Data flattening processing method, wafer, electronic device, and medium

Abstract

Embodiments of the present application provide a data flattening processing method, a wafer, an electronic device and a medium, applied to a computing device, comprising: determining a target position, placing a reference flat plate at the target position, obtaining an arrangement order between a to-be-measured flat plate and the reference flat plate, sending the arrangement order to a measurement component, so that the measurement component sequentially measures each to-be-measured flat plate and the reference flat plate to obtain first measurement data, obtaining the first measurement data, determining measurement data corresponding to the reference flat plate as a reference platform, and performing flattening processing on measurement data corresponding to each to-be-measured flat plate based on the reference platform to obtain second measurement data after flattening processing. Based on the method provided in the present application, the accuracy and stability of the measurement data can be improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor measurement, and more particularly to a data flattening processing method, wafer, electronic device and medium. Background Technology

[0002] With the development of the semiconductor industry, integrated circuits are continuously shrinking the geometric size of transistor devices in accordance with Moore's Law to improve transistor performance and density. As the geometric size of transistors continues to shrink, the impact of back-end of layer (BEOL) metal interconnects is gradually increasing. Interconnect resistance and capacitance have become important indicators affecting device performance. Corresponding parameters of BEOL CU (copper) process have also become key monitoring targets. In particular, monitoring the relative height difference (dishing) caused by chemical mechanical polishing and the surface roughness (erosion) caused by chemical corrosion during CU chemical mechanical polishing (CMP) is of paramount importance. Summary of the Invention

[0003] In a first aspect, embodiments of this application provide a data flattening processing method, applied to a computing device, comprising:

[0004] Determine the target location and place a reference plate at the target location;

[0005] Obtain the arrangement order between the plate to be measured and the reference plate;

[0006] The arrangement order is sent to a measurement component so that the measurement component sequentially measures each plate to be measured and the reference plate to obtain first measurement data corresponding to each plate to be measured and the reference plate respectively.

[0007] Acquire the first measurement data corresponding to each of the measured plate and the reference plate;

[0008] The first measurement data corresponding to the reference plate is determined as the reference platform. Based on the reference platform, the first measurement data corresponding to each plate to be measured is flattened to obtain the flattened second measurement data.

[0009] In one possible implementation, determining the target location includes:

[0010] Obtain the attribute information of each plate to be measured;

[0011] Determine whether the attribute information of each of the measured plates meets the preset conditions;

[0012] If the attribute information of the plate to be measured meets the preset conditions, then the plate to be measured is determined as the target plate to be measured;

[0013] The positions on both sides of each target plate to be measured, and any position between any two target plates to be measured, are determined as the target positions.

[0014] In one possible implementation, the attribute information includes height information;

[0015] Accordingly, determining whether the attribute information of each of the measured plates meets the preset conditions includes:

[0016] Based on the height information of each of the measured plates, the height difference between every two measured plates is obtained;

[0017] Determine whether each of the height differences exceeds a preset first threshold;

[0018] If the height difference exceeds the first threshold, it is determined that the attribute information of the two plates to be measured corresponding to the height difference meets the preset conditions.

[0019] In one possible implementation, the attribute information includes height information;

[0020] Accordingly, determining whether the attribute information of each of the measured plates meets the preset conditions includes:

[0021] Based on the height information of each plate to be measured, the height difference between every two adjacent plates to be measured is obtained;

[0022] Determine whether each height difference is lower than a preset second threshold;

[0023] If the height difference is lower than the second threshold, it is determined that the attribute information of the two plates to be measured corresponding to the height difference meets the preset conditions.

[0024] In one possible implementation, the attribute information includes surface flatness information;

[0025] Accordingly, determining whether the attribute information of each of the measured plates meets the preset conditions includes:

[0026] Determine whether the surface flatness of each of the measured flat plates is lower than a preset third threshold;

[0027] If the surface flatness of the plate to be measured is lower than the third threshold, then the attribute information of the plate to be measured is determined to meet the preset conditions.

