A compatible multiple power semiconductor device heating test device

Abstract

This application discloses a heating test device compatible with multiple power semiconductor devices, belonging to the technical field of semiconductor device testing equipment. It includes a fixed base and a rotating base. A test probe is mounted on the fixed base. One side of the rotating base is hinged to the fixed base, and the other side of the rotating base can be snapped into place with the fixed base. A mounting cavity is provided on the top surface of the fixed base, and a mounting block is placed within the mounting cavity. A test groove for placing the test device is formed on the top surface of the mounting block. A floating heating plate for heating the test device is provided on the side of the rotating base near the fixed base. This application enables multi-device compatibility, reduces testing costs, and improves testing efficiency.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor device testing equipment, and in particular to a heating testing device compatible with various power semiconductor devices. Background Technology

[0002] With the rapid development of electronic technology, semiconductor devices are playing an increasingly important role in modern power electronics, communications, and consumer electronics. To ensure the performance and reliability of these devices in practical applications, effective heating testing is crucial. Heating testing is primarily used to evaluate the thermal characteristics, power handling capacity, and heat dissipation performance of semiconductor devices under different operating conditions.

[0003] Traditional heating test equipment is usually designed for specific types of semiconductor devices, making it difficult to meet the testing needs of various power semiconductor devices. This results in insufficient compatibility of the test equipment, increasing testing costs and time. Summary of the Invention

[0004] To address the incompatibility issues of existing heating test equipment, this application provides a heating test device compatible with various power semiconductor devices.

[0005] The heating test device compatible with multiple power semiconductor devices provided in this application adopts the following technical solution: A heating test device compatible with multiple power semiconductor devices includes a fixed base and a rotating base. A test probe is mounted on the fixed base. One side of the rotating base is hinged to the fixed base, and the other side of the rotating base can be snapped into the fixed base. The top surface of the fixed base is provided with a mounting cavity, and a mounting block is placed in the mounting cavity. The top surface of the mounting block has a test groove for placing the test device. A floating heating plate for heating the test device is provided on the side of the rotating base near the fixed base.

[0006] By adopting the above technical solution, multiple devices can be compatible by replacing the mounting blocks in the device mounting cavity, reducing testing costs and improving testing efficiency; at the same time, the floating heating plate device ensures heating stability and is suitable for devices of different heights.

[0007] Preferably, the rotating seat has a placement groove for mounting the floating heating plate on its side near the fixed base. The inner top surface of the placement groove has several buffer grooves, and the inner top surface of the buffer groove has a guide groove. The rotating seat has a limiting groove connected to the guide groove on its side away from the fixed base. A guide post passes through the guide groove. One end of the guide post is fixedly connected to the floating heating plate, and the other end of the guide post is fixedly connected to a limiting circular plate located in the limiting groove. A buffer spring is sleeved on the outer periphery of the guide post. One end of the buffer spring is fixedly connected to the side of the floating heating plate, and the other end of the buffer spring is fixedly connected to the inner top surface of the buffer groove.

[0008] By adopting the above technical solution, the guide column and spring can ensure the stability of the heating plate during the heating of devices at different heights, while the limiting groove and guide groove ensure the accurate positioning and floating performance of the floating heating plate, thereby improving the adaptability and reliability of the testing device.

[0009] Preferably, a heat dissipation plate is provided on the side of the rotating seat away from the floating heating plate.

[0010] By adopting the above technical solution, a heat sink can be installed on the rotating base to effectively help the device dissipate heat, avoid damage to the device due to excessive heat generated during the heating process, and improve the stability and safety of the device.

[0011] Preferably, the rotating base has a mounting groove on its side, a mounting rod is installed in the mounting groove, a rotating block is sleeved on the outer periphery of the mounting rod, a wedge-shaped locking block is fixed at the bottom end of the rotating block, the fixed base has a connecting groove on its side, a connecting rod is installed in the connecting groove, and the wedge-shaped locking block can engage with the connecting rod.

