A process for making a badge from a metal using high frequency penetration

Abstract

This invention discloses a process for fabricating badges using high-frequency electromagnetic penetration of metal. The process includes the following steps: S1: Positioning the base layer; S2: Positioning the composite layer; S3: Sealing the top mold and bottom mold, pushing the top mold with a push rod until the top mold and bottom mold are completely fitted together, and sealing the working part with the bottom mold to form a sealed space within the top mold, bottom mold, and high-frequency electromagnetic field; S4: Emitting a high-frequency electromagnetic field using a high-frequency electromagnetic transmitter, the high-frequency electromagnetic field penetrates the metal layer by continuously changing its direction, causing the connecting layer to heat up and soften; S5: Applying pressure to the top mold with the push rod to embed the composite layer onto the top of the base layer; S6: Maintaining the push rod to continuously apply pressure to the top mold, continuing the sealed state until the connecting layer is completely cooled; S7: After cooling, separating the top mold and bottom mold, and then performing surface treatment on the metal layer. The badges fabricated using this invention avoid problems such as glue lines and oiling at the connection points, and the connection points are stable.

Description

Technical Field

[0001] This invention relates to the field of badge manufacturing technology, and in particular to a process method for manufacturing badges using high-frequency metal. Background Technology

[0002] Badges, as an auxiliary component that combines functionality and decoration, have a wide range of applications and can be adapted to the needs of products in various fields and actual use.

[0003] In terms of identification, the core function of badges is to distinguish identities and display images. They can be used as symbolic identifiers for various units, teams, institutions, associations, and functional positions. They can intuitively reflect the collective, job attributes, and unique image of the member, strengthening overall recognizability and standardization. They are commonly used in uniforms, work clothes, school uniforms, and other categories to achieve unified visual management. In terms of decorative applications, badges, with their diverse materials, shapes, and craftsmanship, have excellent aesthetic effects. They can be used as decorative accessories for clothing, shoes, hats, bags, outdoor products, and other products, enriching the appearance of the products, enhancing the design quality, and meeting the needs of personalized dressing and appearance upgrades. They have both aesthetic appeal and cultural and creative attributes. To highlight the content they express, badges will have their decorative layers processed. Metal has excellent luster and can outline the patterns or text content on the display layer to emphasize the content of the display layer.

[0004] High-frequency welding (also known as high-frequency heat sealing / welding) is a processing technology that uses a high-frequency electromagnetic field transmitter built into the equipment, which can switch between positive and negative electrodes at high frequencies. It uses the high-frequency electromagnetic field transmitter to emit a high-frequency electromagnetic field, causing the molecules inside the dielectric material to generate heat due to friction caused by molecular polarization under the high-frequency electromagnetic field. Under the pressure of the mold, the welding, embossing, and breaking are completed.

[0005] Currently, most processes involving "metal + high-frequency / induction heating" use the metal itself as a heat source. By continuously changing the direction of a high-frequency electromagnetic field, eddy currents are induced within the metal layer (eddy current induction refers to the phenomenon where free electrons move continuously within the metal layer due to the constant alteration of the electromagnetic field by a high-intensity, high-frequency electromagnetic field; eddy current induction generates heat, thus heating the metal layer). This heated metal layer then contacts a substrate made of a dielectric material (such as silicone). The heated metal melts the dielectric material, ultimately embedding the metal layer into the substrate. However, during the process of melting the substrate using eddy current induction, the adhesive at the bonding surface between the substrate and the metal layer melts first. Under pressure, this adhesive easily oozes out from the edges, forming adhesive lines that require subsequent processing and severely affect the aesthetics of the badge. Summary of the Invention

[0006] To overcome the shortcomings mentioned above, the present invention aims to provide a technical solution that can solve the above problems.