[0028] In one possible implementation, the attribute information includes material information;

[0029] Accordingly, determining whether the attribute information of each of the measured plates meets the preset conditions includes:

[0030] Determine whether the material information of any two adjacent plates to be measured is the same;

[0031] If the material information of two adjacent plates to be measured is different, then it is determined that the attribute information of the two adjacent plates to be measured meets the preset conditions.

[0032] If two adjacent plates to be measured are both made of metal or both are made of non-metal, then the material information of the two adjacent plates to be measured is determined to be the same.

[0033] If one of the two adjacent plates to be measured is made of metal and the other is made of non-metal, then the material information of the two adjacent plates to be measured is determined to be different.

[0034] Secondly, this application provides a wafer, comprising:

[0035] Multiple chip units, which are arranged in a preset position;

[0036] A dicing channel, the dicing channel being arranged around the chip unit, and the dicing channel having occupancy spaces;

[0037] A reference plate is arranged in the vacant space of the cutting track;

[0038] The plate to be measured is arranged in a preset order in the non-occupied space of the cutting channel.

[0039] In one possible implementation, each chip unit includes multiple chip bodies arranged in a preset position.

[0040] Thirdly, this application provides an electronic device, including: a memory and a processor;

[0041] The memory stores computer-executed instructions;

[0042] The processor executes computer execution instructions stored in the memory, causing the processor to perform the method described above.

[0043] Fourthly, this application provides a computer-readable storage medium storing computer-executable instructions, which, when executed by a processor, are used to implement the method described above. Attached Figure Description

[0044] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0045] Figure 1 This is a schematic diagram illustrating a scenario used in this application;

[0046] Figure 2 The measurement process of the plate to be measured is an example of that described in this application;

[0047] Figure 3 A schematic diagram illustrating the selection of a reference platform for existing technologies;

[0048] Figure 4 Flowchart of the data leveling processing method provided in this application Figure 1 ;

[0049] Figure 5 This is a schematic diagram illustrating the placement of a reference flat plate as an example.

[0050] Figure 6 A schematic diagram of measurement data as an example;

[0051] Figure 7 Flowchart of the data leveling processing method provided in this application Figure 2 ;

[0052] Figure 8 Flowchart of the data leveling processing method provided in this application Figure 3 ;

[0053] Figure 9 Flowchart of the data leveling processing method provided in this application Figure 4 ;

[0054] Figure 10 Flowchart of the data leveling processing method provided in this application Figure 5 ;

[0055] Figure 11 Flowchart of the data leveling processing method provided in this application Figure 6 ;

[0056] Figure 12 This application provides a schematic diagram of the structure of a data flattening processing device;

[0057] Figure 13 A schematic diagram of the structure of the electronic device provided in this application.

[0058] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0059] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0060] Figure 1 This is a schematic diagram illustrating a scenario from this application, such as... Figure 1 As shown, ① refers to a wafer, which is a silicon wafer used to fabricate silicon semiconductor circuits; its raw material is silicon. ② refers to a chip unit; specifically, a chip unit is a unit that is repeatedly arranged on a wafer. It refers to an unpackaged semiconductor chip cut from the wafer, containing a complete circuit but not yet packaged, also known as a bare die. ③ refers to a dicing track; the area between chip units is the dicing track. The measurement plate and the reference platform are both arranged in the dicing track, with the reference platform located in the empty space of the dicing track.

[0061] Figure 2 The measurement process of the plate to be measured, as exemplified in this application, is as follows: Figure 2 As shown, Figure 2 This example illustrates the process of measuring the dishing and erosion of a plate to be measured, such as a metal pad, using a measurement component. Figure 1 As shown, when multiple metal pads are arranged in a continuous manner, a measurement component is used to scan each metal pad sequentially to obtain the first measurement data corresponding to each metal pad.

