MOCVD heating device with deformation suppression and MOCVD equipment

Abstract

The present application relates to the technical field of metal organic chemical vapor deposition, and provides a MOCVD heating device for inhibiting deformation and a MOCVD equipment.The device comprises a heating body assembly composed of inner, middle and outer ring heating bodies, and the key lies in that the heating body is supported by a heating body plate type support strip in linear contact, and a protrusion is arranged in a groove on the support strip to reduce contact stress and thermal deformation.A plurality of heat insulation assemblies are arranged at the lower part of the device, the heat insulation plates are supported by profiled heat insulation support plates in plate strip type linear contact, and the thickness and spacing distribution of the heat insulation plates are optimized, and a self-supporting reflective heat insulation ring is integrated to improve the heat insulation effect.The outer ring heating body is designed to be thickened and narrowed to compensate for the loss of edge heat.The planeness, stability and thermal field uniformity of the heating body are significantly improved through multiple structure optimization, so that the deformation is effectively inhibited, and the epitaxial film forming quality is improved.

Description

Technical Field

[0001] This application relates to the field of metal-organic chemical vapor deposition technology, specifically to a MOCVD heating device and MOCVD equipment that suppress deformation. Background Technology

[0002] Metal-Organic Chemical Vapor Deposition (MOCVD), an indispensable core material preparation technology in the modern semiconductor industry, is mainly used for the epitaxial growth of thin single-crystal films of compound semiconductors. The basic principle of this technology is to use a carrier gas to transport a group III or II metal-organic compound precursor, along with a group V or VI hydride, into a reaction chamber. On the heated substrate surface, these gaseous substances undergo a series of complex thermal decompositions and surface chemical reactions, ultimately depositing a structurally complete and high-crystallinity semiconductor thin film on the substrate. Because this process can achieve atomic-level precision control of film layers over a large area, MOCVD is widely used for the large-scale production of functional structural materials of compound semiconductors, such as optoelectronic devices, high-frequency communication equipment, and power electronic components. It is a key process equipment that is difficult to replace with other epitaxial technologies such as molecular beam epitaxy (MBE).

[0003] From a system composition perspective, MOCVD equipment is a typical multidisciplinary integrated system, integrating multiple high-end technology fields such as precision mechanical engineering, semiconductor materials physics, vacuum and fluid control, thermal management engineering, and optoelectronic monitoring in its design and manufacturing. This type of equipment not only has a high degree of automation but also imposes extremely stringent requirements on process stability, repeatability, and control precision. In the MOCVD process, the heating device is one of the core components determining the quality of the epitaxial layer; its performance directly affects the crystal quality, interface steepness, doping uniformity, and the final electrical and optical properties of the device. Specifically, the heating device is responsible for providing the necessary temperature environment for gas-phase reactions and surface migration, and it must meet several stringent process parameters, including rapid heating and cooling capabilities, excellent steady-state temperature uniformity, short stabilization time, and extremely low temperature fluctuations during long-term operation. In actual epitaxial growth, even slight changes in temperature can alter the reaction path or cause uneven film thickness, thus placing extremely high demands on the control precision and stability of the heating system. To achieve this, modern MOCVD equipment typically employs a multi-zone independently controlled heating structure. Furthermore, the uniformity of the thermal field distribution on the substrate is a key factor determining film thickness uniformity and compositional consistency; an uneven thermal field can cause spatial differences in deposition rates, leading to excessive film thickness differences between the epitaxial wafer's edge and center regions, severely impacting product yield. Therefore, the design of the heating system requires not only attention to the arrangement and thermal coupling of heating elements but also the comprehensive design of thermal insulation and heat insulation components to jointly construct an efficient, stable, and highly uniform high-temperature reaction environment.

[0004] Besides the heating system itself, its supporting thermal insulation structure also plays a crucial role. Good and reasonable thermal insulation design helps reduce system heat loss, improve heating efficiency, and enhance the symmetry of temperature distribution within the cavity; while effective electrical insulation ensures the safety and reliability of the system during high-power, long-term heating processes, preventing process failures due to leakage or breakdown. As semiconductor technology nodes continue to advance, the requirements for MOCVD equipment heating systems are also increasing. For example, in emerging applications such as Mini / Micro LED and power electronic gallium nitride (GaN) epitaxy, heating systems need to adapt to higher temperatures, more complex gas flow environments, and larger substrate sizes. Therefore, improving thermal insulation components has become an important direction for the current development of MOCVD technology.

