cylinder, and a positioning cutting device on one side of the pneumatic intermittent feeding device; the vibrating screening device includes a rotating disk, a double-layer spiral plate on the top of the rotating disk, and a discharge plate rotatably connected to the outer wall of the outlet of the double-layer spiral plate. A return spring is fixedly connected to the outer wall of the rotating disk; a brush is slidably connected to the outer wall of the rotating disk; a support roller is fixedly connected to the outer wall of the bottom end of the rotating disk; a telescopic rod is fixedly connected to the outer wall of the rotating disk; a buffer spring is fixedly connected to the outer wall of the bottom end of the rotating disk; a vibrating ring block is slidably connected to the outer wall of the support roller; an unfolding rod is symmetrically rotatably connected to the inner wall of the vibrating ring block; a limit slider is rotatably connected to the outer wall of one end of the unfolding rod; a retaining block is fixedly connected to the outer wall of the limit slider; a displacement screw is threadedly connected to the inner wall of the limit slider; a baffle plate is slidably connected to the outer wall of the vibrating ring block; and a return spring is fixedly connected to the outer wall of the baffle plate.

[0005] The outer wall of the rotating disk is rotatably connected to the inner wall of the screening cylinder; the outer wall of the double-layer spiral plate is fixedly connected to the inner wall of the screening cylinder; the outer wall of the brush is fixedly connected to the outer wall of the central shaft of the double-layer spiral plate; the outer wall of the support roller is slidably connected to the outer wall of the support frame; the outer wall of the telescopic rod at the end away from the rotating disk is fixedly connected to the output end of the stirring motor; the outer wall of the buffer spring at the end away from the rotating disk is slidably connected to the outer wall of the support frame; the outer wall of the vibrating ring block is slidably connected to the inner wall of the support frame and the outer wall of the telescopic rod, respectively; the outer wall of the limiting slider is slidably connected to the inner wall of the base plate; and the displacement screw is connected to the support... The support plate is rotatably connected to the base plate, the outer wall of the baffle plate is slidably connected to the inner wall of the support frame, and the outer wall of the return spring away from the baffle plate is fixedly connected to the outer wall of the support frame. When the vibration amplitude is large, causing the semiconductor material to be fed too quickly, resulting in excessive accumulation on the rotating disk and affecting the screening effect, the machine is stopped, the displacement screw is rotated, so that the limit slider moves in the opposite direction, so that the spacing of the unfolding rods increases, so that the vibrating ring block slides down along the outer wall of the telescopic rod. As the vibrating ring block moves down, it no longer squeezes the baffle plate. Under the action of the return spring, it slides out from the inner wall of the support frame fixed on the base plate, simultaneously blocking the gap left by the vibrating ring block.

[0006] The pneumatic intermittent feeding device includes an air storage cylinder, a thrust piston slidably connected to the inner wall of the air storage cylinder, an air inlet pipe fixedly connected to the outer wall of the air storage cylinder, a piston cylinder fixedly connected to the outer wall of the air inlet pipe, a sealing piston slidably connected to the inner wall of the piston cylinder, a retaining spring fixedly connected to the outer wall of the sealing piston, a feed air pipe fixedly connected to the outer wall of the air inlet pipe, and a piston cylinder fixedly connected to the outer wall of the feed air pipe. A discharge rack is fixedly connected to one end of the piston cylinder. An annular groove is formed on the outer wall of the rotating disk near the outer ring. Semiconductor elements falling onto the rotating disk are thrown towards the surrounding walls of the screening cylinder under the centrifugal force generated by the rotation of the rotating disk. When passing through the groove of the rotating disk, some of the slower-moving elements that fit the groove are captured by the groove. Holes are formed in the groove of the rotating disk and the bottom of the screening cylinder. As the rotating disk rotates, when the hole of the rotating disk aligns with the hole of the screening cylinder, the semiconductor elements in the groove fall into the discharge rack fixedly connected to the inner wall of the bottom of the screening cylinder.

[0007] The air storage cylinder, the thrust piston, and the air inlet pipe are arranged in a circumferential array along the outer wall of the support frame. The bottom outer wall of the air storage cylinder is fixedly connected to the outer wall of the support frame. The outer wall of the thrust piston is fixedly connected to the outer wall of the screening cylinder. The outer wall of the air inlet pipe is fixedly connected to the inner wall of the support frame. The outer wall of the retaining spring away from the sealing piston is fixedly connected to the inner wall of the piston cylinder. The outer wall of the discharge rack is fixedly connected to the inner wall of the support frame. The top outer wall of the discharge rack is fixedly connected to the bottom outer wall of the screening cylinder. The discharge rack has two layers: the inner layer is fixedly connected to the bottom outer wall of the screening cylinder, and the outer layer is fixedly connected to the inner wall of the support frame. As the screening cylinder vibrates, the inner layer slides and connects with the outer layer, ensuring that screening and discharge can still be carried out during vibration. During operation, the up-and-down movement of the screening cylinder drives the air piston, causing the air storage cylinder to alternately complete air intake and exhaust. During air intake, air enters the air storage cylinder through the air inlet pipe, and during exhaust, air pushes open the sealing piston through the feed air pipe, pushing the semiconductor element in the discharge rack, causing it to be intermittently clamped by the spring telescopic clamp of the adjustment and cutting device. This process converts the power of vibrating screening into pneumatic feeding power, realizing the synchronous operation of screening and discharge and feeding. No additional power device is required, reducing equipment coordination operations and improving the overall processing continuity and efficiency.