[0062] The measurement component can be an atomic force microscope (AFM). Specifically, the profiling mode of the AFM can be used. The AFM tip laterally scans a series of metal pads to obtain the profile features of each metal pad. The profiling mode is specifically designed for analytical performance. The AFM instrument can save and output the profile feature image of the corresponding metal pad measurement area as a basis for subsequent research. If the output position to be measured has been defined in the AFM configuration, the AFM can also output the measurement data for the corresponding output position, including dishing and erosion. By measuring the dishing and erosion of the metal plate using atomic force microscopy (AFM) and analyzing the obtained measurement data, the dishing and erosion of the metal plate can be controlled, thereby reducing device defects and improving device stability and reliability. Figure 2 Due to the inherent structure of the AFM machine, its horizontal precision is at the micrometer level, while its vertical precision is at the nanometer level, resulting in a 1000-fold difference compared to the horizontal plane. This leads to a certain degree of offset during measurement. Furthermore, to protect the AFM probe tip from structural damage, the probe tip is raised higher with each subsequent measurement point to prevent tip breakage. This results in skewed measurement data output from the AFM machine. Therefore, the measurement data needs to be leveled in the corresponding software to define parameters for different regions and ensure the accuracy and stability of the measurement data. The choice of reference platform for leveling directly determines the accuracy and stability of the measurement data.

[0063] Figure 3 A schematic diagram of a reference platform selected for existing technology, such as... Figure 3As shown, current measurement data for multiple metal pads typically uses the gap between the metal pads as a reference platform. However, the gap between metal pads is only about 5 micrometers. This overly narrow reference platform leads to unstable output of measurement data by the AFM instrument, resulting in inaccurate data. Offline manual analysis of the output measurement data is required. Measuring data from different areas of multiple metal pads is time-consuming, labor-intensive, and inefficient. Furthermore, manually adjusting and leveling the measurement data introduces human factors, significantly reducing the accuracy and stability of the measurement data. Alternatively, using the area containing the metal pad as a reference platform is problematic because the differences between wafers result in varying heights of the metal pads, leading to an unbalanced reference platform that also severely impacts the accuracy and stability of the measurement data.

[0064] The data flattening method provided in this application involves determining a target location, placing a reference plate at the target location, and sequentially measuring each metal pad and the reference plate to obtain measurement data. The reference plate is then used as a reference platform to flatten the measurement data, resulting in flattened measurement data. The flattening process includes placing the measurement data corresponding to each metal pad on the same horizontal line to reduce the erosion of the measurement data corresponding to each metal pad. The reference plate provided in this application has a smooth surface, resulting in lower erosion of the measurement data corresponding to the reference plate. Furthermore, placing the reference plate at the selected target location allows for more precise flattening of the measurement data, thereby improving the accuracy and stability of the measurement data.

[0065] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0066] Figure 4 Flowchart of the data leveling processing method provided in this application Figure 1 Applied to computing devices, such as Figure 4 As shown, it includes:

[0067] S401. Determine the target location and place a reference plate at the target location.

[0068] The execution subject in this embodiment is a computing device, which can be implemented through a computer program.

[0069] In the provided scenario, the plate to be measured refers to the circuit board used to connect the inside and outside of the chip, and can be a metal pad. The computing device can interact with the control device, which can be implemented through a robotic arm. The computing device sends the determined target location to the control device, which can then grasp the reference plate and place it at the target location. Alternatively, if the computing device is a server, it can send the determined target location to the user's terminal, allowing the user to manually place the reference plate at the target location. Figure 5 This is a schematic diagram illustrating the placement of a reference tablet, as shown below. Figure 5 As shown, if the left side of the plate to be measured 1, the right side of the plate to be measured 5, and the position between the plate to be measured 4 and the plate to be measured 3 are the target positions, then a reference plate can be placed at each of the three target positions.

[0070] S402. Obtain the arrangement order between the plate to be measured and the reference plate.

[0071] Based on the scenario example, after placing the reference plate between the plates to be measured, each plate to be measured and the reference plate occupy a position, such as position 1, position 2, position 3... position n from left to right. The arrangement order between the plates to be measured and the reference plate can be obtained by following the position order from left to right.

[0072] S403. The arrangement order is sent to a measurement component so that the measurement component sequentially measures each plate to be measured and the reference plate to obtain first measurement data corresponding to each plate to be measured and the reference plate respectively.

[0073] Based on the scenario example and the aforementioned content, the measurement component can be selected as AFM. Therefore, the positions 1, 2, 3... n can be sent to AFM in the order of position 1, position 2, position 3... n. AFM can then measure each plate to be measured and the reference plate in the order of position 1, position 2, position 3... n to obtain the first measurement data corresponding to each plate to be measured and the reference plate.