[0007] A process for fabricating badges using high-frequency metal penetration, involving a high-frequency hot-pressing instrument, comprising a support base and a working part. The working part includes a supporting shell, a pneumatic pump, a push rod, a high-frequency electromagnetic field emitter, an upper electrode, and a lower electrode. The support base and the supporting shell are integrally formed. The upper end of the push rod is connected to the top of the supporting shell, and the lower end of the push rod is connected to the upper end of the high-frequency electromagnetic field emitter. The lower end of the high-frequency electromagnetic field emitter is connected to the upper electrode. The bottom of the upper electrode is fixedly connected to the top of the upper mold. The lower electrode is disposed inside the support base, and the lower electrode and the upper electrode are coaxially aligned in the vertical direction. The bottom mold is disposed on the support base. The badge comprises a base layer and a composite layer. The composite layer comprises a metal layer and a connecting layer. The composite layer is embedded on top of the base layer, and the metal layer covers the surface of the connecting layer. The process includes the following steps: S1: Position the base layer, which is placed on the bottom mold; S2: Position the composite layer, which is attached to the bottom of the top mold; S3: Seal the top mold and the bottom mold. The push rod pushes the top mold until the top mold and the bottom mold are completely fitted together, and the top mold and the bottom mold are sealed together. S4: A high-frequency electromagnetic field is emitted by a high-frequency electromagnetic transmitter. The high-frequency electromagnetic field passes through the metal layer by continuously changing the direction of the electromagnetic field, causing the connecting layer to heat up and soften. S5: The push rod applies pressure to the top mold to make the composite layer fit into the top of the base layer; S6: Keep the push rod continuously applying pressure to the top mold, and continue to maintain the sealing state until the connecting layer has completely cooled down; S7: After cooling, separate the top mold and bottom mold, keep the badge fixed on the bottom mold and process the top mold, then use the push rod to push the top mold to make the top mold and bottom mold fit together again, and perform surface treatment on the metal layer.

[0008] Furthermore, the metal layer is provided with a positioning film during positioning, the metal layer is adhered to the positioning film, and the upper end of the positioning film is attached to the top mold.

[0009] Furthermore, in step S2, the top mold is provided with a first positioning groove that matches the metal layer, and the metal layer is positioned on the top mold through the first positioning groove.

[0010] Furthermore, in step S1, the bottom mold is provided with a second positioning groove, which is composed of multiple long strips spliced ​​together. The long strips are fixedly connected to the upper surface of the bottom mold by adhesive, and the base layer is positioned on the bottom mold through the second positioning groove.

[0011] Furthermore, in step S4, the high-frequency electromagnetic field emitted by the high-frequency electromagnetic transmitter has a frequency of 27.12MHz.

[0012] Furthermore, in steps S5 and S6, the pressure of the push rod pushing the top mold remains constant at 0.4MPa-0.8MPa.

[0013] Furthermore, the cooling time in step S6 is 2-4 seconds.

[0014] Optionally, the top mold is processed in step S7 by polishing or sandblasting.

[0015] Preferably, the metal layer is a thin metal sheet.

[0016] Preferably, the metal layer is made of a nickel-chromium alloy material.

[0017] Compared with the prior art, the beneficial effects of the present invention are: This invention solves the problem that high-frequency electromagnetic fields cannot penetrate metals. By limiting the thickness of the metal layer, it avoids the eddy current effect caused by high-frequency electromagnetic fields. Furthermore, by creating a sealed environment, it reduces dielectric loss and concentrates energy within the material. This allows the connecting layers within the metal layer to generate heat through molecular polarization. The beneficial effect of directly heating the substrate layer through the metal layer, causing it to soften, is as follows: 1. The problem of adhesive overflow is solved. In metal heating processes, the adhesive on the bonding surface melts first and is easily squeezed out from the edge to form an adhesive line under pressure. However, the thermal gradient of this invention is from the inside out. The molecular polarization caused by the high-frequency electromagnetic field causes the material's heat energy to be dissipated from the inside out. Compared to the upper surface of the substrate material that is closest to the metal, it is actually the coolest. The adhesive will not overflow from this side. The molten adhesive is sealed inside and penetrates into the substrate, achieving a near-perfect, traceless bonding.

[0018] 2. The adhesion is stronger because the heat is generated from the inside, and the hot melt adhesive film at the bottom can fully melt and penetrate into the fibers of the substrate, forming an adhesion strength that far exceeds that of surface bonding alone.

[0019] 3. It can bond to heat-sensitive substrates. If the substrate is a thin fabric or coating that is not heat-resistant, the metal heating scheme may burn the back of the substrate. The process technology in this invention can effectively protect the substrate because the heat is from the inside out.

[0020] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the process flow of the present invention; Figure 2 This is a schematic diagram of the structure of the high-frequency electromagnetic field penetrating the metal layer according to the present invention. Figure 3 This is a schematic diagram of the overall structure of the high-frequency hot press of the present invention; Figure 4 This is a schematic diagram of the cross-section of the present invention during sealing and welding; Figure 5 This is a schematic diagram of the first positioning groove of the present invention viewed from below; Figure 6 yes Figure 3 Enlarged structural diagram of A in the middle; Figure 7 This is a schematic diagram of the structure of the badge of this invention.