[0008] The positioning and cutting device includes a motor bracket, an intermittent motor fixedly connected to the bottom outer wall of the motor bracket, a fixed rod rotatably connected to the inner wall of the motor bracket, a clamping turntable symmetrically fixedly connected to the outer wall of the fixed rod, an upper tool holder plate fixedly connected to the outer wall of the motor bracket support rod, a lower tool holder plate fixedly connected to the outer wall of the motor bracket, and a spring telescopic clamp fixedly connected to the outer wall of the clamping turntable. By rotating the positioning screw, the support spring is compressed or released, causing the active and passive shearing blades to move along the tool guide rod. Under the action of the support spring, when the blade moves upward, the lead is cut with a longer length, and when it moves downward, the lead is cut with a shorter length. This allows for flexible adjustment of the cutting length of semiconductor component leads according to actual needs during production, meeting the processing requirements of different product specifications. The operation is simple and improves the applicability of the equipment.

[0009] A sliding limiting plate is slidably connected to the outer wall of the spring telescopic clamp. Tool guide rods are symmetrically fixedly connected to the outer walls of both the upper and lower tool holders. Support springs are symmetrically fixedly connected to the outer walls of both the upper and lower tool holders. A passive shearing blade is slidably connected to the outer wall of the tool guide rod. An adjusting screw is threadedly connected to the inner wall of the passive shearing blade. A spring return rod is fixedly connected to the outer wall of the sliding limiting plate. Pushing the sliding tool holder compresses the spring return rod, causing it to slide along the inner wall of the sliding limit plate's outer slide rail, thus moving the tool guide rod and the adjusting screw. This causes the active and passive shearing blades to engage, cutting the leads of the semiconductor element. During cutting, the active shearing blade compresses the spring telescopic clamp through the semiconductor element. After cutting, the spring telescopic clamp is pushed out by the spring, and the semiconductor element is pushed out by the elastic force, disengaging from the spring telescopic clamp.

[0010] A sliding blade holder is fixedly connected to the outer wall of the elastic rebound rod. A blade guide rod is symmetrically fixedly connected to the outer wall of the sliding blade holder. A support spring is fixedly connected to the outer wall of the sliding blade holder. An active shearing blade is slidably connected to the outer wall of the blade guide rod. An adjusting screw is threadedly connected to the inner wall of the active shearing blade. A pneumatic cylinder is slidably connected to the outer wall of the sliding blade holder. A shearing air pipe is fixedly connected to the outer wall of one end of the pneumatic cylinder. When the semiconductor element is moved to a designated position, the air drawn into the air storage cylinder is discharged from the shearing air pipe, squeezing the piston rod on the back of the sliding blade holder, causing the piston rod to slide along the inner wall of the pneumatic cylinder.

[0011] The bottom outer wall of the fixed rod is fixedly connected to the output end of the intermittent motor. The outer wall of the fixed rod is rotatably connected to the inner wall of the motor bracket. The inner wall of the fixed rod is rotatably connected to the outer wall of the motor bracket support rod. When the semiconductor element is clamped by the spring telescopic clamp in the positioning and cutting device, the intermittent motor fixed on the motor bracket drives the fixed rod to rotate, so that the clamp turntable drives the spring telescopic clamp to rotate intermittently.

[0012] The bottom outer wall of the sliding limit plate is fixedly connected to the outer wall of the motor bracket via a support rod. The end of the support spring away from the outer wall of the upper and lower tool holders is fixedly connected to the bottom outer wall of the passive shearing blade. The bottom outer wall of the adjusting screw is rotatably connected to the outer wall of the upper and lower tool holders. When it is necessary to adjust the cutting length of the semiconductor element pins, and the pins need to be left longer, the adjusting screw is rotated. Under the action of the support spring, the active and passive shearing blades move upward along the tool guide rod fixed on the upper and lower tool holders, and the pins are left longer after cutting.