[0074] S404. Obtain the first measurement data corresponding to each of the measured plate and the reference plate.

[0075] Based on the scenario example, the AFM outputs the first measurement data corresponding to each plate to be measured and the reference plate, and the computing device obtains the first measurement data output by the AFM.

[0076] S405. The first measurement data corresponding to the reference plate is determined as the reference platform. Based on the reference platform, the first measurement data corresponding to each plate to be measured is flattened to obtain the flattened second measurement data.

[0077] Combined with scenario examples, Figure 6 A schematic diagram of the measurement data as an example, such as Figure 6 As shown, because the surface of the reference plate is relatively smooth, the error of the first measurement data corresponding to the reference plate is low. Therefore, the computing device can use the first measurement data corresponding to the reference plate as a reference platform to flatten the obtained first measurement data to obtain the second measurement data. Based on the method provided in this example, because the surface of the reference plate is smooth and the error of the first measurement data corresponding to the reference plate is low, using the first measurement data corresponding to the reference plate as a reference platform to flatten the first measurement data corresponding to each plate to be measured, and placing the reference plate at the selected target position, can more accurately flatten the measurement data, thereby improving the accuracy and stability of the measurement data.

[0078] Optionally, Figure 7 Flowchart of the data leveling processing method provided in this application Figure 2 ,like Figure 7 As shown, S401 includes:

[0079] S701. Obtain the attribute information of each plate to be measured;

[0080] Based on the scenario example, the attribute information of the flat plate to be measured refers to information such as its outline, height, material, and structure.

[0081] S702. Determine whether the attribute information of each of the measured plates meets the preset conditions.

[0082] With the help of scenario examples, a preset attribute can be selected from the attribute information of the plate to be measured, and preset conditions can be set based on the preset attribute information. For example, the height information can be used as the preset attribute information, and the preset condition can be whether the height information of the plate to be measured is higher than the preset height.

[0083] S703. If the attribute information of the plate to be measured meets the preset conditions, then the plate to be measured is determined as the target plate to be measured.

[0084] Taking a scenario example, if we use height information as the preset attribute information, and the preset condition is whether the height information of the tablet to be measured is higher than the preset height, then the tablet to be measured with height information higher than the preset height can be used as the target tablet to be measured.

[0085] S704. The positions on both sides of each target plate to be measured, and any position between any two target plates to be measured, are determined as the target positions.

[0086] In a scenario example, if we consider the measuring tablet 1 and the measuring tablet 5 as target measuring tablets, then the left and right sides of the measuring tablet 1 and the measuring tablet 5, as well as the positions between the measuring tablet 1 and the measuring tablet 5, can be determined as target positions. For example, the positions between the left side of the measuring tablet 1 and the right side of the measuring tablet 5, and between the measuring tablet 4 and the measuring tablet 3, can be determined as target positions.

[0087] Based on the method provided in this example, the target plate to be measured can be determined first by setting preset conditions, and then the corresponding target position can be obtained through the target plate to be measured.

[0088] Optionally, the attribute information includes height information.

[0089] Accordingly, Figure 8 Flowchart of the data leveling processing method provided in this application Figure 3 ,like Figure 8 As shown, S701 includes:

[0090] S801. Based on the height information of each of the measured plates, obtain the height difference between every two measured plates.

[0091] By combining scenario examples, the height information of each plate to be measured can be obtained through the attribute information of each plate, thereby calculating the height difference between any two plates in each plate.

[0092] S802. Determine whether each height difference exceeds a preset first threshold.

[0093] Based on the scenario example, the first threshold can be determined according to the actual situation. Since the accuracy of AFM in the vertical and horizontal directions is at the nm level, the first threshold can be determined as 2nm in the example.

[0094] S803. If the height difference exceeds the first threshold, it is determined that the attribute information of the two plates to be measured corresponding to the height difference meets the preset conditions.

[0095] Combined with scenario examples, Figure 2 If the height difference between the plate to be measured 1 and the plate to be measured 5 is large, and the height difference between the plate to be measured 1 and the plate to be measured 5 exceeds 2nm, then the plate to be measured 1 and the plate to be measured 5 can be determined to meet the preset conditions, and thus the plate to be measured 1 and the plate to be measured 5 can be identified as the target plate to be measured.

