Concentration detection-based polishing liquid dilution mixing supply system

Abstract

The application provides a polishing liquid dilution and mixing supply system based on concentration detection, comprising: a liquid supply assembly and a mixing assembly, the liquid supply assembly is used for supplying at least two kinds of liquid to the mixing assembly respectively, and the mixing assembly is used for mixing the at least two kinds of liquid to form a polishing liquid; a first liquid supply path connected between the mixing assembly and a use end; a concentration detection assembly arranged between the mixing assembly and the first liquid supply path and used for detecting a concentration parameter of the polishing liquid in the mixing assembly; a circulation backflow path connected between the first liquid supply path and the mixing assembly; a second liquid supply path used for conveying a standard polishing liquid to the use end; and a control module configured to control the liquid supply assembly to adjust a relative supply amount between the at least two kinds of liquid and / or a flow state of the first liquid supply path, the circulation backflow path and the second liquid supply path based on the concentration parameter. The technical scheme provided by the application can improve the accuracy of polishing liquid concentration control in the polishing liquid dilution and mixing supply system.

Description

Technical Field

[0001] This invention relates to the field of semiconductor chemical mechanical polishing technology, and in particular to a slurry dilution and mixing supply system based on concentration detection. Background Technology

[0002] In semiconductor chemical mechanical polishing (CMP) processes, the concentration stability of the polishing slurry directly determines the polishing rate, surface uniformity, and defect rate of the wafer. As the feature size of integrated circuits continues to shrink, the precision requirements for semiconductor CMP processes are becoming increasingly stringent. Therefore, the polishing slurry supply system needs to achieve high precision, high stability, and continuous, uninterrupted automatic dilution and mixing.

[0003] Traditional manual or semi-automatic solution preparation methods can no longer meet mass production demands, making automated dilution and mixing supply systems a crucial component in semiconductor chemical mechanical polishing (CMP) processes. In related technologies, the mixing ratio is indirectly controlled by maintaining a constant stock solution level and stable diluent pressure. The system automatically stops operating when the stock solution level or diluent flow rate changes to ensure no substandard mixture enters the production system. However, this automated dilution and mixing supply system suffers from low precision in controlling the polishing slurry concentration, making it difficult to meet the high-end semiconductor CMP process's requirement of a concentration deviation of less than ±0.5%. Summary of the Invention

[0004] The present invention provides a grinding slurry dilution and mixing supply system based on concentration detection, which improves the accuracy of grinding slurry concentration control in the grinding slurry dilution and mixing supply system to a certain extent.

[0005] In a first aspect, the present invention provides a grinding slurry dilution and mixing supply system based on concentration detection, comprising:

[0006] A liquid supply assembly and a mixing assembly, wherein the liquid supply assembly supplies at least two liquids to the mixing assembly, and the mixing assembly mixes the at least two liquids to form a grinding slurry;

[0007] The first liquid supply path connects the mixing component to the user end;

[0008] A concentration detection component is disposed between the mixing component and the first liquid supply path, and is used to detect the concentration parameter of the grinding liquid in the mixing component;

[0009] A recirculation path is connected between the first liquid supply path and the mixing component;

[0010] The second liquid supply path is used to deliver the standard grinding slurry to the end of use;

[0011] The control module is configured to control the liquid supply assembly to adjust the relative supply amount between the at least two liquids and / or the flow status of the first liquid supply path, the circulation return path and the second liquid supply path based on the concentration parameters.

[0012] In one embodiment of the present invention, based on the concentration parameter, controlling the liquid supply assembly to adjust the relative supply amounts between the at least two liquids, and / or the flow states of the first liquid supply path, the circulation return path, and the second liquid supply path, includes:

[0013] When the concentration parameter is outside the preset parameter range, the liquid supply component is controlled to adjust the relative supply amount between the at least two liquids and keep the first liquid supply path in a flow state to supply liquid to the user end;

[0014] After adjusting the relative supply amount, if the concentration parameter is outside the preset parameter range, the first liquid supply path is blocked from supplying liquid to the user end, and the grinding liquid output by the mixing component is returned to the mixing component via the circulation return path.

[0015] If the concentration parameter is still outside the preset parameter range after the grinding slurry returns to the mixing component via the circulation return path, the second liquid supply path is controlled to supply liquid to the user end.

[0016] In one embodiment of the present invention, the control module is further configured to:

[0017] Determine the rate of change of the concentration parameter of the grinding fluid output by the mixing component relative to the preset parameter range over time;

[0018] During the adjustment of the relative supply amount, in response to the concentration parameter being outside the preset parameter range and the rate of change being greater than the first preset rate of change threshold, the first liquid supply path is blocked from supplying liquid to the user end, and the grinding liquid output by the mixing component is returned to the mixing component via the circulation return path;

[0019] During the process of the grinding slurry returning to the mixing component via the circulation return path, in response to the concentration parameter being outside the preset parameter range and the rate of change being greater than the second preset rate of change threshold, the second liquid supply path is controlled to supply liquid to the user end.

[0020] In one embodiment of the present invention, the control module includes a first timing unit and a second timing unit;

[0021] The control module is configured as follows:

[0022] When the relative supply is adjusted, the first timing unit is started, and when the timing duration of the first timing unit reaches the first preset duration and the concentration parameter is still outside the preset parameter range, the grinding fluid output by the mixing component is returned to the mixing component through the circulation return path.

[0023] When the grinding slurry begins to return to the mixing component via the circulation return path, the second timing unit is activated, and when the timing duration of the second timing unit reaches the second preset duration and the concentration parameter is still outside the preset parameter range, the second liquid supply path supplies liquid to the user end.

[0024] In one embodiment of the present invention, the control module is further configured to:

[0025] After the second liquid supply path supplies liquid to the user end, the first liquid supply path is kept in a blocked state from supplying liquid to the user end, while the second liquid supply path continues to supply liquid to the user end until a reset command is received.

[0026] In one embodiment of the present invention, the mixing component includes a mixing container and a mixing mechanism cooperating with the mixing container, the circulation return path is connected to the mixing container, and a circulation pump is provided on the circulation return path;

[0027] The control module is also configured to control the circulation pump and the mixing mechanism to continue operating during the period when the grinding fluid output by the mixing component returns to the mixing component via the circulation return path.

[0028] In one embodiment of the present invention, the second liquid supply path includes a liquid storage component for storing grinding slurry and a homogenizing component that cooperates with the liquid storage component.

[0029] The control module is also configured to control the homogenizing component to operate during the period when the second liquid supply path is not supplying liquid to the user end, so as to drive the flow of grinding slurry in the liquid storage component.

[0030] In one embodiment of the present invention, the grinding slurry dilution and mixing supply system based on concentration detection further includes: a switching valve;

[0031] The switching valve has a first state and a second state; in the first state, the mixing component is connected to the user end via the first liquid supply path, and the circulation return path is blocked; in the second state, the portion of the first liquid supply path leading to the user end is blocked, and the first liquid supply path is connected to the circulation return path.

[0032] In one embodiment of the present invention, the at least two liquids include a grinding stock solution and a diluent, the concentration parameter includes a concentration value, and the control module is configured to:

[0033] When the concentration value is higher than the upper limit of the preset parameter range, the supply amount of the grinding stock solution relative to the diluent is reduced;

[0034] When the concentration value is lower than the lower limit of the preset parameter range, the supply amount of the grinding stock solution relative to the diluent is increased.