[0005] However, existing heating elements are supported by several or even more than ten insulating support points. Existing heat insulation components usually adopt a multi-layered spacer structure and also support components such as heat insulation boards through numerous insulating support points. The height and verticality of each support point may have slight processing and installation errors. When dozens of such points support a heavy heating element or heat insulation board, the distribution of support force is very complex, leading to changes in contact force and increased uncontrollability. This increases the risk of warping or tilting of the entire heating element or heat insulation board. Parallelism and flatness are not easy to control, resulting in poor stability and reliability, affecting the uniformity of the thermal field, large temperature fluctuations during control and adjustment, and a high possibility of deformation and displacement of heat insulation components and heating components, which in turn affects the film formation quality. Summary of the Invention

[0006] Overcoming the shortcomings of existing technologies, this application provides a MOCVD heating device and MOCVD equipment that suppresses deformation. It achieves stable support for the heating coil and heat insulation components, suppresses deformation, further reduces the possibility of displacement of various components, simplifies components and reduces assembly difficulty, reduces changes in contact force and uncontrollability, greatly reduces the risk of warping or tilting of the entire heating plate or heat insulation plate, effectively and accurately controls parallelism and flatness, improves the stability and reliability of the overall device, and improves film quality.

[0007] The embodiments of this application are implemented as follows: On one hand, this application provides an example of an MOCVD heating device for suppressing deformation, including a heating element assembly. The heating element assembly includes an inner ring heating element (1), an outer ring heating element (2), and a middle ring main heating element (3). The heating element assembly is housed within the MOCVD chamber and located below the wafer carrier. It is powered and heated by an electrode assembly (7). The device is characterized by: The heating element assembly is supported by a heating element plate support strip (5), and the heating element plate support strip (5) and the heating element assembly are in line contact support; The heating element plate support bar (5) is provided with a plurality of first grooves (10), and the outer ring heating element (2) and the middle ring main heating element (3) are accommodated in the first grooves (10).

[0008] Optionally, the ratio of the thickness of the outer ring heating element (2) to the thickness of the middle ring main heating element (3) is 1.01:1 to 1.4:1; and / or, the width of the outer ring heating element (2) is 5% to 85% of the width of the middle ring main heating element (3).

[0009] Optionally, the bottom of the first groove (10) is provided with a protrusion (16), which contacts the outer ring heating body (2) or the middle ring main heating body (3); and / or, the depth of the first groove (10) is one-tenth to one-third of the thickness of the outer ring heating body (2) or the middle ring main heating body (3); and / or, the thickness d of the heating body plate support strip (5) is 0.5mm to 10mm.

[0010] Optionally, the protrusion (16) is in the shape of spaced dots or serrations.

[0011] Optionally, the heating device further includes a multi-layer heat insulation component (8) disposed at the lower part of the heating body assembly. The multi-layer thermal insulation assembly (8) includes a top thermal insulation panel (9) having a first through hole (11). The heating element plate support bar (5) includes a first through portion (17) that passes through the first through hole (11) and a second through hole (13). The heating device also includes a positioning buffer (12), which includes a positioning part (14) and a buffer part (15). The positioning part (14) passes through the second through hole (13) and is in close contact with the lower surface of the top heat insulation plate (9). The buffer part (15) has an S-shaped structure.

[0012] Optionally, the multi-layer heat insulation assembly (8) further includes an intermediate heat insulation board (17) and a bottom heat insulation board (18), wherein the top heat insulation board (9), the intermediate heat insulation board (17) and the bottom heat insulation board (18) are supported from top to bottom by a shaped heat insulation support board (19) at intervals. The thickness of the top heat insulation board (9) is greater than the thickness of the middle heat insulation board (17), and the thickness of the middle heat insulation board (17) is greater than the thickness of the bottom heat insulation board (18); and the distance between the top heat insulation board (9) and the middle heat insulation board (17) is less than the distance between the middle heat insulation board (17) and the bottom heat insulation board (18).

[0013] Optionally, the ratio of the thickness of the top layer insulation board (9) to the thickness of the intermediate layer insulation board (17) is 1.2:1 to 3:1, and the ratio of the thickness of the intermediate layer insulation board (17) to the thickness of the bottom layer insulation board (18) is 1.2:1 to 3:1; and / or, the difference between the distance between the intermediate layer insulation board (17) and the bottom layer insulation board (18) and the distance between the top layer insulation board (9) and the intermediate layer insulation board (17) is 3 to 4 times the thickness of the bottom layer insulation board (18).

[0014] Optionally, the irregular heat insulation support plate (19) includes a first through support portion (20) and a second support portion (21). The first through support (20) penetrates the intermediate layer heat insulation plate (17) and is fixed to the top layer heat insulation plate (9) and the bottom layer heat insulation plate (18) by the lug (22) and the annular retaining plate (24) provided thereon; The second support (21) is fixed to the intermediate heat insulation plate (17) and the bottom heat insulation plate (18) by means of the lug (22) and the annular retaining plate (24) provided thereon; The annular plate (24) includes an annular body (26), a latch (27), and a stress relief seam (25). The latch (27) is used to pass through the third through hole (23) on the lug (22) to achieve a snap-fit.

[0015] Optionally, the irregular heat insulation support plate (19) is provided with a through hole (28), and the self-supporting reflective heat insulation ring (29) passes through and is supported by the inner wall of the through hole (28); The self-supporting reflective heat insulation ring (29) is annular and is composed of multiple layers of thin metal plates with interlaced ridges.

[0016] On the other hand, this application provides an example of an MOCVD apparatus, including the aforementioned MOCVD heating device for suppressing deformation.

