Chip, circuit board assembly, and electronic device

Abstract

The application discloses a chip, a circuit board assembly and an electronic device, and belongs to the technical field of electronic devices. The chip comprises a first surface, a second surface and a side surface. The first surface is provided with a pin. The first surface and the second surface are oppositely arranged. The side surface is connected to the first surface and the second surface. The second surface is provided with a first flow guide part. The first flow guide part comprises at least one of a flow guide texture, a groove and a flow guide coating.

Description

Technical Field

[0001] This application belongs to the field of electronic equipment technology, specifically relating to a chip, circuit board assembly, and electronic equipment. Background Technology

[0002] Chips, as core components of electronic devices, undertake critical functions such as data processing and control systems. Dispensing technology, as an important packaging process, is widely used for chip fixation. After the chip is soldered, a tiny gap is formed between the chip and the circuit board. The dispensing nozzle moves at a constant speed along the upper side of the chip while simultaneously dripping adhesive at a constant speed. The adhesive flows from the outer side of the chip to the bottom, thus filling the entire bottom of the chip.

[0003] When the shielding cover is attached to the outside of the chip, an opening for dispensing adhesive needs to be set in the shielding cover. In related technologies, after dispensing adhesive, the opening of the shielding cover is covered with copper foil. In order to ensure the long-term reliability of the copper foil, the bonding contact area between the copper foil and the shielding cover will be increased. This means that the opening to the outer edge of the shielding cover needs to be a certain width. If the shielding cover is wide, the circuit board supporting the shielding cover also needs to be wide. Summary of the Invention

[0004] This application aims to provide a chip, circuit board assembly, and electronic device that solves the problem of a large circuit board width caused by a wide shield.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows:

[0006] In a first aspect, embodiments of this application provide a chip comprising: a first surface, a second surface, and a side surface. The first surface is provided with pins, the first surface and the second surface are disposed opposite to each other, the side surface is connected to the first surface and the second surface, and the second surface is provided with a first flow guiding portion. The first flow guiding portion includes at least one of a flow guiding texture, a groove, and a flow guiding coating.

[0007] Secondly, embodiments of this application provide a circuit board assembly, which includes a circuit board, a shielding member, and the chip mentioned in the first aspect. The first surface of the chip is fixed to the circuit board by multiple pins, with a gap formed between adjacent pins, and the gap is filled with an adhesive. The shielding member is connected to the circuit board and covers the chip. The shielding member has a through hole, which is disposed opposite to the second surface to expose the first flow guide portion.

[0008] Thirdly, embodiments of this application provide an electronic device, which includes the chip in the first aspect or the circuit board assembly in the second aspect.

[0009] In the embodiments of this application, when the chip is connected to the circuit board in the circuit board assembly through the first surface, a tiny gap is formed between the first surface and the circuit board due to the presence of the pins. This gap is the area that needs to be filled with colloid to achieve bottom filling and reinforcement.

[0010] Traditional dispensing methods require the dispensing nozzle to be aligned with the chip edge, relying on capillary force generated by the natural gap between the chip bottom and the circuit board to draw in the adhesive. This necessitates that the shielding cover have a sufficiently wide edge for operation. This embodiment, however, alters the adhesive's guiding path by incorporating a flow guide on the chip's second surface. During dispensing, the dispensing nozzle can drip the adhesive directly onto the chip's second surface. The first flow guide actively guides the adhesive dripping onto the chip's surface, overcoming gravity and surface tension. The adhesive flows directionally towards the chip's side and ultimately into the gap between the first surface and the circuit board. This structural design allows the dispensing location to be flexible, no longer limited to the chip's edge, but can be placed at any position on the chip's upper surface (i.e., the second surface). This significantly reduces the precision requirements for the shielding cover's opening position, allowing the shielding cover's edges to be closer to the chip, effectively reducing the overall size of the circuit board assembly and meeting the miniaturization requirements of electronic devices. Furthermore, by setting the flow guide as a texture, groove, or coating, the appropriate flow guide method can be selected according to different production processes and colloid properties. For example, textures and grooves can provide physical guidance, while coatings can change the surface wettability to promote flow, ensuring the reliability and efficiency of dispensing.