[0023] The reference numerals and names in the figure are as follows: Load-bearing base 100, working part 200, supporting shell 201, air pump 202, push rod 203 High-frequency electromagnetic field emitter 204, top mold 205, bottom mold 206, second positioning groove 207. Upper electrode 208, lower electrode 209, first positioning groove 210, badge 300, composite layer 301 Connecting layer 302, metal layer 303, base layer 304. Detailed Implementation

[0024] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0025] It is worth noting that in the description of this invention, the terms "top," "bottom," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the orientation or positional relationship indicated by this invention, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Furthermore, the terms "first" and "second" in this invention are used for descriptive purposes only and should not be construed as indicating or implying relative importance. [Specific Implementation Example 1] Please see Figures 1-6 This invention discloses a process for fabricating a badge 300 using high-frequency metal penetration. The process involves a high-frequency hot-pressing instrument, which includes a support base 100 and a working part 200. The working part 200 includes a supporting shell 201, a pneumatic pump 202, a push rod 203, a high-frequency electromagnetic field emitter 204, an upper electrode 208, and a lower electrode 209. The support base 100 and the supporting shell are integrally formed. The upper end of the push rod 203 is connected to the top of the supporting shell 201, and the lower end of the push rod 203 is connected to the upper end of the high-frequency electromagnetic field emitter 204. The lower end of the electromagnetic field is connected to the upper electrode 208, the bottom of the upper electrode 208 is fixedly connected to the top of the upper mold, the lower electrode 209 is disposed inside the load-bearing base 100, and the lower electrode 209 and the upper electrode 208 are coaxially aligned in the vertical direction, and the bottom mold 206 is disposed on the load-bearing base 100; the badge 300 includes a base layer 304 and a composite layer 301, the composite layer 301 includes a metal layer 303 and a connecting layer 302, the composite layer 301 is embedded in the top of the base layer 304, and the metal layer 303 covers the surface of the connecting layer 302; its process includes the following steps: S1: Position the base layer 304, which is placed on the bottom mold 206; S2: Position the composite layer 301, which is attached to the bottom of the top mold 205; S3: Seal the top mold 205 and the bottom mold 206. The push rod 203 pushes the top mold 205 until the top mold 205 and the bottom mold 206 are completely fitted together, and the top mold 205 and the bottom mold 206 are sealed together. S4: A high-frequency electromagnetic field is emitted by a high-frequency electromagnetic transmitter. The high-frequency electromagnetic field heats up and softens the connecting layer 302 by continuously changing the direction of the electromagnetic field through the metal layer 303. S5: The push rod 203 applies pressure to the top mold 205 to make the composite layer 301 fit into the top of the base layer 304; S6: Keep the push rod 203 continuously applying pressure to the top mold 205, and continue to maintain the sealing state until the connecting layer 302 is completely cooled; S7: After cooling, separate the top mold 205 from the bottom mold 206, keep the badge 300 fixed on the bottom mold 206 and process the upper mold, then use the push rod 203 to push the top mold 205 so that the top mold 205 and the bottom mold 206 are attached again, and perform surface treatment on the metal layer 303.

[0027] This embodiment mainly describes the process method of the present invention, the principle of the process, and the effects brought about by the working method. The specific content is as follows.

[0028] Technology Principle: In traditional physics, electromagnetic waves cannot penetrate metal because the metal layer 303, being a conductor, shields high-frequency electromagnetic fields that want to reach the base layer 304. This invention cleverly utilizes the concept of skin depth (skin depth refers to the depth to which the current density concentrates below the surface of a conductor when alternating current or electromagnetic waves enter it) in physics. By restricting the frequency of the high-frequency electromagnetic field emitted by the high-frequency electromagnetic field transmitter 204 and the material and thickness of the metal layer 303, the high-frequency electromagnetic field can penetrate under specific conditions. Metal layer 303: This invention uses a thin metal sheet. When the thickness of the thin metal sheet is lower than the skin depth of the high-frequency electromagnetic field emitted by the high-frequency electromagnetic transmitter at a specified frequency in the material, high-frequency electromagnetic waves can penetrate the metal. At the same time, by setting the working part 200, a sealing condition is provided when the metal layer 303 and the base layer 304 are fitted together, and the top mold 205 and the bottom mold 206 are completely fitted together, avoiding dielectric loss of high-frequency electromagnetic waves during transmission and locking the energy inside the material. This further ensures that the base layer 304 can generate heat through molecular polarization motion by the high-frequency electromagnetic field.

[0029] The principle of high-frequency electromagnetic fields penetrating metal layers: Please refer to Figure 2 This diagram is only for illustrating the principle of high-frequency electromagnetic fields penetrating metal layers and does not represent the actual dimensions of metal layer 303 and connecting layer 302. The core reason why high-frequency electromagnetic fields cannot penetrate metal layers is that the constantly changing direction of the high-frequency electromagnetic field will generate induced eddy currents inside the metal; the eddy currents will generate a reverse electromagnetic field, which will cancel out the original electromagnetic field inside, such as... Figure 2 As shown in the figure, the large arrow represents the original electromagnetic field, the arc arrow represents the direction of eddy current induction, and the small arrow represents the reverse electromagnetic field generated by the eddy current phenomenon. When the frequency of the high-frequency electromagnetic field and the thickness of the metal are adjusted so that the skin depth is greater than the thickness of the metal layer 303, a sufficient amount of electromagnetic field can penetrate the metal layer 303 and affect the connecting layer 302 and the base layer 304.