[0096] Based on the method provided in this example, the goal of obtaining the target plate to be measured can be achieved by using whether the height difference exceeds a first threshold as a preset condition.

[0097] Optionally, the attribute information includes height information;

[0098] Accordingly, Figure 9 Flowchart of the data leveling processing method provided in this application Figure 4 ,like Figure 9 As shown, S701 includes:

[0099] S901. Based on the height information of each plate to be measured, obtain the height difference between every two adjacent plates to be measured.

[0100] By combining scenario examples, the height information of each plate to be measured can be obtained through the attribute information of each plate, thereby calculating the height difference between any two adjacent plates in each plate.

[0101] S902. Determine whether each height difference is lower than the preset second threshold.

[0102] In a scenario example, if the AFM measurement method involves measuring the height difference between the highest point of each measured plate and the lowest point of the gap between adjacent measured plates, then the height difference between two adjacent measured plates should not be too small, otherwise it will lead to inaccurate measurement data. Therefore, a first threshold can be determined according to the actual situation, for example, the second threshold can be determined to be 0.5 nm.

[0103] S903. If the height difference is lower than the second threshold, it is determined that the attribute information of the two plates to be measured corresponding to the height difference meets the preset conditions.

[0104] Based on the scenario example, the height difference between the measured plate 1 and the measured plate 2 is small. If the height difference between the measured plate 1 and the measured plate 2 is less than 0.5nm, it can be determined that the measured plate 1 and the measured plate 2 meet the preset conditions, and thus the measured plate 1 and the measured plate 2 are identified as the target measured plates.

[0105] Based on the method provided in this example, the target plate to be measured can be obtained by using whether the height difference is less than a second threshold as a preset condition.

[0106] Optionally, the attribute information includes surface flatness information;

[0107] Accordingly, Figure 10 Flowchart of the data leveling processing method provided in this application Figure 5 ,like Figure 10 As shown, S701 includes:

[0108] S1001. Determine whether the surface flatness of each of the measured flat plates is lower than a preset third threshold.

[0109] In conjunction with the scenario example, the surface flatness of the plate to be measured is called Erosion. The rougher the surface of the plate to be measured, the lower the surface flatness; the smoother the surface of the plate to be measured, the higher the surface flatness. Surface flatness can be represented as a percentage.

[0110] S1002. If the surface flatness of the plate to be measured is lower than the third threshold, then it is determined that the attribute information of the plate to be measured meets the preset conditions.

[0111] Based on the scenario example, the third threshold can be determined according to the actual situation. If the surface flatness of the plate to be measured is lower than the third threshold, it means that the surface of the plate to be measured is rougher, and the measurement data corresponding to the plate to be measured needs to be flattened. Therefore, when the surface flatness of the plate to be measured is lower than the third threshold, it is determined that the plate to be measured meets the preset conditions, and the plate to be measured with a surface flatness lower than the third threshold is determined as the target plate to be measured.

[0112] Based on the method provided in this example, the goal of obtaining the target plate to be measured can be achieved by using whether the surface flatness is less than a third threshold as a preset condition.

[0113] Optionally, the attribute information includes material information;

[0114] Accordingly, Figure 11 Flowchart of the data leveling processing method provided in this application Figure 6 ,like Figure 11 As shown, S701 includes:

[0115] S1101. Determine whether the material information of any two adjacent plates to be measured is the same.

[0116] Based on the scenario example, the material information of the plate to be measured is divided into metal and non-metal. Therefore, the plate to be measured can be a metal plate or a non-metal plate. When the material information of the plate to be measured is different, AFM will measure the plate to be measured in different ways for different material information. Therefore, it can be determined in turn whether the material information of any two adjacent plates to be measured is different.

[0117] S1102. If the material information of two adjacent plates to be measured is different, then it is determined that the attribute information of the two adjacent plates to be measured meets the preset conditions.

[0118] Based on the scenario example, if the material information of two adjacent plates to be measured is different, it means that the measurement data corresponding to these two adjacent plates to be measured needs to be focused on leveling. Therefore, it can be determined that these two adjacent plates to be measured meet the preset conditions, and these two adjacent plates to be measured are identified as the target plates to be measured.