[0035] In one embodiment of the present invention, the concentration detection component includes at least one of an online refractometer and an online densitometer.

[0036] This invention provides a grinding slurry dilution and mixing supply system based on concentration detection. By setting a concentration detection component between the mixing component and the first liquid supply path, the actual concentration parameter of the grinding slurry output by the mixing component can be obtained in real time and fed back to the control module. This allows the control module to perform closed-loop control based on the measured concentration: when the concentration parameter deviates from the target, the relative supply amount between at least two liquids is changed by adjusting the liquid supply component to correct the concentration deviation, thereby improving the accuracy of grinding slurry concentration control in the grinding slurry dilution and mixing supply system to a certain extent.

[0037] In addition, the control module is also configured to control the flow status of the first liquid supply path, the circulation return path and the second liquid supply path based on the concentration parameter. This allows the system to handle different levels of concentration anomalies in a tiered manner while maintaining the continuity of liquid supply. When the main mixing liquid supply path cannot correct the concentration anomaly in time, it can take over to deliver standard grinding fluid to the user end, ensuring the continuous operation of the production line and improving the efficiency of grinding fluid production in the grinding fluid dilution and mixing supply system to a certain extent. Attached Figure Description

[0038] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of the present invention, and those skilled in the art can obtain other embodiments based on these drawings without creative effort.

[0039] Figure 1 This is a schematic diagram of a concentration-detection-based grinding slurry dilution and mixing supply system provided in an embodiment of the present invention.

[0040] Figure 2 This is a schematic diagram of the structure of a circulating reflux mode provided in an embodiment of the present invention.

[0041] Figure 3 This is a schematic diagram of the structure of a hybrid component provided in an embodiment of the present invention.

[0042] Figure 4 This is a schematic diagram of the structure of a control module provided in an embodiment of the present invention.

[0043] Figure 5 This is a schematic diagram of the control logic flow of a control module provided in an embodiment of the present invention.

[0044] Explanation of reference numerals in the attached figures:

[0045] 100. Liquid supply assembly; 200. Mixing assembly; 210. Mixing container; 220. Mixing mechanism; 310. First liquid supply path; 320. Circulation return path; 330. Second liquid supply path; 400. Concentration detection assembly; 500. Control module; 510. First timing unit; 520. Second timing unit; 600. Circulation pump; 710. Liquid storage assembly; 720. Homogenization assembly; 800. Switching valve; 900. User end. Detailed Implementation

[0046] Embodiments of the present invention will now be described in more detail with reference to the accompanying drawings. While some embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the present invention. It should be understood that the drawings and embodiments of the present invention are for illustrative purposes only and are not intended to limit the scope of protection of the present invention.

[0047] In semiconductor chemical mechanical polishing (CMP) processes, the concentration stability of the polishing slurry directly determines the polishing rate, surface uniformity, and defect rate of the wafer. As integrated circuit feature sizes continue to shrink, the precision requirements for semiconductor CMP processes are becoming increasingly stringent. The polishing slurry supply system needs to achieve high precision, high stability, and continuous, uninterrupted automated dilution and mixing. Traditional manual or semi-automatic slurry preparation methods can no longer meet mass production demands, and automated dilution and mixing supply systems are gradually becoming key supporting equipment in semiconductor CMP processes.

[0048] In related technologies, the mixing ratio is indirectly controlled by maintaining a constant stock solution level and a stable diluent pressure. When the stock solution level or diluent flow rate changes, the system automatically stops working to ensure that no substandard mixture enters the production system. However, this solution lacks a real-time detection device for the actual concentration of the mixture, making it a typical open-loop control method. Alternatively, the mixing ratio of the stock solution and diluent can be adjusted by rotating a throttle valve, using the overlap of pre-drilled holes on the upper rotating plate and the lower fixed plate to achieve discrete ratio switching. Essentially, this is still an open-loop preset ratio method, lacking the ability to detect and adjust the actual mixing concentration in real time.

[0049] However, the aforementioned existing technical solutions have significant drawbacks in practical applications. First, the open-loop control method cannot obtain the actual concentration of the mixture in real time. When the characteristics of the raw material fluctuate or the pipeline pressure changes, the output concentration will deviate from the target value and cannot be automatically corrected. The concentration control accuracy is usually only ±2% to ±5%, which is difficult to meet the requirement of less than ±0.5% for concentration deviation in high-end semiconductor chemical mechanical polishing processes. In addition, existing systems generally lack built-in self-cleaning functions. Solid particles in the polishing slurry are prone to deposit and crystallize on the pipeline, valves, and inner walls of the mixing tank, requiring frequent manual disassembly and cleaning maintenance. Furthermore, no redundant backup paths are set up. Once an irreversible failure occurs in the main liquid supply path, the system will completely fail, and the continuity of liquid supply cannot be guaranteed.

[0050] Based on this, the present invention provides a grinding slurry dilution and mixing supply system based on concentration detection. By setting a concentration detection component between the mixing component and the first liquid supply path, the actual concentration parameter of the grinding slurry output by the mixing component can be obtained in real time, and the concentration parameter is fed back to the control module, so that the control module can perform closed-loop control based on the measured concentration: when the concentration parameter deviates from the target, the relative supply amount between at least two liquids is changed by adjusting the liquid supply component to correct the concentration deviation, thereby improving the accuracy of grinding slurry concentration control in the grinding slurry dilution and mixing supply system to a certain extent.

[0051] In addition, the control module is also configured to control the flow status of the first liquid supply path, the circulation return path and the second liquid supply path based on the concentration parameter. This allows the system to handle different levels of concentration anomalies in a tiered manner while maintaining the continuity of liquid supply. When the main mixing liquid supply path cannot correct the concentration anomaly in time, it can take over to deliver standard grinding fluid to the user end, ensuring the continuous operation of the production line and improving the efficiency of grinding fluid production in the grinding fluid dilution and mixing supply system to a certain extent.

[0052] Please see Figures 1 to 5This invention provides an embodiment of a slurry dilution and mixing supply system based on concentration detection. This system is primarily used in semiconductor chemical mechanical polishing processes to continuously supply polishing machines with precisely controllable concentration slurry, and is widely applied in the integrated circuit manufacturing field. The slurry dilution and mixing supply system based on concentration detection includes a supply component 100, a mixing component 200, a first supply path 310, a concentration detection component 400, a circulation reflux path 320, a second supply path 330, and a control module 500.

[0053] Specifically, the liquid supply assembly 100 supplies at least two liquids to the mixing assembly 200. The mixing assembly 200 mixes the at least two liquids to form a polishing slurry. A first liquid supply path 310 is connected between the mixing assembly 200 and the user end 900, for delivering the polishing slurry output from the mixing assembly 200 to the user end 900. A concentration detection assembly 400 is disposed between the mixing assembly 200 and the first liquid supply path 310, for detecting the concentration parameter of the polishing slurry in the mixing assembly 200. A circulation return path 320 is connected between the first liquid supply path 310 and the mixing assembly 200, for guiding the polishing slurry in the first liquid supply path 310 back to the mixing assembly 200. A second liquid supply path 330 is used to deliver a standard polishing slurry to the user end 900.

[0054] The control module 500 is configured to control the liquid supply assembly 100 to adjust the relative supply amount between at least two liquids and / or the flow status of the first liquid supply path 310, the circulation return path 320 and the second liquid supply path 330 based on concentration parameters.