[0012] By adopting the above technical solution, the rotating seat is rotated downwards, so that the wedge-shaped locking block on the rotating seat connects with the connecting rod on the fixed base, thereby locking and fixing the rotating seat to the fixed base, thus ensuring the stability of the rotating seat during operation and making it convenient to operate.

[0013] Preferably, the inner side of the mounting groove is provided with a clearance groove, and an abutment spring is installed in the clearance groove. One end of the abutment spring is fixedly connected to the inner side of the clearance groove, and the other end of the abutment spring is fixedly connected to the side of the rotating block.

[0014] By adopting the above technical solution, the wedge-shaped block is tightly abutted against the connecting rod under the elastic force of the abutment spring, making it difficult for the wedge-shaped block to separate from the connecting rod without being subjected to external force, thereby enhancing the stability and durability of the device.

[0015] Preferably, a protrusion is fixed to the side of the rotating block away from the abutting spring.

[0016] By adopting the above technical solution, when it is necessary to separate the rotating seat from the fixed base, the operator can push the protrusion upwards, so that the wedge-shaped locking block rotates away from the connecting rod, thereby releasing the lock between the rotating seat and the fixed base.

[0017] Preferably, a heat-conducting block is placed in the test groove, and the top surface of the heat-conducting block has a mounting groove for placing the test device.

[0018] By adopting the above technical solution, the heat-conducting block can effectively transfer the heat of the upper floating heating plate to the bottom, providing uniform heating for the test device. For short-pin test devices, the short-pin test device needs to be flipped over to contact the test probe. Therefore, the bottom surface of the flipped short-pin test device needs to be heated. The back of the short-pin test device is in direct contact with the heat-conducting block. The floating heating plate transfers heat to the heat-conducting block, enabling short-pin devices to be tested compatibilityably and expanding the test range.

[0019] Preferably, a heat insulation sheet is installed in the mounting groove, and the heat insulation sheet is located on the top surface of the test device.

[0020] By adopting the above technical solution, the heat insulation sheet is located on the top surface of the test device, which effectively prevents high temperature from being conducted to the top of the test device, thereby improving the accuracy and safety of the heating test process.

[0021] Preferably, the mounting groove has a movable groove on its opposite inner side, and the heat insulation sheet has movable blocks fixed on both sides. The movable blocks slide and cooperate with the heat-conducting block in the vertical direction through the movable groove.

[0022] By adopting the above technical solution, the heat insulation sheet slides and engages with the heat-conducting block through the moving groove, ensuring that the position of the heat insulation sheet is not easily shifted, thereby providing heat insulation protection for the top of the test device.

[0023] Preferably, the heat insulation sheet has pressing grooves at the bottom corners, and pressing blocks are installed on the heat insulation sheet by sliding vertically through the pressing grooves. A pressing spring is fixed on the top surface of the pressing block, and the top end of the pressing spring is fixedly connected to the inner top surface of the pressing groove.

[0024] By adopting the above technical solution, the heat insulation sheet is located between the floating heating plate and the test device. When the floating heating plate and the heat-conducting block come into contact, the top surface of the floating heating plate comes into contact with the heat insulation sheet. The heat insulation sheet applies a certain pressure to the test device through the pressing spring and the pressing block, thereby ensuring stable contact between the test device and the probe.

[0025] In summary, this application includes at least one of the following beneficial technical effects: By replacing the mounting blocks inside the device mounting cavity, multi-device compatibility can be achieved, reducing testing costs and improving testing efficiency; at the same time, the floating heating plate device ensures heating stability and is suitable for devices of different heights. The guide posts and springs ensure the stability of the heating plate during the heating of devices at different heights, while the limiting grooves and guide grooves guarantee the accurate positioning and floating performance of the floating heating plate, thus improving the adaptability and reliability of the testing device. The heat-conducting block can effectively transfer the heat from the upper floating heating plate to the bottom, providing uniform heating for the test device. For short-pin test devices, the short-pin test device needs to be flipped over to contact the test probe. Therefore, the bottom surface of the flipped short-pin test device needs to be heated. The back of the short-pin test device is in direct contact with the heat-conducting block. The floating heating plate transfers heat to the heat-conducting block, enabling short-pin devices to be tested for compatibility and expanding the testing range. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the overall structure of a heating test device compatible with multiple power semiconductor devices according to an embodiment of this application.