[0011] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0012] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0013] Figure 1 This is a schematic diagram of a circuit board assembly according to an embodiment of the present invention;

[0014] Figure 2 This is a schematic diagram of the second surface according to an embodiment of the present invention;

[0015] Figure 3 This is a schematic diagram of the first surface according to an embodiment of the present invention;

[0016] Figure 4 This is a schematic diagram of the second surface according to an embodiment of the present invention;

[0017] Figure 5 This is a schematic diagram of a chip according to an embodiment of the present invention;

[0018] Figure 6 This is a schematic diagram of a chip according to an embodiment of the present invention;

[0019] Figure 7 This is a schematic diagram of a chip according to an embodiment of the present invention.

[0020] Figure label:

[0021] 100 Circuit board assembly, 110 Circuit board, 120 Chip, 121 First side, 122 Second side, 123 Third side, 124 Fourth side, 130 Gap, 140 Colloid, 151 First flow guide, 152 Second flow guide, 153 Third flow guide, 154 First part, 155 Second part, 156 Third part, 157 Flow equalization part, 158 First end, 159 Second end, 160 Shielding, 161 Through hole, 171 Die, 172 Barrier part, 180 Pin, 191 First surface, 192 Second surface, 193 Side. Detailed Implementation

[0022] Embodiments of the present invention will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0023] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this invention, unless otherwise stated, "a plurality of" means two or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0024] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0025] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0026] The following is combined Figures 1-7 This invention describes chips, circuit board assemblies, and electronic devices according to embodiments of the present invention.

[0027] like Figure 1 As shown, in some embodiments of this application, a chip 120 is proposed. The chip 120 includes a first surface 191, a second surface 192, and a side surface 193. The first surface 191 is provided with pins 180. The first surface 191 and the second surface 192 are disposed opposite to each other. The side surface 193 connects the first surface 191 and the second surface 192. The second surface 192 is provided with a first flow guide portion 151. The first flow guide portion 151 includes at least one of a flow guide texture, a groove, and a flow guide coating.

[0028] The first surface 191 is provided with pins 180, which are used to achieve electrical connection and physical fixation with the circuit board 110. The first surface 191 and the second surface 192 are arranged opposite to each other, while the side surface 193 forms the circumferential outer wall of the chip 120. A first guide portion 151 is provided on the second surface 192. The first guide portion 151 can be at least one of guide texture, groove or guide coating. When the chip 120 is connected to the circuit board 110 in the circuit board assembly 100 through the first surface 191, a small gap 130 is formed between the first surface 191 and the circuit board 110 due to the presence of the pins 180. This gap 130 is the area that needs to be filled with glue 140 to achieve bottom filling and reinforcement.

[0029] Traditional dispensing methods require the dispensing nozzle to be aligned with the chip edge, relying on capillary force generated by the natural gap between the chip bottom and the circuit board to draw in the adhesive. This necessitates that the shielding cover must have a sufficiently wide edge for operation. However, this embodiment alters the guiding path of the adhesive 140 by providing a flow guide on the second surface 192 of the chip 120. During dispensing, the dispensing nozzle can directly drip the adhesive 140 onto the second surface 192 of the chip 120. At this time, the first flow guide 151 actively guides the adhesive 140 dripping onto the surface of the chip 120, overcoming the effects of gravity and surface tension. The adhesive 140 flows directionally towards the side 193 of the chip 120 and ultimately flows into the gap 130 formed between the first surface 191 and the circuit board 110. This structural design allows the dispensing location to be flexible, no longer limited to the edge of the chip 120, but can be placed at any position on the upper surface of the chip 120 (i.e., the second surface 192). This greatly reduces the accuracy requirements for the shielding opening position, allowing the shielding edge to be closer to the chip 120, effectively reducing the overall size of the circuit board assembly 100 and meeting the miniaturization requirements of electronic devices. Furthermore, by setting the flow guide as a texture, groove, or coating, a suitable flow guide method can be selected according to different manufacturing processes and the characteristics of the adhesive 140. For example, textures and grooves can provide physical guidance, while coatings can change the surface wettability to promote flow, ensuring the reliability and efficiency of dispensing.