[0017] Beneficial effects include: A deformation-suppressing MOCVD heating device and MOCVD equipment, by adopting a heating element plate support strip, replaces the traditional "multi-point support" with "line contact support," greatly simplifying the distribution of support force and avoiding the risk of warping or tilting caused by multi-point installation errors. This makes the parallelism and flatness of the heating element easier to control, fundamentally reducing the possibility of heating element component deformation. It achieves stable support for the heating coil and insulation components, suppressing deformation, further reducing the possibility of component displacement, simplifying components and reducing assembly difficulty, and reducing the uncontrollability of contact force changes. The risk of warping or tilting of the entire heating element or insulation plate is greatly reduced, and parallelism and flatness are effectively and precisely controlled, improving the overall stability and reliability of the device and enhancing film quality. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of a deformation-preventing MOCVD heating device provided in an embodiment of this application.

[0020] Figure 2 This is a partially enlarged schematic diagram of the heating element plate support strip provided in an embodiment of this application.

[0021] Figure 3 This is a schematic diagram of the assembly and positioning of the heating element plate support strip provided in an embodiment of this application.

[0022] Figure 4 This is a partially enlarged schematic diagram of the first groove provided in an embodiment of this application.

[0023] Figure 5 This is a partially enlarged schematic diagram of a multilayer thermal insulation component provided in an embodiment of this application.

[0024] Figure 6 This is a partially enlarged schematic diagram of the annular card plate provided in an embodiment of this application.

[0025] Figure 7 This is a partially enlarged schematic diagram of a self-supporting reflective heat insulation ring provided in an embodiment of this application.

[0026] Icons: 1-Inner ring heating element; 2-Outer ring heating element; 3-Middle ring main heating element; 4-Inner ring heat insulation element; 5-Heating element plate support strip; 6-Rotating support shaft; 7-Electrode assembly; 8-Multi-layer heat insulation assembly; 9-Top layer heat insulation plate; 10-First groove; 11-First through hole; 12-Positioning buffer; 13-Second through hole; 14-Positioning part; 15-Buffer part; 16-Protrusion; 17-Middle layer heat insulation plate; 18-Bottom layer heat insulation plate; 19-Irregular heat insulation support plate; 20-First through support part; 21-Second support part; 22-Leg; 23-Third through hole; 24-Annular retaining plate; 25-Stress relief joint; 26-Circular main body; 27-Latch tongue; 28-Through hole; 29-Self-supporting reflective heat insulation ring; d-Support strip thickness. Detailed Implementation

[0027] The technical solution of the present invention will be clearly and completely described according to the following embodiments. It should be understood that these embodiments are merely examples of some implementations of the present invention, and not an exhaustive list of all possible implementations. Based on the embodiments disclosed in the present invention, any other embodiments that can be conceived by those skilled in the art without creative effort are within the protection scope of the claims of the present invention.

[0028] Those skilled in the art will understand that, unless otherwise expressly defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Furthermore, terms as defined in general dictionaries should be understood to have the same meaning as in the relevant prior art context, and should not be interpreted in an overly idealized or formalistic manner unless specifically defined as in this invention.

[0029] Those skilled in the art will also understand that, unless otherwise expressly stated, the singular forms “a,” “an,” “the,” and “the” used herein may also include plural references. Furthermore, the word “comprising” as used herein is used to indicate the presence of the stated features, steps, operations, elements, or components, but does not exclude the presence or addition of one or more other features, steps, operations, elements, components, or combinations thereof. The term “and / or” as used herein covers all instances and combinations thereof of any of the related listed items.

[0030] Existing heating elements and insulation components are supported by numerous insulating support points. The height and verticality of each support point may have slight processing and installation errors, resulting in a very complex distribution of support forces. This leads to changes in contact forces and increased uncontrollability, which in turn increases the risk of warping or tilting of the entire heating element or insulation plate. Parallelism and flatness are not easy to control, resulting in poor stability and reliability, affecting the uniformity of the thermal field, large temperature fluctuations during control and adjustment, and a high possibility of deformation and displacement of insulation and heating components, which in turn affects the film quality. Therefore, this invention provides a MOCVD heating device and MOCVD equipment that suppress deformation.

[0031] The features and performance of this application will be further described in detail below with reference to embodiments: like Figure 1-7 As shown in the illustration, this application provides an MOCVD heating device for suppressing deformation, comprising: a heating body assembly, which includes an inner ring heating body 1, an outer ring heating body 2, and a middle ring main heating body 3. The heating body assembly is housed within an MOCVD chamber, which also contains a wafer carrier (not shown). The wafer carrier is used to support a wafer and deposit an epitaxial growth film layer prepared by the MOCVD method. The wafer carrier is supported by a rotating support shaft 6. The heating body assembly is located below the wafer carrier and is used to heat the wafer carrier. Heating is powered by an electrode assembly 7. The inner ring heating body 1 is arranged around the rotating support shaft 6 and is used to heat the rotating support shaft 6 and the surrounding area, thereby achieving temperature regulation in the central area of ​​the wafer carrier and improving the overall heating uniformity of the wafer carrier. An inner ring heat insulation body 4 is provided on the outside of the inner ring heating body 1 to uniformly heat the outside of the inner ring heating body 1, prevent deformation during the heating process, and prevent heat loss. The lower part of the heating element assembly is provided with a multi-layer heat insulation component 8, which is used to uniformly heat the lower part of the heating element assembly, prevent deformation during the heating process, and prevent heat loss.

