A method, apparatus and product for in-mold injection molding of a PCBA

Abstract

The application discloses a PCBA in-mold injection molding method, equipment and products, the method comprises the following steps: forming a heat insulation protective coating on the PCBA, the heat insulation protective coating at least covers the electronic components and devices to be protected and the welding parts thereof on the PCBA; curing treatment is carried out on the heat insulation protective coating; the heat insulation performance of the cured heat insulation protective coating is detected; the PCBA with the protective film layer is positioned in the cavity of the injection mold, the molten injection material is injected into the cavity, the molten injection material is wrapped around the PCBA and the heat insulation protective coating, and an integrated injection molding part is formed after cooling. Wherein, the heat insulation protective coating is located between the electronic components and devices to be protected and the welding parts thereof and the molten injection material, used for blocking the heat transfer of the molten injection material to the electronic components and devices to be protected and the welding parts thereof during the in-mold injection molding process, and buffering the pressure impact of the molten injection material on the electronic components and devices to be protected and the welding parts thereof.

Description

Technical Field

[0001] This invention relates to the field of PCBA packaging technology, and in particular to a PCBA in-mold injection molding method, equipment and product. Background Technology

[0002] In the automotive and electronics industries, PCBAs are often required to have good waterproof and dustproof capabilities to withstand harsh operating environments. Currently, the main solutions are low-pressure in-mold injection molding and structural sealing.

[0003] PCBA low-pressure in-mold injection molding uses specialized injection molding equipment to encapsulate PCBA components with low-pressure, low-temperature hot-melt materials. This approach has the following drawbacks: First, low-pressure injection molding requires low-melting-point hot-melt adhesives (PA, polyolefins), resulting in high material costs. Second, low-pressure injection molded products exhibit poor mechanical properties and low dimensional accuracy, making it impossible to achieve thin-wall injection molding of high-performance engineering plastics such as PC. Third, low-pressure injection molding has lower production efficiency, slower filling, longer holding pressure, and a much longer molding cycle than high-pressure molding. Fourth, low-pressure injection molding requires specialized low-pressure molding equipment, making it incompatible with general-purpose injection molding machines and resulting in poor process compatibility.

[0004] Structural sealing solutions use matching sealing rings or sealants to achieve waterproof and dustproof effects, but they are highly dependent on mold and assembly precision, and are prone to aging of sealing rings or adhesives, resulting in a decline in sealing function. In addition, this solution involves complicated procedures and is costly.

[0005] Therefore, how to improve the packaging quality of PCBA is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0006] The first objective of this invention is to provide a PCBA in-mold injection molding method that pre-covers and cures the electronic components and solder joints on the PCBA with a heat-insulating protective coating, and confirms the heat insulation status of the coating by heat insulation performance testing before injection molding. This enables the PCBA to achieve reliable integrated encapsulation molding under the high temperature and high pressure conditions of ordinary in-mold injection molding, effectively improving the PCBA packaging quality. The second objective is to provide a PCBA in-mold injection molding equipment. The third objective is to provide a PCBA in-mold injection molded product.

[0007] To achieve the above objectives, the present invention provides the following technical solution:

[0008] A PCBA in-mold injection molding method includes the following steps:

[0009] A heat-insulating and protective coating is formed on the PCBA, the heat-insulating and protective coating at least covering the electronic components to be protected and their soldered parts on the PCBA;

[0010] The heat-insulating protective coating is cured to form a continuous protective film layer on the outside of the electronic components to be protected and their soldered parts.

[0011] The thermal insulation performance of the cured thermal insulation protective coating is tested. The thermal insulation performance test includes: applying thermal excitation to the area of ​​the PCBA where the thermal insulation protective coating is formed, collecting the temperature distribution information of the PCBA, and determining the thermal insulation status of the thermal insulation protective coating based on the temperature distribution information.

[0012] The PCBA with the protective film layer is positioned in the cavity of the injection mold, and molten injection material is injected into the cavity so that the molten injection material covers the PCBA and the heat insulation protective coating, and is cooled to form an integrated injection molded part.

[0013] In some embodiments, before forming a heat-insulating protective coating on the PCBA, the PCBA is pretreated, the pretreatment including removing oil, dust and / or flux residue from the surface of the PCBA, and drying the cleaned PCBA.