[0013] The outer wall of the sliding blade holder is slidably connected to the inner wall of the sliding limit plate's outer wall slide rail. The outer wall of the support spring at the end away from the sliding blade holder is fixedly connected to the bottom outer wall of the active shearing blade. The bottom outer wall of the adjusting screw is rotatably connected to the outer wall of the sliding blade holder. The outer wall of the pneumatic cylinder is fixedly connected to the inner wall of the sliding limit plate's outer wall slide rail. The outer wall of the shearing air pipe at the end away from the pneumatic cylinder is fixedly connected to the outer wall of the air inlet pipe. When the lead needs to be shortened, the adjusting screw is rotated, and the active shearing blade and the passive shearing blade move down along the tool guide rod fixed on the upper and lower blade holder plates under the action of the support spring, leaving the lead shortened after cutting.

[0014] The beneficial effects of this invention are as follows: 1. This invention utilizes a vibrating screening device, employing a double-layer spiral plate to guide semiconductor components downwards. The centrifugal force generated by the rotating disc throws the components against the screening cylinder wall, where they are captured by the grooves in the rotating disc. Alignment between the rotating disc and the holes at the bottom of the screening cylinder ensures orderly discharge. Simultaneously, a brush fixed to the central axis of the double-layer spiral plate promptly cleans accumulated components, preventing clogging. The soft brush material does not damage the component surface, thus achieving both screening and discharge of semiconductor components and improving pretreatment efficiency.

[0015] 2. This invention, by setting up a vibrating screening device, utilizes a rotating displacement screw to drive the movement of the limiting slider, changing the spacing of the unfolding rods, causing the vibrating ring block to move downward along the telescopic rod, reducing the falling height of the support roller, lowering the gravitational potential energy, thereby reducing the vibration amplitude; conversely, it can increase the vibration amplitude. Furthermore, the fixed block can prevent the unfolding rods from over-expanding and becoming unable to reset, ensuring adjustment stability. This design allows for flexible adjustment of the vibration amplitude according to the component feeding speed requirements, avoiding the accumulation of too many components on the rotating disc due to excessive feeding speed affecting the screening effect, or the impact on processing efficiency due to excessive feeding speed.

[0016] 3. This invention achieves simultaneous screening and feeding by setting up a pneumatic intermittent feeding device. During operation, the screening cylinder moves up and down, driving the air piston, which causes the air storage cylinder to alternately complete air intake and exhaust. During air intake, air enters the air storage cylinder through the air inlet pipe, and during exhaust, air pushes open the sealing piston through the feed air pipe, pushing the semiconductor element in the discharge frame, causing it to be intermittently clamped by the spring telescopic clamp of the adjustment and cutting device. This process converts the power of vibrating screening into pneumatic feeding power, realizing the synchronous operation of screening and feeding without the need for an additional power device, reducing equipment coordination operations, and improving the overall processing continuity and efficiency.

[0017] 4. This invention, by setting up an adjustment cutting device, utilizes the rotation of the adjustment screw to compress or relax the support spring, causing the active and passive shearing blades to move along the tool guide rod. Under the action of the support spring, when the tool moves upward, the lead is cut with a longer length, and when it moves downward, the lead is cut with a shorter length. This allows for flexible adjustment of the cutting length of semiconductor component leads according to actual needs during production, meeting the processing requirements of different product specifications. The operation is simple and improves the applicability of the equipment. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a schematic diagram of the back structure of the present invention; Figure 3 This is a schematic diagram of the internal structure of the present invention; Figure 4 This is a schematic diagram of the structure of the vibrating screening device of the present invention; Figure 5 This is a schematic diagram of the structure of the double-layer spiral plate of the present invention; Figure 6 yes Figure 5 A magnified view of part A; Figure 7 This is a schematic diagram of the structure of the vibration ring block of the present invention; Figure 8 This is a schematic diagram of the structure of the shielding plate of the present invention; Figure 9 yes Figure 8 A magnified view of section B; Figure 10 This is a schematic diagram of the pneumatic intermittent feeding device; Figure 11 This is a schematic diagram of the structure of the gas storage cylinder of the present invention; Figure 12 This is a schematic diagram of the structure of the sealing piston of the present invention; Figure 13 This is a schematic diagram of the structure of the positioning and cutting device of the present invention; Figure 14 This is a schematic diagram of the rotating disk of the present invention.

