Detection circuit substrate for detecting micro light emitting diode display driving backplane

Abstract

A detection circuit substrate for detecting a micro light emitting diode display driving backboard includes a substrate, a detection pad disposed on the substrate, a conductive circuit and a conductive bump. The conductive circuit is electrically connected to the detection pad, and the conductive bump is electrically connected to the conductive circuit. The substrate is used for aligning and adhering to the micro light emitting diode display driving backboard, so that the detection pad is electrically connected to a pair of contact pads of the micro light emitting diode display driving backboard, the conductive bump is electrically connected to a first test pad of the micro light emitting diode display driving backboard, and the detection pad, the pair of contact pads, the conductive circuit, the conductive bump and the first test pad form a detection circuit.

Description

Technical Field

[0001] This invention relates to a detection circuit board for detecting the backplane of a micro LED display driver. Background Technology

[0002] Micro light-emitting diode (micro LED) displays are a type of flat-panel display (FPD) composed of light-emitting diodes ranging in size from 1 to 100 micrometers. Compared to liquid crystal displays (LCDs), micro LED displays offer higher contrast, faster response times, and lower power consumption. With advancements in optoelectronic technology, the size of optoelectronic components is continuously decreasing. Therefore, micro LED displays have become the mainstream trend in the current display industry.

[0003] Currently, miniature LED display devices can be formed by mass-transferring miniature LEDs to a miniature LED display driver backplane. Therefore, it is necessary to ensure that the miniature LED display driver backplane has normal driving capability before the mass transfer step. However, the pad pairs on the miniature LED display driver backplane consist of two separate and insulated pads. Existing test pads on the miniature LED display driver backplane can only test the driving element (e.g., thin-film transistor) that can form a detection circuit under the aforementioned pad pair, and cannot test the conductive connection holes located between the aforementioned pad pair and the aforementioned driving element that are used to electrically connect the aforementioned pad pair and the aforementioned driving element. Summary of the Invention

[0004] This invention provides a test circuit board for testing a micro LED display driver backplane. It can test the pad pairs and conductive connection holes of the driver elements disposed in the micro LED display driver backplane for electrical connection, thereby ensuring the yield of the micro LED display driver backplane.

[0005] The detection circuit board for testing a micro-LED display driver backplane, as proposed in at least one embodiment of the present invention, comprises a substrate, a plurality of detection pads, conductive lines, and conductive bumps. The detection pads are disposed on the substrate, the conductive lines are disposed on the substrate and electrically connected to the detection pads, and the conductive bumps are disposed on the substrate and electrically connected to the conductive lines. The detection circuit board is used to align and bond with the micro-LED display driver backplane, such that the detection pads are respectively electrically connected to a plurality of pad pairs of the micro-LED display driver backplane, and the conductive bumps are electrically connected to a first test pad of the micro-LED display driver backplane, thereby forming a detection circuit from the detection pads, the pad pairs, the conductive lines, the conductive bumps, and the first test pad.

[0006] In at least one embodiment of the present invention, each of the test pads is electrically connected to the first pad and the second pad of each of the pad pairs to conduct the first pad and the second pad, and receives a test signal from the second test pad of the micro LED display driver backplane via one of the first pad and the second pad.

[0007] In at least one embodiment of the present invention, the test signal is used to obtain a feedback signal at the first test pad via the detection circuit, and the micro LED display driver backplane is used to determine whether it has a defect by checking whether the feedback signal meets a preset value.

[0008] In at least one embodiment of the present invention, the detection circuit board for detecting the micro LED display driver backplane further includes a detection alignment mark. The detection alignment mark is disposed on the substrate and is used to align with the existing alignment mark of the micro LED display driver backplane so that the detection circuit board and the micro LED display driver backplane are aligned and bonded.

[0009] In at least one embodiment of the present invention, the substrate has one or more openings.