[0055] This concentration-detection-based polishing slurry dilution and mixing supply system, by incorporating a concentration detection component 400 between the mixing component 200 and the first supply path 310, can acquire the actual concentration parameters of the polishing slurry output by the mixing component 200 in real time and feed these parameters back to the control module 500. This allows the control module 500 to perform closed-loop control based on the measured concentration: when the concentration parameter deviates from the target, the relative supply amounts of at least two liquids are adjusted by regulating the supply component 100 to correct the concentration deviation. Compared to traditional open-loop control methods, this closed-loop feedback adjustment mechanism can stably control the polishing slurry concentration within a narrow range required by the process, meeting the stringent requirements for concentration deviation in high-end semiconductor chemical mechanical polishing processes.

[0056] Furthermore, the control module 500 is configured to control the flow status of the first liquid supply path 310, the circulation return path 320, and the second liquid supply path 330 based on concentration parameters. This allows the system to handle different levels of concentration anomalies in a tiered manner while maintaining continuous liquid supply. Specifically, the circulation return path 320 allows the system to cut off the liquid supply to the user end 900 when necessary, guiding the abnormally concentrated grinding slurry back to the mixing component 200 for homogenization and reprocessing via the circulation return path 320, rather than directly discharging or shutting down the system. The second liquid supply path 330 provides another independent liquid supply channel, which can take over supplying standard grinding slurry to the user end 900 when the main mixing liquid supply path cannot correct the concentration anomaly in time, ensuring the continuous operation of the production line.

[0057] In addition, the flow regulation of the liquid supply component 100, the online feedback of the concentration detection component 400, and the state switching of the first liquid supply path 310, the circulation return path 320 and the second liquid supply path 330 in the system are all coordinated by the control module 500, realizing the automated closed-loop management of concentration monitoring, deviation adjustment and emergency switching, reducing the need for manual intervention and improving the operating efficiency and liquid supply reliability of the semiconductor chemical mechanical polishing production line.

[0058] Specifically, the liquid supply assembly 100 may include multiple liquid storage containers for storing and transporting different types of liquids, and a corresponding delivery pump; the mixing assembly 200 may include a mixing container 210 and a stirring mechanism cooperating with the mixing container 210; and the concentration detection assembly 400 may include at least one of an online refractometer and an online densitometer. The control module 500 may include a programmable logic controller or an embedded industrial computer. A circulation pump 600 may be provided on the circulation return path 320 to drive the grinding slurry to circulate between the mixing assembly 200 and the first liquid supply path 310. The second liquid supply path 330 may include a liquid storage assembly 710 independent of the mixing assembly 200 for pre-storing grinding slurry of a standard concentration.

[0059] In one embodiment, based on the concentration parameter, the liquid supply assembly 100 is controlled to adjust the relative supply amount between the at least two liquids, and / or the flow state of the first liquid supply path 310, the circulation return path 320 and the second liquid supply path 330, including a graded progressive control logic.

[0060] Specifically, when the concentration parameter is outside the preset parameter range, the control module 500 controls the liquid supply assembly 100 to adjust the relative supply volume between at least two liquids and maintain the first liquid supply path 310 in a state of supplying liquid to the user end 900. During this stage, when the system detects a concentration deviation, it first attempts to correct the concentration deviation by adjusting the flow rate, rather than directly cutting off the liquid supply or shutting down the system.

[0061] During the adjustment of the relative supply volume, the first liquid supply path 310 remains unobstructed, and the mixing component 200 continuously delivers grinding slurry to the user end 900, maintaining uninterrupted operation of the production line. Compared to the existing technology's approach of directly shutting down the machine when an anomaly is detected, this control strategy prioritizes ensuring the continuity of liquid supply in the initial stage of concentration deviation, while actively converging the concentration towards the preset parameter range by dynamically adjusting the supply ratio, thus balancing process accuracy and production efficiency.

[0062] If the concentration parameter is still outside the preset range after adjusting the relative supply, it indicates that simple flow rate adjustment is insufficient to correct the concentration deviation. The fault may involve deeper factors such as the feed pump condition, pipeline pressure, valve sealing, or mixing uniformity. At this time, the control module 500 blocks the supply of liquid from the first liquid supply path 310 to the user end 900 and causes the grinding liquid output by the mixing component 200 to return to the mixing component 200 through the circulation return path 320.

[0063] At this level, the system cuts off the path for delivering substandard polishing slurry to the user end 900, preventing abnormally concentrated slurry from entering downstream processes and affecting wafer processing quality. Simultaneously, the polishing slurry does not stop flowing; instead, it forms a closed-loop circulation circuit between the mixing component 200 and the recirculation path 320, continuously performing homogenization and concentration self-calibration. This design avoids production line shutdowns caused by abnormal downtime and effectively prevents the deposition and crystallization of solid particles in the polishing slurry within pipelines and valves through circulating flow, extending pipeline maintenance cycles and reducing the frequency of manual cleaning.

[0064] If the concentration parameter is still outside the preset parameter range after the grinding slurry returns to the mixing component 200 via the circulation return path 320, it is determined that there is an uncorrectable hardware fault or mixing ratio failure in the main mixing supply path. At this time, the control module 500 controls the second supply path 330 to supply slurry to the user end 900. The second supply path 330, as a backup supply channel physically independent of the main mixing supply path, pre-stores standard grinding slurry with a concentration within the preset parameter range, and can seamlessly take over the supply when the main path fails, ensuring the continuous operation of the production line.

[0065] Simultaneously, the system can trigger anomaly alarms, uploading abnormal concentration data, control action records at all levels, and fault information to the host computer or cloud management platform, notifying maintenance personnel to intervene and troubleshoot the fault. Through the above three-level progressive control logic, the system adopts three levels of measures at different stages of concentration anomalies: adjustment and correction, cyclic homogenization self-calibration, and backup path replacement. Each level triggers and escalates sequentially, maximizing the autonomous elimination of deviations in the early stages and providing final liquid supply assurance when deviations cannot be autonomously corrected, thus achieving a balance between continuous liquid supply and concentration control accuracy.

[0066] Specifically, the preset parameter range can be set according to the requirements of the polishing slurry concentration in the semiconductor chemical mechanical polishing process. For example, the preset parameter range can be centered on the target concentration value and set above and below deviation thresholds. The specified acceptable range is defined as the boundary. When the concentration parameter exceeds this range, it is determined that the concentration is outside the preset parameter range. The adjustment of the relative supply can adopt a proportional-integral-derivative (PID) adaptive algorithm. The control module 500 dynamically corrects the output frequency or opening of the raw material feed pump and the diluent feed pump in the liquid supply component 100 according to the current concentration deviation value and the rate of change of the deviation. The flow rate of the two media is adjusted linearly according to the magnitude of the deviation. The larger the deviation, the greater the flow rate adjustment amplitude, thus avoiding concentration oscillation caused by a single large adjustment.

[0067] In one embodiment, the control module 500 is further configured to determine the rate of change over time of deviation of the concentration parameter of the grinding fluid output by the mixing component 200 from a preset parameter range.