[0030] Working principle of high-frequency hot press: When the high-frequency hot press is working, the gas is compressed by the cylinder at the top and the air pressure is used to push the push rod 203 to achieve the bonding of the top mold 205 and the bottom mold 206 and to provide pressure for the bonding of the composite layer 301 and the base layer 304. Then, a high-frequency electromagnetic field is generated by the high-frequency electromagnetic field emitter 204, the upper electrode 208 and the lower electrode 209. The high-frequency electromagnetic field passes through the metal layer 303, the connecting layer 302 and the base layer 304 of the material from top to bottom. The direction of the electric field is not constant. The direction of the electric field changes back and forth from the upper electrode 208 to the lower electrode 209 or from the lower electrode 209 to the upper electrode 208.

[0031] Currently, the common metal + high-frequency / induction heating process in the market uses the metal itself as a heat source. By continuously changing the direction of a high-frequency electromagnetic field, eddy currents are induced within the metal layer 303. This eddy current phenomenon intensifies electron movement, causing frictional heat from collisions. This heat is conducted to the metal, causing it to heat up. Once heated, the metal comes into contact with the substrate layer 304, melting the substrate layer 304. Finally, the metal layer 303 is embedded within the substrate layer 304. However, this method of heating the metal layer 303 to melt the substrate layer 304 results in adhesive lines and grease buildup at the joint (similar to how silicone material becomes greasey after contact with a heated object). Because the internal temperature of the substrate layer 304 is lower than its external temperature, its internal structure remains unchanged. The adhesive or grease buildup on the substrate material surface is only partially addressed. The material flows through the interlocking opening to the surface of the base layer 304, which is extremely difficult to process. However, the interlocking method of this invention differs from common processing methods on the market. In the process flow of this invention, the thickness of the metal sheet is limited. By utilizing the skin depth between the high-frequency electromagnetic field and the metal material, when the thickness of the material under the electromagnetic field is less than its skin depth, the electromagnetic field will treat the metal layer 303 as a transparent film and directly penetrate the metal layer 303 to reach the connecting layer 302 and the base layer 304, causing molecular polarization of the molecules in the connecting layer 302 and the base layer 304. Since molecular polarization also occurs from within the material, the heating mode of the base layer 304 material is different from the traditional interlocking method. Its heating mode is from the inside out. Due to the change in its internal heating structure, the colloid generated when the composite layer 303 and the surface of the base layer 304 are interlocked can flow inward rather than overflow outward, solving the problem of glue lines at the interlocking point after interlocking.

[0032] Using high-frequency waves to penetrate the metal layer 303 polarizes the connecting layer 302 and makes the connection between the connecting layer 302 and the base layer 304, as well as between the connecting layer 302 and the metal layer 303, more stable. As is clear in the above embodiments, in conventional processes, the high-frequency process for fabricating a badge 300 with a metal layer 303 surface involves heating the metal layer 303 using the eddy current effect to melt the base layer 304 for bonding. This process is from the outside in. However, the method of using high-frequency waves to polarize the molecules of the connecting layer 302 and the base layer 304 through the metal layer 303, causing them to heat up and soften, and then bonding the metal layer 303 to the base layer 304, is different. From the inside out, the high-frequency electromagnetic field penetrates the metal layer 303 and acts on the base layer 304 and the connecting layer 302. After the hot melt adhesive film of the base layer 304 is fully melted, it can penetrate into the interior of the connecting layer 302 in the form of molecules to form molecular bonds (molecular bond connection refers to the permanent bonding method in which polymer chains of the same polymer material diffuse, interpenetrate and entangle with each other at the interface in the molten state, and form an interface fused together without layering through intermolecular forces). The bonding strength of molecular bond connection is far greater than that of surface bonding alone (such as softening the connecting layer 302 by applying glue and heating the metal layer 303).