[0010] In at least one embodiment of the present invention, the detection circuit substrate for detecting the micro light-emitting diode display driving backplane further includes an insulating layer disposed on the substrate and located between the conductive lines and the plurality of detection pads, and having a plurality of through holes, wherein the plurality of detection pads are electrically connected to the conductive lines via these through holes.

[0011] In at least one embodiment of the present invention, when the detection circuit substrate and the micro light-emitting diode display driving backplate are aligned and bonded, the plurality of through holes and the plurality of pads overlap in the normal direction of the substrate.

[0012] In at least one embodiment of the present invention, when the detection circuit board and the micro light-emitting diode display driving backplate are aligned and bonded, the plurality of through holes and the plurality of pads do not overlap in the normal direction of the substrate.

[0013] In at least one embodiment of the present invention, each of the detection pads includes a pad connection portion and a circuit connection portion. The pad connection portion is used to connect the first pad and the second pad of each pad pair. The circuit connection portion is used to connect the conductive circuit and is separate from the pad connection portion.

[0014] In at least one embodiment of the present invention, the plurality of detection pads, the conductive lines and the conductive bumps are formed by the same conductive layer in the same manufacturing process. Attached Figure Description

[0015] Figure 1AThis is a top view schematic diagram of a micro light-emitting diode display driving backplate according to at least one embodiment of the present invention;

[0016] Figure 1B yes Figure 1A A schematic diagram of the cross section drawn along section line a-a';

[0017] Figure 2 This is a top view schematic diagram of the detection circuit board according to at least one embodiment of the present invention;

[0018] Figure 3A This is a top view schematic diagram of the detection circuit board and the micro light-emitting diode display driver backplate after alignment and bonding according to at least one embodiment of the present invention;

[0019] Figure 3B yes Figure 3A A schematic diagram of the cross section drawn along section line b-b';

[0020] Figure 4A This is a top view schematic diagram of the detection circuit board and the micro light-emitting diode display driver backplate after alignment and bonding according to at least another embodiment of the present invention;

[0021] Figure 4B yes Figure 4A A schematic diagram of the cross section drawn along section line c-c';

[0022] Figure 5A This is a top view schematic diagram of the detection circuit board and the micro light-emitting diode display driver backplate after alignment and bonding according to at least another embodiment of the present invention;

[0023] Figure 5B yes Figure 5A A schematic diagram of a cross-section drawn along the section line d-d'.

[0024] Figure 6 This is a top view schematic diagram of the detection circuit board according to at least another embodiment of the present invention.

[0025] Symbol Explanation

[0026] 10: Miniature LED display driver backplane

[0027] 12: Base Plate

[0028] 14: Connecting pads

[0029] 16a: First test pad

[0030] 16b: Second test pad

[0031] 18: Existing alignment marker

[0032] 20: Miniature LED

[0033] 100, 100', 100A, 100B: Testing circuit board

[0034] 102, 102': Substrate

[0035] 104, 104A, 104B: Test pads

[0036] 106: Conductive circuit

[0037] 106a, 106b: Branch lines

[0038] 106c: Aggregation Line

[0039] 108: Conductive bump

[0040] 110: Detect alignment markers

[0041] 120: Insulation layer

[0042] CV: Conductive connection hole

[0043] IL: Dielectric layer

[0044] ML: Metal layer

[0045] ND: Normal direction

[0046] O1, O2: Openings

[0047] P1: First bonding pad

[0048] P2: Second bonding pad

[0049] PP: Connector

[0050] SW: Drive element

[0051] T1, T1A, T2: Perforation

[0052] WP: Wiring Connection Section Detailed Implementation

[0053] In the following text, to clearly present the technical features of the present invention, the dimensions (e.g., length, width, thickness, and depth) of the elements (e.g., layers, films, substrates, and regions) in the accompanying drawings will be enlarged proportionally, and the number of some elements may be reduced. Therefore, the description and explanation of the embodiments below are not limited to the number of elements in the drawings or the size and shape of the elements, but should cover the dimensions, shapes, and deviations thereof caused by actual manufacturing processes and / or tolerances. For example, a flat surface shown in the drawings may have rough and / or non-linear characteristics, and an acute angle shown in the drawings may be rounded. Therefore, the elements presented in the accompanying drawings of the present invention are primarily for illustration and are not intended to precisely depict the actual shape of the elements, nor are they intended to limit the claims of the present invention.