[0032] Optionally, the outer ring heating element 2 is located on the outermost side of the heating element assembly, and is thicker and narrower than the middle ring main heating element 3, to compensate for the disadvantage that the outer ring heating element does not have a high enough heating temperature because it is located at the edge of the airflow discharge. The thickness of the outer ring heating element 2 is (1.01-1.4):1 (preferably 1.1:1-1.35:1, 1.13:1-1.1.25:1, 1.17:1-1.1.22:1, etc.) of the thickness of the middle ring heating element 3, where thickness refers to the height from bottom to top in the vertical direction perpendicular to the horizontal direction; the width of the outer ring heating element 2 is 5%-85% of the width of the middle ring main heating element 3 (optionally 5%, 7%, 8%, 13%, 21%, 26%, 35%, 42%, 53%, 67%, 72%, 76%, 81%, 85%, etc.). The "narrowing" reduces the cross-sectional area, thereby increasing the resistance and heating power of the heating element in that section. The power density (power per unit volume / area) is significantly improved. The thicker heating element has a larger heat capacity, thus having stronger thermal inertia. In the outer ring area, since it is the edge where the process airflow exits, the airflow speed and temperature are unstable, which will continuously "wash" and quickly carry away heat. The greater thermal inertia makes the temperature fluctuation of the outer ring heating element smaller when subjected to such disturbances, providing a more continuous and constant heat source for the wafer edge and avoiding sudden changes in edge temperature caused by airflow fluctuations.

[0033] The heating element assembly is supported by the heating element plate support strip 5. Previously, heating elements used numerous insulated support points. The height and verticality of each support point could have slight processing and installation errors. When dozens of such points supported a heavy heating element, the distribution of support force became very complex, leading to changes in contact force and increased uncontrollability. This increased the risk of warping or tilting of the entire heating element, making parallelism and flatness difficult to control, resulting in poor stability and reliability. The strip support insulation design of the heating element plate support strip 5 achieves line contact support between the heating element assembly and the heating element plate support strip 5, effectively reducing the possibility of uncontrollable multi-point deformation. This makes the parallelism of the heating element assembly easier to control and ensures stability and reliability. The linear contact between the heating element plate support strip 5 and the heating element assembly, along with the overall design of the heating element plate support strip 5, ensures that the inner, middle, and outer rings of the heating element all receive support with the same flatness, avoiding problems such as inconsistent assembly of point supports. This helps suppress the possibility of deformation of the zoned heating element assembly and improves temperature uniformity. It simplifies the distribution of support force, avoids changes in contact force and increases uncontrollability, and greatly reduces the risk of warping or tilting of the entire heating element. Parallelism and flatness are easy to control, stability and reliability are high, the uniformity of the thermal field is improved, the possibility of deformation and displacement of heating components is greatly reduced, and the film quality is improved.

[0034] The heating element plate support bar 5 also includes multiple first grooves 10 for accommodating the outer ring heating element 2 and the middle ring main heating element 3, preventing the outer ring heating element 2 and the middle ring main heating element 3 from shifting, so as to facilitate stable support of the heating element.

[0035] Optionally, a protrusion 16 is provided at the bottom of the first groove 10. The protrusion 16 is provided at the contact position between the first groove 10 and the outer ring heating element 2 and the middle ring main heating element 3; the protrusion 16 serves as a spacer, which helps to suppress deformation. The reason is that: the first groove 10, which accommodates part of the heating element, is in close contact with the heating element, affecting the thermal expansion and contraction of the heating element at the contact position (the materials of the heating element plate support strip 5 and the heating element are very different, resulting in a large difference in thermal expansion and contraction), and the two adjacent heating element plate support strips 5 act as a barrier to the communication of the lower space of the heating element, easily forming new local thermal difference areas near the contact positions on both sides of the heating element plate support strip 5. These factors increase the possibility of forming local stress points, increasing the impact of the heating element plate support strip 5 on the heating element, which is not conducive to further improving parallelism. The protrusion 16 reduces the contact area between the first groove 10, which accommodates part of the heating element, and the heating element, reducing the impact on the heating element; at the same time, the spaced protrusions... The protrusion 16 effectively provides localized point contact without affecting the overall line contact, while connecting both sides of the heating element plate support strip 5. This prevents the formation of new localized thermal difference areas near the contact points on both sides of the heating element plate support strip 5, which could result in gaps on both sides. It also provides space for the thermal expansion and contraction of the heating element, thus maintaining an environment that is infinitely close to the contact points between the heating element plate support strip 5 and the heating element, as well as other areas between the heating element (non-contact areas). At the same time, the protrusion 16 forms more heat reflection interfaces, further improving localized temperature uniformity and reducing the adverse effects of the support structure on the heating element. This benefits the overall heating and cooling stability of the heating element and extends its service life.