[0033] This invention employs a precise positioning method in its process flow, which utilizes the dual guarantee of auxiliary materials and pre-positioning in the mold. First, a first positioning groove 210 matching the composite layer 301 is provided at the bottom of the top mold 205, enabling precise positioning of the composite layer 301 within the top mold 205. Second, a second positioning groove 207 formed by multiple elongated bodies is provided on the bottom mold 206, with the base layer 304 placed within the second groove. The first positioning groove 210 and the second positioning groove 207 are precisely aligned. During the welding process, a positioning film is also used to stabilize the composite layer 301, as detailed below: Please see Figure 6In this invention, the second positioning groove 207 is composed of multiple elongated bodies surrounding it. Its specific structure is as follows: the silicone positioning part corresponding to the bottom of the mold is positioned by the elongated bodies along the outer contour of the base layer 304 to prevent the base layer 304 from moving left or right. The bottom of the elongated bodies is adhered with adhesive. The reason why the second positioning groove 207 of this invention is composed of multiple elongated bodies surrounding it is based on the structural design of the base layer 304. In the shape of the badge 300, the base layer 304 has a variety of shapes, such as rectangular, circular, and fan-shaped structures. Using a mold with a fixed shape is difficult to adapt to the varied shapes of the base layer 304. Each time a new shape of the base layer 304 is needed, a new mold is required for positioning, resulting in significant resource waste. Furthermore, the positioning mold shape... When the shape is adapted to the shape of the base layer 304, there may be size issues. In summary, if a fixed groove is set on the mold as the second positioning groove 207, a new positioning groove needs to be designed for each new base layer 304 according to its shape and size. However, the second positioning groove 207 formed by multiple elongated bodies in this invention can be freely adapted to the shape and size of the base layer 304. The positioning effect can be achieved simply by disassembling the elongated bodies and wrapping the elongated bodies around the outline of the base layer 304. Moreover, the process of forming the second positioning groove 207 by wrapping the elongated bodies is much simpler than making positioning grooves with fixed shapes and sizes. It does not require the corresponding mold to be made for the new base layer 304, which largely avoids resource waste.

[0034] In this invention, the composite layer 301 is pre-positioned before being positioned with the first positioning groove 210. The pre-positioning method is to reinforce it with auxiliary materials. In order to achieve higher positioning accuracy, a common method is to superimpose a transparent positioning film on the composite layer 301. This film is like a transparent plastic wrap, which temporarily "sticks" the label to the substrate and firmly fixes it before high-frequency hot pressing to prevent any slight displacement. It should be noted that the first groove of this invention is a groove that fits the composite layer 301. Its shape is the text or pattern content that the badge 300 wants to express. Therefore, the upper part of the badge 300 needs to be replaced for badges with different content.

[0035] It is worth noting that in the preparation process of this invention, the setting of parameters has a significant impact on the molding effect of the product. The process parameters used in this invention, the reasons for selecting these process parameters, and the impact of incorrect process parameters are as follows: In this invention, the high-frequency electromagnetic field uses a frequency of 27.12MHz. Both high and low frequencies of high-frequency electromagnetic fields have their own advantages and disadvantages. Higher frequency electric fields offer advantages such as rapid heating, high efficiency, intense molecular polarization, instantaneous heating and welding, high production capacity, and good electromagnetic field focusing, allowing for fine textures, narrow edges, small badge outlines, and localized fixed-point welding; the edges are neat and aesthetically pleasing, the surface welding effect is good, the surface weld is dense, the texture is clear, the adhesion strength is high, and the heat-affected zone is small, heating only at the welding point, and the surrounding area is less prone to deformation and yellowing, making it very suitable for high-precision material welding. Its disadvantage is weak metal penetration; the higher the frequency, the shallower the skin depth. This leads to difficulties in the fabrication process of the 303 metal layer, and thinner 303 metal layers are prone to breakage. The advantage of lower-frequency electromagnetic fields lies in their large skin depth on metals (copper, nickel-chromium, stainless steel), allowing the metal layer 303 to easily penetrate without affecting the heating of the underlying connecting layer 302 and base layer 304. This results in uniform heating, deep penetration, and the ability to penetrate thick materials and multi-layered composites, achieving simultaneous heating and welding from the inside out. It also offers excellent compatibility with workpieces with thin metal plating, such as badges 300, products with metal hot stamping, or nickel-chromium plating decorative layers, where low frequencies provide minimal shielding, sparking, and damage to the plating. However, its disadvantages include lower polarization friction heating efficiency compared to high frequencies, slower production cycles, heating not only at seams but also over large areas of the workpiece, easy deformation of the base layer 304, and electromagnetic field dispersion with poor focusing, making it difficult to achieve aesthetically pleasing finishes for intricate patterns and narrow borders. Therefore, to ensure the high-frequency electromagnetic field possesses sufficient penetration power while maximizing product aesthetics, this invention selects a common frequency of 27.12MHz as the high-frequency electromagnetic field.