[0054] The spatial relative terms used in this invention, such as "below," "under," "above," and "above," are for the convenience of describing the relative relationship between one element or feature and another, as illustrated in the figures. The true meaning of these spatial relative terms includes other orientations. For example, when the illustration is rotated 180 degrees vertically, the relationship between one element and another may change from "below" or "under" to "above" or "above." Furthermore, the spatial relative descriptions used in this invention should be interpreted in the same way.

[0055] It should be understood that although the present invention may use terms such as "first," "second," and "third" to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are primarily used to distinguish one element from another, or one signal from another. Furthermore, the term "or" as used in this invention may, as appropriate, include any combination of one or more of the associated listed items.

[0056] Although this invention uses a series of operations or steps to illustrate the detection method, the order in which these operations or steps are shown should not be construed as a limitation of the invention. For example, some operations or steps may be performed in a different order and / or simultaneously with other steps. Furthermore, each operation or step described herein may comprise several sub-steps or actions.

[0057] Furthermore, the present invention can be implemented or applied through other different specific embodiments, and the details of the present invention can also be combined, modified and changed in various embodiments based on different viewpoints and applications without departing from the concept of the present invention.

[0058] Figure 1A This is a top view schematic diagram of a micro LED display driving backplane 10 according to at least one embodiment of the present invention. Please refer to... Figure 1A The micro LED display driver backplane 10 includes a base plate 12, a plurality of pad pairs 14 disposed on the base plate 12, a first test pad 16a, a second test pad 16b, and an existing alignment mark 18, and each pad pair 14 includes a first pad P1 and a second pad P2. It should be understood that, although... Figure 1A The illustration only shows four pad pairs 14 as representative examples, but the invention is not limited thereto. In other embodiments, the number of pad pairs 14 can be increased or decreased depending on the size and resolution of the display device to which the micro LED display driver backplane 10 is applied.

[0059] Figure 1B yes Figure 1A A schematic cross-sectional view drawn along section line a-a'. Please refer to [link / reference]. Figure 1A and Figure 1BThe micro LED display driver backplane 10 also includes a driving element SW located between the base plate 12 and the pad pair 14, a metal layer ML located on the driving element SW and electrically connected to the driving element SW, a dielectric layer IL located on the metal layer ML, and a conductive connection hole CV passing through the dielectric layer IL and electrically connected to the metal layer ML. Figure 1B As shown, pad pair 14 is disposed on conductive connection hole CV, and the first pad P1 of pad pair 14 is electrically connected to conductive connection hole CV, while micro light-emitting diode 20 is electrically connected to pad pair 14.

[0060] In some embodiments, the first pad P1 receives an operating voltage (Vdd), and the second pad P2 receives a reference voltage (Vss). The miniature light-emitting diode 20 includes an N-type electrode (unlabeled) and a P-type electrode (unlabeled). The N-type electrode of the miniature light-emitting diode 20 can be electrically connected to one of the first pad P1 and the second pad P2, and the P-type electrode of the miniature light-emitting diode 20 can be electrically connected to the other of the first pad P1 and the second pad P2.

[0061] like Figure 1A and Figure 1B As shown, the test pads (unlabeled) on the micro LED display driver backplane 10 can form a detection circuit for the signal layers including the metal layer ML and below, while the signal layers above the metal layer ML are the first pad P1 and the conductive connection hole CV, which are separated from and insulated from the second pad P2. Therefore, the conductive connection hole CV of the micro LED display driver backplane 10 can be detected by the detection circuit board 100 provided by the present invention, which is used to electrically connect the pads of the micro LED display driver backplane 10.