[0036] Optionally, the multiple protrusions 16 can be arranged in a dotted or serrated pattern. For example, the serrated pattern can further alleviate stress; local multi-point support is more conducive to improving the overall parallelism and flatness; and it helps to reduce heat dissipation.

[0037] Optionally, the depth of the first groove 10 is one-tenth to one-third of the thickness of the outer ring heating element 2 or the middle ring main heating element 3; the depth of the first groove 10 refers to the depth perpendicular to the horizontal plane. The depth of the first groove 10 needs to be sufficient to ensure stable support for the heating element and prevent the heating element from detaching from the heating element plate support strip 5 due to thermal expansion and contraction, which could lead to displacement of the heating element. The depth of the first groove 10 should not be too deep, as excessive depth will increase the contact between the side wall of the first groove 10 and the heating element, resulting in the formation of partitions on both sides of the heating element plate support strip 5, increasing the possibility of forming new local thermal difference areas near the contact positions on both sides of the heating element plate support strip 5; excessive suppression of the deformation of the heating element by the side wall can easily cause the heating element to appear at the contact position with the heating element plate support strip 5 and other positions with differences in stress and thermal uniformity, affecting heating uniformity and the long life of the heating element.

[0038] Optionally, the thickness d of the heating element plate support strip 5 is 0.5-10mm. The thickness d should not be too wide, as this increases the risk of contact between the sidewall of the first groove 10 and the heating element, potentially leading to gaps on both sides of the heating element plate support strip 5 and increasing the likelihood of new localized thermal difference areas forming near the contact points on both sides of the heating element insulating support strip 5. Excessive suppression of the heating element's deformation by the sidewall can cause differences in stress and thermal uniformity between the contact point with the heating element plate support strip 5 and other locations, affecting heating uniformity and the lifespan of the heating element. The thickness d should not be too low, as this can result in insufficient support strength and large deformation of the support strip.

[0039] The multi-layer heat insulation assembly 8 includes a top heat insulation plate 9 with a first through hole 11. The heating element plate support strip 5 also includes a positioning buffer 12, a second through hole 13, and a first through portion 17. The positioning buffer 12 includes a positioning portion 14 and a buffer portion 15. The top heat insulation plate 9 is used for heat insulation, is closest to the heating element, reduces heat loss from the heating element assembly, and evens out the temperature of the heating element assembly. The first through portion 17 of the heating element plate support strip 5 protrudes from the main body of the heating element plate support strip 5 and passes through the first through hole 11 of the top heat insulation plate 9. The positioning portion 14 of the positioning buffer 12 passes through the second through hole 13. The positioning portion 14 is close to the lower surface of the top heat insulation assembly 9 and is plate-shaped, thus forming a clamping structure for the heating element plate support strip 5, making the heating element plate support strip 5 stably clamped and preventing displacement. The plate shape of the positioning portion 14 increases the contact area and can suppress the deformation of the top heat insulation assembly 9 when it expands due to heat at the contact point. The positioning buffer 12... The buffer section 15 has an overall S-shaped structure. One end connected to the positioning section 14 is an arc-shaped structure, and the other end is a freely movable upward-bending arc-shaped structure. This allows the buffer section 15 to freely deform and move at one end to release stress when the heating body assembly is supported by the heating body plate support bar 5 and affected by thermal expansion and contraction. At the same time, the positioning section 14 is further supported by the freely movable upward-bending arc-shaped structure, which helps to further reduce the possibility of deformation of the clamping structure, improve the stability of the high-temperature structure, and the corresponding structure is easy to install and replace, and does not require the precise positioning of a point support structure.

[0040] Optionally, the multi-layer insulation component 8 includes a top layer insulation board 9, an intermediate layer insulation board 17, a bottom layer insulation board 18, and a shaped insulation support board 19; the shaped insulation support board 19 supports the top layer insulation board 9, the intermediate layer insulation board 17, and the bottom layer insulation board 18 at intervals to achieve multi-layer insulation and improve the insulation effect.

[0041] Understandably, the multi-layer insulation panel of the multi-layer insulation component 8 is supported by a non-standard insulation support plate 19. Similar to the support method of the heating element component, previous multi-layer insulation components used numerous insulating support points. The height and verticality of each support point may have slight processing and installation errors. When dozens of such points jointly support the multi-layer insulation panel, the distribution of the supporting force becomes very complex, leading to changes in contact force and increased uncontrollability. This increases the risk of warping or tilting of the entire multi-layer insulation panel, making parallelism and flatness difficult to control, resulting in poor stability and reliability. The strip-type support structure design of the shaped thermal insulation support plate 19 achieves line contact support between the multi-layer thermal insulation component 8 and the shaped thermal insulation support plate 19, effectively reducing the possibility of uncontrollable multi-point deformation. This makes the parallelism of the multi-layer thermal insulation board easy to control and ensures stability and reliability. The linear contact between the shaped thermal insulation support plate 19 and the insulation board, along with the overall design of the shaped thermal insulation support plate 19, ensures that both the inner and outer insulation board sections receive support with the same flatness, avoiding problems such as inconsistent assembly of point supports. This helps suppress the possibility of deformation of the multi-layer thermal insulation board, improves temperature uniformity, and allows for the use of thinner insulation boards. It simplifies the distribution of support force, avoiding changes in contact force and increased uncontrollability, thus greatly reducing the risk of warping or tilting of the entire multi-layer thermal insulation board. Parallelism and flatness are easy to control, resulting in high stability and reliability, improved temperature field uniformity, significantly reduced possibility of deformation and displacement of the thermal insulation component, and extended service life.