[0036] The thickness of the metal layer 303 is limited to 5-15 micrometers. The thickness of the metal layer 303 needs to be strictly limited. The core of the fabrication process of this invention is to utilize the skin depth of the high-frequency electromagnetic field in a certain metal material to be greater than the thickness of the metal layer 303 itself. This prevents electrons from having enough space in the metal layer 303 to form a backflow and generate a reverse electromagnetic field. Thus, the high-frequency electromagnetic field can pass through the limitation of the metal layer 303. If the metal layer 303 is too thick, the skin depth of the high-frequency electromagnetic field will be less than its thickness. The metal layer 303 will form a Faraday cage (a cage made of complete and continuous metal, in which the electric field, electromagnetic waves and high-frequency field outside are all blocked by the metal shell, and there is no electric field inside the cage and it is not affected by the external electromagnetic field), shielding the high-frequency electromagnetic field so that it cannot reach the connecting layer 302 and the base layer 304, and naturally, it cannot be heat-bonded. If the thickness of the metal layer 303 is too thin, the metal layer 303 will be too fragile and easy to break. Moreover, the thinner the thickness, the more difficult the fabrication process becomes.

[0037] The high-frequency welding time is 2-4 seconds. If the welding time is too short, the high-frequency electromagnetic field is insufficient, and the connecting layer 302 and the base layer 304 do not heat up enough to reach a molten state. The molecules in the connecting layer 302 and the base layer 304 cannot move sufficiently, cannot diffuse and entangle with each other, and can only be physically bonded without forming molecular bonds. This leads to the problem that badges 300 exposed to the external environment for extended periods are prone to breakage at the connection between the connecting layer 302 and the base layer 304 during later use, significantly shortening the lifespan of the badge 300. Simultaneously, the interface between the metal layer 303 and the connecting layer 302 is loose, making the metal layer 303 prone to edge lifting and delamination later. Excessive welding time leads to excessive continuous energy input from the electric field. This causes the connecting layer 302 and the base layer 304 to degrade due to excessive temperature and heat. Yellowing and scorching may occur at the edges of the connection between the base layer 304 and the connecting layer 302. Bubbling and voids may also appear inside the base layer 304 and the connecting layer 302. The metal layer 303 may also experience localized arcing due to the field heat generated by the high-frequency electromagnetic field, resulting in oxidation, blackening, and peeling. These are surface-level issues. Excessive welding time can also lead to excessive thermal aging of the molecular chains, resulting in decreased toughness and bonding strength, which can also cause the composite layer 301 and the base layer 304 to easily detach during later use. Therefore, the welding time in the process of this invention is set at 2-4 seconds.

[0038] After the high-frequency welding is completed, the cooling time is about 3 seconds. If the cooling time is too short, the base layer 304 and the connecting layer 302 are still in a molten soft state. The unsettled crystallization pressure is released in advance, and the molecular chains at the molten interface do not have time to stably entangle, which will lead to unstable connection between the base layer 304 and the connecting layer 302 and easy to fall off during later use. Therefore, when using this process to prepare badge 300, it is necessary to ensure that the cooling time is at least greater than 3 seconds.

[0039] The pressing pressure during the process is 0.4MPa-0.8MPa. The core function of the pressure is to tightly bond the base layer 304 and the connecting layer 302, which have penetrated the metal layer 303 and melted upon heating, together. This allows the molecular chains of the base layer 304 and the connecting layer 302 in the molten state to squeeze, penetrate, and entangle with each other, forming molecular bonds. At the same time, it removes air from the contact surface, preventing bubbles and loose connections. It also compresses the metal layer 303, preventing edge warping. If the pressing pressure is too low, the molecules of the connecting layer 302 and the base layer 304 will not penetrate sufficiently and fail to form intermolecular bonds, leading to easy breakage of the connecting layer 302 and the base layer 304 later. If the pressure is too high, the base layer will be over-compressed, overflowing, thinning, and deforming, causing the outline of the badge 300 to become distorted. Excessive pressure can also cause the originally elastic base layer 304 and the connecting layer 302 to lose their elasticity due to excessive internal density. In summary, to ensure the structural stability of the badge 300 while maintaining its elasticity, the pressure used in the welding process of this invention is 0.4MPa-0.8MPa.

[0040] In the process flow of this invention, after removing the top mold 205, the positioning mold attached to the surface of the metal layer 303 is peeled off before surface treatment. Surface treatment includes various methods, such as polishing and matte finishing. Each method will bring different effects to the metal surface, and different surface treatment processes require different process parameters when using the top mold 205 for processing. The following examples will illustrate the effects and process parameters of different surface treatment methods: Surface treatment method 1: Glossy finish, which makes the material surface extremely smooth and microscopically free of bumps and depressions. When light shines on it, it forms a mirror-like one-way reflection, and the surface is high-gloss, bright, and transparent. The surface of the metal layer 303 after glossy finish will produce a mirror reflection effect. The specific process is as follows: the corresponding position of the metal layer 303 in the high-frequency hot press mold is mirror-polished mold surface, and high pressure (0.6-0.8 MPa) and long pressing time (2.5-3.5 seconds) are used for molding.