[0119] S1103. If two adjacent plates to be measured are both made of metal or both are made of non-metal, then the material information of the two adjacent plates to be measured is determined to be the same.

[0120] Combined with scenario examples, Figure 2 Taking the plate to be measured 1 and the plate to be measured 2 as an example, the plate to be measured 1 and the plate to be measured 2 are adjacent. If the plate to be measured 1 and the plate to be measured 2 are both made of metal or both are made of non-metal, then it can be determined that the material information of the plate to be measured 1 and the plate to be measured 2 are the same.

[0121] S1104. If one of the two adjacent plates to be measured is made of metal and the other is made of non-metal, then it is determined that the material information of the two adjacent plates to be measured is different.

[0122] Combined with scenario examples, Figure 2 Taking the measuring plate 1 and measuring plate 2 as examples, if measuring plate 1 is made of metal and measuring plate 2 is made of non-metal, then it can be determined that the material information of measuring plate 1 and measuring plate 2 are different. Similarly, using the above method, the material information of every two adjacent measuring plates is determined sequentially. Based on the method provided in this example, the goal of obtaining the target measuring plate can be achieved by using the difference in material information between adjacent measuring plates as a preset condition.

[0123] Based on the method provided in this embodiment, since the surface of the reference plate is smooth, the erosion of the measurement data corresponding to the reference plate is low. Therefore, the measurement data corresponding to the reference plate is used as a reference platform to flatten the measurement data corresponding to each plate to be measured. Furthermore, by placing the reference plate at the selected target position, the measurement data can be flattened more accurately, thereby improving the accuracy and stability of the measurement data.

[0124] This application embodiment also provides a wafer, including:

[0125] Multiple chip units, which are arranged in a preset position;

[0126] A dicing channel, the dicing channel being arranged around the chip unit, and the dicing channel having occupancy spaces;

[0127] A reference plate is arranged in the vacant space of the cutting track;

[0128] The plate to be measured is arranged in a preset order in the non-occupied space of the cutting channel.

[0129] Refer to the scenario examples. Figure 1On a wafer, there are multiple chip units arranged in preset positions, each chip unit having a pre-set length and width. The area between the chip units is a dicing channel. In this embodiment, the platen to be measured and the reference platen are both deployed in the dicing channel. Specifically, the platen to be measured is arranged in the dicing channel according to a preset arrangement order, and the target position can be determined based on the attribute information of the platen to be measured. The target position can be determined as a preset vacancy, and the reference platen is deployed at the vacancy. The size of the platen to be measured and the reference platen can be selected as 50μm*50μm.

[0130] Optionally, each chip unit includes multiple chip bodies arranged in preset positions.

[0131] Refer to the scenario examples. Figure 1 Each chip unit contains multiple chip bodies. For example, in the chip unit shown in the figure, there are three chips A, one chip B, one chip C, and one chip D. Chips A, B, C, and D are the chip bodies in the example.

[0132] The wafer provided in this application embodiment has corresponding empty spaces preset according to the attribute information of the platen to be measured. When laying out the chip unit, the platen to be measured and the reference platen can be designed into the dicing channel without bringing additional costs and burdens. It is an intuitive, fast and accurate deployment method for the platen to be measured and the reference platen.

[0133] Figure 12 This application provides a schematic diagram of a data flattening processing device, applied to a computing device, comprising:

[0134] The determining module 121 is used to determine the target position and place a reference plate at the target position;

[0135] The acquisition module 122 is used to acquire the arrangement order between the plate to be measured and the reference plate;

[0136] The sending module 123 is further configured to send the arrangement order to a measurement component, so that the measurement component sequentially measures each plate to be measured and the reference plate to obtain first measurement data corresponding to each plate to be measured and the reference plate respectively.

[0137] The acquisition module 121 is also used to acquire the first measurement data corresponding to each plate to be measured and the reference plate respectively;

[0138] The determining module 122 is further configured to determine the first measurement data corresponding to the reference plate as a reference platform, and perform flattening processing on the first measurement data corresponding to each of the plates to be measured based on the reference platform to obtain the flattened second measurement data.