[0042] Optionally, the top insulation board 9, the middle insulation board 17, and the bottom insulation board 18 are arranged alternately from top to bottom, with the spacing between adjacent insulation boards gradually increasing and the thickness of the insulation boards gradually decreasing. Specifically, the thickness of the top insulation board 9 is greater than the thickness of the middle insulation board 17, the thickness of the middle insulation board 17 is greater than the thickness of the bottom insulation board 18, and the spacing between the top insulation board 9 and the middle insulation board 17 is smaller than the spacing between the middle insulation board 17 and the bottom insulation board 18. The insulation boards become thinner and the spacing larger from top to bottom, which helps to enhance the heat insulation effect and reduce the weight of the components. Reduced weight helps to reduce costs. Understandably, the top insulation board 9, the middle insulation board 17, and the bottom insulation board 18 can each consist of one or more boards.

[0043] Optionally, the thickness of the top insulation board 9, the middle insulation board 17 and the bottom insulation board 18 is 0.5-10mm.

[0044] Optionally, the thickness of the top layer insulation plate 9: the thickness of the middle layer insulation plate 17 is (1.2-3):1; the thickness of the middle layer insulation plate 17: the thickness of the bottom layer insulation plate 18 is (1.2-3):1; the distance between the middle layer insulation plate 17 and the bottom layer insulation plate 18 - the distance between the top layer insulation plate 9 and the middle layer insulation plate 17 is (3-4) times the thickness of the bottom layer insulation plate 18; in the MOCVD chamber at low or normal pressure, the gas is rarefied, but at high temperature, the convection and conduction of the remaining gas affect... The spacing between insulation panels has a significant impact on heat insulation and heat uniformity. A smaller distance between the insulation panels (the distance between the top insulation panel 9 and the middle insulation panel 17 is smaller than the distance between the middle insulation panel 17 and the bottom insulation panel 18) greatly suppresses convective and conductive heat transfer. A smaller spacing results in a larger radiation angle coefficient, allowing the heated radiation to be reflected and absorbed multiple times over a shorter distance. Each reflection results in some energy being absorbed and dissipated by the insulation panel itself, effectively attenuating radiant heat in high-temperature, high-heat-flux areas. A larger spacing between the middle insulation panel 17 and the bottom insulation panel 18, where heat has already significantly decreased and the temperature is lower, makes the radiant heat flow more moderate. The insulation effect of a smaller spacing is relatively weaker. Increasing the spacing further reduces the total number of insulation panels, significantly reducing the weight of the entire component. This is highly beneficial for the mechanical design and maintenance of the reaction chamber. Simultaneously, a slightly larger gap also facilitates the flow or discharge of gases retained during the process, preventing accumulation in the gaps of the insulation panels. By controlling the ratio of thick plate to thin plate to (1.2-3):1, and increasing the distance between the insulation plates to 3-4 times the thickness of the thinnest plate, the insulation plate thickness can be controlled more effectively, and the spacing can be controlled to achieve better insulation effect. Different insulation plate thicknesses and excessively large or small spacing will cause the temperature to fluctuate more between the two layers instead of decreasing gradually. This will create a discontinuous temperature field that will affect the heating element upwards, potentially causing uneven temperature distribution in the heating element itself. This will directly damage the temperature uniformity of the wafer growth area, resulting in uneven thickness and composition of the epitaxial wafer, and a decrease in yield. At the same time, the discontinuous temperature field will also affect the structural rigidity and stability of the entire insulation component.

[0045] Optionally, the irregular heat insulation support plate 19 includes a first through support portion 20, a second support portion 21, a lug 22, a third through hole 23, and an annular retaining plate 24. The first through support portion 20 is used to support the top heat insulation plate 9 and the bottom heat insulation plate 18. The first through support portion 20 penetrates the middle heat insulation plate 17 (with a through hole). After the lug 22 with the third through hole 23 penetrates the opening portions of the top heat insulation plate 9 and the bottom heat insulation plate 18 respectively, the irregular heat insulation support plate 19 is fixedly supported between the top heat insulation plate 9 and the bottom heat insulation plate 18 by the annular retaining plate 24 engaging the third through hole 23, thus forming a stable support structure. The second support part 21 supports the intermediate layer insulation board 17 and the bottom layer insulation board 18. The second support part 21, through lugs 22 with third through holes 23, penetrates the openings in the intermediate layer insulation board 17 and the bottom layer insulation board 18 respectively. An annular locking plate 24 then engages with the third through hole 23 to fix the irregularly shaped insulation support plate 19 between the intermediate layer insulation board 17 and the bottom layer insulation board 18, forming a stable support structure. The first through support part 20, the second support part 21, and the lugs 22 are designed as a single unit, allowing for the support and insulation of multiple layers of insulation boards. The snap-fit ​​connection structure enables rapid assembly, simplifies the assembly process, and achieves better stable support. The number of lugs 22 can be set as needed.