[0068] During the adjustment of the relative supply, if the concentration parameter is outside the preset parameter range and the rate of change is greater than the first preset rate of change threshold, it indicates that the concentration deviation is rapidly increasing, and simple flow regulation can no longer effectively curb the deteriorating trend. At this time, if we continue to wait for the complete cycle of flow regulation or the end of the preset timer, the unqualified polishing slurry will continue to enter the downstream process, increasing the risk of wafer processing defects. Therefore, in response to this state, the control module 500 blocks the supply of slurry from the first supply path 310 to the user end 900 in advance, and causes the polishing slurry output from the mixing component 200 to return to the mixing component 200 through the circulation return path 320.

[0069] This skip-level triggering mechanism breaks the fixed sequence of waiting step by step. It actively cuts off the supply of unqualified polishing fluid to the user end 900 in the early stage of accelerated concentration degradation, and confines it in the closed loop for homogenization and reprocessing. This shortens the duration of fault impact and reduces the probability of unqualified polishing fluid entering the semiconductor chemical mechanical polishing process.

[0070] If, during the process of the grinding slurry returning to the mixing component 200 via the circulation reflux path 320, the concentration parameter remains outside the preset parameter range and the rate of change exceeds the second preset rate of change threshold, it indicates that the circulation reflux homogenization self-calibration cannot prevent the continuous deterioration of the concentration, and there may be a serious hardware failure or media failure in the main mixing supply path. In this case, the control module 500 responds to this state and controls the second supply path 330 to supply slurry to the user end 900 in advance.

[0071] This bypass triggering allows the system to directly activate the physically independent backup liquid supply channel without waiting for the preset cycle of the reflux phase to end, thereby restoring the supply of standard grinding slurry in the shortest possible time and maximizing the continuous operation of the production line.

[0072] The aforementioned cascading triggering mechanism based on the rate of change of concentration deviation endows the system with the ability to perceive and predict concentration deterioration trends in real time. Compared to static grading strategies that rely solely on fixed durations or fixed thresholds for triggering, this dynamic assessment method can proactively respond in the early stages of accelerated concentration deviation expansion, avoiding the generation of batches of non-conforming products due to waiting timeouts, and further enhancing the protection against sudden concentration anomalies.

[0073] Specifically, the rate of change can be expressed as the amount of deviation of the concentration parameter from the boundary of the preset parameter range per unit time. The control module 500 can continuously acquire the concentration parameter according to a preset sampling period, calculate the difference in deviation between adjacent sampling periods, and divide it by the sampling period duration to obtain the rate of change. The first preset rate of change threshold and the second preset rate of change threshold can be set according to the requirements of the semiconductor chemical mechanical polishing process for the stability of the polishing slurry concentration; their values ​​can be the same or different.

[0074] In practical applications, the second preset rate of change threshold is usually set to be greater than the first preset rate of change threshold to reflect the greater urgency when the concentration is still deteriorating rapidly during the reflux phase.

[0075] Please see Figure 4 In one embodiment, the control module 500 includes a first timing unit 510 and a second timing unit 520 to achieve precise timing and timed triggering of the execution duration of control actions at all levels.

[0076] Specifically, when adjusting the relative supply, the control module 500 starts the first timing unit 510. If the concentration parameter is still outside the preset parameter range when the timing duration of the first timing unit 510 reaches the first preset duration, it indicates that the concentration deviation has not been effectively corrected after the flow rate adjustment within the first preset duration, and adjusting the supply ratio alone is insufficient to bring the concentration back to the qualified range. At this time, the control module 500 causes the grinding fluid output from the mixing component 200 to return to the mixing component 200 via the circulation return path 320.

[0077] By setting a first preset time boundary for the flow regulation stage, the system can avoid waiting indefinitely for concentration recovery at a certain level, ensuring that the effectiveness of flow regulation is judged within a reasonable time window. If the target is not met after the timeout, the system will promptly escalate to the next level, providing sufficient time for flow regulation correction and preventing the production line from being in a state of concentration uncertainty for an extended period due to prolonged regulation.

[0078] When the grinding slurry begins to return to the mixing assembly 200 via the circulation return path 320, the control module 500 activates the second timing unit 520. If the concentration parameter is still outside the preset parameter range when the timing duration of the second timing unit 520 reaches the second preset duration, it indicates that the concentration deviation has not been effectively corrected after the circulation return homogenization self-calibration within the second preset duration. At this time, the control module 500 supplies slurry to the user end 900 via the second slurry supply path 330.

[0079] By setting a second preset time boundary for the reflux phase, the system can switch to an independent backup liquid supply channel in a timely manner when the concentration cannot be restored by the reflux homogenization, thus avoiding delays in restoring normal liquid supply to the production line due to continuous reflux waiting.

[0080] The aforementioned timed triggering mechanism based on timing units sets clear upper limits for the execution time of each control action, giving the hierarchical progressive control logic a definite judgment standard in the time dimension. Each level escalates sequentially according to preset durations, ensuring sufficient time for each level to function while preventing infinite waiting during fault handling. This ensures the system can autonomously complete fault classification and handling or promptly switch to the backup fluid supply path within a controllable timeframe.

[0081] Specifically, the first and second preset durations can be set according to the requirements of the semiconductor chemical mechanical polishing process on the stability of the liquid supply and the response characteristics of flow regulation and reflux. For example, the first preset duration can be set to 60 seconds to provide sufficient correction time for the flow regulation stage; the second preset duration can be set to 120 seconds to provide a longer cycle processing time for reflux homogenization self-calibration. The first timing unit 510 and the second timing unit 520 can be implemented by timers or counters inside the control module 500, and their timing start times are synchronized with the start times of the flow regulation action and the reflux action, respectively.

[0082] In one embodiment, the control module 500 is further configured to, after supplying liquid to the user end 900 via the second liquid supply path 330, keep the liquid supply from the first liquid supply path 310 to the user end 900 blocked, and keep the second liquid supply path 330 supplying liquid to the user end 900 until a reset command is received.

[0083] When the system has triggered the third level and activated the second liquid supply path 330 to take over the liquid supply, it indicates that there is a fault in the main mixing liquid supply path that cannot be corrected through autonomous adjustment or cyclic homogenization. In this state, if the system automatically switches back to the first liquid supply path 310 without confirming that the fault has been eliminated, the abnormally concentrated polishing slurry will re-enter the downstream process, causing repeated fluctuations in wafer processing quality and even triggering a chain reaction of frequent production line start-ups and shutdowns. Therefore, after entering the liquid supply state of the second liquid supply path 330, the control module 500 performs latching and holding on this state, that is, it continuously blocks the first liquid supply path 310 and keeps the liquid supply channel of the second liquid supply path 330 unobstructed until a clear reset command is received.

[0084] This state latching mechanism ensures that, before manual intervention to troubleshoot and repair the fault, the system always uses the second liquid supply path 330 as a stable and reliable liquid supply source, ensuring the production line continuously receives standard grinding slurry with the correct concentration. Simultaneously, the first liquid supply path 310 is reliably blocked, preventing accidental restoration of the faulty path from interfering with the liquid supply quality. The introduction of a reset command changes the system state switching from automatic triggering to controlled recovery. After confirming that the fault in the main mixing liquid supply path has been eliminated and the concentration adjustment function has returned to normal, the operator can actively send a reset command to exit the second liquid supply path 330 supply state and reactivate the first liquid supply path 310.

[0085] This mechanism provides a safe time window for troubleshooting and system repair, preventing repeated anomalies caused by the system automatically switching back before the fault is resolved, thus ensuring the operational safety of the liquid supply system and the stability of the production process.