[0041] Surface treatment method 2: Matte treatment, which transforms the mirror reflection of the material surface into diffuse reflection, eliminates strong gloss and mirror reflection, and presents a low-reflection, frosted, and delicate matte effect. The matte-treated metal layer 303 will produce a diffuse reflection effect on the surface. The specific process is as follows: the corresponding position of the metal layer 303 of the high-frequency hot press mold is sandblasted or etched with a matte mold surface, and formed with a lower pressure (0.4-0.6 MPa) and a shorter pressing time (1.5-2.5 seconds).

[0042] Surface treatment method 3: Iridescent treatment. The surface is made with a micro-multi-layer interference structure + pearlescent powder / iridescent powder / laser microstructure, which causes light to refract, interfere and diffract. The color, gloss and light and shadow are different when viewed from different angles. It has a flowing satin feel, a pearl feel and a laser neon feel. The metal layer 303 after the iridescent treatment will show flowing color changes under different viewing angles. The specific process is: to set an optical thin film on the surface of the metal layer, or to add iridescent pearlescent powder to the raw materials and form it with specific high frequency parameters. [Specific Implementation Example 2] This embodiment mainly describes the structure and effects of the product prepared using the process of Specific Embodiment 1, as detailed below.

[0044] In this invention, the product is a structure based on a base layer 304, with a composite layer 301 embedded on the surface of the base layer 304. The composite layer 301 has a three-dimensional structure. Thanks to the supporting effect of the connecting layer 302, the prerequisite for a high-frequency electromagnetic field to penetrate the metal layer 303 is that the skin depth of the high-frequency electromagnetic field in a specific metal material is greater than the thickness of the metal layer 303 itself. This makes the thickness of the metal layer 303 very thin, generally at the micrometer level. Therefore, in order to enhance the display effect of the composite layer 301 of the badge 300, a connecting layer 302 is used to connect the metal layer 303 and the base layer 304 to achieve a supporting effect. The metal layer 303 wraps around the connecting layer 302 from the outside. 02. This gives the content displayed in the composite layer 301 a metallic sheen when viewed from all sides. The connecting layer 302 uses the same material as the base layer 304. The connecting layer 302 not only provides support but also protects the metal layer 303. In order to ensure that the thickness of the metal layer 303 in the bonding process is less than the skin depth, the thickness of the metal layer 303 is very small, only tens of micrometers. The metal layer 303 with such a thickness is extremely easy to break during use. Therefore, the connecting filling metal layer 303 protects the metal layer 303, making the metal layer 303 no longer a single thin sheet, but a solid whole structure that is less prone to breakage.

[0045] In this invention, the metal layer 303 material is made of nickel-chromium alloy. Nickel-chromium alloy has the advantages of being resistant to rust and oxidation, and is also resistant to sweat, humidity, and hand contact corrosion. The badge 300 will not fade even after long-term wear and storage. The hardness of the nickel-chromium alloy plating is much higher than that of pure copper and it is not easily scratched. When the badge 300 is exposed to the external environment for a long time, it will be subject to air and water corrosion, leading to rust and loss of color. The advantages of nickel-chromium alloy perfectly avoid this problem. Its high oxidation resistance allows for long-term use. Most importantly, when using 27.12MHz as the high-frequency electromagnetic field frequency for high-frequency processes, the skin depth of the 27.12MHz high-frequency electromagnetic field in nickel-chromium alloy is 32 micrometers, which is higher than that of other metal materials. This makes the process of preparing the metal layer 303 based on nickel-chromium material simpler. Furthermore, the larger skin depth allows the metal itself made of nickel-chromium material to have a greater thickness. This greater thickness, combined with the high hardness of nickel-chromium material, makes the metal layer 303 less prone to breakage.

[0046] In this invention, the base material is TPU (thermoplastic polyurethane elastomer), a commonly used soft rubber material for badges 300 and jewelry. TPU material has the characteristics of high elasticity, wear resistance, oil resistance, hydrolysis resistance, environmental protection and recyclability. First of all, it has good wear resistance. Badges are inevitably subject to erosion and corrosion when exposed to the external environment for a long time during use. In order to ensure that badges 300 can be used for a long time, the high elasticity of TPU material allows badges 300 to adapt well to the deformation of badges 300 caused by clothing wrinkles during exercise. It also conforms to the feature of maintaining the elasticity of badges 300 without excessive pressure in specific embodiment 1. The purpose is to enhance the durability of badges 300.