[0019] In the diagram: 1. Base plate; 2. Support frame; 3. Screening cylinder; 4. Agitator motor; 5. Vibrating screening device; 6. Pneumatic intermittent feeding device; 7. Adjusting and cutting device; 50. Rotating disc; 51. Double-layer spiral plate; 52. Feeding plate; 53. Return spring; 54. Brush; 55. Support roller; 56. Telescopic rod; 57. Buffer spring; 58. Vibrating ring block; 59. Expanding rod; 510. Limiting slider; 511. Fixing block; 512. Displacement screw; 513. Baffle plate; 514. Return spring; 60. Air storage cylinder; 61. Pushing piston; 6 2. Inlet pipe; 63. Piston cylinder; 64. Sealing piston; 65. Retention spring; 66. Feed air pipe; 67. Discharge rack; 70. Motor bracket; 71. Intermittent motor; 72. Fixing rod; 73. Clamp turntable; 74. Upper tool holder plate; 75. Lower tool holder plate; 76. Spring telescopic clamp; 77. Sliding limit plate; 78. Tool guide rod; 79. Support spring; 710. Passive shearing blade; 711. Adjustment screw; 712. Spring return rod; 713. Sliding tool holder; 714. Active shearing blade; 715. Pneumatic cylinder; 716. Shearing air pipe. Detailed Implementation

[0020] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. The embodiments of the present invention are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the invention to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described to better illustrate the principles and practical application of the invention, and to enable those skilled in the art to understand the invention and design various embodiments with various modifications suitable for a particular purpose. Example

[0021] Please see Figure 1 - Figure 14 This invention provides a technical solution: a cutting device for semiconductor component lead processing, comprising: a base plate 1, a support frame 2 fixedly connected to the outer wall of the base plate 1, a screening cylinder 3 provided on the outer wall of the support frame 2, a stirring motor 4 fixedly connected to the bottom outer wall of the support frame 2, a vibrating screening device 5 provided inside the screening cylinder 3, a pneumatic intermittent feeding device 6 provided at the bottom of the screening cylinder 3, and a positioning cutting device 7 provided on one side of the pneumatic intermittent feeding device 6; the vibrating screening device 5 includes a rotating disk 50, a double-layer spiral plate 51 provided at the top of the rotating disk 50, a feeding plate 52 rotatably connected to the outer wall of the outlet of the double-layer spiral plate 51, a return spring 53 fixedly connected to the outer wall of the feeding plate 52, and the outer wall of the rotating disk 50... A brush 54 is slidably connected; a support roller 55 is fixedly connected to the bottom outer wall of the rotating disk 50; a telescopic rod 56 is fixedly connected to the outer wall of the rotating disk 50; and a buffer spring 57 is fixedly connected to the bottom outer wall of the rotating disk 50. A vibrating ring block 58 is slidably connected to the outer wall of the support roller 55; an unfolding rod 59 is symmetrically rotatably connected to the inner wall of the vibrating ring block 58; a limiting slider 510 is rotatably connected to the outer wall of one end of the unfolding rod 59; a retaining block 511 is fixedly connected to the outer wall of the limiting slider 510; a displacement screw 512 is threadedly connected to the inner wall of the limiting slider 510; a baffle plate 513 is slidably connected to the outer wall of the vibrating ring block 58; and a return spring 514 is fixedly connected to the outer wall of the baffle plate 513.

[0022] The outer wall of the rotating disk 50 is rotatably connected to the inner wall of the screening cylinder 3; the outer wall of the double-layer spiral plate 51 is fixedly connected to the inner wall of the screening cylinder 3; the outer wall of the brush 54 is fixedly connected to the outer wall of the central shaft of the double-layer spiral plate 51; the outer wall of the support roller 55 is slidably connected to the outer wall of the support frame 2; the outer wall of the telescopic rod 56 away from the rotating disk 50 is fixedly connected to the output end of the stirring motor 4; the outer wall of the buffer spring 57 away from the rotating disk 50 is slidably connected to the outer wall of the support frame 2; the outer wall of the vibrating ring block 58 is slidably connected to the inner wall of the support frame 2 and the outer wall of the telescopic rod 56 respectively; the outer wall of the limiting slider 510 is slidably connected to the inner wall of the bottom plate 1; the displacement screw 512 is rotatably connected to the bottom plate 1 through the support plate; the outer wall of the baffle plate 513 is slidably connected to the inner wall of the support frame 2; and the outer wall of the return spring 514 away from the baffle plate 513 is fixedly connected to the outer wall of the support frame 2.

[0023] The pneumatic intermittent feeding device 6 includes an air storage cylinder 60, a thrust piston 61 slidably connected to the inner wall of the air storage cylinder 60, an air inlet pipe 62 fixedly connected to the outer wall of the air storage cylinder 60, a piston cylinder 63 fixedly connected to the outer wall of the air inlet pipe 62, a sealing piston 64 slidably connected to the inner wall of the piston cylinder 63, a retaining spring 65 fixedly connected to the outer wall of the sealing piston 64, a feed air pipe 66 fixedly connected to the outer wall of the air inlet pipe 62, a piston cylinder 63 fixedly connected to the outer wall of the feed air pipe 66, and a discharge rack 67 fixedly connected to one end of the piston cylinder 63.