[0086] Specifically, the reset command can be triggered by the operator through interaction with the human-machine interface, or it can be remotely issued by the host computer or cloud management platform after the fault work order is closed. After the reset command is triggered, the control module 500 can first perform a status self-check on the main mixing liquid supply path. After confirming that the concentration detection component 400, the liquid supply component 100, and the mixing component 200 are functioning normally, it will then perform a path switch to restore the first liquid supply path 310 to supply liquid to the user end 900. During the continuous liquid supply of the second liquid supply path 330, the control module 500 can simultaneously upload abnormal concentration data, emergency action records at all levels, and current liquid supply status information to the host computer or cloud management platform, which facilitates maintenance personnel to remotely monitor the system status and trace the source of faults.

[0087] Please see Figure 3In one embodiment, the mixing assembly 200 includes a mixing container 210 and a mixing mechanism 220 cooperating with the mixing container 210. The mixing container 210 is used to contain at least two liquids supplied by the liquid supply assembly 100 and to provide space for liquid mixing; the mixing mechanism 220 is used to apply a stirring action to the liquids in the mixing container 210 to promote the uniform mixing of at least two liquids to form a grinding slurry. A circulation return path 320 is connected to the mixing container 210, and a circulation pump 600 is provided on the circulation return path 320. The circulation pump 600 is used to provide driving force for the circulation flow of the grinding slurry between the circulation return path 320 and the mixing container 210.

[0088] Please see Figure 2 The control module 500 is also configured to control the circulation pump 600 and the mixing mechanism 220 to continue operating during the period when the grinding fluid output from the mixing component 200 returns to the mixing component 200 via the circulation return path 320.

[0089] During the reflux phase of the polishing slurry returning to the mixing assembly 200 via the reflux path 320, the slurry in the pipeline is in a closed-loop circulation state because the supply of slurry from the first supply path 310 to the user end 900 has been blocked. At this time, if the operation of the circulation pump 600 and the mixing mechanism 220 is stopped, the polishing slurry will tend to stand still, and the solid particles in it will gradually settle under the action of gravity, accumulating in the pipeline bends, valve cavities, and the bottom of the mixing container 210, forming hard crystals. This will not only cause pipeline blockage and valve jamming, but also, when the supply of slurry is subsequently restored, the crystals will fall off and enter the semiconductor chemical mechanical polishing process with the polishing slurry, causing serious quality defects such as scratches on the wafer surface.

[0090] Therefore, during the circulation reflux, the control module 500 forces the circulation pump 600 and the mixing mechanism 220 to keep running continuously, so that the grinding fluid is always in a flowing and stirring state, effectively preventing the sedimentation and crystallization of solid particles and maintaining the suspension uniformity of the grinding fluid.

[0091] Simultaneously, the circulating pump 600 drives the grinding slurry to continuously circulate between the mixing container 210 and the circulation return path 320. Combined with the continuous stirring of the mixing mechanism 220, this continuously returns the grinding slurry with concentration differences in different areas of the pipeline to the mixing container 210 for remixing and homogenization. This process accelerates the dilution and homogenization of residual abnormal concentrations of grinding slurry in the pipeline, creating favorable hydrodynamic conditions for the concentration parameters to return to the preset range and shortening the time required for circulation return self-calibration.

[0092] Furthermore, the continuous operation of the circulation pump 600 and the mixing mechanism 220 during the circulation and reflux eliminates the maintenance process of manually disassembling and cleaning the pipeline and mixing container 210 to remove deposits, which is required in the traditional method. This extends the pipeline cleaning cycle from several days to several weeks, significantly reducing the frequency of equipment maintenance and downtime, and improving the overall operating efficiency of the semiconductor chemical mechanical polishing production line.

[0093] Specifically, the mixing mechanism 220 can be a mechanical stirrer, including a drive motor, a stirring shaft, and blades disposed at the end of the stirring shaft, which agitate the liquid in the mixing container 210 by rotating the blades; the mixing mechanism 220 can also be a jet stirrer, which uses a pump to spray the liquid in the mixing container 210 out of the bottom nozzle at high speed, forming convection to achieve stirring. The circulation pump 600 can be a magnetic pump or a diaphragm pump, which is electrically connected to the control module 500. The control module 500 controls the circulation flow rate by adjusting the rotation speed of the circulation pump 600.

[0094] Please see Figure 2 In one embodiment, the second liquid supply path 330 includes a liquid storage component 710 for storing grinding slurry and a homogenizing component 720 cooperating with the liquid storage component 710. The liquid storage component 710 is used to pre-store standard grinding slurry with a concentration within a preset parameter range as an independent liquid supply reserve outside the main mixing liquid supply path; the homogenizing component 720 is used to apply a driving force to the grinding slurry in the liquid storage component 710 to keep it in a flowing state.

[0095] The control module 500 is also configured to control the homogenizing component 720 to drive the flow of grinding fluid within the storage component 710 during the period when the second liquid supply path 330 is not supplying liquid to the user end 900.

[0096] During normal system operation, the second liquid supply path 330 is in standby mode, and the standard polishing slurry in the liquid storage component 710 is left to stand for a long time. Since the polishing slurry is usually a suspension system containing solid particles such as silica and cerium dioxide, under long-term standing conditions, the solid particles will gradually settle under the action of gravity, forming a high-concentration deposition layer at the bottom of the liquid storage component 710, while the concentration of the upper liquid layer will decrease accordingly, resulting in a significant stratification phenomenon of the polishing slurry in the liquid storage component 710.

[0097] If the main mixing liquid supply path experiences an irreversible failure and the second liquid supply path 330 needs to be activated urgently to take over the liquid supply, and if the polishing slurry in the liquid storage component 710 has already stratified or settled, the concentration of the polishing slurry delivered to the user end 900 will deviate significantly from the standard concentration, failing to meet the concentration accuracy requirements of the semiconductor chemical mechanical polishing process, thus deviating from the original intention of setting up the second liquid supply path 330 to ensure the quality of the liquid supply.

[0098] Therefore, during the standby period when the second liquid supply path 330 is not supplying liquid, the control module 500 continuously or periodically controls the homogenizing component 720 to operate, driving the grinding fluid in the storage component 710 to maintain a flowing state, effectively preventing the sedimentation of solid particles and concentration stratification. This active maintenance mechanism ensures that the grinding fluid in the storage component 710 always maintains a uniform suspension state and stable concentration parameters, so that when it is necessary to switch to the second liquid supply path 330, the storage component 710 can immediately provide standard grinding fluid with a qualified concentration, truly achieving seamless feed replacement and ensuring the continuous and stable operation of the production line.

[0099] Meanwhile, this mechanism eliminates the need for manual re-stirring or replacement of the grinding fluid in the storage component 710 before each activation of the second liquid supply path 330, thus improving the system's automation level and emergency response speed.

[0100] Specifically, the liquid storage component 710 can be a sealed stainless steel tank, the volume of which can be determined according to the consumption rate of the user end 900 and the expected failure repair time, typically ranging from 50 liters to 200 liters, sufficient to maintain the continuous liquid supply needs of the user end 900 for several hours. The homogenizing component 720 can be a low-speed stirrer installed inside the liquid storage component 710, driven by a motor to rotate the stirring blades and continuously agitate the grinding liquid to prevent particle sedimentation; the homogenizing component 720 can also be a circulation loop installed outside the liquid storage component 710, where the grinding liquid at the bottom of the liquid storage component 710 is drawn out by the circulation pump 600 and injected from the top, achieving homogenization through liquid convection circulation. The control module 500 can drive the homogenizing component 720 to operate through timed control or continuous control. In this embodiment, the specific operating mode of the homogenizing component 720 is not limited.