[0014] In some embodiments, the heat-insulating protective coating covers the entire PCBA surface, the outer surface of surface mount electronic components, and the solder joint area.

[0015] In some embodiments, the heat-insulating protective coating is a UV-curable heat-insulating protective coating, a thermosetting heat-insulating protective coating, or a UV and thermosetting dual-curable heat-insulating protective coating.

[0016] In some embodiments, the thermal insulation performance test is performed by a thermal insulation performance test module, which includes an infrared light source module and an infrared imaging acquisition module. During the test, the PCBA is placed on a PCBA support with the surface having the thermal insulation protective coating facing the infrared light source module. The infrared light source module applies thermal excitation to the PCBA, and the infrared imaging acquisition module acquires the temperature distribution image of the PCBA.

[0017] In some embodiments, the presence of uneven thickness, missing coating, or damage to the heat insulation protective coating is determined based on the temperature rise difference between the area where the heat insulation protective coating is formed and the area where the heat insulation protective coating is not formed or the preset reference area, the temperature uniformity of the area corresponding to the heat insulation protective coating, and / or the distribution of abnormal hot spots. When it is determined that the heat insulation state meets the preset requirements, the PCBA is then positioned in the cavity of the injection mold.

[0018] In some embodiments, the electrical performance of the PCBA is tested before the PCBA with the protective film layer is positioned in the cavity of the injection mold.

[0019] In some embodiments, the electrical performance of the PCBA is tested after the integrated injection molded part has been cooled and formed.

[0020] A PCBA in-mold injection molding equipment for implementing any of the above-described PCBA in-mold injection molding methods includes: a heat insulation layer spraying module, a curing module, a heat insulation performance testing module, and an injection mold. The heat insulation layer spraying module is used to spray a heat insulation protective coating onto at least the electronic components to be protected and their soldered parts on the PCBA; the curing module is used to cure the heat insulation protective coating; the heat insulation performance testing module is used to test the heat insulation performance of the heat insulation protective coating; and the injection mold is used to form an integrated injection molded part on the PCBA and the heat insulation protective coating.

[0021] A PCBA in-mold injection molded product is manufactured using any of the PCBA in-mold injection molding methods described above. The PCBA in-mold injection molded product includes a PCBA substrate, electronic components welded and fixed to the PCBA substrate, welding parts of the electronic components, a heat-insulating protective coating, and an integrated injection molded encapsulation layer. The heat-insulating protective coating covers the electronic components and their welding parts, and the integrated injection molded encapsulation layer covers the outer side of the PCBA substrate and the heat-insulating protective coating.

[0022] Compared with existing technologies, the above technical solution has at least the following advantages:

[0023] The present invention provides an in-mold injection molding method for PCBA, characterized by comprising the following steps: forming a heat-insulating protective coating on the PCBA, the heat-insulating protective coating covering at least the electronic components to be protected and their soldering parts on the PCBA; curing the heat-insulating protective coating to form a continuous protective film layer on the outside of the electronic components to be protected and their soldering parts; testing the heat insulation performance of the cured heat-insulating protective coating, the heat insulation performance test including: applying thermal excitation to the area of ​​the PCBA with the heat-insulating protective coating, collecting temperature distribution information of the PCBA, and determining the heat insulation state of the heat-insulating protective coating based on the temperature distribution information; positioning the PCBA with the protective film layer in the cavity of the injection mold, injecting molten injection material into the cavity, so that the molten injection material covers the PCBA and the heat-insulating protective coating, and cooling to form an integrated injection molded part. The heat-insulating protective coating is located between the electronic components and their soldered parts to be protected and the molten injection material. It serves to block heat transfer from the molten injection material to the electronic components and their soldered parts during in-mold injection molding and to buffer the pressure impact of the molten injection material on these components. Furthermore, by testing the heat-insulating performance of the cured heat-insulating protective coating before injection molding and using thermal excitation and temperature distribution information to determine its heat-insulating state, it is possible to determine whether the heat-insulating protective coating has effective protective capabilities before the PCBA enters the mold for injection molding. This allows for the early detection of abnormalities such as insufficient heat insulation, coating discontinuity, missed coating, or damage, improving the reliability of pre-injection quality control. Additionally, by positioning the PCBA with the protective film layer within the injection mold cavity and having the molten injection material encapsulate the PCBA and the heat-insulating protective coating, an integrated injection-molded part can be formed while protecting the electronic components and their soldered parts. This reduces reliance on traditional shell assembly and sealing structures, improving the overall integrity, molding efficiency, and reliability of the PCBA package. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0025] Figure 1 A flowchart of an in-mold injection molding method for PCBA provided in a specific embodiment of the present invention;

[0026] Figure 2 This is a comparative diagram showing the difference between having no heat insulation coating and having a heat insulation coating;

[0027] Figure 3This is a cross-sectional view of an in-mold injection molded PCBA product according to a specific embodiment of the present invention.