[0046] Optionally, the annular retaining plate 24 includes a stress relief seam 25, an annular body 26, and a retaining tongue 27; the retaining tongue 27 passes through a third through hole 23 to achieve positioning and snap-fit ​​fixation; at the same time, the annular body 26 is provided to disperse the stress on the heat insulation plate and achieve stable support; the annular shape is more conducive to reducing the possibility of stress concentration; the stress relief seam 25 is provided to facilitate assembly, and at the same time, it can help to release the stress on the annular body 26 when affected by thermal expansion and contraction, further reducing the risk of deformation.

[0047] Optionally, the irregularly shaped heat insulation support plate 19 is partially provided with through holes 28, and the self-supporting reflective heat insulation ring 29 passes through the through holes 28 and is supported by the inner wall of the through holes 28. The self-supporting reflective heat insulation ring 29 is a structure corresponding to the ring shape of the heating body. Preferably, it is arranged corresponding to the middle ring main heating body 3, that is, the middle ring main heating body 3 is arranged in a ring shape as a whole, and the self-supporting reflective heat insulation ring 29 is also arranged in a ring shape. The top heat insulation plate 9, the middle heat insulation plate 17 and the bottom heat insulation plate 18 are usually ceramic heat insulation plates, such as SiN type heat insulation plates; the self-supporting reflective heat insulation ring 29 is made of stainless steel or other materials. The self-supporting reflective heat insulation ring 29 is a multi-layer thin stainless steel plate with interlaced convex strips; the convex strips between different layers are arranged in an interlaced manner, thereby forming a spaced multi-layer stainless steel plate structure; the figure shows the cross-section of the convex strips. It can be seen that after being arranged in a ring shape, the convex strips actually form a circumferential ring structure. Insulation panels made of ceramic or similar materials offer advantages in insulation and stability. However, because ceramic insulation panels are permeable to infrared radiation and other forms of thermal radiation, their insulation capacity is affected. Existing technologies often address this by increasing the number of insulation layers, which results in high costs, increased weight, and stringent installation precision requirements (many insulation layers need to be perfectly straight, which is challenging; unevenness affects the straightness of the insulation panels, leading to differences in insulation efficiency in different areas and consequently impacting the uniformity of the heating element). Additionally, the use of reflective coatings on insulation panels is costly, and the coatings are prone to peeling, affecting their lifespan. By employing a self-supporting reflective insulation ring 29 with a stainless steel insulation board self-supporting structure, infrared radiation can be reflected, deformation is resisted, and the setting of raised strips increases the reflective area, improving the heat insulation effect, greatly reducing the number of layers, reducing the amount of SiN and other insulation boards used, and lowering costs. The overlapping raised strips achieve self-support, forming a multi-layer soft core metal insulation layer in the middle of the insulation board, which is not afraid of deformation and increases the heat insulation effect. Moreover, the setting of raised strips greatly increases the reflection of infrared radiation and other main heat, which is conducive to the utilization of heat in the heating zone (especially the heat utilization at the corresponding central main heating element 3). The overlapping reflections in different directions help to improve temperature uniformity. The stainless steel insulation board in the middle does not affect the insulation performance, is easy to process into different shapes, has low cost, and has better auxiliary adjustment of thermal field uniformity, greatly improving the heat insulation performance.

[0048] In describing the embodiments of the present invention, the following understanding should be clarified: all terms involving direction or positional relationships, such as "center," "above," "below," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," are defined with reference to the orientation or position shown in the accompanying drawings. Such expressions are only for the purpose of clearly and concisely describing the technical solutions of the present invention, and are not intended to limit the absolute orientation or construction method of the related devices or components during actual installation and use, nor do they imply that they must operate in the specific direction shown in the figures. Therefore, they should not be construed as a substantial limitation on the present invention.

[0049] The ordinal numbers such as "first" and "second" used in the description are only used to distinguish different technical features, and do not indicate their relative importance or imply a limitation on the number of features. Therefore, any feature described using terms such as "first" and "second" may explicitly or implicitly include one or more of that feature. In this invention, unless otherwise specified, the term "multiple" means two or more.

[0050] Furthermore, in describing this invention, unless otherwise expressly specified or limited, terms such as "installation," "connection," and "linking" should be interpreted broadly. Specifically, they can refer to fixed connections or detachable connections; they can be direct connections or indirect connections achieved through an intermediate medium; they include not only mechanical connections between two elements but also the internal communication relationships between them. Those skilled in the art should be able to understand the precise meaning of the above terms in this invention in the context of specific technical situations. It should also be noted that the specific features, structures, materials, or characteristics disclosed in this specification can be combined or mutually referenced in any appropriate manner in one or more embodiments or examples.