[0101] Please see Figure 2 In one embodiment, the system further includes a switching valve 800. The switching valve 800 is disposed at the connection between the first liquid supply path 310 and the circulation return path 320, and is used to switch between the liquid supply state and the circulation return state of the first liquid supply path 310.

[0102] Specifically, the switching valve 800 has a first state and a second state. In the first state, the mixing component 200 is connected to the user end 900 via the first liquid supply path 310, and the circulation return path 320 is blocked. At this time, the grinding fluid output by the mixing component 200 is directly delivered to the user end 900 via the first liquid supply path 310 after passing through the concentration detection component 400, and the system is in normal liquid supply mode. In the second state, the portion of the first liquid supply path 310 leading to the user end 900 is blocked, and the first liquid supply path 310 is connected to the circulation return path 320. At this time, the grinding fluid output by the mixing component 200 no longer flows to the user end 900, but instead enters the circulation return path 320 via the front section of the first liquid supply path 310, and then returns to the mixing component 200 along the circulation return path 320, forming a closed-loop circulation circuit, and the system is in circulation return mode.

[0103] Switching between the two states is achieved through a single switching valve 800, allowing the flow path transition between the first supply path 310 and the circulation return path 320 to be completed by controlling only one valve, simplifying the pipeline structure and control logic. Compared to a scheme that involves setting independent on / off valves on the first supply path 310 and the circulation return path 320 and coordinating their timing, this design reduces the number of valves, lowers the programming complexity of the control module 500 and the space occupied by the pipeline layout, while avoiding timing coordination errors that may occur when multiple valves operate in tandem, thus improving the reliability and response speed of the flow path switching.

[0104] When the system executes the hierarchical progressive control logic, the state switching of the switching valve 800 is precisely coordinated with the instructions of the control module 500: when the concentration parameter is outside the preset parameter range and it is necessary to maintain the liquid supply for flow regulation, the switching valve 800 maintains the first state to ensure continuous material supply to the production line; when it is necessary to block the liquid supply and start the circulation backflow for homogenization self-calibration, the control module 500 drives the switching valve 800 to switch from the first state to the second state, cuts off the liquid supply to the user end 900 and connects the circulation backflow path 320. The action is smooth and the switching is rapid, ensuring the timeliness and accuracy of the flow path conversion in the entire emergency response process.

[0105] Specifically, the switching valve 800 can be an electrically operated three-way ball valve, whose valve core has three ports, respectively connected to the liquid supply line on the mixing component 200 side, the downstream section of the first liquid supply path 310 leading to the user end 900, and the inlet of the circulation return path 320. In the first state, the valve core rotates to a position where the mixing component 200 side pipeline is connected to the user end 900 pipeline, and the circulation return port is closed by the valve core wall; in the second state, the valve core rotates to a position where the mixing component 200 side pipeline is connected to the circulation return path 320, and the user end 900 port is closed by the valve core wall. The switching valve 800 is electrically connected to the control module 500, and the control module 500 drives the actuator inside the switching valve 800 to switch between the first and second states by outputting control signals.

[0106] In one embodiment, the liquid supply assembly 100 supplies at least two liquids, including a grinding slurry and a diluent. The grinding slurry is a high-concentration grinding slurry containing abrasive particles, and the diluent is used to dilute the grinding slurry to reduce its concentration; the diluent is typically deionized water. The concentration detection assembly 400 detects a concentration parameter including a concentration value, which characterizes the relative content of abrasive particles or active ingredients in the grinding slurry output by the mixing assembly 200.

[0107] The control module 500 is configured to reduce the supply of grinding stock solution relative to diluent when the concentration value is higher than the upper limit of the preset parameter range, and to increase the supply of grinding stock solution relative to diluent when the concentration value is lower than the lower limit of the preset parameter range.

[0108] When the concentration value exceeds the upper limit of the preset parameter range, it indicates that the concentration of the polishing slurry output by the mixing component 200 is too high, meaning that the proportion of the polishing slurry in the mixture is too large. At this time, if the slurry continues to be supplied to the user end 900 at the current ratio, the excessively high abrasive concentration will cause the polishing rate of the wafer in the semiconductor chemical mechanical polishing process to increase abnormally, the surface uniformity to decrease, and even irreversible scratch defects to occur.

[0109] Therefore, in response to the high concentration state, the control module 500 reduces the supply of grinding concentrate relative to diluent. Specifically, this can be achieved by reducing the output frequency or opening of the grinding concentrate feed pump and / or increasing the output frequency or opening of the diluent feed pump, thereby reducing the proportion of grinding concentrate entering the mixing component 200 and increasing the proportion of diluent, thus gradually reducing the concentration of the output grinding concentrate to within the preset parameter range.

[0110] Conversely, when the concentration value is lower than the lower limit of the preset parameter range, it indicates that the polishing slurry concentration output by the mixing component 200 is too low, meaning that the proportion of diluent in the mixture is too high. In this case, the excessively low abrasive concentration will result in insufficient wafer polishing rate, making it impossible to achieve the expected material removal amount within the time specified by the process, thus affecting production capacity and process efficiency.

[0111] Therefore, in response to the low concentration state, the control module 500 increases the supply of grinding concentrate relative to diluent. Specifically, this can be achieved by increasing the output frequency or opening of the grinding concentrate feed pump and / or decreasing the output frequency or opening of the diluent feed pump, thereby increasing the proportion of grinding concentrate entering the mixing component 200 and decreasing the proportion of diluent, thus gradually increasing the concentration of the output grinding concentrate to within the preset parameter range.

[0112] The strategy described above, which determines the adjustment direction based on the concentration deviation, establishes a clear positive and negative adjustment relationship between the concentration parameter and the supply ratio, making the flow rate adjustment action directional and predictable. Based on this, the control module 500 continuously executes a closed-loop control cycle of concentration detection, deviation calculation, direction judgment, and flow rate adjustment, ensuring that the grinding fluid concentration always converges within the preset parameter range.

[0113] Specifically, the supply of grinding concentrate relative to diluent can be adjusted using a proportional-integral-derivative (PID) adaptive algorithm. The control module 500 dynamically calculates the adjustment amounts of the grinding concentrate feed pump and the diluent feed pump based on the magnitude and rate of change of the deviation between the current concentration value and the preset parameter range, precisely offsetting the concentration deviation. During adjustment, the flow rates of the two media are adjusted linearly according to the magnitude of the deviation; the larger the deviation, the greater the flow rate adjustment; the closer the deviation is to zero, the smaller the adjustment gradually becomes, avoiding concentration oscillations caused by a single large adjustment.

[0114] The supply quantity can be adjusted by adjusting the speed of the feed pump, adjusting the opening of the proportional control valve on the feed pipeline, or adjusting both the pump speed and the valve opening simultaneously. In this embodiment, no specific adjustment method is limited.

[0115] In one embodiment, the concentration detection component 400 includes at least one of an online refractometer and an online densitometer.