[0027] Figure 2 This is a schematic diagram of the mounting block and heat-conducting block in a heating test device compatible with multiple power semiconductor devices according to an embodiment of this application.

[0028] Figure 3 This is a schematic diagram of the rotating base in the heating test device for compatible multi-power semiconductor devices according to an embodiment of this application.

[0029] Figure 4 This is a schematic diagram of the structure of the heat-conducting block and the heat-insulating sheet in the heating test device compatible with multiple power semiconductor devices according to an embodiment of this application.

[0030] Reference numerals: 1. Fixed base; 11. Mounting cavity; 12. Mounting block; 121. Test groove; 13. Connecting groove; 14. Connecting rod; 15. Test probe; 2. Rotating seat; 21. Placement groove; 22. Buffer groove; 23. Guide groove; 24. Limiting groove; 25. Heat dissipation plate; 26. Mounting groove; 27. Mounting rod; 28. Clearance groove; 3. Floating heating plate; 31. Guide column; 32. Limiting circular plate; 33. Buffer spring; 4. Rotating block; 41. Wedge-shaped locking block; 42. Protrusion; 43. Abutment spring; 5. Heat-conducting block; 51. Mounting groove; 52. Moving groove; 6. Heat insulation sheet; 61. Moving block; 62. Pressing groove; 63. Pressing block; 64. Pressing spring. Detailed Implementation

[0031] The following is in conjunction with the appendix Figure 1-4 This application will be described in further detail.

[0032] This application discloses a heating test apparatus compatible with various power semiconductor devices. (Refer to...) Figure 1 and Figure 2 The heating test device compatible with multiple power semiconductor devices includes a fixed base 1 and a rotating base 2. A test probe 15 is mounted on the fixed base 1. One side of the rotating base 2 is hinged to the fixed base 1, and the other side of the rotating base 2 can be snapped into place on the fixed base 1. A mounting cavity 11 is provided on the top surface of the fixed base 1, and a mounting block 12 is placed inside the mounting cavity 11. The top surface of the mounting block 12 has a test groove 121 for placing the test device. By replacing the mounting block 12 in the device mounting cavity 11, multi-device compatibility can be achieved, reducing testing costs and improving testing efficiency.

[0033] Reference Figure 1 and Figure 3 A floating heating plate 3 for heating testing devices is provided on the side of the rotating seat 2 near the fixed base 1. A placement groove 21 for mounting the floating heating plate 3 is provided on the side of the rotating seat 2 near the fixed base 1, and several buffer grooves 22 are formed on the inner top surface of the placement groove 21. A guide groove 23 is formed on the inner top surface of the buffer groove 22, and a limiting groove 24 communicating with the guide groove 23 is formed on the side of the rotating seat 2 away from the fixed base 1. A guide post 31 passes through the guide groove 23, one end of which is fixedly connected to the floating heating plate 3, and the other end of which is fixedly connected to a limiting circular plate 32. The limiting circular plate 32 is located within the limiting groove 24, and a buffer spring 33 is sleeved on the outer periphery of the guide post 31. One end of the buffer spring 33 is fixedly connected to the side of the floating heating plate 3, and the other end of the buffer spring 33 is fixedly connected to the inner top surface of the buffer groove 22.

[0034] The guide post 31 and the buffer spring 33 ensure the stability of the floating heating plate 3 during the heating of devices at different heights. The limiting groove 24 and the guide groove 23 ensure the accurate positioning and floating performance of the floating heating plate 3, thereby improving the adaptability and reliability of the testing device.

[0035] Reference Figure 1 A heat dissipation plate 25 is provided on the side of the rotating seat 2 away from the floating heating plate 3. The heat dissipation plate 25 can effectively help the device dissipate heat, avoid damage to the device due to excessive heat generated during the heating process, and improve the stability and safety of the device.