[0062] It should be understood that, although Figure 1B The diagram illustrates a conductive connection hole CV passing through a dielectric layer IL to electrically connect a metal layer ML and a first pad P1. However, this invention is not limited to this. In other embodiments, the number of dielectric layers and conductive connection holes stacked between the metal layer ML and the pad pair 14 can be set as needed. The detection circuit board 100 provided by this invention can also detect multi-layered conductive connection holes. For example, the first pad P1 and the second pad P2 are prone to breakage due to stress caused by the underlying terrain stacking and slope differences. This can damage the conductive connection hole CV in subsequent manufacturing processes, affecting its conductivity. Therefore, the detection circuit board 100 provided by this invention can detect the conductive connection hole CV.

[0063] Figure 2 This is a top view schematic diagram of the detection circuit board 100 according to at least one embodiment of the present invention. Please refer to... Figure 2The detection circuit board 100 includes a substrate 102, a plurality of detection pads 104, conductive lines 106, conductive bumps 108, and detection alignment marks 110. The detection pads 104 are disposed on the substrate 102, the conductive lines 106 are disposed on the substrate 102 and electrically connected to the detection pads 104, the conductive bumps 108 are disposed on the substrate 102 and electrically connected to the conductive lines 106, and the detection alignment marks 110 are disposed on the substrate 102 for alignment with existing alignment marks 18 of the micro-LED display driving backplane 10, so that the detection circuit board 100 and the micro-LED display driving backplane 10 are aligned and bonded. In some embodiments, the detection alignment marks 110 may be located at the four corners of the detection circuit board 100, and the existing alignment marks 18 may be located at the four corners of the micro-LED display driving backplane 10.

[0064] Furthermore, it should be understood that, although Figure 2 The illustration only shows four test pads 104 as representative examples, but the present invention is not limited thereto. In other embodiments, the number of test pads 104 can be increased or decreased depending on the size and resolution of the display device used in the micro LED display driver backplane 10 to be tested by the test circuit board 100.

[0065] Figure 3A This is a top view of the detection circuit board 100 and the micro light-emitting diode display driver backplate 10 after alignment and bonding according to at least one embodiment of the present invention. Figure 3B yes Figure 3A A schematic cross-sectional view drawn along section line b-b'. For simplicity, the accompanying diagram... Figure 3B The miniature LED display driver backplane 10 shown only depicts the base plate 12 and the pad pairs 14, omitting other layers. Please refer to [link to relevant documentation]. Figure 3A and Figure 3B The detection circuit board 100 is used to align and bond with the micro LED display driver backplane 10, so that the detection pads 104 are electrically connected to the pad pairs 14 of the micro LED display driver backplane 10, and the conductive bumps 108 are electrically connected to the first test pad 16a of the micro LED display driver backplane 10, so that the detection pads 104, the pad pairs 14, the conductive lines 106, the conductive bumps 108 and the first test pad 16a form a detection circuit.

[0066] In detail, each test pad 104 is electrically connected to the first pad P1 and the second pad P2 of each pad pair 14 to conduct the first pad P1 and the second pad P2, and receives the test signal from the second test pad 16b of the micro LED display driver backplane 10 through one of the first pad P1 and the second pad P2. The test signal is measured at the first test pad 16a through the above-mentioned detection circuit to obtain a feedback signal. Whether the feedback signal meets the preset value is used to determine whether the micro LED display driver backplane 10 has a defect.

[0067] For example, such as Figure 3A As shown, the multiple pad pairs 14 of the micro LED display driver backplane 10 are arranged in an array and divided into multiple rows and multiple columns. The multiple detection pads 104 of the detection circuit board 100 are also arranged in an array and divided into multiple rows and multiple columns, respectively corresponding to the aforementioned multiple pad pairs 14. The conductive lines 106 of the detection circuit board 100 include branch lines 106a and 106b extending in a direction parallel to the multiple rows and a convergence line 106c extending in a direction parallel to the multiple columns. The detection pads 104 in the same row are all connected to the same branch line 106a and 106b, and the branch lines 106a and 106b are all connected to the convergence line 106c connected to the conductive bump 108.