[0030] Combination Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, in one possible embodiment, the chip 120 further includes a second flow guide 152 extending toward the first surface 191, and the first flow guide 151 and the second flow guide 152 are connected.

[0031] The second flow guide 152 is provided on the side 193, or the second flow guide 152 is a flow guide channel opened on the second surface 192, and the flow guide channel extends through the chip 120 to the first surface 191.

[0032] The first flow guide 151 and the second flow guide 152 are connected to form a continuous flow guide network. This interconnected structure ensures that the colloid 140, after entering from the second surface 192, can flow smoothly to the bottom or side 193 of the chip 120.

[0033] The second flow guide 152 can be provided on the side 193 of the chip 120, that is, the flow guide texture or groove can be directly processed on the side 193. In this way, after the colloid 140 flows from the second surface 192 to the side 193, it can be directly guided downward to the gap 130 between the first surface 191 and the circuit board 110.

[0034] Alternatively, the second flow guide 152 can be a flow guide channel formed on the second surface 192, extending through the chip 120 to the first surface 191. This channel structure is similar to an internal "dark pipe," allowing the colloid 140 to be directly delivered to the bottom region of the chip 120 via the internal channel after entering the inlet of the second surface 192, without flowing through the side 193. This is particularly useful in scenarios where the space on the side 193 of the chip 120 is limited or where it is necessary to avoid colloid overflow on the side 193.

[0035] Combination Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 6 As shown, in one possible embodiment, the first surface 191 is provided with a third flow guide 153 that communicates with the first flow guide 151. The third flow guide 153 communicates with the first flow guide 151 through a second flow guide 152. The third flow guide 153 is spaced apart from the pin 180.

[0036] The first surface 191 is provided with a third flow guide 153 that communicates with the first flow guide 151, and the third flow guide 153 is connected to the first flow guide 151 through a second flow guide 152, thus forming a complete flow guide loop from the top to the bottom of the chip 120. To prevent the colloid 140 from contaminating or interfering with the core functional area of ​​the chip 120, the third flow guide 153 is spaced away from the pins 180 on the chip 120, meaning the flow path avoids the dense area of ​​the pins 180. This not only ensures the reliability of the electrical connection but also avoids the risk of short circuits caused by colloid 140 residue. This multi-segment flow guide design makes the flow guide function of each part more clearly defined. Through the synergistic effect of each part, precise control of the flow trajectory of the colloid 140 is achieved, ensuring the consistency and predictability of the dispensing process.

[0037] Combination Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 6As shown, in one possible embodiment, the second surface 192 of the chip 120 has a first side 121, a second side 122, a third side 123, and a fourth side 124. The first side 121 and the second side 122 are located on opposite sides of the second surface 192, and the third side 123 and the fourth side 124 are located on the other opposite sides of the second surface 192. The first guide portion 151 includes a first portion 154, a second portion 155, and a third portion 156. The second portion 155 is connected to the first portion 154 and extends toward the first side 121 and / or the second side 122. The third portion 156 is connected to the first portion 154 or the second portion 155 and extends toward the third side 123 and / or the fourth side 124.

[0038] The second surface 192 of the chip 120 has four boundaries: a first side 121, a second side 122, a third side 123, and a fourth side 124. The first side 121 and the second side 122 are located on opposite sides of the second surface 192, while the third side 123 and the fourth side 124 are located on another set of opposite sides. The first portion 154 can be designed to be positioned opposite the dispensing port to receive the main amount of adhesive. The second portion 155 is connected to the first portion 154 and extends towards the first side 121 and / or the second side 122. The second portion 155 is used to dispense the adhesive 140 to both lateral sides of the chip 120. The third portion 156 is connected to either the first portion 154 or the second portion 155 and extends towards the third side 123 and / or the fourth side 124. The third portion 156 is used to dispense the adhesive 140 vertically. This radial or grid-like layout allows the colloid 140 to spread rapidly from the dispensing center outwards, covering a larger area of ​​the bottom of the chip 120. The multi-directional flow distribution design effectively shortens the flow path of the colloid 140, reduces the risk of air bubble retention, and ensures uniform colloid 140 filling in all corners of the bottom of the chip 120.