[0051] It should be particularly noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions will not cause the substantive content of the corresponding technical solutions to deviate from the protection scope defined by the technical solutions of the embodiments of the present invention.

Claims

1. A MOCVD heating device for suppressing deformation, comprising a heating element assembly, the heating element assembly including an inner ring heating element (1), an outer ring heating element (2) and a middle ring main heating element (3), the heating element assembly being housed within an MOCVD chamber and located below a wafer carrier, and being heated by an electrode assembly (7), characterized in that: The heating element assembly is supported by a heating element plate support strip (5), and the heating element plate support strip (5) and the heating element assembly are in line contact support; The heating element plate support bar (5) is provided with a plurality of first grooves (10), and the outer ring heating element (2) and the middle ring main heating element (3) are accommodated in the first grooves (10).

2. The MOCVD heating device for suppressing deformation according to claim 1, characterized in that, The ratio of the thickness of the outer ring heating element (2) to the thickness of the middle ring main heating element (3) is 1.01:1 to 1.4:1; and / or, the width of the outer ring heating element (2) is 5% to 85% of the width of the middle ring main heating element (3).

3. The MOCVD heating device for suppressing deformation according to claim 1, characterized in that, The bottom of the first groove (10) is provided with a protrusion (16), which contacts the outer ring heating body (2) or the middle ring main heating body (3); and / or, the depth of the first groove (10) is one-tenth to one-third of the thickness of the outer ring heating body (2) or the middle ring main heating body (3); and / or, the thickness d of the heating body plate support strip (5) is 0.5mm to 10mm.

4. The MOCVD heating device for suppressing deformation according to claim 3, characterized in that, The protrusions (16) are in the shape of spaced dots or serrations.

5. The MOCVD heating device for suppressing deformation according to claim 1, characterized in that, The heating device further includes a multi-layer heat insulation component (8) disposed at the lower part of the heating body assembly. The multi-layer thermal insulation assembly (8) includes a top thermal insulation panel (9) having a first through hole (11). The heating element plate support bar (5) includes a first through portion (17) that passes through the first through hole (11) and a second through hole (13). The heating device also includes a positioning buffer (12), which includes a positioning part (14) and a buffer part (15). The positioning part (14) passes through the second through hole (13) and is in close contact with the lower surface of the top heat insulation plate (9). The buffer part (15) has an S-shaped structure.

6. The MOCVD heating device for suppressing deformation according to claim 5, characterized in that, The multi-layer heat insulation assembly (8) also includes an intermediate heat insulation board (17) and a bottom heat insulation board (18). The top heat insulation board (9), the intermediate heat insulation board (17) and the bottom heat insulation board (18) are supported from top to bottom by a special-shaped heat insulation support board (19) at intervals. The thickness of the top heat insulation board (9) is greater than the thickness of the middle heat insulation board (17), and the thickness of the middle heat insulation board (17) is greater than the thickness of the bottom heat insulation board (18); and the distance between the top heat insulation board (9) and the middle heat insulation board (17) is less than the distance between the middle heat insulation board (17) and the bottom heat insulation board (18).

7. The MOCVD heating device for suppressing deformation according to claim 6, characterized in that, The thickness ratio of the top layer insulation board (9) to the thickness of the intermediate layer insulation board (17) is 1.2:1 to 3:1, and the thickness ratio of the intermediate layer insulation board (17) to the thickness of the bottom layer insulation board (18) is 1.2:1 to 3:1; and / or, the distance between the intermediate layer insulation board (17) and the bottom layer insulation board (18) minus the distance between the top layer insulation board (9) and the intermediate layer insulation board (17) is 3 to 4 times the thickness of the bottom layer insulation board (18).

8. The MOCVD heating device for suppressing deformation according to claim 6, characterized in that, The irregular heat insulation support plate (19) includes a first through support part (20) and a second support part (21). The first through support (20) penetrates the intermediate layer heat insulation plate (17) and is fixed to the top layer heat insulation plate (9) and the bottom layer heat insulation plate (18) by the lug (22) and the annular retaining plate (24) provided thereon; The second support (21) is fixed to the intermediate heat insulation plate (17) and the bottom heat insulation plate (18) by means of the lug (22) and the annular retaining plate (24) provided thereon; The annular plate (24) includes an annular body (26), a latch (27), and a stress relief seam (25). The latch (27) is used to pass through the third through hole (23) on the lug (22) to achieve a snap-fit.

9. The MOCVD heating apparatus for suppressing deformation according to any one of claims 6 to 8, characterized in that, The irregular heat insulation support plate (19) has a through hole (28), and the self-supporting reflective heat insulation ring (29) passes through and is supported by the inner wall of the through hole (28); The self-supporting reflective heat insulation ring (29) is annular and is composed of multiple layers of thin metal plates with interlaced ridges.

10. An MOCVD apparatus, comprising the MOCVD heating device for suppressing deformation as described in any one of claims 1 to 8.

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