[0068] After receiving the test signal, the second test pad 16b of the micro LED display driver backplane 10 transmits it through the circuit structure of the micro LED display driver backplane 10 (e.g., driving element SW, metal layer ML, and conductive connection hole CV) to the first pad P1 of the pad pair 14 of the micro LED display driver backplane 10. Then, it is transmitted through the detection pad 104 of the detection circuit board 100 to the second pad P2 of the pad pair 14 of the micro LED display driver backplane 10, and then through the detection pad 104 of the detection circuit board 100 to the conductive line 1. 06. Then, the signal is transmitted to the conductive bump 108 of the detection circuit board 100 via the conductive line 106 of the detection circuit board 100, and finally to the first test pad 16a of the micro LED display driver backplane 10 via the conductive bump 108 of the detection circuit board 100 to measure the feedback signal. The testing machine (not shown) can determine whether the micro LED display driver backplane 10 has a defect by checking whether the aforementioned feedback signal meets the preset value, and can estimate the location of the defective node of the micro LED display driver backplane 10 by using a variety of different detection circuits.

[0069] In some embodiments, the test signal may be a voltage signal and the feedback signal may be a current signal. If the feedback signal meets the current range set by the preset value, it can be determined that the micro LED display driver backplane 10 has no defects at the node position where the feedback signal is generated; if the feedback signal does not meet the current range set by the preset value, it can be determined that the micro LED display driver backplane 10 has defects at the node position where the feedback signal is generated.

[0070] Please continue reading. Figure 3A and Figure 3BThe detection circuit board 100 further includes an insulating layer 120, which is disposed on the substrate 102 and located between the conductive line 106 and the detection pad 104, and has a plurality of through holes T1, through which the plurality of detection pads 104 are electrically connected to the conductive line 106. Alternatively, the insulating layer 120 may also be located between the conductive line 106 and the conductive bump 108, and has through holes T2, through which the conductive bump 108 is electrically connected to the conductive line 106. Because the insulating layer 120 covers the conductive line 106, when the detection circuit board 100 is aligned and bonded to the micro-LED display driver backplane 10, short circuits caused by the conductive line 106 contacting the pad pairs 14 of the micro-LED display driver backplane 10 are prevented.

[0071] like Figure 3A and Figure 3B As shown, when the detection circuit board 100 is aligned and bonded to the micro-LED display driver backplane 10, the through holes T1 and the pad pairs 14 do not overlap in the normal direction ND of the substrate 102. Specifically, the detection pad 104 includes a pad connection portion PP and a circuit connection portion WP. The pad connection portion PP connects the first pad P1 and the second pad P2 of the pad pair 14. The circuit connection portion WP connects the conductive line 106 and is connected to the pad connection portion PP. That is, the circuit connection portion WP connects to and contacts the conductive line 106 via the through holes T1. The orthographic projection of the pad connection portion PP onto the base plate 12 of the micro-LED display driver backplane 10 overlaps with the orthographic projection of the pad pair 14 onto the base plate 12, but the orthographic projections of the circuit connection portion WP and the through holes T1 onto the base plate 12 do not overlap with the orthographic projections of the pad pair 14 onto the base plate 12. In other words, the orthographic projections of the circuit connection portion WP and the through holes T1 onto the base plate 12 are outside the orthographic projections of the pad pair 14 onto the base plate 12. The aforementioned design improves the flatness of the pad connection portion PP, ensuring that the pad connection portion PP of the test pad 104 of the test circuit board 100 can adhere to and contact the pad pair 14 of the micro light-emitting diode display driver backplane 10, so as to successfully achieve the test.