[0139] Optionally, module 122 is specifically used to obtain the attribute information of each plate to be measured;

[0140] The determining module 122 is further used to determine whether the attribute information of each of the measured plates meets the preset conditions;

[0141] The determining module 122 is further configured to determine the plate to be measured as the target plate to be measured if the attribute information of the plate to be measured meets the preset conditions.

[0142] The determining module 122 is further configured to determine the positions on both sides of each of the target measuring plates, and any position between any two target measuring plates, as the target positions.

[0143] Optionally, the determining module 122 is further configured to obtain the height difference between every two of the measured tablets based on the height information of each of the measured tablets;

[0144] The determining module 122 is further used to determine whether each height difference exceeds a preset first threshold.

[0145] The determining module 122 is further configured to determine that if the height difference exceeds the first threshold, the attribute information of the two plates to be measured corresponding to the height difference meets the preset conditions.

[0146] Optionally, the determining module 122 is further configured to obtain the height difference between every two adjacent plates to be measured based on the height information of each plate to be measured;

[0147] The determination module 122 is also used to determine whether each height difference is lower than a preset second threshold.

[0148] The determination module 122 is further configured to determine that if the height difference is lower than the second threshold, the attribute information of the two plates to be measured corresponding to the height difference meets the preset conditions.

[0149] Optionally, the determining module 122 is further used to determine whether the surface flatness of each of the measured flat plates is lower than a preset third threshold.

[0150] The determination module 122 is further configured to determine that the attribute information of the plate to be measured meets the preset conditions if the surface flatness of the plate to be measured is lower than the third threshold.

[0151] Optionally, the determining module 122 is also used to determine whether the material information of every two adjacent plates to be measured is the same;

[0152] The determining module 122 is further used to determine that if the material information of two adjacent plates to be measured is different, the attribute information of the two adjacent plates to be measured meets the preset conditions.

[0153] The determination module 122 is further used to determine that the material information of the two adjacent plates to be measured is the same if both are made of metal or both are made of non-metal.

[0154] The determination module 122 is further configured to determine that the material information of the two adjacent plates to be measured is different if one of the plates to be measured is made of metal and the other is made of non-metal.

[0155] The scheduling device for the energy storage system in the energy storage power station provided in this embodiment can execute the method provided in the above method embodiment. Its implementation principle and technical effect are similar, and will not be described in detail here.

[0156] Figure 10 A schematic diagram of the structure of the electronic device provided in this application. Figure 10 As shown, the electronic device 50 provided in this embodiment includes at least one processor 501 and a memory 502. Optionally, the device 50 further includes a communication component 503. The processor 501, memory 502, and communication component 503 are connected via a bus 504.

[0157] In a specific implementation, at least one processor 501 executes computer execution instructions stored in memory 502, causing at least one processor 501 to perform the above-described method.

[0158] The specific implementation process of processor 501 can be found in the above method embodiments, and its implementation principle and technical effect are similar. It will not be repeated here.

[0159] In the above embodiments, it should be understood that the processor can be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), etc. The general-purpose processor can be a microprocessor or any conventional processor. The steps of the method disclosed in this invention can be directly implemented by a hardware processor, or implemented by a combination of hardware and software modules within the processor.

[0160] The memory may include random access memory (RAM) and may also include non-volatile memory (NVM), such as at least one disk storage device.

[0161] The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus, etc. Buses can be categorized as address buses, data buses, control buses, etc. For ease of illustration, the buses shown in the accompanying drawings are not limited to a single bus or a single type of bus.

[0162] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the above-described method.

[0163] This application also provides a computer-readable storage medium storing computer-executable instructions, which, when executed by a processor, implement the above-described method.

[0164] The aforementioned readable storage medium can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk. The readable storage medium can be any available medium accessible to a general-purpose or special-purpose computer.

[0165] An exemplary readable storage medium is coupled to a processor, enabling the processor to read information from and write information to the readable storage medium. Of course, the readable storage medium can also be a component of the processor. The processor and the readable storage medium can reside in an Application Specific Integrated Circuit (ASIC). Alternatively, the processor and the readable storage medium can exist as discrete components in the device.