[0036] Reference Figure 1 and Figure 3The rotating base 2 has a mounting groove 26 on its side, and a mounting rod 27 is installed in the mounting groove 26. A rotating block 4 is fitted around the outer periphery of the mounting rod 27, and a wedge-shaped locking block 41 is fixed to the bottom end of the rotating block 4. The fixed base 1 has a connecting groove 13 on its side, and a connecting rod 14 is installed in the connecting groove 13. The wedge-shaped locking block 41 can engage with the connecting rod 14. Rotating the rotating base 2 downwards connects the wedge-shaped locking block 41 on the rotating base 2 with the connecting rod 14 on the fixed base 1, thus locking and fixing the rotating base 2 to the fixed base 1, thereby ensuring the stability of the rotating base 2 during operation and facilitating operation.

[0037] Reference Figure 1 and Figure 3 The inner side of the mounting groove 26 is provided with a clearance groove 28, and an abutment spring 43 is installed in the clearance groove 28. One end of the abutment spring 43 is fixedly connected to the inner side of the clearance groove 28, and the other end of the abutment spring 43 is fixedly connected to the side of the rotating block 4. Under the elastic force of the abutment spring 43, the wedge-shaped locking block 41 is tightly abutted against the connecting rod 14, making it difficult for the wedge-shaped locking block 41 to separate from the connecting rod 14 without external force, thereby enhancing the stability and durability of the device. A protrusion 42 is fixed on the side of the rotating block 4 away from the abutment spring 43. When it is necessary to separate the rotating seat 2 from the fixed base 1, the operator can push the protrusion 42 upward, so that the wedge-shaped locking block 41 rotates away from the connecting rod 14, thereby releasing the lock between the rotating seat 2 and the fixed base 1.

[0038] Reference Figure 1 and Figure 4 A heat-conducting block 5 is placed inside the test groove 121. The top surface of the heat-conducting block 5 has a mounting groove 51 for placing the test device. The heat-conducting block 5 effectively transfers heat from the upper floating heating plate 3 to the bottom, providing uniform heating for the test device. For short-pin test devices, the short-pin test device needs to be flipped over to contact the test probe 15. Therefore, the bottom surface of the flipped short-pin test device needs to be heated. The back surface of the short-pin test device is in direct contact with the heat-conducting block 5. The floating heating plate 3 transfers heat to the heat-conducting block 5, thereby heating the bottom surface of the short-pin device.

[0039] Furthermore, the heat-conducting block 5 enables compatibility testing of short-pin devices, expanding the testing range.

[0040] Reference Figure 1 and Figure 4 A heat insulation sheet 6 is installed in the mounting groove 51, located on the top surface of the test device. Movable slots 52 are respectively formed on the inner sides of the mounting groove 51. Movable blocks 61 are fixed on both sides of the heat insulation sheet 6, and the movable blocks 61 slide vertically with the heat-conducting block 5 via the movable slots 52. The heat insulation sheet 6 effectively prevents high temperature from being conducted to the top of the test device, thereby improving the accuracy and safety of the heating test process.

[0041] Reference Figure 1 and Figure 4 The heat insulation sheet 6 has pressing grooves 62 at its bottom corners, and pressing blocks 63 are vertically slidably mounted on the heat insulation sheet 6 through the pressing grooves 62. A pressing spring 64 is fixed to the top surface of the pressing block 63, and the top of the pressing spring 64 is fixedly connected to the inner top surface of the pressing groove 62. The heat insulation sheet 6 is located between the floating heating plate 3 and the test device. When the floating heating plate 3 abuts against the heat conducting block 5, the top surface of the floating heating plate 3 abuts against the heat insulation sheet 6. The heat insulation sheet 6 applies a certain pressure to the test device through the pressing spring 64 and the pressing block 63, thereby ensuring stable contact between the test device and the probe.

[0042] The implementation principle of the heating test device compatible with multiple power semiconductor devices in this application embodiment is as follows: by replacing the mounting block 12 in the device mounting cavity 11, multiple device compatibility can be achieved, reducing test costs and improving test efficiency; at the same time, the floating heating plate 3 device ensures heating stability and is suitable for devices of different heights.