[0024] The air storage cylinder 60, the thrust piston 61, and the air inlet pipe 62 are arranged in a circumferential array along the outer wall of the support frame 2. The bottom outer wall of the air storage cylinder 60 is fixedly connected to the outer wall of the support frame 2. The outer wall of the thrust piston 61 is fixedly connected to the outer wall of the screening cylinder 3. The outer wall of the air inlet pipe 62 is fixedly connected to the inner wall of the support frame 2. The outer wall of the end of the retaining spring 65 away from the sealing piston 64 is fixedly connected to the inner wall of the piston cylinder 63. The outer wall of the discharge rack 67 is fixedly connected to the inner wall of the support frame 2. The top outer wall of the discharge rack 67 is fixedly connected to the bottom outer wall of the screening cylinder 3.

[0025] The positioning and cutting device 7 includes a motor bracket 70, an intermittent motor 71 fixedly connected to the bottom outer wall of the motor bracket 70, a fixed rod 72 rotatably connected to the inner wall of the motor bracket 70, a clamping turntable 73 symmetrically fixedly connected to the outer wall of the fixed rod 72, an upper blade holder plate 74 fixedly connected to the outer wall of the motor bracket 70 support rod, a lower blade holder plate 75 fixedly connected to the outer wall of the motor bracket 70, and a spring telescopic clamp 76 fixedly connected to the outer wall of the clamping turntable 73.

[0026] A sliding limit plate 77 is slidably connected to the outer wall of the spring telescopic clamp 76. Tool guide rods 78 are symmetrically fixed to the outer walls of the upper tool holder plate 74 and the lower tool holder plate 75. Support springs 79 are symmetrically fixed to the outer walls of the upper tool holder plate 74 and the lower tool holder plate 75. A passive shearing blade 710 is slidably connected to the outer wall of the tool guide rod 78. An adjustment screw 711 is threaded to the inner wall of the passive shearing blade 710. A spring return rod 712 is fixedly connected to the outer wall of the sliding limit plate 77.

[0027] A sliding blade holder 713 is fixedly connected to the outer wall of the elastic rebound rod 712. A blade guide rod 78 is symmetrically fixedly connected to the outer wall of the sliding blade holder 713. A support spring 79 is fixedly connected to the outer wall of the sliding blade holder 713. An active shearing blade 714 is slidably connected to the outer wall of the blade guide rod 78. An adjusting screw 711 is threadedly connected to the inner wall of the active shearing blade 714. A pneumatic cylinder 715 is slidably connected to the outer wall of the sliding blade holder 713. A shearing air pipe 716 is fixedly connected to the outer wall of one end of the pneumatic cylinder 715.

[0028] The bottom outer wall of the fixed rod 72 is fixedly connected to the output end of the intermittent motor 71, the outer wall of the fixed rod 72 is rotatably connected to the inner wall of the motor bracket 70, and the inner wall of the fixed rod 72 is rotatably connected to the outer wall of the support rod of the motor bracket 70.

[0029] The bottom outer wall of the sliding limit plate 77 is fixedly connected to the outer wall of the motor bracket 70 via a support rod. The end of the support spring 79 away from the outer wall of the upper blade holder plate 74 and the lower blade holder plate 75 is fixedly connected to the bottom outer wall of the passive shearing blade 710. The bottom outer wall of the adjusting screw 711 is rotatably connected to the outer wall of the upper blade holder plate 74 and the lower blade holder plate 75.

[0030] The outer wall of the sliding blade holder 713 is slidably connected to the inner wall of the sliding limit plate 77 outer wall slide rail. The outer wall of the supporting spring 79 away from the sliding blade holder 713 is fixedly connected to the bottom outer wall of the active shearing blade 714. The bottom outer wall of the adjusting screw 711 is rotatably connected to the outer wall of the sliding blade holder 713. The outer wall of the pneumatic cylinder 715 is fixedly connected to the inner wall of the sliding limit plate 77 outer wall slide rail. The outer wall of the shearing air pipe 716 away from the pneumatic cylinder 715 is fixedly connected to the outer wall of the air inlet pipe 62.

[0031] Working principle: When it is necessary to cut the leads of semiconductor components, the semiconductor components to be cut are first poured into the feed port of the screening cylinder 3. The poured semiconductor components slide down the outer wall of the double-layer spiral plate 51 in the vibrating screening device 5 and accumulate under the action of the discharge plate 52. The stirring motor 4 is started and rotated, which drives the rotating disk 50 to rotate through the telescopic rod 56. The bottom of the rotating disk 50 is fixedly connected to the support roller 55, and the outer wall of the support roller 55 is slidably connected to the vibrating ring block 58. When the support roller 55 slides along the protrusion of the vibrating ring block 58, it lifts the screening cylinder 3. When the support roller 55 reaches the highest point of the protrusion, it falls. Under the action of gravity, the rotating disk 50 squeezes the buffer spring 57 to protect the telescopic rod 56. The screening cylinder 3 falls with the semiconductor components accumulated inside, generating vibration and squeezing the discharge plate 52, causing the reset spring 53 to twist and no longer block the discharge port, so that the semiconductor components fall onto the rotating disk 50.