[0047] Finally, it should be noted that the shapes of the base layer 304 and the composite layer 301 in this invention are not singular. The shapes of the base layer 304 and the composite layer 301 are diverse. The badges 300 or signs prepared by the process of this invention, regardless of their shape or pattern, are all within the protection scope of this invention.

[0048] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within the present invention.

Claims

1. A process for fabricating badges using high-frequency penetration metal, characterized in that, The process involves a high-frequency hot pressing instrument, which includes a support base (100) and a working part (200). The working part (200) includes a supporting shell (201), a pneumatic pump (202), a push rod (203), a high-frequency electromagnetic field emitter (204), an upper electrode (208), and a lower electrode (209). The support base (100) and the supporting shell are integrally formed. The upper end of the push rod (203) is connected to the top of the supporting shell (201), and the lower end of the push rod (203) is connected to the upper end of the high-frequency electromagnetic field emitter (204). The lower end of the high-frequency electromagnetic field emitter is connected to the upper electrode (208). The bottom of the mold is fixedly connected to the top of the upper mold. The lower electrode (209) is disposed inside the load-bearing base (100), and the lower electrode (209) and the upper electrode (208) are coaxially aligned in the vertical direction. The bottom mold (206) is disposed on the load-bearing base (100). The badge (300) includes a base layer (304) and a composite layer (301). The composite layer (301) includes a metal layer (303) and a connecting layer (302). The composite layer (301) is embedded on the top of the base layer (304). The metal layer (303) covers the surface of the connecting layer (302). The thickness of the base layer (304) is limited to 5-15 micrometers. The process includes the following steps: S1: Position the base layer (304) on the bottom mold (206); S2: Position the composite layer (301), which is attached to the bottom of the top mold (205); S3: Seal the top mold (205) and the bottom mold (206). The push rod (203) pushes the top mold (205) until the top mold (205) and the bottom mold (206) are completely fitted together, and the top mold (205) and the bottom mold (206) are sealed together. S4: A high-frequency electromagnetic field is emitted by a high-frequency electromagnetic transmitter. The high-frequency electromagnetic field heats up and softens the connecting layer (302) and the base layer (304) by continuously changing the direction of the electromagnetic field through the metal layer (303). S5: The push rod (203) applies pressure to the top mold (205) to make the composite layer (301) fit into the top of the base layer (304); S6: Keep the push rod (203) continuously applying pressure to the top mold (205) and continue to maintain the sealing state until the connecting layer (301) is completely cooled; S7: After cooling, separate the top mold (205) from the bottom mold (206), keep the badge (300) fixed on the bottom mold (206) and process the top mold, then use the push rod (203) to push the top mold (205) so that the top mold (205) and the bottom mold (206) are attached again, and perform surface treatment on the metal layer (303).

2. The process for preparing badges using high-frequency penetration metal according to claim 1, characterized in that, The composite layer (301) is provided with a positioning film during positioning. The composite layer (301) is adhered to the positioning film, and the upper end of the positioning film is attached to the top mold (205).

3. The process for preparing badges using high-frequency penetration metal according to claim 2, characterized in that, In step S1, the top mold (205) is provided with a first positioning groove that matches the composite layer (301), and the composite layer (301) is positioned on the top mold (205) through the first positioning groove.

4. The process for preparing badges using high-frequency penetration metal according to claim 1, characterized in that, The bottom mold (206) is provided with a second positioning groove (207), which is composed of multiple long strips spliced ​​together. The long strips are fixedly connected to the upper surface of the bottom mold (206) by adhesive. The base layer (304) is positioned on the bottom mold (206) through the second positioning groove (207).

5. The process for fabricating a badge (300) using high-frequency penetration metal according to claim 1, characterized in that, In step S4, the high-frequency electromagnetic field emitted by the high-frequency electromagnetic transmitter has a frequency of 27.12MHz.

6. The process for preparing badges using high-frequency penetration metal according to claim 1, characterized in that, In steps S5 and S6, the pressure of the push rod (203) pushing the top mold (205) remains constant at 0.4MPa-0.8MPa.

7. The process for preparing medals using high-frequency penetrating metal according to claim 1, characterized in that, The cooling time in step S6 is 2-4 seconds.

8. The process for preparing badges using high-frequency penetration metal according to claim 1, characterized in that, In step S7, the top mold (205) is processed by polishing or sandblasting.

9. The process for preparing badges using high-frequency penetration metal according to claim 1, characterized in that, The metal layer (303) is a thin metal sheet.

10. The process for preparing badges using high-frequency penetration metal according to claim 1, characterized in that, The metal layer (303) is made of nickel-chromium alloy material.

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