[0116] Online refractometers operate on the principle of light refraction. When light travels from one medium to another, its refraction angle changes with the concentration of the medium. In a grinding slurry dilution and mixing supply system, the online refractometer's detection probe is in direct contact with the flowing grinding slurry. By measuring the change in the refraction angle of light in the grinding slurry, the real-time concentration parameters of the grinding slurry are continuously obtained.

[0117] Online densitometers work on the principle that the resonant frequency of a vibrating element in a medium changes with the density of the medium. When the grinding fluid flows through the measuring chamber of the online densitometer, the resonant frequency of the vibrating tube or tuning fork shifts with the change in the density of the grinding fluid. By calibrating the correspondence between density and concentration, the concentration parameter of the grinding fluid can be indirectly obtained.

[0118] Both of the aforementioned concentration detection devices possess online real-time detection capabilities, enabling continuous acquisition of concentration parameters at a high sampling frequency while the polishing slurry is in continuous flow. This eliminates the need for interrupted slurry supply or offline sampling, thus meeting the real-time feedback signal requirements of closed-loop control. In semiconductor chemical mechanical polishing processes, the correction of polishing slurry concentration deviations has a high timeliness requirement. The real-time feedback signal provided by the concentration detection component 400 allows the control module 500 to respond at an early stage of concentration deviation, preventing the deviation from accumulating and expanding.

[0119] Meanwhile, online refractometers and online densitometers are well adapted to grinding slurry suspension systems containing solid particles, and their detection accuracy is not easily affected by suspended particles in the liquid, maintaining stable measurement accuracy in heterogeneous media such as grinding slurries.

[0120] Specifically, the online refractometer can be an industrial online refractometer based on the critical angle refraction principle, with a sampling frequency set to 10 times per second. The detection results are transmitted to the control module 500 via a 4-20mA current signal or digital communication. The online density meter can be a Coriolis mass flow meter or a tuning fork density meter, which calculates the density of the grinding fluid by detecting changes in vibration frequency and converts it into a concentration value.

[0121] The concentration detection component 400 is installed between the mixing component 200 and the first liquid supply path 310, so that the concentration parameter it detects can accurately reflect the actual concentration of the grinding fluid output by the mixing component 200, avoiding detection deviations caused by delays or uneven mixing during pipeline delivery. In this embodiment, no restrictions are placed on the specific model and installation method of the online refractometer and online densitometer.

[0122] Please see Figure 5 This application provides a scenario example of an application of a grinding slurry dilution and mixing supply system based on concentration detection.

[0123] The stock solution supply module and the diluent supply module deliver the stock solution and diluent to the mixing component 200 according to a preset flow ratio. After stirring and mixing, a preliminary mixed grinding slurry is generated. In actual operation, the operator inputs the target concentration value (e.g., stock solution: diluent = 1:100) through the human-machine interface. The control module 500 automatically calculates the corresponding standard flow ratio (e.g., stock solution 0.05 L / min, diluent 4.95 L / min) based on the target concentration and drives the stock solution pump and diluent pump to operate at this initial ratio. The stirring device inside the mixing component 200 operates at a constant speed (e.g., 200 rpm) to ensure that the stock solution and diluent reach macroscopic uniformity within a few seconds.

[0124] The concentration detection component 400, located on the downstream supply pipeline of the mixing component 200, detects the actual concentration of the initially mixed grinding fluid, generates a concentration feedback signal, and transmits it to the control module 500. The concentration detection component 400 uses an online refractometer with a sampling frequency of 10 times per second. After each detection, it sends the actual concentration value to the control module 500 via a 4-20mA current signal or digital communication.

[0125] Step S3: The control module 500 receives the concentration feedback signal and compares it with a preset target concentration value to obtain a deviation value and an absolute deviation value. Based on the absolute deviation value, it performs progressive processing and outputs a standard mixed grinding slurry. Specifically, the deviation value... ;in, This represents the actual concentration value. The preset target concentration value. Absolute deviation value. The control module 500 has two preset thresholds: and ,in The target concentration is 0.5% of the preset concentration value. This is 2.0% of the preset target concentration value. For example, if the target concentration is 1.0% (mass fraction), then... =0.005%, =0.02%. Control module 500 performs different processing based on the range in which the absolute deviation value falls:

[0126] When the absolute deviation value is greater than and not greater than Time (i.e.) The system adjusts the input flow rates of the stock solution and the diluent. This adjustment method employs a PID control algorithm. The control module 500 calculates the adjustment amount in real time based on the signed deviation value, dynamically correcting the speed of the stock solution pump and / or the diluent pump to bring the deviation value to a level not exceeding [value missing]. Within a certain range. For example, when the actual concentration is higher than the target concentration by a positive deviation, the PID controller decreases the frequency of the concentrate pump or increases the frequency of the diluent pump; conversely, it increases the frequency of the concentrate pump or decreases the frequency of the diluent pump. The PID parameter can be tuned to a proportional coefficient. =1.2, integration time =0.5s, differential time =0.1s, to ensure response speed and stability.

[0127] When the absolute deviation value is greater than Time (i.e.) (>0.02%), triggering an emergency response. The emergency response further includes a three-tiered progressive process:

[0128] When the absolute deviation value meets the condition of 0.5% ≤ absolute deviation value < 2.0%, that is, between the first threshold and the second threshold, the system determines it as a slight concentration deviation. There is no need to trigger the emergency mechanism. The control module 500 starts the PID algorithm, dynamically calculates the flow adjustment parameters of the stock solution and diluent based on the real-time deviation magnitude and deviation change rate, fine-tunes the opening of the electric proportional regulating valve, accurately corrects the delivery flow of the stock solution and diluent, and gradually offsets the concentration deviation, so that the grinding solution concentration slowly returns to the target qualified range. The supply of liquid is not interrupted throughout the fine-tuning process, ensuring the continuity of production.

[0129] Meanwhile, the system monitors the rate of change of concentration deviation in real time. If a rapid increase in concentration deviation or accelerated deterioration of concentration is detected, it will immediately make an advance prediction and increase the adjustment range in advance to avoid the deviation from continuing to expand and shorten the concentration correction cycle.

[0130] When the absolute deviation value is ≥2.0%, that is, the concentration deviation exceeds the second threshold, the system judges it as a serious concentration anomaly, immediately terminates the routine fine-tuning, initiates a three-stage progressive emergency response, and handles the fault in a graded manner, taking into account both production continuity and liquid supply accuracy.

[0131] Level 1 Emergency Response: The system immediately matches the corresponding safe flow rate ratio based on the type of concentration anomaly (too high / too low), switches the temporary supply liquid ratio, and starts timer T1 (60s). During this stage, the main supply pipeline is kept unobstructed, continuously delivering the emergency mixed grinding slurry with the safe ratio to the production line to maintain uninterrupted material supply to the production line, while continuously monitoring concentration changes and waiting for the concentration to return to the qualified range.

[0132] Level 2 Emergency Response: If the absolute concentration deviation value is still not less than the 0.5% qualified threshold after the 60s timer T1 expires, it is determined that the flow fine-tuning correction has failed. The control module 500 controls the switching valve 800 of the main liquid supply pipeline and the circulation return pipeline to operate, cutting off the liquid supply path to the production end 900, switching to the circulation return state, and simultaneously starting the circulation pump 600. The grinding liquid in the mixing component 200 continuously circulates between the mixing component 200 and the liquid supply pipeline, and is continuously stirred in conjunction with the stirring mechanism to complete pipeline homogenization, concentration self-check and deviation correction. The timer T2 (120s) is started simultaneously. During the circulation self-check process, the system continuously collects concentration data until the concentration deviation returns to the qualified range.