[0072] However, the present invention is not limited thereto. In other embodiments, the detection pads 104, conductive lines 106, and conductive bumps 108 can be formed from the same conductive layer in the same manufacturing process. That is, there is no insulating layer between the conductive lines 106 and the detection pads 104 and conductive bumps 108, and no through-hole connection is required. Since the detection pads 104, conductive lines 106, and conductive bumps 108 are formed from the same conductive layer in the same manufacturing process, the topographic flatness of the detection circuit board 100 can be improved, ensuring that the detection pads 104 of the detection circuit board 100 can adhere to and contact the pad pairs 14 of the micro LED display driver backplane 10, so as to achieve detection smoothly.

[0073] Figure 4AThis is a top view schematic diagram of the detection circuit board 100A and the micro light-emitting diode display driver backplate 10 after being aligned and bonded according to at least another embodiment of the present invention. Figure 4B yes Figure 4A A schematic cross-sectional view drawn along section line c-c'. Please refer to [link / reference]. Figure 4A and Figure 4B , Figure 4A and Figure 4B Implementation examples and Figure 3A and Figure 3B The embodiments share most of the same component structures, materials, manufacturing processes, and relative positional relationships; therefore, the identical technical features will not be repeated here. The differences between the two embodiments are: Figure 4A and Figure 4B The through-hole T1A of the insulating layer 120 of the detection circuit board 100A overlaps with the pad pair 14 of the micro light-emitting diode display driving backplate 10 on the normal direction ND of the substrate 102.

[0074] In detail, the detection pad 104A is used to connect the first pad P1 and the second pad P2 of the pad pair 14 and to connect the conductive line 106. That is, the detection pad 104A is connected to and contacts the conductive line 106 via the through hole T1A, and the orthographic projection of the detection pad 104A and the through hole T1A on the base plate 12 of the micro LED display driving backplane 10 overlaps with the orthographic projection of the pad pair 14 on the base plate 12. In other words, compared to Figure 3A and Figure 3B The test pad 104, Figure 4A and Figure 4B The detection pad 104A is not included in the circuit connection portion WP of the base plate 12, which is located outside the orthogonal projection of the pad pair 14 onto the base plate 12. The aforementioned design reduces the chance of the detection pad 104A contacting a non-corresponding pad pair 14 and short-circuiting when the detection circuit board 100 and the micro LED display driver backplate 10 are aligned and bonded.

[0075] Figure 5A This is a top view of the detection circuit board 100B and the micro light-emitting diode display driver backplate 10 after alignment and bonding according to at least another embodiment of the present invention. Figure 5B yes Figure 5A A schematic cross-sectional view drawn along section line d-d'. Please refer to [link / reference]. Figure 5A and Figure 5B , Figure 5A and Figure 5B Implementation examples and Figure 3A and Figure 3B The embodiments share most of the same component structures, materials, manufacturing processes, and relative positional relationships; therefore, the identical technical features will not be repeated here. The differences between the two embodiments are: Figure 5A and Figure 5BThe circuit connection portion WP of the test pad 104B of the test circuit board 100B and the pad connection portion PP are separated from each other. Through the aforementioned design, the pad connection portion PP is completely unaffected by the through hole T1, thereby improving the topographic flatness of the pad connection portion PP and ensuring that the pad connection portion PP of the test pad 104B of the test circuit board 100B can be attached and contacted with the pad pair 14 of the micro light-emitting diode display driver backplane 10 to achieve successful testing.

[0076] Figure 6 This is a top view of the detection circuit board 100' according to at least another embodiment of the present invention. Please refer to... Figure 6 , Figure 6 Implementation examples and Figure 2 The embodiments share most of the same component structures, materials, manufacturing processes, and relative positional relationships; therefore, the identical technical features will not be repeated here. The differences between the two embodiments are: Figure 6 The substrate 102' of the detection circuit board 100' has one or more openings O1, O2. The opening O1 may include a rectangular groove disposed along the edge of the substrate 102', and the opening O2 may include an elliptical hole disposed near the center of the substrate 102'. The openings O1 and O2 in the substrate 102' can be used to ensure that the detection circuit board 100' is tightly attached to the micro-LED display driving backplate 10 in a vacuum chamber (not shown), ensuring that the detection pad 104 of the detection circuit board 100' can be attached and contacted with the pad pair 14 of the micro-LED display driving backplate 10, so as to achieve detection smoothly.