[0039] Combination Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 6 As shown, in one possible embodiment, the second portion 155 is disposed between the first portion 154 and the third side 123, the first end 158 of the second portion 155 extends to the first side 121, the second end 159 of the second portion 155 extends to the second side 122, the first portion 154 is connected to the portion between the first end 158 and the second end 159 of the second portion 155; one end of the third portion 156 is connected to the second portion 155, and the other end of the third portion 156 extends to the third side 123.

[0040] The first flow guide 151 also includes a flow equalization section 157 disposed at the edge of the second surface 192 and extending along a plurality of sides of the second surface 192, wherein the first end 158 and / or the second end 159 of the second portion 155 are connected to the flow equalization section 157, and the third portion 156 extends to one end of the third side 123 and is connected to the flow equalization section 157.

[0041] In this embodiment, a second part 155 is symmetrically arranged on both sides of the first part 154, and a third part 156 is symmetrically arranged on both sides of the first part 154.

[0042] The second portion 155 is disposed between the first portion 154 and the third side 123, forming a transverse channel spanning the width of the chip 120, while the first portion 154 is connected to the middle of the transverse channel. One end of the third portion 156 is connected to the second portion 155, and the other end of the third portion 156 extends to the third side 123. To ensure that the colloid 140 can be evenly distributed to the edge of the chip 120 without local accumulation, the first flow guide 151 also includes a flow equalization portion 157 disposed at the edge of the second surface 192 and extending along multiple sides. The flow equalization portion 157 is essentially a groove or textured strip that surrounds or partially surrounds the edge of the chip 120. The first end 158 and / or the second end 159 of the second portion 155 are connected to the flow equalization portion 157, and the end of the third portion 156 is also connected to the flow equalization portion 157. In this way, the colloid 140 flowing in from the first part 154, after being initially diverted by the second part 155 and the third part 156, will converge into the flow equalization part 157 at the edge. The flow equalization part 157 will then redistribute the colloid 140 evenly and guide it downwards from various positions at the edge. This three-stage flow guiding mechanism of "center-radial-edge equalization" minimizes the uneven filling caused by dispensing position deviations or colloid volume fluctuations, significantly improving the long-term reliability of the product.

[0043] In one possible embodiment, the first end 158 of the second portion 155 extends to the first side 121, the second end 159 of the second portion 155 extends to the second side 122, and the first portion 154 is connected to the portion between the first end 158 and the second end 159 of the second portion 155. One end of the third portion 156 is connected to the second portion 155, and the other end of the third portion 156 extends to the third side 123; the first guide portion 151 includes at least two third portions 156, and the plurality of third portions 156 extend along the extension direction of the second portion 155 (…). Figure 2 (The arrow at point H points to) the interval setting.

[0044] The second part 155 is designed as a main distribution channel spanning the width of the chip 120. The first end 158 of the second part 155 extends to the first side 121, and the second end 159 extends to the second side 122, thus forming a guiding section connecting the left and right sides of the chip 120. The first part 154 connects to the middle section of the aforementioned guiding section and is used to collect dripping colloid. The third part 156 serves as a branch channel extending outward from the side edge of the second part 155. One end of the third part 156 is connected to the second part 155, and the other end extends to the third side 123, thereby distributing the colloid from the central region to the edge of the chip 120. This multi-branch parallel layout constructs a dense, gridded guiding network on the second surface 192 of the chip 120, ensuring uniform colloid filling at every corner of the bottom of the chip 120.

[0045] Combination Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 6 As shown, in one possible embodiment, the chip 120 further includes a second flow guide 152, which includes a flow guide channel formed on the second surface 192, with the other end of the flow guide channel extending to the first surface 191 or the side surface 193. The first flow guide 151 is a groove, which extends to communicate with the opening of the flow guide channel located on the second surface 192.