[0028] Figure 4 This is a schematic diagram of the structure of an in-mold injection molded PCBA product according to a specific embodiment of the present invention;

[0029] Figure 5 This is a schematic diagram of the structure of a heat insulation performance testing module for an in-mold injection molding equipment for PCBA, provided in a specific embodiment of the present invention.

[0030] The attached figures are labeled as follows:

[0031] 10-PCBA substrate; 11-electronic components; 12-soldering area; 13-connector; 20-heat insulation and protective coating; 30-integrated injection molding encapsulation layer; 40-PCBA bracket; 50-infrared light source module; 60-infrared imaging acquisition module. Detailed Implementation

[0032] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0033] Please refer to Figures 1 to 5 .

[0034] The PCBA in-mold injection molding method provided by this invention includes the following steps:

[0035] Step 1: Form a heat-insulating protective coating on the PCBA. The heat-insulating protective coating should at least cover the electronic components to be protected and their soldered areas on the PCBA. A high-temperature and high-pressure resistant heat-insulating protective coating is formed on the PCBA surface, the outer surface of the surface-mount electronic components, and the solder joint area. The heat-insulating protective coating can be formed by spraying or spin coating, and can cover the entire PCBA surface or only the electronic components to be protected and their soldered areas. The electronic components to be protected may include chips, capacitors, wafers, surface-mount electronic components, etc. Preferably, the heat-insulating protective coating covers the entire PCBA surface, the outer surface of the surface-mount electronic components, and the solder joint area.

[0036] The total thickness of the heat-insulating protective coating can be 100μm to 300μm, and the thickness of a single film can be 50μm to 80μm; for sensitive component areas, the thickness can be increased to 200μm to 300μm. The heat-insulating protective coating can be a UV-curable modified silicone heat-insulating protective coating, which includes acrylic modified silicone resin and ceramic hollow microspheres and / or silica hollow sphere fillers.

[0037] The thermal conductivity of the heat-insulating protective coating can be 0.08 W / (m·K) to 0.15 W / (m·K), the coefficient of thermal expansion can be no greater than 120 ppm / ℃, the short-term withstand temperature can be no less than 300℃, the long-term withstand temperature can be no less than 150℃, the dielectric strength can be no less than 27 kV / mm, the volume resistivity can be no less than 1×10^8 Ω·cm, the withstand voltage can be no less than 1.5 kV, the Shore A hardness can be 60 to 80, and the adhesion to FR-4, solder pads, or components can be no less than 3 MPa. Other heat-insulating protective coatings that can achieve thermal insulation and protection can also be selected, such as nano-ceramic inorganic heat-insulating coatings, modified epoxy / phenolic oxide heat-resistant coatings, and parylene coatings.

[0038] Step Two: Curing the heat-insulating protective coating to form a continuous protective film on the outer side of the electronic components and their soldered areas. The heat-insulating protective coating can be a UV-curable, thermosetting, or a dual-curable (UV and thermo) type. During curing, the PCBA with the heat-insulating protective coating is fed into a UV curing or thermosetting device to cure the coating, forming a continuous and dense protective film on the outer side of the PCBA and the electronic components. When using UV curing, the UV light energy can be 800mJ / cm² to 1600mJ / cm², and the curing time can be 20s to 120s.