[0133] Level 3 Emergency Response: If the absolute concentration deviation value is still not less than 0.5% after the T2 timer expires for 120 seconds, it is determined that there is a hardware failure or ratio failure in the main dilution mixing system, which cannot automatically correct the concentration. The system immediately shuts down the main liquid supply and circulation return pipeline, and seamlessly switches to an independent backup liquid supply path. The backup path delivers pre-stored standard concentration qualified grinding liquid to continuously supply the production line. At the same time, the system immediately triggers equipment abnormality alarm, reports the fault through audible and visual prompts and background data push, and records complete fault information, including fault type (concentration too high / too low failure), real-time concentration deviation data, Level 1 / Level 2 emergency execution trajectory, backup liquid supply operation status, etc., to facilitate equipment maintenance and fault tracing.

[0134] The standard mixed grinding slurry is continuously delivered to at least one user end 900 through the supply pipeline, forming a closed-loop control circuit. During normal supply, the above steps are repeatedly executed at millisecond intervals. The concentration detection component 400 continuously provides feedback on the actual concentration, and the control module 500 continuously compares and adjusts to ensure that the output concentration remains stable at the target concentration. Within [a certain range]. Even during an emergency response, as long as the concentration returns to normal, the system immediately reverts to normal closed-loop control mode to ensure continuous liquid supply.

[0135] It is understood that the specific examples in this document are only intended to help those skilled in the art better understand the embodiments described herein, and are not intended to limit the scope of the invention.

[0136] It is understood that in the various embodiments described in this specification, the sequence number of each process does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments described in this specification.

[0137] It is understood that the various implementation methods described in this specification can be implemented individually or in combination, and the implementation methods in this specification are not limited in this respect.

[0138] It is understood that, in this specification, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0139] Furthermore, in this specification, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0140] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this disclosure. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0141] The above description is merely a specific embodiment of this specification, but the scope of protection of this invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this specification should be included within the scope of protection of this specification. Therefore, the scope of protection of this invention should be determined by the scope of the claims.

Claims

1. A grinding slurry dilution and mixing supply system based on concentration detection, characterized in that, include: A liquid supply assembly and a mixing assembly, wherein the liquid supply assembly supplies at least two liquids to the mixing assembly, and the mixing assembly mixes the at least two liquids to form a grinding slurry; The first liquid supply path connects the mixing component to the user end; A concentration detection component is disposed between the mixing component and the first liquid supply path, and is used to detect the concentration parameter of the grinding liquid in the mixing component; A recirculation path is connected between the first liquid supply path and the mixing component; The second liquid supply path is used to deliver the standard grinding slurry to the end of use; The control module is configured to control the liquid supply assembly to adjust the relative supply amount between the at least two liquids and / or the flow status of the first liquid supply path, the circulation return path and the second liquid supply path based on the concentration parameters.

2. The grinding slurry dilution and mixing supply system based on concentration detection according to claim 1, characterized in that, Based on the concentration parameter, controlling the liquid supply assembly to adjust the relative supply amount between the at least two liquids, and / or the flow state of the first liquid supply path, the circulation return path, and the second liquid supply path, includes: When the concentration parameter is outside the preset parameter range, the liquid supply component is controlled to adjust the relative supply amount between the at least two liquids and keep the first liquid supply path in a flow state to supply liquid to the user end; After adjusting the relative supply amount, if the concentration parameter is outside the preset parameter range, the first liquid supply path is blocked from supplying liquid to the user end, and the grinding liquid output by the mixing component is returned to the mixing component via the circulation return path. If the concentration parameter is still outside the preset parameter range after the grinding slurry returns to the mixing component via the circulation return path, the second liquid supply path is controlled to supply liquid to the user end.

3. The grinding slurry dilution and mixing supply system based on concentration detection according to claim 2, characterized in that, The control module is also configured to: Determine the rate of change of the concentration parameter of the grinding fluid output by the mixing component relative to the preset parameter range over time; During the adjustment of the relative supply amount, in response to the concentration parameter being outside the preset parameter range and the rate of change being greater than the first preset rate of change threshold, the first liquid supply path is blocked from supplying liquid to the user end, and the grinding liquid output by the mixing component is returned to the mixing component via the circulation return path; During the process of the grinding slurry returning to the mixing component via the circulation return path, in response to the concentration parameter being outside the preset parameter range and the rate of change being greater than the second preset rate of change threshold, the second liquid supply path is controlled to supply liquid to the user end.

4. The grinding slurry dilution and mixing supply system based on concentration detection according to claim 2, characterized in that, The control module includes a first timing unit and a second timing unit; The control module is configured as follows: When the relative supply is adjusted, the first timing unit is started, and when the timing duration of the first timing unit reaches the first preset duration and the concentration parameter is still outside the preset parameter range, the grinding fluid output by the mixing component is returned to the mixing component through the circulation return path. When the grinding slurry begins to return to the mixing component via the circulation return path, the second timing unit is activated, and when the timing duration of the second timing unit reaches the second preset duration and the concentration parameter is still outside the preset parameter range, the second liquid supply path supplies liquid to the user end.

5. The grinding slurry dilution and mixing supply system based on concentration detection according to any one of claims 2 to 4, characterized in that, The control module is also configured to: After the second liquid supply path supplies liquid to the user end, the first liquid supply path is kept in a blocked state from supplying liquid to the user end, while the second liquid supply path continues to supply liquid to the user end until a reset command is received.

6. The grinding slurry dilution and mixing supply system based on concentration detection according to claim 1, characterized in that, The mixing component includes a mixing container and a mixing mechanism that cooperates with the mixing container. The circulation return path is connected to the mixing container, and a circulation pump is provided on the circulation return path. The control module is also configured to control the circulation pump and the mixing mechanism to continue operating during the period when the grinding fluid output by the mixing component returns to the mixing component via the circulation return path.

7. The grinding slurry dilution and mixing supply system based on concentration detection according to claim 1, characterized in that, The second liquid supply path includes a liquid storage component for storing grinding slurry and a homogenizing component that cooperates with the liquid storage component; The control module is also configured to control the homogenizing component to operate during the period when the second liquid supply path is not supplying liquid to the user end, so as to drive the flow of grinding slurry in the liquid storage component.

8. The grinding slurry dilution and mixing supply system based on concentration detection according to claim 1, characterized in that, Also includes: Switching valve; The switching valve has a first state and a second state; In the first state, the mixing component is connected to the user end via the first liquid supply path, and the circulation return path is blocked; In the second state, the portion of the first liquid supply path leading to the user end is blocked, and the first liquid supply path is connected to the circulation return path.

9. The grinding slurry dilution and mixing supply system based on concentration detection according to claim 1, characterized in that, The at least two liquids include a grinding stock solution and a diluent, the concentration parameter includes a concentration value, and the control module is configured to: When the concentration value is higher than the upper limit of the preset parameter range, the supply amount of the grinding stock solution relative to the diluent is reduced; When the concentration value is lower than the lower limit of the preset parameter range, the supply amount of the grinding stock solution relative to the diluent is increased.

10. The grinding slurry dilution and mixing supply system based on concentration detection according to claim 1, characterized in that, The concentration detection component includes at least one of an online refractometer and an online densitometer.

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