[0046] In addition to the first flow guide 151 disposed on the second surface 192, the chip 120 also includes a second flow guide 152. The second flow guide 152 is a flow channel formed on the second surface 192, and the flow channel is a through-hole 161 structure with openings at both ends. This internal channel design breaks through the limitation of simply relying on surface texture for flow guidance, allowing the colloid 140 to have a "shortcut" to directly penetrate from the top of the chip 120 to the bottom or side 193. Some of the colloid 140 first falls into the groove of the first flow guide 151 and is guided to diffuse along the surface tension of the groove. When flowing through the opening of the flow channel, driven by gravity and pressure, the colloid 140 will quickly fill the internal channel and directly reach the gap 130 at the bottom or the side 193 of the chip 120 through the outlet at the other end of the channel. On the one hand, the internal flow channel is used to quickly fill the central area at the bottom of the chip 120, which greatly shortens the flow path of the colloid 140 and effectively reduces the probability of air bubble entrapment. On the other hand, the surface groove retains its flow guiding function, ensuring the fullness of the filling in the edge area of ​​chip 120 and avoiding the risk of dispensing failure caused by blockage of a single channel.

[0047] Combination Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 6 and Figure 7 As shown, in one possible embodiment, the first surface 191 is provided with a barrier portion 172, which is a continuous closed pattern, and the second guide portion 152 and the third guide portion 153 are both provided outside the closed pattern.

[0048] The barrier portion 172 is a continuous closed pattern. The second flow guide portion 152, the third flow guide portion 153, and the flow channel are all cleverly arranged within the area surrounded by the closed pattern of the barrier portion 172. This design utilizes the barrier portion 172 as a physical barrier to effectively prevent the colloid 140 from flowing to the die 171 at the bottom of the chip 120, thus preventing the colloid 140 from eroding or interfering with the core circuitry or bonding wires of the chip 120. Whether during the dispensing process or during the long-term use of the chip 120, the barrier portion 172 ensures that the colloid 140 is strictly confined to the non-functional area, guaranteeing both mechanical reinforcement and sealing effects while maintaining the purity and stability of the electrical performance of the chip 120.

[0049] Combination Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 6 As shown, in some embodiments of this application, a circuit board assembly 100 is proposed. The circuit board assembly 100 includes a circuit board 110, a shielding member 160, and a chip 120 as described in any of the above embodiments. The first surface 191 of the chip 120 is fixed to the circuit board 110 by a plurality of pins 180, and a gap 130 is formed between two adjacent pins 180. The gap 130 is provided with an adhesive 140. The shielding member 160 is connected to the circuit board 110 and covers the chip 120. The shielding member 160 is provided with a through hole 161, which is disposed opposite to the second surface 192 to expose the first flow guide portion 151.

[0050] The first surface 191 of chip 120 is fixed to circuit board 110 via pins 180. Multiple adjacent gaps 130 are formed between the first surface 191 and circuit board 110 due to solder joints; these gaps 130 serve as the accommodating space for the bottom filler adhesive. A shield 160 is placed over chip 120 and has through-holes 161, which are positioned opposite to the second surface 192 of chip 120. The orthogonal projection of the first guide portion 151 at least partially coincides with the dispensing opening, ensuring that the dispensing nozzle can dispense adhesive onto the second surface 192 of chip 120 without obstruction. During dispensing, adhesive 140 drips through the opening onto the first guide portion 151 of the second surface 192, then flows under the guidance of the first guide portion 151 towards the side 193 of chip 120, and finally flows into the gaps 130 between the first surface 191 and circuit board 110. It breaks through the strict limitations of traditional dispensing on the position and size of the shield, allowing the shield to be made smaller and more compact, thereby effectively reducing the volume of the entire circuit board assembly by 100, and meeting the design requirements of modern electronic devices for thinness and miniaturization.

[0051] In one possible embodiment, the first guide portion 151 is used to guide the colloid 140 into the void 130.

[0052] The first guide section 151 is not merely a passive receiving surface, but an active guiding structure. This active guiding function significantly reduces the dependence of the dispensing process on equipment precision. Even if there is a slight deviation in the dispensing position, as long as the adhesive 140 falls within the range of the first guide section 151, the final filling effect can be guaranteed.