[0032] The rotating disk 50 has an annular groove on its outer wall near the outer ring. Semiconductor elements falling onto the rotating disk 50 are thrown towards the surrounding walls of the screening cylinder 3 by the centrifugal force generated by the rotation of the rotating disk 50. When passing through the groove of the rotating disk 50, some of the slower ones that fit the groove are captured by the groove. Both the groove of the rotating disk 50 and the bottom of the screening cylinder 3 have holes. As the rotating disk 50 rotates, when the holes of the rotating disk 50 are aligned with the holes of the screening cylinder 3, the semiconductor elements in the groove fall into the discharge rack 67 that is fixedly connected to the inner wall of the bottom of the screening cylinder 3.

[0033] When the groove is filled and the semiconductor components thrown by the centrifugal force of the single cup accumulate, the brush 54 fixed on the central axis of the double-layer spiral plate 51 begins to play its role. The brush surface of the brush 54 is flush with the disk surface of the rotating disk 50. When the accumulated semiconductor components pass through the brush 54, they are brushed off by the brush 54. The brush surface of the brush 54 is soft and will not damage the surface of the semiconductor components.

[0034] When the vibration amplitude is large, causing the semiconductor material to be fed too quickly, resulting in excessive accumulation on the rotating disk 50 and affecting the screening effect, the machine is stopped. The displacement screw 512 is rotated, causing the limit slider 510 to move in the opposite direction, increasing the spacing of the unfolding rods 59. This causes the vibrating ring block 58 to slide down along the outer wall of the telescopic rod 56. As the vibrating ring block 58 moves down, it no longer presses against the baffle plate 513. Under the action of the return spring 514, it slides out from the inner wall of the support frame 2 fixed on the base plate 1, simultaneously blocking the gap left by the vibrating ring block 58. At this time, the machine is restarted. The height of the support roller 55 on the ground is reduced, the gravitational potential energy is reduced, and the vibration amplitude is smaller, resulting in a slower feeding speed or no feeding at all. To prevent the unfolding rod 59 from unfolding at too large an angle and failing to return to its original position after reaching the limit position, a retaining block 511 is fixedly connected to the outer wall of the limit slider 510, so that the unfolding rod 59 can no longer reach the limit position, ensuring that the unfolding can unfold and retract normally and ensuring the stability of its function.

[0035] When the semiconductor element falls into the discharge rack 67 in the pneumatic intermittent feeding device 6, as the screening cylinder 3 moves upward, it drives the air-pushing piston 61 to move upward, creating a negative pressure in the air storage cylinder 60. The air pushes open the sealing piston 64 in the piston cylinder 63, compresses the retaining spring 65, enters the air inlet pipe 62, and further enters the air storage cylinder 60. As the screening cylinder 3 moves downward, it drives the air-pushing piston 61 to press down, squeezing the air in the air storage cylinder 60. The air then enters the feeding air pipe 66 through the air inlet pipe 62, pushes open the sealing piston 64 in the piston cylinder 63, compresses the retaining spring 65, and blows the air out. The blown-out air squeezes the semiconductor element in the discharge rack 67, causing the semiconductor element to be intermittently clamped by the spring telescopic clamp 76 in the positioning and cutting device 7.

[0036] After the semiconductor component is gripped by the spring telescopic clamp 76 in the positioning and cutting device 7, the intermittent motor 71 fixed on the motor bracket 70 drives the fixed rod 72 to rotate, causing the clamp turntable 73 to drive the spring telescopic clamp 76 to rotate intermittently. When the semiconductor component is moved to the designated position, the air drawn into the air storage cylinder 60 is discharged from the shearing air pipe 716, squeezing the piston rod on the back of the sliding blade holder 713, causing the piston rod to slide along the inner wall of the pneumatic cylinder 715, pushing the sliding blade holder 713 to squeeze the spring return rod 712, which slides along the inner wall of the slide rail on the outer wall of the sliding limit plate 77, driving the tool guide rod 78 and the positioning screw 711 to move, driving the active shearing blade 714 and the passive shearing blade 710 to engage and cut the pins of the semiconductor component. During cutting, the active shearing blade 714 squeezes the spring telescopic clamp 76 through the semiconductor component. After cutting, the spring telescopic clamp 76 is pushed out under the action of the spring, and the semiconductor component is pushed out under the action of the elastic force, disengaging from the spring telescopic clamp 76.