[0039] Step 3: Perform thermal insulation performance testing on the cured thermal insulation protective coating. This testing includes: applying thermal excitation to the area of ​​the PCBA with the thermal insulation protective coating, collecting temperature distribution information of the PCBA, and determining the thermal insulation status of the coating based on this information. The thermal excitation can be applied using a mid-wave infrared light source. The wavelength of the mid-wave infrared light source can be 2.0μm~4.0μm, the power density can be 0.4W / cm²~1.5W / cm², the heating time can be 5s~10s, the light source temperature can be 100℃~150℃, and the vertical distance between the infrared light source module and the PCBA can be 80mm~150mm. During testing, the temperature rise in the area of ​​the PCBA with the thermal insulation coating can be 15℃~40℃, and the temperature rise in the area without the thermal insulation coating can be 22℃~46℃. Once the thermal insulation status is determined to meet the preset requirements, the PCBA is then positioned within the cavity of the injection mold. (See also...) Figure 2 Since the heat-insulating protective coating can reduce the heat transfer of molten injection material to the solder joint, the peak temperature and heating rate of the solder joint with the heat-insulating protective coating can be lower than those of the solder joint without the heat-insulating protective coating, which helps to reduce the risk of solder joint hot melting and component displacement.

[0040] The thermal insulation performance test can be performed using a thermal insulation performance testing module, which includes an infrared light source module and an infrared imaging acquisition module. During testing, the PCBA is placed on the PCBA support 40 with the surface of the thermal insulation protective coating facing the infrared light source module 50. The infrared light source module 50 applies thermal excitation to the PCBA, and the infrared imaging acquisition module 60 acquires the temperature distribution image of the PCBA. By comparing the temperature distribution of the coated area with the uncoated area or a preset reference area, the thermal insulation effect of the thermal insulation protective coating can be determined, and the uniformity of the coating thickness and whether there is any missed coating or damage can be further determined. For example, based on the temperature rise difference between the area with the thermal insulation protective coating and the area without the thermal insulation protective coating or the preset reference area, the temperature uniformity of the corresponding area of ​​the thermal insulation protective coating, and / or the distribution of abnormal hot spots, it can be determined whether there is uneven thickness, missed coating, or damage to the thermal insulation protective coating. For example, if the temperature of a certain area that should be sprayed is high, it indicates that it has not been sprayed or the coating thickness is too thin. When it is determined that the thermal insulation state meets the preset requirements, the PCBA is then positioned in the cavity of the injection mold. This improves injection molding quality and prevents products from being unreworkable due to uneven, missed, or damaged heat insulation coatings.

[0041] Step 4: Position the PCBA with the protective film layer inside the injection mold cavity. Inject molten injection molding material into the cavity, allowing the molten injection molding material to coat the PCBA and the heat-insulating protective coating. After cooling, a one-piece injection molded part is formed. For example, a PCBA with a protective film layer and confirmed heat insulation is fixedly placed inside the injection mold cavity. After mold closing, molten injection molding material is injected into the cavity, allowing the molten injection molding material to coat the PCBA and the heat-insulating protective coating. The one-piece coating is then completed under the high temperature and high pressure conditions of ordinary in-mold injection molding. The injection molding material can be selected from at least one of engineering plastics such as PC, PBT, PMMA, PA, ABS, PC+ABS, PPS, and PA66; the melt temperature can be 220℃~300℃, the injection pressure can be 75MPa~130MPa, and the mold temperature can be 55℃~95℃.

[0042] The heat-insulating protective coating is located between the electronic components and their soldered parts to be protected and the molten injection material. It serves to block heat transfer from the molten injection material to the electronic components and their soldered parts during in-mold injection molding and to buffer the pressure impact of the molten injection material on these components. Furthermore, by testing the heat-insulating performance of the cured heat-insulating protective coating before injection molding and using thermal excitation and temperature distribution information to determine its heat-insulating state, it is possible to determine whether the heat-insulating protective coating has effective protective capabilities before the PCBA enters the mold for injection molding. This allows for the early detection of abnormalities such as insufficient heat insulation, coating discontinuity, missed coating, or damage, improving the reliability of pre-injection quality control. Additionally, by positioning the PCBA with the protective film layer within the injection mold cavity and having the molten injection material encapsulate the PCBA and the heat-insulating protective coating, an integrated injection-molded part can be formed while protecting the electronic components and their soldered parts. This reduces reliance on traditional shell assembly and sealing structures, improving the overall integrity, molding efficiency, and reliability of the PCBA package.

[0043] After injection molding, a cooling and demolding process is carried out. After the product in the mold has cooled and solidified, the mold is opened and the integrated injection-molded PCBA finished product is taken out.