[0053] In one possible embodiment, the first surface 191 is provided with a barrier portion 172 for enclosing and forming a clean adhesive area, and the adhesive 140 is all disposed outside the clean adhesive area.

[0054] The barrier portion 172 is a continuous closed pattern. This design utilizes the barrier portion 172 as a physical barrier to effectively prevent the colloid 140 from flowing to the die 171 at the bottom of the chip 120, thus preventing the colloid 140 from eroding or interfering with the core circuitry or bonding wires of the chip 120. Whether during the dispensing process or during the long-term use of the chip 120, the barrier portion 172 ensures that the colloid 140 is strictly confined to the non-functional area, guaranteeing both mechanical reinforcement and sealing effects while maintaining the purity and stability of the electrical performance of the chip 120.

[0055] In one embodiment of this application, capillary textures are made on all or part of the outer surface of the chip 120. The colloid 140 is dropped onto the newly added capillary textures on the upper surface of the chip 120. Under the guidance of the capillary action of the capillary textures, it flows to the bottom of the chip 120, thereby achieving dispensing between the bottom of the chip 120 and the circuit board 110.

[0056] Capillary textures are achieved (but are not limited to) the following methods:

[0057] After encapsulation, chemical etching, laser engraving, and other methods are used to form capillary textures on the surface of chip 120.

[0058] A chip 120 packaging mold with capillary features is used. After the chip 120 is packaged in the mold as a bare die, it is demolded. After demolding, the surface of the chip 120 forms a capillary texture.

[0059] Through the above invention, the position of the dispensing nozzle has been changed from the edge of the chip 120 to any position above the chip 120, thereby reducing the width restrictions on the shield 160 and the circuit board 110.

[0060] For example, a capillary texture is made on the entire outer surface of the chip 120, and adhesive is dispensed on the capillary texture of the chip 120. The adhesive 140 falls on the surface of the chip 120. Under the capillary action of the capillary texture, the adhesive 140 flows through the first guide portion 151 on the top surface of the chip 120 to the second guide portion 152 on the side of the chip 120, and then flows into the bottom of the chip 120 through the capillary gap at the bottom of the chip 120, thereby realizing the dispensing of adhesive between the chip 120 and the circuit board 110.

[0061] Compared to the dispensing solutions in related technologies, this implementation solution solves the length limitation of the circuit board 110. The opening position of the shield 160 can be any upper surface of the chip 120 at the outer edge of the chip 120, thereby reducing the size and position requirements of the dispensing opening of the shield 160 and reducing the width limitation from the outer edge of the shield 160 to the edge of the chip 120.

[0062] In another embodiment of this application, a capillary texture of a specific range is formed on the surface of chip 120, and adhesive is applied above the capillary texture of chip 120. The adhesive 140 falls into the first guide portion 151 on the top surface of chip 120. Under the capillary action of the capillary texture, the adhesive 140 flows through the first guide portion 151 on the top surface of chip 120 to the second guide portion 152 on the side of chip 120, and then flows through the second guide portion 152 on the side of chip 120 to the third guide portion 153 on the bottom surface of chip 120. Under the capillary action, the adhesive 140 quickly fills the gap 130.

[0063] In some scenarios, it is not possible to apply adhesive to the entire bottom of the chip 120. The third guide portion 153 and the barrier portion 172 can be used to limit the range of the adhesive 140 on the bottom of the chip 120.

[0064] The texture on a specific area of ​​the bottom surface of chip 120 can be a raised texture or an anti-capillary texture, used to hinder and restrict the flow of colloid 140.

[0065] By using a specific range of capillary textures, the dispensing range of chip 120 is determined, thereby avoiding other problems caused by dispensing adhesive to the entire bottom of chip 120.

[0066] In another embodiment of this application, a channel for colloid 140 is formed on the surface of chip 120, and colloid 140 is applied to a specific area of ​​chip 120. The colloid 140 flows along the channel for colloid 120 to the side and then flows along the side of chip 120 to the bottom of chip 120, thereby filling the bottom of chip 120 with colloid 140.

[0067] Channels can be provided in chip 120 to allow colloid 140 to flow through these channels to the bottom of chip 120.