[0037] When it is necessary to adjust the lead cutting length of a semiconductor component, if the lead needs to be longer, rotate the adjusting screw 711. The active shearing blade 714 and the passive shearing blade 710 move upward along the tool guide rod 78 fixed on the upper tool holder plate 74 and the lower tool holder plate 75 under the action of the support spring 79, and the lead is left longer after cutting. If the lead needs to be shorter, rotate the adjusting screw 711. The active shearing blade 714 and the passive shearing blade 710 move downward along the tool guide rod 78 fixed on the upper tool holder plate 74 and the lower tool holder plate 75 under the action of the support spring 79, and the lead is left shorter after cutting.

[0038] Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art and related fields based on the embodiments of the present invention without inventive effort should fall within the scope of protection of the present invention. Structures, devices, and operating methods not specifically described and explained in the present invention, unless otherwise specified or limited, shall be implemented according to conventional means in the art.

Claims

1. A cutting device for processing semiconductor element leads, characterized in that, include: A base plate (1) is fixedly connected to a support frame (2) on its outer wall. A screening cylinder (3) is provided on the outer wall of the support frame (2). A stirring motor (4) is fixed on the bottom outer wall of the support frame (2). A vibrating screening device (5) is provided inside the screening cylinder (3). A pneumatic intermittent feeding device (6) is provided at the bottom of the screening cylinder (3). A position-adjusting cutting device (7) is provided on one side of the pneumatic intermittent feeding device (6). The vibrating screening device (5) includes a rotating disk (50), a double-layer spiral plate (51) is provided on the top of the rotating disk (50), a feeding plate (52) is rotatably connected to the outer wall of the outlet of the double-layer spiral plate (51), a return spring (53) is fixedly connected to the outer wall of the feeding plate (52), a brush (54) is slidably connected to the outer wall of the rotating disk (50), a support roller (55) is fixedly connected to the outer wall of the bottom end of the rotating disk (50), a telescopic rod (56) is fixedly connected to the outer wall of the rotating disk (50), and a buffer spring (57) is fixedly connected to the outer wall of the bottom end of the rotating disk (50). The outer wall of the support roller (55) is slidably connected to a vibrating ring block (58), the inner wall of the vibrating ring block (58) is symmetrically rotatably connected to an unfolding rod (59), one end of the unfolding rod (59) is rotatably connected to a limiting slider (510), the outer wall of the limiting slider (510) is fixedly connected to a retaining block (511), the inner wall of the limiting slider (510) is threadedly connected to a displacement screw (512), the outer wall of the vibrating ring block (58) is slidably connected to a baffle plate (513), and the outer wall of the baffle plate (513) is fixedly connected to a return spring (514).

2. The cutting equipment for semiconductor element lead processing according to claim 1, characterized in that: The outer wall of the rotating disk (50) is rotatably connected to the inner wall of the screening cylinder (3), the outer wall of the double-layer spiral plate (51) is fixedly connected to the inner wall of the screening cylinder (3), the outer wall of the brush (54) is fixedly connected to the outer wall of the central shaft of the double-layer spiral plate (51), the outer wall of the support roller (55) is slidably connected to the outer wall of the support frame (2), the outer wall of the telescopic rod (56) away from the rotating disk (50) is fixedly connected to the output end of the stirring motor (4), and the outer wall of the buffer spring (57) away from the rotating disk (50) is fixedly connected to the outer wall of the end away from the rotating disk (50). The outer wall of the vibrating ring block (58) is slidably connected to the outer wall of the support frame (2), and the outer wall of the vibrating ring block (58) is slidably connected to the inner wall of the support frame (2) and the outer wall of the telescopic rod (56), respectively. The outer wall of the limiting slider (510) is slidably connected to the inner wall of the base plate (1), the displacement screw (512) is rotatably connected to the base plate (1) through the support plate, the outer wall of the shielding plate (513) is slidably connected to the inner wall of the support frame (2), and the outer wall of the return spring (514) away from the shielding plate (513) is fixedly connected to the outer wall of the support frame (2).

3. The cutting equipment for semiconductor element lead processing according to claim 1, characterized in that: The pneumatic intermittent feeding device (6) includes an air storage cylinder (60), a thrust piston (61) is slidably connected to the inner wall of the air storage cylinder (60), an air inlet pipe (62) is fixedly connected to the outer wall of the air storage cylinder (60), a piston cylinder (63) is fixedly connected to the outer wall of the air inlet pipe (62), a sealing piston (64) is slidably connected to the inner wall of the piston cylinder (63), a retaining spring (65) is fixedly connected to the outer wall of the sealing piston (64), a feed air pipe (66) is fixedly connected to the outer wall of the air inlet pipe (62), a piston cylinder (63) is fixedly connected to the outer wall of the feed air pipe (66), and a discharge rack (67) is fixedly connected to one end of the piston cylinder (63).