[0044] Before forming the heat-insulating protective coating on the PCBA, a pretreatment process is performed. This pretreatment includes removing oil, dust, and / or flux residue from the PCBA surface, followed by drying. This ensures the cleanliness of the PCBA substrate and electronic component surfaces, guaranteeing the adhesion of the subsequent coating. Pretreatment can employ plasma cleaning or anhydrous ethanol ultrasonic cleaning. When using plasma cleaning, the cleaning power can be 100W–300W, and the cleaning time can be 30s–90s. After cleaning, the surface energy of the PCBA can be increased to 36mN / m–55mN / m.

[0045] To ensure the electrical performance of the PCBA before and after injection molding, the PCBA with a protective film layer is tested for electrical performance before being positioned in the cavity of the injection mold to confirm that the PCBA still maintains normal electrical function after spraying, curing and heat insulation performance testing; after cooling to form an integrated injection molded part, the PCBA is tested for electrical performance again to confirm that the electronic function of the PCBA is normal after injection molding.

[0046] An automotive UWB product was molded using in-mold injection molding. First, a standard PCBA circuit board with SMT assembly was selected, ultrasonically cleaned with anhydrous ethanol, and then dried at a constant temperature. Next, a UV-curable heat-insulating protective coating was sprayed over the entire PCBA and components, with the film thickness controlled at 100μm–130μm. Then, the UV curing equipment was turned on, the UV light energy was adjusted to 1600mJ / cm², and curing was performed for 55 seconds to form a uniform and dense protective film.

[0047] When testing the thermal insulation performance of the aforementioned PCBA, the infrared wavelength was 3.5 μm, the power density was 0.7 W / cm², the heating time was 8 s, the heat source temperature was set at 140℃, and the distance from the heat source to the board was 110 mm. The test results showed that the temperature rise in the area with the thermal insulation coating was 25℃, and the temperature rise in the area without the thermal insulation coating was 32℃. Subsequently, functional testing was performed on the PCBA.

[0048] The coated PCBA was fixed in the injection mold. PBT GF30 injection molding material was selected, and the melt temperature was set to 265℃, the injection pressure to 95MPa, the mold temperature to 80℃, and the holding time to 23s. In-mold injection was then carried out. After cooling and demolding, a full electrical inspection was performed. The results showed that the PCBA circuit functioned normally, and there were no cracks, displacements, or detachments of components. There were no blistering or burning phenomena on the board surface.

[0049] This invention also provides an in-mold injection molding equipment for PCBA, used to implement any of the above-described PCBA in-mold injection molding methods, comprising: a heat insulation layer spraying module, a curing module, a heat insulation performance testing module, and an injection mold. The heat insulation layer spraying module is used to spray a heat insulation protective coating onto at least the electronic components to be protected and their soldered parts on the PCBA; the curing module is used to cure the heat insulation protective coating; the heat insulation performance testing module is used to test the heat insulation performance of the heat insulation protective coating; and the injection mold is used to form an integrated injection molded part on the PCBA and the heat insulation protective coating. Furthermore, it includes an electrical performance testing module for performing electrical performance testing on the PCBA.

[0050] This invention also provides an in-mold injection molded PCBA product, which is manufactured using any of the above-described in-mold injection molding methods. The in-mold injection molded PCBA product includes a PCBA substrate 10, electronic components 11 welded and fixed to the PCBA substrate 10, welding portions 12 of the electronic components 11, a heat-insulating protective coating 20, and an integrated injection molding encapsulation layer 30. The heat-insulating protective coating 20 covers the electronic components 11 and their welding portions 12. The integrated injection molding encapsulation layer 30 covers the outside of the PCBA substrate 10 and the heat-insulating protective coating 20. The in-mold injection molded PCBA product also includes a connector 13 electrically connected to the PCBA substrate 10. The connector 13 is at least partially exposed outside the integrated injection molding encapsulation layer 30 for electrical connection with external devices.

[0051] It should be noted that in this specification, relational terms such as first and second are used only to distinguish one entity from several other entities, and do not necessarily require or imply any such actual relationship or order between these entities.