[0077] In summary, in at least one embodiment of the present invention, the detection circuit board for testing the micro-LED display driver backplane, after being aligned and bonded to the micro-LED display driver backplane, allows multiple detection pads of the detection circuit board to be electrically connected to multiple pad pairs of the micro-LED display driver backplane, and allows conductive bumps of the detection circuit board to be electrically connected to test pads of the micro-LED display driver backplane. This forms a detection circuit consisting of the aforementioned detection pads, pad pairs, conductive lines, conductive bumps, and test pads, enabling the detection of conductive connection holes in the micro-LED display driver backplane used to electrically connect pad pairs and driving elements, thereby ensuring the yield of the micro-LED display driver backplane.

[0078] Although the present invention has been disclosed above with reference to embodiments, it is not intended to limit the present invention. Those skilled in the art to which this invention pertains may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A detection circuit board for detecting a micro LED display driver backplane, comprising: Substrate; Multiple detection pads are disposed on the substrate; Conductive lines are disposed on the substrate and electrically connected to the plurality of detection pads; as well as A conductive bump is disposed on the substrate and electrically connected to the conductive line. The detection circuit board is used to align and bond with the micro-LED display driver backplane so that the plurality of detection pads are electrically connected to the plurality of pad pairs of the micro-LED display driver backplane, and the conductive bump is electrically connected to the first test pad of the micro-LED display driver backplane. The plurality of detection pads, the plurality of pad pairs, the conductive line, the conductive bump, and the first test pad form a detection circuit. Each detection pad is electrically connected to the first and second pads of the respective pad pairs to conduct the first and second pads. The detection pad receives a test signal from the second test pad of the micro-LED display driver backplane through one of the first and second pads. The test signal is used to obtain a feedback signal at the first test pad through the detection circuit. Whether the feedback signal meets a preset value is used to determine whether the micro-LED display driver backplane has a defect.

2. The detection circuit board for detecting the backplane of a micro LED display driver as described in claim 1, further comprising: Alignment marks are detected and disposed on the substrate to align with existing alignment marks on the micro LED display driver backplane, so that the detection circuit board is aligned and bonded to the micro LED display driver backplane.

3. The detection circuit substrate for detecting the backplane of a micro LED display driver as described in claim 1, wherein the substrate has one or more openings.

4. The detection circuit board for detecting the backplane of a micro LED display driver as described in claim 1, further comprising: An insulating layer is disposed on the substrate and located between the conductive line and the plurality of detection pads, and has a plurality of through holes, wherein the plurality of detection pads are electrically connected to the conductive line through the plurality of through holes.

5. The detection circuit substrate for detecting a micro LED display driver backplane as described in claim 4, wherein when the detection circuit substrate and the micro LED display driver backplane are aligned and bonded, the plurality of through holes and the plurality of pads overlap in the normal direction of the substrate.

6. The detection circuit substrate for detecting a micro LED display driver backplane as described in claim 4, wherein when the detection circuit substrate and the micro LED display driver backplane are aligned and bonded, the plurality of through holes and the plurality of pads do not overlap in the normal direction of the substrate.

7. The detection circuit board for detecting a micro LED display driver backplane as described in claim 6, wherein each of the detection pads comprises: A pad connection portion is used to connect the first pad and the second pad of each pad pair; as well as A line connection portion for connecting the conductive line, wherein the line connection portion and the pad connection portion are separate from each other.

8. The detection circuit board for detecting the backplane of a micro LED display driver as described in claim 1, wherein the plurality of detection pads, the conductive lines and the conductive bumps are formed by the same conductive layer in the same manufacturing process.

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