4. The cutting equipment for semiconductor element lead processing according to claim 3, characterized in that: The air storage cylinder (60), the thrust piston (61), and the air inlet pipe (62) are arranged in a circumferential array along the outer wall of the support frame (2). The bottom outer wall of the air storage cylinder (60) is fixedly connected to the outer wall of the support frame (2). The outer wall of the thrust piston (61) is fixedly connected to the outer wall of the screening cylinder (3). The outer wall of the air inlet pipe (62) is fixedly connected to the inner wall of the support frame (2). The outer wall of the end of the retaining spring (65) away from the sealing piston (64) is fixedly connected to the inner wall of the piston cylinder (63). The outer wall of the discharge rack (67) is fixedly connected to the inner wall of the support frame (2). The top outer wall of the discharge rack (67) is fixedly connected to the bottom outer wall of the screening cylinder (3).

5. The cutting equipment for semiconductor element lead processing according to claim 1, characterized in that: The positioning and cutting device (7) includes a motor bracket (70), an intermittent motor (71) is fixedly connected to the bottom outer wall of the motor bracket (70), a fixed rod (72) is rotatably connected to the inner wall of the motor bracket (70), a clamp turntable (73) is symmetrically fixedly connected to the outer wall of the fixed rod (72), an upper tool holder plate (74) is fixedly connected to the outer wall of the motor bracket (70), a lower tool holder plate (75) is fixedly connected to the outer wall of the motor bracket (70), and a spring telescopic clamp (76) is fixedly connected to the outer wall of the clamp turntable (73).

6. The cutting equipment for semiconductor element lead processing according to claim 5, characterized in that: The outer wall of the spring telescopic clamp (76) is slidably connected to a sliding limit plate (77). The outer walls of the upper tool holder plate (74) and the lower tool holder plate (75) are symmetrically fixedly connected to tool guide rods (78). The outer walls of the upper tool holder plate (74) and the lower tool holder plate (75) are symmetrically fixedly connected to support springs (79). The outer wall of the tool guide rod (78) is slidably connected to a passive shearing blade (710). The inner wall of the passive shearing blade (710) is threadedly connected to an adjusting screw (711). The outer wall of the sliding limit plate (77) is fixedly connected to a spring return rod (712).

7. The cutting equipment for semiconductor element lead processing according to claim 6, characterized in that: The outer wall of the elastic rebound rod (712) is fixedly connected to a sliding blade holder (713), the outer wall of the sliding blade holder (713) is symmetrically fixedly connected to a blade guide rod (78), the outer wall of the sliding blade holder (713) is fixedly connected to a support spring (79), the outer wall of the blade guide rod (78) is slidably connected to an active shearing blade (714), the inner wall of the active shearing blade (714) is threadedly connected to an adjusting screw (711), the outer wall of the sliding blade holder (713) is slidably connected to a pneumatic cylinder (715), and one end of the pneumatic cylinder (715) is fixedly connected to a shearing air pipe (716).

8. The cutting equipment for semiconductor element lead processing according to claim 5, characterized in that: The bottom outer wall of the fixed rod (72) is fixedly connected to the output end of the intermittent motor (71), the outer wall of the fixed rod (72) is rotatably connected to the inner wall of the motor bracket (70), and the inner wall of the fixed rod (72) is rotatably connected to the outer wall of the support rod of the motor bracket (70).

9. A cutting device for semiconductor element lead processing according to claim 6, characterized in that: The bottom outer wall of the sliding limit plate (77) is fixedly connected to the outer wall of the motor bracket (70) via a support rod. The end of the support spring (79) away from the outer wall of the upper blade holder plate (74) and the lower blade holder plate (75) is fixedly connected to the bottom outer wall of the passive shearing blade (710). The bottom outer wall of the adjusting screw (711) is rotatably connected to the outer wall of the upper blade holder plate (74) and the lower blade holder plate (75).

10. A cutting device for semiconductor element lead processing according to claim 7, characterized in that: The outer wall of the sliding blade holder (713) is slidably connected to the inner wall of the sliding limit plate (77) outer wall slide rail. The outer wall of the supporting spring (79) away from the sliding blade holder (713) is fixedly connected to the bottom outer wall of the active shearing blade (714). The bottom outer wall of the adjusting screw (711) is rotatably connected to the outer wall of the sliding blade holder (713). The outer wall of the pneumatic cylinder (715) is fixedly connected to the inner wall of the sliding limit plate (77) outer wall slide rail. The outer wall of the shearing air pipe (716) away from the pneumatic cylinder (715) is fixedly connected to the outer wall of the air inlet pipe (62).

Images