[0052] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0053] The foregoing has provided a detailed description of the PCBA in-mold injection molding method, equipment, and product provided by this invention. Specific examples have been used to illustrate the principles and implementation methods of this invention; the descriptions of these embodiments are merely for the purpose of helping to understand the core ideas of this invention. It should be noted that those skilled in the art can make various improvements and modifications to this invention without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this invention.

Claims

1. A method for in-mold injection molding of PCBA, characterized in that, Includes the following steps: A heat-insulating and protective coating is formed on the PCBA, the heat-insulating and protective coating at least covering the electronic components to be protected and their soldered parts on the PCBA; The heat-insulating protective coating is cured to form a continuous protective film layer on the outside of the electronic components to be protected and their soldered parts. The thermal insulation performance of the cured thermal insulation protective coating is tested. The thermal insulation performance test includes: applying thermal excitation to the area of ​​the PCBA where the thermal insulation protective coating is formed, collecting the temperature distribution information of the PCBA, and determining the thermal insulation status of the thermal insulation protective coating based on the temperature distribution information. The PCBA with the protective film layer is positioned in the cavity of the injection mold, and molten injection material is injected into the cavity so that the molten injection material covers the PCBA and the heat insulation protective coating, and is cooled to form an integrated injection molded part.

2. The PCBA in-mold injection molding method according to claim 1, characterized in that, Before forming a heat-insulating protective coating on the PCBA, the PCBA is pretreated. The pretreatment includes removing oil, dust and / or flux residue from the surface of the PCBA and drying the cleaned PCBA.

3. The PCBA in-mold injection molding method according to claim 1, characterized in that, The heat-insulating and protective coating covers the entire PCBA surface, the outer surface of surface-mount electronic components, and the solder joint area.

4. The PCBA in-mold injection molding method according to claim 1, characterized in that, The heat insulation and protective coating is a UV-curable heat insulation and protective coating, a thermosetting heat insulation and protective coating, or a UV and thermosetting dual-curable heat insulation and protective coating.

5. The PCBA in-mold injection molding method according to claim 1, characterized in that, The thermal insulation performance test is performed through a thermal insulation performance test module, which includes an infrared light source module and an infrared imaging acquisition module. During the test, the PCBA is placed on a PCBA support with the surface having the thermal insulation protective coating facing the infrared light source module. The infrared light source module applies thermal excitation to the PCBA, and the infrared imaging acquisition module acquires the temperature distribution image of the PCBA.

6. The PCBA in-mold injection molding method according to claim 5, characterized in that, Based on the temperature rise difference between the area where the heat insulation protective coating is formed and the area where the heat insulation protective coating is not formed or the preset reference area, the temperature uniformity and / or abnormal hot spot distribution of the area corresponding to the heat insulation protective coating, it is determined whether the heat insulation protective coating has uneven thickness, missing coating or damage. When it is determined that the heat insulation state meets the preset requirements, the PCBA is then positioned in the cavity of the injection mold.

7. The PCBA in-mold injection molding method according to claim 1, characterized in that, Before positioning the PCBA with the protective film layer into the cavity of the injection mold, the electrical performance of the PCBA is tested.

8. The PCBA in-mold injection molding method according to claim 1, characterized in that, After the integrated injection molded part is cooled and formed, the electrical performance of the PCBA is tested.

9. A PCBA in-mold injection molding equipment, used to implement the PCBA in-mold injection molding method according to any one of claims 1 to 8, characterized in that, include: The system includes a heat insulation layer spraying module, a curing module, a heat insulation performance testing module, and an injection mold. The heat insulation layer spraying module is used to spray a heat insulation protective coating onto at least the electronic components to be protected and their soldered parts on the PCBA. The curing module is used to cure the heat insulation protective coating. The heat insulation performance testing module is used to test the heat insulation performance of the heat insulation protective coating. The injection mold is used to form an integrated injection molded part on the PCBA and the heat insulation protective coating.

10. A PCBA in-mold injection molded product, characterized in that, The PCBA is manufactured using the in-mold injection molding method according to any one of claims 1 to 8. The PCBA in-mold injection molded product includes a PCBA substrate, electronic components welded and fixed to the PCBA substrate, the welding parts of the electronic components, a heat-insulating protective coating, and an integrated injection molded encapsulation layer. The heat-insulating protective coating covers the electronic components and their welding parts, and the integrated injection molded encapsulation layer covers the outside of the PCBA substrate and the heat-insulating protective coating.

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