[0068] The above method avoids adding a coating or capillary texture to the surface of chip 120, and can form a dispensing channel in one step during the chip 120 packaging process.

[0069] Capillary texture can also be a coating material that promotes or hinders the flow of colloid 140, and such a coating material can be sprayed onto chip 120.

[0070] Texture can also be a special material that promotes or hinders the flow of solder and flux.

[0071] In the embodiments of this application, an electronic device is proposed, which includes the chip or the circuit board assembly in any of the above embodiments and can achieve the same technical effect, which will not be described again here.

[0072] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0073] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A chip, characterized in that, The chip includes: a first surface, a second surface, and a side surface. The first surface is provided with pins. The first surface and the second surface are disposed opposite to each other. The side surface is connected to the first surface and the second surface. The second surface is provided with a first current guiding portion. The first flow guide includes at least one of flow guide texture, groove and flow guide coating.

2. The chip according to claim 1, characterized in that, The chip further includes a second flow guide extending toward the first surface, and the first flow guide and the second flow guide are connected. The second flow guide is provided on the side; or, The second flow guide portion is a flow guide channel formed on the second surface, and the flow guide channel extends through the chip to the first surface.

3. The chip according to claim 2, characterized in that, The first surface is provided with a third flow guide that communicates with the first flow guide. The third flow guide is connected to the first flow guide through the second flow guide. The third flow guide is spaced apart from the pin.

4. The chip according to claim 1, characterized in that, The second surface of the chip has a first side, a second side, a third side, and a fourth side. The first side and the second side are located on opposite sides of the second surface, and the third side and the fourth side are located on another opposite side of the second surface. The first flow guide includes a first part, a second part, and a third part. The second part is connected to the first part and extends toward the first side and / or the second side. The third portion is connected to the first portion or the second portion, and the third portion extends toward the third side and / or the fourth side.

5. The chip according to claim 4, characterized in that, The second part is disposed between the first part and the third side, with a first end of the second part extending to the first side and a second end of the second part extending to the second side. The first part is connected to the portion between the first end and the second end of the second part. One end of the third part is connected to the second part, and the other end of the third part extends to the third side. The first flow guide further includes a flow equalization section disposed at the edge of the second surface and extending along a plurality of sides of the second surface; the first end and / or the second end of the second portion is connected to the flow equalization section, and one end of the third portion extending to the third side is connected to the flow equalization section.

6. The chip according to claim 4, characterized in that, The first end of the second part extends to the first side, the second end of the second part extends to the second side, and the first part is connected to the portion between the first end and the second end of the second part; one end of the third part is connected to the second part, and the other end of the third part extends to the third side; the first guide portion includes at least two of the third parts, and a plurality of the third parts are spaced apart along the extension direction of the second part.

7. The chip according to claim 1, characterized in that, It also includes a second flow guide portion, which includes a flow guide channel formed on the second surface, and the other end of the flow guide channel extends to the first surface or the side surface; The first guide portion is a groove, and the first guide portion extends to communicate with the opening of the guide channel located on the second surface.

8. The chip according to claim 3, characterized in that, The first surface is provided with a barrier portion, which is a continuous closed pattern. The second and third flow guiding portions are both located outside the closed pattern.

9. A circuit board assembly, characterized in that, include: Circuit board; The chip as described in any one of claims 1 to 8, wherein the first surface of the chip is fixed to the circuit board by a plurality of said pins, a gap is formed between two adjacent said pins, and the gap is provided with colloid; A shielding component is connected to the circuit board and covers the chip. The shielding component has a through hole, which is disposed opposite to the second surface to expose the first flow guide portion.

10. The circuit board assembly according to claim 9, characterized in that, The first flow guide is used to guide the colloid into the void.

11. The circuit board assembly according to claim 9, characterized in that, The first surface is provided with a barrier portion for enclosing and forming a clean adhesive area, and the adhesive is disposed outside the clean adhesive area.

12. An electronic device, characterized in that, include: The chip as described in claims 1 to 8 or the circuit board assembly as described in any one of claims 9 to 11.

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