[0043] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A heating test device compatible with multiple power semiconductor devices, characterized in that: The device includes a fixed base (1) and a rotating base (2). A test probe (15) is mounted on the fixed base (1). One side of the rotating base (2) is hinged to the fixed base (1), and the other side of the rotating base (2) can be snapped into the fixed base (1). The top surface of the fixed base (1) is provided with a mounting cavity (11), and a mounting block (12) is placed in the mounting cavity (11). The top surface of the mounting block (12) is provided with a test groove (121) for placing the test device. A floating heating plate (3) for heating the test device is provided on the side of the rotating base (2) near the fixed base (1).

2. The heating test device compatible with multiple power semiconductor devices according to claim 1, characterized in that: The rotating seat (2) has a placement groove (21) for mounting the floating heating plate (3) on its side near the fixed base (1). The inner top surface of the placement groove (21) has several buffer grooves (22), and the inner top surface of the buffer grooves (22) has guide grooves (23). The rotating seat (2) has a limiting groove (24) on its side away from the fixed base (1) that communicates with the guide grooves (23). A guide post (31) passes through the guide grooves (23). One end of the guide post (31) is fixedly connected to the floating heating plate (3), and the other end of the guide post (31) is fixedly connected to a limiting circular plate (32). The limiting circular plate (32) is located in the limiting groove (24). A buffer spring (33) is sleeved on the outer periphery of the guide post (31). One end of the buffer spring (33) is fixedly connected to the side of the floating heating plate (3), and the other end of the buffer spring (33) is fixedly connected to the inner top surface of the buffer groove (22).

3. The heating test device compatible with multiple power semiconductor devices according to claim 1, characterized in that: A heat dissipation plate (25) is provided on the side of the rotating seat (2) away from the floating heating plate (3).

4. The heating test device compatible with multiple power semiconductor devices according to claim 1, characterized in that: The rotating base (2) has an installation groove (26) on its side, and an installation rod (27) is installed in the installation groove (26). A rotating block (4) is sleeved on the outer periphery of the installation rod (27). A wedge-shaped locking block (41) is fixed at the bottom end of the rotating block (4). The fixed base (1) has a connecting groove (13) on its side, and a connecting rod (14) is installed in the connecting groove (13). The wedge-shaped locking block (41) can engage with the connecting rod (14).

5. The heating test device compatible with multiple power semiconductor devices according to claim 4, characterized in that: The inner side of the mounting groove (26) is provided with a clearance groove (28), and an abutment spring (43) is installed in the clearance groove (28). One end of the abutment spring (43) is fixedly connected to the inner side of the clearance groove (28), and the other end of the abutment spring (43) is fixedly connected to the side of the rotating block (4).

6. The heating test device compatible with multiple power semiconductor devices according to claim 5, characterized in that: The rotating block (4) has a protrusion (42) fixed on the side away from the abutting spring (43).

7. The heating test device compatible with multiple power semiconductor devices according to claim 1, characterized in that: A heat-conducting block (5) is placed inside the test groove (121), and the top surface of the heat-conducting block (5) is provided with a mounting groove (51) for placing the test device.

8. The heating test device compatible with multiple power semiconductor devices according to claim 7, characterized in that: A heat insulation sheet (6) is installed in the mounting groove (51), and the heat insulation sheet (6) is located on the top surface of the test device.

9. The heating test device compatible with multiple power semiconductor devices according to claim 8, characterized in that: The mounting groove (51) has a movable groove (52) on its inner side. The heat insulation sheet (6) has a movable block (61) fixed on both sides. The movable block (61) slides and engages with the heat-conducting block (5) in the vertical direction through the movable groove (52).

10. A heating test apparatus compatible with multiple power semiconductor devices according to claim 9, characterized in that: The heat insulation sheet (6) has pressing grooves (62) at the bottom corners. The heat insulation sheet (6) has pressing blocks (63) that slide vertically along the pressing grooves (62). A pressing spring (64) is fixed on the top surface of the pressing block (63). The top end of the pressing spring (64) is fixedly connected to the inner top surface of the pressing groove (62).

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