[0166] The division of units is merely a logical functional division; in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be indirect coupling or communication connection through some interfaces, devices, or units, and may be electrical, mechanical, or other forms.

[0167] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0168] In addition, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0169] If a function is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this invention, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0170] Those skilled in the art will understand that all or part of the steps of the above-described method embodiments can be implemented by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When executed, the program performs the steps of the above-described method embodiments; and the aforementioned storage medium includes various media capable of storing program code, such as ROM, RAM, magnetic disks, or optical disks.

[0171] Finally, it should be noted that other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein, and is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. A data flattening processing method, characterized in that, Applied to computing devices, including: Determine the target location and place a reference plate at the target location; Obtain the arrangement order between the plate to be measured and the reference plate; The arrangement order is sent to a measurement component so that the measurement component sequentially measures each plate to be measured and the reference plate to obtain first measurement data corresponding to each plate to be measured and the reference plate respectively. Acquire the first measurement data corresponding to each of the measured plate and the reference plate; The first measurement data corresponding to the reference plate is determined as the reference platform. Based on the reference platform, the first measurement data corresponding to each plate to be measured is flattened to obtain the flattened second measurement data.

2. The method according to claim 1, characterized in that, Determining the target location includes: Obtain the attribute information of each plate to be measured; Determine whether the attribute information of each of the measured plates meets the preset conditions; If the attribute information of the plate to be measured meets the preset conditions, then the plate to be measured is determined as the target plate to be measured; The positions on both sides of each target plate to be measured, and any position between any two target plates to be measured, are determined as the target positions.

3. The method according to claim 2, characterized in that, The attribute information includes height information; The step of determining whether the attribute information of each of the measured plates meets the preset conditions includes: Based on the height information of each of the measured plates, the height difference between every two measured plates is obtained; Determine whether each height difference exceeds a preset first threshold; If the height difference exceeds the first threshold, it is determined that the attribute information of the two plates to be measured corresponding to the height difference meets the preset conditions.

4. The method according to claim 3, characterized in that, The attribute information includes height information; The step of determining whether the attribute information of each of the measured plates meets the preset conditions includes: Based on the height information of each plate to be measured, the height difference between every two adjacent plates to be measured is obtained; Determine whether each height difference is lower than a preset second threshold; If the height difference is lower than the second threshold, it is determined that the attribute information of the two plates to be measured corresponding to the height difference meets the preset conditions.

5. The method according to claim 3, characterized in that, The attribute information includes surface flatness information; The step of determining whether the attribute information of each of the measured plates meets the preset conditions includes: Determine whether the surface flatness of each of the measured flat plates is lower than a preset third threshold; If the surface flatness of the plate to be measured is lower than the third threshold, then the attribute information of the plate to be measured is determined to meet the preset conditions.

6. The method according to claim 3, characterized in that, The attribute information includes material information; The step of determining whether the attribute information of each of the measured plates meets the preset conditions includes: Determine whether the material information of any two adjacent plates to be measured is the same; If the material information of two adjacent plates to be measured is different, then it is determined that the attribute information of the two adjacent plates to be measured meets the preset conditions. If two adjacent plates to be measured are both made of metal or both are made of non-metal, then the material information of the two adjacent plates to be measured is determined to be the same. If one of the two adjacent plates to be measured is made of metal and the other is made of non-metal, then the material information of the two adjacent plates to be measured is determined to be different.

7. A wafer, characterized in that, include: Multiple chip units, which are arranged in a preset position; A dicing channel, the dicing channel being arranged around the chip unit, and the dicing channel having occupancy spaces; A reference plate is arranged in the vacant space of the cutting track; The plate to be measured is arranged in a preset order in the non-occupied space of the cutting channel.

8. The wafer according to claim 7, characterized in that, Each chip unit includes multiple chip bodies arranged in preset positions.

9. An electronic device, characterized in that, include: Memory and processor; The memory stores computer-executed instructions; The processor executes computer execution instructions stored in the memory, causing the processor to perform the method as described in any one of claims 1-6.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions, which, when executed by a processor, are used to implement the method as described in any one of claims 1-6.

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